CN106700426A - Additive material formula of halogen-free and stibium-free environment-friendly copper-clad plate - Google Patents

Additive material formula of halogen-free and stibium-free environment-friendly copper-clad plate Download PDF

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CN106700426A
CN106700426A CN201611268682.XA CN201611268682A CN106700426A CN 106700426 A CN106700426 A CN 106700426A CN 201611268682 A CN201611268682 A CN 201611268682A CN 106700426 A CN106700426 A CN 106700426A
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parts
additive
hydroxide powder
free
halogen
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孙茂云
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Tongling Huake Electronic Materials Co Ltd
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Tongling Huake Electronic Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention discloses an additive material formula of a halogen-free and stibium-free environment-friendly copper-clad plate. An additive is composed of dimethyl formamide, aluminum hydroxide powder, dicumyl peroxide, magnesium hydrate, diethylenetriamine, sodium dodecyl benzene sulfonate, polyamide, sodium hydroxide powder, dimethyl adipate and dimethyl imidazole, and the additive raw materials are prepared according to the appropriate ratio and molten, stirred and mixed at high temperature to obtain the additive. The obtained additive is applied to the production process of the copper-clad plate, the additive of the type is excellent in curing performance in the using process, and the manufacturing method is easy, convenient, and capable of improving the stability and adhering effect and preventing copper foil from falling.

Description

The additive material formula of halogen-free stibium-free environment friendly CCL
Technical field
The present invention relates to copper-clad plate production technical field, more particularly to a kind of additive of halogen-free stibium-free environment friendly CCL Material prescription.
Background technology
Also known as base material, it is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., is soaked with resin, and single or double covers for copper-clad plate With Copper Foil, through a kind of board-like material of hot pressing, referred to as copper-clad laminate.It is the stock for being PCB, is often base Material, when it is produced for multi-layer sheet, is also core plate.Copper-clad plate is divided into according to mechanical rigid：Rigid plate, flex plate；According to not It is divided into insulating material structure：The copper-clad plate of organic resin class, metal-based copper-clad plate, ceramic base copper-clad plate；It is divided into according to thickness：Often What straightedge and thin plate, wherein thickness were less than 0.5mm is thin plate；It is divided into according to reinforcing material：The copper-clad plate of glass cloth base, paper substrate cover copper Plate, composite-based copper clad plate；It is divided into according to some properties：TG plates high, high dielectric property are done, uv blocking plate.
Because the flame-retardant system of plain edition copper-clad plate is brominated resin system（Bromine is halogens）, bromide burning generation To the mankind and the harmful dioxin material of environment, find preferable flame-retardant system and replace halide, production and manufacturing environment is friendly Type halogen-free copper-clad plate is to promote electronic industry development, protects the premise of environment for human survival.Halogen-free copper-clad plate must keep general On the premise of the key property of logical copper-clad plate, good dielectric properties, excellent resistance to ion transport and CTI high are should also have Property, it is more widely applied.
Current copper-clad plate is subsequently adding addition in process of production, it is necessary to first carry out glue, it is necessary to first dissolve curing agent Agent by fully dissolve and be thoroughly mixed it is uniform after, allow glue to cure some hours, allow each component have contact with each other enough, Interpenetrate, colloid is reached a stability through a period of time., it is necessary to add addition during adhesive is made Agent, the component of current additive is more single, and its bond effect is poor, needs further perfect, and solidification effect has Treat further raising.
The content of the invention
The present invention is in order to overcome deficiency of the prior art, there is provided a kind of additive of halogen-free stibium-free environment friendly CCL Material prescription.
The present invention is to be achieved through the following technical solutions：
A kind of additive material formula of halogen-free stibium-free environment friendly CCL, described copper-clad plate includes adhesive layer, glass fibers Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, completed in resin Afterwards, resin temperature is maintained at 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to Prepreg, described additive is made up of the component of following weight portion：Dimethylformamide 3-7 parts, aluminium-hydroxide powder 13- 27 parts, cumyl peroxide 1-5 parts, magnesium hydroxide powder 2-5 parts, diethylenetriamine 3-7 parts, neopelex 6- 13 parts, polyamide 13-23 parts, sodium hydroxide powder 5-7 parts, dimethyl adipate 8-12 parts and methylimidazole 5-8 parts.
Further, described additive is made up of the component of following weight portion：3 parts of dimethylformamide, aluminium hydroxide 13 parts of powder, 1 part of cumyl peroxide, 2 parts of magnesium hydroxide powder, 3 parts of diethylenetriamine, 6 parts of neopelex, 5 parts of 13 parts of polyamide, 5 parts of sodium hydroxide powder, 8 parts of dimethyl adipate and methylimidazole.
Further, described additive is made up of the component of following weight portion：7 parts of dimethylformamide, aluminium hydroxide 27 parts of powder, 5 parts of cumyl peroxide, 5 parts of magnesium hydroxide powder, 7 parts of diethylenetriamine, neopelex 13 Part, 23 parts of polyamide, 7 parts of sodium hydroxide powder, 12 parts of dimethyl adipate and 8 parts of methylimidazole.
Further, described additive is made up of the component of following weight portion：5 parts of dimethylformamide, aluminium hydroxide 20 parts of powder, 3 parts of cumyl peroxide, 4 parts of magnesium hydroxide powder, 5 parts of diethylenetriamine, neopelex 10 Part, 18 parts of polyamide, 6 parts of sodium hydroxide powder, 10 parts of dimethyl adipate and 7 parts of methylimidazole.
Dimethylformamide（DMF）It is a kind of transparency liquid, can be dissolved each other with water and most of organic solvent.It is chemical anti- The common solvent answered.Absolute dimethylformamide is that do not have odorous, but technical grade or rotten dimethylformamide then have fish raw meat Taste, the impurity of dimethyl amine is contained because of it.Title source is because it is formamide（The acid amides of formic acid）Dimethyl substitution Thing, and two methyl are all located at N（Nitrogen）On atom.Dimethylformamide is high boiling polarity（Hydrophily）Aprotic is molten Agent, can promote the carrying out of SN2 reaction mechanisms.Dimethylformamide is manufactured using methyl formate and dimethyl amine.Dimethyl Formamide is unstable in the presence of highly basic such as NaOH or strong acid such as hydrochloric acid or sulfuric acid（Especially at high temperature）, and water Solve is formic acid and dimethyl amine.
The chemical formula Al (OH) of aluminium hydroxide3, it is the hydroxide of aluminium.Aluminium hydroxide can generate salt and water with acid reaction Salt and water can be generated with highly basic reaction again, therefore be also a kind of amphoteric hydroxide.Chemical formula Al (OH)3, it is the hydroxide of aluminium Thing.Due to showing certain acidity again, so aluminic acid can be referred to as again（H3AlO3）, but actual generate when being reacted with alkali is four hydroxyls Base closes aluminate（[Al(OH)4]-）.
Cumyl peroxide, also known as vulcanizing agent DCP, the cumin of peroxidating two.White crystals.Stablize at room temperature, see light by Crossfade into slightly yellow.It is water insoluble, it is dissolved in ethanol, ether, acetic acid, benzene and petroleum ether.It is a kind of strong oxidizer.Can be used as monomer The initiator of polymerization, vulcanizing agent, crosslinking agent, curing agent, flame-retardant additive of macromolecular material etc..
Magnesium hydroxide alias causticity magnesite, caustic-calcined magnesite etc., suspension of the magnesium hydroxide in water is referred to as hydroxide magnesia magma Agent, abbreviation magnesia magma, magnesium hydroxide is colourless hexagonal prism crystal or white powder, is insoluble in water and alcohol, is dissolved in diluted acid and ammonium salt is molten Liquid, the aqueous solution is in alkalescent.Solubility very little in water, but be dissolved in the part of water and ionize completely.The natural ore deposit of magnesium hydroxide Thing shepardite.Can be used for sugaring and magnesia etc..Because magnesium hydroxide is abundant in the Nature comparision contents, and its chemical property and aluminium It is more close, therefore user starts to be replaced with magnesium hydroxide aluminium chloride for fragrant body product.Chemical formula Mg (OH)2, formula weight 58.32.White amorphous powder.Water is insoluble in, diluted acid and ammonium salt solution is soluble in.The concentration of saturated aqueous solution be 1.9 milligrams/ Rise (18 DEG C), in alkalescence.It is heated to 350 DEG C and loses water generation magnesia.
Diethylenetriamine is that yellow has hygroscopic clear viscous liquids, and irritant ammonia is smelly, flammable, in strong basicity. Water, acetone, benzene, ethanol, methyl alcohol etc. are dissolved in, normal heptane is insoluble in, copper and its alloy are corrosive.- 35 DEG C of fusing point, boiling point 207 DEG C, relative density 0.9586（20、20℃）, refractive index 1.4810.94 DEG C of flash-point.This product has the reactivity of secondary amine, easily with Multiple compounds react, and its derivative has been widely used.Moisture and carbon dioxide in easy absorption air.
Neopelex abbreviation SDBS, white or faint yellow powdery or chip solid.Hardly possible volatilization, it is soluble in water, It is dissolved in water and forms translucent solution.To alkali, diluted acid, hard water stable chemical nature.
Polyamide it be the high polymer containing amide group in macromolecular main chain repeat unit general name.Polyamide can be by interior Acid amide ring-opening polymerisation is obtained, and can also be obtained by diamine and binary acid polycondensation etc..It is that DuPont develops use at first In the resin of fiber, realize industrializing in nineteen thirty-nine.The 1950's starts to develop and produce injection-molded item, with substituted metal Meet the lightweight of downstream industry product, the requirement of reduces cost.PA has a good combination property, including mechanical property, heat-resisting Property, wear resistance, chemical proofing and self lubricity, and coefficient of friction is low, there is certain anti-flammability, it is easy to process, be suitable to With glass fibre and other filler filling enhancing modifieds, improve performance and expand range of application.
NaOH, chemical formula is NaOH, is commonly called as caustic soda, caustic soda, caustic soda, is a kind of highly basic with severe corrosive, Generally sheet or block-shape morphology, soluble in water（Heat release when being dissolved in water）And alkaline solution is formed, and separately there is hygroscopy, easily draw empty Vapor in gas（Deliquescence）And carbon dioxide（It is rotten）, hydrochloric acid can be added to check whether to go bad.NaOH be chemical laboratory its A kind of middle indispensable chemicals, is also one of common chemicals.Sterling is the crystal of water white transparency.Density 2.130g/cm3. 318.4 DEG C of fusing point.1390 DEG C of boiling point.Industrial goods contain a small amount of sodium chloride and sodium carbonate, are the crystal of White-opalescent.There is block Shape, sheet, granular and bar-shaped etc..Formula weight 39.997.NaOH in water process can as alkaline cleaner, be dissolved in ethanol and Glycerine；Insoluble in propyl alcohol, ether.There is disproportionated reaction with the halogen such as chlorine, bromine, iodine.With acids rise neutralization and generate salt and Water.
The chemical formula of dimethyl adipate is：C8H14O4, it is a kind of colourless also known as adipic acid double methyl esters, adipic acid dimethyl esters Transparency liquid, its fusing point is 8 DEG C, and boiling point is 109-110 DEG C (14 mmHg), 228.7 DEG C (760mmHg), and water insoluble, energy is molten In alcohol, ether, belong to lower toxicity material, be industrially mainly used in the raw material of synthetic intermediate, medicine, spices, as plasticizer and High boiling solvent etc..
Methylimidazole is white crystalline powder, there is moisture absorption, is dissolved in water, alcohol, is dissolved in acetone, DMF.It is insoluble in benzene； It is poisonous, and corrosivity irritant to skin, mucous membrane.This product is used for metronidazole, the synthesis of dimetridazole.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention by by additive by dimethylformamide, Aluminium-hydroxide powder, cumyl peroxide, magnesium hydroxide powder, diethylenetriamine, neopelex, polyamide, Sodium hydroxide powder, dimethyl adipate and methylimidazole composition, and by the additive of these species in accordance with the appropriate ratio Prepare melting stirring at high temperature to mix, the additive that will be obtained is applied in the middle of the production technology of copper-clad plate, this Curing performance is excellent when in use for the additive of type, and preparation method is simple, convenient, it is possible to increase its stability, bonding Effect, is prevented from Copper Foil and comes off.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, the present invention is carried out further below Describe in detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to limit this hair It is bright.
Embodiment one：
A kind of additive material formula of halogen-free stibium-free environment friendly CCL, described copper-clad plate includes adhesive layer, glass fibers Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, completed in resin Afterwards, resin temperature is maintained at 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to Prepreg, described additive is made up of the component of following weight portion：3 parts of dimethylformamide, 13 parts of aluminium-hydroxide powder, 1 part of cumyl peroxide, 2 parts of magnesium hydroxide powder, 3 parts of diethylenetriamine, 6 parts of neopelex, polyamide 13 Part, 5 parts of sodium hydroxide powder, 8 parts of dimethyl adipate and 5 parts of methylimidazole.
Embodiment two：
A kind of additive material formula of halogen-free stibium-free environment friendly CCL, described copper-clad plate includes adhesive layer, glass fibers Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, completed in resin Afterwards, resin temperature is maintained at 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to Prepreg, described additive is made up of the component of following weight portion：7 parts of dimethylformamide, 27 parts of aluminium-hydroxide powder, 5 parts of cumyl peroxide, 5 parts of magnesium hydroxide powder, 7 parts of diethylenetriamine, 13 parts of neopelex, polyamide 23 Part, 7 parts of sodium hydroxide powder, 12 parts of dimethyl adipate and 8 parts of methylimidazole.
Embodiment three：
A kind of additive material formula of halogen-free stibium-free environment friendly CCL, described copper-clad plate includes adhesive layer, glass fibers Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, completed in resin Afterwards, resin temperature is maintained at 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to Prepreg, described additive is made up of the component of following weight portion：5 parts of dimethylformamide, 20 parts of aluminium-hydroxide powder, 3 parts of cumyl peroxide, 4 parts of magnesium hydroxide powder, 5 parts of diethylenetriamine, 10 parts of neopelex, polyamide 18 Part, 6 parts of sodium hydroxide powder, 10 parts of dimethyl adipate and 7 parts of methylimidazole.
The present invention by by additive by dimethylformamide, aluminium-hydroxide powder, cumyl peroxide, magnesium hydroxide Powder, diethylenetriamine, neopelex, polyamide, sodium hydroxide powder, dimethyl adipate and methylimidazole Constitute, and the additive of these species is prepared into melting stirring at high temperature in accordance with the appropriate ratio and mix, will obtain Additive apply in the middle of the production technology of copper-clad plate, curing performance is excellent when in use for such additive, and system Make method simple, convenient, it is possible to increase its stability, adhesive effect, be prevented from Copper Foil and come off.
General principle of the invention, principal character and advantages of the present invention has been shown and described above.The technology of the industry It should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is only the present invention to personnel Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute Attached claims and its equivalent thereof.

Claims (4)

1. the additive material formula of halogen-free stibium-free environment friendly CCL, described copper-clad plate includes adhesive layer, glass fibre Cloth, copper foil layer, the adhesive layer is coated on glass fabric, is dissolved curing agent more than 50 DEG C with epoxy resin, Additive is subsequently adding after fully dissolving and being thoroughly mixed uniformly, allows glue to cure some hours, allow each component to have Contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, after resin completes, Resin temperature is maintained at 60 DEG C, glass fabric impregnating resin is used, and carries out baking at a certain temperature and be fabricated to half admittedly Change piece, it is characterised in that described additive is made up of the component of following weight portion：Dimethylformamide 3-7 parts, aluminium hydroxide Powder 13-27 parts, cumyl peroxide 1-5 parts, magnesium hydroxide powder 2-5 parts, diethylenetriamine 3-7 parts, detergent alkylate Sodium sulfonate 6-13 parts, polyamide 13-23 parts, sodium hydroxide powder 5-7 parts, dimethyl adipate 8-12 parts and methylimidazole 5- 8 parts.
2. the additive material formula of halogen-free stibium-free environment friendly CCL according to claim 1, it is characterised in that described Additive be made up of the component of following weight portion：3 parts of dimethylformamide, 13 parts of aluminium-hydroxide powder, peroxidating diisopropyl 1 part of benzene, 2 parts of magnesium hydroxide powder, 3 parts of diethylenetriamine, 6 parts of neopelex, 13 parts of polyamide, hydroxide sodium powder 5 parts of 5 parts of end, 8 parts of dimethyl adipate and methylimidazole.
3. the additive material formula of halogen-free stibium-free environment friendly CCL according to claim 1, it is characterised in that described Additive be made up of the component of following weight portion：7 parts of dimethylformamide, 27 parts of aluminium-hydroxide powder, peroxidating diisopropyl 5 parts of benzene, 5 parts of magnesium hydroxide powder, 7 parts of diethylenetriamine, 13 parts of neopelex, 23 parts of polyamide, NaOH 8 parts of 7 parts of powder, 12 parts of dimethyl adipate and methylimidazole.
4. the additive material formula of halogen-free stibium-free environment friendly CCL according to claim 1, it is characterised in that described Additive be made up of the component of following weight portion：5 parts of dimethylformamide, 20 parts of aluminium-hydroxide powder, peroxidating diisopropyl 3 parts of benzene, 4 parts of magnesium hydroxide powder, 5 parts of diethylenetriamine, 10 parts of neopelex, 18 parts of polyamide, NaOH 7 parts of 6 parts of powder, 10 parts of dimethyl adipate and methylimidazole.
CN201611268682.XA 2016-12-31 2016-12-31 Additive material formula of halogen-free and stibium-free environment-friendly copper-clad plate Pending CN106700426A (en)

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CN101585955A (en) * 2008-12-31 2009-11-25 广东生益科技股份有限公司 Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil
CN101735558A (en) * 2008-11-07 2010-06-16 福建新世纪电子材料有限公司 Glue solution for copper-clad plate

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CN101735558A (en) * 2008-11-07 2010-06-16 福建新世纪电子材料有限公司 Glue solution for copper-clad plate
CN101585955A (en) * 2008-12-31 2009-11-25 广东生益科技股份有限公司 Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil

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