CN106684079A - Integrated circuit - Google Patents
Integrated circuit Download PDFInfo
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- CN106684079A CN106684079A CN201510750277.0A CN201510750277A CN106684079A CN 106684079 A CN106684079 A CN 106684079A CN 201510750277 A CN201510750277 A CN 201510750277A CN 106684079 A CN106684079 A CN 106684079A
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- integrated circuit
- inductance
- pad
- metal level
- electric current
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Abstract
An integrated circuit comprises a first inductor, a second inductor and a blocking device, wherein the first inductor is arranged on a metal layer, the second inductor is arranged on the metal layer, and the blocking device is configured on the metal layer, is arranged between the first inductor and the second inductor and is used for blocking coupling between the first inductor and the second inductor.
Description
Technical field
The present invention relates to a kind of basic electronic circuit, and more particularly to a kind of integrated circuit.
Background technology
In integrated circuits, often there is inductance in the inner and circuit in coupling phenomenon, such as betide electricity
Between sense and inductance, between circuit and circuit and between inductance and circuit.Especially in high frequency field
(such as 5GHz-10GHz), or more than 10GHz, its coupling phenomenon becomes apparent from, and has a strong impact on collection
Into the efficiency of circuit.
So that coupling phenomenon is betided between inductance and inductance as an example, due to the development of the technique of integrated circuit
Direction is gradually miniaturized, and causes the inductance in integrated circuit increasingly nearer with the distance between inductance, from
And cause the coupling phenomenon between inductance and inductance further notable.
The content of the invention
To solve the above problems, a technical elements of the present invention are related to a kind of integrated circuit, this integrated electricity
Road includes the first inductance, the second inductance and stopper.First inductance is located at a metal level, the second inductance
Positioned at above-mentioned metal level, and stopper is configured on above-mentioned metal level, and positioned at the first inductance and second
Between inductance, to stop the coupling between the first inductance and the second inductance.
Another technical elements of the present invention are related to a kind of integrated circuit, and this integrated circuit is electric comprising first
Sense, the second inductance and electric current loop.First inductance is located at a metal level, and the second inductance is located at above-mentioned metal
Layer, and electric current loop is configured on above-mentioned metal level, and between the first inductance and the second inductance, and
Electric current loop is located at a plane, and this plane is approximately perpendicularly to above-mentioned metal level.
Therefore, technology according to the present invention content, the embodiment of the present invention by providing a kind of integrated circuit,
The coupling phenomenon improved between inductance and inductance is used, and lifts the efficiency of integrated circuit.
After refering to following description, the technical field of the invention those of ordinary skill works as can be easily
Understand the essence spirit and other goals of the invention of the present invention, and other technology hands of the present invention
Section and enforcement aspect.
Description of the drawings
It is that above and other objects of the present invention, feature, advantage and embodiment can be become apparent,
Institute accompanying drawings are described as follows：
Fig. 1 is to illustrate a kind of schematic diagram of integrated circuit according to one embodiment of the invention.
Fig. 2 is to illustrate a kind of schematic diagram of integrated circuit according to one embodiment of the invention.
Fig. 3 is to illustrate a kind of schematic diagram of integrated circuit according to one embodiment of the invention.
Fig. 4 is to illustrate a kind of fence such as the integrated circuit of Fig. 3 according to one embodiment of the invention to illustrate
Figure.
Fig. 5 is to illustrate a kind of experimental data figure of integrated circuit according to one embodiment of the invention.
Fig. 6 is to illustrate a kind of experimental data figure of integrated circuit according to one embodiment of the invention.
Fig. 7 is to illustrate a kind of experimental data figure of integrated circuit according to one embodiment of the invention.
According to usual operating type, various features are not drawn to scale with component in figure, its drafting
Mode is in order to specific features and component related to the present invention are presented in optimal manner.Additionally,
Between different schemas, similar component/part is censured with same or analogous element numbers.
Specific embodiment
In order that the narration of the present invention it is more detailed with it is complete, below for the enforcement aspect of the present invention
Illustrative description is proposed with specific embodiment；But this not implements or is embodied as with the present invention
The unique forms of example.Cover in embodiment multiple specific embodiments feature and to construction with
Operate the method and step and its order of these specific embodiments.However, also can be embodied as using other
Example is reaching identical or impartial function and sequence of steps.
Unless this specification is defined otherwise, the implication and the present invention of science and technology vocabulary used herein
Those of ordinary skill in the art understands identical with usual meaning.Additionally, in discord
In the case of context conflicts, the singular noun used by this specification covers the complex number type of the noun；And
Also the odd number type of the noun is covered during plural noun used.
In addition, with regard to " coupling " used herein, can refer to that two or multiple components are mutually directly made
Entity is in electrical contact, or mutually puts into effect body or in electrical contact indirectly, is also referred to as two or multiple components
Mutual operation or action.
Fig. 1 is to illustrate a kind of schematic diagram of integrated circuit according to one embodiment of the invention.As illustrated,
Integrated circuit 100 includes inductance 110 and inductance 120.Above-mentioned inductance 110 and inductance 120 are all located at
Metal level 500.When integrated circuit 100 is operated, can be in Z axis between inductance 110 and inductance 120
It is upper to produce coupling 600, so as to affect the efficiency of integrated circuit 100.
Fig. 2 is to illustrate a kind of schematic diagram of integrated circuit according to another embodiment of the present invention.Compared to figure
Integrated circuit 100 shown in 1, the integrated circuit 100A that Fig. 2 draws further includes stopper 130, this
Stopper 130 is configured on metal level 500, and between inductance 110 and inductance 120, to
Stop the coupling between inductance 110 and inductance 120.For example, stopper 130 may be used to stop
The coupling 600 between inductance 110 and inductance 120 shown in Fig. 1.
In one embodiment, stopper 130 can be electric current loop.As shown in Fig. 2 electric current loop 130
In a plane, such as YZ planes, this plane is approximately perpendicularly to metal level 500.Configure by said structure
Mode, when integrated circuit 100A is operated, produces between inductance 110 and inductance 120 on Z axis
Coupling, will be stopped by electric current loop 130, and effect of the coupling to integrated circuit 100A can be improved
The impact of energy.This be due to electric current loop 130 be a loop, therefore, inductance 110,120
When the magnetic field of upper generation passes through electric current loop 130, induced field can be generated on electric current loop 130 to revolt
The magnetic field that inductance 110,120 is generated, shows so as to improve the coupling between inductance 110 and inductance 120
As to lift the efficiency of integrated circuit 100A.
In another embodiment, the visual actual demand of electric current loop 130 and be grounded or suspension joint
(floating).In another embodiment, electric current loop 130 can be polygon electric current loop.This polygon electricity
The height H of stream ring 130 is extended upwardly to the top 139 of polygon electric current loop 130 by metal level 500,
Height H is about 50 microns (um) to 200 microns (um).In another embodiment, above-mentioned height H
About 80 microns (um) to 135 microns (um).
In an optional embodiment, the diameter of polygon electric current loop 130 is about 15 microns (um) extremely
35 microns (um).In another embodiment, the diameter of polygon electric current loop 130 is about 18 microns (um)
To 25 microns (um).
Referring again to Fig. 2, electric current loop 130 includes pad 132, wire 134 and pad 136.Yu Jie
On structure, pad 132 is coupled to pad 136, and for example, pad 132 can pass through connecting line 138
To be coupled to pad 136.Additionally, wire 134 include the end 133 of first end 131 and second, first
End 131 is coupled to pad 132, and the second end 133 is coupled to pad 136.
In one embodiment, the height H of wire 134 is extended upwardly to by pad 136 and led
The top 139 of line 134, height H is about 50 microns (um) to 200 microns (um).In another real
In applying example, above-mentioned height H is about 80 microns (um) to 135 microns (um).
In another embodiment, pad 132 is about 71 microns (um) extremely to pad 136 apart from D
171 microns (um).In another embodiment, the first end 131 of wire 134 is coupled with pad 132
At first point, the second end 133 and the pad 136 of wire 134 are coupled to second point, above-mentioned first point
It is about 71 microns (um) to 171 microns (um) with the distance of second point.
In an optional embodiment, the diameter of wire 134 is about 15 microns (um) to 35 microns
(um).In another embodiment, the diameter of wire 134 is about 18 microns (um) to 25 microns (um).
Fig. 3 is to illustrate a kind of schematic diagram of integrated circuit according to yet another embodiment of the invention.Compared to figure
The integrated circuit 100B that integrated circuit 100A shown in 2, Fig. 3 draw further includes fence 140.This
Fence 140 is configured at the lower section of metal level 500, and between 110 inductance and inductance 120.So
One, when integrated circuit 100B is operated, the coupling produced between inductance 110 and inductance 120,
In addition to it can be stopped by electric current loop 130, more can be stopped by fence 140, and can further improve coupling
Close the impact of the efficiency to integrated circuit 100B.
In certain embodiments, fence 140 is also referred to as vertical view case formula ground protection layer (vertical
patterned ground shielding,vertical PGS)。
Fig. 4 is to illustrate a kind of fence of integrated circuit as shown in Figure 3 according to further embodiment of this invention
Schematic diagram.In the present embodiment, remaining implementation of the fence 140 of Fig. 3 is illustrated, as illustrated,
Fence 140 includes pillar 141 and multiple stripes 142～146.These stripes 142～146 it is every
One is respectively coupled to pillar 141, and for example, the middle body of stripes 142 is coupled to pillar
141, additionally, the middle body of stripes 143 is coupled to pillar 141, and it is spaced with stripes 142
Certain distance.The configuration mode of stripes 144～146 similar to stripes 142～143 configuration mode,
Do not repeat in this.In another embodiment, pillar 141 is configured on first direction and (is such as configured at Z
On direction of principal axis), above-mentioned stripes 142～146 are configured in second direction (be such as configured in Y direction),
And first direction is approximately perpendicularly to second direction.As shown in figure 4, the pillar 141 and strip of fence 140
Portion 142～146 forms herring-bone form structure, and this herring-bone form structure is conducive to disturbing inductance 110 and inductance 120
Between the coupling that produces, and can further improve and couple the shadow to the efficiency of integrated circuit 100B
Ring.
Fig. 5 is to illustrate a kind of experimental data figure of integrated circuit according to one embodiment of the invention.This experiment
Datagram indicated that under different frequency, the loss (Insertion between the inductance of integrated circuit
loss).As illustrated, curve m1 is provided without stopper (such as integrated circuit：Electric current loop) experiment
Data.Curve m2～m4 adopts the checking data of stopper for the integrated circuit of the embodiment of the present invention,
Specifically, curve m2 is the checking number that integrated circuit adopts height for the stopper of 80 microns (um)
According to, curve m3 is the checking data that integrated circuit adopts height for the stopper of 200 microns (um),
Curve m4 is the checking data that integrated circuit adopts height for the stopper of 135 microns (um).By scheming
5 experimental data understands that the coupling value of curve m2～m4 is low compared with the coupling value of curve m1, and highest can
3.5dB is reduced, therefore, it is able to prove that the integrated circuit of the embodiment of the present invention can be reduced between inductance really
Coupling value, and can improve and couple the impact to the efficiency of integrated circuit.It is so of the invention
The numerical value do not lifted with above-described embodiment is limited, and practising its those skilled in the art can be according to actual demand
Adjust above-mentioned numerical value to reach optimal efficiency.
Fig. 6 is to illustrate a kind of experimental data figure of integrated circuit according to another embodiment of the present invention.This reality
Test datagram to indicate that under different frequency, the loss between the inductance of integrated circuit.As schemed
Show, curve m5～m6 adopts stopper (such as the integrated circuit of the embodiment of the present invention：Electric current loop) test
Card data, specifically, curve m5 is that integrated circuit adopts wire two ends at a distance of 71 microns (um)
Stopper checking data, curve m6 be integrated circuit using wire two ends at a distance of 171 microns (um)
Stopper checking data.From the experimental data of Fig. 6, the coupling value of curve m5～m6 compared with
The coupling value of curve m1 is low, therefore, it is able to prove that the integrated circuit of the embodiment of the present invention can drop really
Coupling value between low inductance, and the impact for coupling the efficiency to integrated circuit can be improved.The right present invention is not
Be limited with the numerical value that above-described embodiment is lifted, technical staff can according to actual demand adjust above-mentioned numerical value with
Reach optimal efficiency.
Fig. 7 is to illustrate a kind of experimental data figure of integrated circuit according to yet another embodiment of the invention.This reality
Test datagram to indicate that under different frequency, the loss between the inductance of integrated circuit.As schemed
Show, curve m7～m9 adopts stopper (such as the integrated circuit of the embodiment of the present invention：Electric current loop) test
Card data, specifically, curve m7 is stopper of the integrated circuit using a diameter of 18 microns (um)
Checking data, curve m8 be integrated circuit using a diameter of 25 microns (um) stopper checking
Data, curve m9 is checking data of the integrated circuit using the stopper of a diameter of 35 microns (um).
From the experimental data of Fig. 7, the coupling value of curve m7～m9 is low compared with the coupling value of curve m1,
Therefore, it is able to prove the coupling value that the integrated circuit of the embodiment of the present invention can be reduced between inductance really, and
Impact of the coupling to the efficiency of integrated circuit can be improved.The number that so present invention is not lifted with above-described embodiment
Value is limited, and practising its those skilled in the art can adjust above-mentioned numerical value to reach optimal efficiency according to actual demand.
From the invention described above embodiment, there are following advantages using the present invention.The present invention is implemented
By a kind of integrated circuit is provided, the coupling that using improves between inductance and inductance shows example
As, and lift the efficiency of integrated circuit.
Although disclosing the specific embodiment of the present invention in embodiment above, so it is not limited to
The present invention, the technical field of the invention those of ordinary skill, in the principle without departing substantially from the present invention and essence
In the case of refreshing, when it can be carried out it is various change with modification, therefore protection scope of the present invention when with
What claims were defined is defined.
Symbol description
100：Integrated circuit
100A～100B：Integrated circuit
110、120：Inductance
130：Electric current loop
131：First end
132、136：Pad
133：Second end
134：Wire
138：Connecting line
139：Top
140：Fence
141：Pillar
142～146：Stripes
500：Metal level
600：Coupling
Claims (10)
1. a kind of integrated circuit, comprising：
One first inductance, positioned at a metal level；
One second inductance, positioned at the metal level；And
One stopper, is configured on the metal level, and second electric with this positioned at first inductance
Between sense, to stop the coupling between first inductance and second inductance.
2. integrated circuit according to claim 1, wherein, stopper ground connection or suspension joint.
3. integrated circuit according to claim 1, wherein, the stopper is included：
One first pad；
One second pad, is coupled to first pad；And
One wire, comprising：
One first end, is coupled to first pad；And
One second end, is coupled to second pad.
4. integrated circuit according to claim 1, further includes：
One fence, is configured at metal level lower section, and second electric with this positioned at first inductance
Between sense.
5. integrated circuit according to claim 4, wherein, the fence is included：
One pillar, is configured on a first direction；And
Multiple stripes, each of the plurality of stripes is respectively coupled to the pillar, and matches somebody with somebody
It is placed in a second direction, wherein, the first direction is perpendicular to the second direction.
6. a kind of integrated circuit, comprising：
One first inductance, positioned at a metal level；
One second inductance, positioned at the metal level；And
One electric current loop, is configured on the metal level, and second electric with this positioned at first inductance
Between sense, wherein, the electric current loop is located at a plane, and the plane is approximately perpendicularly to the metal level.
7. integrated circuit according to claim 6, wherein, electric current loop ground connection or suspension joint.
8. integrated circuit according to claim 6, wherein, the electric current loop is included：
One first pad；
One second pad, is coupled to first pad；And
One wire, comprising：
One first end, is coupled to first pad；And
One second end, is coupled to second pad.
9. integrated circuit according to claim 6, further includes：
One fence, is configured at metal level lower section, and second electric with this positioned at first inductance
Between sense.
10. integrated circuit according to claim 9, wherein, the fence is included：
One pillar, is configured on a first direction；And
Multiple stripes, each of the plurality of stripes is respectively coupled to the pillar, and matches somebody with somebody
It is placed in a second direction, wherein, the first direction is perpendicular to the second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510750277.0A CN106684079B (en) | 2015-11-06 | 2015-11-06 | Integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510750277.0A CN106684079B (en) | 2015-11-06 | 2015-11-06 | Integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106684079A true CN106684079A (en) | 2017-05-17 |
| CN106684079B CN106684079B (en) | 2019-05-14 |
Family
ID=58858476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510750277.0A Active CN106684079B (en) | 2015-11-06 | 2015-11-06 | Integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106684079B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06176928A (en) * | 1992-12-10 | 1994-06-24 | Tdk Corp | Laminated electronic component |
| US20040178472A1 (en) * | 2002-10-15 | 2004-09-16 | Silicon Laboratories, Inc. | Electromagnetic shielding structure |
| CN103518260A (en) * | 2011-03-21 | 2014-01-15 | 吉林克斯公司 | Symmmetrical center tap inductor structure |
-
2015
- 2015-11-06 CN CN201510750277.0A patent/CN106684079B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06176928A (en) * | 1992-12-10 | 1994-06-24 | Tdk Corp | Laminated electronic component |
| US20040178472A1 (en) * | 2002-10-15 | 2004-09-16 | Silicon Laboratories, Inc. | Electromagnetic shielding structure |
| CN103518260A (en) * | 2011-03-21 | 2014-01-15 | 吉林克斯公司 | Symmmetrical center tap inductor structure |
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| Publication number | Publication date |
|---|---|
| CN106684079B (en) | 2019-05-14 |
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