CN106634670A - Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL) - Google Patents
Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL) Download PDFInfo
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- CN106634670A CN106634670A CN201611268852.4A CN201611268852A CN106634670A CN 106634670 A CN106634670 A CN 106634670A CN 201611268852 A CN201611268852 A CN 201611268852A CN 106634670 A CN106634670 A CN 106634670A
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- parts
- solvent
- clad plate
- copper
- adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a solvent material formula for a polytetrafluoroethylene high-frequency microwave CCL, a solvent in an adhesive layer is mixed with dimethyl glutarate, fatty alcohol-polyoxyethylene ether, alkanolamide, polyvinylpyrrolidone, rosin resin, methyl-tri-butanone-oxime silane, triethylene tetramine, dimethyl adipate, dimethyl formamide and polyacrylamide at normal temperature and pressure by stirring, the obtained solvent is applied to the production technology of the CCL, the dielectric property and the mechanical property of the CCL can be improved, at the same time, the service life of the adhesive layer is prolonged and the use performance of the adhesive layer is improved, the curing time of the adhesive is easy to master, and the adhesive force of the adhesive is improved simultaneously.
Description
Technical field
The present invention relates to copper-clad plate production technical field, more particularly to a kind of politef high-frequency microwave copper-clad plate is molten
Agent material formula.
Background technology
Also known as base material, it is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., is soaked with resin, and single or double covers for copper-clad plate
With Copper Foil, referred to as a kind of board-like material of Jing hot pressing, copper-clad laminate.It is the stock for being PCB, is often base
Material, when it is used for multi-layer sheet produces, is also central layer.Copper-clad plate is divided into according to mechanical rigid：Rigid plate, flex plate；According to not
It is divided into insulating material structure：Organic resin class copper-clad plate, metal-based copper-clad plate, ceramic base copper-clad plate；It is divided into according to thickness：Often
Straightedge and thin plate, wherein thickness are thin plate less than 0.5mm；It is divided into according to reinforcing material：Glass cloth base copper-clad plate, paper substrate cover copper
Plate, composite-based copper clad plate；It is divided into according to some properties：High TG plates, high dielectric property are done, uv blocking plate.Copper-clad plate is mainly used
In printed circuit board is made, manufacture for various Military Electronic Equipments, communication equipment, computer, automotive electronics, household electrical appliance etc.
Industry.With the development of global electronic information industry, the demand rapid growth to copper-clad plate, the high-speed developing period is entered.With this
Meanwhile, domestic electronics and information industry simultaneous growth, copper-clad plate market growth rate exceed the average speedup in the world, present for many years prosperous
The growth of Sheng.In the production process of copper-clad plate, need to apply to solvent, but solvent composition of the prior art is more
It is single, the service life and performance of adhesive layer in the manufacture process of copper-clad plate, can be affected so that when adhesive solidifies
Between be difficult grasp, while reducing the adhesive force of adhesive.
The content of the invention
The present invention is in order to overcome deficiency of the prior art, there is provided a kind of politef high-frequency microwave copper-clad plate it is molten
Agent material formula.
The present invention is to be achieved through the following technical solutions：
A kind of solvent material formula of politef high-frequency microwave copper-clad plate, described copper-clad plate include adhesive layer, base material
Layer, copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent,
The solvent is made up of the component of following weight portion：Glutaric Acid Dimethyl ester 8-15 parts, fatty alcohol-polyoxyethylene ether 6-20 parts, alkyl
Alkylolamides 4-15 parts, polyvinylpyrrolidone 5-16 parts, rosin resin 5-19 parts, methyl tributanoximo silane 6-18 parts, three
Ethylene tetramine 10-25 parts, dimethyl adipate 15-25 parts, dimethylformamide 7-20 parts and polyacrylamide 10-15 parts.
Further, the solvent is made up of the component of following weight portion：8 parts of Glutaric Acid Dimethyl ester, fatty alcohol polyoxy second
6 parts of alkene ether, 4 parts of alkylolamideses, 5 parts of polyvinylpyrrolidone, 5 parts of rosin resin, 6 parts of methyl tributanoximo silane, three
10 parts of 10 parts of ethylene tetramine, 15 parts of dimethyl adipate, 7 parts of dimethylformamide and polyacrylamide.
Further, the solvent is made up of the component of following weight portion：15 parts of Glutaric Acid Dimethyl ester, fatty alcohol polyoxy second
20 parts of alkene ether, 15 parts of alkylolamideses, 16 parts of polyvinylpyrrolidone, 19 parts of rosin resin, methyl tributanoximo silane 18
Part, 25 parts of triethylene tetramine, 25 parts of dimethyl adipate, 20 parts of dimethylformamide and 15 parts of polyacrylamide.
Further, the solvent is made up of the component of following weight portion：12 parts of Glutaric Acid Dimethyl ester, fatty alcohol polyoxy second
15 parts of alkene ether, 9 parts of alkylolamideses, 12 parts of polyvinylpyrrolidone, 14 parts of rosin resin, methyl tributanoximo silane 15
Part, 20 parts of triethylene tetramine, 20 parts of dimethyl adipate, 13 parts of dimethylformamide and 12 parts of polyacrylamide.
Compared with prior art, the invention has the beneficial effects as follows：The present invention by by the solvent in adhesive layer by penta
Acid dimethyl, fatty alcohol-polyoxyethylene ether, alkylolamideses, polyvinylpyrrolidone, rosin resin, methyl tributanoximo
Silane, triethylene tetramine, dimethyl adipate, dimethylformamide and polyacrylamide stir at normal temperatures and pressures mixing and
Into the solvent for obtaining is applied in the middle of the production technology of copper-clad plate, it is possible to increase the dielectric properties of copper-clad plate, mechanical property,
The service life and performance of adhesive layer are improved simultaneously so that adhesive is easily mastered hardening time, while improve glue
The adhesive force of glutinous agent.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below the present invention is carried out further
Describe in detail.It should be appreciated that specific embodiment described herein is not used to limit this only to explain the present invention
It is bright.
Embodiment one：
A kind of solvent material formula of politef high-frequency microwave copper-clad plate, described copper-clad plate include adhesive layer, base material
Layer, copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent,
The solvent is made up of the component of following weight portion：8 parts of Glutaric Acid Dimethyl ester, 6 parts of fatty alcohol-polyoxyethylene ether, alkylolamideses
4 parts, 5 parts of polyvinylpyrrolidone, 5 parts of rosin resin, 6 parts of methyl tributanoximo silane, 10 parts of triethylene tetramine, adipic acid
10 parts of 15 parts of dimethyl ester, 7 parts of dimethylformamide and polyacrylamide.
Embodiment two：
A kind of solvent material formula of politef high-frequency microwave copper-clad plate, described copper-clad plate include adhesive layer, base material
Layer, copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent,
The solvent is made up of the component of following weight portion：15 parts of Glutaric Acid Dimethyl ester, 20 parts of fatty alcohol-polyoxyethylene ether, alkylol acyl
15 parts of amine, 16 parts of polyvinylpyrrolidone, 19 parts of rosin resin, 18 parts of methyl tributanoximo silane, 25 parts of triethylene tetramine,
15 parts of 25 parts of dimethyl adipate, 20 parts of dimethylformamide and polyacrylamide.
Embodiment three：
A kind of solvent material formula of politef high-frequency microwave copper-clad plate, described copper-clad plate include adhesive layer, base material
Layer, copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent,
The solvent is made up of the component of following weight portion：12 parts of Glutaric Acid Dimethyl ester, 15 parts of fatty alcohol-polyoxyethylene ether, alkylol acyl
9 parts of amine, 12 parts of polyvinylpyrrolidone, 14 parts of rosin resin, 15 parts of methyl tributanoximo silane, 20 parts of triethylene tetramine,
12 parts of 20 parts of dimethyl adipate, 13 parts of dimethylformamide and polyacrylamide.
The present invention by by the solvent in adhesive layer by Glutaric Acid Dimethyl ester, fatty alcohol-polyoxyethylene ether, alkylol acyl
Amine, polyvinylpyrrolidone, rosin resin, methyl tributanoximo silane, triethylene tetramine, dimethyl adipate, dimethyl
Methanamide and polyacrylamide are stirred at normal temperatures and pressures and are mixed, and the solvent for obtaining is applied to the production work of copper-clad plate
In the middle of skill, it is possible to increase the dielectric properties of copper-clad plate, mechanical property, while improving the service life and usability of adhesive layer
Can so that adhesive is easily mastered hardening time, while improve the adhesive force of adhesive.
Wherein, the chemical formula of Glutaric Acid Dimethyl ester is：C7H12O4It is a kind of liquid with micro-perfume gas, its boiling point is 214
DEG C (0.9MPa), is highly soluble in ether and alcohol.
Fatty alcohol-polyoxyethylene ether (AEO), is also called polyoxyethylene aliphatic alcohol ether.It is development in nonionic surfactant
The most maximum kind of fast, consumption.Such surfactant is by Polyethylene Glycol（PEG）With fatty alcohol condensation
Ether, has different kinds because the degree of polymerization of Polyethylene Glycol is different with the species of fatty alcohol.
Alkylolamideses are stable in acid, alkali.Wetting power, emulsifying ability are big.In mixed people's soap, foaming power can be improved, cleaned
Power, stability in hard water.Produced by fatty acid Loral and diethanolamine 2mnl heating.For a kind of nonionic surfactant, can be used as
Detergent, wetting agent, emulsifying row.
Polyvinylpyrrolidone abbreviation PVP, is a kind of non-ionic macromolecule compound, is N- vinylamide Type of Collective
It is most characteristic in thing, and it is studied most deep, extensive fine chemicals kind.Have evolved into nonionic, cation, it is cloudy from
Sub 3 big class, technical grade, pharmaceutical grade, 3 kinds of specifications of food stage, relative molecular mass from it is thousands of to more than 1,000,000 homopolymer, altogether
Polymers and crosslinking series of polymers product.
Rosin resin is a kind of light color, through high polymeric（Dimerization）High softening-point, high viscosity, it is and preferably anti-
Oxidisability, and complete resistive connection is brilliant in a liquid state or in solution, and its multiple use includes paint, desiccant, synthesis
Resin, automobile ink, floor tile, rubber composition, scaling powder, solder(ing) paste, and various adhesive and protective coating.
No. CAS of trien is 112-24-3, and molecular formula is C6H18N4, which has strong basicity and moderate tack
Light yellow liquid.Trien in addition to solvent is made is additionally operable to manufacture epoxy curing agent, metal-chelator and synthesis
Polyamide and ion exchange resin etc..
Dimethyl adipate, also known as adipic acid double methyl ester, adipic acid dimethyl esters, is a kind of colourless transparent liquid, and its fusing point is 8 °
C, boiling point be 109-110 DEG C (14 mmHg), 228.7 DEG C (760 mmHg), it is water insoluble, alcohol, ether can be dissolved in, belong to lower toxicity
Material, is industrially mainly used in the raw material of synthetic intermediate, medicine, spice, as plasticizer and high boiling solvent etc..
Dimethylformamide（DMF）It is a kind of transparency liquid, can dissolves each other with water and most of organic solvent.It is chemical anti-
The common solvent answered.Absolute dimethylformamide is that do not have odorous, but technical grade or rotten dimethylformamide then have fish raw meat
Taste, because which contains the impurity of dimethyl amine.
Polyacrylamide classification polyacrylamide Products：Polyacrylamide（PAM）For high molecular weight water soluble polymer,
Insoluble in most of organic solvents, with good flocculability, the frictional resistance between liquid can be reduced, by ion characteristic point
Nonionic, anion, four type of cation and amphoteric can be divided into.
Ultimate principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
It should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and description is only the present invention to personnel
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements are both fallen within scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (4)
1. the solvent material formula of politef high-frequency microwave copper-clad plate, described copper-clad plate include adhesive layer, substrate layer,
Copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, and which is special
Levy and be, the solvent is made up of the component of following weight portion：Glutaric Acid Dimethyl ester 8-15 parts, fatty alcohol-polyoxyethylene ether 6-20
Part, alkylolamideses 4-15 parts, polyvinylpyrrolidone 5-16 parts, rosin resin 5-19 parts, methyl tributanoximo silane 6-
18 parts, triethylene tetramine 10-25 parts, dimethyl adipate 15-25 parts, dimethylformamide 7-20 parts and polyacrylamide 10-
15 parts.
2. the solvent material formula of politef high-frequency microwave copper-clad plate according to claim 1, it is characterised in that institute
State solvent to be made up of the component of following weight portion：8 parts of Glutaric Acid Dimethyl ester, 6 parts of fatty alcohol-polyoxyethylene ether, alkylolamideses 4
Part, 5 parts of polyvinylpyrrolidone, 5 parts of rosin resin, 6 parts of methyl tributanoximo silane, 10 parts of triethylene tetramine, adipic acid
10 parts of 15 parts of dimethyl ester, 7 parts of dimethylformamide and polyacrylamide.
3. the solvent material formula of politef high-frequency microwave copper-clad plate according to claim 1, it is characterised in that institute
State solvent to be made up of the component of following weight portion：15 parts of Glutaric Acid Dimethyl ester, 20 parts of fatty alcohol-polyoxyethylene ether, alkylolamideses
15 parts, 16 parts of polyvinylpyrrolidone, 19 parts of rosin resin, 18 parts of methyl tributanoximo silane, 25 parts of triethylene tetramine, oneself
15 parts of 25 parts of acid dimethyl, 20 parts of dimethylformamide and polyacrylamide.
4. the solvent material formula of politef high-frequency microwave copper-clad plate according to claim 1, it is characterised in that institute
State solvent to be made up of the component of following weight portion：12 parts of Glutaric Acid Dimethyl ester, 15 parts of fatty alcohol-polyoxyethylene ether, alkylolamideses
9 parts, 12 parts of polyvinylpyrrolidone, 14 parts of rosin resin, 15 parts of methyl tributanoximo silane, 20 parts of triethylene tetramine, oneself
12 parts of 20 parts of acid dimethyl, 13 parts of dimethylformamide and polyacrylamide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268852.4A CN106634670A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268852.4A CN106634670A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106634670A true CN106634670A (en) | 2017-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611268852.4A Pending CN106634670A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula for polytetrafluoroethylene high-frequency microwave copper-clad plate (CCL) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111154332A (en) * | 2020-01-22 | 2020-05-15 | 江西服装学院 | Printing ink and preparation method thereof |
| CN112619204A (en) * | 2020-12-31 | 2021-04-09 | 浙江锦华新材料股份有限公司 | Deep dehydration drying agent and application thereof in synthesis of methyl tributyl ketoxime silane |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102689463A (en) * | 2012-05-28 | 2012-09-26 | 珠海亚泰电子科技有限公司 | Flexible copper-clad plate |
| CN104325774A (en) * | 2014-08-20 | 2015-02-04 | 杭州福斯特光伏材料股份有限公司 | Preparation method of dual-layer glue-free type double-face flexible copper-clad plate |
-
2016
- 2016-12-31 CN CN201611268852.4A patent/CN106634670A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102689463A (en) * | 2012-05-28 | 2012-09-26 | 珠海亚泰电子科技有限公司 | Flexible copper-clad plate |
| CN104325774A (en) * | 2014-08-20 | 2015-02-04 | 杭州福斯特光伏材料股份有限公司 | Preparation method of dual-layer glue-free type double-face flexible copper-clad plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111154332A (en) * | 2020-01-22 | 2020-05-15 | 江西服装学院 | Printing ink and preparation method thereof |
| CN112619204A (en) * | 2020-12-31 | 2021-04-09 | 浙江锦华新材料股份有限公司 | Deep dehydration drying agent and application thereof in synthesis of methyl tributyl ketoxime silane |
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Application publication date: 20170510 |
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