CN106706136B - A kind of refrigerated infrared detector - Google Patents
A kind of refrigerated infrared detector Download PDFInfo
- Publication number
- CN106706136B CN106706136B CN201611121203.1A CN201611121203A CN106706136B CN 106706136 B CN106706136 B CN 106706136B CN 201611121203 A CN201611121203 A CN 201611121203A CN 106706136 B CN106706136 B CN 106706136B
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- China
- Prior art keywords
- cold
- dewar
- storage device
- infrared detector
- cold finger
- Prior art date
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- 238000003860 storage Methods 0.000 claims abstract description 50
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000005057 refrigeration Methods 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000003292 glue Substances 0.000 description 4
- 229910000883 Ti6Al4V Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a kind of refrigerated infrared detectors, the refrigerated infrared detector includes: including Dewar, Dewar cold finger, refrigerator and detector chip, refrigerator is located in Dewar cold finger, detector chip in Dewar, on the cold head of Dewar cold finger, Dewar cold finger bottom, the side opposite with cold head be equipped with cold-storage device.By means of technical solution of the present invention, not only the cool-storage time of infrared detector can be extended in the case where not increasing refrigerator air consumption, but also the stable temperature control of infrared detector can also be enhanced to a certain extent.
Description
Technical field
The present invention relates to infrared acquisition field, in particular to a kind of refrigerated infrared detector.
Background technique
J-T refrigeration type infrared detector has a wide range of applications on various airborne, carrier-borne and land-based missiles, is guided missile
The core component for tracking target, is equivalent to " eyes " of guided missile.Detector is supplied in the preparation stage high pressure gas cylinder of guided missile, is made
Infrared detector is cracking to reach its operating temperature, can work normally.After MISSILE LAUNCHING, infrared detector is needed not have
In the case where gas source or seldom gas source, the normal operating conditions of one section of cool-storage time is continued to meet wanting for tactics index
It asks.The length of cool-storage time largely decides that guided missile keeps track target capability, when extending infrared detector cold-storage
Between for improve guided missile system combat performance have very great help.
Since the volume of guided missile gas supply high pressure gas cylinder under normal circumstances is smaller, so to J-T refrigeration type infrared detector
Air consumption have higher requirements.Need the regime flow of the refrigerator service life to extend gas cylinder small as far as possible；But existing
On the basis of all types of infrared detector structure designs, if it is desired to extending cool-storage time the regime flow of refrigerator can only just tieed up
It holds in a biggish level to provide enough refrigerating capacitys.It is aforementioned to there is larger contradiction between the two, it can not take into account, if wanting to subtract
Small air consumption necessarily sacrifices part cool-storage time, and vice versa.
J-T refrigeration type infrared detector operating temperature can be fluctuated with the variation of refrigerator instantaneous flow, by a relatively large margin
Temperature fluctuation the noise of its output signal can be made to become larger, signal noise is one of important indicator of performances of IR, is subtracted
The fluctuation of small detector operating temperature has very great help to noise is reduced.
The J-T refrigeration type infrared detector of existing structure is influenced by the refrigerator air consumption for needing strictly to limit, and is stored
Cool time can not improve；With the variation of refrigerator instantaneous flow fluctuation by a relatively large margin can occur for detector temperature simultaneously.
Summary of the invention
In order to extend the cool-storage time of infrared detector, while reducing infrared detector operating temperature with the variation width of flow
Degree, the present invention provides a kind of refrigerated infrared detectors.
Refrigerated infrared detector provided by the invention, including Dewar, Dewar cold finger, refrigerator and detector chip, institute
Refrigerator is stated to be located in the Dewar cold finger, the detector chip in the Dewar, positioned at the cold head of the Dewar cold finger
It is upper:
Dewar cold finger bottom, the side opposite with cold head are equipped with cold-storage device.
The present invention has the beneficial effect that:
The embodiment of the present invention by Dewar cold finger bottom, the side opposite with cold head equipped with cold-storage device, not only can be
Extend the cool-storage time of infrared detector in the case where not increasing refrigerator air consumption, and can also enhance to a certain extent red
The stable temperature control of external detector.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the refrigerated infrared detector of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of Dewar cold finger of the embodiment of the present invention；
Wherein: 1, stem；2, cold head；3, refrigerator；4, detector chip；5, Dewar；6, pedestal；7, cold-storage device；8,
Shell.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
In order to extend the cool-storage time of infrared detector, while reducing infrared detector operating temperature with the variation width of flow
Degree, the present invention provides a kind of refrigerated infrared detectors to carry out the present invention further detailed below in conjunction with attached drawing and embodiment
It describes in detail bright.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, the present invention is not limited.
J-T refrigerator work when refrigeration working medium gas generally provided by gas cylinder, for gas bottle volume generally all in 10L
Within, so being limited by gas cylinder volume, infrared detection system needs to minimize the flow of J-T refrigerator, to keep foot
Enough service lifes.
The application passes through the study found that ideally, when J-T refrigerator ventilates work in Dewar cold finger member forward end
It will form one layer of liquid film, provide a stable low temperature environment for infrared detector.But when J-T refrigerator flow is too small, liquid film
Rupture can be generated under various factors effect.Once liquid film ruptures, infrared detector temperature will fluctuate therewith；Together
When, after stopping gas supply, since the cool-storage time of liquid-sheet disintegration infrared detector is also smaller than stabilizing solution membrane stage.
According to an embodiment of the invention, providing a kind of refrigerated infrared detector, Fig. 1 is that the refrigeration of the embodiment of the present invention is red
The structural schematic diagram of external detector, as shown in Figure 1, refrigerated infrared detector according to an embodiment of the present invention includes Dewar 5, Dewar
Cold finger, refrigerator 3 and detector chip 4, the refrigerator 3 are located in the Dewar cold finger, and the detector chip 4 is in institute
It states in Dewar 5, on the cold head of the Dewar cold finger, Dewar cold finger bottom, the side opposite with cold head are equipped with cold-storage
Device 7.
Specifically, the Dewar cold finger includes stem 1, cold head 2 and pedestal 6；The stem 1 is the sky with a bottom surface
Heart column structure, the stem 1 are fixed with the pedestal 6 far from one end of bottom surface, and the shell 8 is shut out with the pedestal 6 composition
Watts 5, it is located at the bottom surface in the Dewar 5；The cold head 2 be coated on outside the stem 1 bottom surface and with it is described
On 1 cylinder of stem that bottom surface connects, cold head position is formed；The detector chip 4 is located in the cold head position far from described
One end of bottom surface；The cold-storage device 7 is located inside the stem 1, is fixed on the bottom surface；The refrigerator 3 is located at institute
It states in stem 1.
The cold-storage device of the embodiment of the present invention can store a certain amount of liquid refrigerant gas, while to J-T refrigerator
The starting time does not have too big influence.Under the action of surface tension of liquid, after J-T refrigerator ventilates work, filled in cold-storage
Setting middle liquid refrigerating working medium will form one layer of stable liquid film, even if the liquid film is due to cold-storage device when refrigerator flow is smaller
In the presence of will not rupture easily.Ensure that stablize maintain infrared detector operating temperature while, stop gas supply after due to
There is a certain amount of liquid refrigeration working medium to store in cold-storage device, the cold head near sites of Dewar structure is made to maintain a long period
Low-temperature condition, the cool-storage time of infrared detector also extended.That therefore, it is necessary to the cold-storage devices is light-weight, thermal mass is small,
Heat-transfer rate is fast.
Based on above-mentioned consideration, which is specifically as follows stainless (steel) wire or copper mesh or other tools
The similar material of standby These characteristics.
More specifically, the mesh number of the reticular structure is 100~200 mesh, i.e., the mesh number of stainless (steel) wire or copper mesh is 100
~200 mesh.
Specifically, the material of cold head 2 be can valve alloy 4J33, the material of stem 1 is TC4 (Ti-6Al-4V), pedestal 6
Material is can valve alloy 4J33.Cold head, stem, the pedestal of the embodiment of the present invention can also select other to can be realized corresponding function
Material.
In the embodiment of the present invention, using welding or be bonded by the fixed Dewar cold finger bottom of the cold-storage device, with it is cold
Opposite side.
Specifically, the fixed Dewar cold finger bottom of the cold-storage device, the side opposite with cold head are wrapped using welding
Include following steps:
Solder foil is placed on Dewar cold finger bottom, the cold-storage device is placed in the solder foil；
Dewar cold finger after placement solder foil and cold-storage device is placed in vacuum brazing furnace and is handled to the solder foil
Melt.
More specifically, the material of the solder foil is AgCu28 alloy.
More specifically, when using the material of solder foil for AgCu28 alloy, after placing solder foil and cold-storage device
Dewar cold finger when being placed on processing in vacuum brazing furnace, 1~60S is kept the temperature under conditions of 810~835 DEG C.
Specifically, the fixed Dewar cold finger bottom of the cold-storage device, the side opposite with cold head are wrapped using bonding
Include following steps:
After the cold-storage device surface coating water, it is placed on Dewar cold finger bottom, the side opposite with cold head, Gu
Change.
Under normal circumstances, pass through electroplating technology after Dewar cold finger processes in Dewar cold finger plating nickel on surface.
Illustrate technical solution of the present invention in order to more detailed, provides the preparation method of Dewar cold finger.
(1) cold head is welded on the stem bottom surface and the stem cylinder to connect with the bottom surface, forms cold head position；In
The stem welds pedestal far from one end of bottom surface；
Specifically, cold head material be 4J33 can valve alloy, core column material TC4, submount material be 4J33 can valve alloy, pricker
It welds solder and selects AgCu28 alloy, brazing process carries out in vacuum brazing furnace, 820 DEG C of welding temperature, keeps the temperature 1min.
(2) cold-storage device is fixed on the bottom surface using welding or bonding.
Soldering (or bonding) the cold-storage silk screen at the cold head back side, brazing material (or adhesive glue) independently selects, but needs to meet
Low temperature, which is applicable in, to be required.This uses AgCu28 solder foil (bonding uses 502 glue of K-2 type).
It is brazed embodiment
● solder sheet is placed at the cold head back side with tweezers, cold-storage silk screen then is placed above in solder, then in stem
Interior placement brazing tooling.
● part to be welded is swung in into burner hearth flat-temperature zone, and ensures foreign at burner hearth table top and fire door, shuts fire door, starter motor
Tool pump is opened other pumping valve and is vacuumized to furnace chamber, after vacuum meter shows vacuum degree lower than 10Pa, closes other pumping valve, opens
Step valve and main pumping valve before molecular pump start molecular pump, when vacuum degree is shown better than 1x10E-3Pa, starting operation heating schedule,
810 DEG C -835 DEG C are heated to, 0-1min is kept the temperature, cools to 100 DEG C with the furnace hereinafter, valve, pump group are successively closed, to temperature display
When lower than 40 DEG C or less, charging valve is opened, pours nitrogen to furnace chamber, fire door automatically opens, and wears gloves and takes out weldment.
● after the completion of soldering, microscopically observation, solder fusing is abundant, no accumulation；
It is bonded embodiment
● one layer of 502 glue of K-2 type is applied on cold-storage silk screen surface with cotton swab；
● by cold-storage silk screen in non-dust cloth surface wipes, until without extra glue between the hole of silk screen；
● cold-storage silk screen is placed on the cold head back side with tweezers, is then charged into bonding jig, guarantees cold-storage silk screen and cold head
Part comes into full contact with.
Four refrigeration of two infrared detectors and the embodiment of the present invention of two J-T refrigerators and existing structure are infrared
Detector is respectively assembled to be tested together, wherein the cold-storage device of four refrigerated infrared detectors is the copper mesh of 100 mesh.
As a result as shown in the table, wherein detector service temperature stability is the wave for the diode voltage value installed by its cold head position
It moves to characterize.
As can be seen from the above table, the cool-storage time of infrared detector provided in an embodiment of the present invention extends 20% or so,
Stable temperature control is also significantly increased.
The above description is only an embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification,
Equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (6)
1. a kind of J-T refrigerated infrared detector, comprising: Dewar, Dewar cold finger, J-T refrigerator and detector chip, the J-
T refrigerator is located in the Dewar cold finger, the detector chip in the Dewar, positioned at the cold head of the Dewar cold finger
On, it is characterised in that:
Dewar cold finger bottom, the side opposite with cold head are equipped with cold-storage device；
The cold-storage device is reticular structure；
The cold-storage device is stainless (steel) wire or copper mesh；
The mesh number of the reticular structure is 100 mesh~200 mesh；
Liquid refrigeration working medium is stored in the cold-storage device, after J-T refrigerator ventilates work, liquid refrigerating working medium is described
One layer of stable liquid film is formed in cold-storage device.
2. J-T refrigerated infrared detector as described in claim 1, which is characterized in that will be described using welding or bonding way
Cold-storage device is fixed on Dewar cold finger bottom, the side opposite with cold head.
3. J-T refrigerated infrared detector as claimed in claim 2, which is characterized in that filled the cold-storage using welding manner
Set be fixed on Dewar cold finger bottom, the side opposite with cold head the following steps are included:
Solder foil is placed on Dewar cold finger bottom, the cold-storage device is placed in the solder foil；
Dewar cold finger after placement solder foil and cold-storage device is placed on processing to the solder foil in vacuum brazing furnace to melt.
4. J-T refrigerated infrared detector as claimed in claim 3, which is characterized in that the material of the solder foil is AgCu28
Alloy.
5. J-T refrigerated infrared detector as claimed in claim 3, which is characterized in that after placing solder foil and cold-storage device
Dewar cold finger when being placed on processing in vacuum brazing furnace, 1S~60S is kept the temperature under conditions of 810 DEG C~835 DEG C.
6. J-T refrigerated infrared detector as claimed in claim 2, which is characterized in that filled the cold-storage using bonding way
Set be fixed on Dewar cold finger bottom, the side opposite with cold head the following steps are included:
After the cold-storage device surface coating water, it is placed on Dewar cold finger bottom, the side opposite with cold head, is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121203.1A CN106706136B (en) | 2016-12-08 | 2016-12-08 | A kind of refrigerated infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121203.1A CN106706136B (en) | 2016-12-08 | 2016-12-08 | A kind of refrigerated infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106706136A CN106706136A (en) | 2017-05-24 |
| CN106706136B true CN106706136B (en) | 2019-11-22 |
Family
ID=58936533
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611121203.1A Active CN106706136B (en) | 2016-12-08 | 2016-12-08 | A kind of refrigerated infrared detector |
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| CN (1) | CN106706136B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107121199B (en) * | 2017-07-12 | 2023-06-02 | 中国科学院上海技术物理研究所 | Quick cooling device for ultra-long linear Dewar liquid nitrogen refrigeration and implementation method |
| CN107511549A (en) * | 2017-09-04 | 2017-12-26 | 中国电子科技集团公司第十研究所 | A kind of compound cold bench and its manufacture method |
| CN109084902A (en) * | 2018-08-14 | 2018-12-25 | 中国电子科技集团公司第十研究所 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
| CN110274404A (en) * | 2019-05-15 | 2019-09-24 | 中国电子科技集团公司第十一研究所 | Bellows self-adjustable J-T refrigerator |
| CN112923808B (en) * | 2021-02-24 | 2023-02-24 | 上海机电工程研究所 | Shear type air supply mechanism of infrared missile refrigerating device |
| CN112923807B (en) * | 2021-02-24 | 2023-02-28 | 上海机电工程研究所 | Floating type rebounding device suitable for variable-missile-diameter infrared missile air supply mechanism |
| CN113339702B (en) * | 2021-07-01 | 2022-12-23 | 段娜 | Refrigerating system and liquid helium dewar bottle gas protection device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2115602B (en) * | 1982-02-24 | 1986-01-02 | Philips Electronic Associated | Getters in infra-red radiation detectors |
| CN2837747Y (en) * | 2005-07-11 | 2006-11-15 | 中国科学院上海技术物理研究所 | Minisize low-temperature metal Dewar for infrared focal plane detector |
| CN101865582A (en) * | 2010-02-22 | 2010-10-20 | 张志军 | Cold accumulation storage cabinet |
| CN103075898A (en) * | 2013-02-01 | 2013-05-01 | 杨家华 | Gas and liquid heat exchange device |
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2016
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