CN106659030A - Bonding structure and electronic device - Google Patents
Bonding structure and electronic device Download PDFInfo
- Publication number
- CN106659030A CN106659030A CN201510729709.XA CN201510729709A CN106659030A CN 106659030 A CN106659030 A CN 106659030A CN 201510729709 A CN201510729709 A CN 201510729709A CN 106659030 A CN106659030 A CN 106659030A
- Authority
- CN
- China
- Prior art keywords
- adhering part
- bonded structure
- handle portion
- adhesive portion
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The disclosure relates to a bonding structure and an electronic device. The bonding structure can comprise a bonding portion and a handle portion formed by outward protruding of any position on the edge of the bonding portion. The specification of the bonding portion matches that of a part to be bonded, so that the part to be bonded is adhered to a preset area in the electronic device through the bonding portion. The specification of the handle portion matches that of the part to be bonded, so that when the part to be bonded is adhered to the preset area, the handle portion reaches out between the part to be bonded and the preset area. Through the technical scheme of the disclosure, dismounting difficulties of parts in the electronic device are reduced, and parts that have been bonded are prevented from being damaged during dismounting.
Description
Technical field
It relates to field of terminal technology, more particularly to a kind of bonded structure and electronic equipment.
Background technology
Fix for position is carried out to the part in electronic equipment, generally require to set corresponding component with electronics
Bonding is carried out between standby apparatus body, to avoid it from shaking.
However, being keeped in repair to electronic equipment, detecting etc. when processing, the portion to bonding is generally required
Part is dismantled, but because prior bonding is processed, can increase the dismounting difficulty to these parts, or even
Cause the damage to corresponding component.
The content of the invention
The disclosure provides a kind of bonded structure and electronic equipment, to solve correlation technique in deficiency.
According to the first aspect of the embodiment of the present disclosure, there is provided a kind of bonded structure, including：
Adhesive portion, the specification of the adhesive portion with treat adhering part and match, can make described to treat adhering part
The predeterminable area in electronic equipment is affixed to by the adhesive portion；
The handle portion that the optional position outwardly convex of the edge of the adhesive portion is formed, the handle portion
Specification with treat adhering part and match, can make it is described when adhering part affixes to the predeterminable area, from
It is described to treat to be stretched out between adhering part and the predeterminable area.
Optionally, the specification of the adhesive portion is not more than the end face for treating adhering part.
Optionally, the handle portion is formed by the midpoint outwardly convex of arbitrary side of the adhesive portion.
Optionally, the double faced adhesive tape that the adhesive portion is formed in one with the handle portion.
Optionally, the double faced adhesive tape is easy-to-draw glue.
Optionally, the one end in the handle portion away from the adhesive portion is provided with non-sticky pull handle arrangement.
Optionally, the non-sticky pull handle arrangement is covered and stretched out outside the predeterminable area in the handle portion
Part.
Optionally, the non-sticky pull handle arrangement include two top surfaces for being respectively arranged at the handle portion and
One side on the paster of bottom surface, and the paster away from the handle portion is non-sticky surface.
According to the second aspect of the embodiment of the present disclosure, there is provided a kind of electronic equipment, including：
Apparatus body；
At least one treats adhering part, and each treats that adhering part corresponding at least one is implemented as described above
Bonded structure any one of example.
Optionally, treat that adhering part is affixed in the apparatus body by multiple bonded structures when arbitrary
During predeterminable area, multiple bonded structures are centrosymmetric along arbitrary end face center point for treating adhering part
Arrange.
Optionally, it is described to treat that adhering part includes the internal battery in the electronic equipment.
The technical scheme that embodiment of the disclosure is provided can include following beneficial effect：
From above-described embodiment, the disclosure in adhesive portion edge by arranging handle portion so that user
In the adhering part in dismantling electronic equipment, it is easy to directly be exerted a force by handle portion, so as to can
To reduce the dismounting difficulty to the part in electronic equipment, it is to avoid cause in unloading process to adhesive portion
The damage of part.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory
, the disclosure can not be limited.
Description of the drawings
Accompanying drawing herein is merged in description and constitutes the part of this specification, shows and meets this public affairs
The embodiment opened, and be used to explain the principle of the disclosure together with description.
Fig. 1 is a kind of dimensional structure diagram of the bonded structure according to an exemplary embodiment.
Fig. 2 is that a kind of according to an exemplary embodiment treats default in adhering part and electronic equipment
The schematic diagram in region.
Fig. 3 is a kind of knot of the electronic equipment for applying bonded structure according to an exemplary embodiment
Structure schematic diagram.
Fig. 4 is the dimensional structure diagram of another kind of bonded structure according to an exemplary embodiment.
Fig. 5 is the electronic equipment that the another kind according to an exemplary embodiment applies bonded structure
Structural representation.
Fig. 6 is that a kind of bonded structure according to an exemplary embodiment is closed with the structure for treating adhering part
The schematic diagram of system.
Specific embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following
When description is related to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous
Key element.Embodiment described in following exemplary embodiment does not represent the institute consistent with the disclosure
There is embodiment.Conversely, they are only with described in detail in the such as appended claims, disclosure
The example of the consistent apparatus and method of a little aspects.
Fig. 1 is a kind of dimensional structure diagram of the bonded structure according to an exemplary embodiment, such as
Shown in Fig. 1, the bonded structure can include：
Adhesive portion 1；Wherein, the handle that the optional position outwardly convex of the edge of the adhesive portion 1 is formed
Portion 2.As an exemplary embodiment, as shown in figure 1, the handle portion 2 can appointing from adhesive portion 1
The midpoint outwardly convex of one side is formed.
The bonded structure of the disclosure can apply to the bonding process of any part in electronic equipment, such as
Battery, back shroud etc..For example, Fig. 2 shows and for the battery 10 of electronic equipment to be bonded to preset areas
Application scenarios in domain 20；Correspondingly, as shown in figure 3, the bonded structure meets following specification conditions：
1) specification of adhesive portion 1 with match as the battery 10 for treating adhering part, the battery 10 can be made
The predeterminable area 20 in electronic equipment is affixed to by the adhesive portion 1.
In one exemplary embodiment, the specification of adhesive portion 1 is not more than the end face of battery 10；Such as Fig. 3
It is shown, the end face specification of the specification of adhesive portion 1 less than battery 10, it is to avoid affect in electronic equipment other
Part.Certainly, the specification of adhesive portion 1 can not be too small, such as it should be ensured that adhesive portion 1 can be provided
Default bonding force, so as to ensure that enough adhesive strengths are formed between battery 10 and predeterminable area 20.
2) specification in handle portion 2 with match as the battery 10 for treating adhering part, battery 10 can be made
When affixing to the predeterminable area 20, handle portion 2 can stretch between the battery 10 and the predeterminable area 20
Go out, so that it is guaranteed that user can contact the handle portion 2, and exert a force to adhesive portion 1 by handle portion 2,
To realize the dismounting to the part of battery 10.
From above-described embodiment, the disclosure in the edge of adhesive portion 1 by arranging handle portion 2 so that
User is easy to be carried out directly by handle portion 2 in the grade adhering part of battery 10 in dismantling electronic equipment
Force is connect, such that it is able to reduce the dismounting difficulty to adhering part, it is to avoid cause right in unloading process
The damage of adhering part.
1st, glue types
The double faced adhesive tape that adhesive portion 1 can be formed in one with handle portion 2.As an exemplary embodiment,
The double faced adhesive tape can be easy-to-draw glue, then when user to handle portion 2 by exerting a force, can make adhesive portion 1
Deform upon and lose after bonding force, then adhesive portion 1 can be by user from (or other bondings of battery 10
Part) to extract out and predeterminable area 20 between, the adhering state for making battery 10 is eliminated such that it is able to straight
Removing battery 10 is connect, without causing to damage to battery 10.
2nd, pull handle arrangement
As shown in figure 3, the one end in handle portion 2 away from adhesive portion 1 can be provided with non-sticky pull handle arrangement
3, then user directly can pinch the non-sticky pull handle arrangement 3 with finger and exert a force to adhesive portion 1, so as to keep away
Exempt from the viscose glue and user's direct skin contact on the surface of handle portion 2, prevent from causing the discomfort of user.
As an exemplary embodiment, as shown in figure 4, non-sticky pull handle arrangement 3 can include two points
The top surface in the handle portion and the paster 31,32 of bottom surface are not arranged at, and away from the drawing on paster 31,32
The one side of hand 2 be non-sticky surface (i.e. positioned at top paster 31 top surface, positioned at the paster of bottom
32 bottom surface is non-sticky surface).Certainly, the one side on paster 31,32 near handle portion 2 can be with
For non-sticky surface or tacky surfaces, herein and it is not limited, because can be by handle portion 2
Surface viscosity, realize bonding between paster 31,32 and handle portion 2.
Further, non-sticky pull handle arrangement 3 can be covered and stretched out in handle portion 2 outside predeterminable area 20
Part.As shown in figure 5, the part outside predeterminable area 20 is stretched out in handle portion 2, its surface
To be covered by the non-sticky pull handle arrangement 3, so as to avoid other portions of handle portion 2 to electronic equipment internal
Situations such as bonding being produced between part.
3rd, multiple bonded structures
Although in the above-described embodiments, battery 10 is bonded to into predeterminable area 20 by an adhering part；
But in fact, for each in electronic equipment treats adhering part, there may be corresponding one or many
Individual adhering part.
Than as shown in fig. 6, on the end face of battery 10, can simultaneously arrange two bonded structures, then should
Battery 10 can be bonded to the predeterminable area in electronic equipment by adhesive portion 1A, adhesive portion 1B simultaneously
20；Meanwhile, user can be corresponding to remove by respectively to handle portion 1A or handle portion 1B forces
Bonded structure.
Wherein, the apparatus body that adhering part affixes to electronic equipment by multiple bonded structures is treated when arbitrary
In predeterminable area when, the adhesive portion 1 of multiple bonded structures can be along arbitrary end face for treating adhering part
Central point is centrosymmetric setting.Than as shown in fig. 6, adhesive portion 1A and adhesive portion 1B are around battery 10
End face center point O be centrosymmetric setting；Certainly, the disclosure is not limited this.
Those skilled in the art will readily occur to this after considering description and putting into practice disclosure disclosed herein
Disclosed other embodiments.The application is intended to any modification, purposes or the adaptability of the disclosure
Change, these modifications, purposes or adaptations follow the general principle of the disclosure and including this public affairs
Open undocumented common knowledge or conventional techniques in the art.Description and embodiments only by
It is considered as exemplary, the true scope of the disclosure and spirit are pointed out by claim below.
It should be appreciated that the disclosure be not limited to be described above and be shown in the drawings it is accurate
Structure, and can without departing from the scope carry out various modifications and changes.The scope of the present disclosure is only by institute
Attached claim is limiting.
Claims (11)
1. a kind of bonded structure, it is characterised in that include：
Adhesive portion, the specification of the adhesive portion with treat adhering part and match, can make described to treat adhering part
The predeterminable area in electronic equipment is affixed to by the adhesive portion；
The handle portion that the optional position outwardly convex of the edge of the adhesive portion is formed, the handle portion
Specification with treat adhering part and match, can make it is described when adhering part affixes to the predeterminable area, from
It is described to treat to be stretched out between adhering part and the predeterminable area.
2. bonded structure according to claim 1, it is characterised in that the specification of the adhesive portion is not
More than the end face for treating adhering part.
3. bonded structure according to claim 1, it is characterised in that the handle portion is by described viscous
The midpoint outwardly convex of arbitrary side of socket part is formed.
4. bonded structure according to claim 1, it is characterised in that the adhesive portion and the drawing
The double faced adhesive tape that hand is formed in one.
5. bonded structure according to claim 4, it is characterised in that the double faced adhesive tape is easy-to-draw glue.
6. bonded structure according to claim 1, it is characterised in that away from institute in the handle portion
The one end for stating adhesive portion is provided with non-sticky pull handle arrangement.
7. bonded structure according to claim 6, it is characterised in that the non-sticky pull handle arrangement
Cover and part outside the predeterminable area is stretched out in the handle portion.
8. bonded structure according to claim 6, it is characterised in that the non-sticky pull handle arrangement
Including two top surfaces for being respectively arranged at the handle portion and the paster of bottom surface, and away from institute on the paster
The one side for stating handle portion is non-sticky surface.
9. a kind of electronic equipment, it is characterised in that include：
Apparatus body；
At least one treats adhering part, and each treats adhering part corresponding at least one such as claim
Bonded structure any one of 1-6.
10. electronic equipment according to claim 9, it is characterised in that treat adhering part when arbitrary
When affixing to the predeterminable area in the apparatus body by multiple bonded structures, multiple bonded structures it is viscous
Socket part is centrosymmetric setting along arbitrary end face center point for treating adhering part.
11. electronic equipments according to claim 9, it is characterised in that described to treat adhering part bag
Include the internal battery in the electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510729709.XA CN106659030A (en) | 2015-10-30 | 2015-10-30 | Bonding structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510729709.XA CN106659030A (en) | 2015-10-30 | 2015-10-30 | Bonding structure and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106659030A true CN106659030A (en) | 2017-05-10 |
Family
ID=58809648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510729709.XA Pending CN106659030A (en) | 2015-10-30 | 2015-10-30 | Bonding structure and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106659030A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360278A (en) * | 2017-08-15 | 2017-11-17 | 广东欧珀移动通信有限公司 | Housing, housing unit and mobile terminal |
| CN107395814A (en) * | 2017-08-24 | 2017-11-24 | 广东欧珀移动通信有限公司 | Easy-to-draw glue component, housing unit and mobile terminal |
| CN108129999A (en) * | 2018-01-25 | 2018-06-08 | 北京小米移动软件有限公司 | Easy-to-draw glue, battery component and electronic equipment |
| CN108155321A (en) * | 2018-01-31 | 2018-06-12 | 北京小米移动软件有限公司 | Readily removable paper, battery component and electronic equipment |
| WO2019037612A1 (en) * | 2017-08-24 | 2019-02-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Stretch releasing adhesive assembly, housing assembly and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590197U (en) * | 2009-12-11 | 2010-09-22 | 东莞市易创实业有限公司 | Mobile phone battery tag |
| CN203479755U (en) * | 2013-11-25 | 2014-03-12 | 广东汕头超声电子股份有限公司 | Ultrasonic detection device of composite insulator |
| CN104582386A (en) * | 2013-10-15 | 2015-04-29 | 宏达国际电子股份有限公司 | Electronic device and method for dismounting components of electronic device |
-
2015
- 2015-10-30 CN CN201510729709.XA patent/CN106659030A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201590197U (en) * | 2009-12-11 | 2010-09-22 | 东莞市易创实业有限公司 | Mobile phone battery tag |
| CN104582386A (en) * | 2013-10-15 | 2015-04-29 | 宏达国际电子股份有限公司 | Electronic device and method for dismounting components of electronic device |
| CN203479755U (en) * | 2013-11-25 | 2014-03-12 | 广东汕头超声电子股份有限公司 | Ultrasonic detection device of composite insulator |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107360278A (en) * | 2017-08-15 | 2017-11-17 | 广东欧珀移动通信有限公司 | Housing, housing unit and mobile terminal |
| CN107360278B (en) * | 2017-08-15 | 2023-08-11 | Oppo广东移动通信有限公司 | Shell, shell assembly and mobile terminal |
| CN107395814A (en) * | 2017-08-24 | 2017-11-24 | 广东欧珀移动通信有限公司 | Easy-to-draw glue component, housing unit and mobile terminal |
| WO2019037612A1 (en) * | 2017-08-24 | 2019-02-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Stretch releasing adhesive assembly, housing assembly and mobile terminal |
| US10870258B2 (en) | 2017-08-24 | 2020-12-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Stretch releasing adhesive assembly, housing assembly and mobile terminal |
| CN108129999A (en) * | 2018-01-25 | 2018-06-08 | 北京小米移动软件有限公司 | Easy-to-draw glue, battery component and electronic equipment |
| CN108155321A (en) * | 2018-01-31 | 2018-06-12 | 北京小米移动软件有限公司 | Readily removable paper, battery component and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |
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| RJ01 | Rejection of invention patent application after publication |