CN106686900A - Method for processing printed circuit board by using calixarene - Google Patents
Method for processing printed circuit board by using calixarene Download PDFInfo
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- CN106686900A CN106686900A CN201710103587.2A CN201710103587A CN106686900A CN 106686900 A CN106686900 A CN 106686900A CN 201710103587 A CN201710103587 A CN 201710103587A CN 106686900 A CN106686900 A CN 106686900A
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- substrate
- circuit board
- printed circuit
- calixarenes
- liquid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for processing a printed circuit board by using calixarene. The method comprises the following steps of (a) adding the calixarene and an organic solvent to a container with a stirring device at a room temperature and atmospheric pressure and lastingly stirring to obtain a printing liquid; (b) carrying out treatment of drilling, cleaning and the like on a substrate and putting the substrate on one screen printing machine; (c) adding the printing liquid to the screen printing machine and rubbing the substrate with the printing liquid; (d) putting the substrate in the environments of the room temperature and the atmospheric pressure, naturally airing for later use and forming a printing liquid layer by the printing liquid on the substrate; (e) putting the substrate on a screen printing table of another screen printing machine, adding liquid silver paste to the screen printing machine and rubbing the printing liquid layer with the silver paste; and (f) putting the substrate obtained in the step (e) into an oven for baking, and naturally cooling to obtain the printed circuit board. The method for processing the printed circuit board by using the calixarene is high in environmental protection property, the adhesive force of silver particles on the substrate can be improved and the impedance of a conducting circuit can be reduced.
Description
Technical field
The present invention relates to a kind of manufacture field of printed circuit board, it is specifically a kind of not only there is good environmental-protecting performance but also
Possesses the method that the utilization calixarenes of excellent quality stability processes printed circuit board.
Background technology
With economic continuous development, printed circuit board is also increasingly wide in the application of the industries such as household electrical appliance, industrial electronic
It is general.Because printed circuit board has processing cost, extremely strong industrial repeatability, automaticity and life that electronic product can be greatly reduced
The higher advantage of efficiency is produced, so it is favored by vast electrical equipment, electron trade producer deeply.However, existing printed circuit board
There are two great technological deficiencies in production process.First, traditional printed circuit board is generally processed using Subtraction method, its
Mainly it is made up of operations such as cleaning, press mold, development, etching and stripings.Due to the Reusability industrial chemicals on base material plate body, because
And the environmental contaminants of substantial amounts of heavy metal, high concentrated acid, alkali etc. can be produced in the process of printed circuit board.When above-mentioned
When pollutant is directly discharged toward the external world, the ecological environment around its meeting heavy damage, so traditional printed circuit board production category
Heavily contaminated processing industry.Second, the technique of traditional Subtraction method production printed circuit board (PCB) can not only consume substantial amounts of metal money
Source, can also consume the substantial amounts of energy, and need to carry out environmental protection treatment to waste material in following process.So, Subtraction method adds
Work printed circuit board is a kind of industry of labour's highly dense, in addition to it is more the step of there is whole processing,
Also need to plus man-hour carry out a certain degree of staff operation, cause the production cost of printed circuit board (PCB) all the time can not significantly under
Drop, and its working (machining) efficiency is relatively low.
In order to solve the problems, such as that pollutant discharge amount is larger, the silk-screen printing technique of circuit board is occurred in that in the market.
It utilizes printing plate that the line map of electrically conductive ink is printed to substrate, and small copper particle is solidificated in electrically conductive ink by plating
On, so as to form the conducting wire on substrate.Electricity is printed as Chinese patent literature CN102612269A discloses a kind of all print
The preparation method of road plate, it utilizes the principle of serigraphy that the line map that electrically conductive ink is constituted is printed to substrate, and passes through
Electroplating line figure makes copper particle adhere on line map, to form conductive circuit diagram on substrate.Although the method can be from one
Determine to solve the problems, such as that pollutant is discharged in a large number in degree, but, although although plating belongs to electrochemical process, copper particle is still
It is to realize that it is fixed on substrate by the way of physical adherence, thus adhesive force of the copper particle on substrate is relatively low.Meanwhile, copper
Simple substance can be directly exposed in the external world when sticking to substrate, and the circuit for causing circuit board is easy to occur aoxidizing come off with copper particle
Situation, so as to considerably increase the impedance of circuit.
In fact, when in the manufacturing process of printed circuit board, occurring the feelings of conducting wire broken string due to manufacturing deficiency
Condition Jing often occurs.Traditional solution is that printed circuit board is placed on independent benefit line machine, first removes the protection on circuit
Oil, then strikes off the copper particle around at broken string, then carries out mending line operation.But, traditional benefit line method equally occurs benefit
The copper particle relatively low problem of adhesive force on substrate again at line, and mend the operation of line and need individually to carry out, so as to cause printed circuit
The working (machining) efficiency of plate declines to a great extent.
Additionally, in the comparison of conductance, silver has the electric conductivity more more outstanding than copper.But due to Conventional abatement method and
Stencil can cause the waste of a large amount of metal materials, and silver belongs to precious metal, so it fails all the time in printed circuit
It is widely used in the processing of plate.Therefore, how to manufacture it is a kind of both possessed excellent conductance, and can effective control its be processed into
This silver wire circuit board, the always significant technology issues of printed circuit board (PCB) manufacture field.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of feature of environmental protection is strong and can reduce metal material
The method that the utilization calixarenes of waste processes printed circuit board.
Another object of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of conduction that can effectively prevent on substrate
There is oxidation and reduces the method that the utilization calixarenes of conducting wire impedance processes printed circuit board in circuit.
What the goal of the invention of the present invention was realized in：A kind of method that utilization calixarenes processes printed circuit board, it is special
Levy and be：The method for making printed circuit board comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 10-30 minutes, mass percent of the calixarenes in printed liquid is 2-20%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for (2-6):1；
F) step e gained substrate is placed in baking box, is toasted 30-200 minutes at 80-200 DEG C, then naturally cooled to
The printed circuit board that calixarenes can be utilized to make after room temperature.
Furtherly, the calixarenes in step a be cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons in one kind or with
Arbitrary proportion mixes.
Furtherly, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；
Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.
Furtherly, the organic solvent in step a is the one kind or mixed with arbitrary proportion in toluene, dimethylbenzene or styrene
Close.
Furtherly, printed circuit board is again placed on the screen printing table of screen printer after the completion of step f, and toward screen printer
The silver paste of liquid is added, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and cup virtue in silver paste
The mass ratio of hydrocarbon is (8-12):1.
Furtherly, after the completion of secondary printing, gained substrate is placed in baking box, is toasted at 120-200 DEG C
100-250 minutes, then printed circuit board is obtained by naturally cooling to after room temperature.
Furtherly, silver paste is nanometer-level silver slurry in step e, and the particle diameter of silver particles is 50-90 nanometers.
The present invention is improved to the production technology of the printed circuit board of prior art, and its advantage is as follows：
1st, in the method for utilization calixarenes of the invention processing printed circuit board, calixarenes is employed as silver particles in base
Carrier on plate.First, calixarenes have multidimensional can complexed active key, its except can with baseplate material occur complex reaction
Outward, moreover it is possible to the silver particles being complexed in silver paste, the attachment structure of two-way complexing is formed.The two-way chelation structure can make silver particles exist
Complexing power on substrate persistently by chemical bond rank is acted on, and is truly realized silver particles being connected chemically on non-metal base plate,
So as to greatly improving adhesive force of the silver particles on substrate, it is to avoid the feelings for coming off occur on the circuit for printing in silver particles
Condition.Secondly, calixarenes itself has the adjustable molecule cavity of size, can be according to silver particles when complex reaction is produced with silver particles
Particle size adjust molecule cavity receiving space, with eliminate between silver particles complexing when space steric effect, so as to
Close-packed arrays of the silver particles on printing liquid layer are realized, uniform complex silver continuous phase is formed, substrate is greatly improved and is reached the standard grade
The electric conductivity on road.
2nd, in the method for utilization calixarenes of the invention processing printed circuit board, silver particles are on substrate in the way of being complexed
Formed with printing liquid layer and be connected chemically structure.First, this is connected chemically structure and can greatly improve silver particles in whole circuit board print
Utilization rate during system, effectively reduces loss and consumption of the silver in the whole process of printed circuit board, real real
Popularization of the silver in printed circuit board processing industry is showed, so as to reduce processing cost when circuit board prints, and has significantly carried
The monolithic conductive performance of elevated track.Secondly, after being complexed with calixarenes, its chemical reactivity declines to a great extent silver particles, so as to
Effectively reduce the oxidation reaction that silver particles exposure occurs in atmosphere, it is to avoid conducting wire makes circuit produce impedance because of oxidation
The phenomenon of increase.
3rd, in the method for utilization calixarenes of the invention processing printed circuit board, printed liquid and silver paste employ print by several times
The mode of brush is processed.Printing by several times also achieves printing in addition to it can ensure that printed liquid and carry out completely with the complex reaction of substrate
Liquid forms two grades of complexings between substrate and silver paste, so as to improve the compactness that silver particles are arranged in printing layer.
4th, in the method for utilization calixarenes of the invention processing printed circuit board, after silver paste is completed for printing, can be with
Secondary printing is carried out to substrate using concentration higher silver paste.Secondary printing can ensure that silver particles are complete with what printed liquid was complexed
Property, and silver particles cavity, missing point of generation etc. in one-step print are repaired, it is equal on substrate so as to improve silver particles
Even property and compactness, improve the electric conductivity of circuit.
5th, utilization calixarenes of the invention is made in the method for printed circuit board, using high concentration silver paste to printed circuit board
Carry out secondary printing.First, highdensity complex reaction is produced with printed liquid by the excessive silver particles of silver paste, to repair in print
Circuit board processed adds the defect such as open circuit, circuit defect for producing in man-hour, ensures that the complete of conducting wire on printed circuit board
Property and electric conductivity.Secondly, secondary printing can be carried out on the screen printer of initial production, so in printing without the need for printing
Circuit board carries out the operation such as extra positioning, calibration, significantly reduces the difficulty of circuit mending, and so as to effectively be lifted electricity is printed
The working (machining) efficiency of road plate.
Specific embodiment
The method that the utilization calixarenes of the present invention processes printed circuit board, it is characterised in that：The making printed circuit board
Method comprise the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 10-30 minutes, mass percent of the calixarenes in printed liquid is 2-20%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for (2-6):1；
F) step e gained substrate is placed in baking box, is toasted 30-200 minutes at 80-200 DEG C, then naturally cooled to
The printed circuit board that calixarenes can be utilized to make after room temperature.
Wherein, the calixarenes in step a is for the one kind in cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons or with any
Ratio mixes.The multidimensional having using calixarenes can complexed active structure so as to can respectively with baseplate material and silver paste in
There is complex reaction in silver particles, form the two-way complexing attachment structure with calixarenes as basic point.The two-way chelation structure makes silver granuel
Complexing power of the son persistently by chemical bond rank on substrate is acted on, and realizes silver particles being connected chemically on non-metal base plate,
So as to lifting adhesive force of the silver particles on substrate, it is to avoid situation about coming off occur on the circuit for printing in silver particles.This
Outward, because cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons itself have the adjustable molecule cavity of size, producing with silver particles
The receiving space of molecule cavity can be adjusted during raw complex reaction according to the particle size of silver particles, it is achieved thereby that silver particles are in print
Close-packed arrays on brush liquid layer, form uniform complex silver continuous phase, improve the electric conductivity of circuit on substrate.In the present invention
In, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to uncle
Butyl cup [8] aromatic hydrocarbons.Said components have symmetrical chelation structure with phenyl ring as basic point, be effectively improved its respectively with baseplate material
With the stability of silver particles complexing.
In addition, the organic solvent in step a is the one kind in toluene, dimethylbenzene or styrene or is mixed with arbitrary proportion.
Above-mentioned solvent has approximate benzene ring structure with calixarenes, and it can produce outstanding dissolving according to similar compatibility principle to calixarenes
Effect, so as to improve uniformity of the calixarenes in printed liquid.
After the completion of step f of the present invention, printed circuit board can be again placed on the screen printing table of screen printer, and toward silk-screen
The silver paste of liquid is added in machine, again secondary printing is carried out to printed circuit board according to line requirements, silver granuel in silver paste
Son is (8-12) with the mass ratio of calixarenes:1.By the ratio of silver particles and calixarenes using excessive complexing mode, silver granuel is made
Son can as far as possible with calixarenes produce complex reaction, so as to lifted complexing after the completion of silver particles than table density, with to once
Silver particles cavity, missing point produced in printing etc. is repaired, and improves uniformity and compactness of the silver particles on substrate.
After the completion of secondary printing, gained substrate can be placed in baking box, and 100-250 is toasted at 120-200 DEG C
Minute, then printed circuit board is obtained by naturally cooling to after room temperature.By the basal temperature and baking time that lift baking, can carry
The complex reaction activity of silver particles and calixarenes in silver paste is risen, makes to occur in whole complex system that density is high, fireballing network
Reaction is closed, and the space steric effect between silver particles in complexing can be eliminated, further lifting silver particles are on printing liquid layer
The compactness of arrangement.
Additionally, present invention utilizes high concentration silver paste carries out secondary printing to printed circuit board.By the excessive silver of silver paste
Particle produces highdensity complex reaction with printed liquid, to repair the open circuit, the circuit defect that add man-hour generation in printed circuit board
Etc. defect, the integrality and electric conductivity of conducting wire on printed circuit board are ensured that.Meanwhile, secondary printing can be first
Carry out on the screen printer of beginning production, so in printing without the need for carry out the operation such as extra positioning, calibration to printed circuit board plate,
The difficulty of circuit mending is significantly reduced, so as to effectively lift the working (machining) efficiency of printed circuit board.
In step e of the present invention, silver paste can adopt nanometer-level silver slurry, and the particle diameter of silver particles is 50-90 nanometers.Upper
Under stating particle size range, silver particles have extremely outstanding ductility, and with excellent mechanical performance.Additionally, the particle size range
Under silver particles be also equipped with the advantages of deformation is uniform, bonding strength is high, so as to give circuit good inclusion characteristic, can improve logical
Bonding strength of the electric line on substrate.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 0.8-6 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And immersed solder test in its
Wetting state is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 220-250 DEG C of heating.
Each embodiment for being processed the method for printed circuit board using calixarenes to the present invention below is described in detail, but
Therefore do not limit the invention in the scope of embodiments：
Embodiment 1
The method of the making printed circuit board of the present invention comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 10 minutes, mass percent of the calixarenes in printed liquid is 2%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for 2:1；
F) step e gained substrate is placed in baking box, is toasted 30 minutes at 80 DEG C, then naturally cooled to after room temperature i.e.
The printed circuit board that calixarenes can be utilized to make.
Calixarenes wherein in step a is cup [4] aromatic hydrocarbons, and cup [4] aromatic hydrocarbons can adopt 4- tert-butyl group p tertButylcalixarenes；And
Organic solvent in step a can adopt toluene.
Additionally, printed circuit board can be again placed on the screen printing table of screen printer after the completion of step f, and add toward screen printer
Enter the silver paste of liquid, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and calixarenes in silver paste
Mass ratio be 8:1.And work as after the completion of secondary printing, gained substrate is placed in baking box, toast 100 minutes at 120 DEG C,
Printed circuit board is obtained by naturally cooling to again after room temperature.
In addition, silver paste is nanometer-level silver slurry in step e, the particle diameter of silver particles is 90 nanometers.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 6 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder test
State is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 220 DEG C of heating.
Embodiment 2
The method of the making printed circuit board of the present invention comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 30 minutes, mass percent of the calixarenes in printed liquid is 20%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for 6:1；
F) step e gained substrate is placed in baking box, is toasted 200 minutes at 200 DEG C, then naturally cooled to after room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes wherein in step a is the arbitrary proportion mixture of cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.
Specifically, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons be
To tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a is toluene, dimethylbenzene or cinnamic arbitrary proportion mixture.
Additionally, printed circuit board can be again placed on the screen printing table of screen printer after the completion of step f, and add toward screen printer
Enter the silver paste of liquid, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and calixarenes in silver paste
Mass ratio be 12:1.And work as after the completion of secondary printing, gained substrate is placed in baking box, 250 points are toasted at 200 DEG C
Clock, then printed circuit board is obtained by naturally cooling to after room temperature.
In addition, silver paste is nanometer-level silver slurry in step e, the particle diameter of silver particles is 50 nanometers.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 0.8 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And it moistens in immersed solder test
Wet condition is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 250 DEG C of heating.
Embodiment 3
The method of the making printed circuit board of the present invention comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 15 minutes, mass percent of the calixarenes in printed liquid is 8%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for 3:1；
F) step e gained substrate is placed in baking box, is toasted 80 minutes at 100 DEG C, then naturally cooled to after room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes wherein in step a is the arbitrary proportion mixture of cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.Specifically, cup
[6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a
For toluene, the arbitrary proportion mixture of dimethylbenzene.
Additionally, printed circuit board can be again placed on the screen printing table of screen printer after the completion of step f, and add toward screen printer
Enter the silver paste of liquid, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and calixarenes in silver paste
Mass ratio be 9:1.And work as after the completion of secondary printing, gained substrate is placed in baking box, toast 150 minutes at 140 DEG C,
Printed circuit board is obtained by naturally cooling to again after room temperature.
In addition, silver paste is nanometer-level silver slurry in step e, the particle diameter of silver particles is 80 nanometers.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 4 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder test
State is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 230 DEG C of heating.
Embodiment 4
The method of the making printed circuit board of the present invention comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 20 minutes, mass percent of the calixarenes in printed liquid is 14%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for 4:1；
F) step e gained substrate is placed in baking box, is toasted 110 minutes at 110 DEG C, then naturally cooled to after room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes wherein in step a is the arbitrary proportion mixture of cup [4] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.Specifically, cup
[4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a
For toluene and cinnamic arbitrary proportion mixture.
Additionally, printed circuit board can be again placed on the screen printing table of screen printer after the completion of step f, and add toward screen printer
Enter the silver paste of liquid, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and calixarenes in silver paste
Mass ratio be 10:1.And work as after the completion of secondary printing, gained substrate is placed in baking box, 200 points are toasted at 180 DEG C
Clock, then printed circuit board is obtained by naturally cooling to after room temperature.
In addition, silver paste is nanometer-level silver slurry in step e, the particle diameter of silver particles is 70 nanometers.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 3 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder test
State is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 240 DEG C of heating.
Embodiment 5
The method of the making printed circuit board of the present invention comprises the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and are persistently stirred
Printed liquid is obtained by mixing 25 minutes, mass percent of the calixarenes in printed liquid is 18%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to base according to line requirements
On plate；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid is in substrate
It is upper to form printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer
Material, embrocates silver paste to the printing liquid layer of substrate according still further to line requirements, the quality of silver particles and calixarenes in silver paste
Than for 5:1；
F) step e gained substrate is placed in baking box, is toasted 180 minutes at 180 DEG C, then naturally cooled to after room temperature
The printed circuit board that calixarenes can be utilized to make.
Calixarenes wherein in step a is the arbitrary proportion mixture of cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons.
Specifically, cup [4] aromatic hydrocarbons is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons be
To tert-butyl-calix [8] aromatic hydrocarbons.And the organic solvent in step a is toluene, dimethylbenzene or cinnamic arbitrary proportion mixture.
Additionally, printed circuit board can be again placed on the screen printing table of screen printer after the completion of step f, and add toward screen printer
Enter the silver paste of liquid, secondary printing is carried out to printed circuit board according still further to line requirements, silver particles and calixarenes in silver paste
Mass ratio be 11:1.And work as after the completion of secondary printing, gained substrate is placed in baking box, 240 points are toasted at 190 DEG C
Clock, then printed circuit board is obtained by naturally cooling to after room temperature.
In addition, silver paste is nanometer-level silver slurry in step e, the particle diameter of silver particles is 60 nanometers.
Resistivity, adhesive force are carried out respectively to the printed circuit board made by the employing present invention according to IPC-TM-650 standards
With welding performance test, this utilization invention method obtained in printed circuit board (PCB) same units length conduction apart under, its
Resistivity is 2 Ω .mm2/m；3M seccotine adhesive force test result is without there is peeling；And its wetting in immersed solder test
State is good and the phenomenon such as bubbles, is layered, burns and changes colour without appearance after 240 DEG C of heating.
Claims (7)
1. a kind of method that utilization calixarenes processes printed circuit board, it is characterised in that：The method for making printed circuit board
Comprise the steps：
(1) preparation of printed liquid
A) under normal temperature and pressure, calixarenes and organic solvent are separately added in the container with agitating device, and persistently stir 10-
Printed liquid can be obtained within 30 minutes, mass percent of the calixarenes in printed liquid is 2-20%；
(2) substrate pre-treatment
B) substrate drilled according to line requirements, cleaned etc. and being processed, and substrate is placed on the screen printing table of screen printer；
C) a steps gained printed liquid is added in the screen printer of b step, and printed liquid is embrocated to substrate according to line requirements
On；
D) step c gained substrate is placed in the environment of normal temperature and pressure, standby after it dries naturally, printed liquid shape on substrate
Into printing liquid layer；
(3) the circuit printing of substrate
E) Step d gained substrate is placed on the screen printing table of another screen printer, and the silver paste of liquid is added toward screen printer, then
Silver paste is embrocated to the printing liquid layer of substrate according to line requirements, silver particles are with the mass ratio of calixarenes in silver paste
(2-6):1；
F) step e gained substrate is placed in baking box, is toasted 30-200 minutes at 80-200 DEG C, then naturally cool to room temperature
The printed circuit board that calixarenes can be utilized to make afterwards.
2. the method for processing printed circuit board using calixarenes according to claim 1, it is characterised in that：In step a
Calixarenes be cup [4] aromatic hydrocarbons, cup [6] aromatic hydrocarbons and cup [8] aromatic hydrocarbons in one kind or with arbitrary proportion mixing.
3. the method for processing printed circuit board using calixarenes according to claim 2, it is characterised in that：Cup [4] virtue
Hydrocarbon is 4- tert-butyl group p tertButylcalixarenes；Cup [6] aromatic hydrocarbons is to tert-butyl-calix [6] aromatic hydrocarbons；Cup [8] aromatic hydrocarbons is to tert-butyl-calix [8] virtue
Hydrocarbon.
4. the method for processing printed circuit board using calixarenes according to claim 1, it is characterised in that：In step a
Organic solvent be toluene, dimethylbenzene or styrene in one kind or with arbitrary proportion mixing.
5. the method for processing printed circuit board using calixarenes according to claim 1, it is characterised in that：Step f is complete
Printed circuit board is again placed on the screen printing table of screen printer into rear, and the silver paste of liquid is added toward screen printer, according still further to
Line requirements carry out secondary printing to printed circuit board, and silver particles and the mass ratio of calixarenes are (8-12) in silver paste:1.
6. the method for processing printed circuit board using calixarenes according to claim 5, it is characterised in that：The secondary printing
After the completion of, gained substrate is placed in baking box, toast 100-250 minutes at 120-200 DEG C, then naturally cool to after room temperature
Printed circuit board can be obtained.
7. the method for processing printed circuit board using calixarenes according to claim 1, it is characterised in that：In step e
Silver paste is nanometer-level silver slurry, and the particle diameter of silver particles is 50-90 nanometers.
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| CN201710103587.2A CN106686900B (en) | 2017-02-24 | 2017-02-24 | A method of printed circuit board is processed using calixarenes |
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| CN201710103587.2A CN106686900B (en) | 2017-02-24 | 2017-02-24 | A method of printed circuit board is processed using calixarenes |
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| CN106686900B CN106686900B (en) | 2019-06-25 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1927526A (en) * | 2006-09-28 | 2007-03-14 | 昆山成利焊锡制造有限公司 | Leadless solder for electronic industry and preparation method |
| CN101525745A (en) * | 2009-04-03 | 2009-09-09 | 四川大学 | Metal surface treatment agent and printed wiring board with protecting film formed thereby |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| JP2013067697A (en) * | 2011-09-21 | 2013-04-18 | Dic Corp | Naphthol resin, curable resin composition, its cured product, and printed circuit board |
| JP2014024977A (en) * | 2012-07-27 | 2014-02-06 | Dic Corp | Curable resin composition, cured product and printed wiring board |
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2017
- 2017-02-24 CN CN201710103587.2A patent/CN106686900B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1927526A (en) * | 2006-09-28 | 2007-03-14 | 昆山成利焊锡制造有限公司 | Leadless solder for electronic industry and preparation method |
| CN101525745A (en) * | 2009-04-03 | 2009-09-09 | 四川大学 | Metal surface treatment agent and printed wiring board with protecting film formed thereby |
| JP2013067697A (en) * | 2011-09-21 | 2013-04-18 | Dic Corp | Naphthol resin, curable resin composition, its cured product, and printed circuit board |
| CN102612269A (en) * | 2012-04-01 | 2012-07-25 | 鞍山市正发电路有限公司 | All-printed circuit board |
| JP2014024977A (en) * | 2012-07-27 | 2014-02-06 | Dic Corp | Curable resin composition, cured product and printed wiring board |
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| Publication number | Publication date |
|---|---|
| CN106686900B (en) | 2019-06-25 |
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