CN106712518B - 变换器模块、变压器模块及其电路 - Google Patents

变换器模块、变压器模块及其电路 Download PDF

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CN106712518B
CN106712518B CN201510780735.5A CN201510780735A CN106712518B CN 106712518 B CN106712518 B CN 106712518B CN 201510780735 A CN201510780735 A CN 201510780735A CN 106712518 B CN106712518 B CN 106712518B
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CN106712518A (zh
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曾剑鸿
辛晓妮
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Delta Electronics Shanghai Co Ltd
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Abstract

本发明提供了变换器模块、变压器模块及其电路，其中，变换器模块包括：系统板；隔离整流单元，通过至少一引脚连接于系统板，其中隔离整流单元包括：一磁芯，磁芯包含平行于系统板的至少一芯柱和设置于芯柱两端的两盖板；以及多个载板单元，设置于两盖板之间，且均垂直于系统板，载板单元具有至少一过孔，每个载板单元包含至少一初级绕线组和至少一次级绕线组，至少一芯柱穿过载板单元的过孔，引脚形成于至少一载板单元临近于系统板的一边侧，用以连接载板单元和系统板。本发明的变换器模块、变压器模块及其电路省去了多个磁芯盖板，磁芯总体积可明显减小，提升了模块功率密度，并且减小了磁芯损耗，提高了系统效率。

Description

变换器模块、变压器模块及其电路
技术领域
本发明涉及电路领域，尤其涉及一种变换器模块、变压器模块及其电路。
背景技术
随着人类对智能生活要求的提升，社会对数据处理的需求日益旺盛。全球在数据处理上的能耗，平均每年达到数千亿甚至数万亿度；而一个大型数据中心的占地面积可以达到数万平方米。因此，高效率和高功率密度，是这一产业健康发展的关键指标。
目前，数据中心的关键单元是服务器，其主板通常由中央处理器(CPU)、芯片组(Chipsets)、内存等等数据处理芯片和它们的供电电源及必要外围组件组成。随着单位体积服务器处理能力的提升，意味着这些处理芯片的数量、集成度也在提升，导致空间占用和功耗的提升。因此，为这些芯片供电的电源(因为与数据处理芯片同在一块主板上，又称主板电源)，就被期望有更高的效率，更高的功率密度和更小的体积，来支持整个服务器乃至整个数据中心的节能和占地面积缩小。为了满足高功率密度的需求，电源的开关频率也越来越高。
数据中心的发展，将使得POL(负载点)电源的输入有可能从12V转换为48V甚至是400V，而POL的输出电压往往比较低，因此，需要能够实现高输入输出电压比的高频变换电路。这样的电路往往含一个变压器。而要在输出侧实现高频大电流下的高效率，并不容易。现有技术，比如LLC(谐振变换器)拓扑由于开关损耗小，效率高，输出功率容易扩充等优势被广泛使用。
对于低压大电流输出的应用，通常采用多个变压器通过高压侧串联，低压侧并联的方式连接实现，如图1所示。将图1中虚线框61’和62’内的电路分别定义为一个电路单元，虚线框63’内的电路定义为高压侧功率器件。如图2所示，其中每个电路单元包含高压侧绕线组231’，低压侧绕线组232’，低压侧绕线组232’连接两个开关器件233’。
图3(a)至3(d)给出了目前业界常用的低压大电流的电源模块7’的结构。图3(a)是模块的俯视图，如图3(a)所示，模块包含一个多层印刷电路板(PCB，Printed CircuitBoard)载体71’；多个高压侧器件，比如三个变压器72’；及模块的PIN引脚73’。其中每个变压器72’的磁芯都为一个U型磁芯含多个磁柱74’(例如：两个磁柱)，每个磁柱74’都耦合一个电路单元，即此模块电源由六个电路单元通过平面分布式结构实现。但又由于，模块采用了多个单独的变压器72’，生产过程中需要分别控制气隙，一致性比较差，而且生产效率低。
图3(b)为图3(a)中虚线部分的剖面图，如图3(b)所示，每个电路单元中开关器件76’都放置在印刷电路板载体75’的上下两个表面，变压器72’的绕线组是通过多层印刷电路板实现的。
图3(c)为此结构的侧视图，如图3(c)所示，模块的PIN引脚73’，以及电源模块7’和系统板1’之间的连接关系。电源模块7’和系统板1’之间是通过转接PIN引脚73’连接的。
图3(d)为此结构中的磁柱与系统板的位置关系示意图，如图3(d)所示，磁柱74’是分段的且均垂直于系统板1’的，并且每根磁柱74’的两端均设有盖板77’，这种分段式的磁柱74’造成了电源模块7’的整体体积较大。
图3(a)至3(d)中的电源模块7’是一种平面分布式结构，占系统板1’的面积比较大，也不利于系统功率密度的提高。电源模块7’和系统板1’之间通过转接PIN引脚73’进行电气连接，由于PIN引脚73’具有一定的阻抗，在大电流输出场合，会引起额外的损耗。而且模块是通过PIN引脚73’传到系统板进行散热的，同样因为PIN引脚73’的热阻，模块到系统板之间的热阻增大，模块散热变差。
有鉴于此，如何发展一种变换器，以改善前述传统技术的缺陷，实为目前迫切需要解决的问题。
发明内容
针对现有技术中的缺陷，本发明的目的在于提供一种变换器模块、变压器模块及其电路，克服现有技术的困难，省去了多个磁芯盖板，磁芯总体积可明显减小，提升了模块功率密度，并且减小了磁芯损耗，提高了系统效率；低压侧大电流接口可以直接连接到系统版，较少系统的总体损耗。
根据本发明的一个方面，提供一种变换器模块，包括：
系统板；
隔离整流单元，通过至少一引脚连接于所述系统板，其中所述隔离整流单元包括：
一磁芯，所述磁芯包含平行于所述系统板的至少一芯柱和设置于所述芯柱两端的两盖板；以及
多个载板单元，设置于所述两盖板之间，且均垂直于所述系统板，所述载板单元具有至少一过孔，每个所述载板单元包含至少一初级绕线组和至少一次级绕线组，所述至少一芯柱穿过所述载板单元的过孔，所述引脚形成于至少一所述载板单元临近于所述系统板的一边侧，用以连接所述载板单元和所述系统板。
优选地，所述初级绕线组包含至少一具有环绕所述芯柱的引线图案的印刷电路板走线线圈，或是包含缠绕所述芯柱而成的导线线饼；以及
所述次级绕线组包含具有环绕所述芯柱的引线图案的印刷电路板走线线圈。
优选地，每个所述载板单元还包含至少一开关器件，所述开关器件连接于该载板单元的所述次级绕线组。
优选地，至少一所述开关器件位于至少一所述载板单元的表面或内嵌于所述载板单元。
优选地，所述开关器件是MOSFET管或者二极管。
优选地，所述载板单元的引脚是T型引脚。
优选地，至少两个所述载板单元的输出电压相同且输出并联。
优选地，至少两个所述载板单元的所述引脚共同形成一导电体，所述导电体接触并耦接所述系统板。
优选地，所述导电体是一导电条或是由多个T型引脚相互焊接形成的插脚焊盘。
优选地，所述变换器模块还包含至少一第一电路模块，所述第一电路模块位于所述盖板与所述系统板之间且临近所述系统板，所述第一电路模块耦接所述系统板，且所述第一电路模块包括高压侧功率器件模块、控制模块中的至少一种。
优选地，所述变换器模块还包含至少一第二电路模块，所述第二电路模块位于所述载板单元的上边侧，所述电路模块包括谐振电感模块、激磁电感模块、高压侧功率器件模块中的至少一种。
优选地，所述磁芯与载板单元通过封装胶灌封在一起。
优选地，包括至少一载板，所述载板上设有多个载板单元。
根据本发明的另一个方面，还提供一种变压器模块，包括：
一磁芯，所述磁芯具有平行于所述系统板的至少一芯柱和设置于所述芯柱两端的两盖板；
多个载板单元，设置于所述两盖板之间，至少部分所述多个载板单元相互平行，所述载板单元具有至少一过孔，每个所述载板单元上设置至少一初级绕线组和至少一次级绕线组，所述至少一芯柱穿过所述载板单元的过孔，且每个所述载板单元还包含至少一开关器件，所述开关器件连接于该载板单元的所述次级绕线组。
优选地，所述变压器模块还包含：至少一引脚形成于至少一所述载板单元的一边侧。
根据本发明的另一个方面，还提供一种电路，包括如上述的变压器模块。
优选地，所述电路是谐振电路或者反激电路。
有鉴于此，本发明的变换器模块、变压器模块及其电路省去了多个磁芯盖板，磁芯总体积可明显减小，提升了模块功率密度，并且减小了磁芯损耗，提高了系统效率。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显：
图1为现有技术的一个电路图；
图2为图1中变压器单元的电路图；
图3(a)为现有技术的一种电源模块的俯视剖面图；
图3(b)为图3(a)中A-A方向的剖面图；
图3(c)为图3(a)的侧视图；
图3(d)为图3(c)中的磁柱与系统板的位置关系示意图；
图4为本发明一实施例中的第一种变换器模块的剖面图；
图5为本发明一实施例中的变换器模块中磁柱的示意图；
图6为本发明一实施例中的第二种变换器模块的剖面图；
图7为本发明一实施例中的第三种变换器模块的剖面图；
图8为本发明一实施例中的第四种变换器模块的剖面图；
图9为本发明一实施例中的第五种变换器模块的剖面图；
图10为本发明一实施例中的第六种变换器模块的剖面图；
图11为本发明一实施例中的第七种变换器模块的剖面图；
图12为本发明一实施例中的第八种变换器模块的俯视剖面图；
图13为本发明一实施例中的第八种变换器模块的正视剖面图；
图14为图13的侧视图；
图15为本发明一实施例中的第八种变换器模块中第一种载板单元的示意图；
图16为本发明一实施例中的第八种变换器模块中第二种载板单元的示意图；
图17为本发明一实施例中反激变换器单元的电路图；
图18为本发明一实施例中全桥变换器单元的电路图；以及
图19为本发明一实施例中全桥整流模块单元的电路图。
附图标记
1’ 系统板 1 系统板
231’ 高压侧绕线组 2 隔离整流单元
232’ 低压侧绕线组 21 引脚
233’ 开关器件 22 磁芯
61’ 电路单元 221 芯柱
62’ 电路单元 222 盖板
63’ 高压侧功率器件 23 载板单元
7’ 电源模块 231 初级绕线组
71’ 高压侧器件 232 次级绕线组
72’ 变压器 233 开关器件
73’ PIN引脚 234 全桥整流电路
74’ 磁柱 24 导电体
75’ 印刷电路板载体 25 T型引脚
76’ 开关器件 26 插脚焊盘
77’ 盖板 3 第一电路模块
4 第二电路模块
5 封装胶
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本发明将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。
所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施方式中。在下面的描述中，提供许多具体细节从而给出对本发明的实施方式的充分理解。然而，本领域技术人员应意识到，没有特定细节中的一个或更多，或者采用其它的方法、组元、材料等，也可以实践本发明的技术方案。在某些情况下，不详细示出或描述公知结构、材料或者操作以避免模糊本发明。
如图4所示，本发明一实施例提供了一种变换器模块，包括系统板1和隔离整流单元2，隔离整流单元2的引脚可以直接通过表面贴装技术(SMT，Surface Mount Technology)焊接到系统板1，但本发明并不以此为限。其中，隔离整流单元2包括：一磁芯22和多个载板单元23，多个载板单元23可以分别位于多个载板上。磁芯22包含平行于系统板1的至少一芯柱221和设置于芯柱221两端的两盖板222。多个载板单元23设置于两盖板222之间，且均垂直于系统板1，载板单元23具有至少一过孔，每个载板单元23上设置至少一初级绕线组(图中未示出)和至少一次级绕线组(图中未示出)，至少一芯柱221穿过载板单元23的过孔，引脚(PIN，图中未示出)形成于至少一载板单元23临近于系统板1的一边侧，用以连接载板单元23和系统板1。引脚可以包含信号引脚和功率引脚，用以传输信号和/或功率；多个载板单元的多个引脚可以形成于临近于系统板1的同一侧，直接和系统板1接触并连接；但本发明并不以此为限。本实施例中的各个载板单元23是层叠方式放置，通过一个或多个芯柱221耦合在一起，即多个载板单元23共享芯柱221，形成一个变压器模块，但本发明并不以此为限。在其他变化例中，多个载板单元23也可以集成在一个载板上，本发明并不以此为限。
如图4和图5所示，本发明一实施例中的芯柱221是平行于系统板1的，可以通过芯柱221将多个载板单元23集成为一个变压器模块，以实现类似前案多个变压器模块的功能，但本发明并不以此为限。载板单元23可以邻接到系统板，减少了输出转接Pin所带来的额外损耗，尤其在低压大电流的应用中可以提高系统效率；并且，由于隔离整流单元2可以邻接到系统板，载板单元23到系统板1的热阻也明显减小，载板单元23的散热条件更好；同时，由于省去了多个磁芯盖板，磁芯总体积可明显减小，模块功率密度得到提升，并且减小磁芯损耗，提高了系统效率，但本发明并不以此为限。
如图6至9所示，本发明一实施例中的隔离整流单元2与系统板1中间可以有多种不同的连接方式，但不以此为限。
参见图6，先将本发明一实施例中整个隔离整流单元2装好后通过封装胶5进行封装，然后将封装好的模块打磨露出引脚，由引脚直接连接到系统板1。
参见图7，载板单元23的输出电压相同且输出并联时，根据本发明一实施例，变换器模块中隔离整流单元2的每个载板单元23的引脚(图中未示出)可以先与导电条24通过焊料焊接实现电连接，然后再由导电条24作为引脚与系统板1进行连接，从而扩大连接面积。其中，载板单元23的引脚可以是T型引脚，但本发明并不以此为限。
参见图8(为了清楚看清T型引脚25的结构，本图中省略了系统板1)，本发明一实施例的变换器模块中隔离整流单元2的每个载板单元23的引脚(图中未示出)可以先与T型引脚25通过焊料焊接，再与系统板(图中未示出)进行连接。
参见图9(为了清楚看清插脚焊盘26的结构，本图中省略了系统板1)，载板单元23的输出电压相同且输出并联时，根据本发明一实施例，变换器模块中隔离整流单元2的每个载板单元23的引脚(图中未示出)可以先与具有多个T型引脚相互焊接形成的插脚焊盘26通过焊料焊接，再与系统板(图中未示出)进行连接。
并且，可以通过在制成过程加胶水的方式固定载板单元23和T型引脚或导电条之间的连接可靠性。例如，在变压器组装完成后，可以在印刷电路板与印刷电路板之间的缝隙中先加入胶水，将导电条和印刷电路板固定之后，再进行焊接，但本发明并不以此为限。
如图10至11所示，本发明一实施例中的隔离整流单元2与系统板1还可以增设其他功能模块以实现不同的电路目的，但本发明并不以此为限。
参见图10，本发明一实施例中的变换器模块还包含一第一电路模块3。第一电路模块3可以位于盖板222与系统板1之间且临近系统板1，第一电路模块3耦接系统板1，且第一电路模块3可以包括智能功率模块(IPM模块)、高压侧功率器件模块、控制模块中的至少一种，也可以全部包含，但本发明并不以此为限。
参见图11，本发明一实施例中的变换器模块还包含一第二电路模块4。第二电路模块4位于载板单元23的上边侧，载板单元23可以通过导电条24连接第二电路模块4，但本发明并不以此为限，也可以直接连接或通过其它方式连接。第二电路模块4可以包括谐振电感模块、激磁电感、高压侧功率器件模块中的至少一种，但本发明并不以此为限。激磁电感也可以通过调整变换器模块中磁芯的气隙集成到变换器模块中。
本发明一实施例中的变换器模块也可以同时具有上述第一电路模块3和第二电路模块4，此处不再赘述。
如图12至14所示，本发明一实施例中的变换器模块中的磁芯22可以包含平行于系统板1的两芯柱221和设置于芯柱221两端的两盖板222。载板单元23具有至少一过孔，每根芯柱221穿过载板单元23的过孔。载板单元23可以垂直于系统板1，但本发明并不以此为限。每个载板单元23上可以设置若干初级绕线组231、若干次级绕线组232以及若干开关器件233。初级绕线组231可以包含缠绕芯柱221的导线线饼，但本发明并不以此为限。在其他变化例中，初级绕线组231和次级绕线组232也可以是包含具有环绕芯柱221的引线图案的印刷电路板走线线圈。开关器件233连接于该载板单元23的次级绕线组232。开关器件233可以位于载板单元23的表面或内嵌于载板单元23。开关器件233可以是MOSFET管或者二极管，但本发明不以此为限。初级绕线组231或次级绕线组232的绕组排布可以采用P-S-P或S-P-S或P-S-S-P或S-P-P-S的结构(其中，P表示初级绕线组231，S表示次级绕线组232)，但本发明不以此为限。
图15和16中，均以初级绕线组231和带抽头的次级绕线组232(绕组采用的是P-S-S-P结构，P表示初级绕线组231，S表示次级绕线组232，但不以此为限)以及两个开关器件233为例，来介绍载板单元23的两种主要结构，但本发明并不以此为限。
如图15所示，载板单元23上的次级绕线组232均通过印刷电路板上的走线线圈形成，走线线圈可以具有环绕芯柱221的引线图案，形成于多层印刷线路板(PCB)上，但本发明并不以此为限。初级绕线组231包含缠绕芯柱221而成的导线线饼，可以分别对称设置在多层印刷线路板远离系统板1的上部两侧，但本发明不以此为限。两个开关器件233可以分别对称设置在多层印刷线路板接近系统板1的下部两侧，但本发明不以此为限，两个开关器件233可以分别设置在不同层的不同位置。
如图16所示，载板单元23整体可以为一个多层印刷线路板(PCB)。次级绕线组232可以是具有环绕芯柱221的引线图案的印刷电路板走线线圈。初级绕线组231分别设置在次级绕线组232两侧，也可以是具有环绕芯柱221的引线图案的印刷电路板走线线圈。开关器件233可以内嵌于印刷电路板内，但本发明不以此为限。
多个载板单元23的设置方法可以是把多个如图16所示的多层印刷线路板集成为一个总的印刷线路板，此时，总的印刷线路板可以包含更多分层，互相平行的多个载板单元23之间可以不具有间隙，但本发明并不以此为限。
本发明一实施例还提供一种变压器模块，该变压器模块可以被安装于系统板1，包括：一磁芯22和多个载板单元23。其中，磁芯22具有平行于系统板1的至少一芯柱221和设置于芯柱221两端的两盖板222。多个载板单元23设置于两盖板222之间，至少部分多个载板单元23相互平行，载板单元23具有至少一过孔，每个载板单元23上设置至少一初级绕线组231和至少一次级绕线组232，至少一芯柱221穿过载板单元23的过孔，且每个载板单元23还包含至少一开关器件233，开关器件233连接于该载板单元23的次级绕线组232。至少一引脚21形成于至少一载板单元23的一边侧。相关技术内容同上，此处不再赘述。
本发明一实施例还提供一种电路，包括上述变压器模块。电路可以是谐振电路或者反激电路。相关技术内容同上，此处不再赘述。本发明一实施例中，载板单元23所包含的电路单元不但可以是带中心抽头的变压器单元(参见图2)，也可以是图17中反激变换器的电路单元，即次级侧绕组232中可以只包含一个开关器件233，但本发明不以此为限。
如图18所示，载板单元23可以作为全桥变换器的变压器单元，次级侧绕组232中包含4个独立的开关器件233，但本发明不以此为限。
如图19所示，也可以将4个开关器件233通过封装工艺集成为一个全桥整流模块234，或者通过硅片级的集成工艺，将4个开关集做到一个硅片中，形成一个全桥整流IC(集成电路)，但本发明不以此为限。
综上可知，本发明一实施例中的变换器模块、变压器模块及其电路省去了多个磁芯盖板，磁芯总体积可明显减小，提升了模块功率密度，并且减小了磁芯损耗，提高了系统效率。
以上对本发明的具体实施例进行了描述。需要理解的是，本发明并不局限于上述特定实施方式，本领域技术人员可以在权利要求的范围内做出各种变形或修改，这并不影响本发明的实质内容。

Claims (15)

1.一种变换器模块，其特征在于，包括：
系统板；
隔离整流单元，通过至少一引脚连接于所述系统板，其中所述隔离整流单元包括：
一磁芯，所述磁芯包含平行于所述系统板的至少一芯柱和设置于所述芯柱两端的两盖板；以及
多个载板单元，设置于所述两盖板之间，且均垂直于所述系统板，所述载板单元具有至少一过孔，每个所述载板单元包含至少一初级绕线组和至少一次级绕线组，所述至少一芯柱穿过所述载板单元的过孔，所述引脚形成于至少一所述载板单元临近于所述系统板的一边侧，用以连接所述载板单元和所述系统板；
所述初级绕线组包含至少一具有环绕所述芯柱的引线图案的印刷电路板走线线圈，或是包含缠绕所述芯柱而成的导线线饼；
所述次级绕线组包含具有环绕所述芯柱的引线图案的印刷电路板走线线圈；
每个所述载板单元还包含至少一开关器件，至少一所述开关器件位于至少一所述载板单元的表面或内嵌于所述载板单元。
2.如权利要求1所述的变换器模块，其特征在于，所述开关器件连接于该载板单元的所述次级绕线组。
3.如权利要求1所述的变换器模块，其特征在于，所述开关器件是MOSFET管或者二极管。
4.如权利要求1所述的变换器模块，其特征在于，所述载板单元的引脚是T型引脚。
5.如权利要求1所述的变换器模块，其特征在于，至少两个所述载板单元的输出电压相同且输出并联。
6.如权利要求1所述的变换器模块，其特征在于，至少两个所述载板单元的所述引脚共同形成一导电体，所述导电体接触并耦接所述系统板。
7.如权利要求6所述的变换器模块，其特征在于，所述导电体是一导电条或是由多个T型引脚相互焊接形成的插脚焊盘。
8.如权利要求1所述的变换器模块，其特征在于，所述变换器模块还包含至少一第一电路模块，所述第一电路模块位于所述盖板与所述系统板之间且临近所述系统板，所述第一电路模块耦接所述系统板，且所述第一电路模块包括高压侧功率器件模块、控制模块中的至少一种。
9.如权利要求1所述的变换器模块，其特征在于，所述变换器模块还包含至少一第二电路模块，所述第二电路模块位于所述载板单元的上边侧，所述第二电路模块包括谐振电感模块、激磁电感模块、高压侧功率器件模块中的至少一种。
10.如权利要求1所述的变换器模块，其特征在于，所述磁芯与载板单元通过封装胶灌封在一起。
11.如权利要求1所述的变换器模块，其特征在于，包括至少一载板，所述载板上设有多个载板单元。
12.一种变压器模块，其特征在于，包括：
一磁芯，所述磁芯具有平行于系统板的至少一芯柱和设置于所述芯柱两端的两盖板；
多个载板单元，设置于所述两盖板之间，至少部分所述多个载板单元相互平行，所述载板单元具有至少一过孔，每个所述载板单元上设置至少一初级绕线组和至少一次级绕线组，所述至少一芯柱穿过所述载板单元的过孔，且每个所述载板单元还包含至少一开关器件，所述开关器件连接于该载板单元的所述次级绕线组；
所述初级绕线组包含至少一具有环绕所述芯柱的引线图案的印刷电路板走线线圈，或是包含缠绕所述芯柱而成的导线线饼；以及
所述次级绕线组包含具有环绕所述芯柱的引线图案的印刷电路板走线线圈；
至少一所述开关器件位于至少一所述载板单元的表面或内嵌于所述载板单元。
13.如权利要求12所述的变压器模块，其特征在于，所述变压器模块还包含：至少一引脚形成于至少一所述载板单元的一边侧。
14.一种电路，其特征在于，包括：如权利要求12或13中所述的变压器模块。
15.如权利要求14所述的电路，其特征在于，所述电路是谐振电路或者反激电路。
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