CN106684216A - Composite transparent fluorescent ceramic chip and preparing method for white LEDs - Google Patents

Composite transparent fluorescent ceramic chip and preparing method for white LEDs Download PDF

Info

Publication number
CN106684216A
CN106684216A CN201710021677.7A CN201710021677A CN106684216A CN 106684216 A CN106684216 A CN 106684216A CN 201710021677 A CN201710021677 A CN 201710021677A CN 106684216 A CN106684216 A CN 106684216A
Authority
CN
China
Prior art keywords
pixel
composite transparent
light
tinted
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710021677.7A
Other languages
Chinese (zh)
Inventor
张继云
罗朝华
蒋俊
江浩川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Institute of Material Technology and Engineering of CAS
Original Assignee
Ningbo Institute of Material Technology and Engineering of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Institute of Material Technology and Engineering of CAS filed Critical Ningbo Institute of Material Technology and Engineering of CAS
Priority to CN201710021677.7A priority Critical patent/CN106684216A/en
Publication of CN106684216A publication Critical patent/CN106684216A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

Abstract

The invention provides a composite transparent fluorescent ceramic chip and preparing method for white LEDs, the composite transparent fluorescent ceramic chip is the integral structure of two or more small ceramic units connected in the cross section, the small ceramic unit is a light pixel, the light color of the each lighting pixel is more than two, after being excited by the LED chip, the composite transparent fluorescent ceramic chip emits white light. Compared with the existing technology, the different lighting pixel points are compound on the same ceramic chip according to the principle that the three base colors of red light, blue light and green light are mixed into white light, the problem of uneven dispersion of phosphor particles in organic materials, the scattering of surface light and the loss of red components, and the like are overcome, the technical scheme has the advantages of high conversation efficiency, high color index, long life, good heat stability and adjustable color temperature.

Description

A kind of composite transparent fluorescence ceramics piece for white light LEDs and preparation method thereof
Technical field
The invention belongs to LED field of luminescent technology, be related to a kind of composite transparent fluorescence ceramics piece for white light LEDs and its Preparation method.
Background technology
With the progress of light emitting diode (Light Emitting Diode, abbreviation LED) technology, white light LEDs are from spy Plant light source applications field and gradually step into general lighting field.White light LEDs are with its high brightness, high color rendering index (CRI), energy-conserving and environment-protective, response Speed is fast, long service life, small volume, high reliability, become after electric filament lamp, fluorescent lamp and high-voltage gas discharging light it " forth generation green illumination light source " afterwards.
Business-like white light LEDs are mainly with the light switch technology system that blue light (or purple light) is changed generation white light at present It is standby to obtain.The fluorescent material of rare earth doped luminescent material is mainly scattered in organic material such as silica gel or epoxy resin by this method In material, it is then encapsulated on blue chip.But, based on the fluorescent material of powdered form fluorescent material, because of powdered form fluorescent material Inherent characteristicses so that the LED of commercial product there are problems that as follows at present:
(1) light scattering of uniformly dispersed difference and surface of the fluorescent powder grain in organic material, affects white light LED part Optical homogeneity and luminous efficiency;
(2) heat stability of organic material is poor, causes organic material degradation and aging, have impact on device illumination effect and Service life;
(3) disappearance of fluorescent material red color components cannot realize the white light of low colour temperature and high color rendering index (CRI), cause colour temperature high, no It is soft;
(4) the autonomous property right disappearance of commercial fluorescent material, business-like fluorescent material major part comes from America and Europe, day in the market This grade country, significantly limit the research and development and production of China's LED component.
Transparent fluorescent ceramic is successfully applied on the led device so that the problems referred to above have obtained effectively solving.Fluorescent material quilt After making transparent fluorescent ceramic, it is to avoid existing fluorescent material it is uneven caused by sedimentation after mixing with epoxy resin/organosilicon and Coating technique time restriction can not too long of shortcoming, provide a great convenience to production process for encapsulating arrangement, eliminate gluing Technique simultaneously avoids gluing uniformity controlling problem.Be additionally, since crystalline ceramics can printing opacity, with enough mechanical strengths, Chemical stability is high, and corrosion-resistant, intensity is big, hardness is high, makes device more resistant to abrasion, shock resistance, is damaged using surface through long-time Wound is few, keeps high permeability, makes LED component service life longer.Thus, white light LEDs are prepared using transparent fluorescent ceramic have Technological process is few, the advantage such as simple production process, cost are relatively low, lamp life length, the large-scale popularization application of favourable LED product.
At present, transparent fluorescent ceramic is applied to LED mainly two ways:Chinese patent CN104276818A provides one MULTILAYER COMPOSITE YAG crystalline ceramics is planted, which introduces fluorescent material, transparent fluorescent ceramic Jing blue lights in upper and lower transparent ceramic layer respectively LED sends white light after exciting.But this MULTILAYER COMPOSITE crystalline ceramics makes material due to contact surface component and the difference of structure Light loss is serious, reduces the luminous efficiency of light fixture.Chinese patent CN103682044A provides a kind of light transmission fluorescence ceramics White light LED part of the piece as luminous body, which mixes different rare earth ions in same ceramic matrix, by adjusting spectrum, reaches The purpose emitted white light after exciting to blue light.But the material that this method is obtained there are problems that color rendering index and.
The content of the invention
For the above-mentioned state of the art, the present invention provides a kind of composite transparent fluorescence ceramics piece for white light LEDs, and which is in whole Body structure, obtains white light Jing after LED chip is excited, and has light conversion efficiency height, color rendering index height, adjustable color etc. excellent Point.
The technical solution used in the present invention is:A kind of composite transparent fluorescence ceramics piece for white light LEDs, by two or more Little ceramic unit be integrally formed structure cross section is closely coupled;
Light is sent after LED chip independent excitation each little ceramic unit, i.e., each little ceramic unit is a light emitting pixel Point;Also, it is two or more that the color of light is sent after each light emitting pixel point of LED chip independent excitation, i.e. each light emitting pixel is pressed Two or more light emitting pixel points can be divided into according to the color lighted after exciting, such as the light emitting pixel point glowed after exciting is red Light image vegetarian refreshments, the light emitting pixel point for exciting rear Yellow light-emitting low temperature are gold-tinted pixel etc.;
The composite transparent fluorescence ceramics piece sends white light Jing after LED chip is excited.
The material of described each light emitting pixel point is not limited, and can be made up of with the centre of luminescence matrix, and wherein matrix includes The material with garnet structure such as YAG, LuAG, GGAG, Na2Ba2Si2O7、Ba9Sc2Si6O24、Ba9Lu2Si6O24Deng silicate Material system, and Y2O3、Lu2O3、Sc2O3、Al2O3、MgAl2O4、CaF2, one kind in ZnS, ALON, MgO, ZrO, BeO etc. or Various combinations, the centre of luminescence are Ce3+、Eu2+、Er3+、Tb3+Deng rare earth ion and Ti3+、Mn2+、Cr3+Deng transition metal ionss In one or more of combination.
The thickness of described composite transparent fluorescence ceramics piece is preferably 0.15-45mm, and radial dimension is preferably 0.5-50mm.
The radial dimension of described each light emitting pixel point is preferably 0.1-50mm.
The shape independence of described each light emitting pixel point.The shape of described each light emitting pixel point is not limited, and can be four sides Shape, circle, triangle, ellipse, polygon etc..Preferably, the shape of each light emitting pixel point is identical.
Used as a kind of implementation, described LED chip is blue-light LED chip, and at this moment this excites chip independent excitation each Two kind light are sent after light emitting pixel point preferably, a kind of is gold-tinted, another kind of is HONGGUANG, i.e. after each light emitting pixel point is according to exciting Luminous color can be divided to two kinds, and the light emitting pixel point glowed after exciting is HONGGUANG pixel, excites the luminous picture of rear Yellow light-emitting low temperature Vegetarian refreshments is gold-tinted pixel.Gold-tinted pixel is made up of gold-tinted ceramic material, such as GGAG:Ce、YAG:Ce etc., gold-tinted pixel Point is made up of HONGGUANG ceramic material, such as GGAG:Eu、GGAG:Cr、YAG:Pr、YAG:Eu etc..
Preferably, gold-tinted pixel is spaced apart with HONGGUANG pixel from the composite transparent fluorescence ceramics piece integrally; Further preferably, gold-tinted pixel is regularly spaced apart with HONGGUANG pixel, quantity and the gold-tinted pixel of HONGGUANG pixel The ratio of number of point is preferably (2-3):(1-2);Most preferably, the shape of described each light emitting pixel point is identical.
Used as another kind of implementation, described LED chip is UV LED chip, and at this moment this excites chip independent excitation Three kind light are sent after each light emitting pixel point preferably, a kind of is gold-tinted for green glow, one kind, and another kind of is HONGGUANG.That is, each light emitting pixel Point according to the color lighted after exciting can minutes three kinds, the light emitting pixel point glowed after exciting is HONGGUANG pixel, is sent out after exciting The light emitting pixel point of gold-tinted is gold-tinted pixel, and the light emitting pixel point for exciting rear green light is green glow pixel.Gold-tinted pixel It is to be made up of gold-tinted ceramic material, such as GGAG:Ce、YAG:Ce etc.;Gold-tinted pixel is made up of HONGGUANG ceramic material, for example GGAG:Eu、GGAG:Cr、YAG:Pr、YAG:Eu etc.;Green glow pixel is made up of green glow ceramic material, for example, mix europkium-activated Aluminium borate etc..
Preferably, from the composite transparent fluorescence ceramics piece integrally, gold-tinted pixel, HONGGUANG pixel and green glow pixel It is spaced apart;Further preferably, gold-tinted pixel, HONGGUANG pixel and green glow pixel are regularly spaced apart, HONGGUANG pixel The ratio of number of the quantity, the quantity of gold-tinted pixel and green glow pixel of point is preferably (2-3):(1-2):(2-3);It is optimum Choosing, the shape of described each light emitting pixel point are identical.
Present invention also offers a kind of method for preparing above-mentioned composite transparent fluorescence ceramics piece, according to each light emitting pixel point shape Shape and its annexation design mould;Using wet moulding method, the powder body of each light emitting pixel point is made into after slurry and injects mould Corresponding position in tool, then dehydrate, remove mould, or remove mould, dehydrate, obtain the base with some strength Body;Subsequently blank sintering, annealing and twin polishing are processed, composite transparent fluorescence ceramics piece is obtained.
Present invention also offers the method that another kind prepares above-mentioned composite transparent fluorescence ceramics piece, using wet moulding method, The powder body of each light emitting pixel point is made into into slurry;Then, according to each light emitting pixel point shape and its annexation on low-temperature receiver By each slurry flow casting molding;Finally, it is sintered, after polishing, obtains composite transparent fluorescence ceramics piece.
The composite transparent fluorescence ceramics piece of the present invention can be used for white light LED part, as a kind of structure, by the composite transparent Fluorescence ceramics piece is placed in above LED chip, and during working condition, composite transparent fluorescence ceramics piece obtains white Jing after LED chip is excited Light.Preferably, spacing 5mm-55mm is kept between the composite transparent fluorescence ceramics piece and LED chip.
In sum, the present invention is mixed into the principle of white light according to HONGGUANG, blue and green light three primary colours, in same ceramics It is combined on piece and obtains different light emitting pixel points, white light LEDs is then obtained under the exciting of LED chip, compared with prior art, Have the advantages that:
(1) the composite transparent fluorescence ceramics that the present invention is provided can be efficiently against fluorescent powder grain in organic material The problems such as uniformly dispersed difference, surface light scattering and red component are lacked, thus there is luminous efficiency higher, can obtain low The white light of colour temperature and high color rendering index (CRI);And, fluorescence ceramics good heat conductivity, and away from chip thermal source, can in encapsulation process To avoid the use of epoxy resin or silica gel, and then improve the luminous efficiency and service life of LED component;
(2) compared with transparent fluorescent ceramic is mixed, the composite transparent fluorescence ceramics that the present invention is provided effectively solve many more The Spectral modification of fluorescence ceramics presence and the problem of compensation are mixed, with higher luminous efficiency;With stacked laminated transparent fluorescence ceramics phase Than the composite transparent fluorescence ceramics that the present invention is provided directly include the pixel of various emission wavelengths on a lamellar body, do not have The ceramic interface vertical with incident ray is present, and there is no substantial amounts of light loss phenomenon, with more preferable illumination effect;Its transmission Rate covers 480~750nm in 50%-80%, emission spectrum.
(3) white light composition can be adjusted by adjusting shape, component and its annexation of each light emitting pixel point, thus It is compact conformation, flexibly adjustable.
Description of the drawings
Fig. 1 is the square array configuration of the composite transparent fluorescence ceramics piece in the embodiment of the present invention 1;
Fig. 2 is the structural representation of the white light LED part using the composite transparent fluorescence ceramics piece in the embodiment of the present invention 1 Figure;
Fig. 3 is the triangular array structure of the composite transparent fluorescence ceramics piece in the embodiment of the present invention 4;
Fig. 4 is the triangular array structure of the composite transparent fluorescence ceramics piece in the embodiment of the present invention 5;
Wherein, the reference in Fig. 2 is:1- composite transparent fluorescence ceramics pieces, 2-LED chips, 3- device pedestals.
Specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing, embodiment, it should be pointed out that described below is implemented Example is intended to be easy to the understanding of the present invention, and does not play any restriction effect to which.
Embodiment 1:
In the present embodiment, composite transparent fluorescence ceramics piece thickness is 0.5mm, and its surface is as shown in figure 1, by 4*4 little Tao Porcelain unit is integrally formed structure cross section is closely coupled, and each little ceramic unit structure is identical, square structure, overall shape Into the square array configuration of 4*4.
In the present embodiment, excitation source adopts blue-light LED chip, after the excitation source independent excitation each little ceramic unit Send the light of HONGGUANG and two kinds of colors of gold-tinted, i.e. each little ceramic unit be a light emitting pixel point, each light emitting pixel point according to The color lighted after exciting can be divided into HONGGUANG pixel and gold-tinted pixel, and the white boxes in such as Fig. 1 represent gold-tinted pixel, Black box represents HONGGUANG pixel.When the composite transparent fluorescence ceramics piece sends white light Jing after the excitation source is excited.
As shown in figure 1, in the square array configuration of the 4*4, gold-tinted pixel is regularly spaced with HONGGUANG pixel Distribution, the quadrate array in 4*4, i.e. for any one gold-tinted pixel, the adjacent pixel in its upper and lower, left and right is equal For HONGGUANG pixel.
In the present embodiment, HONGGUANG pixel is by YAG:Eu3+Material is constituted, and gold-tinted pixel is by GGAG:Ce3+Material Constitute.
The preparation method of the composite transparent fluorescence ceramics piece is as follows:
According to the gypsum mold of the structure design 4*4 quadrate array of the composite transparent fluorescence ceramics piece shown in Fig. 1;
With YAG:Eu3+The ceramic powder of the pixel to glow after exciting, the tetraethyl orthosilicate (TEOS) with 0.8wt% For sintering aid, dehydrated alcohol is disperse medium, by Al2O3The method of ball grinder ball milling, prepares yttrium-aluminium-garnet ceramic powder Slurry;
With GGAG:Ce3+To excite the ceramic powder of the pixel of rear Yellow light-emitting low temperature, with the tetraethyl orthosilicate of 0.8wt% (TEOS) it is sintering aid, dehydrated alcohol is disperse medium, by Al2O3The method of ball grinder ball milling, prepares gadolinium gallium-aluminum garnet Ceramic powder slurry;
According to shown in Fig. 1, yttrium-aluminium-garnet ceramic powder slurry is fallen respectively with gadolinium gallium-aluminum garnet ceramic powder slurry Enter corresponding square lattice in mould, be then dried 24h at low temperature, take out mould, subsequently in air atmosphere in 800 DEG C Calcining 2h, removes the TEOS of residual, finally biscuit is placed in vacuum drying oven and is sintered, be warming up to 1700 DEG C simultaneously with 10 DEG C/min 20h is incubated under 10-3Pa, room temperature is cooled to 10 DEG C/min then;
Sample after sintering is put in Muffle furnace, 1450 DEG C of insulation 10h are made annealing treatment in air atmosphere, then By potsherd twin polishing to 0.5mm.
Composite transparent fluorescence ceramics piece obtained above can be used for white light LED part, and its structure is as shown in Fig. 2 blue-ray LED Chip 2 is placed on device pedestal 3, and the composite transparent fluorescence ceramics piece is placed in above blue-light LED chip 2, and between the two Spacing 5mm-55mm is kept, during working condition, composite transparent fluorescence ceramics piece sends white light Jing after blue-light LED chip is excited.
Embodiment 2:
In the present embodiment, the composite transparent fluorescence ceramics piece in the structure and embodiment 1 of composite transparent fluorescence ceramics piece Structure is essentially identical, except that HONGGUANG pixel is by YAG:Pr3+Material is constituted, and gold-tinted pixel is by YAG:Ce3+Material Material is constituted.
The preparation method of the composite transparent fluorescence ceramics piece is as follows:
With YAG:Pr3+The ceramic powder of the pixel to glow after exciting, with deionized water as solvent, sodium polyacrylate (PAAS) it is dispersant, methylcellulose (MC) is binding agent, and glycerol is plasticiser, adds 0.6% PAAS, disperseed Stable YAG:Pr3+Powder suspension liquid, after ball milling 8h, adds 1.5%MC and 1.2% glycerol, continues ball milling 20h, obtain red Light ceramic slurry;
With YAG:Ce3+To excite the ceramic powder of the pixel of rear Yellow light-emitting low temperature, with deionized water as solvent, sodium polyacrylate (PAAS) it is dispersant, methylcellulose (MC) is binding agent, and glycerol is plasticiser, adds 0.6% PAAS, disperseed Stable YAG:Ce3+Powder suspension liquid, after ball milling 8h, adds 1.5%MC and 1.2% glycerol, continues ball milling 20h, obtain Huang Light ceramic slurry;
Corresponding position by ceramic size on the low-temperature receiver that pre-freezing temperature is -25 DEG C, according to the composite transparent shown in Fig. 1 Gold-tinted ceramic size and HONGGUANG ceramic size are carried out flow casting molding in correspondence position by the structure design of fluorescence ceramics piece, are controlled Scraper gap is 1mm, obtains monolayer square cast sheet, and after cast layer crystallization, repetitive operation is cast the second layer and the 3rd Layer, is controlled to 1mm per thickness degree, obtains multilamellar cast sheet;
After by multilamellar cast sheet lyophilization 24h, sinter at 1650 DEG C, be incubated 2h, then be cooled to room temperature with stove, it is then two-sided Sample is obtained after being polished to 0.5mm.
Composite transparent fluorescence ceramics piece obtained above can be used for white light LEDs, and its structure is as shown in Fig. 2 blue-light LED chip 2 are placed on device pedestal 3, and the composite transparent fluorescence ceramics piece is placed in above blue-light LED chip 2, during working condition, are combined Transparent fluorescent ceramic piece Jing after blue-light LED chip is excited after obtain white light.
Embodiment 3:
In the present embodiment, the composite transparent fluorescence ceramics piece in the structure and embodiment 1 of composite transparent fluorescence ceramics piece Structure is essentially identical, except that HONGGUANG pixel is by YAG:Eu3+Material is constituted, and gold-tinted pixel is by YAG:Ce3+Material Material is constituted.
The preparation method of the composite transparent fluorescence ceramics piece is essentially identical with the preparation method in embodiment 1, different It is HONGGUANG pixel by YAG:Eu3+Material is constituted, and gold-tinted pixel is by YAG:Ce3+Material is constituted.
Embodiment 4:
In the present embodiment, composite transparent fluorescence ceramics piece thickness is 2mm, and its surface is as shown in figure 3, single by 8 little ceramics Unit is integrally formed structure cross section is closely coupled, and each little ceramic unit structure is identical, structure triangular in shape, composite ceramic ceramics Square structure is integrally formed.
In the present embodiment, excitation source adopts blue-light LED chip, after the excitation source independent excitation each little ceramic unit Send the light of HONGGUANG and two kinds of colors of gold-tinted, i.e. each little ceramic unit be a light emitting pixel point, each light emitting pixel point according to The color lighted after exciting can be divided into HONGGUANG pixel and gold-tinted pixel, and the white triangles shape grid in such as Fig. 3 represents gold-tinted Pixel, oblique line filling triangle represent HONGGUANG pixel.When the composite transparent fluorescence ceramics piece is Jing after the excitation source is excited Send white light.
The preparation method of the composite transparent fluorescence ceramics piece is essentially identical with the preparation method in embodiment 1, different It is the gypsum mold of the structure design triangular array according to the composite transparent fluorescence ceramics piece shown in Fig. 3.
Embodiment 5:
In the present embodiment, the composite transparent fluorescence ceramics piece in the structure and embodiment 3 of composite transparent fluorescence ceramics piece Structure is essentially identical, except that HONGGUANG pixel and gold-tinted pixel are according to arrangement, wherein white triangles shape side shown in Fig. 4 Lattice represent gold-tinted pixel, and oblique line filling triangle represents HONGGUANG pixel.
The preparation method of the composite transparent fluorescence ceramics piece is essentially identical with the preparation method in embodiment 1, different It is the gypsum mold of the structure design triangular array according to the composite transparent fluorescence ceramics piece shown in Fig. 4.
Embodiment described above has been described in detail to technical scheme, it should be understood that the above is only For the specific embodiment of the present invention, the present invention is not limited to, all any modifications made in the spirit of the present invention, Supplementary or similar fashion replacement etc., should be included within the scope of the present invention.

Claims (10)

1. a kind of composite transparent fluorescence ceramics piece for white light LEDs, is characterized in that:By plural little ceramic unit in horizontal stroke Section is closely coupled to be integrally formed structure;
Light is sent after LED chip independent excitation each little ceramic unit, i.e., each little ceramic unit is a light emitting pixel point;And And, it is two or more that LED chip excites the color that rear each light emitting pixel point sends light;
The composite transparent fluorescence ceramics piece sends white light Jing after LED chip is excited.
2. the composite transparent fluorescence ceramics piece for being used for white light LEDs as claimed in claim 1, is characterized in that:Described is each luminous The material of pixel is made up of with the centre of luminescence matrix;
Matrix includes the material with garnet structure, silicate material system, and Y2O3、Lu2O3、Sc2O3、Al2O3、 MgAl2O4、CaF2, one or more in ZnS, ALON, MgO, ZrO, BeO of combination;
The centre of luminescence is Ce3+、Eu2+、Er3+、Tb3+Rare earth ion and Ti3+、Mn2+、Cr3+One kind in transition metal ionss or Various combinations.
3. the composite transparent fluorescence ceramics piece for being used for white light LEDs as claimed in claim 1, is characterized in that:Described is compound The thickness of bright fluorescence ceramics piece is 0.15-45mm, and radial dimension is 0.5-50mm;
Preferably, the radial dimension of described each light emitting pixel point is 0.1-50mm.
4. the composite transparent fluorescence ceramics piece for being used for white light LEDs as claimed in claim 1, is characterized in that:Described is each luminous The shape of pixel is respectively selected from the one kind in tetragon, circle, triangle, ellipse, polygon;
Preferably, the shape of described each light emitting pixel point is identical.
5. the composite transparent fluorescence ceramics piece for white light LEDs as described in any claim in Claims 1-4, which is special Levying is:Described LED chip is blue-light LED chip, and each light emitting pixel point is divided into gold-tinted pixel and HONGGUANG pixel;
Preferably, described gold-tinted pixel is by GGAG:Ce ceramic materials or YAG:Ce ceramic materials are constituted;
Preferably, HONGGUANG pixel is by GGAG:Eu ceramic materials, GGAG:Cr ceramic materials, YAG:Pr ceramic materials or YAG:Eu ceramic materials are constituted.
6. the composite transparent fluorescence ceramics piece for being used for white light LEDs as claimed in claim 5, is characterized in that:Gold-tinted pixel with HONGGUANG pixel is spaced apart;
Preferably, gold-tinted pixel is regularly spaced apart with HONGGUANG pixel;
Preferably, the quantity of HONGGUANG pixel is (2-3) with the ratio of number of gold-tinted pixel:(1-2).
7. the composite transparent fluorescence ceramics piece for white light LEDs as described in any claim in Claims 1-4, which is special Levying is:Described LED chip is UV LED chip, and each light emitting pixel point is divided into gold-tinted pixel, HONGGUANG pixel with green picture Vegetarian refreshments;
Preferably, gold-tinted pixel is by GGAG:Ce ceramic materials or YAG:Ce ceramic materials are constituted;
Preferably, HONGGUANG pixel is by GGAG:Eu ceramic materials, GGAG:Cr ceramic materials, YAG:Pr ceramic materials or YAG:Eu ceramic materials are constituted;
Preferably, green glow pixel is constituted by mixing europkium-activated aluminium borate ceramic material.
8. the composite transparent fluorescence ceramics piece for being used for white light LEDs as claimed in claim 7, is characterized in that:It is gold-tinted pixel, red Light image vegetarian refreshments is spaced apart with green glow pixel;
Preferably, gold-tinted pixel, HONGGUANG pixel and green glow pixel are regularly spaced apart;
Preferably, the ratio of number of the quantity of HONGGUANG pixel, the quantity of gold-tinted pixel and green glow pixel is preferably (2-3):(1-2):(2-3).
9. the preparation of the composite transparent fluorescence ceramics piece for white light LEDs as described in any claim in Claims 1-4 Method, is characterized in that:Mould is designed according to each light emitting pixel point shape and its annexation;Using wet moulding method, will be each The powder body of light emitting pixel point is made into after slurry and injects corresponding position in mould, then dehydrate, go mould, or mould from Tool, dehydrate, obtain the base substrate with some strength;Subsequently blank sintering, annealing and twin polishing are processed, is combined Transparent fluorescent ceramic piece;Or,
Using wet moulding method, the powder body of each light emitting pixel point is made into into slurry;Then, according to each light emitting pixel point shape and Its annexation is on low-temperature receiver by each slurry flow casting molding;Finally, it is sintered, after polishing, obtains composite transparent fluorescence pottery Ceramics.
10. a kind of white light LED part, including LED excites chip with being combined described in any claim in claim 1 to 7 Transparent fluorescent ceramic piece, during working condition, composite transparent fluorescence ceramics piece obtains white light Jing after LED chip is excited.
CN201710021677.7A 2017-01-12 2017-01-12 Composite transparent fluorescent ceramic chip and preparing method for white LEDs Pending CN106684216A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710021677.7A CN106684216A (en) 2017-01-12 2017-01-12 Composite transparent fluorescent ceramic chip and preparing method for white LEDs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710021677.7A CN106684216A (en) 2017-01-12 2017-01-12 Composite transparent fluorescent ceramic chip and preparing method for white LEDs

Publications (1)

Publication Number Publication Date
CN106684216A true CN106684216A (en) 2017-05-17

Family

ID=58850581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710021677.7A Pending CN106684216A (en) 2017-01-12 2017-01-12 Composite transparent fluorescent ceramic chip and preparing method for white LEDs

Country Status (1)

Country Link
CN (1) CN106684216A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108321285A (en) * 2018-04-02 2018-07-24 上海应用技术大学 A kind of white light LEDs patterned fluorescent membrane structure and preparation method thereof
WO2019052028A1 (en) * 2017-09-13 2019-03-21 深圳光峰科技股份有限公司 Wavelength conversion apparatus, and manufacturing method therefor
CN109798489A (en) * 2017-11-17 2019-05-24 深圳市绎立锐光科技开发有限公司 A kind of lighting device and automobile lighting lamp
CN109896843A (en) * 2017-12-07 2019-06-18 上海航空电器有限公司 Complex phase ceramic array, preparation method and light supply apparatus for laser lighting
CN110218085A (en) * 2019-06-17 2019-09-10 江苏师范大学 A kind of preparation method of the composite fluorescence ceramics for warm white optical illumination
CN111003946A (en) * 2019-12-10 2020-04-14 福建省长汀金龙稀土有限公司 Preparation method of glass/gadolinium gallium aluminum garnet composite material
CN112537953A (en) * 2020-12-16 2021-03-23 中国科学院上海硅酸盐研究所 Composite fluorescent ceramic and preparation method thereof
CN113024253A (en) * 2019-12-09 2021-06-25 上海航空电器有限公司 High-color-rendering edge-covering composite-structure wavelength conversion ceramic for laser illumination and preparation method thereof
CN113402269A (en) * 2021-06-29 2021-09-17 南通大学 Preparation method of three-color transparent fluorescent ceramic capable of adjusting white light of different degrees
CN116462510A (en) * 2023-04-10 2023-07-21 东华大学 Calcium fluoride-based fluorescent ceramic material and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100109575A1 (en) * 2004-12-06 2010-05-06 Koninklijke Philips Electronics, N.V. Single chip led as compact color variable light source
CN106030836A (en) * 2014-03-10 2016-10-12 欧司朗光电半导体有限公司 Wavelength conversion element, light-emitting semiconductor component comprising a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component comprising a wavelength conversion element
CN106298754A (en) * 2016-09-30 2017-01-04 鸿利智汇集团股份有限公司 The manufacture method of a kind of CSP lamp bead and CSP lamp bead

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100109575A1 (en) * 2004-12-06 2010-05-06 Koninklijke Philips Electronics, N.V. Single chip led as compact color variable light source
CN106030836A (en) * 2014-03-10 2016-10-12 欧司朗光电半导体有限公司 Wavelength conversion element, light-emitting semiconductor component comprising a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component comprising a wavelength conversion element
CN106298754A (en) * 2016-09-30 2017-01-04 鸿利智汇集团股份有限公司 The manufacture method of a kind of CSP lamp bead and CSP lamp bead

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109838763B (en) * 2017-09-13 2021-04-30 深圳光峰科技股份有限公司 Wavelength conversion device and preparation method thereof
WO2019052028A1 (en) * 2017-09-13 2019-03-21 深圳光峰科技股份有限公司 Wavelength conversion apparatus, and manufacturing method therefor
CN109838763A (en) * 2017-09-13 2019-06-04 深圳光峰科技股份有限公司 A kind of Wavelength converter and preparation method thereof
CN109798489A (en) * 2017-11-17 2019-05-24 深圳市绎立锐光科技开发有限公司 A kind of lighting device and automobile lighting lamp
CN109798489B (en) * 2017-11-17 2021-11-12 深圳市绎立锐光科技开发有限公司 Lighting device and automobile lighting lamp
CN109896843A (en) * 2017-12-07 2019-06-18 上海航空电器有限公司 Complex phase ceramic array, preparation method and light supply apparatus for laser lighting
CN108321285A (en) * 2018-04-02 2018-07-24 上海应用技术大学 A kind of white light LEDs patterned fluorescent membrane structure and preparation method thereof
CN110218085A (en) * 2019-06-17 2019-09-10 江苏师范大学 A kind of preparation method of the composite fluorescence ceramics for warm white optical illumination
CN113024253A (en) * 2019-12-09 2021-06-25 上海航空电器有限公司 High-color-rendering edge-covering composite-structure wavelength conversion ceramic for laser illumination and preparation method thereof
CN113024253B (en) * 2019-12-09 2023-09-12 上海航空电器有限公司 High-color-rendering edge-covering composite structure wavelength conversion ceramic for laser illumination and preparation method thereof
CN111003946A (en) * 2019-12-10 2020-04-14 福建省长汀金龙稀土有限公司 Preparation method of glass/gadolinium gallium aluminum garnet composite material
CN111003946B (en) * 2019-12-10 2022-06-24 福建省长汀金龙稀土有限公司 Preparation method of glass/gadolinium gallium aluminum garnet composite material
CN112537953A (en) * 2020-12-16 2021-03-23 中国科学院上海硅酸盐研究所 Composite fluorescent ceramic and preparation method thereof
CN112537953B (en) * 2020-12-16 2022-03-08 中国科学院上海硅酸盐研究所 Composite fluorescent ceramic and preparation method thereof
CN113402269A (en) * 2021-06-29 2021-09-17 南通大学 Preparation method of three-color transparent fluorescent ceramic capable of adjusting white light of different degrees
CN116462510A (en) * 2023-04-10 2023-07-21 东华大学 Calcium fluoride-based fluorescent ceramic material and preparation method thereof

Similar Documents

Publication Publication Date Title
CN106684216A (en) Composite transparent fluorescent ceramic chip and preparing method for white LEDs
CN107540368B (en) Preparation method of complex-phase semitransparent fluorescent ceramic and LED module
CN106887486B (en) Structure of Bar-code fluorescence ceramics and the preparation method and application thereof for white light LED part
CN103205254B (en) Comprise white light LEDs of New Solid transparent fluorescent material and preparation method thereof
CN101697367A (en) Method for preparing LED by using transparent ceramics
CN103159407B (en) Fluorescent powder/silicon-based mesoporous material composite fluorescent glass and preparation method thereof
CN107200588B (en) Preparation method of aluminum nitride matrix fluorescent ceramic and related fluorescent ceramic
CN110240468B (en) Fluorescent ceramic and preparation method thereof
US9085733B2 (en) Yttrium aluminum garnet phosphor, method for preparing the same, and light-emitting diode containing the same
CN108947516A (en) A kind of (Cu, Ce): YAG transparent fluorescent ceramic and the preparation method and application thereof
CN106479500A (en) A kind of luminescent glass ceramic and its preparation method and the application in LED illumination device
WO2018028265A1 (en) Wavelength conversion device and preparation method therefor, light-emitting device and projection device
CN106518037A (en) Silicate fluorescent ceramic with full-spectrum emission effect and preparation method thereof
CN113402269A (en) Preparation method of three-color transparent fluorescent ceramic capable of adjusting white light of different degrees
CN113480311A (en) Preparation method of Ce: YAG fluorescent ceramic emitting warm white light
Sun et al. Green emitting spinel/Ba2SiO4: Eu2+/spinel sandwich structure robust ceramic phosphor prepared by spark plasma sintering
CN104003726B (en) A kind of YAG crystalline ceramics for white LED lamp and preparation method thereof
CN109679654A (en) A kind of fluorescent powder and preparation method thereof
CN104119071B (en) A kind of LED lamp adopting novel transparent pottery
CN109896843A (en) Complex phase ceramic array, preparation method and light supply apparatus for laser lighting
CN1952039A (en) Sialon fluorescent powder for white light LED and electric light sources manufactured therefrom
CN104496474B (en) A kind of ultraviolet conversion of white light LED transparent ceramic material and preparation method thereof
CN104291823B (en) A kind of YAG crystalline ceramics and preparation method thereof
CN114031400B (en) Single-phase warm white fluorescent ceramic and preparation method and application thereof
CN109336582A (en) A kind of composite construction fluorescence ceramics and preparation method thereof for white light LEDs

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170517

RJ01 Rejection of invention patent application after publication