CN106685285A - Integrated chip for driving stepping motor and motor driving device - Google Patents
Integrated chip for driving stepping motor and motor driving device Download PDFInfo
- Publication number
- CN106685285A CN106685285A CN201611255586.1A CN201611255586A CN106685285A CN 106685285 A CN106685285 A CN 106685285A CN 201611255586 A CN201611255586 A CN 201611255586A CN 106685285 A CN106685285 A CN 106685285A
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- Prior art keywords
- chip
- mos
- dies
- lead frame
- carriers
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- 239000000969 carrier Substances 0.000 claims abstract description 60
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 230000005611 electricity Effects 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 3
- 239000011133 lead Substances 0.000 description 54
- 239000004065 semiconductor Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P8/00—Arrangements for controlling dynamo-electric motors of the kind having motors rotating step by step
- H02P8/14—Arrangements for controlling speed or speed and torque
Abstract
The invention discloses an integrated chip for driving a stepping motor and motor driving device; the integrated chip comprises a lead frame, and the lead frame is formed with a first chip carrier, for second chip carriers, and four third chip carriers; a TC1005 driving chip is arranged on the first chip carrier; one N-MOS pipe chip is arranged on each second chip carrier, and one P-MOS tube chip is arranged on each of four third chip carriers; the TC1005 driving chip is electrically connected with four N-MOS tube chips and four P-MOS tube chips, wherein four second chip carriers and four third chip carriers are arranged at the outer edge of the lead frame. The integrated chip for driving the stepping motor and the motor driving device can realize the highly integration of the driving circuit of the stepping motor and the minimization of the driving chip, and are good for designing and packaging the driving circuit.
Description
Technical field
The present invention relates to Design of Stepper Motor Control Circuit field, more particularly to a kind of to be used for stepper motor driven integrated chip
And motor driver.
Background technology
At present, the general working method of step motor drive is that the H bridges formed by metal-oxide-semiconductor are driven by drive circuit,
And then operating current is provided to motor, drive stepping motor is come with this.But the volume of panel shared by metal-oxide-semiconductor is larger,
Be inconvenient to install.
The content of the invention
The main object of the present invention is to propose one kind for stepper motor driven integrated chip and motor driver, purport
It is larger in the volume of panel shared by metal-oxide-semiconductor, it has not been convenient to the problem of installation.
For achieving the above object, one kind proposed by the present invention is used for stepper motor driven integrated chip, including lead frame
Frame, the lead frame is formed with the first chip carrier, four the second chip carriers, four the 3rd chip carriers；Described first
TC1005 driving chips are provided with chip carrier；It is respectively provided with a N-MOS dies on four second chip carriers, four
A P-MOS dies are respectively provided with 3rd chip carrier；The TC1005 driving chips and four N-MOS dies
And four N-MOS dies electrical connections；Wherein, four second chip carriers and four the 3rd chip carriers are equal
It is arranged on the outward flange of the lead frame.
Preferably, first chip carrier is arranged at the middle part of the lead frame, four second chip carriers
The 3rd chip carrier ring described with four is located at the periphery of first chip carrier.
Preferably, the lead frame is square setting, and with relative the first side and the second side, four described second
Chip carrier is correspondingly arranged at the first side of the lead frame, and four the 3rd chip carriers are correspondingly arranged at the lead
Second side of framework.
Preferably, the lead frame is square setting, and with relative the first side and the second side, two described second
Chip carrier and two the 3rd chip carriers are disposed side by side on the first side of the lead frame, two second chips
Carrier and two the 3rd chip carriers are disposed side by side on the second side of the lead frame.
Preferably, the lead frame also includes many with what the signal pins of the TC1005 driving chips connected one to one
Multiple radiating pins that the source lead of individual signal pins and four N-MOS dies connects one to one, and
The multiple radiating pins connected one to one with the source lead of the described four P-MOS dies.
Preferably, multiple radiating pins integrally set with each second chip carrier and each 3rd chip carrier
Put.
Preferably, each radiating pin is step motor drive pin.
Preferably, the width of the radiating pin is 1.05mm, the radiating pin and the adjacent radiating pin
Spacing is 0.8mm；The width of multiple signal pins is 0.3mm, the signal pins and the adjacent signal pins
Spacing is 0.8mm.
Preferably, described also to include packaging body for stepper motor driven integrated chip, the packaging body is wrapped in institute
State the outer surface of lead frame；The length and width of the packaging body is 10mm.
Preferably, the driving chip includes multiple signal input pins and multiple signal output feet；The TC1005 drives
Multiple signal input pins of chip are used for receives input signal；Multiple signal output feet of the TC1005 driving chips with it is multiple
The grid of the grid of the N-MOS dies and multiple P-MOS dies connects one to one；
The TC1005 driving chips are used for receives input signal, and produce drive signal, to drive multiple N-MOS
Die and the corresponding ON/OFF of multiple P-MOS dies；
The drain electrode of each P-MOS dies is used to be electrically connected with power supply；The source electrode of four P-MOS dies
The source electrode of N-MOS dies described with four is corresponded and electrically connected；The drain electrode of each N-MOS dies is used to be grounded.
The present invention also proposes a kind of motor driver, and the motor driver includes being used for motor as above
The integrated chip of driving, this is used for stepper motor driven integrated chip, including lead frame, and the lead frame is formed with
One chip carrier, four the second chip carriers, four the 3rd chip carriers；TC1005 drives are provided with first chip carrier
Dynamic chip；A N-MOS dies are respectively provided with four second chip carriers, are respectively provided with four the 3rd chip carriers
One P-MOS dies；The TC1005 driving chips and four N-MOS dies and four P-MOS dies electricity
Connection；Wherein, four second chip carriers and four the 3rd chip carriers are arranged at the outer of the lead frame
Edge.
The present invention is used for stepper motor driven integrated chip, and lead frame is provided with the integrated chip, and at this
The first chip carrier, four the second chip carriers, four the 3rd chip carriers, and four the second chips are formed with lead frame
Carrier and four the 3rd chip carriers are arranged at the outward flange of lead frame, and TC1005 driving chips are arranged into first
On chip carrier, four N-MOS dies are separately positioned on the second chip carrier, and four P-MOS dies are divided
It is not arranged on the 3rd chip carrier, TC1005 driving chips are by lead and four N-MOS dies and four P-MOS tube cores
Piece electrically connect, with realize TC1005 driving chips receive outside control signal when, drive by four N-MOS dies with
And the dual H-bridge that four P-MOS dies are formed, and then carry out drive stepping motor fortune to external motor offer operating current
Turn.The drive circuit collection that the present invention constitutes TC1005 driving chips, four N-MOS dies and four P-MOS dies
Into stepper motor driving circuit Highgrade integration, and the miniaturization of driving chip on the same chip, is so realized, favorably
In the design and installation of drive circuit.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is structural representation of the present invention for stepper motor driven integrated chip；
Fig. 2 is another structural representation of the present invention for stepper motor driven integrated chip；
Fig. 3 is the side structure schematic view of Fig. 2；
Fig. 4 is another angle schematic diagram of Fig. 3.
Drawing reference numeral explanation：
The realization of the object of the invention, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment a part of embodiment only of the invention, rather than the embodiment of whole.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
If it is to be appreciated that relate in the embodiment of the present invention directivity indicate (such as up, down, left, right, before and after ...),
Then directionality indicate be only used for explain the relative position relation under a certain particular pose (as shown in drawings) between each part,
Motion conditions etc., if the particular pose changes, directionality indicates also correspondingly to change therewith.
If in addition, relating to the description of " first ", " second " etc. in the embodiment of the present invention, being somebody's turn to do " first ", " second " etc.
Description be only used for describing purpose, and it is not intended that indicating or implying its relative importance or implicit indicate indicated skill
The quantity of art feature.Thus, " first " is defined, at least one spy can be expressed or be implicitly included to the feature of " second "
Levy.In addition, the technical scheme between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
Based on enough realizations, when the combination appearance of technical scheme is conflicting or cannot realize it will be understood that the knot of this technical scheme
Conjunction is not present, also not within the protection domain of application claims.
It is proposed by the present invention a kind of for stepper motor driven integrated chip.
With reference to Fig. 1 and Fig. 2, in an embodiment of the present invention, the integrated chip includes lead frame 10, the lead frame 10
On be formed with the first chip carrier 11, four the second chip carriers, 12, four the 3rd chip carriers 13, and TC1005 drives core
21, four P-MOS dies 23 of piece and four N-MOS dies 22.
In the present embodiment, the lead frame 10 for each chip chip carrier, the be respectively formed on lead frame 10
One 12, four the 3rd chip carriers 13 of the second chip carrier of chip carrier 11, four can be that the copper such as copper-chromium system, copper-patch system are closed
Gold is made.
In the present embodiment, TC1005 driving chips 21, P-MOS dies 23 and four N-MOS dies 22 can be adopted
Welding is pasted, the conductive mode such as glue or glass glue is being respectively and fixedly installed to the first chip carrier 11, four the
On two the 3rd chip carriers 13 of chip carrier 12, four, certainly each chip can also fix peace using other fixed forms
Dress, here is not limited.
In this enforcement, TC1005 driving chips 21 can be by bonding material and four N- such as spun gold, aluminium wire or copper wires
Metal-oxide-semiconductor chip 22 and four P-MOS dies 23, with routing bonding technology electrically connecting between each chip internal exit is realized
Connect, to form driving circuit.Certainly in other embodiments, electricity can also be realized by other bonding technologies between each chip
Gas connects, and here is not limited.
In the present embodiment, it is to be understood that because the driving current of metal-oxide-semiconductor is than larger, and then temperature rise ratio is higher, by four
Individual second chip carrier 12 and four the 3rd chip carriers 13 are arranged at the outward flange of lead frame 10, thus, can avoid
P-MOS pipes on the N-MOS dies 22 and four the 3rd chip carriers 13 being separately fixed on four the second chip carriers 12
Operationally, the heat of generation affects the work of driving chip to chip 23, while also helping P-MOS dies 23 and N-MOS
Die 22 radiating of itself.
The present invention is used for stepper motor driven integrated chip, and lead frame 10, Yi Ji is provided with the integrated chip
The first chip carrier 11, four the second chip carriers, 12, four the 3rd chip carriers 13, and four are formed with the lead frame 10
Individual second chip carrier 12 and four the 3rd chip carriers 13 are arranged at the outward flange of lead frame 10, and by TC1005
Driving chip 21 is arranged on the first chip carrier 11, and four N-MOS dies 22 are separately positioned on the second chip carrier 12,
And four P-MOS dies 23 are separately positioned on the 3rd chip carrier 13, TC1005 driving chips 21 by lead with
Four N-MOS dies 22 and four P-MOS dies 23 are electrically connected, to realize that TC1005 driving chips 21 are receiving outside
Control signal when, drive the dual H-bridge that formed by four N-MOS dies 22 and four P-MOS dies 23, and then to outer
The motor for connecing provides operating current and carrys out drive stepping motor operating.The present invention is by 21, four N-MOS of TC1005 driving chips
The drive circuit of die 22 and four compositions of P-MOS dies 23 is integrated on the same chip, thus, realizing stepping electricity
Drive circuit Highgrade integration, and the miniaturization of driving chip, are conducive to the design and encapsulation of drive circuit.
With reference to Fig. 1, in a preferred embodiment, first chip carrier 11 is arranged in the lead frame 10
Portion, four second chip carriers 12 and four rings of the 3rd chip carrier 13 are located at the outer of first chip carrier 11
Enclose.
In the present embodiment, the first chip carrier 11 for carrying TC1005 driving chips 21 is arranged in lead frame 10
Portion, and the second chip carrier 12 and the 3rd chip carrier 13 are set up separately in its periphery, also will four P-MOS dies 23 and four
Individual N-MOS dies 22 set up separately in the periphery of TC1005 driving chips 21, are arranged such, facilitate TC1005 driving chips 21 with it is each
The electrical connection of metal-oxide-semiconductor chip, and the layout of integrated chip is more concentrated, it is real to save the arrangement space of integrated chip
The miniaturization of existing integrated chip.
With reference to Fig. 1, in a preferred embodiment, the lead frame 10 is square setting, and with the first relative side
(figure is not indicated) and the second side (figure is not indicated), four second chip carriers 12 are correspondingly arranged at the lead frame 10
First side, four the 3rd chip carriers 13 are correspondingly arranged at the second side of the lead frame 10.
In the present embodiment, lead frame 10 is square setting so that the symmetrical configuration of integrated chip, is more beneficial for TC1005
The space setting of driving chip 21 and each metal-oxide-semiconductor chip, four the second chip carriers 12 and four 13 points of the 3rd chip carriers
The side of lead frame 10 2 is not correspondingly arranged at, is arranged such, to facilitate encapsulation.
With reference to Fig. 1, in a preferred embodiment, the lead frame 10 is square setting, and with the first relative side
With the second side, two second chip carriers 12 and two the 3rd chip carriers 13 are disposed side by side on the lead frame
10 the first side, two second chip carriers 12 and two the 3rd chip carriers 13 are disposed side by side on the lead frame
Second side of frame 10.
In the present embodiment, lead frame 10 is square setting so that the symmetrical configuration of integrated chip, is more beneficial for TC1005
The space of driving chip 21 and each metal-oxide-semiconductor chip is arranged, and two the second chip carriers 12 and two the 3rd chip carriers 13 set
Put in the side of lead frame 10, corresponding, two other second chip carrier 12 and two other the 3rd chip carrier 13 are arranged
In the opposite side of lead frame 10, it is arranged such, is more beneficial for TC1005 driving chips 21 and four N-MOS dies 22 and four
Electrically connect between P-MOS dies 23, and the electrical connection between N-MOS dies 22 and P-MOS dies 23.
With reference to Fig. 2 to Fig. 4, in a preferred embodiment, the lead frame 10 also includes driving core with the TC1005
The multiple signal pins 15 and the source electrode of four N-MOS dies 22 that the signal pins of piece 21 connect one to one are drawn
Multiple radiating pins 14 that foot connects one to one, and with the source lead of the described four P-MOS dies 23 one by one
Multiple radiating pins 14 of correspondence connection.
It is understood that N-MOS dies 22 and P-MOS dies 23 as power chip operationally, temperature rise meeting
Comparison is high, in order to avoid the temperature rise on N-MOS dies 22 and P-MOS dies 23 is to chip itself and core adjacent thereto
The normal work of piece is impacted, in the present embodiment, multiple radiating pins 14 and four P-MOS dies 23 of lead frame 10
The output pin drawn with four each chip internals of N-MOS dies 22 connects one to one, to work on power in integrated chip
When, four P-MOS dies 23 and four N-MOS dies 22 are radiated.In the present embodiment, TC1005 driving chips 21
On be provided with multiple signal pins, each signal pins of TC1005 driving chips 21 can be by the bonding such as spun gold, aluminium wire or copper wire
Material realizes the electrical connection with each signal pins 15 on lead frame 10 with routing bonding technology, and then is drawn by each signal
Foot 15 receives the external signals such as power supply signal, the control signal of outside, to drive each P-MOS dies 23 and each N-MOS tube cores
The ON/OFF of piece 22, and then control the startup/stopping of motor, and the operating of various patterns.It is many in the present embodiment
Individual radiating pin 14 and four N-MOS dies 22 and P-MOS dies 23, and multiple signal pins 15 and TC1005 drivings
Between the signal pins of chip 21, by material binds such as metal lead wires, and then electrical connection can be realized.
With reference to Fig. 2 to Fig. 4, in a preferred embodiment, multiple pins 14 and each second chip carriers of radiating
12 and each 3rd chip carrier 13 be wholely set.
In the present embodiment, the chip carrier 12 of radiating pin 14 and second is by the copper alloys such as copper-chromium system, copper-ferrum system one
Molding is arranged, thus, radiate pin 14 and each N-MOS dies 22 and the contact area of P-MOS dies 23 can be caused
Bigger, radiating pin 14 is good with the steadiness of each N-MOS dies 22 and P-MOS dies 23, and radiating effect is preferable.When
So, more note, connect with outside each part and connect weldering efficiency at weldering to increase radiating pin 14, can be in radiating pin
The conducting metals such as stannum are plated at 14, and in order to increase the radiating effect of radiating foot, radiating pin 14 can be with by the tool such as copper-aluminum
The metal for having good radiating effect is made, and here is not limited.
Further, in above-described embodiment, in order to reduce the volume of chip, and in order that the integrated level of integrated chip more
Height, each radiating pin 14 is also used as each N-MOS dies 22 and the step motor drive signal of P-MOS dies 23
The pin of output.It is arranged such, reduces the pin number of integrated chip, further to reduce the volume of integrated chip, while
It is more favorable to the radiating of N-MOS dies 22 and P-MOS dies 23.
With reference to Fig. 2 to Fig. 4, in a preferred embodiment, the width d1 of the radiating pin 14 is preferably 1.05mm, described
Radiating pin 14 is preferably 0.8mm with spacing h1 of the adjacent radiating pin 14；The width of multiple signal pins 15
D2 is preferably 0.3mm, and the signal pins 15 are preferably 0.8mm with center distance d2 of the adjacent signal pins 15.
In the present embodiment, compared to existing chip pin, the width of the radiating pin 14 is wider, and adjacent heat radiation pin
The spacing of 14 spacing also pin more each than existing chip is big, is arranged such, it is ensured that radiating pin 14 fully radiates, this
Outward, radiate between pin 14 and ensure that wider spacing can also avoid the temperature rise of adjacent chips from impacting other chips, with
And avoid the signal between adjacent leads from disturbing.It is understood that in other embodiments, in the volume for ensureing integrated chip
While miniaturization, can be with the width and adjacent heat radiation pin 14 of the increase radiating pin 14 on the basis of the present embodiment
Spacing so that better heat-radiation effect and avoid signal cross-talk.It will also be appreciated that in a further embodiment, ensureing
While the radiating effect of integrated chip, can be reducing the radiating width of pin 14 and adjacent on the basis of the present embodiment
The spacing of radiating pin 14, so that the integrated level of integrated chip is higher, here is not limited.
Described also to include lead for stepper motor driven integrated chip in above-described embodiment, the TC1005 drives
Chip 21, multiple P-MOS tube cores, multiple N-MOS dies 22, the radiating pin 14 and the signal pins 15
On be provided with pad for connecting each wire ends.
In the present embodiment, a plurality of lead with electric conductivity is used to realize chip and chip, and chip and external signal
The electrical connection of pin 15.The lead can be that copper wire, aluminium wire etc. have the good metal of certain ductility and electric conductivity
Lead.
It is in a preferred embodiment, described also to include envelope for stepper motor driven integrated chip with reference to Fig. 2 to Fig. 4
Dress body 30, the packaging body 30 is wrapped in the outer surface of the lead frame 10；Length c1 and width c2 of the packaging body 30
It is 10mm.
In the present embodiment, packaging body 30 can be the materials such as plastics, ceramics, glass or metal and lead frame 10 and each
Chip is integrally formed.
Specifically, when integrated chip is encapsulated, first by TC1005 driving chips 21, P-MOS dies 23 and four N-MOS
Die 22 is respectively and fixedly installed on the first chip carrier 11, four the second chip carriers, 12, four the 3rd chip carriers 13
Afterwards, then with packaging body 30 it is collectively forming integrated chip.
With reference to Fig. 1, in a preferred embodiment, the TC1005 driving chips 21 include multiple signal input pins and multiple
Signal output foot；Multiple signal input pins of the TC1005 driving chips 21 are used for receives input signal；The driving chip
Multiple signal output feet connect one to one with the grid of multiple N-MOS pipes and the grid of multiple P-MOS pipes；
The TC1005 driving chips 21 are used to receive the control signal of outside input, and produce drive signal, to drive
Multiple N-MOS pipes 22 and the corresponding ON/OFF of multiple P-MOS pipes 23；
The drain electrode of each P-MOS23 pipes 23 is used to be electrically connected with power supply；The source electrode of four P-MOS pipes 23 with
The source electrode of four N-MOS pipes 22 corresponds electrical connection；The drain electrode of each N-MOS pipes 22 is used to be grounded.
In the present embodiment, when the control signal of outside is received, output is corresponding to drive letter to TC1005 driving chips 21
Number, to drive the dual H-bridge metal-oxide-semiconductor power driving circuit formed by four N-MOS pipes 22 and four P-MOS pipes 23, and then give
External motor provides operating current and carrys out drive stepping motor operating.
The present invention also proposes a kind of motor driver, and motor driver includes as above for motor drive
Dynamic integrated chip.This is used for the concrete structure of stepper motor driven integrated chip with reference to above-described embodiment, due to this motor
Driving means employ whole technical schemes of above-mentioned all embodiments for stepper motor driven integrated chip, therefore extremely
There is less all beneficial effects that the above-mentioned technical scheme for stepper motor driven integrated chip embodiment is brought, here
No longer repeat one by one.
The preferred embodiments of the present invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every at this
Under the inventive concept of invention, the equivalent structure transformation made using description of the invention and accompanying drawing content, or directly/use indirectly
It is included in the scope of patent protection of the present invention in other related technical fields.
Claims (10)
1. it is a kind of to be used for stepper motor driven integrated chip, it is characterised in that including lead frame, the lead frame is formed
There are the first chip carrier, four the second chip carriers, four the 3rd chip carriers；It is provided with first chip carrier
TC1005 driving chips；A N-MOS dies, four the 3rd chip carriers are respectively provided with four second chip carriers
On be respectively provided with a P-MOS dies；The TC1005 driving chips and four N-MOS dies and four P-MOS
Die is electrically connected；Wherein, four second chip carriers and four the 3rd chip carriers are arranged at the lead
The outward flange of framework.
2. stepper motor driven integrated chip is used for as claimed in claim 1, it is characterised in that first chip carrier
It is arranged at the middle part of the lead frame, four second chip carriers and four the 3rd chip carrier rings are located at described
The periphery of the first chip carrier.
3. stepper motor driven integrated chip is used for as claimed in claim 2, it is characterised in that the lead frame is in side
Shape is arranged, and with relative the first side and the second side, four second chip carriers are correspondingly arranged at the lead frame
The first side, four the 3rd chip carriers are correspondingly arranged at the second side of the lead frame.
4. stepper motor driven integrated chip is used for as claimed in claim 2, it is characterised in that the lead frame is in side
Shape is arranged, and with relative the first side and the second side, two second chip carriers and two the 3rd chip carriers
The first side of the lead frame is disposed side by side on, two second chip carriers and two the 3rd chip carriers are side by side
It is arranged on the second side of the lead frame.
5. as described in any one of Claims 1-4 for stepper motor driven integrated chip, it is characterised in that it is described to draw
Wire frame also includes multiple signal pins connected one to one with the signal pins of the TC1005 driving chips and described four
Multiple radiating pins that the source lead of the N-MOS dies connects one to one, and P-MOS described with described four pipes
Multiple radiating pins that the source lead of chip connects one to one.
6. stepper motor driven integrated chip is used for as claimed in claim 5, it is characterised in that multiple radiating pins
It is wholely set with each second chip carrier and each 3rd chip carrier.
7. stepper motor driven integrated chip is used for as claimed in claim 5, it is characterised in that the width of the radiating pin
Spend for 1.05mm, the radiating pin is 0.8mm with the spacing of the adjacent radiating pin；The width of multiple signal pins
Spend for 0.3mm, the signal pins are 0.8mm with the spacing of the adjacent signal pins.
8. stepper motor driven integrated chip is used for as claimed in claim 5, it is characterised in that described for motor
The integrated chip of driving also includes packaging body, and the packaging body is wrapped in the outer surface of the lead frame；The packaging body
Length and width is 10mm.
9. stepper motor driven integrated chip is used for as claimed in claim 5, it is characterised in that the TC1005 drives core
Piece includes multiple signal input pins and multiple signal output feet；Multiple signal input pins of the TC1005 driving chips are used to connect
Receive input signal；Multiple signal output feet of the TC1005 driving chips and the grid of multiple N-MOS dies and many
The grid of the individual P-MOS dies connects one to one；
The TC1005 driving chips are used for receives input signal, and produce drive signal, to drive multiple N-MOS tube cores
Piece and the corresponding ON/OFF of multiple P-MOS dies；
The drain electrode of each P-MOS dies is used to be electrically connected with power supply；The source electrode and four of four P-MOS dies
The source electrode of the individual N-MOS dies corresponds electrical connection；The drain electrode of each N-MOS dies is used to be grounded.
10. a kind of motor driver, it is characterised in that include as described in claim 1 to 9 any one for stepping electricity
The integrated chip that machine drives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611255586.1A CN106685285A (en) | 2016-12-29 | 2016-12-29 | Integrated chip for driving stepping motor and motor driving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611255586.1A CN106685285A (en) | 2016-12-29 | 2016-12-29 | Integrated chip for driving stepping motor and motor driving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106685285A true CN106685285A (en) | 2017-05-17 |
Family
ID=58871863
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611255586.1A Pending CN106685285A (en) | 2016-12-29 | 2016-12-29 | Integrated chip for driving stepping motor and motor driving device |
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