CN106646736A - Optical waveguide - Google Patents
Optical waveguide Download PDFInfo
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- CN106646736A CN106646736A CN201611019852.0A CN201611019852A CN106646736A CN 106646736 A CN106646736 A CN 106646736A CN 201611019852 A CN201611019852 A CN 201611019852A CN 106646736 A CN106646736 A CN 106646736A
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- covering
- region
- layer
- oxygen buried
- buried layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12152—Mode converter
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The embodiment of the invention provides an optical waveguide, comprising a substrate (01), a buried oxide layer (02), a waveguide layer (06), a cladding (03) and a moisture-proof layer (05) stacked in sequence, wherein the moisture-proof layer (05) covers at least part of area of the surface of the cladding (03), and the at least part of area comprises an area opposite to the waveguide layer (06). By arranging the moisture-proof layer on the surface of the cladding, the moisture-proof performance of the optical waveguide can be improved to reduce the influence of humidity change on mode field distribution and mode field size of the optical waveguide.
Description
Technical field
The present invention relates to optical communication field, more particularly to a kind of fiber waveguide.
Background technology
Silicon light technology is with material based on silicon-on-insulator (Silicon-on-insulator, SOI), using complementation
Metal-oxide semiconductor (MOS) (Complementary Metal Oxide Semiconductor, CMOS) technique carries out making light
Chip, realizes the technology that photosignal is converted.As shown in figure 1, SOI is by substrate (Substrate), oxygen buried layer (Buried
Oxide, Box) and ducting layer (Waveguide layer) composition, the wherein material of substrate is Si, and the material of oxygen buried layer is
SiO2, the material of ducting layer is Si.Due to SiO2Refractive index smaller (about 1.44), and the refractive index of Si is very big (about
3.47), thus SOI waveguides refringence it is very big, the restriction to light is very strong, and its waveguide can be with small-sized, typical waveguide
Size is 400nm × 220nm.
In existing scheme, covering generally can be also set on the ducting layer of SOI waveguides, covering typically adopts SiO2Material,
In the case of changing in the humidity of the SOI waveguide local environments, SiO2The refractive index of material can change, accordingly,
Using the SiO2The refractive index of the covering of material also can change, and then cause the mode distributions and mould field size of fiber waveguide to be sent out
Changing.
The content of the invention
The invention provides a kind of fiber waveguide, in the case of changing in the humidity of the fiber waveguide local environment, reduces
The mode distributions of the fiber waveguide and the amplitude of variation of mould field size, to reduce mode distributions and mould of the humidity change to the fiber waveguide
The impact of field size.
A kind of first aspect, there is provided fiber waveguide, including：
Substrate (01), oxygen buried layer (02), ducting layer (06), covering (03) and the damp-proof layer (05) for stacking gradually；
The damp-proof layer (05) covers at least part of region on covering (03) surface, at least part of region bag
Include with the ducting layer (06) just to region.
The fiber waveguide of the embodiment of the present invention, by arranging damp-proof layer in cladding surface, it is possible to increase the moisture resistance of fiber waveguide
Can, mode distributions and the impact of mould field size to the fiber waveguide is changed with the humidity for reducing the fiber waveguide local environment.
In some possible implementations, the oxygen buried layer (02) covers the first surface of the substrate (01) at least
Subregion, the ducting layer (06) covers the first area of the first surface of the oxygen buried layer (02), and the covering (03) is covered
At least part of region on the first surface of the oxygen buried layer (02) in addition to the first area and the ducting layer (06) are covered,
Wherein, the first surface of the substrate (01) is near the side of the oxygen buried layer (02) on the substrate (01)
Surface, the first surface of the oxygen buried layer (02) is the surface of the side on the oxygen buried layer (02) away from the substrate (01).
In some possible embodiments, the oxygen buried layer (02) covers the first surface of the substrate (01), described
Region on the first surface of oxygen buried layer (02) in addition to the first area includes second area, the 3rd region, the 4th region
With the 5th region, the 5th region, the 3rd region and the 4th are spaced between the second area and the 3rd region
Region is adjacent with the first area, and the 3rd region is located at the side of the first area, and the 4th region is located at
The opposite side of the first area；
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers institute
Second area is stated, second covering (032) covers the 3rd region, the ducting layer (06) and the 4th region；
The damp-proof layer (05) cover at least part of region of the first surface of first covering (031), described second
Side wall, second bag on the first surface of covering (032), first covering (031) near second covering (032)
Side wall near a covering (031) and the 5th region on layer (032),
Wherein, the first surface of first covering (031) is away from the oxygen buried layer on first covering (031)
(02) surface of side, the first surface of second covering (032) is to bury oxygen away from described on second covering (032)
The surface of the side of layer (02).
So, damp-proof layer (05) can also cover the side wall of the second covering (032), it is therefore prevented that steam oozes from the side wall of covering
Enter, can further improve the humidity resistance of fiber waveguide, changed to this with the humidity for further reducing the fiber waveguide local environment
The mode distributions of fiber waveguide and the impact of mould field size.
In some possible embodiments, the oxygen buried layer (02) covers the first surface of the substrate (01), described
At least part of region on the first surface of oxygen buried layer (02) in addition to the first area include second area, the 3rd region and
4th region, the 3rd region and the 4th region it is adjacent with the first area, the 3rd region be located at described first
The side in region, the 4th region is located at the opposite side of the first area；
There is groove, the notch of the groove faces away from the substrate (01) on the oxygen buried layer (02), described the
Two regions are located at the side of the first madial wall of the groove, the 3rd region, the first area and the 4th region
Positioned at the side of the second madial wall of the groove, the second madial wall of the first madial wall of the groove and second groove
Be it is relative,
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers institute
Second area is stated, second covering (032) covers the 3rd region, the ducting layer (06) and the 4th region；
The damp-proof layer (05) cover at least part of region of the first surface of first covering (031), described second
Side wall, second bag on the first surface of covering (032), first covering (031) near second covering (032)
Near the side wall and the inner surface of the groove of first covering (031) on layer (032),
Wherein, the first surface of first covering (031) is away from the oxygen buried layer on first covering (031)
(02) surface of side, the first surface of second covering (032) is to bury oxygen away from described on second covering (032)
The surface of the side of layer (02), the inner surface of the groove includes first madial wall, second madial wall and described recessed
The bottom surface of groove.
So, damp-proof layer (05) can also cover the inner surface of the groove on oxygen buried layer (02), can further improve light
The humidity resistance of waveguide, the mode distributions and mould to the fiber waveguide are changed with the humidity for further reducing the fiber waveguide local environment
The impact of field size.
In some possible embodiments, the first surface of the substrate (01) include the 6th region, SECTOR-SEVEN domain and
Section Eight domain, between the 6th region and the SECTOR-SEVEN domain Section Eight domain is spaced；
The oxygen buried layer (02) includes the first oxygen buried layer (021) and the second oxygen buried layer (022), first oxygen buried layer
(021) the 6th region is covered, second oxygen buried layer (022) covers the SECTOR-SEVEN domain, and the ducting layer (06) covers
The first area of the first surface of second oxygen buried layer (02), the first surface of second oxygen buried layer (022) is described the
On one oxygen buried layer (022) away from the substrate (01) side surface；
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers institute
The first surface of the first oxygen buried layer (021) is stated, second covering (032) covers the ducting layer (06) and described second and buries oxygen
Region on the first surface of layer (022) in addition to the first area, the first surface of first oxygen buried layer (021) is institute
State the surface of the side on the first oxygen buried layer (021) away from the substrate (01)；
The damp-proof layer (05) cover at least part of region of the first surface of first covering (031), described second
Side wall, second bag on the first surface of covering (032), first covering (031) near second covering (032)
Near second oxygen buried layer on the side wall, first oxygen buried layer (021) of first covering (031) on layer (032)
(022) near the side wall and the Section Eight of first oxygen buried layer (021) on side wall, second oxygen buried layer (022)
Domain,
Wherein, the first surface of first covering (031) is away from the oxygen buried layer on first covering (031)
(02) surface of side, the first surface of second covering (032) is to bury oxygen away from described on second covering (032)
The surface of the side of layer (02).
So, damp-proof layer (05) can also cover the both sides side wall of second oxygen buried layer (022) at ducting layer (06) place, energy
Enough humidity resistances for further improving fiber waveguide, are changed to the fiber waveguide with the humidity for further reducing the fiber waveguide local environment
Mode distributions and mould field size impact.
In some possible embodiments, the covering (03) covers and remove on the first surface of the oxygen buried layer (02) institute
State the region outside first area and the ducting layer (06).
So be conducive to simplifying the manufacture craft of fiber waveguide.
In some possible embodiments, fiber waveguide also includes：Top covering (07), the top covering (07) covers described
Away from a side surface of the covering (03) on damp-proof layer (05).
By arranging top covering on damp-proof layer, the humidity resistance of fiber waveguide can be further improved.
In some possible embodiments, the damp-proof layer (05) is including one or more layers sub- damp-proof layer.
In some possible embodiments, the damp-proof layer (05) is including following at least one material：SixN1-x、
SiON, Al and Al1-xOx, wherein 0<x<1.
In some possible embodiments, the distance between the damp-proof layer (05) and described ducting layer (06) be more than or
Equal to 1 μm and less than or equal to 20 μm.
By making to be spaced suitable distance between damp-proof layer and ducting layer, damp-proof layer can be reduced to the mould field of fiber waveguide
Affect, and then impact of the damp-proof layer to the performance of fiber waveguide can be reduced.
In some possible embodiments, the thickness of the damp-proof layer (05) is more than or equal to 2nm and is less than or equal to
200nm。
For example, the thickness of damp-proof layer (05) can also be more than or equal to 3nm and less than or equal to 100nm.
By arranging suitable thickness for damp-proof layer, impact of the damp-proof layer to the mould field of fiber waveguide, Jin Erneng can be reduced
Enough reduce performance impact of the damp-proof layer to fiber waveguide.
In some possible embodiments, the fiber waveguide is spot-size converter.
The spot-size converter of the embodiment of the present invention can reduce the humidity of the reverse silicon based three-dimensional wedge local environment and become
The impact that change brings to its mode distributions and mould field size such that it is able to which the mould field improved between spot-size converter and optical fiber is lost
Match somebody with somebody, reduce the insertion loss of spot-size converter.
In some possible embodiments, the fiber waveguide is reverse silicon based three-dimensional wedge.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram of silicon-on-insulator；
Fig. 2 is the cross section structure schematic diagram of fiber waveguide according to an embodiment of the invention；
Fig. 3 is the overall structure diagram of spot-size converter；
Fig. 4 is the cross section structure schematic diagram of fiber waveguide according to another embodiment of the present invention；
Fig. 5 is the cross section structure schematic diagram of fiber waveguide according to another embodiment of the present invention；
Fig. 6 is the cross section structure schematic diagram of fiber waveguide according to another embodiment of the present invention；
Fig. 7 is the cross section structure schematic diagram of fiber waveguide according to another embodiment of the present invention；
Fig. 8 is the cross section structure schematic diagram of fiber waveguide according to another embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is described.
Fig. 2 is the schematic diagram of fiber waveguide according to embodiments of the present invention.As shown in Fig. 2 fiber waveguide includes what is stacked gradually
Substrate (01), oxygen buried layer (02), ducting layer (06), covering (03) and damp-proof layer (05).
Damp-proof layer (05) covers at least part of region on covering (03) surface, and at least part of region includes and ducting layer
(06) just to region.
The fiber waveguide of the embodiment of the present invention, by arranging damp-proof layer in cladding surface, it is possible to increase the moisture resistance of fiber waveguide
Can, mode distributions and the impact of mould field size to the fiber waveguide is changed with the humidity for reducing the fiber waveguide local environment.
Specifically, oxygen buried layer (02) covers at least part of region of the first surface of substrate (01), and ducting layer (06) is covered
The first area (11) of the first surface of oxygen buried layer (02), covering (03) is covered and remove on the first surface of oxygen buried layer (02) the firstth area
At least part of region and ducting layer (06) outside domain (11).
Wherein, the first surface of substrate (01) is near the surface of the side of oxygen buried layer (02), oxygen buried layer on substrate (01)
(02) first surface is the surface of the side on oxygen buried layer (02) away from substrate (01).
If as shown in Fig. 2 the substrate (01), oxygen buried layer (02), ducting layer (06), covering (03) and protection against the tide in fiber waveguide
Layer (05) is stacked gradually along direction from bottom to up, then the first surface of substrate (01) is the upper surface of substrate (01), buries
The first surface of oxygen layer (02) is the upper surface of oxygen buried layer (02).For ease of description, can be in fiber waveguide as shown in Figure 2 respectively
The upper surface Unify legislation of layer is first surface, and the lower surface Unify legislation of each layer is second surface.
It should be noted that oxygen buried layer (02) covers at least part of region of the first surface of substrate (01), it is meant that bury
The second surface of oxygen layer (02) contacts with least part of region of the first surface of substrate (01).Ducting layer (06) is covered and buries oxygen
The first area (11) of the first surface of layer (02), it is meant that the second surface of ducting layer (06) and the first table of oxygen buried layer (02)
The first area (11) in face contacts.Similarly, covering (03) is covered and remove on the first surface of oxygen buried layer (02) first area
(11) at least part of region and ducting layer (06) outside, it is meant that the second surface of covering (03) and the first of oxygen buried layer (02)
The side at least part of region, ducting layer (06) first surface and ducting layer (06) both sides on surface in addition to first area (11)
Wall contacts.
In certain embodiments, fiber waveguide shown in Fig. 2 can for spot-size converter (Spot Size Converter,
SSC).The overall structure diagram of SSC is illustrated in figure 3, SSC can be coupled the light in other fiber waveguides (such as optical fiber).Should
Understand, SSC can adopt the wedge structure shown in Fig. 3, but the knot of wedge shape SSC shown in Fig. 3 is not limited in the embodiment of the present invention
Structure.
It should be understood that fiber waveguide shown in Fig. 2 is also used as other fiber waveguide devices.
For example, the size of ducting layer (06) can be designed as 130nm × 220nm, and wherein 220nm can be ducting layer (06)
Height value, 130nm can be ducting layer (06) width value.It should be understood that ducting layer (06) is also designed to other chis
It is very little.
It should be noted that if spot-size converter is using the wedge structure shown in Fig. 3,130nm × 220nm can refer to
Be wedge structure most narrow end ducting layer size.
The spot-size converter of the embodiment of the present invention can reduce the humidity of environment and change to its mode distributions and mould field size
The impact that (mode field size) brings such that it is able to improve the model field unbalance between spot-size converter and optical fiber, reduces mould
The insertion loss of spot-size converter.
The material of substrate (01) is Si, and the material of oxygen buried layer (02) is SiO2, the material of ducting layer (06) is Si, covering
(03) material is SiO2。
In certain embodiments, damp-proof layer (05) can include a straton damp-proof layer.In further embodiments, such as Fig. 4
Shown, damp-proof layer (05) can also include many straton damp-proof layers.By arranging many straton damp-proof layers, protection against the tide can be further enhanced
Effect.
It should be understood that in Fig. 4 only by taking two straton damp-proof layers (051) and (052) as an example, damp-proof layer (05) can also include other
Many straton damp-proof layers of quantity.
The material of damp-proof layer (05) can have protective action to moisture, while the refractive index of the material of damp-proof layer (05) can be with
More than or equal to 1.4 and less than or equal to 3, can so reduce impact of the damp-proof layer to the mould field of fiber waveguide.For example, damp-proof layer (05)
Material can be SixN1-x, SiON, Al or Al1-xOx, wherein 0<x<1.But the embodiment of the present invention is not limited this, damp-proof layer
(05) material can also be other barrier materials.
When damp-proof layer (05) is including many straton damp-proof layers, the material of many straton damp-proof layers can be with identical, it is also possible to no
Together, the embodiment of the present invention is not limited this.
Ducting layer (06) close to covering (03) refractive index and fiber waveguide mould field size strong correlation, by covering table
Face arranges damp-proof layer, and steam can be avoided to enter covering (03), and then can reduce mode distributions and mould of the steam to fiber waveguide
The impact of field size.
Alternatively, as shown in figure 5, the fiber waveguide shown in Fig. 2 can also include top covering (04).Top covering (04) covers anti-
Away from a side surface of covering (03) on damp layer (05).
In certain embodiments, the material of top covering (04) can be identical with the material of covering (03), it is also possible to covering
(03) material is different, and the embodiment of the present invention is not limited this.For example, the material of top covering (04) can be SiO2, also may be used
Think Si3N4, or doping Si1-xOx, for example can be with p-doped (P) or boron (B).
It should be understood that when top covering (04) is positioned at the outermost layer of fiber waveguide, top covering (04) is referred to as passivation layer.
By arranging top covering on damp-proof layer, the humidity resistance of fiber waveguide can be further improved, further to reduce
The humidity of the fiber waveguide local environment changes the mode distributions to the fiber waveguide and the impact of mould field size.
As shown in Fig. 2 the damp-proof layer by arranging a layer plane in fiber waveguide, can avoid steam from oozing from upper surface
Enter, it is simple structure, practical.But steam can from side wall ooze into, therefore the embodiment of the present invention also proposed one kind can
The structure that three bread cover is realized, as shown in Figure 6 to 8.It should be understood that examples of the Fig. 6 to Fig. 8 for fiber waveguide shown in Fig. 2, to avoid
Repeat, suitably eliminate corresponding content.
Covering (03) in fiber waveguide shown in Fig. 6 to Fig. 8 includes the first covering (031) and the second covering (032), the first bag
The first surface of layer (031) is the surface of the side on the first covering (031) away from oxygen buried layer (02), the second covering (032)
First surface is the surface of the side on the second covering (032) away from oxygen buried layer (02).
Alternatively, as shown in fig. 6, oxygen buried layer (02) covers the first surface of substrate (01), the first table of oxygen buried layer (02)
Region on face in addition to first area (11) includes second area (12), the 3rd region (13), the 4th region (14) and the 5th
Region (15), is spaced the 5th region (15), the 3rd region (13) and the 4th area between second area (12) and the 3rd region (13)
Domain (14) is adjacent with first area (11), the 3rd region (13) positioned at the side of first area (11), the 4th region (14) position
In the opposite side of first area (11)；
First covering (031) covers second area, and the second covering (032) covers the 3rd region, ducting layer (06) and the 4th
Region (14)；
Damp-proof layer (05) cover at least part of region of first surface of the first covering (031), the of the second covering (032)
Near the first covering on the side wall, the second covering (032) of the second covering (032) on one surface, the first covering (031)
(031) side wall and the 5th region (15).
So, by the area of further increase damp-proof layer (05) covering so that damp-proof layer (05) can also cover second
The side wall of covering (032), it is therefore prevented that steam from the side wall of covering ooze into, can further improve the humidity resistance of fiber waveguide, with
Further reduce mode distributions and the impact of mould field size of the humidity change to the fiber waveguide.
In certain embodiments, damp-proof layer (05) can only cover the first surface of the second covering (032), the second covering
(032) the side wall near the first covering (031) and the 5th region (15) on.
It should be noted that in certain embodiments, covering (03) can also include first covering in fiber waveguide
(031) and second covering (032), side of the first covering (031) positioned at the second covering (032).
In certain embodiments, as shown in fig. 6, covering (03) can also include two the first coverings (031) in fiber waveguide
With the one the second covering (032), and two the first coverings (031) are respectively positioned at the both sides of the second covering (032).Two
The position relationship of the other parts in each first covering (031) in one covering (031) and fiber waveguide may be referred to retouch above
State, here is not repeated.
Alternatively, as shown in fig. 7, oxygen buried layer (02) covers the first surface of substrate (01), the first table of oxygen buried layer (02)
At least part of region on face in addition to first area (11) includes second area (12), the 3rd region (13) and the 4th region
(14), the 3rd region (13) and the 4th region (14) are adjacent with first area (11), and the 3rd region (13) is positioned at first area
(11) side, opposite side of the 4th region (14) positioned at first area (11)；
There is groove, the notch of groove faces away from substrate (01), and second area (12) is positioned at recessed on oxygen buried layer (02)
The side of the first madial wall of groove, the 3rd region (13), first area (11) and the 4th region (14) are in the second of groove
The side of side wall, the first madial wall of groove is relative with the second madial wall of the second groove；
First covering (031) covers second area (12), and the second covering (032) covers the 3rd region (13), ducting layer
And the 4th region (14) (06)；
Damp-proof layer (05) cover at least part of region of first surface of the first covering (031), the of the second covering (032)
Near the first covering on the side wall, the second covering (032) of the second covering (032) on one surface, the first covering (031)
(031) side wall and the inner surface of groove.
Wherein, the inner surface of groove includes the bottom surface of the first madial wall, the second madial wall and groove.
So, by the area of further increase damp-proof layer (05) covering so that damp-proof layer (05) can also be covered and bury oxygen
The inner surface of the groove on layer (02), can further improve the humidity resistance of fiber waveguide, further to reduce the fiber waveguide institute
The humidity of place's environment changes mode distributions and the impact of mould field size to the fiber waveguide.
In certain embodiments, damp-proof layer (05) can only cover the first surface of the second covering (032), the second covering
(032) the side wall of close first covering (031), the second madial wall of groove and the ground of groove on.
In certain embodiments, the side wall on the first covering (031) near the second covering (032) and the first inner side of groove
Wall may be located at same plane.
In certain embodiments, the side wall on the first covering (031) near the second covering (032) and the first inner side of groove
Wall can also be located at different planes.For example, the first madial wall of the groove can be protruded from the first covering (031) near the
The side wall of two coverings (032).
Similarly, on the second covering (032) near the first covering (031) side wall and the second madial wall of groove can be with position
In same plane, it is also possible to positioned at different planes.
It should be noted that in certain embodiments, covering (03) can also include first covering in fiber waveguide
(031) and second covering (032), side of the first covering (031) positioned at the second covering (032).Have on oxygen buried layer (02)
Have a groove, the groove be located at the region between the first covering (031) and the second covering (032) just to position.
In certain embodiments, as shown in fig. 7, covering (03) can also include two the first coverings (031) and the
One second covering (032), and two the first coverings (031) are respectively positioned at the both sides of the second covering (032).Have on oxygen buried layer (02)
Have two grooves, two grooves be located at respectively region between two the first coverings (031) and the second covering (032) just to
Position.The position relationship of other each layers in each first covering (031) and fiber waveguide in two the first coverings (031), with
And the position relationship of the other parts in each groove in two grooves and fiber waveguide may be referred to be described above, here is no longer
Repeat.
Alternatively, as shown in figure 8, the first surface of substrate (01) includes the 6th region (16), SECTOR-SEVEN domain (17) and the
Eight regions (18), are spaced Section Eight domain (18) between the 6th region (16) and SECTOR-SEVEN domain (17)；
Oxygen buried layer (02) includes the first oxygen buried layer (021) and the second oxygen buried layer (022), and the first oxygen buried layer (021) covers the
Six regions (16), the second oxygen buried layer (022) covers SECTOR-SEVEN domain (17), and ducting layer (06) covers the first of the second oxygen buried layer (02)
The first area (11) on surface, the first surface of the second oxygen buried layer (022) is away from substrate (01) on the first oxygen buried layer (022)
The surface of side；
First covering (031) covers the first surface of the first oxygen buried layer (021), and the second covering (032) covers ducting layer
(06) region and on the first surface of the second oxygen buried layer (022) in addition to first area, the first table of the first oxygen buried layer (021)
Face is the surface of the side on the first oxygen buried layer (021) away from substrate (01)；
Damp-proof layer (05) cover at least part of region of first surface of the first covering (031), the of the second covering (032)
Near the first covering on the side wall, the second covering (032) of the second covering (032) on one surface, the first covering (031)
(031) it is close on the side wall, the second oxygen buried layer (022) of the second oxygen buried layer (022) on side wall, the first oxygen buried layer (021)
The side wall of the first oxygen buried layer (021) and Section Eight domain (18).
So, damp-proof layer (05) can also cover the whole side wall of oxygen buried layer (02), can further improve fiber waveguide
Humidity resistance, the mode distributions and mould field size to the fiber waveguide are changed with the humidity for further reducing the fiber waveguide local environment
Impact.
In certain embodiments, damp-proof layer (05) can only cover the first surface of the second covering (032), the second covering
(032) the side wall and the on the side wall of the first covering (031), the second oxygen buried layer (022) near the first oxygen buried layer (021)
Eight regions.
It should be noted that in certain embodiments, covering (03) can also include first covering in fiber waveguide
(031) and second covering (032), side of first covering (031) positioned at the second covering (032).Oxygen buried layer (02) is wrapped
First oxygen buried layer (021) and second oxygen buried layer (022) are included, first oxygen buried layer (031) is positioned at the second oxygen buried layer
(032) side.
In certain embodiments, as shown in figure 8, covering (03) can also include two the first coverings (031) in fiber waveguide
With the one the second covering (032), and two the first coverings (031) are respectively positioned at the both sides of the second covering (032).Oxygen buried layer
(02) there are two the first oxygen buried layers (021) and two the second oxygen buried layers (022), two first oxygen buried layers (021) are respectively on
Positioned at the both sides of the second oxygen buried layer (022).In each first covering (031) and fiber waveguide in two the first coverings (031)
In each first oxygen buried layer (021) and fiber waveguide in the position relationship of other each layers, and two the first oxygen buried layers (021)
The position relationship of other parts may be referred to be described above, and here is not repeated.
The subregion of covering (03) and/or oxygen buried layer (02) can be etched away using etching technics, be obtained such as Fig. 6 extremely
Structure shown in Fig. 8, to increase the region of damp-proof layer covering.
Alternatively, as shown in Fig. 6, Fig. 7 and Fig. 8, damp-proof layer (05) covers the part of the first surface of the first covering (031)
Region.
The manufacture craft of fiber waveguide can so be simplified.
It should be understood that damp-proof layer (05) can also cover the Zone Full of the first surface of the first covering (031).
Alternatively, the distance between damp-proof layer (05) and ducting layer (06) are more than or equal to 1 μm and less than or equal to 20 μm.
As shown in Fig. 2, Fig. 4 to Fig. 8, the fore-and-aft distance between the top edge of the lower limb and ducting layer (06) of damp-proof layer 05 be more than or
Equal to 1 μm and less than or equal to 20 μm.As shown in Fig. 6 to Fig. 8, side of the damp-proof layer (05) on the left of the second covering (032)
The lateral separation at the edge on the left of edge and ducting layer (06) is more than or equal to 1 μm and less than or equal to 20 μm, or damp-proof layer
(05) lateral separation at the edge on the right side of the edge and ducting layer (06) on the right side of the second covering (032) is more than or equal to 1 μm
And less than or equal to 20 μm.
By making to be spaced suitable distance between damp-proof layer and ducting layer, damp-proof layer can be reduced to the mould field of fiber waveguide
Affect, and then impact of the damp-proof layer to the performance of fiber waveguide can be reduced.
Alternatively, the thickness of damp-proof layer (05) is more than or equal to 3nm and less than or equal to 100nm.
Alternatively, the thickness of damp-proof layer (05) is more than or equal to 2nm and less than or equal to 200nm.
By arranging suitable thickness for damp-proof layer, impact of the damp-proof layer to the mould field of fiber waveguide, Jin Erneng can be reduced
Enough reduce impact of the damp-proof layer to the performance of fiber waveguide.
It should be noted that the embodiment of the present invention is not limited the manufacture craft of fiber waveguide.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, all should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by the scope of the claims.
Claims (12)
1. a kind of fiber waveguide, it is characterised in that include：
Substrate (01), oxygen buried layer (02), ducting layer (06), covering (03) and the damp-proof layer (05) for stacking gradually；
The damp-proof layer (05) covers at least part of region on covering (03) surface, at least part of region include with
The ducting layer (06) just to region.
2. fiber waveguide according to claim 1, it is characterised in that
The oxygen buried layer (02) covers at least part of region of the first surface of the substrate (01), and the ducting layer (06) covers
The first area of the first surface of the oxygen buried layer (02), the covering (03) is covered on the first surface of the oxygen buried layer (02)
At least part of region and the ducting layer (06) in addition to the first area,
Wherein, the first surface of the substrate (01) is near the table of the side of the oxygen buried layer (02) on the substrate (01)
Face, the first surface of the oxygen buried layer (02) is the surface of the side on the oxygen buried layer (02) away from the substrate (01).
3. fiber waveguide according to claim 2, it is characterised in that
The oxygen buried layer (02) covers the first surface of the substrate (01), except described on the first surface of the oxygen buried layer (02)
Region outside first area include second area, the 3rd region, the 4th region and the 5th region, the second area with it is described
The 5th region is spaced between 3rd region, the 3rd region and the 4th region are adjacent with the first area, described
3rd region is located at the side of the first area, and the 4th region is located at the opposite side of the first area；
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers described the
Two regions, second covering (032) covers the 3rd region, the ducting layer (06) and the 4th region；
The damp-proof layer (05) covers at least part of region, second covering of the first surface of first covering (031)
(032) near side wall, second covering of second covering (032) on first surface, first covering (031)
(032) the side wall near first covering (031) and the 5th region on,
Wherein, the first surface of first covering (031) is away from the oxygen buried layer (02) on first covering (031)
The surface of side, the first surface of second covering (032) is away from the oxygen buried layer (02) on second covering (032)
Side surface.
4. fiber waveguide according to claim 2, it is characterised in that
The oxygen buried layer (02) covers the first surface of the substrate (01), except described on the first surface of the oxygen buried layer (02)
At least part of region outside first area includes second area, the 3rd region and the 4th region, the 3rd region and the 4th
Region is adjacent with the first area, and the 3rd region is located at the side of the first area, and the 4th region is located at
The opposite side of the first area；
There is groove, the notch of the groove faces away from the substrate (01), secondth area on the oxygen buried layer (02)
Domain is located at the side of the first madial wall of the groove, and the 3rd region, the first area and the 4th region are located at
The side of the second madial wall of the groove, the first madial wall of the groove is phase with the second madial wall of second groove
To；
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers described the
Two regions, second covering (032) covers the 3rd region, the ducting layer (06) and the 4th region；
The damp-proof layer (05) covers at least part of region, second covering of the first surface of first covering (031)
(032) near side wall, second covering of second covering (032) on first surface, first covering (031)
(032) near the side wall and the inner surface of the groove of first covering (031) on,
Wherein, the first surface of first covering (031) is away from the oxygen buried layer (02) on first covering (031)
The surface of side, the first surface of second covering (032) is away from the oxygen buried layer (02) on second covering (032)
Side surface, the inner surface of the groove includes the bottom of first madial wall, second madial wall and the groove
Face.
5. fiber waveguide according to claim 2, it is characterised in that
The first surface of the substrate (01) include the 6th region, SECTOR-SEVEN domain and Section Eight domain, the 6th region with it is described
The Section Eight domain is spaced between SECTOR-SEVEN domain；
The oxygen buried layer (02) includes the first oxygen buried layer (021) and the second oxygen buried layer (022), and first oxygen buried layer (021) is covered
The 6th region is covered, second oxygen buried layer (022) covers the SECTOR-SEVEN domain, and the ducting layer (06) covers described second
The first area of the first surface of oxygen buried layer (02), the first surface of second oxygen buried layer (022) is first oxygen buried layer
(022) on away from the substrate (01) side surface；
The covering (03) includes the first covering (031) and the second covering (032), and first covering (031) covers described the
The first surface of one oxygen buried layer (021), second covering (032) covers the ducting layer (06) and second oxygen buried layer
(022) region on first surface in addition to the first area, the first surface of first oxygen buried layer (021) is described
On first oxygen buried layer (021) away from the substrate (01) side surface；
The damp-proof layer (05) covers at least part of region, second covering of the first surface of first covering (031)
(032) near side wall, second covering of second covering (032) on first surface, first covering (031)
(032) near second oxygen buried layer on the side wall, first oxygen buried layer (021) of first covering (031) on
(022) near the side wall and the Section Eight of first oxygen buried layer (021) on side wall, second oxygen buried layer (022)
Domain,
Wherein, the first surface of first covering (031) is away from the oxygen buried layer (02) on first covering (031)
The surface of side, the first surface of second covering (032) is away from the oxygen buried layer (02) on second covering (032)
Side surface.
6. fiber waveguide according to claim 2, it is characterised in that the covering (03) covers the of the oxygen buried layer (02)
Region and the ducting layer (06) on one surface in addition to the first area.
7. fiber waveguide according to any one of claim 1 to 6, it is characterised in that also include：
Top covering (07), the top covering (07) is covered on the damp-proof layer (05) away from a side surface of the covering (03).
8. fiber waveguide according to any one of claim 1 to 7, it is characterised in that the damp-proof layer (05) is including a layer
Or many straton damp-proof layers.
9. fiber waveguide according to any one of claim 1 to 8, it is characterised in that the damp-proof layer (05) is including following
At least one material：SixN1-x, SiON, Al and Al1-xOx, wherein 0<x<1.
10. fiber waveguide according to any one of claim 1 to 9, it is characterised in that the damp-proof layer (05) and the ripple
The distance between conducting shell (06) is more than or equal to 1 μm and less than or equal to 20 μm.
11. fiber waveguides according to any one of claim 1 to 10, it is characterised in that the thickness of the damp-proof layer (05)
More than or equal to 2nm and less than or equal to 200nm.
12. fiber waveguides according to any one of claim 1 to 11, it is characterised in that the fiber waveguide is reverse wedge shape
Spot-size converter.
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| CN201611019852.0A CN106646736B (en) | 2016-11-18 | 2016-11-18 | Optical waveguide |
| PCT/CN2017/085747 WO2018090593A1 (en) | 2016-11-18 | 2017-05-24 | Optical waveguide |
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|---|---|---|---|
| CN201611019852.0A CN106646736B (en) | 2016-11-18 | 2016-11-18 | Optical waveguide |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018090593A1 (en) * | 2016-11-18 | 2018-05-24 | 华为技术有限公司 | Optical waveguide |
| WO2023039892A1 (en) * | 2021-09-18 | 2023-03-23 | 华为技术有限公司 | Optical chip and preparation method therefor, and communication device |
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| CN1711494A (en) * | 2002-11-19 | 2005-12-21 | 鲁梅热股份有限公司 | Electro-optic polymer waveguide devices and method for making such devices |
| US20060013547A1 (en) * | 2004-07-13 | 2006-01-19 | Bridgestone Corporation | Method for manufacturing optical waveguide, and optical waveguide made by the method |
| US20060029348A1 (en) * | 2002-02-19 | 2006-02-09 | Optinetrics, Inc. | Optical waveguide structure |
| US20060042322A1 (en) * | 2000-05-19 | 2006-03-02 | Optinetrics, Inc. | Integrated optic devices and processes for the fabrication of integrated optic devices |
| US20100278496A1 (en) * | 2007-09-26 | 2010-11-04 | Masatoshi Yamaguchi | Optical waveguide and method for producing the same |
| CN103257398A (en) * | 2012-02-17 | 2013-08-21 | 台湾积体电路制造股份有限公司 | Method of fabrication polymer waveguide |
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|---|---|---|---|---|
| CN106646736B (en) * | 2016-11-18 | 2018-11-16 | 华为机器有限公司 | Optical waveguide |
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|---|---|---|---|---|
| US20060042322A1 (en) * | 2000-05-19 | 2006-03-02 | Optinetrics, Inc. | Integrated optic devices and processes for the fabrication of integrated optic devices |
| US20060029348A1 (en) * | 2002-02-19 | 2006-02-09 | Optinetrics, Inc. | Optical waveguide structure |
| CN1711494A (en) * | 2002-11-19 | 2005-12-21 | 鲁梅热股份有限公司 | Electro-optic polymer waveguide devices and method for making such devices |
| US20060013547A1 (en) * | 2004-07-13 | 2006-01-19 | Bridgestone Corporation | Method for manufacturing optical waveguide, and optical waveguide made by the method |
| US20100278496A1 (en) * | 2007-09-26 | 2010-11-04 | Masatoshi Yamaguchi | Optical waveguide and method for producing the same |
| CN103257398A (en) * | 2012-02-17 | 2013-08-21 | 台湾积体电路制造股份有限公司 | Method of fabrication polymer waveguide |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018090593A1 (en) * | 2016-11-18 | 2018-05-24 | 华为技术有限公司 | Optical waveguide |
| WO2023039892A1 (en) * | 2021-09-18 | 2023-03-23 | 华为技术有限公司 | Optical chip and preparation method therefor, and communication device |
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| Publication number | Publication date |
|---|---|
| CN106646736B (en) | 2018-11-16 |
| WO2018090593A1 (en) | 2018-05-24 |
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