KR20160036474A - Receptacle connector inculuding the improved contact array structure - Google Patents

Receptacle connector inculuding the improved contact array structure Download PDF

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Publication number
KR20160036474A
KR20160036474A KR1020150100867A KR20150100867A KR20160036474A KR 20160036474 A KR20160036474 A KR 20160036474A KR 1020150100867 A KR1020150100867 A KR 1020150100867A KR 20150100867 A KR20150100867 A KR 20150100867A KR 20160036474 A KR20160036474 A KR 20160036474A
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KR
South Korea
Prior art keywords
contact
portion
array
contact pins
contact array
Prior art date
Application number
KR1020150100867A
Other languages
Korean (ko)
Inventor
최정훈
이현우
Original Assignee
엘에스엠트론 주식회사
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Publication date
Priority to KR20140128543 priority Critical
Priority to KR1020140128543 priority
Application filed by 엘에스엠트론 주식회사 filed Critical 엘에스엠트론 주식회사
Priority claimed from PCT/KR2015/007536 external-priority patent/WO2016047911A1/en
Publication of KR20160036474A publication Critical patent/KR20160036474A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62Sliding engagements with one side only, e.g. modular jack coupling devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00Four or more poles

Abstract

Disclosed is a receptacle connector with an improved structure of a contact array. According to one aspect of the present invention, the receptacle connector includes: an insulator; a first contact array including a plurality of contact pins assembled to form a row in the insulator; a second contact array including a plurality of contact pins assembled to form a row in the insulator to be spaced from the first contact array; and a shell enclosing the assembly of the insulator and the first contact array and the second contact array. A mounting unit of a portion of the contact pins included in the second contact array and a mounting unit of the contact pins included in the first contact array are positioned in the same row.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a receptacle connector,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a receptacle connector, and more particularly, to a receptacle connector having an improved array structure of a contact array.

Generally, the receptacle connector is mounted on a printed circuit board (PCB) of various portable electronic devices and is fastened to a plug connector corresponding thereto, and is generally configured to meet the USB (Micro Universal Serial Bus) standard.

Details of the new USB specification, type-C connector, have recently been published at the IDF (Intel Developer Forum). The USB type-C connector has a size similar to that of the USB 2.0 Micro-B and has the advantage of being easy to attach and detach the plug connector regardless of the direction of connection of the plug connector. In addition, the USB type-C connector has a transmission speed of 10Gbps, which is twice as fast as the conventional USB 3.0, and can supply power up to 100W, so it is expected to be used in various fields.

The USB type -C connector is divided into dual SMT (Surface Mount Technology) type and Hybrid (SMT + DIP) type depending on the printed circuit board mounting method. In the SMT type, the contact pins of the USB type-C connector are mounted in contact with the surface of the printed circuit board. In the dual SMT type, two rows of contact pins are surface mounted on the printed circuit board. In the hybrid type, the contact pins of one row among the two rows of contact pins are mounted in the SMT type and the remaining one row of contact pins are mounted in the DIP (Dual Inline Package) type. In this case, the DIP (Dual Inline Package) type is a method in which the contact pins of the connector are formed perpendicularly to the printed circuit board and inserted into the through-holes formed in the printed circuit board. Of these, it is difficult to confirm whether the contact pins of one row among the two rows of contact pins are properly mounted on the printed circuit board in the dual SMT type connector. Therefore, a hybrid type connector is preferable in which all contact pins can be mounted or not.

1 is a view showing a part of a bottom surface of a hybrid type receptacle connector according to the prior art. 1, a hybrid type receptacle connector includes an insulator 11 of a predetermined shape, a first contact array 12 and a second contact array 13 assembled to the insulator 11, And a shell 10 surrounding the outside of the product. The first contact array 12 is made up of one row of SMT type contact pins and the second contact array 13 is made up of two rows of DIP type contact pins. The contact pins of the DIP type can be configured in one column. However, in this case, it is not possible to place a large number of the DIP type contact pins in the first column. As shown in Fig. 1, generally, the contact pins of the DIP type are arranged in two rows.

However, in the conventional hybrid type receptacle connector having the above structure, the second contact array 13 composed of two rows of DIP type contact pins occupies a large mounting area in the printed circuit board. Also, since the second contact array 13 is composed of two rows of contact pins and the first contact array 12 is composed of one row of contact pins, the receptacle connector is formed of a total of three rows of contact pins, thereby increasing the overall length. Therefore, the conventional receptacle connector having three rows of contact pins has a drawback that it can not satisfy trends of portable electronic devices which are gradually becoming larger and slimmer. In particular, the arrangement structure of the contact array according to the related art has been a barrier to reduce the size of the bezel or to increase the capacity of the battery in order to increase the screen of the portable electronic device.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a hybrid receptacle connector in which a contact array can be mounted on a printed circuit board with a reduced contact area, In order to solve the problem.

According to an aspect of the present invention, there is provided a receptacle connector including: an insulator; A first contact array including a plurality of contact pins arranged in a row in the insulator; A second contact array including a plurality of contact pins arranged in a row in the insulator so as to be spaced apart from the first contact array; And a shell surrounding the insulator and the assembly of the first contact array and the second contact array, wherein a mounting portion of a part of the contact pins included in the second contact array includes a contact pin of the contact pins included in the first contact array It is located in the same column as the mounting part.

The plurality of contact pins included in the first contact array include: a contact portion for providing an electrical contact with the plug connector; A mounting portion that is surface mounted on a printed circuit board; And a connecting portion connecting the contact portion and the mounting portion.

The contact portions of some contact pins of the plurality of contact pins included in the first contact array may include outward curvature and the contact portions of the remaining contact pins may be straight.

The curvature may be diagonally outward.

The mounting portion of the part of the contact pins included in the second contact array may be located between the mounting portion of the contact pin including the bending portion in the contact portion and the mounting portion of the contact pin having the linear contact portion.

The contact portion and the mounting portion may be parallel, and the connection portion may be perpendicular to the contact portion and the mounting portion.

The mounting portion of the plurality of contact pins included in the first contact array may be located higher than the contact portion with respect to the bottom surface of the receptacle connector.

The contact portion and the mounting portion may be parallel to each other, and the connecting portion may be formed in a shape of a prism.

The plurality of contact pins included in the second contact array include: a contact portion for providing an electrical contact with the plug connector; A mounting unit mounted on the printed circuit board; And a connection part connecting the contact part and the mounting part, wherein the mounting part of the part of the plurality of contact pins among the plurality of contact pins included in the second contact array is surface mounted on the printed circuit board, The mounting portion may be inserted into the printed circuit board.

The contact portion of the part of the contact pins included in the second contact array may include an outwardly curved portion and the contact portion of the remaining contact pin may be straight.

Wherein the contact portions of some of the contact pins of the second contact array include an outwardly curved contact and the contact portions of the remaining contact pins of the second contact array , And may be a linear shape.

The curvature may be right angled or diagonally outward.

The contact portion of the partial contact pin included in the second contact array may be straight.

The connection portion of the remaining contact pins included in the second contact array may be connected to the contact portion vertically and horizontally connected to the mounting portion, and may include bending.

The connection portion of the remaining contact pins included in the second contact array may be connected perpendicularly to the contact portion and the mounting portion and may include bending.

One end of the contact portion connected to the connection portion of the remaining contact pin included in the second contact array may be located lower than one end of the mounting portion connected to the connection portion of the remaining contact pin with respect to the bottom surface of the receptacle connector .

The connection portion of the remaining contact pins included in the second contact array may be in the shape of a circle.

The mounting portion of the part of the contact pins included in the second contact array may be positioned higher than the contact portion with respect to the bottom surface of the receptacle connector.

The connection portion of the part of the contact pins included in the second contact array may be in the form of a lead.

The mounting portion of the plurality of contact pins included in the first contact array and the mounting portion of the part of the contact pins included in the second contact array are surface mounted on the printed circuit board and the remaining contacts included in the second contact array The mounting portion of the fin can be inserted and mounted on the printed circuit board.

The interface arrangement of the plurality of contact pins included in the first contact array may be opposite to the interface arrangement of the plurality of contact pins included in the second contact array.

The present invention reduces the length of the receptacle connector while reducing the mounting area of the printed circuit board by reducing the arrangement of the contact arrays of the hybrid type receptacle connector from three rows to two columns.

Particularly, the arrangement of the contact pins of the DIP type for increasing the mounting area of the printed circuit board can be reduced from two rows to one row, thereby shortening the mounting area of the printed circuit board and shortening the length of the receptacle connector.

Therefore, when the present invention is applied to a portable electronic device such as a smart phone, it is possible to reduce the size of the bezel portion where the receptacle connector is located, thereby easily increasing the screen area and increasing the capacity of the battery.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description of the invention given below, serve to further the understanding of the technical idea of the invention. And should not be construed as limiting.
1 is a view showing a part of a bottom surface of a hybrid type receptacle connector according to the prior art.
2 is an exploded perspective view of a receptacle connector according to an embodiment of the present invention.
3 is a diagram illustrating a contact array according to an embodiment of the present invention.
4 is an assembled perspective view of a receptacle connector including the contact array shown in Fig.
5 is a bottom view of Fig.
6 is a view showing a contact array according to another embodiment of the present invention.
7 is a bottom view of a receptacle connector including the contact array shown in Fig.
8 is a view showing a contact array according to another embodiment of the present invention.
9 is a bottom view of the receptacle connector including the contact array shown in Fig.
10 is a view showing a contact array according to another embodiment of the present invention.
11 is a bottom view of the receptacle connector including the contact array shown in Fig.
12 is a view showing a contact array according to another embodiment of the present invention.
13 is a bottom view of the receptacle connector including the contact array shown in Fig.
14 is a view showing a contact array according to another embodiment of the present invention.
15 is a bottom view of the receptacle connector including the contact array shown in Fig.
16 is an exploded perspective view of a receptacle connector according to another embodiment of the present invention.
17 is a diagram specifically showing a contact array of the receptacle connector of Fig. 16;
18 is an assembled perspective view of a receptacle connector including the contact array shown in Fig.
Fig. 19 is a bottom view of Fig. 4; Fig.
FIG. 20 is a diagram comparing a printed circuit board mounting pattern of a conventional contact array with a contact array according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined. Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.

In the following embodiments, 'forward' means the direction in which the plug connector is positioned to engage with the receptacle connector, and 'rear' means the opposite direction to the front.

1. Onboard ( on - board ) Type Receptacle  connector

2 is an exploded perspective view of a receptacle connector according to an embodiment of the present invention. The type of the components of the receptacle connector shown in Fig. 2 is one example, and it is apparent to those skilled in the art that some of the components shown in Fig. 2 may be omitted or changed to other components, May be added. The receptacle connector of this embodiment is an on-board type receptacle connector, which is mounted on a printed circuit board as it is.

2, a receptacle connector according to an embodiment of the present invention includes insulators 100 and 101 having a predetermined shape and made of an insulator block, a first contact array 102 assembled to the insulators 100 and 101, Two contact arrays 103, and a shell 106 surrounding the exterior of the product.

The insulators 100 and 101 have a first insulator 100 accommodated inside the shell 106 and a body that can be incorporated with a part of the first insulator 100 and have a rear surface of the shell 106 closed And the second insulator 101 is provided. The first insulator 100 and the second insulator 101 are provided with a plurality of slots (not shown) for assembling the contact pins. The material of the insulators 100 and 101 may be, for example, a plastic resin.

In addition, a predetermined RFI pad 105 is provided on one side of the second insulator 101 in preparation for RFI (Radio Frequency Interference). The RFI pad 105 blocks signal interference that may occur between the contact arrays 102 and 103 during transmission and reception of signals through the first contact array 102 and the second contact array 103. Specifically, when a high-speed signal flows through the first contact array 102 and the second contact array 103, a signal flowing through one of the contact pins may affect a signal flowing to the other contact pin. The RFI pad 105 connected to the ground prevents an interference phenomenon between the contact pins when a signal flowing through one of the contact pins is diverted to the RFI pad 105 rather than to the other contact pins .

Inside the first insulator (100), a mid plate (104) for reinforcing the strength of the assembly of contact pins is disposed. The mid plate 104 is positioned between the first contact array 102 and the second contact array 103. The mid plate 104 is used to block interference between a signal flowing through the first contact array 102 and a signal flowing through the second contact array 103. For example, the midplate 104 may cause the signal to flow to ground rather than the first contact array 102 when a signal flowing through the second contact array 103 is diverted.

Further, the mid plate 104 may have a coupling protrusion 104a. The engaging projections 104a and the corresponding projections of the plug connector engage with each other to engage the receptacle connector and the plug connector with each other. Specifically, the engaging projection 104a can engage with the corresponding projection of the plug connector when the plug connector is coupled to the receptacle connector or detached from the receptacle connector, and can play a role as a hindrance to some degree of engagement or disconnection of the plug connector. Thereby, the user can be made aware of whether the plug connector is correctly coupled to the receptacle connector or correctly separated from the receptacle connector.

The shell 106 is made of a metal material and accommodates the second insulator 101 therein from the rear. In addition, the shell 106 receives the first insulator 100 therein, and the rear surface thereof is closed with the second insulator 101. The shell 106 may be mounted on the printed circuit board via the solder portion 106a.

The first contact array 102 is located on the second insulator 101 placed on the upper surface of the first insulator 100. The second contact array 103 is located on the lower surface of the first insulator 100. Thus, the first contact array 102 and the second contact array 103 are spaced from each other. The second contact array 103, the lower surface of the first insulator 100, the middle plate 104, the upper surface of the first insulator 100, the upper surface of the second insulator 10 , And the first contact array 102 are stacked in this order.

Looking at the manufacturing process, the first insulator 100 is formed through the first insert molding together with the second contact array 103 and the middle plate 104. After the first insulator 100 is formed, the first contact array 102 is spaced apart from the first insulator 100 by a predetermined distance, and then the second insulator 101 is formed through the second insert molding.

The contact fins of the first contact array 102 and the second contact array 103 shown in Fig. 2 are arranged at a constant pitch of 12, Lt; / RTI > Table 1 below shows the interface specifications of the USB type-C connector. As shown in the following Table 1, the interface arrangement order of the contact pins constituting the first contact array 102 is opposite to the interface arrangement order of the contact pins constituting the second contact array 103. However, the interface at both ends is the same as the ground. Therefore, in the present specification, the reverse order of the interface placement means that the order of placement of the remaining contact pins except the ground pins at both ends is reversed. As described above, the order of arranging the interfaces of the contact pins constituting the first and second contact arrays 102 and 103 is reversed, so that the plug connector can be attached and detached regardless of the direction of connection of the plug connector.

The first contact array GND RX2 + RX2- VBUS SBU1 D1- D1 + CC1 VBUS TX1- TX1 + GND The second contact array GND TX2 + TX2- VBUS CC2 D2 + D2- SBU2 VBUS RX1- RX1 + GND

The GND pin is a ground pin. The TX and RX pins are data bus pins, and the (+) and (-) pins are adjacent to each other in pairs. The VBUS pin is the pin for power supply. The SBU pins SBU1 and SBU2 are pins for the sideband. The CC pins (CC1, CC2) are the pins for the Configuration Channel. D pins (D1, D2) are pins for differential data signals, and the (+) and (-) pins are adjacent to each other. As described below, the mounting portion 103a-1 of some of the contact pins belonging to the second contact array 103 is formed to be the same as the mounting portion 102a of the contact pins of the first contact array 102 When placed in the column, the mounting portions 102a, 103a-1, 103a-2 of the contact pins forming the pair must be positioned adjacent to each other in the pitch direction. Here, the contact pins forming the pair are TX pin, RX pin, and D pin. The contact arrays 102 and 103 will be described in detail below with reference to the drawings.

(1.1) Contact  First Example of Array

3 is a view showing a contact array according to an embodiment of the present invention. FIG. 3A is a first contact array 102, FIG. 3B is a second contact array 103, FIG. 3C is a plan view of the first contact array 102 and the second contact array 103, as viewed from above.

3 (a), the contact pins of the first contact array 102 include a mounting portion 102a, a contact portion 102b, and a connection portion 102c. The mounting portion 102a is a portion that is surface-mounted on the printed circuit board and is parallel to the printed circuit board, and is drawn out through the second insulator 101. [ The contact portion 102b provides electrical contact with the contact array of the corresponding plug connector. The contact portion 102b is coupled to the slot of the first insulator 100. [ The connection portion 102c connects the mounting portion 102a and the contact portion 102b. The mounting portion 102a and the contact portion 102b are substantially parallel and the connecting portion 102c is connected substantially vertically to the mounting portion 102a and the contact portion 102b as shown in Figure 3 (a). 3 (a), the plurality of contact pins constituting the first contact array 102 all have the same shape and a straight shape.

As shown in FIG. 3 (b), the second contact array 103 includes two kinds of contact pins.

The first type of contact pins include a mounting portion 103a-1, a contact portion 103b, and a connecting portion 103c. The contact pins 103b of the first type are not linear but curved. The bent portion is formed such that the mounting portion 103a-1 and the contact portion 103b are not located on the same straight line and the mounting portion 103a-1 is parallel to the contact portion 103b, . In this embodiment, the curvature may be a right angle, an oblique line or various other shapes. The reason why the contact portion 103b has such a curvature is that the mounting portion 103a-1 of the first type of contact pins can be bent in the pitch direction (the direction in which the mounting portion 102a of the first contact array 102) And is located at the outermost portion of the first contact array 102. [

The second type of contact pins include a mounting portion 103a-2, a contact portion 103b, and a connecting portion 103c. The contact portion 103b of the second kind of contact pins provides electrical contact with the contact array of the corresponding plug connector. The contact portion 103b is coupled to the slot of the first insulator 100. [ The contact portion 103b of the second type of contact pins is in a linear shape and the mounting portion 103a-2 is substantially perpendicular to the contact portion 103b. The connection portion 103c is connected substantially vertically to the contact portion 103b and horizontally connected to the mounting portion 103a-2. The connecting portion 103c of the second kind of contact pins has a curved outward direction as shown in Fig. 3 (b). The reason for this bending is to increase the pitch interval of the mounting portions 103a-2. If you do not increase the pitch interval, you do not need to bend. The mounting portion 103a-1 of the first type of contact pins is a portion that is surface-mounted on the printed circuit board and is parallel to the printed circuit board. On the other hand, the mounting portion 103a-2 of the second kind of contact pins is inserted into the printed circuit board and soldered.

When the first and second contact arrays 102 and 103 are coupled to the first insulator 100 as shown in Fig. 3 (c), the mounting of the contact pins of the first type of the second contact array 103 The portion 103a-1 is located in the same row in the pitch direction as the mounting portion 102a of the contact pins of the first contact array 102. [

Fig. 4 is an assembled perspective view of a receptacle connector including the contact array shown in Fig. 3, and Fig. 5 is a bottom view of Fig.

4 and 5, through the bottom surface of the second insulator 101 of the receptacle connector, the mounting portion 102a of the first contact array 102 and the contact pins of the first type of the second contact array 103 The mounting portion 103a-1 of the main body 103a is pulled out to the rear side. At this time, the mounting portion 103a-1 of the first type of contact pins of the second contact array 103 drawn out through the bottom surface of the second insulator 101 is mounted on the mounting surface of the contact pins belonging to the first contact array 102 Are positioned in the same column in the pitch direction as the portion 102a. As shown in Fig. 5, the mounting portion 103a-2 of the second type of contact pins included in the second contact array 103 is drawn out in the DIP soldering type, and the mounting portion 103a-2 of the second contact array 103 The mounting portion 103a-1 of one kind of contact pins and the mounting portion 102a of the contact pins belonging to the first contact array 102 are drawn out in the SMT type. When the mounting portions 103a-1 of the plurality of contact pins belonging to the second contact array 103 are positioned in the column of the mounting portion 102a of the first contact array 102, the remaining contacts of the second contact array 103 It is possible to form the mounting portions 103a-2 of the fins in one row. Unlike the mounting structure in which the conventional two-row DIP soldering-type contact pins and the one-row SMT-type contact pins are combined, the arrangement structure of the contact pins is different from that of the conventional structure in which the contact pins of one row DIP soldering type and the contact pins of the one row SMT type The combined mounting structure can be realized, so that the mounting area of the contact pins on the printed circuit board can be effectively reduced and the length of the connector can be reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. 3, in the arrangement of the mounting portions 103a-1 of the first type of contact pins included in the second contact array 103, the left three mounting portions 103a-1 are located on the left side To GND, TX2 +, and TX2- interfaces, and TX2 + and TX2- interfaces are located adjacent to each other. The three mounting portions 103a-1 on the right side are RX1-, RX1 +, and GND interfaces from the left side, and RX1- and RX1 + interfaces are adjacent to each other. The mounting portion 103a-2 of the second type of contact pins included in the second contact array 103 is composed of VBUS, CC2, D2 +, D2-, SBU2 and VBUS interface sequences from the left side. D2-interfaces are located adjacent to each other.

(1.2) Contact  Second Example of Array

6 is a view showing a contact array according to another embodiment of the present invention. FIG. 6A is a first contact array 102, FIG. 6B is a second contact array 103, 6 (c) is a plan view of the first contact array 102 and the second contact array 103, as viewed from the top.

6 (a), the contact pins of the first contact array 102 include a mounting portion 402a, a contact portion 402b, and a connection portion 402c. The mounting portion 402a is a portion that is surface mounted on the printed circuit board and is parallel to the printed circuit board and is drawn out through the second insulator 101. [ The contact portion 402b provides an electrical contact with the contact array of the corresponding plug connector. The contact portion 402b is coupled to the slot of the first insulator 100. [ The connection portion 402c connects the mounting portion 402a and the contact portion 402b. The mounting portion 402a and the contact portion 402b are substantially parallel and the connection portion 402c is substantially perpendicularly connected to the mounting portion 402a and the contact portion 402b as shown in Figure 6 (a). The first contact array 102 of FIG. 6 has a shape in which the contact portions 402b of the contact pins at both outer sides of the center two contact pins are bent. In this embodiment, the curvature is a slant shape inclined obliquely toward the outside, but is not limited thereto. The reason why the contact portion 402b is bent as described above is that the mounting portion 403a-1 of the partial contact pin of the second contact array 103 is connected to the mounting portion 402a of the contact pin of the first contact array 102 ) To create a space that can be positioned in the same row.

As shown in FIG. 6 (b), the second contact array 103 includes two kinds of contact pins.

The first type of contact pins include a mounting portion 403a-1, a contact portion 403b, and a connection portion 402c. Some of the first-type contact pins have a shape in which the contact portion 403b is linear, and a portion has a curvature. The bent portion of the mounting portion 403a-1 and the contact portion 403b are not located on the same straight line, and the mounting portion 403-1a is parallel to the contact portion 403b, Respectively. In the present embodiment, it is bent twice at right angles. The number and angle of bending may vary depending on the embodiment, or may be oblique diagonal lines, but are not limited thereto. The reason why the contact portion 403b is bent in this way is that the mounting portion 403a-1 of the first type of contact pins forms the same row as the mounting portion 402a of the first contact array 102, And is located at the outermost portion of the array 102.

The second type of contact pins include a mounting portion 403a-2, a contact portion 403b, and a connection portion 403c. The contact portion 403b of the second kind of contact pins provides electrical contact with the contact array of the corresponding plug connector. And the corresponding contact portion 403b is coupled to the slot of the first insulator 100. [ The contact portion 403b of the second type of contact pins is in a linear shape and the mounting portion 403a-2 is substantially perpendicular to the contact portion 403b. The connection portion 403c is connected substantially vertically to the contact portion 403b and horizontally connected to the mounting portion 403a-2. The connection portion 403c of the second type of contact pins has a curvature in the outward direction or the inward direction as shown in Fig. 6 (b). The reason for this bending is to make the pitch of the mounting portions 403a-2 constant and long. If you do not lengthen the pitch, you do not need to bend. The mounting portion 403a-1 of the first type of contact pins is a portion that is surface-mounted on the printed circuit board, and is parallel to the printed circuit board. On the other hand, the mounting portion 403a-2 of the second kind of contact pins is inserted into the printed circuit board and soldered.

When the first and second contact arrays 102 and 103 are coupled to the first insulator 100 as shown in Fig. 6C, the mounting of the first type of contact pins of the second contact array 103 The portion 403a-1 is located in the same row in the pitch direction as the mounting portion 402a of the contact pins of the first contact array 102. [

7 is a bottom view of a receptacle connector including the contact array shown in Fig. 7, the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is intermittently positioned between the mounting portions 402a of the first contact array 102 And forms the same row as the mounting portion 402a of the first contact array 102. [ As shown in Fig. 7, since the mounting structure in which the contact pins of the one row DIP soldering type and the contact pins of the one row SMT type are combined can be implemented, the mounting area of the contact pins on the printed circuit board can be effectively reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. 6, the arrangement of the mounting portions 403a-1 of the first type of contact pins included in the second contact array 103 includes GND, VBUS, CC2, SBU2, VBUS, GND And the mounting portion 403a-2 of the second type of contact pins included in the second contact array 103 is composed of TX2 +, TX2-, D2 +, D2-, RX1-, and RX1 + from the left. Thus, the contact pins for the differential pair signal are positioned adjacent to each other.

(1.3) Contact  A third example of an array

8 is a view showing a contact array according to another embodiment of the present invention. Referring to FIG. 8, the first contact array 102 has the same structure as the first contact array 102 described with reference to FIG. On the other hand, the second contact array 103 shown in Fig. 8 is different from the second contact array 103 shown in Fig. Specifically, the contact pins on the outer side of the second contact array 103 of FIG. 6 are arranged such that the contact portions 403b are bent and the mounting portions 403a-1 are connected to the mounting portions (not shown) of the first contact array 102 402a. However, the contact pins on the outer side of the second contact array 103 of FIG. 8 are arranged such that the contact portions 403b are linear without bending and the mounting portions 403a-2 are mounted on the mounting portions of the first contact arrays 102 Are not located in the same column as the second row 402a. That is, a contact pin of the second kind.

9 is a bottom view of the receptacle connector including the contact array shown in Fig. 9, the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is intermittently positioned between the mounting portions 402a of the first contact array 102 And forms the same row as the mounting portion 402a of the first contact array 102. [ As shown in Fig. 9, since the mounting structure in which the one-row DIP soldering type contact pins and the one-row SMT type contact pins are combined can be implemented, the mounting area on the printed circuit board of the contact pins can be effectively reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. 8, the arrangement of the mounting portions 403a-1 of the first type of contact pins included in the second contact array 103 is composed of VBUS, CC2, SBU2 and VBUS from the left. The mounting portion 403a-2 of the second type of contact pins included in the second contact array 103 is composed of GND, TX2 +, TX2-, D2 +, D2-, RX1-, RX1 +, and GND from the left. As such, the contact pins (TX2 +, TX2-, D2 +, D2-, RX1-, RX1 +) for the differential pair signal are located adjacent to each other.

(1.4) Contact  Fourth example of array

10 is a view showing a contact array according to another embodiment of the present invention. Referring to FIG. 10, the first contact array 102 has the same structure as the first contact array 102 described with reference to FIG. On the other hand, the second contact array 103 shown in Fig. 10 is different from the second contact array 103 shown in Fig. More specifically, the contact pins on the outer side of the second contact array 103 of FIG. 3 are arranged such that the contact portions 103b are bent and the mounting portions 103a-1 are mounted on the mounting portions 102a. However, the contact pins on the outer side of the second contact array 103 of FIG. 10 are arranged such that the contact portions 103b are straight without any bending and the mounting portions 103a-2 are mounted on the mounting portions of the first contact arrays 102 102a. ≪ / RTI > That is, a contact pin of the second kind.

11 is a bottom view of the receptacle connector including the contact array shown in Fig. 11, the mounting portion 103a-1 of the first type of contact pin included in the second contact array 103 is intermittently positioned between the mounting portions 102b of the first contact array 102 And forms the same row as the mounting portion 102a of the first contact array 102. [ As shown in FIG. 11, since the mounting structure in which the contact pins of the one row DIP soldering type and the contact pins of the one row SMT type are combined can be implemented, the mounting area of the contact pins on the printed circuit board can be effectively reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. 10, in the arrangement of the mounting portions 103a-1 of the first type of contact pins included in the second contact array 103, TX2 + and TX2- on the left side, RX1- and RX1 + on the right side, And the contact pins for the differential pair signal are positioned adjacent to each other. The mounting portion 103a-2 of the second type of contact pins included in the second contact array 103 is composed of GND, VBUS, CC2, D2 +, D2-, SBU2, VBUS, and GND from the left. D2 + and D2- are also located adjacent to each other.

(1.5) Contact  Fifth example of arrays

12 is a view showing a contact array according to another embodiment of the present invention. The first contact array 102 of Fig. 12 is slightly different from the first contact array 102 of Fig. In the first contact array 102 of Fig. 6, the distance between the mounting portions 402a of the contact pins in which the contact portions 402b are straight and the contact pins in which the contact portions adjacent thereto are curved, And the two mounting portions 403a-1 of the two contact pins belonging to the second contact array 103 can enter. However, in FIG. 12, it is an interval in which one mounting portion 403a-1 can enter. On the other hand, the second contact array 103 shown in Fig. 12 is slightly different from the second contact array 103 shown in Fig. Specifically, a total of six contact pins of the first type of the second contact array 103 of FIG. 6 are provided, while a total of four contact pins of the first type of the second contact array 103 of FIG. 12 are provided. That is, the second contact array 103 of FIG. 12 has the second contact pins from the outer side of the first type of contact pins of the second contact array 103 of FIG. 6 and the second type of contact pins of the second contact array 103 of the second contact array 103 of the DIP soldering type Lt; / RTI > contact pin.

13 is a bottom view of the receptacle connector including the contact array shown in Fig. 13, the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is intermittently positioned in the first contact array 102 and is connected to the first contact array 102, And the mounting portion 402a of the mounting portion 402a. As shown in FIG. 13, since the mounting structure in which the contact pins of the one-row DIP soldering type and the contact pins of the one-row SMT type are combined can be implemented, the mounting area of the contact pins on the printed circuit board can be effectively reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. 12, the arrangement of the mounting portions 403a-1 of the first type of contact pins included in the second contact array 103 is composed of GND, CC2, SBU2, and GND from the left. The mounting portion 403a-2 of the second type of contact pins included in the second contact array 103 is composed of TX2 +, TX2-, VBUS, D2 +, D2-, VBUS, RX1- and RX1 + from the left. As such, the contact pins (TX2 +, TX2-, D2 +, D2-, RX1-, RX1 +) for the differential pair signal are located adjacent to each other.

(1.6) Contact  Sixth example of arrays

14 is a view showing a contact array according to another embodiment of the present invention. The first contact array 102 of Fig. 14 is slightly different from the first contact array 102 of Fig. In the first contact array 102 shown in Fig. 6, there are two contact pins positioned at the center and having a linear shape of the contact portion 402b, whereas the number of the first contact arrays 120 shown in Fig. 14 is four. In the first contact array 102 shown in Fig. 6, the distance between the contact pins having the straight line-shaped contact portions 402b and the contact pins having the bent contact portions 402b adjacent thereto, Is an interval at which the two mounting portions 403a-1 of the contact pins belonging to the second contact array 103 can enter. On the other hand, the first contact array 102 of FIG. 14 is an interval in which one mounting portion 403a-1 can enter.

The second contact array 103 shown in Fig. 14 is slightly different from the second contact array 103 of Fig. Specifically, a total of six contact pins of the first type of the second contact array 103 of FIG. 6 are provided, while a total of four contact pins of the first type of the second contact array 103 of FIG. 14 are provided. That is, the second contact array 103 of FIG. 14 has the third contact pins from the outer side of the first type of contact pins of the second contact array 103 of FIG. 6 to the second type, that is, the DIP soldering pin It is time.

15 is a bottom view of the receptacle connector including the contact array shown in Fig. 15, the mounting portion 403a-1 of the first type of contact pin included in the second contact array 103 is intermittently positioned between the mounting portions 402a of the first contact array 102 And forms the same row as the mounting portion 402a of the first contact array 102. [ As shown in Fig. 15, since the mounting structure in which the contact pins of the one row DIP soldering type and the contact pins of the one row SMT type are combined can be implemented, the mounting area of the contact pins on the printed circuit board can be effectively reduced.

As described above, it should be noted that the arrangement of the contact pins (for example, TX2 +, TX2-, D2 +, D2-, RX1 +, RX1-) for the differential pair signal Should be placed adjacent to each other. The contact pins for the differential pair signal offset the noise due to the electromagnetic field acting in opposite directions to prevent noise from being transmitted to the other contact pins. Specifically, referring to Fig. 14, the arrangement of the mounting portions 403a-1 of the first type of contact pins included in the second contact array 103 is composed of GND, VBUS, VBUS, and GND from the left. The mounting portion 403a-2 of the second type of contact pins included in the second contact array 103 is composed of TX2 +, TX2-, CC2, D2 +, D2-, SBU2, RX1-, and RX1 + from the left. As such, the contact pins (TX2 +, TX2-, D2 +, D2-, RX1-, RX1 +) for the differential pair signal are located adjacent to each other.

2. Board cut- off ( Board cut - off ) Type Receptacle  connector

16 is an exploded perspective view of a receptacle connector according to another embodiment of the present invention. The type of the components of the receptacle connector shown in Fig. 16 is one example, and it is apparent to those skilled in the art that some of the components shown in Fig. 16 may be omitted or changed to other components, May be added. In Fig. 16, the components with the same reference numbers as those in Fig. 2 perform the functions and operations described with reference to Fig. However, the receptacle connector shown in Fig. 16 is a board cut-off type, and some parts shown in Fig. 16 are different in shape and structure from the parts shown in Fig. The printed circuit board is partially cut corresponding to the shape of the receptacle connector of Fig. 16, and the receptacle connector of Fig. 16 is inserted into the cutting portion of the printed circuit board. On the other hand, the receptacle connector shown in Fig. 2 is placed on the surface of the printed circuit board. Thus, the solder portion 106a of the receptacle connector of FIG. 2 is located at the lower end portion of the shell 106, but the solder portion 106a of the receptacle connector of FIG. 16 is located at the upper end portion of the shell 106. The mid plate 104 of Fig. 2 has a planar shape, but the mid plate 104 of Fig. 16 has a layered shape. The second insulator 101 shown in Fig. 2 has a shape in which the contact arrays 102 and 103 are drawn out from the lower end while the second insulator 101 shown in Fig. 16 has a shape in which the contact arrays 102 and 103 are drawn out from the upper end to be. The first contact array 102 is assembled in a row on the upper surface of the first insulator 100 and the second contact array 103 is arranged on the lower surface of the first insulator 100 so as to be spaced apart from the first contact array 102. [ As shown in Fig. The contact arrays 102 and 103 will be described in detail below with reference to the drawings.

17A is a first contact array 102, FIG. 17B is a second contact array 103, and FIG. 17B is a cross-sectional view of the contact array of the receptacle connector shown in FIG. FIG. 17C is a plan view of the first contact array 102 and the second contact array 103, and is viewed from above.

As shown in Fig. 17A, the contact pins of the first contact array 102 include a mounting portion 1702a, a contact portion 1702b, and a connection portion 1702c. The mounting portion 1702a is a portion that is surface mounted on the printed circuit board and is parallel to the printed circuit board and is drawn out through the second insulator 101. [ The contact portion 1702b provides an electrical contact with the contact array of the corresponding plug connector. The contact portion 1702b is coupled to the slot of the first insulator 100. [ The contact portions 1702b all have a straight line shape. The connection portion 1702c connects the mounting portion 1702a and the contact portion 1702b. 17 (a), the mounting portion 1702a and the contact portion 1702b are substantially parallel, and the connecting portion 1702c is vertically and horizontally arranged to raise the height of the mounting portion 1702a with respect to the contact portion 1702b, Is a shape of '┏ ┓' with a curvature. The connection portion 1702c is connected to the mounting portion 1702a and the contact portion 1702b substantially vertically. Also, the connection portion 1702c has a narrower width from the contact portion 1702b toward the mounting portion 1702a. The reason why the width is narrowed in this manner is that when the mounting portion 1702a of the first contact array 102 and the partial mounting portion 1703a-1 of the second contact array 103 are located in the same row in the pitch direction, So that the width of the receptacle connector can be prevented from increasing. However, if the width of the receptacle connector does not matter, the width of the connection portion 1702c may not be narrowed.

As shown in FIG. 17 (b), the second contact array 103 includes two kinds of contact pins.

The first type of contact pins include a mounting portion 1703a-1, a contact portion 1703b, and a connection portion 1703c. The contact pins 1703b of the first type are not linear but curved. The bent portion of the mounting portion 1703a-1 and the contact portion 1703b are not located on the same straight line when viewed from above, and the mounting portion 1703-1a is parallel to the contact portion 1703b, Respectively. In the present embodiment, the curvature is a slant shape inclined obliquely toward the outside, but may be a rectangular shape or the like. The reason why the contact portion 1703b is bent as described above is that the mounting portion 1703a-1 of the first type of contact pins forms the same row as the mounting portion 1702a of the first contact array 102, And is located at the outermost portion of the array 102. The connection portion 1702c of the first type of contact pins has a shape of '┏ ┓' having a vertical bend to increase the height of the mounting portion 1703a-1 with respect to the contact portion 1703b.

The contact pins of the second type of the second contact array 103 also include a mounting portion 1703a-2, a contact portion 1703b, and a connection portion 1702c. The contact portion 1703b of the second kind of contact pins provides electrical contact with the contact array of the corresponding plug connector. The contact portion 1703b is engaged with the slot of the first insulator 100. [ The contact portion 1703b of the second type of contact pins is in a linear shape and the mounting portion 1703a-2 is substantially perpendicular to the contact portion 1703b. The connection portion 1702c of the second type of contact pins is in the shape of "┓" in order to increase the height of the mounting portion 1703a-2 with respect to the contact portion 1703b. The connecting portion 1702c of the second kind of contact pins is obliquely inclined obliquely toward the outside in this embodiment in order to increase the distance between the mounting portions 1703a-2. The mounting portion 1703a-1 of the first type of contact pins is a portion that is surface mounted on the printed circuit board and is parallel to the printed circuit board. On the other hand, the mounting portion 1703a-2 of the second kind of contact pins is inserted into the printed circuit board and soldered.

As shown in Fig. 17C, when the first and second contact arrays 102 and 103 are coupled to the first insulator 100, the mounting of the first type of contact pins of the second contact array 103 The portion 1703a-1 is located in the same row in the pitch direction as the mounting portion 1702a of the contact pins of the first contact array 102. [

FIG. 18 is an assembled perspective view of the receptacle connector including the contact array shown in FIG. 17, and FIG. 19 is a bottom view of FIG.

18 and 19, a mounting portion 1702a of the first contact array 102 and a mounting portion 1702a of the first kind of contact pins of the second contact array 103 are connected through the second insulator 101 of the receptacle connector, The portion 1703a-1 is drawn outward. At this time, the mounting portion 1703a-1 of the first type of contact pins of the second contact array 103 drawn out through the second insulator 101 is mounted on the mounting portion (not shown) of the contact pins belonging to the first contact array 102 1702a in the pitch direction. 19, the mounting portion 1703a-2 of the second type of contact pins included in the second contact array 103 is drawn out in the DIP soldering type, and the mounting portion 1703a-2 of the second contact array 103 The mounting portion 1703a-1 of one kind of contact pins and the mounting portion 1702a of the contact pins belonging to the first contact array 102 are drawn out in the SMT type. When the mounting portions 1703a-1 of the plurality of contact pins belonging to the second contact array 103 are positioned in the same column as the mounting portion 1702a of the first contact array 102, And the mounting portions 1703a-2 of the remaining contact pins can be constituted by one row. Unlike the mounting structure in which the conventional two-row DIP soldering-type contact pins and the one-row SMT-type contact pins are combined, the arrangement structure of the contact pins is different from that of the conventional structure in which the contact pins of one row DIP soldering type and the contact pins of the one row SMT type The combined mounting structure can be implemented, which is advantageous in that the mounting area of the contact pins on the printed circuit board can be effectively reduced.

The board cut-off type receptacle connector may have the contact pin arrangement structure of the contact arrays 102, 103 described with reference to Fig. 17, but also the on-board type receptacle connector of Figs. 6 to 15 May have an arrangement combination of the contact pins described with reference to FIG. Since the arrangement of the contact pins is fully described with reference to Figs. 6 to 15, the description thereof is omitted here.

FIG. 20 is a diagram comparing a printed circuit board mounting pattern of a conventional contact array with a contact array according to an embodiment of the present invention. 20A is a side view of a conventional on-board type contact array 12 and 13 of a receptacle connector mounted on a printed circuit board 2010. Fig. 20B is a side view of the contact arrays 102 and 103 of the receptacle connector of the on-board type according to the embodiment of the present invention when mounted on the printed circuit board 2010. Fig. Fig. 20C is a side view of the contact array 102, 103 of the board-cut receptacle connector according to the embodiment of the present invention when mounted on the printed circuit board 2010. Fig.

Referring to FIG. 20, a conventional receptacle connector is composed of one row of SMT-type contact pins and two rows of DIP-type contact pins. However, the receptacle connector according to the embodiment of the present invention is composed of one row of SMT-type contact pins and one row of DIP-type contact pins. Particularly, the receptacle connector according to the embodiment of the present invention reduces the number of DIP type contact pins which occupy a large mounting area by replacing a part of the DIP type contact pins with the SMT type and mounting them in the same row as the SMT type contact pins . Therefore, the overall mounting area of the receptacle connector can be reduced. In addition, by reducing the structure of the contact pins from three rows to two columns, the overall length of the receptacle connector can be greatly reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not to be limited to the details thereof and that various changes and modifications will be apparent to those skilled in the art. And various modifications and variations are possible within the scope of the appended claims.

100: first insulator 101: second insulator
102: first contact array 102a:
103: second contact array 103a:
104: mid plate 106: shell

Claims (22)

  1. Insulator;
    A first contact array including a plurality of contact pins arranged in a row in the insulator;
    A second contact array including a plurality of contact pins arranged in a row in the insulator so as to be spaced apart from the first contact array; And
    And a shell surrounding the insulator and the assembly of the first contact array and the second contact array,
    Wherein the mounting portion of the plurality of contact pins included in the second contact array is located in the same column as the mounting portion of the contact pins included in the first contact array.
  2. The method according to claim 1,
    Wherein a plurality of contact pins included in the first contact array
    A contact portion for providing an electrical contact with the plug connector;
    A mounting portion that is surface mounted on a printed circuit board; And
    And a connection portion connecting the contact portion and the mounting portion.
  3. 3. The method of claim 2,
    The contact portions of some contact pins of the plurality of contact pins included in the first contact array include outwardly curved portions,
    And the contact portions of the remaining contact pins have a straight shape.
  4. The method of claim 3,
    Wherein the bent is an oblique line toward the outside.
  5. The method of claim 3,
    Wherein a mounting portion of the contact pin included in the second contact array is located between a mounting portion of the contact pin including a bend in the contact portion and a mounting portion of the contact pin having the linear contact portion, .
  6. 3. The method of claim 2,
    The contact portion and the mounting portion are parallel
    And the connecting portion is perpendicular to the contact portion and the mounting portion.
  7. 3. The method of claim 2,
    Wherein the mounting portion of the plurality of contact pins included in the first contact array includes:
    The receptacle connector being located higher than the contact portion with respect to the bottom surface of the receptacle connector.
  8. 8. The method of claim 7,
    Wherein the contact portion and the mounting portion are parallel,
    Wherein the connecting portion has a shape of a prism.
  9. The method according to claim 1,
    And a plurality of contact pins included in the second contact array,
    A contact portion for providing an electrical contact with the plug connector;
    A mounting portion mounted on the printed circuit board; And
    And a connecting portion connecting the contact portion and the mounting portion,
    Wherein the mounting portions of the plurality of contact pins among the plurality of contact pins included in the second contact array are surface mounted on the printed circuit board and the mounting portions of the remaining contact pins are inserted and mounted on the printed circuit board.
  10. 10. The method of claim 9,
    The contact portion of the partial contact pin included in the second contact array,
    Including an outwardly directed bend,
    And the contact portions of the remaining contact pins are linear.
  11. 10. The method of claim 9,
    Wherein the contact portions of some contact pins of the one or more contact pins included in the second contact array include an outwardly directed bend,
    And the contact portions of the remaining contact pins of the partial contact pins included in the second contact array are linear.
  12. The method according to claim 10 or 11,
    The bend is a right angle.
  13. The method according to claim 10 or 11,
    Wherein the bent is an oblique line toward the outside.
  14. 10. The method of claim 9,
    The contact portion of the partial contact pin included in the second contact array,
    Wherein the receptacle connector is straight-shaped.
  15. 10. The method of claim 9,
    The connecting portion of the remaining contact pins included in the second contact array,
    Wherein the receptacle connector is connected perpendicularly to the contact portion and horizontally connected to the mounting portion.
  16. 10. The method of claim 9,
    The connecting portion of the remaining contact pins included in the second contact array,
    And wherein the receptacle connector is connected perpendicularly to the contact portion and the mounting portion, and includes a bend.
  17. 17. The method of claim 16,
    And one end of the contact portion connected to the connection portion of the remaining contact pin included in the second contact array,
    And is lower than one end of the mounting portion connected to the connecting portion of the remaining contact pin with respect to the bottom surface of the receptacle connector.
  18. 18. The method of claim 17,
    The connecting portion of the remaining contact pins included in the second contact array,
    Shaped receptacle connector.
  19. 10. The method of claim 9,
    The mounting portion of the part of the contact pins included in the second contact array,
    The receptacle connector being located higher than the contact portion with respect to the bottom surface of the receptacle connector.
  20. 20. The method of claim 19,
    The connection portion of the partial contact pin included in the second contact array,
    Receptacle connector, in the form of ┏..
  21. The method according to claim 1,
    Wherein the mounting portion of the plurality of contact pins included in the first contact array and the mounting portion of the partial contact pin included in the second contact array are surface mounted on the printed circuit board,
    And the mounting portions of the remaining contact pins included in the second contact array are inserted and mounted on the printed circuit board.
  22. The method according to claim 1,
    Wherein the interface arrangement of the plurality of contact pins included in the first contact array includes:
    Wherein the second contact array is opposite the interface arrangement of the plurality of contact pins included in the second contact array.
KR1020150100867A 2014-09-25 2015-07-16 Receptacle connector inculuding the improved contact array structure KR20160036474A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
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PCT/KR2015/007536 WO2016047911A1 (en) 2014-09-25 2015-07-21 Receptacle connector having improved structure for contact array
CN201580051876.1A CN106716740B (en) 2014-09-25 2015-07-21 Socket connector including improved crosspoint array structure

Publications (1)

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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4260791B2 (en) * 2005-11-07 2009-04-30 日本航空電子工業株式会社 connector
KR20090056918A (en) * 2007-11-30 2009-06-03 이문기 A type symmetric usb receptacle
WO2009069969A2 (en) * 2007-11-30 2009-06-04 Moon Key Lee A type symmetric usb receptacle
TWI420749B (en) * 2008-12-19 2013-12-21 Chant Sincere Co Ltd Usb connector and contact array thereof
CN201378641Y (en) * 2009-03-06 2010-01-06 北京华旗资讯数码科技有限公司 USB interface socket with double plug-in surfaces
CN101867100A (en) * 2009-04-15 2010-10-20 诠欣股份有限公司 USB connector and contact point array thereof
US8951050B2 (en) * 2011-02-23 2015-02-10 Japan Aviation Electronics Industry, Limited Differential signal connector capable of reducing skew between a differential signal pair
KR101338249B1 (en) * 2012-02-24 2013-12-09 엘에스엠트론 주식회사 Improved receptacle connector for contact array structure

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CN106716740B (en) 2019-05-28

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