CN106738838A - A kind of plastic packaging machine measuring thickness device - Google Patents
A kind of plastic packaging machine measuring thickness device Download PDFInfo
- Publication number
- CN106738838A CN106738838A CN201611129188.5A CN201611129188A CN106738838A CN 106738838 A CN106738838 A CN 106738838A CN 201611129188 A CN201611129188 A CN 201611129188A CN 106738838 A CN106738838 A CN 106738838A
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- Prior art keywords
- lower platen
- group
- top board
- packaging machine
- plastic packaging
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims abstract description 9
- 238000001514 detection method Methods 0.000 claims description 18
- 239000003990 capacitor Substances 0.000 claims description 14
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000000843 powder Substances 0.000 description 58
- 238000000465 moulding Methods 0.000 description 29
- 238000013461 design Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
A kind of plastic packaging machine measuring thickness device, including the top board and lower platen that are disposed in parallel relation to one another in vertical direction, structure crosses thing passage between the top board and the lower platen, at least one is provided with described top board along the paper-pressing mechanism perpendicular to the lower platen surface direction lifting activity, described paper-pressing mechanism is connected with resetting-mechanism, and the movement tendency to the lower platen direction is remained under resetting-mechanism effect;Also include testing agency, the testing agency at least includes first group of portion and second group of portion, the ratio of the distance of the distance lower platen relative with the paper pressing end of the paper-pressing mechanism of the described relatively described lower platen in first group of portion is always a definite value, and the distance of the relatively described lower platen in second group of portion is fixed all the time.The present invention possesses the advantage of the certainty of measurement of the thickness measuring sensor that can ensure displacement type compared to existing technology.
Description
Technical field
The present invention relates to the Thickness sensitivity construction applications of plastic packaging machine of handling official business, more particularly to a kind of plastic packaging machine measuring thickness device.
Background technology
In modern handle official bussiness, molding powder medium is still indispensable information carrier, and this just determines that substantial amounts of office sets
It is standby to be required to detect each attribute of molding powder medium, the normal performance of ability assurance function.In many of molding powder medium
Thickness is highly important parameter in attribute, is needed by detecting that molding powder dielectric thickness is determined again in plastic packaging machine and gluing machine etc.
In the office equipment of oneself running parameter, the thickness of molding powder medium directly affects the performance of equipment, so being all provided with this kind equipment
It is equipped with the Thickness sensitivity structure of detection molding powder dielectric thickness.
Existing Thickness sensitivity structure is generally using the detection scheme of photo-electric, although the output linearity degree of photoelectric sensor
Very well, but cannot be used directly for that molding powder side medium is thick, opto-electronic detection scheme is typically with other structures and follows molding powder medium
Change and photoelectric sensor detection other structures on fit structure position come the molding powder dielectric thickness that converts, such side
Be present Railway Project in case, be primarily due to from the thickness of molding powder medium to also there are multiple fit structures Photoelectric Detection, then
The error of the setting of fit structure equally determines the detection structure of this photoelectric sensor, this adds increased the error of final result
Rate;Secondly so-called fit structure is in fact that moudling powder dielectric structure is divided into multiple ranks with respect to the hoisting depth of molding powder medium
Ladder, photoelectric sensor read parameter be often the presence of obvious stepping feature, so reading parameter be in fact it is discrete,
Its precision completely first with the resolution ratio of fit structure;Third, the disturbing factor of photoelectric sensor is a lot, so its structure sets
Meter generally requires to increase anti-tampering protection structure, causes cost increase.
The content of the invention
The part present invention provides a kind of plastic packaging machine measuring thickness device in view of the shortcomings of the prior art, and the inventive method is by machinery
The design of structure lifts accuracy of detection of the sensor of displacement type in thickness measuring, has ensured that the prime of detection is not limited by structure
Make and cause accuracy of detection to decline.
The technical scheme is that providing a kind of plastic packaging machine measuring thickness device, including it is disposed in parallel relation to one another in vertical direction
Top board and lower platen, thing passage was constituted between the top board and the lower platen, be provided with described top board
At least one along the moudling powder medium mechanism perpendicular to the lower platen surface direction lifting activity, described moudling powder medium machine
Structure is connected with resetting-mechanism, and the movement tendency to the lower platen direction is remained under resetting-mechanism effect;Also include
Testing agency, the testing agency at least includes first group of portion and second group of portion, and first group of described portion is relatively described to be pushed
The ratio of the distance of the distance of the plate lower platen relative with the moudling powder media end of the moudling powder medium mechanism is always one
Individual definite value, the distance of the relatively described lower platen in second group of portion is fixed all the time.
Used as of the invention preferred, also including capacitor grid transducer, described capacitor grid transducer includes quiet grid, moving grid and appearance
Gate sensor chip, described moving grid is arranged in first group of portion, described quiet grid and the capacitor grid transducer chip
It is arranged in second group of described portion.
Include lifting shaft, connecting seat, pulley, the reset as of the invention preferred, described moudling powder medium mechanism
Mechanism includes lifting chamber and back-moving spring, and the lower end of described lifting shaft is connected with the connecting seat, described pulley rotation
The lower end of the connecting seat is connected to, the side of described connecting seat is connected with first group of described portion, described lifting axis
Sexuality is arranged in the lifting chamber, and the reset bullet is provided between the top in described lifting chamber and described connecting seat
Spring, the reset direction of described back-moving spring is all the time towards the lower platen side.
Preferably described moudling powder medium mechanism only sets one as of the invention, the centre bit of described top board
Install and be equipped with through hole, plate surface is pushed described in described pulley through through hole compression.
As it is of the invention preferably, described lifting chamber is fixed in the upper surface of the top board, second group of described portion
It is affixed with the top board.
As it is of the invention preferably, the position of the lower platen immobilizes, the relatively described lower platen of described top board
Distance top with the lower platen is adjustably set.
As of the invention preferred, two moudling powder medium mechanisms, described upper pressure are provided with the top board
Two through holes are provided with plate, described two through holes are symmetrical arranged by symmetric points of the midpoint of the top board, and described in two
The central point of through hole is located along the same line with the midpoint of the top board, and described pulley compresses the lower platen through through hole
Surface.
Shape is turned over downwards as the side of side of of the invention preferred, the described lower platen on molding powder medium direction is entered
Into entering molding powder medium inclined-plane.
As it is of the invention preferably, when described back-moving spring reaches largest deformation amount, the back-moving spring is for institute
The active force for stating connecting seat is less than 49N.
As it is of the invention preferably, also including hall sensing device, described hall sensing device include movable magnet steel with
Detection Hall device, described movable magnet steel is arranged in first group of portion, described detection Hall device be arranged at described in the
In two groups of portions.
The invention has the advantages that:
The present invention possesses the advantage of the certainty of measurement of the thickness measuring sensor that can ensure displacement type compared to existing technology.
Brief description of the drawings
Fig. 1 is structural representation of the invention;
In figure, 1- top boards;2- lower platens;3- crosses thing passage;4- moudling powder media mechanism;5- resetting-mechanisms;6- testing agencies;
4-1- lifting shafts;4-2- connecting seats;4-3- pulleys;5-1- lifts chamber;5-2- back-moving springs;1-1- through holes;First group of portion of 6-1-;
Second group of portion of 6-2-;2-1- enters molding powder medium inclined-plane.
Specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
As shown in figure 1, the embodiment of the present invention includes the top board 1 being disposed in parallel relation to one another in vertical direction and lower platen 2,
The thing passage 3 excessively for putting molding powder medium is constituted between top board 1 and lower platen 2, lower platen 2 is on molding powder medium direction is entered
The side of side is turned over downwards to be formed into molding powder medium inclined-plane 2-1.The position of lower platen 2 is immobilized, and top board 1 is relative to be pushed
The distance of plate 2 adjustably sets the top with lower platen 2, contributes to according to the specific of molding powder medium apart from adjustable set-up mode
Thickness adjusted the width of thing passage 3, can so increase the size compatibility of plastic packaging machine, and specific connected mode has following several
Kind:First, lower platen 2 is fixed on the upper of plastic packaging machine, and top board 1 is connected with a lowering or hoisting gear of plastic packaging machine;Second, upper pressure
Lowering or hoisting gear is provided between plate 1 and lower platen 2.Lowering or hoisting gear can be that electric expansion bar can also be matching somebody with somebody for rack and pinion
Structure is closed, it is strip gap to cross thing passage 3, it is both maximum measurement limit to cross thing 3 width in vertical direction of passage, is set
Molding powder dielectric displacement, curling are brought caused by thing passage 3 can be eliminated effectively on measurement point position by extraneous factor
Measurement error, because the measurement object of the embodiment of the present invention is relatively thin molding powder medium, and typically all can plural number Zhang Jinhang
Measurement, so any tiny error all can cause deviation accumulation because of molding powder media quantity, so as to result in larger knot
Fruit deviation, so it is very crucial and necessary structure guarantee, top board for the embodiment of the present invention to set thing passage 3
At least one is provided with 1 along the moudling powder medium mechanism 4 perpendicular to the surface direction lifting activity of lower platen 2, moudling powder medium
Mechanism 4 is connected with resetting-mechanism 5, and the movement tendency in the direction of pushing the back down 2 is remained under the effect of resetting-mechanism 5;Also wrap
Testing agency 6 is included, testing agency 6 at least includes first group of portion 6-1 and second group of portion 6-2, and first group of portion 6-1 is with respect to lower platen
The ratio of the distance of 2 distance lower platen 2 relative with the moudling powder media end of moudling powder medium mechanism 4 is always a definite value,
Second group of portion 6-2 is fixed all the time with respect to the distance of lower platen 2.Inspection in order to coordinate the displacement-current potential of capacitor grid transducer of the invention
Survey mode thus need set one relatively accurately mechanical structure come ensure accuracy of detection not by the external world physical cause disturbed, institute
It is used for fixing the moving grid of capacitor grid transducer with the first group of portion 6-1 for setting, the quiet of capacitor grid transducer is fixed with second group of portion 6-2
Grid, after having served as adding molding powder medium in thing passage 3, moudling powder medium mechanism 4 is lifted equal with the thickness of molding powder medium
Distance, the distance is exactly the distance of the moudling powder media end with respect to lower platen 2 of moudling powder medium mechanism 4, and first group of portion 6-1 is such as
Fruit is, then first group portion 6-1 distance with respect to lower platen 2 and moudling powder medium mechanism 4 affixed with moudling powder medium mechanism 4
Moudling powder media end is 1 with respect to the ratio of the distance of lower platen 2, but because first group of portion 6-1 is used as a portion of plastic packaging machine
In the presence of part, sometimes it cannot be guaranteed that first group of portion 6-1 mono- surely synchronously follows moudling powder medium mechanism 4 to move when design
Make, if when joined together by the other structures of first group of portion 6-1 and plastic packaging machine, moudling powder medium mechanism 4 relative the may be caused
One group of portion 6-1 there is also a displacement, but the present invention will ensure distances and moudling powder of first group of portion 6-1 with respect to lower platen 2
The ratio of the distance of the moudling powder media end with respect to lower platen 2 of medium mechanism 4 is always a definite value, such as moudling powder medium mechanism
4 activity 2mm, first group of portion 6-1 activity 4mm, then ratio is 2, and by that analogy, such structure is easy to the control system of subsequent installation
The signal returned according to sensor of uniting carries out algorithm calculating, if without structure setting feature of the invention, the calculation of sensor
Method design can be sufficiently complex, it is preferred that being the situation that ratio is 1.
The moudling powder medium mechanism 4 of the embodiment of the present invention includes lifting shaft 4-1, connecting seat 4-2, pulley 4-3, resetting-mechanism
5 include lifting chamber 5-1 and back-moving spring 5-2, and the lower end of lifting shaft 4-1 is connected with connecting seat 4-2, and pulley 4-3 rotates connection
In the lower end of connecting seat 4-2, the side of connecting seat 4-2 is connected with first group of portion 6-1, and lifting shaft 4-1 is linearly movably set in liter
In drop chamber 5-1, to lift and be provided with back-moving spring 5-2, the reset side of back-moving spring 5-2 between the top of chamber 5-1 and connecting seat 4-2
To towards the side of lower platen 2, wherein spring is in tensioner state, and reset direction is both downward so that pulley 4-3 can be pressed all the time
The tight surface of lower platen 2, so when there is molding powder medium to be clipped between lower platen 2 and pulley 4-3, lifting shaft 4-1 is elevated, and answers
Position spring 5-2 is compressed, and the now reset force increase of back-moving spring 5-2 compresses molding powder medium, so the lifting of lifting shaft 4-1 is high
Degree is both the thickness of molding powder medium.
When back-moving spring 5-2 reaches largest deformation amount, back-moving spring 5-2 is less than for the active force of connecting seat 4-2
49N, if active force is excessive or causes molding powder dielectric surface to be depressed, and causes measurement data to be forbidden, when active force is less than 49N
When, the limit of deformation pair is in the surface compression of molding powder medium, so the active force less than 49N is very necessary
, this plays a very important role to the accuracy for detecting, and prior art in order to lifted accuracy be generally only from algorithm and
The resolution ratio of sensor is started with, not as the embodiment of the present invention by structure solution come it is simple.
The embodiment of the present invention is, present invention additionally comprises capacitor grid transducer, to hold in the first implementation method of the selection of sensor
Gate sensor includes quiet grid, moving grid and capacitor grid transducer chip, and moving grid is arranged on first group of portion 6-1, quiet grid and capacitive grating
Sensor chip is arranged on second group of portion 6-2, and capacitor grid transducer is a kind of based on variable area operation principle, measurable big displacement
Capacitance digital sensor.It and other digital displacement transducers, such as grating, inductosyn is compared, with volume
Small, simple structure, resolution ratio and the degree of accuracy is high, measuring speed fast, small power consumption, low cost, less demanding to use environment etc. prominent
The characteristics of going out.
The embodiment of the present invention second implementation method of the selection of sensor be present invention additionally comprises hall sensing device,
Hall sensing device includes movable magnet steel and detection Hall device, and movable magnet steel is arranged on first group of portion 6-1, and detection Hall device sets
It is placed on second group of portion 6-2, while structure of the invention can also be used on Hall sensor, due to Hall sensor and appearance
The detection structure of gate sensor is identical, it is possible to compatible Hall sensor, so facilitates part special circumstances lower sensor
Change, but for the effect of the embodiment of the present invention, the precision of Hall sensor is not so good as capacitor grid transducer.
The top board 1 of the embodiment of the present invention is moudling powder medium with the first way of the cooperation of moudling powder medium mechanism 4
4, mechanism sets one, and the center of top board 1 is provided with through hole 1-1, and pulley 4-3 compresses lower platen 2 through through hole 1-1
Surface, the consideration for being arranged at center is not attractive in appearance or processing facility, and allows for the center institute of top board 1
The position of corresponding molding powder medium is to actually receive the minimum location point of ectocine, so when pulley 4-3 is pressed in the position,
Its detection precision is highest.Lifting chamber 5-1 is fixed in the upper surface of top board 1, second group of portion 6-2 it is affixed with top board 1 by
Will not be with lifting shaft 4-1 activities in lifting chamber 5-1, it is possible to ensure that first group of portion 6-1 can be gathered around with respect to second group of portion 6-2
There is a mobilizable displacement, lifting chamber 5-1 is fixed on top board 1 by screw, maintenance easy to disassemble.
The top board 1 of the embodiment of the present invention is to be set on top board 1 with the first way of the cooperation of moudling powder medium mechanism 4
Two moudling powder medium mechanisms 4 are equipped with, two through hole 1-1 are provided with top board 1, two through hole 1-1 are with the midpoint of top board 1
For symmetric points are symmetrical arranged, and two central points of through hole 1-1 are located along the same line with the midpoint of top board 1, and pulley 4-3 wears
Cross through hole 1-1 and compress lower platen 2 surface, the purpose for so setting be in order to the midpoint both sides in top board 1 carry out mirror image sampling,
Two results of output, can just facilitate follow-up increased processor to carry out the comparing or equalization of making even in later stage this when
The algorithm of data filtering draws more accurate numerical value successively, so this structure setting provides one for improving measurement accuracy
Individual highly important structure guarantee.Lifting chamber 5-1 is fixed in the upper surface of top board 1, and second group of portion 6-2 is affixed with top board 1
Because lifting chamber 5-1 will not be with lifting shaft 4-1 activities, it is possible to ensure that first group of portion 6-1 can be with respect to second group of portion 6-2
Possess a mobilizable displacement, lifting chamber 5-1 is fixed on top board 1 by screw, maintenance easy to disassemble.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to design of the invention
It is defined with scope.On the premise of design concept of the present invention is not departed from, this area ordinary person is to technical side of the invention
The all variations and modifications that case is made, all should drop into protection scope of the present invention, claimed technology contents of the invention,
Through all recording in detail in the claims.
Claims (10)
1. a kind of plastic packaging machine measuring thickness device, it is characterised in that:Including the top board being disposed in parallel relation to one another in vertical direction(1)With
Lower platen(2), the top board(1)With the lower platen(2)Between structure cross thing passage(3), described top board(1)Upper setting
Have at least one along perpendicular to the lower platen(2)The paper-pressing mechanism of surface direction lifting activity(4), described paper-pressing mechanism
(4)With resetting-mechanism(5)Connection, and in resetting-mechanism(5)Remained under effect to the lower platen(2)The motion in direction becomes
Gesture;Also include testing agency(6), the testing agency(6)At least include first group of portion(6-1)And second group of portion(6-2), institute
The first group of portion for stating(6-1)Relatively described lower platen(2)Distance and the paper-pressing mechanism(4)Paper pressing end relatively described push
Plate(2)The ratio of distance be always a definite value, second group of portion(6-2)Relatively described lower platen(2)Distance all the time
It is fixed.
2. a kind of plastic packaging machine measuring thickness device according to claim 1, it is characterised in that:Also include capacitor grid transducer, it is described
Capacitor grid transducer include quiet grid, moving grid and capacitor grid transducer chip, described moving grid is arranged at first group of portion(6-1)
On, described quiet grid and the capacitor grid transducer chip are arranged at second group of described portion(6-2)On.
3. a kind of plastic packaging machine measuring thickness device according to claim 1, it is characterised in that:Described paper-pressing mechanism(4)Including
Lifting shaft(4-1), connecting seat(4-2), pulley(4-3), the resetting-mechanism(5)Including lifting chamber(5-1)And back-moving spring
(5-2), described lifting shaft(4-1)Lower end and the connecting seat(4-2)Connection, described pulley(4-3)It is rotatably connected on
The connecting seat(4-2)Lower end, described connecting seat(4-2)Side and first group of described portion(6-1)Connection, it is described
Lifting shaft(4-1)Linearly it is movably set in the lifting chamber(5-1)Interior, described lifting chamber(5-1)Top and described company
Joint chair(4-2)Between be provided with the back-moving spring(5-2), described back-moving spring(5-2)Reset direction all the time towards institute
State lower platen(2)Side.
4. a kind of plastic packaging machine measuring thickness device according to claim 3, it is characterised in that:Described paper-pressing mechanism(4)Only set
Put one, described top board(1)Center be provided with through hole(1-1), described pulley(4-3)Through through hole(1-1)
Compress the lower platen(2)Surface.
5. a kind of plastic packaging machine measuring thickness device according to claim 3, it is characterised in that:Described lifting chamber(5-1)It is affixed
In the top board(1)Upper surface, second group of described portion(6-2)With the top board(1)It is affixed.
6. a kind of plastic packaging machine measuring thickness device according to claim 1, it is characterised in that:The lower platen(2)Position consolidate
Fixed constant, described top board(1)Relatively described lower platen(2)Distance adjustably set and the lower platen(2)Top.
7. a kind of plastic packaging machine measuring thickness device according to claim 3, it is characterised in that:The top board(1)On be provided with
Two paper-pressing mechanisms(4), described top board(1)On be provided with two through holes(1-1), described two through holes(1-1)With
The top board(1)Midpoint be symmetrical arranged for symmetric points, and two through holes(1-1)Central point and the top board
(1)Midpoint be located along the same line, described pulley(4-3)Through through hole(1-1)Compress the lower platen(2)Surface.
8. a kind of plastic packaging machine measuring thickness device according to claim 1, it is characterised in that:Described lower platen(2)In paper feed
The side of the side on direction is turned over downwards to form paper feed inclined-plane(2-1).
9. a kind of plastic packaging machine measuring thickness device according to claim 3, it is characterised in that:When described back-moving spring(5-2)
When reaching largest deformation amount, the back-moving spring(5-2)For the connecting seat(4-2)Active force be less than 49N.
10. a kind of plastic packaging machine measuring thickness device according to claim 1, it is characterised in that:Also include hall sensing device, institute
The hall sensing device stated includes movable magnet steel and detection Hall device, and described movable magnet steel is arranged at first group of portion(6-
1)On, described detection Hall device is arranged at second group of described portion(6-2)On.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109612382A (en) * | 2019-02-01 | 2019-04-12 | 哈尔滨恒达交通设备技术开发有限公司 | A kind of train brake pad thickness measurement equipment |
CN110701989A (en) * | 2019-08-29 | 2020-01-17 | 威海华菱光电股份有限公司 | Thickness detection device and thickness detection method |
CN111272058A (en) * | 2020-03-30 | 2020-06-12 | 北京二十一世纪科技发展有限公司 | Contact type thickness measuring device, system using the same and measuring method thereof |
CN114353655A (en) * | 2020-10-12 | 2022-04-15 | 东友科技股份有限公司 | Thickness measuring device |
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