CN106679853A - Matrix film pressure sensor based on flexible circuit board technology and manufacturing method thereof - Google Patents
Matrix film pressure sensor based on flexible circuit board technology and manufacturing method thereof Download PDFInfo
- Publication number
- CN106679853A CN106679853A CN201610979812.4A CN201610979812A CN106679853A CN 106679853 A CN106679853 A CN 106679853A CN 201610979812 A CN201610979812 A CN 201610979812A CN 106679853 A CN106679853 A CN 106679853A
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- China
- Prior art keywords
- circuit board
- sensor
- pressure sensor
- flexible pcb
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005516 engineering process Methods 0.000 title abstract description 7
- 238000000034 method Methods 0.000 claims description 32
- 229920002521 macromolecule Polymers 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 5
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a matrix film pressure sensor based on a flexible circuit board technology. The matrix film pressure sensor comprises an adhesion force sensitive element, a UV adhesive layer, and a sensor circuit board. The adhesion force sensitive element is glued to the sensor circuit board through the UV adhesive layer. The invention further relates to a manufacturing method of the matrix film pressure sensor based on a flexible circuit board technology. The matrix film pressure sensor based on a flexible circuit board technology, which combines a flexible circuit board and a film force sensitive element, makes up for the disadvantages and carries forward the advantages of the flexible circuit board and the film force sensitive element. The matrix film pressure sensor has the characteristics of high density of wiring, low weight, small thickness and long service life, is suitable for mass production, and has a wide application range.
Description
Technical field
The present invention relates to sensor technical field, more particularly to pressure sensor technique field, specifically refer to one kind and be based on
The matrix form diaphragm pressure sensor of flexible PCB technique and manufacture method.
Background technology
Sensor is a kind of detection means, can experience measured information, and can be by the information for detecting, by a set pattern
Rule is for conversion into the signal of telecommunication or the information output of other desired forms, is widely used in water conservancy, geology, meteorology, chemical industry, medical treatment
The aspects such as health.Pressure transducer has become that technology in various kinds of sensors is most ripe, performance is most stable, the class of cost performance highest one
Sensor.Wherein diaphragm pressure sensor has the advantages that other solid state pressure sensors are incomparable, such as soft, stability
Can be good, corrosion-resistant etc., and thin-film force transducer is high with light micro volume in some places conditional to measurement space
The advantage for being difficult to substitute such as linear substitutes thick heavy pressure transducer, is being widely used on the market.At present, on the market
Diaphragm pressure sensor is all based on typography making, and interface section adopts puncture type cold end terminal.Due to its manufacturing process
Affect with interface, this kind of sensor has service life short, and sensor space is required greatly, and reticular density is not high, and product is oxidizable etc.
Shortcoming, particularly reticular density are low, and service life is short, and interface is unstable, and the application for making diaphragm pressure sensor is subject to the very day of one's doom
System.
The content of the invention
The purpose of the present invention is the shortcoming for overcoming above-mentioned prior art, there is provided one kind can realize that raising dot matrix is close
Degree, the matrix form diaphragm pressure sensor based on flexible PCB technique for increasing the service life and manufacture method.
To achieve these goals, the matrix form diaphragm pressure sensor based on flexible PCB technique of the invention and system
Make method and there is following composition：
Should be based on flexible PCB technique matrix form diaphragm pressure sensor, including paste force sensing element, UV glue-lines and
Sensor circuit board, described force sensing element of pasting is connected by described UV glue-lines with described sensor circuit board bonding.
It is preferred that described sensor circuit board is provided with pad.
More preferably, described force sensing element of pasting is connected by described UV glue-lines with described pad bonding.
It is preferred that described pastes force sensing element for macromolecule force sensing element.
It is preferred that described sensor circuit board is flexible PCB.
Also include a kind of method of manufacture the sensor, the method is comprised the following steps：
(1) profile of sensor is drawn；
(2) drawing principle figure, confirms the line number and columns of the matrix of sensor on flexible PCB；
(3) data file for manufacturing sensor is generated；
(4) sensor circuit board is made according to described data file；
(5) UV glue is covered on pad in the way of printing；
(6) the quick material of power macromolecule is printed to corresponding welding disking area；
(7) sensor is toasted with infrared incubator, it is ensured that between macromolecule force-sensitive material, UV glue and PFC pads
Adhesive force.
The matrix form diaphragm pressure sensor based on flexible PCB technique and the manufacture method in the invention is employed, will
FPC (flexible PCB) and thin film power is quick combines, compensate for the shortcoming of the two, the two advantage be developed, with Distribution density
The characteristics of high, lightweight, thickness of thin, long service life, it is suitable for producing in enormous quantities, is with a wide range of applications.
Description of the drawings
Fig. 1 is the matrix form diaphragm pressure sensor based on flexible PCB technique of the present invention and the signal of manufacture method
Figure.
Fig. 2 is the matrix form diaphragm pressure sensor based on flexible PCB technique and the level of manufacture method of the present invention
The schematic diagram of structure.
Fig. 3 is the pad appearance schematic diagram based on flexible PCB technique of the present invention.
Fig. 4 is the pad connection mode schematic diagram based on flexible PCB technique of the present invention.
Specific embodiment
In order to more clearly describe the technology contents of the present invention, carry out with reference to specific embodiment further
Description.
Matrix form diaphragm pressure sensor of flexible PCB technique should be based on, as shown in Fig. 2 including pasting the quick unit of power
Part, UV glue-lines and sensor circuit board, described pastes force sensing element by described UV glue-lines and described sensor circuit
Plate bonding connection.
In a kind of preferably embodiment, described sensor circuit board is provided with pad, described sensor laying
On the pad of soft sensor, bond pad shapes as shown in figure 3, the connection mode between pad (is not limited only to 4 as shown in Figure 4
× 4 matrixes, can be more pad combinations).
In a kind of more preferably embodiment, described pastes force sensing element by described UV glue-lines and described pad
Bonding connection.
In a kind of preferably embodiment, described pastes force sensing element for macromolecule force sensing element.
In a kind of preferably embodiment, described sensor circuit board is flexible PCB.
Also include a kind of method of manufacture the sensor, the method is comprised the following steps：
(1) profile of sensor is drawn；
(2) drawing principle figure, confirms the line number and columns of the matrix of sensor on flexible PCB；
(3) data file for manufacturing sensor is generated；
(4) sensor circuit board is made according to described data file；
(5) UV glue is covered on pad in the way of printing；
(6) the quick material of power macromolecule is printed to corresponding welding disking area；
(7) sensor is toasted with infrared incubator, it is ensured that between macromolecule force-sensitive material, UV glue and PFC pads
Adhesive force.
In a kind of specific embodiment, as shown in figure 1, introducing manufacture of the present invention：
(1) structure is drawn, the profile of the sensor of confirmation.
(2) schematic diagram is drawn, and confirms the line number and columns of sensor matrixes on FPC.
(3) PCBlayout, ultimately generating can supply the file of FPC manufacturers manufacture.
(4) FPC makes.FPC manufacturers form the quick base plate of power according to documenting FPC is made.
(5) UV glue is applied.Using typography, UV glue is covered on sensor pads.
(6) force-sensitive material is pasted.Using typography, the quick material of power macromolecule is printed onto into corresponding sensor pad areas
Domain, forms corresponding pressure sensor points.
(7) infrared baking.Toasted with infrared incubator, it is ensured that macromolecule force-sensitive material, UV glue has necessarily with PFC pads
Adhesive force.
The matrix form diaphragm pressure sensor based on flexible PCB technique in the invention is employed, by FPC (flexible electrical
Road plate) and thin film power is quick combines, and compensate for the shortcoming of the two, develops the two advantage, with Distribution density it is high, lightweight,
The characteristics of thickness of thin, long service life, it is suitable for producing in enormous quantities, is with a wide range of applications.
In this description, the present invention is described with reference to its specific embodiment.But it is clear that still can make
Various modifications and alterations are without departing from the spirit and scope of the present invention.Therefore, specification and drawings are considered as illustrative
And it is nonrestrictive.
Claims (6)
1. a kind of matrix form diaphragm pressure sensor based on flexible PCB technique, it is characterised in that described sensor bag
Include and paste force sensing element, UV glue-lines and sensor circuit board, it is described paste force sensing element by described UV glue-lines with it is described
Sensor circuit board bonding connection.
2. the matrix form diaphragm pressure sensor based on flexible PCB technique according to claim 1, it is characterised in that
Described sensor circuit board is provided with pad.
3. the matrix form diaphragm pressure sensor based on flexible PCB technique according to claim 2, it is characterised in that
Described force sensing element of pasting is connected by described UV glue-lines with described pad bonding.
4. the matrix form diaphragm pressure sensor based on flexible PCB technique according to claim 1, it is characterised in that
Described pastes force sensing element for macromolecule force sensing element.
5. the matrix form diaphragm pressure sensor based on flexible PCB technique according to claim 1, it is characterised in that
Described sensor circuit board is flexible PCB.
6. the matrix form diaphragm pressure based on flexible PCB technique any one of a kind of manufacturing claims 1 to 5 is passed
The method of sensor, it is characterised in that described method is comprised the following steps：
(1) profile of sensor is drawn；
(2) drawing principle figure, confirms the line number and columns of the matrix of sensor on flexible PCB；
(3) data file for manufacturing sensor is generated；
(4) sensor circuit board is made according to described data file；
(5) UV glue is covered on pad in the way of printing；
(6) the quick material of power macromolecule is printed to corresponding welding disking area；
(7) sensor is toasted with infrared incubator, it is ensured that the attachment between macromolecule force-sensitive material, UV glue and PFC pads
Power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610979812.4A CN106679853A (en) | 2016-11-08 | 2016-11-08 | Matrix film pressure sensor based on flexible circuit board technology and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610979812.4A CN106679853A (en) | 2016-11-08 | 2016-11-08 | Matrix film pressure sensor based on flexible circuit board technology and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106679853A true CN106679853A (en) | 2017-05-17 |
Family
ID=58840273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610979812.4A Pending CN106679853A (en) | 2016-11-08 | 2016-11-08 | Matrix film pressure sensor based on flexible circuit board technology and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106679853A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327960A (en) * | 2018-10-19 | 2019-02-12 | 深圳市朋辉科技术有限公司 | A kind of large size FPC sensing membrane structure and its manufacture craft |
| CN109489872A (en) * | 2018-10-19 | 2019-03-19 | 深圳市朋辉科技术有限公司 | A kind of flexible sensor modular structure and its manufacture craft |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1948932A (en) * | 2005-10-13 | 2007-04-18 | 探微科技股份有限公司 | Method of making pressure sensor |
| CN101885463A (en) * | 2010-06-21 | 2010-11-17 | 东北大学 | Development method of flexible pressure-sensitive element based on carbon nano-tube filled high polymer composite material |
| CN102539035A (en) * | 2012-01-17 | 2012-07-04 | 江苏物联网研究发展中心 | Lattice type flexible pressure distribution sensor and manufacturing method thereof |
| CN102958281A (en) * | 2011-08-18 | 2013-03-06 | 嘉善德智医疗器械科技有限公司 | Method for preparing circuits on flexible base materials and application thereof |
| CN104199571A (en) * | 2014-08-14 | 2014-12-10 | 深圳市豪威薄膜技术有限公司 | Manufacturing method of flexible film function piece |
| CN205389295U (en) * | 2016-03-21 | 2016-07-20 | 江西合力泰科技有限公司 | Flexible circuit board assembly |
| CN206161200U (en) * | 2016-11-08 | 2017-05-10 | 上海市共进通信技术有限公司 | Matrix film pressure sensor based on flexible circuit board technology |
-
2016
- 2016-11-08 CN CN201610979812.4A patent/CN106679853A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1948932A (en) * | 2005-10-13 | 2007-04-18 | 探微科技股份有限公司 | Method of making pressure sensor |
| CN101885463A (en) * | 2010-06-21 | 2010-11-17 | 东北大学 | Development method of flexible pressure-sensitive element based on carbon nano-tube filled high polymer composite material |
| CN102958281A (en) * | 2011-08-18 | 2013-03-06 | 嘉善德智医疗器械科技有限公司 | Method for preparing circuits on flexible base materials and application thereof |
| CN102539035A (en) * | 2012-01-17 | 2012-07-04 | 江苏物联网研究发展中心 | Lattice type flexible pressure distribution sensor and manufacturing method thereof |
| CN104199571A (en) * | 2014-08-14 | 2014-12-10 | 深圳市豪威薄膜技术有限公司 | Manufacturing method of flexible film function piece |
| CN205389295U (en) * | 2016-03-21 | 2016-07-20 | 江西合力泰科技有限公司 | Flexible circuit board assembly |
| CN206161200U (en) * | 2016-11-08 | 2017-05-10 | 上海市共进通信技术有限公司 | Matrix film pressure sensor based on flexible circuit board technology |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327960A (en) * | 2018-10-19 | 2019-02-12 | 深圳市朋辉科技术有限公司 | A kind of large size FPC sensing membrane structure and its manufacture craft |
| CN109489872A (en) * | 2018-10-19 | 2019-03-19 | 深圳市朋辉科技术有限公司 | A kind of flexible sensor modular structure and its manufacture craft |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |