CN106653618A - 一种集成电路封装点胶室 - Google Patents
一种集成电路封装点胶室 Download PDFInfo
- Publication number
- CN106653618A CN106653618A CN201610865145.7A CN201610865145A CN106653618A CN 106653618 A CN106653618 A CN 106653618A CN 201610865145 A CN201610865145 A CN 201610865145A CN 106653618 A CN106653618 A CN 106653618A
- Authority
- CN
- China
- Prior art keywords
- wall
- deflector
- dispensing room
- integrated antenna
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000003292 glue Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000001914 filtration Methods 0.000 claims abstract description 7
- 239000000428 dust Substances 0.000 claims abstract description 4
- 238000009413 insulation Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004321 preservation Methods 0.000 abstract 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610865145.7A CN106653618B (zh) | 2016-09-25 | 2016-09-25 | 一种集成电路封装点胶室 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610865145.7A CN106653618B (zh) | 2016-09-25 | 2016-09-25 | 一种集成电路封装点胶室 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106653618A true CN106653618A (zh) | 2017-05-10 |
CN106653618B CN106653618B (zh) | 2019-01-08 |
Family
ID=58853965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610865145.7A Expired - Fee Related CN106653618B (zh) | 2016-09-25 | 2016-09-25 | 一种集成电路封装点胶室 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106653618B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109979858A (zh) * | 2019-04-16 | 2019-07-05 | 马鞍山小古精密机电科技有限公司 | 一种电子产品生产用恒温式封装装置 |
CN110299315A (zh) * | 2019-08-06 | 2019-10-01 | 马鞍山正复安电子科技有限公司 | 一种集成电路自动封装设备 |
CN113284828A (zh) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | 一种电子产品生产用恒温式封装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103603159A (zh) * | 2013-11-15 | 2014-02-26 | 蓝星(北京)化工机械有限公司 | 一种内循环式碳纤维干燥炉 |
CN104524874A (zh) * | 2014-12-09 | 2015-04-22 | 天祝天禾生物科技有限责任公司 | 一种食用菌接菌室空气净化系统 |
CN204583618U (zh) * | 2015-02-15 | 2015-08-26 | 南通航运职业技术学院 | 一种自动化涂胶设备 |
CN105521899A (zh) * | 2016-03-08 | 2016-04-27 | 佳马机械涂覆科技(苏州)有限公司 | 一种移动式涂料喷涂机 |
CN205361774U (zh) * | 2016-03-08 | 2016-07-06 | 佳马机械涂覆科技(苏州)有限公司 | 一种移动式涂料喷涂机 |
-
2016
- 2016-09-25 CN CN201610865145.7A patent/CN106653618B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103603159A (zh) * | 2013-11-15 | 2014-02-26 | 蓝星(北京)化工机械有限公司 | 一种内循环式碳纤维干燥炉 |
CN104524874A (zh) * | 2014-12-09 | 2015-04-22 | 天祝天禾生物科技有限责任公司 | 一种食用菌接菌室空气净化系统 |
CN204583618U (zh) * | 2015-02-15 | 2015-08-26 | 南通航运职业技术学院 | 一种自动化涂胶设备 |
CN105521899A (zh) * | 2016-03-08 | 2016-04-27 | 佳马机械涂覆科技(苏州)有限公司 | 一种移动式涂料喷涂机 |
CN205361774U (zh) * | 2016-03-08 | 2016-07-06 | 佳马机械涂覆科技(苏州)有限公司 | 一种移动式涂料喷涂机 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109979858A (zh) * | 2019-04-16 | 2019-07-05 | 马鞍山小古精密机电科技有限公司 | 一种电子产品生产用恒温式封装装置 |
CN110299315A (zh) * | 2019-08-06 | 2019-10-01 | 马鞍山正复安电子科技有限公司 | 一种集成电路自动封装设备 |
CN113284828A (zh) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | 一种电子产品生产用恒温式封装装置 |
Also Published As
Publication number | Publication date |
---|---|
CN106653618B (zh) | 2019-01-08 |
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Legal Events
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181122 Address after: 221300 South of Binhu Avenue and West of Taihu Avenue in Pizhou High-tech Industrial Development Zone, Xuzhou City, Jiangsu Province Applicant after: JIANGSU CANJIA TECHNOLOGY Co.,Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201210 Address after: Room 1201, No.9, Changjiang street, Huanggu District, Shenyang City, Liaoning Province Patentee after: Zhongrong Internet Co.,Ltd. Address before: 221300 South of Binhu Avenue and West of Taihu Avenue in Pizhou High-tech Industrial Development Zone, Xuzhou City, Jiangsu Province Patentee before: JIANGSU CANJIA TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190108 |