CN106647862A - Temperature regulating system - Google Patents

Temperature regulating system Download PDF

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Publication number
CN106647862A
CN106647862A CN201710074924.XA CN201710074924A CN106647862A CN 106647862 A CN106647862 A CN 106647862A CN 201710074924 A CN201710074924 A CN 201710074924A CN 106647862 A CN106647862 A CN 106647862A
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CN
China
Prior art keywords
module
triode
temperature
end communication
output end
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Pending
Application number
CN201710074924.XA
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Chinese (zh)
Inventor
王振
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Institute of Technology
Original Assignee
Wuhan Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Institute of Technology filed Critical Wuhan Institute of Technology
Priority to CN201710074924.XA priority Critical patent/CN106647862A/en
Publication of CN106647862A publication Critical patent/CN106647862A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature

Abstract

The invention discloses a temperature regulating system at least comprising: a temperature measuring component, a processor, a semiconductor refrigeration chip and a driving module, wherein a signal output end of the temperature measuring component is in communication connection with a signal input end of the processor, and the signal output end of the processor is in communication connection with the signal input end of the semiconductor refrigeration chip through the driving module. According to the temperature regulating system disclosed by the invention, the temperature on the surface of an object to be performed with temperature measurement is measured through the temperature measuring component, the measured temperature data are sent to the processor to be analyzed, the processor controls the semiconductor refrigeration chip to refrigerate or heat based on an analysis result, and thus fixed point accurate temperature control of the surface of a certain piece of skin is realized.

Description

A kind of humidity control system
Technical field
The present invention relates to field of medical technology, more particularly to a kind of humidity control system.
Background technology
In specific skin rehabilitation and therapeutic process, generally require that the surface of human body block skin is carried out to pinpoint accurate temperature Degree control.Such as during burn treating or treating skin disease, if the temperature of skin to be treated is controlled in 25 DEG C or so, just The sense of discomfort of patient can be greatly reduced, and without being affected by ambient temperature.
But currently used technology does not realize that the fixed point accurate temperature to certain block skin surface is controlled.
The content of the invention
The present invention solved and be not carried out in prior art to certain block skin surface by providing a kind of humidity control system Fixed point accurate temperature control technical problem.
The invention provides a kind of humidity control system, including:Temperature-measuring part, processor, semiconductor chilling plate and driving Module;The signal output part of the temperature-measuring part is connected with the signal input end communication of the processor, the letter of the processor Number output end is connected by the drive module with the signal input end communication of the semiconductor chilling plate.
Further, the processor includes:
Data reception module, for receiving the temperature data of the temperature-measuring part;
Comparison module, for the temperature data of the temperature-measuring part and preset temperature value to be compared;
Computing module, for calculating control signal according to the comparative result of the comparison module driving mould is sent to Block, realizes the control to the semiconductor chilling plate.
Further, the computing module, specifically includes:
Computing unit, for calculating control signal according to the comparative result of the comparison module;
Data processing unit, at least for the control signal to be converted into duty cycle data;
PWM generator, for sending pulse signal to the drive module according to the duty cycle data.
Further, also include:Time block;The time block is connected with data processing unit communication.
Further, also include:Battery and boost module;The electricity of the current output terminal of the battery and the boost module Stream input electric connection, the current output terminal of the boost module and the temperature-measuring part, the processor, the semiconductor The current input terminal of cooling piece, the drive module and the time block is electrically connected with.
Further, the drive module includes:Driving chip, the first triode, the second triode, the 3rd triode and 4th triode;The emitter stage of first triode be connected with the colelctor electrode of second triode after with the semiconductor system The first signal input end communication connection of cold;The base stage of first triode and the first signal output of the driving chip End communication connects;The base stage of second triode is connected with the secondary signal output end communication of the driving chip;Described The colelctor electrode of one triode is connected with the cathode output end communication of the boost module;The emitter stage of second triode and institute State the cathode output end communication connection of boost module;The emitter stage of the 3rd triode and the colelctor electrode of the 4th triode It is connected with the secondary signal input end communication of the semiconductor chilling plate after connection;The base stage of the 3rd triode and the drive The secondary signal output end communication connection of dynamic chip;The base stage of the 4th triode is defeated with the first signal of the driving chip Go out end communication connection;The colelctor electrode of the 3rd triode is connected with the cathode output end communication of the boost module;Described The emitter stage of four triodes is connected with the cathode output end communication of the boost module;The signal input part of the driving chip with The signal output end communication connection of the PWM generator.
Further, also include:Charging module;The current output terminal of the charging module is input into the electric current of the battery End is electrically connected with.
Further, also include:Electric quantity monitoring module;The signal input part of the electric quantity monitoring module accesses the electricity Pond, the signal output part of the electric quantity monitoring module is connected with the signal input end communication of the data processing unit.
Further, also include:Wireless communication module;The wireless communication module is connected with processor communication.
Further, the wireless communication module includes following at least one communication module:Wifi module, radio-frequency module and Bluetooth module.
One or more technical schemes provided in the present invention, at least have the following technical effect that or advantage:
The temperature for treating temperature control body surface by temperature-measuring part is measured, then the temperature data for measuring is sent to Processor carries out data analysis, and processor is freezed or heated based on analysis result control semiconductor chilling plate, so as to realize The fixed point accurate temperature of certain block skin surface is controlled.
Description of the drawings
Fig. 1 is the structured flowchart of humidity control system provided in an embodiment of the present invention;
Fig. 2 is the use block diagram of humidity control system provided in an embodiment of the present invention;
Fig. 3 is the structured flowchart of drive module in humidity control system provided in an embodiment of the present invention;
Fig. 4 is the workflow diagram of humidity control system provided in an embodiment of the present invention.
Specific embodiment
The embodiment of the present invention solved and be not carried out in prior art to certain block skin by providing a kind of humidity control system The technical problem of the fixed point accurate temperature control on skin surface.
Technical scheme in the embodiment of the present invention is to solve above-mentioned technical problem, and general thought is as follows:
The temperature for treating temperature control body surface by temperature-measuring part is measured, then the temperature data for measuring is sent to Processor carries out data analysis, and processor is freezed or heated based on analysis result control semiconductor chilling plate, so as to realize The fixed point accurate temperature of certain block skin surface is controlled.
In order to more fully understand above-mentioned technical proposal, below in conjunction with Figure of description and specific embodiment to upper State technical scheme to be described in detail.
Referring to Fig. 1 and Fig. 2, humidity control system provided in an embodiment of the present invention, at least include:Temperature-measuring part, processor, Semiconductor chilling plate and drive module;The signal output part of temperature-measuring part is connected with the signal input end communication of processor, processes The signal output part of device is connected by drive module with the signal input end communication of semiconductor chilling plate.
It should be noted that can by heat-conduction medium be arranged on temperature-measuring part and treat between temperature adjustment object, semiconductor system Cold and treat between temperature adjustment object, for the temperature conduction of skin surface to semiconductor chilling plate to be freezed or semiconductor chilling plate Skin surface is conducted heat to by heat-conduction medium, the heat-conduction medium can be the media such as copper sheet, and by screw or Heat transfer glue links together with semiconductor chilling plate, temperature-measuring part.
It is in the present embodiment, temperature-measuring part is adjacent with semiconductor chilling plate in order to obtain more preferable temperature control effect Arrange.
In the present embodiment, temperature-measuring part is temperature sensor DS18B20.
The structure of processor is illustrated, processor at least includes:
Data reception module, for receiving the temperature data of temperature-measuring part;
Comparison module, for the temperature data of temperature-measuring part and preset temperature value to be compared;
Computing module, for calculating control signal according to the comparative result of comparison module drive module is sent to, and it is right to realize The control of semiconductor chilling plate.
Wherein, computing module is specifically included:
Computing unit, for calculating control signal according to the comparative result of comparison module;
Data processing unit, at least for control signal to be converted into duty cycle data;
PWM generator, for sending pulse signal to drive module according to duty cycle data.
The structure of the embodiment of the present invention is specifically described, is also at least included:Time block;At time block and data Reason unit communications connection.
The structure of the embodiment of the present invention is further described, is also at least included:Battery and boost module;The electricity of battery The current input terminal of stream output end and boost module is electrically connected with, the current output terminal of boost module and temperature-measuring part, processor, The current input terminal of semiconductor chilling plate, drive module and time block is electrically connected with.
Referring to Fig. 3, drive module at least includes:Driving chip, the first triode, the second triode, the 3rd triode and 4th triode;The emitter stage of the first triode is believed after being connected with the colelctor electrode of the second triode with the first of semiconductor chilling plate Number input end communication connection;The base stage of the first triode is connected with the first signal output end communication of driving chip;Two or three pole The base stage of pipe is connected with the secondary signal output end communication of driving chip;The colelctor electrode of the first triode and the positive pole of boost module Output end communication connection;The emitter stage of the second triode is connected with the cathode output end communication of boost module;3rd triode Emitter stage is connected after being connected with the colelctor electrode of the 4th triode with the secondary signal input end communication of semiconductor chilling plate;Three or three The base stage of pole pipe is connected with the secondary signal output end communication of driving chip;The base stage of the 4th triode and the first of driving chip Signal output end communication connects;The colelctor electrode of the 3rd triode is connected with the cathode output end communication of boost module;Four or three pole The emitter stage of pipe is connected with the cathode output end communication of boost module;The signal input part of driving chip and the letter of PWM generator Number output end communication connection.
In the present embodiment, driving chip is IR2110 chips;First triode, the second triode, the 3rd triode and 4th triode is power switch pipe.
In order to ensure the embodiment of the present invention can continuous firing, also at least include:Charging module;The electric current of charging module is defeated Go out end to be electrically connected with the current input terminal of battery.
In the present embodiment, the current input terminal of charging module is connected by USB interface with the current output terminal of power supply.
In order to be monitored to the electricity of battery, also at least include:Electric quantity monitoring module;The signal of electric quantity monitoring module is defeated Enter to terminate into battery, the signal output part of electric quantity monitoring module is connected with the signal input end communication of data processing unit.
In the present embodiment, electric quantity monitoring module is FAN4010 chips.
In order to realize the telecommunications functions of the embodiment of the present invention, also at least include:Wireless communication module;Radio communication mold Block is connected with processor communication.
In the present embodiment, wireless communication module includes following at least one communication module:Wifi module, radio-frequency module and Bluetooth module.
Referring to Fig. 4, when needing to perform temperature control flow, the current actual temperature in temperature sensor is read first Value, and be compared with preset temperature value, obtain temperature difference.The temperature gap can be on the occasion of, or negative value, only One of symbology refrigeration, and another symbology is heated.Again digital PID operation is carried out to the temperature difference, PID at this The model of computing can be increment type, or absolute type.The result of PID arithmetic maps to dutycycle numerical value, conversion For the count value of a certain fixed cycle, PWM generator is sent into, producing two groups of pwm pulse signals that are anti-phase and having dead band is used to drive The drive module of dynamic semiconductor chilling plate, so as to controlling semiconductor chilling plate refrigeration or heating, makes actual temperature with default temperature Degree is consistent, it is thus achieved that the precise control of temperature.Additionally, processor can also by wifi module or bluetooth module with it is long-range Terminal realizes UNICOM, data transfer, so as to the actual temperature for detecting and battery electric quantity situation are fed back into remote terminal, also connects Receive the preset temperature data and the whether information such as start-up temperature control of remote terminal transmission.Need exist for explanation, boosting Module is by the boost in voltage exported by battery and voltage stabilizing is used to 12V for H bridge drive modules, while another road leads to 12V voltages Cross reduction voltage circuit voltage stabilizing to use for the other parts of system to 3.3V, while completing the monitoring to battery electric quantity.
【Technique effect】
1st, the temperature for treating temperature control body surface by temperature-measuring part is measured, then the temperature data for measuring is sent Data analysis is carried out to processor, processor is freezed or heated based on analysis result control semiconductor chilling plate, so as to reality Show the fixed point accurate temperature to certain block skin surface to control.
2nd, the H bridge drive modules constituted using power switch tube device are driven to semiconductor chilling plate, by receiving The pwm signal control power switch tube device exported by processor, it is achieved thereby that accurate refrigeration and computer heating control.
3rd, by the application to charging module, it is ensured that the continuity of embodiment of the present invention work.
4th, by the application to electric quantity monitoring module, the monitoring of the electricity to the embodiment of the present invention is realized, is further protected The continuity of embodiment of the present invention work is demonstrate,proved.
5th, by the application to wireless communication module, the telecommunications functions of the embodiment of the present invention are realized.
The embodiment of the present invention can be applicable to skin rehabilitation or therapy field, be detected using semiconductor refrigerating technology combination temperature Technology, realizes the temperature control to human skin, while can also carry out data transmission with intelligent terminal, so as to realize The function of remote monitoring.
Those skilled in the art are it should be appreciated that embodiments of the invention can be provided as method, system or computer program Product.Therefore, the present invention can be using complete hardware embodiment, complete software embodiment or with reference to the reality in terms of software and hardware Apply the form of example.And, the present invention can be adopted and wherein include the computer of computer usable program code at one or more The computer program implemented in usable storage medium (including but not limited to magnetic disc store, CD-ROM, optical memory etc.) is produced The form of product.
The present invention is the flow process with reference to method according to embodiments of the present invention, equipment (system) and computer program Figure and/or block diagram are describing.It should be understood that can be by computer program instructions flowchart and/or each stream in block diagram The combination of journey and/or square frame and flow chart and/or the flow process in block diagram and/or square frame.These computer programs can be provided The processor of all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce A raw machine so that produced for reality by the instruction of computer or the computing device of other programmable data processing devices The device of the function of specifying in present one flow process of flow chart or one square frame of multiple flow processs and/or block diagram or multiple square frames.
These computer program instructions may be alternatively stored in can guide computer or other programmable data processing devices with spy In determining the computer-readable memory that mode works so that the instruction being stored in the computer-readable memory is produced to be included referring to Make the manufacture of device, the command device realize in one flow process of flow chart or one square frame of multiple flow processs and/or block diagram or The function of specifying in multiple square frames.
These computer program instructions also can be loaded into computer or other programmable data processing devices so that in meter Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented process, so as in computer or The instruction performed on other programmable devices is provided for realizing in one flow process of flow chart or multiple flow processs and/or block diagram one The step of function of specifying in individual square frame or multiple square frames.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described Property concept, then can make other change and modification to these embodiments.So, claims are intended to be construed to include excellent Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without deviating from the present invention to the present invention God and scope.So, if these modifications of the present invention and modification belong to the scope of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to comprising these changes and modification.

Claims (10)

1. a kind of humidity control system, it is characterised in that include:Temperature-measuring part, processor, semiconductor chilling plate and driving mould Block;The signal output part of the temperature-measuring part is connected with the signal input end communication of the processor, the signal of the processor Output end is connected by the drive module with the signal input end communication of the semiconductor chilling plate.
2. the system as claimed in claim 1, it is characterised in that the processor includes:
Data reception module, for receiving the temperature data of the temperature-measuring part;
Comparison module, for the temperature data of the temperature-measuring part and preset temperature value to be compared;
Computing module, for calculating control signal according to the comparative result of the comparison module drive module is sent to, real Now to the control of the semiconductor chilling plate.
3. system as claimed in claim 2, it is characterised in that the computing module, specifically includes:
Computing unit, for calculating control signal according to the comparative result of the comparison module;
Data processing unit, at least for the control signal to be converted into duty cycle data;
PWM generator, for sending pulse signal to the drive module according to the duty cycle data.
4. system as claimed in claim 3, it is characterised in that also include:Time block;The time block and the data Processing unit communication connection.
5. system as claimed in claim 4, it is characterised in that also include:Battery and boost module;The electric current of the battery is defeated Go out the current input terminal electric connection at end and the boost module, the current output terminal of the boost module and the thermometric portion The current input terminal of part, the processor, the semiconductor chilling plate, the drive module and the time block electrically connects Connect.
6. system as claimed in claim 5, it is characterised in that the drive module includes:Driving chip, the first triode, Second triode, the 3rd triode and the 4th triode;The collection of the emitter stage of first triode and second triode It is connected with the first signal input end communication of the semiconductor chilling plate after electrode connection;The base stage of first triode and institute State the first signal output end communication connection of driving chip;The base stage of second triode is believed with the second of the driving chip Number output end communication connection;The colelctor electrode of first triode is connected with the cathode output end communication of the boost module;Institute State the emitter stage of the second triode to be connected with the cathode output end communication of the boost module;The emitter stage of the 3rd triode It is connected with the secondary signal input end communication of the semiconductor chilling plate after being connected with the colelctor electrode of the 4th triode;It is described The base stage of the 3rd triode is connected with the secondary signal output end communication of the driving chip;The base stage of the 4th triode with The first signal output end communication connection of the driving chip;The colelctor electrode of the 3rd triode is with the boost module just Pole output end communication connection;The emitter stage of the 4th triode is connected with the cathode output end communication of the boost module;Institute State the signal input part of driving chip to be connected with the signal output end communication of the PWM generator.
7. system as claimed in claim 5, it is characterised in that also include:Charging module;The electric current output of the charging module Hold and be electrically connected with the current input terminal of the battery.
8. system as claimed in claim 5, it is characterised in that also include:Electric quantity monitoring module;The electric quantity monitoring module Signal input part accesses the battery, and the signal output part of the electric quantity monitoring module is defeated with the signal of the data processing unit Enter end communication connection.
9. the system as any one of claim 1-8, it is characterised in that also include:Wireless communication module;It is described wireless Communication module is connected with processor communication.
10. system as claimed in claim 9, it is characterised in that the wireless communication module includes following at least one communication Module:Wifi module, radio-frequency module and bluetooth module.
CN201710074924.XA 2017-02-13 2017-02-13 Temperature regulating system Pending CN106647862A (en)

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Publication number Priority date Publication date Assignee Title
CN109730408A (en) * 2019-01-05 2019-05-10 天津大学 The bracelet and method for regulating temperature of a kind of pair of human hands local temperature adjustment
CN109883568A (en) * 2019-02-12 2019-06-14 辽宁达能电气股份有限公司 A kind of constant temperature box device based on temperature-measuring system of distributed fibers
CN114428526A (en) * 2022-01-26 2022-05-03 联想长风科技(北京)有限公司 Constant temperature control method, system and device

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