CN106684226A - Bi-color chip LED system and bi-color chip LED - Google Patents
Bi-color chip LED system and bi-color chip LED Download PDFInfo
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- CN106684226A CN106684226A CN201611132150.3A CN201611132150A CN106684226A CN 106684226 A CN106684226 A CN 106684226A CN 201611132150 A CN201611132150 A CN 201611132150A CN 106684226 A CN106684226 A CN 106684226A
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- 230000001360 synchronised effect Effects 0.000 claims abstract description 7
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
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- 238000003384 imaging method Methods 0.000 abstract description 5
- 230000001788 irregular Effects 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002096 quantum dot Substances 0.000 description 3
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- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
Embodiments of the invention disclose a bi-color chip LED system and a bi-color chip LED. By adopting different materials for two bracket bases in a bi-color chip LED bracket, the color coordinate offset rates of a corresponding blue chip LED and a green chip LED along with temperature changes are adjusted to be synchronous, so that same color coordinate offset rate is realized in the temperature changing processes of the blue chip LED and the green chip LED, and the problem of irregular color coordinate changes caused by different color coordinate offset rates of the blue chip LED and the green chip LED in the bi-color chip LED due to temperature influences can be avoided; and therefore, a high-color-gamut imaging display effect is ensured.
Description
Technical field
The application is related to chip LED display field, more particularly to a kind of double-colored chip LED system and double-colored chip LED.
Background technology
High colour gamut display screen is substantially improved on gamut range, and color performance is more enriched, and stereovision is also mesh more preferably
One important trend of front display screen development.Corresponding high colour gamut Display Technique also develops rapidly, such as OLED (Organic
Light-Emitting Diode, Organic Light Emitting Diode), quantum dot LED (Light Emitting Diode, light-emitting diodes
Pipe) Display Technique etc..The primary colours color saturation and colourama excitation of high colour gamut display screen is all very high, and this is also to color measuring skill
Art and equipment it is also proposed higher requirement.
At present, high colour gamut is realized mainly by quantum dot, but because quantum dot itself such as makes at the factor, cause cost always
It is not in any more.And double-colored chip LED is encapsulated in while realizing liquid crystal module high colour gamut, with sizable cost advantage.
Applicant has found that above-mentioned existing processing scheme at least there is a problem of as follows during the application is realized：
For double-colored chip module, because the luminescent material that the chip LED of different colours is used is different, cause to become in temperature
During change, the deflection rate of chromaticity coordinates is different, and causes that module entirety color coordinate drift is uncontrollable, and side-play amount is excessive etc. asks
Topic, affects high colour gamut to be imaged display effect.
The content of the invention
The embodiment of the present application provides a kind of double-colored chip LED system and double-colored chip LED, to avoid because double-colored chip
The speed that blue chip LED in LED produces color coordinate drift with Green Chip LED temperature influences is different, and caused color
Changes in coordinates is irregular, affects high colour gamut to be imaged the problem of display effect.
In order to reach above-mentioned technical purpose, this application provides a kind of double-colored chip LED system, including blue chip LED,
Green Chip LED, double-colored chip LED support and control system, wherein：
The double-colored chip LED support, specifically includes metal basal board and two stand base, described two stand base peaces
Loaded on the metal basal board, being respectively used to install blue chip LED and the Green Chip LED, wherein, it is described two
Stand base adopts different materials, the different material to be used to be separately mounted to described in described two stand base
The color coordinate drift rate adaptation that blue chip LED and the Green Chip LED are varied with temperature is to synchronization；
The control system, for according to the chromaticity coordinates after the synchronization of blue chip LED and the Green Chip LED
Deflection rate, to the color of blue chip LED and the Green Chip LED control is synchronized.
Preferably, described two stand base adopt different materials, the different material to be used to be separately mounted to
The color coordinate drift rate adaptation of blue chip LED and the Green Chip LED in described two stand base is to same
Step, specifically includes：
Thermal resistance value for installing the material of the stand base of blue chip LED is less than for installing the green core
The thermal resistance value of the material of the stand base of piece LED.
Preferably, the thermal resistance value for installing the material of the stand base of blue chip LED is less than installation institute
The thermal resistance value of the material of the stand base of Green Chip LED is stated, specially：
The material of the stand base for installing blue chip LED is epoxy resin EMC；
The material of the stand base for installing the Green Chip LED is polytetrafluoroethylene PTFE.
Preferably, the control system, is additionally operable to：
Receive the hot changes in coordinates rule of blue chip LED and the hot changes in coordinates rule of the Green Chip LED；
Wherein, tune of two kinds of hot changes in coordinates rules based on the different thermal resistance values of the material of corresponding stand base
Section, and there is the hot changes in coordinates speed that identical varies with temperature.
On the other hand, the embodiment of the present application additionally provides a kind of double-colored chip LED, including blue chip LED, Green Chip
LED, double-colored chip LED support, the double-colored chip LED support specifically includes metal basal board and two stand base, wherein：
Described two stand base, are installed on the metal basal board, are respectively used to install blue chip LED and institute
State Green Chip LED；
Wherein, described two stand base adopt different materials, the different material to be used to that institute will to be separately mounted to
State the color coordinate drift speed that blue chip LED in two stand base and the Green Chip LED are varied with temperature
Adjust to synchronization.
Preferably, the double-colored chip LED support, specifically includes：
Thermal resistance value for installing the material of the stand base of blue chip LED is less than for installing the green core
The thermal resistance value of the material of the stand base of piece LED.
Preferably, the thermal resistance value for installing the material of the stand base of blue chip LED is less than installation institute
The thermal resistance value of the material of the stand base of Green Chip LED is stated, specially：
The material of the stand base for installing blue chip LED is EMC；
The material of the stand base for installing the Green Chip LED is PTFE.
Compared with prior art, the Advantageous Effects of the technical scheme that the embodiment of the present application is proposed include：
The embodiment of the present application discloses a kind of double-colored chip LED system and double-colored chip LED, by double-colored chip LED
Two stand base in support adopt different materials, and corresponding blue chip LED and Green Chip LED are become with temperature
The color coordinate drift rate adaptation of change to synchronization, so as to, make blue chip LED and Green Chip LED in temperature changing process,
Realize identical color coordinate drift speed, it is to avoid because blue chip LED and Green Chip LED in double-colored chip LED is by temperature
Degree affects the speed for producing color coordinate drift different, and caused chromaticity coordinates changes erratic problem, it is ensured that high colour gamut imaging
Display effect.
Description of the drawings
In order to be illustrated more clearly that the technical scheme of the application, embodiment will be described below needed for the accompanying drawing to be used
It is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, general for this area
For logical technical staff, on the premise of not paying creative work, can be with according to these other accompanying drawings of accompanying drawings acquisition.
The structural representation of a kind of double-colored chip LED system that Fig. 1 is proposed by the embodiment of the present application；
The three-dimensional view of a kind of double-colored chip LED support that Fig. 2A is proposed by the embodiment of the present application；
The structural representation of a kind of double-colored chip LED that Fig. 2 B are proposed by the embodiment of the present application；
Fig. 3 is the relation schematic diagram of NTSC chromaticity coordinates of the prior art and color；
The color that a kind of blue chip LED and Green Chip LED that Fig. 4 is proposed by the embodiment of the present application is varied with temperature is sat
Mark deviating track schematic diagram.
Specific embodiment
As the application background technology is stated, in existing double-colored chip LED structure, because chip light emitting material
Difference, the chip LED that result in different colours varies with temperature, the skew that chromaticity coordinates can occur with different rate of changes,
So as to causing the color coordinate drift of the chip LED of different colours cannot be controlled by unified control rule, with temperature
Change, the chip LED of different colours can produce the color change trend of different rates, cause the mistake of overall color coordinate drift
Control, affects the display effect of high colour gamut imaging.
Present inventor wished by double-colored chip LED system provided herein, can be to different colours
Chip LED is synchronized with the speed that temperature produces color coordinate drift, especially makes blue chip LED and Green Chip LED exist
In temperature changing process, realize identical color coordinate drift speed, it is to avoid because double-colored chip LED in blue chip LED and
The speed that Green Chip LED temperature influences produce color coordinate drift is different, and caused chromaticity coordinates changes erratic problem.
As shown in figure 1, the structural representation of a kind of double-colored chip LED system proposed by the embodiment of the present application, specifically
Including blue chip LED1, Green Chip LED2, double-colored chip LED support 3 and control system 4, blue chip LED1 and green
Chip LED 2 is respectively arranged on double-colored chip LED support 3 and constitutes a dual-colored LED module, multiple dual-colored LED modules with control
System processed 4 is connected, and by control system 4 display control is realized.
As shown in Figure 2 A and 2 B, the respectively solid of a kind of double-colored chip LED support that the embodiment of the present application is proposed
The structural representation of view and a kind of double-colored chip LED using the support, double-colored chip LED support 3 specifically includes Metal Substrate
Plate 33 and two stand base 31 and 32, wherein：
Stand base 31 and stand base 32 are installed on the metal basal board 33, are respectively used to install the blue chip
The LED1 and Green Chip LED2.
Wherein, stand base 31 and stand base 32 adopt different materials, the different material to be used to pacify respectively
What blue chip LED1 and the Green Chip LED2 being mounted in stand base 31 and stand base 32 was varied with temperature
Color coordinate drift rate adaptation is to synchronization.
In specific application scenarios, the method for synchronizing regulation can be realized by the thermal resistance value of differentiation,
Thermal resistance value i.e. for installing the material of the stand base 31 of blue chip LED1 is less than for installing the Green Chip
The thermal resistance value of the material of the stand base 32 of LED2.
Based on above-mentioned thinking, in specific application scenarios, EMC (Epoxy Molding Compond, ring can be adopted
Oxygen tree fat injected molded compound) as the material of the stand base 31 for installing blue chip LED1, using PTFE
The material of (Polytetrafluoroethylene, politef) as the stand base 32 for installing Green Chip LED2.When
So, if other have the material of different thermal resistance values, it is also possible to above-mentioned material is substituted, such as PPA (poly- terephthalate
P-phenylenediamine) etc..
It should be noted that the chip LED that different colours are adjusted in synchronism by the thermal resistance value of different materials is become with temperature
The color coordinate drift speed of change simply realizes that the one kind for the technical scheme that the embodiment of the present application is proposed is concrete and processes strategy, example
Such as, regulating and controlling packaging environment temperature by isolating chip installing space can also realize above-mentioned technique effect, therefore, meeting color
On the premise of coordinate offset rate adaptation, the change of concrete Adjusted Option can't affect the protection domain of the application.
In above-mentioned double-colored chip LED system, also including control system 4, each dual-colored LED module is connected respectively, be used for
According to the color coordinate drift speed after the synchronization of blue chip LED1 and the Green Chip LED2, to the blue chip
The color of LED1 and the Green Chip LED2 synchronizes control.
Before control system 4 proceeds by control, in addition it is also necessary to receive the hot changes in coordinates rule of blue chip LED1
The hot changes in coordinates rule of rule and the Green Chip LED2, wherein, two kinds of hot changes in coordinates rules are based on corresponding
The regulation of the different thermal resistance values of the material of frame pedestal, and there is the hot changes in coordinates speed that identical varies with temperature.
Compared with prior art, the Advantageous Effects of the technical scheme that the embodiment of the present application is proposed include：
The embodiment of the present application discloses a kind of double-colored chip LED system and double-colored chip LED, by double-colored chip LED
Two stand base in support adopt different materials, and corresponding blue chip LED and Green Chip LED are become with temperature
The color coordinate drift rate adaptation of change to synchronization, so as to, make blue chip LED and Green Chip LED in temperature changing process,
Realize identical color coordinate drift speed, it is to avoid because blue chip LED and Green Chip LED in double-colored chip LED is by temperature
Degree affects the speed for producing color coordinate drift different, and caused chromaticity coordinates changes erratic problem, it is ensured that high colour gamut imaging
Display effect.
Below in conjunction with the accompanying drawing in the application, clear, complete description is carried out to the technical scheme in the application, shown
So, described embodiment is a part of embodiment of the application, rather than the embodiment of whole.Based on the enforcement in the application
Example, the every other embodiment that those of ordinary skill in the art are obtained on the premise of creative work is not made all belongs to
In the scope of the application protection.
As shown in figure 3, for NTSC of the prior art (National Television Standards Committee,
(U.S.) NTSC, i.e. a kind of color show standard) relation schematic diagram of chromaticity coordinates and color, in the signal
In figure, color can be defined by chromaticity coordinates X and Y, and the skew of chromaticity coordinates, directly affect shown color.
The color coordinate drift amount of double-colored chip LED is larger and uncontrollable, so as to the color for making integral LED just there occurs very
Big change.As shown in figure 4, a kind of blue chip LED proposed by the embodiment of the present application and Green Chip LED are varied with temperature
Color coordinate drift track schematic diagram.As shown in Figure 3, it is considered to which blue and green Y chromaticity coordinates difference is larger, so, in order to
Conveniently browse and contrast, in the diagram, introduce two Y chromaticity coordinates, wherein, the Y chromaticity coordinates numerical value in left side is larger, illustrates green
Y chromaticity coordinates corresponding to color chip LED, the Y chromaticity coordinates numerical value on right side is less, illustrates the Y colors corresponding to blue chip LED and sits
Mark, by such setting, can be square by the temperature of bluish-green double-colored chip LED-chromaticity coordinates variation track curve movement to together
Just browse.It should be noted that in actual application, corresponding trail change curve will not be smooth straight line, and in Fig. 4
In, it is intended merely to conveniently browse and illustrate, just employ straight line to characterize corresponding trail change curve, such change is not
The protection domain of the application can be affected.
(track is oblique to can be seen that the Y chromaticity coordinates variation with temperature speed of blue chip LED by the geometric locus of Fig. 4
Rate) apparently higher than Green Chip LED, with reference to specific analysis, it can be deduced that wherein main influence factor's dimension is chip knot
Warm Tj(junction temperature), junction temperature is in practical semiconductor chip (wafer, nude film) in electronic equipment
The operating temperature of PN junction, usually above skin temperature and device surface temperature.
Specifically, TjComputing formula is as follows：
Tj=Ta+(RθJA×PD)；
Wherein, TaRepresent the ambient temperature of encapsulation, RθJAThe thermal resistance value corresponding to chip LED is represented, PD represents the work(of encapsulation
Rate.
In specific application scenarios, TaAs pad temperature, can be obtained by direct measurement LED pad.For double
Color chip LED, because two chips LED are packaged in a dual-colored LED module, equivalent to being in same environmental system, so,
The T of two chips LEDaIt is synchronous change.
On the other hand, PD is the encapsulation power of chip LED, because two chips are by unity loop control, electric current I and electricity
Pressure V synchronously changes, so, PD is also identical.
The analysis based on more than understands, in impact TjThree factors in, for two chip LEDs, TaAll it is one with PD
Cause, therefore, exist and change numerical value regulation TjPossibility.So, the technical scheme that the embodiment of the present application is proposed passes through
Change the thermal resistance value corresponding to two chips LED to realize that two chips LED have different junction temperatures T under same time pointj,
So as to reach the chromaticity coordinates rate of change of synchronous blue chip LED and Green Chip LED.
Equally as shown in Figure 2 B, blue chip LED1 is placed on support to the structural representation of bluish-green double-colored chip LED module
On pedestal 31, Green Chip LED2 is placed in stand base 32, and is welded in lamp bar PCB by scolding tin.After energization, chip
Substantial amounts of heat is lighted and produces, heat is mainly passed to by stand base and carried out on the metal basal board (such as aluminium base) of lamp bar
Radiating.Because bluish-green two chips LED is encapsulated in a dual-colored LED module simultaneously, and while weld on metallic substrates, institute
Junction temperature T under directly will affecting chip in working order with, the diversity of the heat conductivility of stand basej。
As shown in figure 4, the chromaticity coordinates rate of change of blue chip LED1 is higher than Green Chip LED2, so, want synchronization
Both, need junction temperature T for improving Green Chip LED2j, accordingly, also it is accomplished by the stand base to installing Green Chip LED2
32 using the higher material of thermal resistance value.
At present, the material of the stand base of chip LED is also mainly EMC, and the thermal resistance value of this material is 0.12W/ (mK),
Stand base 32 is replaced by the embodiment of the present application the material of high thermal resistance value, increases the thermal resistance value corresponding to Green Chip LED2
RθJA, so as to, the junction temperature of Green Chip LED2 is lifted, the chromaticity coordinates rate of change of Green Chip LED2 is improved, make bluish-green chip
The chromaticity coordinates change of LED is synchronous.
EMC is compared, the material with higher thermal resistance value can be PTFE, it is hot higher than EMC because its value is 0.25W/ (mK)
Resistance, meanwhile, PTFE has a good thermal stability, 327 DEG C of fusing point, and with good machining property and weatherability etc..Cause
This, the embodiment of the present application is designed the stand base 32 of the Green Chip LED2 in bluish-green double-colored chip LED module and is replaced using PTFE
For existing EMC, and blue chip LED1 uses the stand base 31 of EMC materials.Due to the thermal resistance corresponding to Green Chip LED
Value is higher than blue chip LED, junction temperature T corresponding to the Green Chip LED of same timejIt is higher than corresponding to blue chip LED
Junction temperature Tj, so as to, the Y color coordinate drift speed near-synchronous of two chips LED are made, thus, control system can be slapped in advance
Chromaticity coordinates Changing Pattern is held, by writing corresponding control rule in advance come to the colour temperature of double-colored chip LED module and display face
Color is controlled.
Compared with prior art, the Advantageous Effects of the technical scheme that the embodiment of the present application is proposed include：
The embodiment of the present application discloses a kind of double-colored chip LED system and double-colored chip LED, by double-colored chip LED
Two stand base in support adopt different materials, and corresponding blue chip LED and Green Chip LED are become with temperature
The color coordinate drift rate adaptation of change to synchronization, so as to, make blue chip LED and Green Chip LED in temperature changing process,
Realize identical color coordinate drift speed, it is to avoid because blue chip LED and Green Chip LED in double-colored chip LED is by temperature
Degree affects the speed for producing color coordinate drift different, and caused chromaticity coordinates changes erratic problem, it is ensured that high colour gamut imaging
Display effect.
Through the above description of the embodiments, those skilled in the art can be understood that the embodiment of the present invention
Can be realized by hardware, it is also possible to realize by the mode of software plus necessary general hardware platform.Based on such reason
Solution, the technical scheme of the embodiment of the present invention can be embodied in the form of software product, and the software product can be stored in one
Individual non-volatile memory medium (can be CD-ROM, USB flash disk, portable hard drive etc.) in, including some instructions are used so that a meter
Calculate machine equipment (can be personal computer, server, or network equipment etc.) and perform the embodiment of the present invention each implement scene
Described method.
It will be appreciated by those skilled in the art that accompanying drawing is a schematic diagram for being preferable to carry out scene, module in accompanying drawing or
Flow process is not necessarily implemented necessary to the embodiment of the present invention.
It will be appreciated by those skilled in the art that the module in the device in implement scene can according to implement scene describe into
Row is distributed in the device of implement scene, it is also possible to carry out one or more dresses that respective change is disposed other than this implement scene
In putting.The module of above-mentioned implement scene can merge into a module, it is also possible to be further split into multiple submodule.
The embodiments of the present invention are for illustration only, do not represent the quality of implement scene.
Disclosed above is only that the several of the embodiment of the present invention are embodied as scene, but, the embodiment of the present invention not office
It is limited to this, the changes that any person skilled in the art can think of should all fall into the business of the embodiment of the present invention and limit scope.
Claims (7)
1. a kind of double-colored chip light emitting diode LED information display system, it is characterised in that including blue chip LED, Green Chip LED, double
Color chip LED support and control system, wherein：
The double-colored chip LED support, specifically includes metal basal board and two stand base, and described two stand base are installed on
On the metal basal board, it is respectively used to that blue chip LED and the Green Chip LED are installed, wherein, described two supports
Pedestal adopts different materials, the different material to be used to that the blueness in described two stand base will to be separately mounted to
The color coordinate drift rate adaptation that chip LED and the Green Chip LED are varied with temperature is to synchronization；
The control system, for according to the color coordinate drift after the synchronization of blue chip LED and the Green Chip LED
Speed, to the color of blue chip LED and the Green Chip LED control is synchronized.
2. double-colored chip LED system as claimed in claim 1, it is characterised in that described two stand base are using different
Material, the different material is used for will blue chip LED that be separately mounted in described two stand base and described
The color coordinate drift rate adaptation of Green Chip LED is specifically included to synchronization：
Thermal resistance value for installing the material of the stand base of blue chip LED is less than for installing the Green Chip
The thermal resistance value of the material of the stand base of LED.
3. double-colored chip LED system as claimed in claim 2, it is characterised in that described for installing blue chip LED
Stand base material thermal resistance value less than the material of the stand base for installing the Green Chip LED thermal resistance value, specifically
For：
The material of the stand base for installing blue chip LED is epoxy resin EMC；
The material of the stand base for installing the Green Chip LED is polytetrafluoroethylene PTFE.
4. double-colored chip LED system as claimed in claim 2, it is characterised in that the control system, is additionally operable to：
Receive the hot changes in coordinates rule of blue chip LED and the hot changes in coordinates rule of the Green Chip LED；
Wherein, regulation of two kinds of hot changes in coordinates rules based on the different thermal resistance values of the material of corresponding stand base, and
With the hot changes in coordinates speed that identical is varied with temperature.
5. a kind of double-colored chip LED, it is characterised in that including blue chip LED, Green Chip LED, double-colored chip LED support,
The double-colored chip LED support specifically includes metal basal board and two stand base, wherein：
Described two stand base, are installed on the metal basal board, are respectively used to install blue chip LED and described green
Color chip LED；
Wherein, described two stand base adopt different materials, the different material to be used to that described two will to be separately mounted to
The color coordinate drift rate adaptation that blue chip LED and the Green Chip LED in individual stand base is varied with temperature
To synchronization.
6. double-colored chip LED as claimed in claim 5, it is characterised in that specifically include：
Thermal resistance value for installing the material of the stand base of blue chip LED is less than for installing the Green Chip
The thermal resistance value of the material of the stand base of LED.
7. double-colored chip LED as claimed in claim 6, it is characterised in that it is described for install blue chip LED
The thermal resistance value of the material of the stand base of the thermal resistance value of the material of frame pedestal Green Chip LED described less than installation, specially：
The material of the stand base for installing blue chip LED is EMC；
The material of the stand base for installing the Green Chip LED is PTFE.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611132150.3A CN106684226A (en) | 2016-12-09 | 2016-12-09 | Bi-color chip LED system and bi-color chip LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611132150.3A CN106684226A (en) | 2016-12-09 | 2016-12-09 | Bi-color chip LED system and bi-color chip LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106684226A true CN106684226A (en) | 2017-05-17 |
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Cited By (3)
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| CN110322857A (en) * | 2019-07-05 | 2019-10-11 | 青岛海信电器股份有限公司 | Color compensation method and display equipment |
| CN113900462A (en) * | 2021-12-10 | 2022-01-07 | 华御祥茶科学研究院(深圳)有限公司 | System for measuring and adjusting tea making temperature based on thermal induction |
| CN117615481A (en) * | 2024-01-24 | 2024-02-27 | 杭州罗莱迪思科技股份有限公司 | Dynamic correction color mixing system and method for influence of self-adaptive temperature on color coordinates |
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| CN110322857A (en) * | 2019-07-05 | 2019-10-11 | 青岛海信电器股份有限公司 | Color compensation method and display equipment |
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| CN117615481A (en) * | 2024-01-24 | 2024-02-27 | 杭州罗莱迪思科技股份有限公司 | Dynamic correction color mixing system and method for influence of self-adaptive temperature on color coordinates |
| CN117615481B (en) * | 2024-01-24 | 2024-04-09 | 杭州罗莱迪思科技股份有限公司 | Dynamic correction color mixing system and method for influence of self-adaptive temperature on color coordinates |
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