CN105300574B - Graphene pressure sensor and its preparation method and application - Google Patents
Graphene pressure sensor and its preparation method and application Download PDFInfo
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- CN105300574B CN105300574B CN201510780886.0A CN201510780886A CN105300574B CN 105300574 B CN105300574 B CN 105300574B CN 201510780886 A CN201510780886 A CN 201510780886A CN 105300574 B CN105300574 B CN 105300574B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Abstract
The present invention provides a kind of graphene pressure sensor and preparation method thereof, it is characterised in that it is at least made of elastic substrate layer, graphene pressure sensitive layer and encapsulated layer；Wherein described elastic substrate layer includes induction zone, overlap, electrode district；The graphene pressure sensitive layer is attached on induction zone, and graphene pressure sensitive layer directly contacts with electrode district and forms overlap；The encapsulated layer covering graphene pressure sensitive layer and the overlap of graphene pressure sensitive layer and electrode district.The graphene Sensitivity in Pressure Sensors of the present invention is high, stability is good, expected service life length, and its low manufacture cost, technique are simple, process control.
Description
Technical field
The present invention relates to graphene pressure sensor and its preparation method and application.
Background technology
Present capacitance touch screen is only relatively primary input, they simply follow the trail of screen surface finger or
Move the track to be formed in the position of stylus.It is that usually they can not provide pressure or apply using a defect of touch Panel
The information of size is pressed, and the size of pressure may also be used for another dimension as input, it can be the electricity being associated
Sub- equipment provides instruction or control signal.
Current diaphragm pressure sensor in higher sensitivity uses ZnO nanowire array or Kynoar mostly
(PVDF) as sensing sensing element, but sensitivity is still not high enough, is difficult standard for the pressure deformation strained less than 0.4%
Really sensing, the seizure difficulty so in microcircuit design to signal is also with regard to bigger.
For extremely faint strain (<0.4%), ZnO or PVDF piezoelectric pressure indicators sense skip signal just
Not it is obvious that seizure when being thus unfavorable for microcircuit design to setting pressure signal, is also just difficult to digital algorithm letter
Number processing；
In addition, ZnO pressure sensitivity tactility apparatus to acid, aqueous slkali it is more sensitive, easily chemically react, especially for often with
The electronic product of human contact, can seriously affect the stability of sensor.
Patent CN104359597A discloses a kind of pressure sensor, and the pressure sensor of this miniature change of sensing is with two
Layer flexible substrate and the carbon nanotubes or graphene film for being respectively overlay in inner surface, electrode is respectively on the inside of two sheets of flexible substrate
Both ends, two layers of substrate stagger assembling, when being squeezed, stretching when external forces, upper and lower two layer graphene (or carbon nanometer
Pipe) contact area of layer will change, so as to cause the contact resistance of two interlayers to change.Although this sensor also has
There is very high sensitivity, but this sensor is due to that layer graphene or carbon nanotubes cannot encapsulate up and down, in use easily
Damage, and this sensor is also related with the factor such as the difference in height of upper and lower lamellar spacing and profile pattern, pressure sensitive letter
Number stability it is very poor.
Therefore, still need to that exploitation high sensitivity, stability is good, the pressure sensor of service life length.
The content of the invention
To solve the above problems, the present invention provides a kind of graphene pressure sensor, it is characterised in that it is at least by elasticity
Substrate layer, graphene pressure sensitive layer and encapsulated layer composition；
Wherein described elastic substrate layer includes induction zone, overlap and electrode district；
The graphene pressure sensitive layer is attached on induction zone, and graphene pressure sensitive layer is directly contacted with electrode district
And form overlap；The encapsulated layer covering graphene pressure sensitive layer and the overlap joint of graphene pressure sensitive layer and electrode district
Area.
In the present invention, the electrode district is used for flexible print circuit (FPC) knot of polymeric membrane and metal electrode composition
Structure region；Induction zone is used for the high-molecular organic material composite construction region for placing graphene pressure sensitive layer；Overlap is will
The metal electrode region contacted with graphene pressure sensitive layer.
Wherein described high-molecular organic material includes but is not limited to adhesive, rubber, plastics or resin.
In addition, the present invention provides also a kind of method for preparing above-mentioned graphene pressure sensor, it is characterised in that the side
Method comprises the following steps：
(1) elastic substrate layer is made on supporting layer, makes electrode district surface and induction zone surface at grade；
(2) graphene pressure sensitive layer is prepared；
(3) graphene pressure sensitive layer is transferred to induction zone, and ensures that graphene pressure sensitive layer is formed with electrode district
Effectively overlap joint；
(4) the etching sensing pattern on graphene pressure sensitive layer；
(5) high-molecular organic material is coated to graphene pressure sensitive layer and overlap, forms encapsulated layer；
(6) product sensor is cut according to required appearance and size.
The present invention also provides the purposes that above-mentioned graphene pressure sensor is used for intelligent terminal.
The graphene Sensitivity in Pressure Sensors of the present invention is high, stability is good, expected service life length, and its cost of manufacture
Low, technique is simple, process control.
Brief description of the drawings
Fig. 1 is a kind of front view of graphene pressure sensor.
Fig. 2 is a kind of top view of graphene pressure sensor.
The pressure sensitivity signal of sensor when Fig. 3 is finger flicking.
Fig. 4 is the heavy sensor pressure sensitivity signal on time of finger.
Embodiment
In the present invention, the location expression on each several part in graphene pressure sensor, is based on for attached Fig. 1 and 2,
Obviously, with the evolution of attached drawing 1-2 equipment, wherein the position of each component also changes；Therefore, this specification combines specific position
The explanation put does not form any restrictions to invention.
The present invention provides a kind of graphene pressure sensor, it is characterised in that it is at least by elastic substrate layer, graphene pressure
Power inductive layer, encapsulated layer composition；
Wherein described elastic substrate layer includes induction zone, overlap, electrode district；
The graphene pressure sensitive layer is attached on induction zone, and graphene pressure sensitive layer is directly contacted with electrode district
And form overlap；The encapsulated layer covering graphene pressure sensitive layer and the overlap joint of graphene pressure sensitive layer and electrode district
Area.
In the present invention, the elastic substrate layer includes induction zone, overlap, electrode district；Wherein electrode district is used for high score
The flexible printed circuit structure region of sub- film and metal electrode composition；Induction zone is used to place the organic of graphene pressure sensitive layer
High molecular material composite construction region；Overlap is the metal electrode region that will be contacted with graphene pressure sensitive layer.
Wherein described high-molecular organic material includes but is not limited to adhesive, rubber, plastics or resin.
In the present invention, the electrode is located at the homonymy of graphene pressure sensor, is not only easy to bind, and causes pressure
Sensillary area domain bigger, can also so be conducive to guard electrode and the graphene of the interface of elastic substrate layer.Encapsulated layer covers stone
Black alkene pressure sensitive layer and the overlap of graphene pressure sensitive layer and electrode district, so contribute to stabilization and the guarantor of final products
Shield, it is ensured that the long-time service of product.
In addition, the present invention provides a kind of method for preparing above-mentioned graphene pressure sensor, it is characterised in that the method
Comprise the following steps：
(1) elastic substrate layer is made on supporting layer, makes electrode district surface and induction zone surface at grade；
(2) graphene pressure sensitive layer is prepared；
(3) graphene pressure sensitive layer is transferred to induction zone, and ensures that graphene pressure sensitive layer is formed with electrode district
Effectively overlap joint；
(4) the etching sensing pattern on graphene pressure sensitive layer；
(5) high-molecular organic material is coated to graphene pressure sensitive layer and overlap, forms encapsulated layer；
(6) product sensor is cut according to required appearance and size.
In step (1), the supporting layer can be (poly- to benzene for double faced adhesive tape, single side release liners, one side glue, polyester film, PET
Naphthalate), PI (polyimides), PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PBT it is (poly- to benzene two
Formic acid butanediol ester), PMMA (polymethyl methacrylate), metal, ceramics or flexible glass, wherein, supporting layer causes and electricity
The making for the elastic substrate layer that pole side connects is more prone to, while can be to avoid electrode and elastic substrate stratum boundary in manufacturing process
The rupture of graphene, plays a protective role at face.
In step (1), for increase electrode district and the interfacial contact area of induction zone, at the electrode adjacent with induction zone,
Its cross section can be zigzag or waveform etc..
In step (1), the induction zone can be acid and alkali-resistance etch, with human-body biological compatibility well, chemical property it is steady
Fixed various eiastomeric silicone glue, it may be selected from PDMS (dimethyl silicone polymer), silica gel E620 (the poly- silicon of dimethyl diphenyl
Oxygen alkane), OCA glue (transparent optical cement), its thickness be 10-250 μm, be preferably 50-200 μm, more preferably 100-175 μm.
In a preferred embodiment, in step (1), supporting layer is coated in after elastic silica gel vacuum degassing is steeped
On, make its surface and electrode surface at grade, degassed under vacuum steeps again, is then heating and curing, and forms elastic substrate
Layer, wherein the heating carries out in an oven, heating-up temperature is 30-150 DEG C, hardening time 10-180min.
In another preferred embodiment of the present, in step (1), the electrode district back side and induction zone and supporting layer is pasted, made
Three is closely pasted with volume to volume rolling, and make induction zone and electrode district surface at grade.
In another preferred embodiment of the present, in step (1), copper foil can also be pressurizeed together with induction zone and supporting layer,
Corroded by the film, obtain the electrode of required pattern.
In step (2), the graphene pressure sensitive layer can be prepared by methods known in the art, such as chemical gas
Phase sedimentation (CVD method), or also can by by graphene powder it is coated, rolling, filter, spraying prepare graphene film, or
Person using graphene oxide powder is coated, rolling, filter, spraying forms graphene oxide film, then formed by reduction method
Graphene film, graphene film is formed with patterning process.
When using process for preparing graphenes by chemical vapour deposition pressure sensitive layer when, it is used growth graphene substrate include but
It is not limited to copper, iron, nickel, corronil, silica, carborundum, the sheet material of platinum, web material or three-dimensional foam structure material.
In a preferred embodiment, in step (2), the graphene pressure sensitive layer is prepared using CVD method, its
Described in the thickness of graphene net be 10-500nm, mesh is 10 × 10-500 × 500 μm, and single graphene line width is 5-
250μm。
In step (2), the sheet resistance of prepared graphene pressure sensitive layer is 0.2-200K Ω/.
In step (4), etching is carried out using laser etching machine, and the laser etching machine swashs for commonly used in the art
Photoetch machine, its is commercially available.
In step (4), to ensure that the graphene for sensing pattern is disconnected with surrounding graphene pressure sensitive layer, and phase is obtained
Pressure sensitive region to bigger, the sensing pattern can be multigroup pattern such as square, circular, oval with one heart.
In step (4), the distance of the line influence pattern and right side edge is 0.01-10mm, is preferably 0.1-
6mm, the width of sensing pattern outermost pattern is 0.01-1mm, is preferably 0.2-5mm.
In a preferred embodiment, in step (5), to prevent that it is organic high that the electrode district away from overlap is not coated by
Molecular material, masking tape can be used to protect electrode, the adhesive tape is pressure sensitive adhesive tape.
In step (5), to cure the organic polymer of coating, it can be heated in an oven, oven temperature 30-
150 DEG C, hardening time 5-180min.
In step (5), the encapsulated layer can be various organic silica gels, it may be selected from PDMS, silica gel E620, C6-515 liquid
Body silica gel, the encapsulation layer thickness can be 10~500 μm, be preferably 50-300 μm, more preferably 100-200 μm, to protect stone
Black alkene pressure sensitive layer is from scratching.
Wherein, the encapsulation layer material is that organic silicone oil, silicon rubber, silicones, and the encapsulated layer pass through dispensing, spray
Apply, be coated with, silk-screen printing or 3D printing technique are realized.
In a preferred embodiment, in step (5), to prevent overlap to be stressed damage, on overlap
Side encapsulated layer upper surface adhesion interface reinforcing strip, the interface reinforcing strip may be selected from pressure sensitive adhesive, ultraviolet light solid glue, hot-setting adhesive,
Instant drying adhesive, structure glue, fluid sealant.
In a preferred embodiment, the electrode of the electrode district is flexible print circuit (FPC) electrode, it is by copper foil
It is made with PI films, wherein the thickness of PI films is 10-500 μm, and PI films add with copper foil according to heat pressing process hot pressing well known in the art
Work and form electrode, the copper foil surface can evaporation thickness be 10-500nm anti oxidation layer, the anti oxidation layer can be gold, nickel
Or nichrome.
In the present invention, gold evaporation, nickel or nichrome can prevent from remaining in the chlorine in graphene mesh on copper foil
Change the corrosion of iron or the corrosion of other bronsted lowry acids and bases bronsted lowries, and then may insure the stability of sensor.
In another embodiment, the electrode of the electrode district is FPC electrodes, it is PET (polyethylene terephthalates
Ester) copper plating film, and on copper can the golden film of evaporation thickness 10-500nm, nickel film or nichrome anti oxidation layer.
In the present invention, those skilled in the art can change elastic substrate layer and the encapsulation in graphite pressure sensor
Material and the structure of graphene pressure sensitive layer and thickness used in layer etc. are because usually changing the graphene pressure sensing
The static resistance of device, the static resistance are 0.2-200K Ω, preferably 1.0-100K Ω, more preferably 2-50K Ω, can induction pressure
Scope be 0.1g-100kg, be preferably 1.0g-50kg, more preferably 20g-10kg.
In the present invention, the present invention makes follow-up directly test, welding or binding will not be light using on-deformable copper foil
Easy damaged graphene pressure sensitivity region, is conducive to the stability of sensor.
The miniaturization structure of the graphene pressure sensor of the present invention can be assemblied at the frame of smart mobile phone or the LCD back ofs the body
Face, and the pressure sensitivity experience of another dimension can also be obtained.
The present invention also provides the purposes that above-mentioned pressure sensor is used for intelligent terminal, graphene pressure sensor of the invention
Available for smart mobile phone, wearable electronic etc..
The present invention will be further described with reference to the accompanying drawings, but is not intended to limit the present invention.
Embodiment
Example one
It will be made of the copper foil 4 (thickness is 30 μm) of PI films 3 (thickness is 125 μm) and gold evaporation (thickness 200nm)
The FPC electrodes back side (i.e. PI films side) is closely bonded with supporting layer double faced adhesive tape and release liners 1；By A, B group of organic silica gel E620
Divide according to 1:1 is uniformly mixed and is coated under vacuo after de-bubble on supporting layer double faced adhesive tape and release liners 1, is then placed in 80 in baking oven
DEG C, 40min be heating and curing, as induction zone 2.
Graphene is grown using atmospheric pressure cvd method, its substrate is 200 mesh copper mesh, and brass wire diameter is 45 μm, and mesh is 75 × 75
μm, prepared graphene thickness is 80~100nm, and the single width of graphene net is 70 μm, and aperture is 66.5 × 66.5 μm.
The copper mesh that growth has graphene is lain against into FeCl3Copper mesh is corroded completely in solution, is cleaned with pure water and repeatedly will
Remaining FeCl in graphene mesh3Solution cleans up, and then the graphene of above-mentioned preparation is transferred on substrate surface, and makes stone
Black alkene net forms effective overlap joint with electrode, wherein the substrate of the transfer graphene includes electrode district, induction zone, supporting layer, and
Naturally dry is put into air, this example graphene pressure sensitive layer sheet resistance is 50K Ω/；
Pressing design etches concentric lantern ring rectangle with laser etching machine and senses pattern 7, to increase sense as far as possible
Region is answered, sensing pattern 7 is apart from right side edge about 1mm, 7 outermost square pattern width about 0.3mm of sensing pattern.
It will be pasted on copper foil 4 from left end 1/4-3/4 length areas with pressure sensitive adhesive tape, then mixing adds organic silica gel
E620, it is vertical static again after horizontal, make one layer of organic silica gel E620 of graphene surface uniform fold, its thickness is about 0.15mm,
Then put in baking oven and be heating and curing in 80 DEG C, 40min, as encapsulated layer 6, finally tear the pressure sensitive adhesive tape pasted on the electrode.
Encapsulated layer upper surface sticking two-faced adhesive tape 8 above copper foil 4 and 2 contact interface of induction zone, then passes according to design
Sensor geomery, with the outer shape of laser cutting sensor, makes it be separated with substrate, gained graphene pressure sensor
Static resistance is 1.0k Ω.
Embodiment 2
Will be by copper foil 4 (thickness is 25 μm) group of PI films 3 (thickness is 80 μm) and evaporation nichrome (thickness 150nm)
Into the FPC electrodes back side (i.e. PI films side) closely pasted with supporting layer single side PET adhesive tape 1, gap is not produced between making two layers
And bubble；By the host agent of PDMS and curing agent according to 10:1 is uniformly mixed to be removed under vacuum after bubble and is coated in supporting layer one side glue and gathers
On ester gum band 1,60min nature levellings are stood, its surface and copper foil 4 is then vacuumized bubble removing again, so in same plane
After put in baking oven 60 DEG C, 70min be heating and curing, as induction zone 2, finally remaining silica gel on copper foil 4 is removed.
Using atmospheric pressure cvd method, graphene growth substrate is 100 mesh copper mesh, 100 μm of brass wire diameter, 150 × 150 μ of mesh
M, prepared graphene 150~180nm of thickness, the single width of graphene net are 120 μm, 130 × 130 μm of aperture.
Copper mesh after growth graphene is lain against into FeCl3Copper wire is corroded completely in solution, is cleaned multiple times with high purity water
By remaining FeCl in graphene mesh3Solution cleans up, and then will clean multiple graphene and is transferred on substrate surface, institute
The substrate for stating transfer graphene mesh includes electrode district, induction zone, supporting layer, the naturally dry into air is then put, by model moral
Hua Li makes graphene absorption on 2 surface of induction zone, and graphene is formed effective overlap joint, the netted graphite of substrate surface with electrode
Alkene is 100 Ω/ as graphene pressure sensitive layer 5, gained graphene pressure sensitive layer sheet resistance；
Pressing design etches concentric lantern ring rectangle with laser etching machine and senses pattern 7, to increase sense as far as possible
Region is answered, sensing pattern 7 is apart from right side edge 0.6mm, 7 outermost square pattern width 0.2mm of sensing pattern.
It will be pasted on copper foil 4 from left end 1/4-3/4 length areas with pressure sensitive adhesive tape, be then added dropwise and be uniformly mixed ground PDMS,
Horizontal rest 60min, natural levelling, makes one layer of PDMS of graphene surface uniform fold, thickness about 0.2mm, then puts in baking oven
60 DEG C, 120min be heating and curing, as encapsulated layer 6, finally the pressure sensitive adhesive tape pasted on the electrode is slowly torn.
Encapsulated layer upper surface above copper foil 4 and 2 contact interface of induction zone applies the polyimide resin 8 of 0.2mm thickness,
Then according to design sensor shape size, with the outer shape of laser cutting sensor, it is made to be separated with substrate, gained graphite
The static resistance of alkene pressure sensor is 50K Ω.
Example three
It will be made of PI films 3 (thickness is 50 μm) and the copper foil 4 (thickness is 20 μm) of evaporation nickel (thickness 250nm)
The back side (i.e. PI films side) of FPC electrodes is pasted with the OCA glue that thickness is 175 μm and the PET 1 that thickness is 125 μm, and front is covered
Release film, then three is closely pasted with volume to volume rolling, gap and bubble are not produced between each layer, makes OCA glue surface and copper
Foil electrode 4 is in same plane, and OCA glue is as induction zone 2.
Using atmospheric pressure cvd method, graphene growth substrate is 80 mesh copper mesh, 50 μm of brass wire diameter, 200 × 200 μm of mesh,
Prepared graphene thickness 55nm, the single width of graphene net are 74 μm, 184 × 184 μm of aperture.
Copper mesh after growth graphene is lain against into FeCl3Copper wire is corroded completely in solution, then it is repeatedly clear with high purity water
Wash remaining FeCl in graphene mesh3Solution cleans up, and then will clean multiple graphene and is transferred to substrate surface, makes
Graphene and electrode form effective overlap joint, and the substrate of the transfer graphene includes electrode district, induction zone, supporting layer, 60 DEG C,
After 60min heat dryings, it is set to adsorb on 2 surface of induction zone by Van der Waals force, the graphene net of substrate surface is as stone
Black alkene pressure sensitive layer 5, gained graphene pressure sensor sheet resistance are 600 Ω/；
Pressing design etches concentric lantern ring rectangle with laser etching machine and senses pattern 7, is sensed with that may increase
Region, sensing pattern 7 is apart from right side edge 0.8mm, 7 outermost square pattern width 0.35mm of sensing pattern.
Ground will be uniformly mixed by C6- from left end 1/4-3/4 length areas with light applying adhesive tape, then dropwise addition on copper foil 4
515 liquid silica gels (dimethyl diphenyl polysiloxanes), horizontal rest 40min, then vertical suspension 15min, make graphene surface
One layer of silica gel C6-515 liquid silica gel of uniform fold, thickness about 0.1mm, then put in baking oven 70 DEG C, 40min be heating and curing, make
For encapsulated layer 6, finally the pressure sensitive adhesive tape pasted on the electrode is slowly torn.
Encapsulated layer upper surface above copper foil 4 and 2 contact interface of induction zone applies the phenolic resin 8 of 0.2mm thickness, then
According to the sensor shape size of design, with the outer shape of laser cutting sensor, it is set to be separated with substrate, gained graphene
The static resistance of pressure sensor is 0.5K Ω.
By the graphene pressure sensor prepared by embodiment 1 simulation and the complete machine assembling test of mobile phone, substrate is positioned over
On, the elastic foam identical with sensor thickness is attached around sensor, adds one layer of hard cover board above.External force acts on cover board
When, strain signal also occurs therewith for foam compression, sensor, and test result is as shown in Figure 3 and Figure 4.
Claims (10)
1. a kind of graphene pressure sensor, it is at least made of elastic substrate layer, graphene pressure sensitive layer, encapsulated layer；
Wherein described elastic substrate layer includes induction zone, overlap, electrode district；
The graphene pressure sensitive layer is attached on induction zone, and graphene pressure sensitive layer directly contacts and shape with electrode district
Into overlap；The encapsulated layer covering graphene pressure sensitive layer and the overlap of graphene pressure sensitive layer and electrode district.
2. graphene pressure sensor according to claim 1, wherein the graphene pressure sensitive layer is netted graphite
Alkene.
3. graphene pressure sensor according to claim 1 or 2, wherein the sheet resistance of the graphene pressure sensitive layer
0.1-106Ω/, wherein the static resistance of the graphene pressure sensor for 0.2-200K Ω, can induction pressure scope
For 0.1g-100kg.
4. graphene pressure sensor according to claim 1, wherein, the electrode district is by polymeric membrane and metal electricity
The flexible print circuit of pole composition, the polymeric membrane is PI, PET, PE, PMMA film；The induction zone is organic polymer material
Material, the high molecular material is organic silica gel, rubber or plastics.
5. graphene pressure sensor according to claim 1, wherein, the encapsulated layer is organic silicone oil, silicon rubber, silicon
Resin, and the encapsulated layer is formed by dispensing, spraying, coating, silk-screen printing or 3D printing technique.
6. a kind of method for preparing graphene pressure sensor described in claim 1, it comprises the following steps：
(1) elastic substrate layer is made on supporting layer, makes electrode district surface and induction zone surface at grade；
(2) graphene pressure sensitive layer is prepared；
(3) graphene pressure sensitive layer is transferred to induction zone, and ensures that graphene pressure sensitive layer is formed effectively with electrode district
Overlap joint；
(4) the etching sensing pattern on graphene pressure sensitive layer；
(5) high-molecular organic material is coated to graphene pressure sensitive layer and overlap, forms encapsulated layer；
(6) product sensor is cut according to required appearance and size.
7. according to the method described in claim 6, wherein, in step (1), the supporting layer is double faced adhesive tape, single side release liners,
One side glue, polyester film, PET, PI, PE, PP, PVC, PBT, PMMA, metal, ceramics or flexible glass.
8. according to the method described in claim 6, wherein, in step (2), the graphene pressure sensitive layer uses graphene
Powder is coated, rolls, filter, spraying forms graphene film, or uses coated graphene oxide powder, rolling, pumping
Filter, spraying form graphene oxide film, then form graphene film through reduction method, then form graphene with patterning process
Pressure sensitive layer is prepared or prepared using chemical vapour deposition technique.
9. according to the method described in claim 6, wherein, in step (2), the graphene pressure sensitive layer is heavy using chemistry
Prepared by area method, wherein substrate used is copper, iron, nickel, corronil, silica, carborundum, the sheet material of platinum, web material or three-dimensional
Structural foam.
10. the graphene pressure sensor described in claim 1-5 is used for smart mobile phone, the purposes of wearable electronic.
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| CN201510780886.0A CN105300574B (en) | 2015-11-13 | 2015-11-13 | Graphene pressure sensor and its preparation method and application |
| PCT/CN2016/076062 WO2017080128A1 (en) | 2015-11-13 | 2016-03-10 | Graphene pressure sensor and manufacturing method and use thereof |
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| CN112781757B (en) * | 2020-12-26 | 2023-10-31 | 重庆华知光环保科技有限责任公司 | Flexible capacitive pressure sensor based on graphene and preparation method thereof |
| CN113059808B (en) * | 2021-04-12 | 2022-07-26 | 华东理工大学 | Method for selectively processing 3D printing model by functionalized digital light |
| CN114279619B (en) * | 2021-08-24 | 2022-11-11 | 南京大学 | Anti-permeation high-sensitivity graphene hydraulic sensor and processing technology thereof |
| CN113816362B (en) * | 2021-09-23 | 2024-02-06 | 浙江大学 | Preparation method of precision patterned three-dimensional porous graphene, and precision transfer printing method and application thereof |
| CN114235234A (en) * | 2021-12-20 | 2022-03-25 | 哈尔滨工业大学 | Preparation method of flexible pressure sensor for flexible inflatable unfolding structure measurement |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891251A (en) * | 2012-09-13 | 2013-01-23 | 北京大学 | Encapsulation structure and encapsulation method for graphene hall element |
| CN103345963A (en) * | 2013-06-28 | 2013-10-09 | 重庆墨希科技有限公司 | Graphene composite transparent electrode and preparation method and application thereof |
| CN103389846A (en) * | 2013-07-17 | 2013-11-13 | 常州二维碳素科技有限公司 | Graphene touch screen electrode and fabrication method thereof |
| CN103941918A (en) * | 2014-04-21 | 2014-07-23 | 无锡格菲电子薄膜科技有限公司 | Graphene thin film touch sensor and manufacturing method thereof |
| CN104220964A (en) * | 2010-12-24 | 2014-12-17 | 石墨烯广场株式会社 | Touch sensor using graphin for simultaneously detecting pressure and position |
| CN104793786A (en) * | 2015-03-26 | 2015-07-22 | 无锡格菲电子薄膜科技有限公司 | Manufacturing method for graphene touch screen sensor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8901680B2 (en) * | 2012-04-12 | 2014-12-02 | International Business Machines Corporation | Graphene pressure sensors |
| US20150090043A1 (en) * | 2013-09-27 | 2015-04-02 | Infineon Technologies Ag | Mems |
| CN105092117B (en) * | 2015-08-19 | 2017-06-09 | 东南大学 | A kind of piezoresistive pressure sensor and preparation method thereof |
| CN105092118B (en) * | 2015-09-25 | 2017-10-20 | 东南大学 | One kind has highly sensitive flexible piezoresistive pressure sensor and preparation method thereof |
| CN105300574B (en) * | 2015-11-13 | 2018-04-17 | 常州二维碳素科技股份有限公司 | Graphene pressure sensor and its preparation method and application |
-
2015
- 2015-11-13 CN CN201510780886.0A patent/CN105300574B/en active Active
-
2016
- 2016-03-10 WO PCT/CN2016/076062 patent/WO2017080128A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104220964A (en) * | 2010-12-24 | 2014-12-17 | 石墨烯广场株式会社 | Touch sensor using graphin for simultaneously detecting pressure and position |
| CN102891251A (en) * | 2012-09-13 | 2013-01-23 | 北京大学 | Encapsulation structure and encapsulation method for graphene hall element |
| CN103345963A (en) * | 2013-06-28 | 2013-10-09 | 重庆墨希科技有限公司 | Graphene composite transparent electrode and preparation method and application thereof |
| CN103389846A (en) * | 2013-07-17 | 2013-11-13 | 常州二维碳素科技有限公司 | Graphene touch screen electrode and fabrication method thereof |
| CN103941918A (en) * | 2014-04-21 | 2014-07-23 | 无锡格菲电子薄膜科技有限公司 | Graphene thin film touch sensor and manufacturing method thereof |
| CN104793786A (en) * | 2015-03-26 | 2015-07-22 | 无锡格菲电子薄膜科技有限公司 | Manufacturing method for graphene touch screen sensor |
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| WO2017080128A1 (en) | 2017-05-18 |
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