CN106675480A - Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate - Google Patents
Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate Download PDFInfo
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- CN106675480A CN106675480A CN201611268483.9A CN201611268483A CN106675480A CN 106675480 A CN106675480 A CN 106675480A CN 201611268483 A CN201611268483 A CN 201611268483A CN 106675480 A CN106675480 A CN 106675480A
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- Prior art keywords
- parts
- hydroxide powder
- copper
- additive
- clad plate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an additive material formula of a halogen-free CEM-1 composite substrate copper-clad plate. The additive material formula comprises the following additives: benzoyl peroxide, aluminum hydroxide powder, dicumyl peroxide, magnesium hydroxide powder, sodium dodecyl benzene sulfonate, polyamide, calcium hydroxide powder, dimethyl adipate and sldium lauryl sulfate; the additive material is prepared by preparing the additives according to a proper proportion, melting the additives at the high temperature and stirring for mixing. When being applied to a manufacturing technique of the copper-clad plate, the obtained additive is good in compatibility with epoxy resin on the one hand and improves the adhesive property of the epoxy resin on the other hand when in use; therefore, the additive material provided by the invention prevents falling off of metal copper due to poor adhesion force with a porous wall, can improve the stability at the room temperature and effectively prevents a circuit on the copper-clad plate from being broken due to poor adhesion force.
Description
Technical field
The present invention relates to copper-clad plate production technical field, more particularly to a kind of Halogen CEM-1 composite base material copper-clad plates add
Plus agent material formula.
Background technology
Also known as base material, it is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., is soaked with resin, and single or double covers for copper-clad plate
With Copper Foil, referred to as a kind of board-like material of Jing hot pressing, copper-clad laminate.It is the stock for being PCB, is often base
Material, when it is used for multi-layer sheet produces, is also central layer.Copper-clad plate is divided into according to mechanical rigid：Rigid plate, flex plate；According to not
It is divided into insulating material structure：Organic resin class copper-clad plate, metal-based copper-clad plate, ceramic base copper-clad plate；It is divided into according to thickness：Often
Straightedge and thin plate, wherein thickness are thin plate less than 0.5mm；It is divided into according to reinforcing material：Glass cloth base copper-clad plate, paper substrate cover copper
Plate, composite-based copper clad plate；It is divided into according to some properties：High TG plates, high dielectric property are done, uv blocking plate.Copper-clad plate is mainly used
In printed circuit board is made, manufacture for various Military Electronic Equipments, communication equipment, computer, automotive electronics, household electrical appliance etc.
Industry.With the development of global electronic information industry, the demand rapid growth to copper-clad plate, the high-speed developing period is entered.
Copper-clad plate at present in process of production, needs first to carry out glue, and firming agent is first dissolved by needs, is subsequently adding addition
Agent through fully dissolve and be thoroughly mixed it is uniform after, allow some hours of glue ripening, allow each component have contact with each other enough,
Interpenetrate, Jing makes colloid reach a stability for a period of time.When copper-clad plate makes, in hole, metallization process is complicated,
Qualification rate is low, and critical defect is the poor adhesive force of metallic copper and hole wall, easily comes off, so as to cause circuit in hole to disconnect, these
Have what is caused due to adhesive bond effect difference, during adhesive is made, need to add additive, current additive
Component for more single, its bond effect is poor, needs further perfect, prevents the circuit in copper-clad plate because of poor adhesive force
And disconnect.
The content of the invention
The present invention is to overcome deficiency of the prior art, there is provided a kind of Halogen CEM-1 composite base material copper-clad plates add
Plus agent material formula.
The present invention is to be achieved through the following technical solutions：
A kind of additive material formula of Halogen CEM-1 composite base material copper-clad plates, described copper-clad plate include adhesive layer, glass
Fiber cloth, copper foil layer, the adhesive layer is coated on glass fabric, firming agent is molten more than 50 DEG C with epoxy resin
Solution, be subsequently adding additive through fully dissolve and be thoroughly mixed it is uniform after, allow some hours of glue ripening, allow each component
Have and contact with each other enough, interpenetrate, Jing makes colloid reach a stability for a period of time, completes in resin
Afterwards, resin temperature is maintained at into 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to
Prepreg, described additive are made up of the component of following weight portion：Benzoyl peroxide 3-8 parts, aluminium-hydroxide powder 12-
25 parts, cumyl peroxide 2-9 parts, magnesium hydroxide powder 2-5 parts, dodecylbenzene sodium sulfonate 6-13 parts, kymene -6
Part, calcium hydroxide powder 4-7 parts, dimethyl adipate 5-12 parts and sodium laurylsulfate 3-8 parts.
Further, described additive is made up of the component of following weight portion：3 parts of benzoyl peroxide, aluminium hydroxide
12 parts of powder, 2 parts of cumyl peroxide, 2 parts of magnesium hydroxide powder, 6 parts of dodecylbenzene sodium sulfonate, kymene part, hydrogen-oxygen
Change 3 parts of 4 parts of calcium powder, 5 parts of dimethyl adipate and sodium laurylsulfate.
Further, described additive is made up of the component of following weight portion：8 parts of benzoyl peroxide, aluminium hydroxide
25 parts of powder, 9 parts of cumyl peroxide, 5 parts of magnesium hydroxide powder, 13 parts of dodecylbenzene sodium sulfonate, polyamide 6 part, hydrogen
8 parts of 7 parts of lime powder, 12 parts of dimethyl adipate and sodium laurylsulfate.
Further, described additive is made up of the component of following weight portion：5 parts of benzoyl peroxide, aluminium hydroxide
22 parts of powder, 6 parts of cumyl peroxide, 4 parts of magnesium hydroxide powder, 10 parts of dodecylbenzene sodium sulfonate, 4 parts of polyamide, hydrogen
6 parts of 6 parts of lime powder, 8 parts of dimethyl adipate and sodium laurylsulfate.
The complete entitled peroxidating of the Chinese of benzoyl peroxide（Two）Benzoyl, white or faint yellow thin wick are micro- to have hardship
Almond scent.It is a kind of strong oxidizer, extremely unstable, easy firing.Can explode when clashing into, being heated, rub.Send out when adding sulphuric acid
Raw burning.Main usess：The initiator of synthetic resin.Flour, oils and fatss, the bleach of wax, cosmetic additive, vulcanizer.
The chemical formula Al (OH) of aluminium hydroxide3, it is the hydroxide of aluminum.Aluminium hydroxide can generate salt and water with acid reaction
Salt and water can be generated with highly basic reaction again, therefore be also a kind of amphoteric hydroxide.Chemical formula Al (OH)3, it is the hydroxide of aluminum
Thing.Due to showing certain acidity again, so and aluminic acid can be referred to as（H3AlO3）, but it is actual with alkali reaction when generate is four hydroxyls
Base closes aluminate（[Al(OH)4]-）.
Cumyl peroxide, also known as vulcanizing agent DCP, two cumin of peroxidating.White crystals.It is stable under room temperature, see light by
Crossfade into slightly yellow.It is water insoluble, it is dissolved in ethanol, ether, acetic acid, benzene and petroleum ether.It is a kind of strong oxidizer.Can be used as monomer
The initiator of polymerization, the vulcanizing agent of macromolecular material, cross-linking agent, firming agent, flame-retardant additive etc..
Magnesium hydroxide calls causticity magnesite, caustic-calcined magnesite etc., and suspension of the magnesium hydroxide in water is referred to as hydroxide magnesia magma
Agent, abbreviation magnesia magma, magnesium hydroxide are colourless hexagonal prism crystal or white powder, are insoluble in water and alcohol, be dissolved in diluted acid and ammonium salt is molten
Liquid, aqueous solution are in alkalescence.Dissolubility very little in water, but be dissolved in the part of water and ionize completely.The natural ore of magnesium hydroxide
Thing shepardite.Can be used for sugaring and magnesium oxide etc..Because magnesium hydroxide is enriched in the Nature comparision contents, and its chemical property and aluminum
It is more close, therefore user starts with magnesium hydroxide to replace aluminum chloride for fragrant body product.Chemical formula Mg (OH)2, formula weight
58.32.White amorphous powder.Water is insoluble in, diluted acid and ammonium salt solution is soluble in.The concentration of saturated aqueous solution be 1.9 milligrams/
Rise (18 DEG C), in alkalescence.It is heated to 350 DEG C and loses water generating magnesium oxide.
Dodecylbenzene sodium sulfonate abbreviation SDBS, white or faint yellow powdery or chip solid.Difficult volatilization, it is soluble in water,
It is dissolved in water and forms translucent solution.To alkali, diluted acid, hard water stable chemical nature.
Polyamide it be the high polymer containing amide group in macromolecular main chain repetitives general name.Polyamide can be by interior
Acid amide ring-opening polymerisation is obtained, and also can be obtained by diamine and binary acid polycondensation etc..It is that DuPont develops use at first
In the resin of fiber, industrialization is realized in nineteen thirty-nine.The 1950's starts to develop and produce injection-molded item, with substituted metal
Meet downstream industry product lightweight, the requirement of reduces cost.PA has a good combination property, including mechanical property, heat-resisting
Property, wear resistance, chemical proofing and self lubricity, and coefficient of friction is low, has certain anti-flammability, it is easy to process, be suitable to
With glass fibre and other filler filling enhancing modifieds, improve performance and expand range of application.
Calcium hydroxide is a kind of white powdery solids.Chemical formula Ca (OH)2, Calx, slaked lime are commonly called as, water is added
Afterwards, in upper and lower two-layer, upper strata aqueous solution referred to as clarifies lime water, and lower floor's suspension is referred to as lime cream or lime white.The supernatant
Clarification lime water can check carbon dioxide, and lower floor's troubled liquor lime cream is a kind of construction material.Calcium hydroxide is a kind of white
Color pulverulent solids, are slightly soluble in water.
The chemical formula of dimethyl adipate is：C8H14O4, also known as adipic acid double methyl ester, adipic acid dimethyl esters, it is a kind of colourless
Transparency liquid, its fusing point are 8 DEG C, and boiling point is 109-110 DEG C (14 mmHg), 228.7 DEG C (760mmHg), and water insoluble, energy is molten
In alcohol, ether, belong to lower toxicity material, be industrially mainly used in the raw material of synthetic intermediate, medicine, spice, as plasticizer and
High boiling solvent etc..
Sodium laurylsulfate active matter content 30%~25%, faint yellow or white paste.When 40%, viscosity is improved quickly,
Colloid is formed, or is 0.5~1.0mm spicules.It is powder if being spray-dried.1% solution krafft point is 16 DEG C, is faced
Boundary's micellar concentration is 6.8mmol/L；When 25 DEG C, the surface tension of 0.1% solution is 49.0mN/m, and interfacial tension is 20.3mN/ m；
When 60 DEG C, the wetting time of 1% solution is 19.1s.HLB value is 40.
Compared with prior art, the invention has the beneficial effects as follows：The present invention by by additive by benzoyl peroxide,
Aluminium-hydroxide powder, cumyl peroxide, magnesium hydroxide powder, dodecylbenzene sodium sulfonate, polyamide, calcium hydroxide powder
End, dimethyl adipate and sodium laurylsulfate composition, and the additive of these species is prepared in accordance with the appropriate ratio
Melt stirring to mix under high temperature, the additive for obtaining is applied in the middle of the production technology of copper-clad plate, it is such to add
Plus agent when in use on the one hand and epoxy resin compatibility very well, on the other hand improve its adhesive property, prevent metallic copper and
The poor adhesive force of hole wall causes to come off, and can improve the stability under its room temperature, be effectively prevented circuit in copper-clad plate because
Poor adhesive force and disconnect.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below the present invention is carried out further
Describe in detail.It should be appreciated that specific embodiment described herein is not used to limit this only to explain the present invention
It is bright.
Embodiment one：
A kind of additive material formula of Halogen CEM-1 composite base material copper-clad plates, described copper-clad plate include adhesive layer, glass
Fiber cloth, copper foil layer, the adhesive layer is coated on glass fabric, firming agent is molten more than 50 DEG C with epoxy resin
Solution, be subsequently adding additive through fully dissolve and be thoroughly mixed it is uniform after, allow some hours of glue ripening, allow each component
Have and contact with each other enough, interpenetrate, Jing makes colloid reach a stability for a period of time, completes in resin
Afterwards, resin temperature is maintained at into 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to
Prepreg, described additive are made up of the component of following weight portion：3 parts of benzoyl peroxide, 12 parts of aluminium-hydroxide powder,
2 parts of cumyl peroxide, 2 parts of magnesium hydroxide powder, 6 parts of dodecylbenzene sodium sulfonate, kymene part, calcium hydroxide powder 4
3 parts of part, 5 parts of dimethyl adipate and sodium laurylsulfate.
Embodiment two：
A kind of additive material formula of Halogen CEM-1 composite base material copper-clad plates, the group of described additive by following weight portion
Divide and make：8 parts of benzoyl peroxide, 25 parts of aluminium-hydroxide powder, 9 parts of cumyl peroxide, 5 parts of magnesium hydroxide powder, ten
13 parts of dialkyl benzene sulfonic acids sodium, polyamide 6 part, 7 parts of calcium hydroxide powder, 12 parts of dimethyl adipate and sodium laurylsulfate 8
Part.
Embodiment three：
A kind of additive material formula of Halogen CEM-1 composite base material copper-clad plates, the group of described additive by following weight portion
Divide and make：5 parts of benzoyl peroxide, 22 parts of aluminium-hydroxide powder, 6 parts of cumyl peroxide, 4 parts of magnesium hydroxide powder, ten
10 parts of dialkyl benzene sulfonic acids sodium, 4 parts of polyamide, 6 parts of calcium hydroxide powder, 8 parts of dimethyl adipate and sodium laurylsulfate 6
Part.
The present invention by by additive by benzoyl peroxide, aluminium-hydroxide powder, cumyl peroxide, magnesium hydroxide
Powder, dodecylbenzene sodium sulfonate, polyamide, calcium hydroxide powder, dimethyl adipate and sodium laurylsulfate composition, and will
The additive of these species prepares melting stirring at high temperature in accordance with the appropriate ratio and mixes, and the additive for obtaining is transported
Use in the middle of the production technology of copper-clad plate, such additive when in use on the one hand and epoxy resin compatibility very
It is good, its adhesive property is on the other hand improved, prevents metallic copper and the poor adhesive force of hole wall from causing to come off, and its room temperature can be improved
Under stability, the circuit being effectively prevented in copper-clad plate disconnected because of poor adhesive force.
Ultimate principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
It should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and description is only the present invention to personnel
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements are both fallen within scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (4)
1. the additive material formula of Halogen CEM-1 composite base materials copper-clad plate, described copper-clad plate include adhesive layer, glass fibers
Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, firming agent is molten more than 50 DEG C with epoxy resin
Solution, be subsequently adding additive through fully dissolve and be thoroughly mixed it is uniform after, allow some hours of glue ripening, allow each component
Have and contact with each other enough, interpenetrate, Jing makes colloid reach a stability for a period of time, completes in resin
Afterwards, resin temperature is maintained at into 60 DEG C, uses glass fabric impregnating resin, and carry out baking at a certain temperature and be fabricated to
Prepreg, it is characterised in that described additive is made up of the component of following weight portion：Benzoyl peroxide 3-8 parts, hydrogen-oxygen
Change aluminium powder 12-25 parts, cumyl peroxide 2-9 parts, magnesium hydroxide powder 2-5 parts, dodecylbenzene sodium sulfonate 6-13 parts,
- 6 parts of kymene, calcium hydroxide powder 4-7 parts, dimethyl adipate 5-12 parts and sodium laurylsulfate 3-8 parts.
2. the additive material formula of Halogen CEM-1 composite base material copper-clad plates according to claim 1, it is characterised in that
Described additive is made up of the component of following weight portion：3 parts of benzoyl peroxide, 12 parts of aluminium-hydroxide powder, peroxidating two
2 parts of isopropylbenzene, 2 parts of magnesium hydroxide powder, 6 parts of dodecylbenzene sodium sulfonate, kymene part, 4 parts of calcium hydroxide powder, oneself two
3 parts of 5 parts of dimethyl phthalate and sodium laurylsulfate.
3. the additive material formula of Halogen CEM-1 composite base material copper-clad plates according to claim 1, it is characterised in that
Described additive is made up of the component of following weight portion：8 parts of benzoyl peroxide, 25 parts of aluminium-hydroxide powder, peroxidating two
9 parts of isopropylbenzene, 5 parts of magnesium hydroxide powder, 13 parts of dodecylbenzene sodium sulfonate, polyamide 6 part, 7 parts of calcium hydroxide powder, oneself two
8 parts of 12 parts of dimethyl phthalate and sodium laurylsulfate.
4. the additive material formula of Halogen CEM-1 composite base material copper-clad plates according to claim 1, it is characterised in that
Described additive is made up of the component of following weight portion：5 parts of benzoyl peroxide, 22 parts of aluminium-hydroxide powder, peroxidating two
6 parts of isopropylbenzene, 4 parts of magnesium hydroxide powder, 10 parts of dodecylbenzene sodium sulfonate, 4 parts of polyamide, 6 parts of calcium hydroxide powder, oneself two
6 parts of 8 parts of dimethyl phthalate and sodium laurylsulfate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268483.9A CN106675480A (en) | 2016-12-31 | 2016-12-31 | Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268483.9A CN106675480A (en) | 2016-12-31 | 2016-12-31 | Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate |
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| CN201611268483.9A Pending CN106675480A (en) | 2016-12-31 | 2016-12-31 | Additive material formula of halogen-free CEM-1 composite substrate copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844963A (en) * | 2020-08-14 | 2020-10-30 | 广东硕成科技有限公司 | Heat-resistant and temperature-resistant elastic rubber mat made of copper-clad plate laminated composite material and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
-
2016
- 2016-12-31 CN CN201611268483.9A patent/CN106675480A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
Non-Patent Citations (3)
| Title |
|---|
| 化学工业部科学技术情报研究所编: "《化工产品手册有机化工原料（下册）》", 30 June 1985, 化学工业出版社 * |
| 吴世敏等: "《简明精细化工大辞典》", 30 June 1999, 辽宁科学技术出版社 * |
| 孙传尧: "《选矿工程师手册（第2册）》", 31 March 2015, 冶金工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844963A (en) * | 2020-08-14 | 2020-10-30 | 广东硕成科技有限公司 | Heat-resistant and temperature-resistant elastic rubber mat made of copper-clad plate laminated composite material and manufacturing method thereof |
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Application publication date: 20170517 |