CN106716740B - Socket connector including improved crosspoint array structure - Google Patents
Socket connector including improved crosspoint array structure Download PDFInfo
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- CN106716740B CN106716740B CN201580051876.1A CN201580051876A CN106716740B CN 106716740 B CN106716740 B CN 106716740B CN 201580051876 A CN201580051876 A CN 201580051876A CN 106716740 B CN106716740 B CN 106716740B
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- crosspoint array
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Abstract
The present invention provides a kind of socket connector including improved crosspoint array structure.The socket connector of a mode of the invention, it includes: an insulator；One first crosspoint array, having the assembly at the insulator is multiple contact pins of a column；One second crosspoint array has multiple contact pins that assembly arranges at the insulator for one, and separates with first crosspoint array；An and shell, it, which is constituted, is located at column identical with the installation section of the contact pin included in first crosspoint array with the installation section of included a part of contact pin in a sub-assembly of the insulator, first crosspoint array and second crosspoint array, second crosspoint array.
Description
Technical field
The present invention relates to a kind of socket connectors, more particularly to a kind of socket with an improved crosspoint array arrangement
Connector.
This application claims enjoy on September 25th, the 2014 South Korea patent application 10-2014-0128543 submitted, in 2015
The patent application, is incorporated in by the priority for the South Korea patent application 10-2015-0100867 that on July 16, in submits by quoting
This, as the patent application is herein by entire disclosure.
Background technique
In general, a socket connector install to a printed circuit board of various portable electronic devices (PCB:
Printed Circuit Board), and it is connected to a corresponding pin connector, and usually constituted micro- logical to meet
With universal serial bus (USB, Micro Universal Serial Bus) standard.
Recently, new-type USB mark has been disclosed as in Intel Developer Forum (Intel Developer Forum, IDF)
The details of a quasi- C type connector (type-C connector).Size possessed by USB C type connector is similar to
2.0 Micro-B of USB, and do not influenced, allow each attachment of pin connector or divided by the connection direction of pin connector
From.In addition, USB C type connector has the transmission rate of up to 10Gbps, more existing USB 3.0 goes up about twice fastly, and also
The power supply of 100W is allowed up to, and it is anticipated that USB c-type is used for various fields.
USB C type connector is classified as bis- (Dual) surface mount technologies according to the mounting means of printed circuit board
(SMT, Surface Mount Technology) type and blend together (Hybrid:SMT+DIP) type.In SMT type, USB c-type connects
The contact pin for connecing device is installed as contacting with the surface of printed circuit board, and in SMT type, and two column contact pin surfaces are installed to printing
Circuit board.In blending together type, among Yu Lianglie contact pin, a column contact pin is mounted in SMT type, and remaining column contact pin
It is mounted in dual-inline package (DIP, Dual In line Package) type.At this point, in DIP type, a connector
One contact pin-shaped becomes vertical printed circuit plate and is inserted into form the through hole for installation in the printed circuit boards
(Through-hole).Among above-mentioned, in Yu Shuan SMT type connector, it is not easy to which checking the one of them of two column contact pins is
It is no to be correctly installed on printed circuit board.Therefore, allow to check the mixed formed connectors whether all contact pins are correctly installed
It is preferred.
Fig. 1 is the figure for showing a part of an existing bottom surface for blending together type socket connector.As shown in Figure 1, mixed
Forming socket connector includes an insulator 11, has a predetermined shape；One first crosspoint array 12 and one second contact battle array
Column 13, those are assembled to insulator 11；And a shell 10, around the outside of entire product.First crosspoint array 12 is by one
It arranges SMT type contact pin to constitute, and the second crosspoint array 13 is made of two column DIP type contact pins.DIP type contact pin can be come with a column
It constitutes, but in this example, it is impossible to configure many DIP type contact pins in a column, and therefore usually arrange with two to arrange DIP
Type contact pin, as shown in Figure 1.
However, as above through constitute it is existing blend together in type socket connector, You Lianglie DIP type contact pin constitute
The second crosspoint array 13 occupy a large area on a printed circuit.Further, since the second crosspoint array 13 is by two column contacts
Pin is constituted, and the first crosspoint array 12 is made of a column contact pin, and socket connector has three column contact pins in total, causes whole
The length of a product is long.Therefore, the existing socket connector with three column contact pins is not met with larger screen and relatively thin
The recent trend of the portable electronic devices of design.Particularly, the one of crosspoint array existing arrangement becomes reduction frame portion
Size is to amplify portable electronic devices screen or increase the obstruction of battery capacity.
Summary of the invention
Problem to be solved by the invention
The present invention is designed to solve the problems, such as the relevant technologies, and therefore the present invention about offer one blend together socket connection
Device has an improved contact pin arrangement, so that those crosspoint arrays can occupy the peace of a reduction on a printed circuit board
Area is filled, and the socket connector has one to design compared with short.
The technical solution solved the problems, such as
In a mode of the invention, a socket connector is provided, it includes: an insulator；One first crosspoint array,
With multiple contact pins that assembly arranges at the insulator for one；One second crosspoint array has at the insulator
Multiple contact pins that assembly arranges for one, and separated with first crosspoint array；And a shell, it is constituted described to surround
One sub-assembly of insulator, first crosspoint array and second crosspoint array, it is included in second crosspoint array
The installation section of a part of contact pin be located at the installation section with the contact pin included in first crosspoint array
Identical column.
Included multiple contact pins can in first crosspoint array respectively include: a contact portions, through structure
At to provide the electric contact with a pin connector；One installation section is surface mounted to a printed circuit board；And one connect
Socket part point, is constituted to connect the contact portions to the installation section.
In first crosspoint array among included multiple contact pins, the contact portions of a part of contact pin
There can be a bending being inclined outwardly, the contact portions of residual contact pin there can be a rectilinear form.
The bending can be an inclined oblique line outwardly.
The installation section of included a part of contact pin can be located at described curved in second crosspoint array
Between the bent installation section of the contact pin and the installation section of the contact pin with the rectilinear form contact portions.
The contact portions can the installation section, the coupling part can the vertical contact portions and institutes in parallel
State installation section.
It is included multiple described in first crosspoint array on the basis of a bottom surface of the socket connector
The position of the installation section of contact pin can be higher than the contact portions.
The contact portions can the parallel installation section, the coupling part can have a ┏ ┓ shape.
Included multiple contact pins can in second crosspoint array respectively include: a contact portions, through structure
At to provide the electric contact with a pin connector；One installation section, installation a to printed circuit board；An and interconnecting piece
Point, it is constituted to connect the contact portions to the installation section, it is included multiple in second crosspoint array
Among the contact pin, the installation section of a part of contact pin is surface mounted to the printed circuit board, residual contact pin
Installation section insertion installation to the printed circuit board.
The contact portions of included a part of contact pin can have one outward in second crosspoint array
The contact portions of inclined bending, the residual contact pin can have a rectilinear form.
In second crosspoint array among included a part of contact pin, the described of a part of contact pin is connect
Point part can have a bending being inclined outwardly, in second crosspoint array included a part of contact pin it
In, the contact portions of residual contact pin can have a rectilinear form.
The bending can have a right angle or for an inclined oblique line outwardly.
The contact portions of included a part of contact pin can have a straight line in second crosspoint array
Shape.
The coupling part of the included residual contact pin can be vertically connected in second crosspoint array
The contact portions and it is horizontally connected to the installation section, and there is a bending.
The coupling part of the included residual contact pin can be vertically connected in second crosspoint array
The contact portions and the installation section, and there is a bending.
On the basis of a bottom surface of the socket connector, it is connected to institute included in second crosspoint array
The position for stating one end of the contact portions of the coupling part of residual contact pin can connect lower than the residue is connected to
One end of the installation section of the coupling part of point pin.
The coupling part of the included residual contact pin can have one in second crosspoint arrayShape.
On the basis of a bottom surface of the socket connector, included described one in second crosspoint array
The position of the installation section of tapping point pin can be higher than the contact portions.
The coupling part of included a part of contact pin can have one in second crosspoint arrayShape
Shape.
The installation section of included multiple contact pins and second crosspoint array in first crosspoint array
In the installation section of included a part of contact pin can be surface mounted to a printed circuit board, second crosspoint array
In the installation section of included residual contact pin can be inserted into installation to the printed circuit board.
An interface arrangements of included multiple contact pins can be with second contact in first crosspoint array
One interface arrangements of multiple contact pins of array are opposite.
Invention effect
In the present invention, an arrangement for blending together the crosspoint array in type socket connector is kept to two column from three column, to contract
Subtract the mounting area on printed circuit board, and also reduces the length of socket connector.
Particularly, since the arrangement for increasing the DIP type contact pin of the mounting area on printed circuit board is kept to one from two column
Column, can further reduce the mounting area on printed circuit board, and also further reduce the length of socket connector.
Therefore, if the present invention is applied to the portable electronic devices of such as smart phone, placing socket company can be reduced
The size of the frame portion of device is connect, and therefore can increase easily screen area and enhance battery capacity.
Detailed description of the invention
Offer is reacted on to skill of the invention with Detailed description of the invention presently preferred embodiments of the present invention, and with disclosing one above
Art feature further appreciates that.But, the present invention is not intended to be considered limited to attached drawing.
Fig. 1 is the figure for showing a part of an existing bottom surface for blending together type socket connector.
Fig. 2 is the exploded perspective view for showing a socket connector of an embodiment according to the present invention.
Fig. 3 is the figure for showing a crosspoint array of an embodiment according to the present invention.
Fig. 4 is the assembling stereogram of a socket connector of the display including crosspoint array shown in Fig. 3.
Fig. 5 is the bottom view of Fig. 4.
Fig. 6 is the figure of the crosspoint array of display according to another embodiment of the present invention.
Fig. 7 is the bottom view of a socket connector of the display including crosspoint array shown in fig. 6.
Fig. 8 is the figure of the crosspoint array of display according to another embodiment of the present invention.
Fig. 9 is the bottom view of a socket connector of the display including crosspoint array shown in Fig. 8.
Figure 10 is the figure of the crosspoint array of display according to another embodiment of the present invention.
Figure 11 is the bottom view of a socket connector of the display including crosspoint array shown in Fig. 10.
Figure 12 is the figure of the crosspoint array of display according to another embodiment of the present invention.
Figure 13 is the bottom view of a socket connector of the display including crosspoint array shown in Figure 12.
Figure 14 is the figure of the crosspoint array of display according to another embodiment of the present invention.
Figure 15 is the bottom view of a socket connector of the display including crosspoint array shown in Figure 14.
Figure 16 is the exploded perspective view of the socket connector of display according to another embodiment of the present invention.
Figure 17 is the figure for displaying the details of a crosspoint array of socket connector of Figure 16.
Figure 18 is the assembling stereogram of a socket connector of the display including crosspoint array shown in Figure 17.
Figure 19 is the bottom view of Figure 18.
Figure 20 is for a crosspoint array of an embodiment more according to the present invention and an existing crosspoint array one
The figure of installation pattern on printed circuit board.
Specific embodiment
Hereinafter, presently preferred embodiments of the present invention will describe in detail referring to attached drawing.Before narration, it should be understood that
Wording used in this specification and appended claims is not intended to be limited to the connotation in general and dictionary,
But define the principle of wording suitably based on allowing the present inventor to be directed to best interpretations with correspondence technical approach of the invention
It is explained based on connotation and concept.Therefore, the preferable example that proposed narration is only for illustration purposes only,
And it is not intended to limit the scope of the invention, therefore it is understood that others etc. can be made in the case of without departing from the scope of the present invention
Jljl and modification object.
In following exposure, " front " word means to be intended to be bound to one locating for a pin connector of a socket connector
Direction, and " rear portion " word means an opposite to that direction.
1. (on-board) type socket connector on plate
Fig. 2 is the exploded perspective view for showing a socket connector of an embodiment according to the present invention.Socket shown in Fig. 2
The component of connector is only an example, in the art in the apparent range of those who have general knowledge, Fig. 2
Shown in component can partially be excluded or be exchanged with other assemblies, or can dividually increase any further component.This is implemented
The socket connector of example is a plate mo(u)ld top half socket connector, is placed on a printed circuit board and is directly mounted at this.
Referring to Fig. 2, the socket connector of an embodiment according to the present invention includes: insulator 100,101, those are by having
One insulator bulk of one predetermined shape is constituted；One first crosspoint array 102 and one second crosspoint array 103, those are assembled to
Insulator 100,101；And a shell 106, it is constituted to surround outside product.
Insulator 100,101 includes: a first insulator 100, is contained in the inside of shell 106；And one second insulation
Body 101 has a main body, the integration of first insulator 100 of the main body and a part, and completes the rear side of shell 106.First
Insulator 100 and second insulator 101 are respectively provided with multiple for assembling the slit (not shown) of contact pin.Insulator 100,
101 can for example plastic resin be made.
In addition, radio frequency interference (RFI, Radio Frequency Interference) in order to prevent, in second insulator
101 side is installed by one scheduled RFI pad 105.RFI pads the interference of 105 blocking signals, and signal interference can pass through the first contact battle array
It is betided between crosspoint array 102,103 when column 102 and the transmission of the second crosspoint array 103 or reception signal.In detail, if one is high
Fast signal flows through the first crosspoint array 102 and the second crosspoint array 103, then a signal for flowing through any one contact pin can be to one
The signal for flowing through another contact pin impacts.When the signal that one flows through any one contact pin is dissipated, the RFI of ground connection
Pad 105 allows diverged signal to flow to RFI pad 105 rather than another contact pin, to prevent the interference between contact pin.
The middle plate 104 of one intensity for reinforcing contact pin bank component is configured in the inside of first insulator 100.Middle plate
104 between the first crosspoint array 102 and the second crosspoint array 103.Middle plate 104 flows through the first crosspoint array for obstructing one
102 signal and one flows through interference between the signal of the second crosspoint array 103.For example, working as one flows through the second crosspoint array 103
Signal when being dissipated, middle plate 104 allows diverged signal to flow to ground terminal rather than the first crosspoint array 102.
In addition, middle plate 104 can have one to combine protrusion 104a.It is corresponding with the one of a pin connector in conjunction with raised 104a
Protrusion engagement, so that socket connector and pin connector are bonded to each other.In detail, connect when pin connector is incorporated in socket
When connecing device or being separated with socket connector, in conjunction with raised 104a can it is corresponding with socket connector protrusion engagement, to realize use
In prevent socket connector to be combined or separately reach a certain degree clasp joint function (hooking function).Therefore, user
It can accurately identify whether pin connector is definitely bound to socket connector or definitely separates from socket connector.
Shell 106 is made with metal material, and second insulator 101 is accommodated therein by side behind.In addition, shell
106 are accommodated therein first insulator 100, and the rear side of shell 106 is completed by second insulator 101.Shell 106 can
It installs via a welding portion 106a to a printed circuit board.
First crosspoint array 102 is located at the second insulator 101 being placed on the upper face of first insulator 100.The
Two point array 103 is located at the lower surface of first insulator 100.Therefore, the first crosspoint array 102 and the second crosspoint array
103 are separated from each other.Stacking order is watched from the second crosspoint array 103, component is with the second crosspoint array 103, first insulator 100
Lower surface, middle plate 104, first insulator 100 upper face, a part second insulator 101 and the first contact battle array
The sequence storehouse of column 102.
Watch manufacturing process, first insulator 100 via with together first embedding of the second crosspoint array 103 and middle plate 104
Enter molding (insert molding) and is formed.After forming first insulator 100, the first crosspoint array 102 be placed as with
First insulator 100 separates a preset distance, ultimately forms second insulator 101 via the second insert molding later.
In the first crosspoint array 102 and the second crosspoint array 103 shown in Fig. 2,12 contact pins are respectively with rule
Pitch arrangement, and each pin has the interface (interface) along direction " A " in figure, as shown in table 1 below.The following table 1 is shown
The interface standard of USB C type connector.As shown in table 1 below, the interface arrangements sequence and the of the contact pin of the first crosspoint array 102
The interface arrangements sequence of the contact pin of two point array 103 is opposite.But, the interface at both ends is ground terminal in the same manner.Therefore, exist
In this specification, the reverse order of interface arrangements means other than the ground pin at both ends, arranges remaining contact pin on the contrary.
Since the interface arrangements of the contact pin of first and second crosspoint array 102,103 are as above opposite each other, plug connection
Device connects why direction attaches or separate regardless of it.
Table 1
One GND pin is a ground pin.One TX pin and RX pin are data/address bus pin, and phase each other is sold by (+) pin and one (-)
It is adjacent while pairs of (Pairs).One VBUS pin is for one for supplying the pin of power (POWER).It is a use that one SBU, which sells SBU1, SBU2,
In the pin of sideband (Sideband).One CC pin CC1, CC2 are one for constituting channel (Configuration Channel)
Pin.One D sells the pin that D1, D2 are used for differential data signal for one, and (+) pin and (-) pin are adjacent to each other while pairs of.As slightly
It is described afterwards, when the installation section 103a-1 of some contact pin in the contact pin of the second crosspoint array 103 and the first contact battle array
When the installation section 102a of the contact pin of column 102 is located at identical column, installation section 102a, 103a-1 of pairs of contact pin,
It the position of 103a-2 must be adjacent to each other along pitch direction.Herein, pairs of contact pin can be TX pin, RX pin or D pin.On
Crosspoint array 102,103 is stated to describe in detail below with reference to the accompanying drawings.
(1.1) the first example of crosspoint array
Fig. 3 is the figure for showing a crosspoint array of an embodiment according to the present invention, and wherein Fig. 3 (a) display one first connects
Lattice array 102, Fig. 3 (b) shows one second crosspoint array 103, and Fig. 3 (c) is top view, shows the first contact battle array by top
Column 102 and the second crosspoint array 103.
As shown in Fig. 3 (a), the contact pin of the first crosspoint array 102 respectively includes an installation section 102a, a contact portions
A 102b and coupling part 102c.Installation section 102a is surface mounted to a printed circuit board, the parallel printed circuit board, and
It is extracted by second insulator 101.One crosspoint array of contact portions 102b pin connector corresponding with one forms an electricity
Contact.Contact portions 102b is bound to a slit of first insulator 100.Coupling part 102c connection installation section 102a is to connecing
Point part 102b.As shown in Fig. 3 (a), installation section 102a and contact portions 102b are close to parallel to each other, and coupling part 102c
It is close to be vertically connected to installation section 102a and contact portions 102b.In addition, as shown in Fig. 3 (a), the first crosspoint array 102
Multiple contact pins there is a straight line (straight) shape in the same manner.
As shown in Fig. 3 (b), the second crosspoint array 103 includes two kinds of contact pins.
The first contact pin respectively includes an installation section 103a-1, a contact portions 103b and a coupling part 103c.
In the first contact pin, contact portions 103b is shaped to have a bending rather than a rectilinear configuration.When viewed from above,
Curved formation causes installation section 103a-1 and contact portions 103b not in same straight line, but installation section
The parallel contact portions 103b of 103a-1 but be located at more lateral.In this embodiment, bending can have a right angle or an oblique line shape,
But it is not only restricted to this.Contact portions 103b has a bending, because the installation section 103a-1 of the first contact pin is located at first
The outermost of crosspoint array 102, at the same it is identical with the installation section 102a of the first crosspoint array 102 along the formation of pitch direction
Column, as described later.
Second of contact pin respectively includes an installation section 103a-2, a contact portions 103b and a coupling part 103c.
One crosspoint array of the contact portions 103b of second of contact pin pin connector corresponding with one forms an electric contact.Contact portion
The slit for dividing 103b to be bound to first insulator 100.The contact portions 103b of second of contact pin has a rectilinear configuration, and
Installation section 103a-2 is close to vertical joint part 103b.Coupling part 103c is close to be vertically connected to contact portions 103b,
And horizontally connected with to installation section 103a-2.The coupling part 103c of second of contact pin has a bending being inclined outwardly,
As shown in Fig. 3 (b).Bending is set to elongate the pitch interval between the 103a-2 of installation section.If not needing to elongate pitch interval
Bending can not then be formed.The installation section 103a-1 of the first contact pin is surface mounted to a printed circuit board and the parallel printing
Circuit board.Meanwhile it in the installation section 103a-2 insertion printed circuit board of second of contact pin and being soldered at this.
As shown in Fig. 3 (c), if first and second crosspoint array 102,103 is bound to first insulator 100, second
The installation section 103a-1 of the first contact pin of crosspoint array 103 is located at and the first crosspoint array 102 along pitch direction
The identical column of installation section 102a of contact pin.
Fig. 4 is the assembling stereogram of a socket connector of the display including crosspoint array shown in Fig. 3, and Fig. 5 is Fig. 4's
Bottom view.
Referring to Fig. 4 and Fig. 5, the first of the installation section 102a of the first crosspoint array 102 and the second crosspoint array 103 are connect
The installation section 103a-1 of point pin is extracted by the bottom surface of the second insulator 101 of socket connector.At this point, passing through the
Two insulators 101 bottom surface extraction the second crosspoint array 103 the first contact pin installation section 103a-1 along
Pitch direction is located at column identical with the installation section 102a of contact pin of the first crosspoint array 102.As shown in figure 5, second connects
The installation section 103a-2 of second of contact pin of lattice array 103 is extracted with DIP solder type, and the second crosspoint array 103
The installation section 102a of the contact pin of the installation section 103a-1 of the first contact pin and the first crosspoint array 102 is with SMT type quilt
Extraction.If the installation section 103a-1 of a part of contact pin of the second crosspoint array 103 as above is located at the first contact battle array
The column of the installation section 102a of column 102, then the installation section 103a-2 of the residual contact pin of the second crosspoint array 103 can be with a column
Setting.This contact pin arrangement can be achieved one in the installation for wherein combining a column DIP solder type contact pin and a column SMT type contact pin
Structure is different from wherein combining two column DIP solder type contact pins and a column existing mounting structure for SMT type contact pin.
Therefore, it can effectively reduce the mounting area of the contact pin on printed circuit board, and also shorten the length of connector.
As above-mentioned, when arranging contact pin, notably it to be used for differential-pair signal (differential pair signal)
The installation section of contact pin (for example, TX2+, TX2-, D2+, D2-, RX1+, RX1-) must be configured to adjacent to each other.For differential
Noise caused by offsetting the contact pin of signal by the electric field that applies in the opposite direction, and therefore noise is prevented to be transferred to
Another contact pin.In detail, referring to Fig. 3, the installation section of the first included contact pin in the second crosspoint array 103
In the arrangement of 103a-1, three installation section 103a-1 in left side respectively GND, TX2+, TX2- interface, and TX2+ since left
And the position of TX2- interface is adjacent to each other.In addition, three installation section 103a-1 on right side respectively RX1-, RX1 since left
+, GND interface, and the position of RX1- and RX1+ interface is adjacent to each other.In addition, second included in the second crosspoint array 103
The installation section 103a-2 of contact pin with since left for VBUS, CC2, D2+, D2-, SBU2, VBUS interface sequence be arranged, and
The position of D2+ and D2- is also adjacent to each other.
(1.2) the second example of crosspoint array
Fig. 6 is the figure of the crosspoint array of display according to another embodiment of the present invention, wherein Fig. 6 (a) display one first
Crosspoint array 102, Fig. 6 (b) shows one second crosspoint array 103, and Fig. 6 (c) is top view, by top observation display first
Crosspoint array 102 and the second crosspoint array 103.
As shown in Fig. 6 (a), the contact pin of the first crosspoint array 102 includes an installation section 402a, a contact portions
A 402b and coupling part 402c.Installation section 402a is surface mounted to a printed circuit board, and the parallel printed circuit board,
And installation section 402a is extracted by second insulator 101.The one of contact portions 402b pin connector corresponding with one connects
Lattice array forms an electric contact.Contact portions 402b is bound to the slit of first insulator 100.Coupling part 402c connection installation
Part 402a to contact portions 402b.As shown in Fig. 6 (a), installation section 402a and contact portions 402b close to parallel to each other, and
Coupling part 402c is close to be vertically connected to installation section 402a and contact portions 402b.The first crosspoint array 102 of Fig. 6 passes through
It constitutes, so that centered on two contact pins at center, the contact portions 402b positioned at the external connector pin of two sides has one
Bending.In this embodiment, bending can have a right angle or an oblique line shape, but be not only restricted to this.Contact portions 402b has
One bending, to form a space, wherein the installation section 403a-1 of a part of contact pin of the second crosspoint array 103 is located at and the
The identical column of installation section 402a of the contact pin of one crosspoint array 102.
As shown in Fig. 6 (b), the second crosspoint array 103 includes two kinds of contact pins.
The first contact pin respectively includes an installation section 403a-1, a contact portions 403b and a coupling part 402c.
The first contact pin of a part includes the contact portions 403b of a rectilinear configuration, and part of it has a bending.When from upper
When side's observation, curved formation causes installation section 403a-1 and contact portions 403b not in same straight line, but pacifies
It fills the parallel contact portions 403b of part 403a-1 but is located at more lateral.In this embodiment, there are a curved contact portions
403b is perpendicularly bent toward twice.Curved quantity and angle can change according to embodiment, or bending can be an inclined oblique line,
But it is not only restricted to this.Contact portions 403b has just like above-mentioned bending, because of the installation section 403a-1 of the first contact pin
Positioned at the outermost of the first crosspoint array 102, it is formed simultaneously column identical with the installation section 402a of the first crosspoint array 102.
Second of contact pin respectively includes an installation section 403a-2, a contact portions 403b and a coupling part 403c.
One crosspoint array of the contact portions 403b of second of contact pin pin connector corresponding with one forms an electric contact.Contact portion
The slit for dividing 403b to be bound to first insulator 100.The contact portions 403b of second of contact pin has a rectilinear configuration, and pacifies
Part 403a-2 is filled close to vertical joint part 403b.Coupling part 403c is close to be vertically connected to contact portions 403b, and
Close to horizontally connected with to installation section 403a-2.The coupling part 403c of second of contact pin has one inwardly or outwardly to tilt
Bending, as shown in Fig. 6 (b).Bending is formed so that installation section 403a-2 there can be rule and long pitch.If not needing to draw
Long-pitch interval can not then form bending.The installation section 403a-1 of the first contact pin is surface mounted to a printed circuit board simultaneously
The parallel printed circuit board.Meanwhile in the installation section 403a-2 insertion printed circuit board of second of contact pin and being soldered to this
Place.
As shown in Fig. 6 (c), if first and second crosspoint array 102,103 is bound to first insulator 100, second
The installation section 403a-1 of the first contact pin of crosspoint array 103 is located at and the first crosspoint array 102 along pitch direction
The identical column of installation section 402a of contact pin.
Fig. 7 is the bottom view of a socket connector of the display including crosspoint array shown in fig. 6.Referring to Fig. 7, the second contact
The installation section 403a-1 of the first included contact pin is intermittently located at the installation of the first crosspoint array 102 in array 103
Between the 402a of part, and form column identical with the installation section 402a of the first crosspoint array 102.As shown in fig. 7, implementable one
The mounting structure of a column DIP solder type contact pin and a column SMT type contact pin is wherein being combined, and therefore can efficiently reduced
The mounting area of contact pin on a printed circuit.
As above-mentioned, when arranging contact pin, notably for the contact pin of differential-pair signal (for example, TX2+, TX2-, D2
+, D2-, RX1+, RX1-) installation section must be configured to adjacent to each other.Contact pin for differential-pair signal is offset by along phase
Noise caused by the electric field that opposite direction applies, and noise is therefore prevented to be transferred to another contact pin.In detail, reference Fig. 6,
In second crosspoint array 103 arrangement of the installation section 403a-1 of the first included contact pin since left by GND,
VBUS, CC2, SBU2, VBUS, GND are constituted.In addition, the installation of second of contact pin included in the second crosspoint array 103
Part 403a-2 is made of since left TX2+, TX2-, D2+, D2-, RX1-, RX1+.As above-mentioned, for differential-pair signal
The position of contact pin is adjacent to each other.
(1.3) the third example of crosspoint array
Fig. 8 is the figure of the crosspoint array of display according to another embodiment of the present invention.Referring to Fig. 8, the first crosspoint array
102 have structure identical with the first crosspoint array 102 shown in fig. 6.Meanwhile the second crosspoint array 103 shown in Fig. 8 is then not
It is same as the second crosspoint array 103 of Fig. 6.In detail, the contact pin for being located at two outsides of the second crosspoint array 103 of Fig. 6 is had
Some contact portions 403b have a bending, and installation section 403a-1 is located at the installation section with the first crosspoint array 102
The identical column of 402a.However, contact portions possessed by the contact pin for being located at two outsides of the second crosspoint array 103 of Fig. 8
403b has a rectilinear configuration rather than a bending, and installation section 403a-2 is not at the installation with the first crosspoint array 102
The identical column of part 402a.In other words, the contact pin for being located at two outsides of the second crosspoint array 103 of Fig. 8 is second of contact
Pin.
Fig. 9 is the bottom view of a socket connector of the display including crosspoint array shown in Fig. 8.Referring to Fig. 9, the second contact
The installation section 403a-1 of the first included contact pin is intermittently located at the installation of the first crosspoint array 102 in array 103
Between the 402a of part, and it is located at column identical with the installation section 402a of the first crosspoint array 102.As shown in figure 9, implementable one
The mounting structure of a column DIP solder type contact pin and a column SMT type contact pin is wherein being combined, and therefore can efficiently reduced
The mounting area of contact pin on a printed circuit.
As above-mentioned, when arranging contact pin, notably for the contact pin of differential-pair signal (for example, TX2+, TX2-, D2
+, D2-, RX1+, RX1-) installation section must be configured to adjacent to each other.Contact pin for differential-pair signal is offset by along phase
Noise caused by the electric field that opposite direction applies, and noise is therefore prevented to be transferred to another contact pin.In detail, reference Fig. 8,
In second crosspoint array 103 arrangement of the installation section 403a-1 of the first included contact pin since left by VBUS,
CC2, SBU2, VBUS are constituted.In addition, the installation section 403a- of second of contact pin included in the second crosspoint array 103
2 are made of since left GND, TX2+, TX2-, D2+, D2-, RX1-, RX1+, GND.As above-mentioned, for differential-pair signal
The position of contact pin TX2+, TX2-, D2+, D2-, RX1-, RX1+ are adjacent to each other.
(1.4) the 4th example of crosspoint array
Figure 10 is the figure of the crosspoint array of display according to another embodiment of the present invention.Referring to Fig.1 0, the first contact battle array
Column 102 have structure identical with the first crosspoint array 102 shown in Fig. 3.Meanwhile the second crosspoint array 103 shown in Fig. 10
Then it is different from the second crosspoint array 103 of Fig. 3.In detail, the contact pin for being located at two outsides of the second crosspoint array 103 of Fig. 3
Possessed contact portions 103b has a bending, and installation section 103a-1 is located at the mounting portion with the first crosspoint array 102
Divide the identical column of 102a.However, contact portions possessed by the contact pin for being located at two outsides of the second crosspoint array 103 of Figure 10
103b has a rectilinear configuration rather than a bending, and installation section 103a-2 is not at the installation with the first crosspoint array 102
The identical column of part 102a.In other words, the contact pin for being located at two outsides of the second crosspoint array 103 of Figure 10 is second of contact
Pin.
Figure 11 is the bottom view of a socket connector of the display including crosspoint array shown in Fig. 10.Referring to Fig.1 1, second
The installation section 103a-1 of the first included contact pin is intermittently located at the first crosspoint array 102 in crosspoint array 103
Between the 102a of installation section, and it is located at column identical with the installation section 102a of the first crosspoint array 102.As shown in figure 11, may be used
Implement one in the mounting structure for wherein combining a column DIP solder type contact pin and a column SMT type contact pin, and therefore can be efficient
Ground reduces the mounting area of contact pin on a printed circuit.
As above-mentioned, when arranging contact pin, notably for the contact pin of differential-pair signal (for example, TX2+, TX2-, D2
+, D2-, RX1+, RX1-) installation section must be configured to adjacent to each other.Contact pin for differential-pair signal is offset by along phase
Noise caused by the electric field that opposite direction applies, and noise is therefore prevented to be transferred to another contact pin.In detail, referring to figure
10, the arrangement of the installation section 103a-1 of the first included contact pin is by being located at the TX2 in left side in the second crosspoint array 103
+, TX2- and RX1- and RX1+ positioned at right side constituted, the position for use in the contact pin of differential-pair signal is adjacent to each other.
In addition, the installation section 103a-2 of second of contact pin included in the second crosspoint array 103 since left by GND, VBUS,
CC2, D2+, D2-, SBU2, VBUS, GND are constituted.Herein, the position of D2+ and D2- is also adjacent to each other.
(1.5) the 5th example of crosspoint array
Figure 12 is the figure of the crosspoint array of display according to another embodiment of the present invention.The first crosspoint array of Figure 12
102 are somewhat different than the first crosspoint array 102 of Fig. 6.In the first crosspoint array 102 of Fig. 6, with rectilinear configuration contact
The installation section 402a of a contact pin of part 402b and a contact pin with bending contact portions 402b adjacent thereto it
Between formed one interval, with wherein include belong to the second crosspoint array 103 two contact pins two installation section 403a-1.
However, in Figure 12, interval is formed as including only single installation section 403a-1.Meanwhile the second crosspoint array shown in Figure 12
103 are somewhat different than the second crosspoint array 103 of Fig. 6.In detail, the first included in the second crosspoint array 103 of Fig. 6
The quantity of contact pin is six, but the quantity of the first contact pin included in the second crosspoint array 103 of Figure 12 is four.
In other words, the second crosspoint array 103 of Figure 12 and an example are equivalent, wherein the first in the second crosspoint array 103 of Fig. 6 connects
Among point pin, the second contact pin come from two outer end numbers is replaced by second of contact pin, i.e. DIP solder type contact pin.
Figure 13 is the bottom view of a socket connector of the display including crosspoint array shown in Figure 12.Referring to Fig.1 3, second
The installation section 403a-1 of the first included contact pin is intermittently located in the first crosspoint array 102 in crosspoint array 103,
And it is located at column identical with the installation section 402a of the first crosspoint array 102.As shown in figure 13, implementable one one is combined wherein
The mounting structure of DIP solder type contact pin and a column SMT type contact pin is arranged, and therefore can efficiently reduce contact pin and print
Mounting area on circuit board.
As above-mentioned, when arranging contact pin, notably for the contact pin of differential-pair signal (for example, TX2+, TX2-, D2
+, D2-, RX1+, RX1-) installation section must be configured to adjacent to each other.Contact pin for differential-pair signal is offset by along phase
Noise caused by the electric field that opposite direction applies, and noise is therefore prevented to be transferred to another contact pin.In detail, referring to figure
12, in the second crosspoint array 103 arrangement of the installation section 403a-1 of the first included contact pin since left by GND,
CC2, SBU2, GND are constituted.In addition, the installation section 403a-2 of second of contact pin included in the second crosspoint array 103
It is made of since left TX2+, TX2-, VBUS, D2+, D2-, VBUS, RX1-, RX1+.As above-mentioned, for differential-pair signal
The position system of contact pin TX2+, TX2-, D2+, D2-, RX1-, RX1+ are adjacent to each other.
(1.6) the 6th example of crosspoint array
Figure 14 is the figure of the crosspoint array of display according to another embodiment of the present invention.The first crosspoint array of Figure 14
102 are somewhat different than the first crosspoint array 102 of Fig. 6.It is centrally located and have straight in the first crosspoint array 102 of Fig. 6
The quantity of the contact pin of line morphology contact portions 402b is two, but in the first crosspoint array 102 of Figure 14, such contact pin
Quantity be four.In addition, in the first crosspoint array 102 of Fig. 6, in the contact with rectilinear configuration contact portions 402b
Form an interval between the installation section 402a of pin and a contact pin with bending contact portions 402b adjacent thereto, with
Including two installation section 403a-1 of the contact pin for belonging to the second crosspoint array 103.Meanwhile the first contact battle array of Figure 14
It wherein only may include the interval of single installation section 403a-1 that column 102, which have one,.
Second crosspoint array 103 shown in Figure 14 is somewhat different than the second crosspoint array 103 of Fig. 6.In detail, Fig. 6
The quantity of the first included contact pin is six in second crosspoint array 103, but institute in the second crosspoint array 103 of Figure 14
Including the first contact pin quantity be four.In other words, the second crosspoint array 103 of Figure 14 and an example are equivalent, wherein
Among the first contact pin of the second crosspoint array 103 of Fig. 6, the third contact pin come from two outer end numbers is by second
Contact pin, i.e. DIP solder type contact pin, it is replaced.
Figure 15 is the bottom view of a socket connector of the display including crosspoint array shown in Figure 14.Referring to Fig.1 5, second
The installation section 403a-1 of the first included contact pin is intermittently located at the first crosspoint array 102 in crosspoint array 103
Between the 402a of installation section, and it is located at column identical with the installation section 402a of the first crosspoint array 102.As shown in figure 15, may be used
Implement one in the mounting structure for wherein combining a column DIP solder type contact pin and a column SMT type contact pin, and therefore can be efficient
Ground reduces the mounting area of contact pin on a printed circuit.
As above-mentioned, when arranging contact pin, notably for the contact pin of differential-pair signal (for example, TX2+, TX2-, D2
+, D2-, RX1+, RX1-) installation section must be configured to adjacent to each other.Contact pin for differential-pair signal is offset by along phase
Noise caused by the electric field that opposite direction applies, and noise is therefore prevented to be transferred to another contact pin.In detail, referring to figure
14, in the second crosspoint array 103 arrangement of the installation section 403a-1 of the first included contact pin since left by GND,
VBUS, VBUS, GND are constituted.In addition, the installation section 403a- of second of contact pin included in the second crosspoint array 103
2 are made of since left TX2+, TX2-, CC2, D2+, D2-, SBU2, RX1-, RX1+.As above-mentioned, for differential-pair signal
The position of contact pin TX2+, TX2-, D2+, D2-, RX1-, RX1+ are adjacent to each other.
2. plate cuts off (Board cut-off) type socket connector
Figure 16 is the exploded perspective view of the socket connector of display according to another embodiment of the present invention.Shown in Figure 16
The component of socket connector is only an example, in the art the obvious range of those who have general knowledge
Interior, component shown in Figure 16 can partially be excluded or exchange with other assemblies, or can dividually increase any further component.
Any component of Figure 16 as indicated by appended drawing reference identical with Fig. 2 executes function and operation same as shown in Figure 2.So
And socket connector shown in Figure 16 is a plate cutting type socket connector, and the shape and knot of some components shown in Figure 16
Structure is different from those of Fig. 2.The shape of the socket connector of printed circuit board corresponding diagram 16 is partly cut, and Figure 16's is slotting
Base connector is inserted into the cut portion of printed circuit board.Meanwhile socket connector shown in Fig. 2 is placed on printed circuit board
On surface.Therefore, even if the welding portion 106a of socket connector shown in Fig. 2 is located at the lower end of shell 106, the socket of Figure 16
The welding portion 106a of connector is located at the upper end of shell 106.In addition, even if the middle plate 104 of Fig. 2 has a flat shape, figure
16 middle plate 104 has a stairstepping.In addition, even if the second insulator 101 of Fig. 2 constituted so as to crosspoint array 102,
103 extract out from its lower end, but the second insulator 101 of Figure 16 is constituted so that crosspoint array 102,103 is extracted out from the upper end.The
One crosspoint array 102 is assembled to form a column on the upper face of first insulator 100, and the second crosspoint array 103 passes through
Assembly is separates with the first crosspoint array 102, to form a column in the lower surface of first insulator 100.Crosspoint array
102, it 103 is described in detail later with reference to attached drawing.
Figure 17 is the figure for displaying the details of a crosspoint array of socket connector of Figure 16, wherein Figure 17 (a) display one first
Crosspoint array 102, Figure 17 (b) shows one second crosspoint array 103, and Figure 17 (c) is top view, shows that first connects by top
Lattice array 102 and the second crosspoint array 103.
As shown in Figure 17 (a), the contact pin of the first crosspoint array 102 respectively includes an installation section 1702a, a contact portion
Divide a 1702b and coupling part 1702c.Installation section 1702a is surface mounted to a printed circuit board, the parallel printed circuit
Plate, and be extracted by second insulator 101.One crosspoint array shape of contact portions 1702b pin connector corresponding with one
At an electric contact.Contact portions 1702b is bound to a slit of first insulator 100.All contact portions 1702b have one
It is linear.Coupling part 1702c connection installation section 1702a to contact portions 1702b.As shown in Figure 17 (a), installation section
1702a and contact portions 1702b is close to parallel to each other, and coupling part 1702c has oneShape, top and under
Portion side has bending, to promote height of the installation section 1702a compared with contact portions 1702b.In addition, coupling part 1702c
It is close to be vertically connected to installation section 1702a and contact portions 1702b.In addition, coupling part 1702c be formed to have one from
The width that contact portions 1702b is gradually decreased towards installation section 1702a.When the first crosspoint array 102 installation section 1702a and
When the part installation section 1703a-1 of second crosspoint array 103 is located at same column along pitch direction, the width gradually decreased contracts
Subtract pitch, to prevent the width of socket connector from increasing.However, can not be reduced if the width of socket connector is unimportant
The width of coupling part 1702c.
As shown in Figure 17 (b), the second crosspoint array 103 includes two kinds of contact pins.
The first contact pin respectively includes an installation section 1703a-1, a contact portions 1703b and a coupling part
1703c.The first contact pin includes a contact portions 1703b, has a curved shape rather than a rectilinear configuration.If from top
Observe bending, then installation section 1703a-1 and contact portions 1703b is not in same straight line, but installation section
The parallel contact portions 1703b of 1703a-1 is in the position external than contact portions 1703b.In this embodiment, bending has
One inclined oblique line shape outwardly, but it is also implementable for corner shape etc. always.Contact portions 1703b has bending, because first
The installation section 1703a-1 of kind contact pin is located at the outermost of the first crosspoint array 102, is formed simultaneously and the first crosspoint array
The 102 identical column of installation section 1702a.The coupling part 1702c of the first contact pin has top and lower part curved
BentShape, to promote height of the installation section 1703a-1 compared with contact portions 1703b.
In addition, second of contact pin of the second crosspoint array 103 respectively includes an installation section 1703a-2, a contact portion
Divide a 1703b and coupling part 1702c.The one of the contact portions 1703b of second of contact pin pin connector corresponding with one
Crosspoint array forms an electric contact.Corresponding contact portions 1703b is bound to the slit of first insulator 100.Second of contact
The contact portions 1703b of pin has a rectilinear configuration, and installation section 1703a-2 is close to vertical joint part 1703b.Second
The coupling part 1702c of contact pin has oneShape, to promote installation section 1703a-2 and contact portions 1703b phase
The height of ratio.In this embodiment, the coupling part 1702c of second of contact pin has an inclined oblique line shape outwardly, with
Increase an interval of installation section 1703a-2.The installation section 1703a-1 of the first contact pin is surface mounted to a printed circuit
Plate and the parallel printed circuit board.Meanwhile it in the installation section 1703a-2 insertion printed circuit board of second of contact pin and welding
At to this.
As shown in Figure 17 (c), if first and second crosspoint array 102,103 is bound to first insulator 100, second
The installation section 1703a-1 of the first contact pin of crosspoint array 103 is located at and the first crosspoint array 102 along pitch direction
The identical column of installation section 1702a of contact pin.
Figure 18 is the assembling stereogram of a socket connector of the display including crosspoint array shown in Figure 17, and Figure 19 is figure
18 bottom view.
8 and Figure 19 referring to Fig.1, the first of the installation section 1702a of the first crosspoint array 102 and the second crosspoint array 103
The installation section 1703a-1 of kind contact pin is extracted by the second insulator 101 of socket connector.At this point, absolutely by second
Edge body 101 extract out the second crosspoint array 103 the first contact pin installation section 1703a-1 along pitch direction be located at
The identical column of installation section 1702a of included contact pin in first crosspoint array 102.As shown in figure 19, the second contact battle array
The installation section 1703a-2 of second included of contact pin is extracted in column 103 with DIP solder type, and the second crosspoint array
The installation section 1702a of the contact pin of the installation section 1703a-1 of 103 the first contact pin and the first crosspoint array 102 with
SMT type is extracted.If the installation section 1703a-1 of included a part of contact pin is as above in the second crosspoint array 103
Ground is located at the column of the installation section 1702a of the first crosspoint array 102, the then installation of the residual contact pin of the second crosspoint array 103
Part 1703a-2 can be with a column setting.This contact pin arrangement can be achieved one and combine a column DIP solder type contact pin and one wherein
The mounting structure for arranging SMT type contact pin, and is wherein being combined two column DIP solder type contact pins and one is arranging SMT type contact pin
Existing mounting structure is different.Therefore, the mounting area of the contact pin on printed circuit board can effectively be reduced.
Other than the contact of the crosspoint array 102,103 shown in Figure 17 arranges, plate cutting type socket connector can also have
Just like the contact pin arrangement of Fig. 6 to plate mo(u)ld top half socket connector shown in figure 15.Since the arrangement of contact pin is entirely by reference to Fig. 6
It is described to Figure 15, herein just no longer narration in detail.
Figure 20 is for a crosspoint array of an embodiment more according to the present invention and an existing crosspoint array one
The figure of installation pattern on printed circuit board.Figure 20 (a) is side view, shows the contact of an existing plate mo(u)ld top half socket connector
Array 12,13 is mounted to a printed circuit board 2010.Figure 20 (b) is side view, shows an embodiment according to the present invention
The crosspoint array 102,103 of plate mo(u)ld top half socket connector is mounted to printed circuit board 2010.Figure 20 (c) is side view, display
The crosspoint array 102,103 of the plate cutting type socket connector of an embodiment according to the present invention is mounted to printed circuit board
2010。
Referring to Figure 20, existing socket connector is made of a column SMT type contact pin and two column DIP type contact pins.
However, the socket connector of an embodiment according to the present invention is by a column SMT type contact pin and a column DIP type contact pin institute structure
At.Particularly, in the socket connector of an embodiment according to the present invention, a part of DIP type contact pin becomes SMT type
And identical column are mounted on SMT type contact pin, to reduce the quantity for the DIP type contact pin for occupying big mounting area.Therefore, may be used
Reduce the entire mounting area of socket connector.Further, since the structure of contact pin is reduced to two column from three column, can greatly reduce
The length of entire socket connector.
The present invention describes in detail.But, while pointing out presently preferred embodiments of the present invention, it should be understood that in detail narration with
Particular example is only given via the mode that illustrates, because thus those one skilled in the art ought describe clear belong to originally in detail
Various change and modification in the range of invention.
Claims (21)
1. a kind of socket connector, it includes:
One insulator；
One first crosspoint array, have at the insulator one it is surface-mounted be a column multiple contact pins；
One second crosspoint array, have at the insulator it is opposite with a surface it is surface-mounted be the more of a column
A contact pin, and separated with first crosspoint array；And
One shell surround one group of the insulator, first crosspoint array and second crosspoint array through constituting
Component,
In second crosspoint array installation section of included a part of contact pin be located at in first crosspoint array
The identical column in installation section of the included contact pin, the peace of included residual contact pin in second crosspoint array
Dress part is located at the column different from the installation section of the contact pin included in first crosspoint array,
Included multiple contact pins in first crosspoint array respectively include:
One first contact portions, through constituting the electric contact to provide with a pin connector；
One the first installation part is surface mounted to a printed circuit board；And
One the first pontes is constituted to connect first contact portions to the first installation part.
2. socket connector according to claim 1,
In first crosspoint array among included multiple contact pins, the first contact portions of a part of contact pin
First contact portions of the bending being inclined outwardly with one, residual contact pin have a rectilinear form.
3. socket connector according to claim 2,
It is described to be bent into an inclined oblique line outwardly.
4. socket connector according to claim 2,
The installation section of included a part of contact pin, which is located at, in second crosspoint array has described curved the
The first installation part of the contact pin of one contact portions connects with the described of the first contact portions with the rectilinear form
Between the first installation part of point pin.
5. socket connector according to claim 1,
First contact portions the first installation part in parallel,
Vertical first contact portions of the first pontes and the first installation part.
6. socket connector according to claim 1,
On the basis of a bottom surface of the socket connector, included multiple contacts in first crosspoint array
The position of the first installation part of pin is higher than first contact portions.
7. socket connector according to claim 6,
First contact portions the first installation part in parallel,
The first pontes has a ┏ ┓ shape.
8. socket connector according to claim 1, included multiple contact pins in second crosspoint array
Respectively include:
One second contact portions, through constituting the electric contact to provide with a pin connector；
One second installation section, installation a to printed circuit board；And
One second connecting portion point is constituted to connect second contact portions to second installation section,
In second crosspoint array among included multiple contact pins, the second installation of a part of contact pin
Part of the surface is installed to the printed circuit board, and the second installation section insertion of residual contact pin is installed to the printed circuit
Plate.
9. socket connector according to claim 8,
Second contact portions of included a part of contact pin have one to lean outward in second crosspoint array
Oblique bending,
Second contact portions of the residual contact pin have a rectilinear form.
10. socket connector according to claim 8,
In second crosspoint array among included a part of contact pin, described the second of a part of contact pin is connect
Point part has a bending being inclined outwardly,
In second crosspoint array among included a part of contact pin, second contact of residual contact pin
Part has a rectilinear form.
11. socket connector according to claim 9 or 10,
The bending has a right angle.
12. socket connector according to claim 9 or 10,
It is described to be bent into an inclined oblique line outwardly.
13. socket connector according to claim 8,
Second contact portions of included a part of contact pin have a linear in second crosspoint array
Shape.
14. socket connector according to claim 8,
The second connecting portion point of the included residual contact pin is vertically connected to institute in second crosspoint array
It states the second contact portions and is horizontally connected to second installation section, and there is a bending.
15. socket connector according to claim 8,
The second connecting portion point of the included residual contact pin is vertically connected to institute in second crosspoint array
The second contact portions and second installation section are stated, and there is a bending.
16. socket connector according to claim 15,
On the basis of a bottom surface of the socket connector, it is connected in second crosspoint array included described surplus
The position of one end of the contact portions of the second connecting portion of remaining contact pin point, which is lower than, is connected to the residual contact pin
The second connecting portion point second installation section one end.
17. socket connector according to claim 16,
The second connecting portion point of the included residual contact pin has a ┓ shape in second crosspoint array.
18. socket connector according to claim 8,
On the basis of a bottom surface of the socket connector, included described a part is connect in second crosspoint array
The position of second installation section of point pin is higher than second contact portions.
19. socket connector according to claim 18,
The second connecting portion point of included a part of contact pin has a ┏ ┓ shape in second crosspoint array
Shape.
20. socket connector according to claim 1,
The first installation part and second crosspoint array of included multiple contact pins in first crosspoint array
In the installation section of included a part of contact pin be surface mounted to a printed circuit board,
The installation section insertion of included residual contact pin is installed to the printed circuit board in second crosspoint array.
21. socket connector according to claim 1,
An interface arrangements of included multiple contact pins and second crosspoint array in first crosspoint array
One interface arrangements of multiple contact pins are opposite.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140128543 | 2014-09-25 | ||
| KR10-2014-0128543 | 2014-09-25 | ||
| KR10-2015-0100867 | 2015-07-16 | ||
| KR1020150100867A KR102096432B1 (en) | 2014-09-25 | 2015-07-16 | Receptacle connector inculuding the improved contact array structure |
| PCT/KR2015/007536 WO2016047911A1 (en) | 2014-09-25 | 2015-07-21 | Receptacle connector having improved structure for contact array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106716740A CN106716740A (en) | 2017-05-24 |
| CN106716740B true CN106716740B (en) | 2019-05-28 |
Family
ID=55799779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580051876.1A Active CN106716740B (en) | 2014-09-25 | 2015-07-21 | Socket connector including improved crosspoint array structure |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102096432B1 (en) |
| CN (1) | CN106716740B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206893861U (en) * | 2017-04-25 | 2018-01-16 | 泰科电子(上海)有限公司 | Connector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090056918A (en) * | 2007-11-30 | 2009-06-03 | 이문기 | A type symmetric usb receptacle |
| WO2009069969A2 (en) * | 2007-11-30 | 2009-06-04 | Moon Key Lee | A type symmetric usb receptacle |
| CN201378641Y (en) * | 2009-03-06 | 2010-01-06 | 北京华旗资讯数码科技有限公司 | USB interface socket with double plug-in surfaces |
| KR20130097392A (en) * | 2012-02-24 | 2013-09-03 | 엘에스엠트론 주식회사 | Improved receptacle connector for contact array structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4260791B2 (en) * | 2005-11-07 | 2009-04-30 | 日本航空電子工業株式会社 | connector |
| TWI420749B (en) * | 2008-12-19 | 2013-12-21 | Chant Sincere Co Ltd | Usb connector and contact array thereof |
| CN101867100A (en) * | 2009-04-15 | 2010-10-20 | 诠欣股份有限公司 | USB connector and contact point array thereof |
| US8951050B2 (en) * | 2011-02-23 | 2015-02-10 | Japan Aviation Electronics Industry, Limited | Differential signal connector capable of reducing skew between a differential signal pair |
-
2015
- 2015-07-16 KR KR1020150100867A patent/KR102096432B1/en active IP Right Grant
- 2015-07-21 CN CN201580051876.1A patent/CN106716740B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090056918A (en) * | 2007-11-30 | 2009-06-03 | 이문기 | A type symmetric usb receptacle |
| WO2009069969A2 (en) * | 2007-11-30 | 2009-06-04 | Moon Key Lee | A type symmetric usb receptacle |
| CN201378641Y (en) * | 2009-03-06 | 2010-01-06 | 北京华旗资讯数码科技有限公司 | USB interface socket with double plug-in surfaces |
| KR20130097392A (en) * | 2012-02-24 | 2013-09-03 | 엘에스엠트론 주식회사 | Improved receptacle connector for contact array structure |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160036474A (en) | 2016-04-04 |
| CN106716740A (en) | 2017-05-24 |
| KR102096432B1 (en) | 2020-04-02 |
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