CN106659055A - Heat-radiation unit and manufacturing unit therefor - Google Patents
Heat-radiation unit and manufacturing unit therefor Download PDFInfo
- Publication number
- CN106659055A CN106659055A CN201510729300.8A CN201510729300A CN106659055A CN 106659055 A CN106659055 A CN 106659055A CN 201510729300 A CN201510729300 A CN 201510729300A CN 106659055 A CN106659055 A CN 106659055A
- Authority
- CN
- China
- Prior art keywords
- heat
- pedestal
- heat pipe
- hole
- sink unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat-radiation unit and a manufacturing unit therefor, and the heat-radiation unit comprises a heat pipe and a substrate. The substrate is provided with a first side and a second side, and the second side is provided with a first trench and a plurality of through holes communicated with the first and second sides. The heat pipe is provided with a heat absorption region and a conduction region, wherein the conduction region is formed by the extending of the heat absorption region towards at least one end opposite to the direction of the heat absorption region, and the parts, corresponding to the through holes, of the heat pipe are accommodated in the through holes, and are aligned with the first side of the substrate. The heat radiation unit and the method can iron out the defect that the plane precision of a boss of the known heat pipe and the substrate and a heat pipe is difficult to control.
Description
【Technical field】
A kind of heat-sink unit and its manufacture method, espespecially a kind of heat-sink unit and its manufacture method with preferably thermo-contact plane.
【Background technology】
There are CPU and other calculating chips in existing electronic equipment，And can all produce heat when computing is carried out，Therefore need heat dissipation element auxiliary to use its radiating efficiency of increase and reach antipyretic purpose，Most-often used heat dissipation element such as heat pipe、Temperature-uniforming plate、Radiator、The elements such as radiating fin，Mainly being increased heat-transfer rate or heat is directed at into distal end using the grade element carries out distal end radiating，Or use heat radiation efficiency through area of dissipation is increased，General central processing unit mainly conducts heat through contacting with radiator，And radiator provides the effect for increasing area of dissipation for one kind，To make its heat-transfer rate more quick then can be combined heat pipe with radiator，And the position that radiator is contacted with central processing unit is opened up aperture or opens up groove and heat pipe is directly exposed conduction heat is contacted with central processing unit transfer heat to the radiator with larger area of dissipation again and radiated，This is often used by the heat dissipation element that heat pipe is combined with radiator，And the heat dissipation element still has the disappearance that cannot be enhanced，The disappearance is when the groove of accommodating heat pipe is opened up in the radiator side，The heat pipe is fixed in the groove through the mode for wearing or being disposed vertically，But the heat pipe still has that part is convex to expose the position that the radiator is contacted with central processing unit，And cause the not good generation thermal chocking of flatness，It is known generally through the position of protrusion is removed at the position in the way of Milling Process，And because the part that heat pipe protrudes the groove of the radiator is not completely all identical height，And heat pipe tube wall itself also has a case that thickness differs，It is relatively easy when Milling Process is carried out excessively to cut pin and destroy thermotube wall，Heat pipe is made to lose effect.Therefore headed by how improving known disappearance i.e. weight target.
【The content of the invention】
To solve the shortcoming of above-mentioned known technology, the main purpose of the present invention, there is provided it is a kind of can the heat-sink unit of the smooth precision of plane that contacts with thermal source of heat radiation unit.
Another mesh ground of the present invention provides a kind of manufacture method of the heat-sink unit of the smooth precision of the plane that heat radiation unit is contacted with thermal source.
To provide a kind of heat-sink unit up to the above-mentioned purpose present invention, comprising：One pedestal, with one first side and one second side, second side offers a groove and plural number connects the through hole of first and second side；One heat pipe, with a heat absorption area and a conducting region, and the conducting region extends institute's configuration from the heat absorption area at least one end in the direction in the contrary heat absorption area, and the heat pipe to should be at through hole position protrude out and be located in the through hole such as this, it is and while neat with the first lateral incision of the pedestal.
The heat pipe is a flat hot pipe or D type heat pipe any of which.
The corresponding upper and lower both sides for being divided into the pedestal in first side and second side.
The pedestal is correspondingly arranged at the convex portion such as this and conducts heat with an at least thermal source directly contact.
To provide a kind of heat-sink unit manufacture method up to the above-mentioned purpose present invention, comprise the steps of：
One pedestal and a heat pipe are provided；In pedestal upside one groove of shaping and plural through hole；The heat pipe is inserted in the groove and machining is imposed to the pedestal upside, heat pipe is forced in the groove and through hole；
Machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim with the pedestal downside.
The grade through hole is arranged at groove of the pedestal near centre.
The machining is for punch process or rolling processing or forges processing any of which.
Machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim after this step with the pedestal downside, finish at boss of the pin processing to the pedestal through cutting with more one, the surface smoothness for thereby making the boss is lifted.
The heat pipe is a flat hot pipe or D type heat pipe any of which.
By the heat-sink unit and its manufacture method of the present invention, the problems such as the heat-sink unit position precision controlling that heat pipe is contacted with the heat-radiating substrate with thermal source when assembling being made up of heat-radiating substrate and heat pipe in known technology can be improved being difficult.
【Description of the drawings】
Fig. 1 is the three-dimensional exploded view of heat-sink unit first embodiment of the present invention；
Fig. 2 is the three-dimensional combination figure of heat-sink unit first embodiment of the present invention；
Fig. 3 is the assembled sectional view of heat-sink unit first embodiment of the present invention；
Fig. 4 is the three-dimensional exploded view of heat-sink unit second embodiment of the present invention
Fig. 5 is the manufacture method machining sketch chart of heat-sink unit of the present invention；
Fig. 6 is the manufacture method machining sketch chart of heat-sink unit of the present invention；
Fig. 7 is the flow chart of steps of the manufacture method first embodiment of heat-sink unit of the present invention；
Fig. 8 is the flow chart of steps of the manufacture method second embodiment of heat-sink unit of the present invention.
Component in accompanying drawing representated by each sequence number is：
Heat-sink unit 1
Heat pipe 11
Heat absorption area 111
Conducting region 112
Pedestal 12
First side 121
Second side 122
Groove 123
Through hole 124
Thermal source 2.
【Specific embodiment】
The above-mentioned purpose and its structure of the present invention and characteristic functionally, will be explained according to the embodiment of institute's accompanying drawings.
Fig. 1, Fig. 2, Fig. 3 are referred to, is the stereo decomposing and combination and sectional view of heat-sink unit first embodiment of the present invention, as illustrated, the heat-sink unit 1, comprising：One heat pipe 11, a pedestal 12；
The heat pipe 11 has a heat absorption conducting region 112 of area 111 and, and the conducting region 112 extends institute's configuration from the heat absorption area 111 at least one end in the direction in the contrary heat absorption area, the heat pipe 11 is any of which of a flat hot pipe or D types heat pipe or pipe or is collocated with each other use.
The pedestal 12 has one first side 121 and one second side 122, second side 122 offers a groove 123 and plural number connects the through hole 124 of first and second side 121,122, the heat pipe 11 is located in the groove 123, and the correspondence of heat pipe 11 is located at the through hole such as this 124（Part）Protrude out and be located in the through hole 124 and trim with the first side 121 of the pedestal 12.
The pedestal 12 to be arranged and conduct heat with least directly contact of a thermal source 2 at through hole 124.
By can be seen that in the present embodiment Fig. 3, the heat pipe 11 pairs should the part of 12 through hole of pedestal 124（Part）Protrude out and be located in the through hole 124, and mutually trim with the first side 121 of the pedestal 12, and remaining position of heat pipe 11 is then located in the groove 123 of the pedestal 12 and trims with the second side 122 of the pedestal 12.
Refering to Fig. 4，For the three-dimensional exploded view of heat-sink unit second embodiment of the present invention，This enforcement profit is described using the mode that circular heat pipe 11 is combined with pedestal 12，When the groove 123 (the present embodiment groove shape adopts circular arc) that the circular heat pipe 11 inserts the pedestal 12 is interior，Protrude the groove 123 of the pedestal 12 in the part of heat pipe 11，Can be by machining (punching press、Rolling、Forging) position of the projecting groove 123 of heat pipe 11 is forced in the groove 123，And while insert in the through hole 124，Make the heat pipe 11 shape to combine closely with it in the groove 123 and the through hole 124，And receive after machining pressurization compressing，The heat pipe 11 also has partial portion that the first side 121 of the pedestal 12 is protruded by the through hole 124，The mode of machining can be again passed through the position to be pushed back in the through hole 124，And trim with the first side 121 of the pedestal 12，Make the first of the both sides that the heat pipe 11 is deformed and the pedestal 12、Two sides 121、122 correspondences are trimmed，The present embodiment is using punch process (shown in Fig. 5) as explanation，But do not regard it as and be limited，Also can be rolling (as shown in Figure 6).
Fig. 7 is referred to, is the flow chart of steps of the manufacture method first embodiment of heat-sink unit of the present invention, and in the lump refering to aforementioned Fig. 1～4 and Fig. 5, Fig. 6 machining sketch chart, as illustrated, the manufacture method of the heat-sink unit, comprises the steps of：
S1:One pedestal and a heat pipe are provided；
One pedestal 12 and a heat pipe 11 be provided, the pedestal 12 may be selected from copper, aluminium material any of which or and its alloy, the heat pipe 11 is a flat hot pipe or D types heat pipe or pipe any of which.
S2:In pedestal upside one groove of shaping and plural through hole；
A groove 123 is formed in the upside (the second side 122) of the pedestal 12 through except material processing, and the pedestal 12 will be arranged at plural through hole 124 is set near the groove 123 of centre, the grade through hole 124 passes through the pedestal 12 and is communicated to downside (the first side 121) plane of the pedestal 12.
S3:The heat pipe is inserted in the groove and machining is imposed to the pedestal upside, heat pipe is forced in the groove and through hole；
The correspondence of the heat pipe 11 is inserted in the groove 123 of the pedestal 12, and through machining the heat pipe is pressed by heat pipe be forced into the groove and heat pipe to should through hole position while being forced into the through hole, the machining is for punch process or rolling processing or forges processing any of which, and this etc. machining can repeatedly process (rolling processing is as shown in Figure 6) for disposable processing (punch process is as shown in Figure 5) or for repeatability.
S4:Machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim with the pedestal downside.
The heat pipe 11 pairs should be at the grade through hole 124 of pedestal 12, because being forced in the through hole 124 by machining, and have part that the position of heat pipe 11 on downside (the first side 121) surface of the pedestal 12 is protruded by the through hole 124, the part pressurization of the convex grade through hole 124 for exposing the pedestal 12 of the heat pipe 11 is forced in the through hole 124 of the pedestal 12 through the mode of machining, makes the position that the grade heat pipe 11 protrudes the through hole 124 trim with downside (the first side 121) surface of the pedestal 12.
Fig. 8 is referred to, is the flow chart of steps of the manufacture method second embodiment of heat-sink unit of the present invention, the present embodiment is comprised the steps of：
S1:One pedestal and a heat pipe are provided；
S2:In pedestal upside one groove of shaping and plural through hole；
S3:The heat pipe is inserted in the groove and machining is imposed to the pedestal upside, heat pipe is forced in the groove and through hole；
S4:Machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim with the pedestal downside.
Only the present embodiment is identical with aforementioned first embodiment partial content, therefore here will not be described in great detail, and this enforcement is from the different places of aforementioned first embodiment, with more step S5:Finish at boss of the pin processing to the pedestal through cutting, the surface smoothness for thereby making the boss is lifted；
, again to cut the precision on the mode put forward Noboru surface of pin processing, described to cut pin processing can be Milling Process or planing operation or attrition process any of which for pedestal 12 that will be after machining and the surface of heat pipe 11.
Can greatly improve known heat pipe and combined the disappearance that rear precision controlling is difficult with pedestal through the manufacture method of the present invention, and improve after known heat pipe is combined with pedestal and closely do not cause the disappearance such as thermal chocking.
Claims (9)
1. a kind of heat-sink unit, it is characterised in that include：
One pedestal, with one first side and one second side, second side offers a groove and plural number connects the through hole of first and second side；
One heat pipe, with a heat absorption area and a conducting region, and the conducting region extends institute's configuration from the heat absorption area at least one end in the direction in the contrary heat absorption area, and the heat pipe to should be at through hole position protrude out and be located in the through hole such as this, it is and while neat with the first lateral incision of the pedestal.
2. heat-sink unit according to claim 1, it is characterised in that the heat pipe is a flat hot pipe or D type heat pipe any of which.
3. heat-sink unit according to claim 1, it is characterised in that the corresponding upper and lower both sides for being divided into the pedestal in first side and second side.
4. heat-sink unit according to claim 1, it is characterised in that the pedestal is correspondingly arranged at the convex portion such as this and conducts heat with an at least thermal source directly contact.
5. a kind of heat-sink unit manufacture method, it is characterised in that comprise the steps of：
One pedestal and a heat pipe are provided；
In pedestal upside one groove of shaping and plural through hole；
The heat pipe is inserted in the groove and machining is imposed to the pedestal upside, heat pipe is forced in the groove and through hole；
Machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim with the pedestal downside.
6. heat-sink unit manufacture method according to claim 5, it is characterised in that the through hole is arranged at groove of the pedestal near centre.
7. heat-sink unit manufacture method according to claim 5, it is characterised in that the machining is punch process or rolling processing or forges processing any of which.
8. heat-sink unit manufacture method according to claim 5, it is characterized in that, machining is imposed to the pedestal downside, the position that heat pipe protrudes the through hole is pressed in the through hole makes it trim after this step with the pedestal downside, finish at boss of the pin processing to the pedestal through cutting with more one, the surface smoothness for thereby making the boss is lifted.
9. heat-sink unit manufacture method according to claim 5, it is characterised in that the heat pipe is a flat hot pipe or D type heat pipe any of which.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111021739.7A CN113631022B (en) | 2015-10-29 | 2015-10-29 | Heat dissipation unit and manufacturing method thereof |
| CN201510729300.8A CN106659055A (en) | 2015-10-29 | 2015-10-29 | Heat-radiation unit and manufacturing unit therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510729300.8A CN106659055A (en) | 2015-10-29 | 2015-10-29 | Heat-radiation unit and manufacturing unit therefor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111021739.7A Division CN113631022B (en) | 2015-10-29 | 2015-10-29 | Heat dissipation unit and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106659055A true CN106659055A (en) | 2017-05-10 |
Family
ID=58810404
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111021739.7A Active CN113631022B (en) | 2015-10-29 | 2015-10-29 | Heat dissipation unit and manufacturing method thereof |
| CN201510729300.8A Pending CN106659055A (en) | 2015-10-29 | 2015-10-29 | Heat-radiation unit and manufacturing unit therefor |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111021739.7A Active CN113631022B (en) | 2015-10-29 | 2015-10-29 | Heat dissipation unit and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN113631022B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109622823A (en) * | 2019-01-16 | 2019-04-16 | 苏州汉斯精密模具配件有限公司 | A kind of multiple groups heating wire synchronous high-efficiency rolling-type device and its rolling depression method |
| WO2023133720A1 (en) * | 2022-01-12 | 2023-07-20 | 谢华棣 | Manufacturing method for circuit board assembly having three-dimensional heat dissipation |
| WO2024099236A1 (en) * | 2022-11-11 | 2024-05-16 | 蔚来汽车科技(安徽)有限公司 | In-vehicle heat-pipe heat dissipation controller, and vehicle |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338499B (en) * | 2022-07-21 | 2024-03-08 | 深圳兴奇宏科技有限公司 | Manufacturing method of heat dissipating device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374395A (en) * | 2007-08-24 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN101990384A (en) * | 2009-08-05 | 2011-03-23 | 鈤新科技股份有限公司 | Heat conducting structure with coplanar heated parts and manufacturing method thereof, and radiator with heat conducting structure |
| CN104869783A (en) * | 2014-02-20 | 2015-08-26 | 奇鋐科技股份有限公司 | Radiating module combined structure and radiating module manufacture method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070151711A1 (en) * | 2006-01-05 | 2007-07-05 | Kuo-Hsin Chen | Heat sink and method for manufacturing the same |
| US7487825B2 (en) * | 2006-10-31 | 2009-02-10 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN101951750A (en) * | 2010-05-12 | 2011-01-19 | 深圳市超频三科技有限公司 | Hot pipe radiator and manufacturing method thereof |
| CN102271483B (en) * | 2010-06-07 | 2015-07-08 | 富瑞精密组件（昆山）有限公司 | Heat-dissipating combined structure |
| TWI537540B (en) * | 2014-02-20 | 2016-06-11 | Asia Vital Components Co Ltd | Heat dissipation module combined structure and manufacturing method thereof |
| CN203814119U (en) * | 2014-04-30 | 2014-09-03 | 奇鋐科技股份有限公司 | Heat radiation module |
| TWM486933U (en) * | 2014-06-17 | 2014-09-21 | Asia Vital Components Co Ltd | Electric substrate heat dissipation structure |
-
2015
- 2015-10-29 CN CN202111021739.7A patent/CN113631022B/en active Active
- 2015-10-29 CN CN201510729300.8A patent/CN106659055A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374395A (en) * | 2007-08-24 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN101990384A (en) * | 2009-08-05 | 2011-03-23 | 鈤新科技股份有限公司 | Heat conducting structure with coplanar heated parts and manufacturing method thereof, and radiator with heat conducting structure |
| CN104869783A (en) * | 2014-02-20 | 2015-08-26 | 奇鋐科技股份有限公司 | Radiating module combined structure and radiating module manufacture method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109622823A (en) * | 2019-01-16 | 2019-04-16 | 苏州汉斯精密模具配件有限公司 | A kind of multiple groups heating wire synchronous high-efficiency rolling-type device and its rolling depression method |
| WO2023133720A1 (en) * | 2022-01-12 | 2023-07-20 | 谢华棣 | Manufacturing method for circuit board assembly having three-dimensional heat dissipation |
| WO2024099236A1 (en) * | 2022-11-11 | 2024-05-16 | 蔚来汽车科技(安徽)有限公司 | In-vehicle heat-pipe heat dissipation controller, and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113631022B (en) | 2024-09-20 |
| CN113631022A (en) | 2021-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106659055A (en) | Heat-radiation unit and manufacturing unit therefor | |
| TWM311234U (en) | Water-cooling base | |
| KR101437068B1 (en) | A connecting pipe manufacturing type radiator and a manaufacturing method thereof | |
| US20170151641A1 (en) | Heat dissipation unit manufacturing method | |
| CN107771005B (en) | Heat radiation module and manufacturing method thereof | |
| CN108695275A (en) | Radiator | |
| US20190093957A1 (en) | Heat dissipation unit | |
| CN206876015U (en) | Heat radiator | |
| JP3175529U (en) | Fixing structure of heatsink using fins | |
| US6370774B1 (en) | Radiator with thin fins and method for producing the same | |
| US20020020523A1 (en) | Radiator with thin fins | |
| CN108302970A (en) | Water-cooling head | |
| CN205161001U (en) | Heat radiating unit | |
| CN206821128U (en) | Heat radiator | |
| CN103889189A (en) | Radiator combination structure | |
| US20150330715A1 (en) | Manufacturing method of thermal module | |
| US10328482B2 (en) | Method for manufacturing metal compact and apparatus for manufacturing metal compact | |
| US20040010912A1 (en) | Method for making a heat sink device and product made thereby | |
| CN104034192B (en) | Heat pipe structure | |
| TWI818106B (en) | Heat radiator, cooling device | |
| JP5134577B2 (en) | Manufacturing method of radiator, alignment moving mechanism and cutting module used in this manufacturing method | |
| CN207731920U (en) | Memory body heat-sink unit | |
| JP7082036B2 (en) | How to make a radiator | |
| JP2916129B1 (en) | Manufacturing method of grooved plate-shaped member | |
| CN113497907B (en) | Heat dissipation part and television |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |