CN106637871A - Heat pump clothes dryer and heat pump system thereof - Google Patents
Heat pump clothes dryer and heat pump system thereof Download PDFInfo
- Publication number
- CN106637871A CN106637871A CN201510744653.5A CN201510744653A CN106637871A CN 106637871 A CN106637871 A CN 106637871A CN 201510744653 A CN201510744653 A CN 201510744653A CN 106637871 A CN106637871 A CN 106637871A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pump
- heat pipe
- cold
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
- D06F58/00—Domestic laundry dryers
- D06F58/02—Domestic laundry dryers having dryer drums rotating about a horizontal axis
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
- D06F58/00—Domestic laundry dryers
- D06F58/20—General details of domestic laundry dryers
- D06F58/206—Heat pump arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Detail Structures Of Washing Machines And Dryers (AREA)
Abstract
The invention provides a heat pump clothes dryer and a heat pump system thereof. The heat pump clothes dryer and the heat pump system thereof have the high heat exchange efficiency, the drying time can be shortened, a semiconductor refrigeration component is protected, the phenomenon that the limiting temperature appears on the surface of the semiconductor refrigeration component is avoided, and the service life of the semiconductor refrigeration component is prolonged. The heat pump system comprises an evaporator and a condenser which are arranged in an air duct of the heat pump clothes dryer, the heat pump system further comprises the semiconductor refrigeration component with the cold end and the hot end, the semiconductor refrigeration component is fixedly installed on the outer side of the air duct, the cooling capacity generated by the cold end is conveyed to the gas side of the evaporator through a first heat pipe or a first heat sink, the heat generated by the hot end is conveyed to the gas side of the condenser through a second heat pipe or a second heat sink. Due to the fact that the cold capacity of the cold end is effectively utilized, the hot end does not make direction contact with gas inside the air duct, the heat exchange efficiency is improved, and the service life of the semiconductor refrigeration component is prolonged.
Description
This application claims submitting Patent Office of the People's Republic of China, Application No. on October 30th, 2015
201510731211.7, the China of entitled " a kind of heat pump clothes dryer and its heat pump "
The priority of patent application, entire contents are hereby incorporated by the application.
Technical field
The present invention relates to technical field of heat pumps, more particularly to a kind of heat pump clothes dryer and its heat pump
System.
Background technology
Heat pump clothes dryer mainly includes compressor, condenser, evaporimeter, throttling arrangement, auxiliary
Fan, cylinder, air circulation duct, main air blower and air filter, wherein, condenser,
Evaporimeter, throttling arrangement and compressor collectively constitute heat pump.
Fig. 1 is refer to, Fig. 1 is a kind of principle of set-up mode of heat pump clothes dryer in prior art
Schematic diagram.
As shown in figure 1, the operation principle of heat pump clothes dryer is as follows：Circulating fan first starts, will
The wind field of closed-loop system is set up；After circulating fan operation, compressor start, heat pump
Start working, air passes sequentially through cylinder, screen pack, evaporimeter, condenser, is then return to
Cylinder, completes one cycle；Dry hot blast is entered in cylinder, (to be dried by loading
Clothing) moisture take away.When going out cylinder, the temperature reduction of air, humidity increase.Humid air
Evaporimeter is flowed through, by cool-down dehumidification；Condenser is then flowed through, temperature is raised, and returns to cylinder complete
Into an air circulation.So repeatedly, until clothing is oven-dried, close compressor is finally closed
Closed loop blower fan.
It can be seen from above-mentioned principle, after heat pump clothes dryer starts, longer period of time is in liter
Wen Qi, and the wind-warm syndrome now into cylinder is relatively low, dehumidification rate is relatively low.In order to shorten during drying
Between, it may be considered that increase auxiliary cold source and thermal source.
Please further refer to Fig. 2, Fig. 2 is the schematic cross-section in the air channel 1 for being provided with auxiliary thermal source.
As shown in Fig. 2 the Chinese patent of Patent No. CN202430535U discloses one kind having
The heat pump of auxiliary thermal source, on the air channel of condensator outlet semiconductor heater is installed,
The semiconductor heater is arranged in order by multiple semiconductor refrigerating elements and is constituted.When to semiconductor
When cooling module is passed through direct current, can respectively there is hot and cold effect in the two ends of semiconductor refrigerating element
Should；As shown in Fig. 2 the hot junction 20 of semiconductor chilling plate is arranged in into air channel inner side, cold end
10 are arranged in air channel outside, and the air in air channel is heated with will pass through hot junction 20, enter
One step improves the wind-warm syndrome into cylinder.
But, above-mentioned existing technical scheme exists following not enough：
1st, when the cold end 10 of semiconductor chilling plate is placed directly within the outside of air channel, wind will not be acted on
Air in road, the cold energy of generation is thrown aside, and causes the waste of the energy, is also easy to because of cold end
10 surface temperature is too low and frosting, affects the life-span, or even directly damages semiconductor chilling plate；
2nd, semiconductor chilling plate is delicate electronic device, and in air channel is hot and humid environment,
And it is mingled with fiber debris in humid air, the service life of semiconductor chilling plate can be affected；
3rd, the hot junction 20 of semiconductor chilling plate is directly arranged at air channel inner side, only by hot junction 20
Surface area exchanged heat, heat exchange area is less, and heat dissipation capacity not enough, affects heat exchange efficiency.
Therefore, a kind of heat pump clothes dryer and its heat pump how are designed, to improve heat exchange efficiency,
Shorten drying time, while protecting semiconductor refrigerating element, extend semiconductor refrigerating unit
The service life of part, becomes the technical problem of the current urgent need to resolve of those skilled in the art.
The content of the invention
It is an object of the invention to provide a kind of heat pump clothes dryer and its heat pump, with higher
Heat exchange efficiency, can shorten drying time, and semiconductor refrigerating element is protected, it is to avoid half
There is limiting temperature in the surface of conductor cooling module, and then extends the use of semiconductor refrigerating element
Life-span.
To solve above-mentioned technical problem, the present invention provides a kind of heat pump, including being arranged on heat
Evaporimeter and condenser in the air channel of pump dryer, the heat pump is also included with cold end
With the semiconductor refrigerating element in hot junction, the semiconductor refrigerating element is fixedly mounted on the air channel
Outside, the cold that the cold end is produced is delivered to the steaming by the way that the first heat pipe or first are heat sink
The gas side of device is sent out, the heat that the hot junction produces is delivered to institute by the way that the second heat pipe or second are heat sink
State the gas side of condenser.
The heat pump of the present invention, the cold produced by the cold end of semiconductor refrigerating element is by warm
Pipe or the first heat sink gas side for being delivered to evaporimeter, are carried out pre- to the air of evaporimeter upstream and downstream
Dehumidifying or further dehumidifying, with effectively utilizes cold, it is to avoid the waste of cold；Due to cold end
Cold effectively transfer out, the surface temperature mistake of cold end will not be caused because cold piles up
It is low, also therefore and in cold end frosting semiconductor refrigerating element would not be damaged, auxiliary extends half
The service life of conductor cooling module；Meanwhile, whole semiconductor refrigerating element is arranged on outside air channel
Side, will not contact with the hot and humid gas in air channel, even if impurity is not carried in gas not yet
Can be attached on semiconductor refrigerating element so that semiconductor refrigerating element has good use ring
Border, is conducive to extending its service life；And, using heat pipe or it is heat sink carry out heat transfer,
Be conducive to increasing heat exchange area and convection transfer rate, and then improve heat exchange efficiency, Neng Gougeng
The drying to gas in air channel is realized soon.
What is more important, the cold end of semiconductor refrigerating element is cold equivalent to the auxiliary of heat pump
Source, can carry out pre-dehumidified or the gas for evaporimeter downstream to the gas of vaporizer upstream
Further dehumidified, to improve the degree of drying into the gas of condenser, be easy to condenser
Follow-up hyperthermic treatment is carried out, in other words the intensification for condenser is ready, enables to gas
Body is increased to higher temperature；Meanwhile, the hot junction of semiconductor refrigerating element is equivalent to heat pump
Auxiliary thermal source, the gas of condenser upstream can be preheated or to condenser downstream
Gas further heated, and then lifted and be ultimately formed the temperature of gas.It can be seen that, lead to
The cooperation in cold end and hot junction is crossed, the gas of the high temperature low humidity for heat pump clothes dryer may finally be formed
Body, effectively increases drying efficiency.
Alternatively, cold can be equably delivered to first heat pipe gas of the evaporimeter
Side；And/or even heat can be delivered to second heat pipe gas side of the condenser.
Alternatively, some fins are set with first heat pipe and/or second heat pipe, respectively
The fin extends along wind direction.
Alternatively, first heat pipe is extended in the same direction with the heat exchanger tube of the evaporimeter；And/or institute
State the second heat pipe to extend in the same direction with the heat exchanger tube of the condenser.
Alternatively, the cold end is towards the inner side in the air channel, and described first is heat sink installed in institute
State on the end face of cold end, and described first heat sink with some fin, each fin with
Matrix form is intervally arranged.
Alternatively, the hot junction is towards the inner side in the air channel, and described second is heat sink installed in institute
State on the end face in hot junction, and described second heat sink with some fin, each fin with
Matrix form is intervally arranged.
Alternatively, the cold that the cold end is produced is conveyed and/or institute by first heat pipe
The heat for stating hot junction generation is conveyed by second heat pipe.
Alternatively, also include using keeper made by Heat Conduction Material, the semiconductor refrigerating unit
Part is arranged on the keeper, and is fixedly mounted on the outer of the air channel by the keeper
Side wall.
Alternatively, between the cold end and first heat pipe or the cold end and described
One it is heat sink between be coated with heat-conducting silicone grease；And/or, between the hot junction and second heat pipe,
Or the hot junction and it is described second it is heat sink between be coated with heat-conducting silicone grease.
The present invention also provides a kind of heat pump clothes dryer, including the heat pump system described in any of the above-described
System.
Because the heat pump clothes dryer of the present invention is including the heat pump described in any of the above-described, therefore on
State the heat that the technique effect that the heat pump described in any one can be generated is applied to the present invention
Pump dryer, here is omitted.
Description of the drawings
Fig. 1 is a kind of principle schematic of set-up mode of heat pump clothes dryer in prior art；
Fig. 2 is the schematic cross-section in the air channel for being provided with auxiliary thermal source；
Fig. 3 is heat pump provided by the present invention dimensional structure diagram in embodiment 1；
Fig. 4 is the top view of heat pump shown in Fig. 3；
Fig. 5 is that semiconductor refrigerating element and heat pipe connection status are bowed in heat pump described in Fig. 3
View and side view, wherein, Fig. 5 a are top view, and Fig. 5 b are side view；
Fig. 6 heat pumps provided by the present invention dimensional structure diagram in example 2；
Fig. 7 is the top view of heat pump shown in Fig. 6；
Fig. 8 is semiconductor refrigerating element and the first heat pipe in heat pump shown in Fig. 6, second hot
Sink in a kind of set-up mode in the dimensional structure diagram of connection status；
Fig. 9 is semiconductor refrigerating element shown in Fig. 8 and the first heat pipe and the second heat sink connection status
Top view；
Figure 10 is that heat sink being in semiconductor refrigerating element connects in heat pump provided by the present invention
Connect the dimensional structure diagram of state；
Figure 11 is heat pump provided by the present invention dimensional structure diagram in embodiment 3；
Figure 12 is the top view of heat pump shown in Figure 11.
In Fig. 1-2：
Cold end 10, hot junction 20；
In Fig. 3-12：
Air channel 1, evaporimeter 2, condenser 3, semiconductor refrigerating element 4, first heat sink 51,
Second heat sink 52, the first heat pipe 53, the second heat pipe 54, fin 6, keeper 7, compressor
8th, motor 9.
Specific embodiment
The core of the present invention is to provide a kind of heat pump clothes dryer and its heat pump, with higher
Heat exchange efficiency, can shorten drying time, and semiconductor refrigerating element is protected, it is to avoid half
There is limiting temperature in the surface of conductor cooling module, and then extends the use of semiconductor refrigerating element
Life-span.
Below in conjunction with accompanying drawing, the heat pump clothes dryer and its heat pump of the present invention are specifically situated between
Continue, so as to those skilled in the art's accurate understanding technical scheme.
With the air channel 1 of heat pump clothes dryer as reference inside and outside as herein described, near the center of air channel 1
Direction for interior, be outer away from the direction at the center of air channel 1.As herein described first, second etc.
Word, only for the same or similar different parts of specification configuration or different structure, it is right not indicate that
Certain particular determination of order.Upstream and downstream as herein described is to be with the flow direction of gas
With reference to being defined, gas first flow through for upstream, relative with upstream is downstream.
As shown in Fig. 3-Figure 12, the invention provides a kind of heat pump, for heat pump clothes-drying
Machine, heat pump can include evaporimeter 2 and condenser 3, and both are arranged at heat pump clothes-drying
In the air channel 1 of machine, to carry out to the low temperature and high relative humidity gas that the cylinder by heat pump clothes dryer flows out
Dehumidifying and heating, to form dry high-temperature gas, so as to be dried to the clothing in cylinder
Process, gas passes sequentially through cylinder-evaporimeter 2- condensers 3, is eventually returned to cylinder, completes one
Secondary circulation.
The heat pump of the present invention can also include semiconductor refrigerating element 4, semiconductor refrigerating unit
Part 4 has cold end and hot junction, and semiconductor refrigerating element 4 can be fixedly mounted on the outer of air channel 1
Side, then by heat pipe or it is heat sink by cold end produce cold be delivered to the upstream of evaporimeter 2 or
The gas side in person downstream, by heat pipe or the heat sink heat by hot junction generation condenser 3 is delivered to
Upstream or the gas side in downstream.
It will be recalled from above that upstream of the evaporimeter 2 in condenser 3, can be to low temperature and high relative humidity
Gas carries out dehumidifying and further cooling, when the cold end of semiconductor refrigerating element 4 it is cold by what is produced
Amount is delivered to the gas side of evaporimeter 2, gas can further be dehumidified or pre-dehumidified,
To strengthen effect on moisture extraction, the degree of drying of gas is improved；Condenser 3 is under evaporimeter 2
Trip, can heat to the gas after dehumidifying, to improve the wind-warm syndrome into cylinder, when partly leading
The heat of generation is delivered to the gas side of condenser 3 in the hot junction of body cooling module 4, can be to gas
Body is further heated up or pre-add heat treatment, and then increases the wind-warm syndrome for eventually entering into cylinder,
Shorten drying time.
It can be seen that, semiconductor refrigerating element 4 is equivalent to an auxiliary source, and its cold end provided auxiliary is cold
Source, hot junction provided auxiliary thermal source, auxiliary realizes the dehumidifying of the low temperature and high relative humidity gas flowed out by cylinder
And heating, the more dry and higher gas of wind-warm syndrome is formed, to doing containing wet wash in cylinder
It is dry, so as to shorten drying time.
It is of the invention by semiconductor refrigerating compared with the heat pump in prior art heat pump clothes dryer
Element 4 is arranged on the outside in air channel 1 so that low in semiconductor refrigerating element 4 and air channel 1
Warm high humidity gas are not directly contacted with, it is achieved thereby that the protection to semiconductor refrigerating element 4, also
The impurity carried in gas can be avoided to be attached on semiconductor refrigerating element 4；Semiconductor refrigerating
The cold end of element 4 is and existing by heat pipe or the heat sink gas side that cold is delivered to evaporimeter 2
The cold end in the outside of air channel 1 of leaving unused in technology is compared, and cold is fully used, and improves
Energy utilization rate；And, heat pipe or it is heat sink ensure that cold transmit reliability, can prevent
Cold is piled up in cold end, also can just avoid the frosting because the surface temperature of cold end is too low, and then
Prevent because frosting damages semiconductor refrigerating element 4, extend making for semiconductor refrigerating element 4
Use the life-span；Also, due to heat pipe or the heat sink effective transmission that can realize cold or heat, can
To improve heat exchange efficiency.
For ease of description, herein the heat pipe being connected with cold end is defined as into the first heat pipe 53, with heat
The connected heat pipe in end is defined as the second heat pipe 54, be connected with cold end heat sink to be defined as first heat sink
51, what is be connected with hot junction heat sink is defined as second heat sink 52.
It should be noted that the first heat pipe 53 and first heat sink 51 in due to the application is used
It is theoretically, hot essentially without having first simultaneously in the same embodiment in conveying cold
Pipe 53 and first heat sink 51；In the same manner, in the same embodiment also essentially without presence simultaneously
Second heat pipe 54 and second heat sink 52.Part (heat pipe is adopted according to cold and heat transmission
Or it is heat sink) difference, below divide four embodiments to be described in detail the application.
Embodiment 1
As in Figure 3-5, in the first specific embodiment, semiconductor refrigerating element 4
Cold end and hot junction can pass through the conveying of Heat Pipes energy, i.e. cold end is arranged at the first heat pipe
53 are arranged at the second heat pipe 54 and condenser 3 with the upstream of evaporimeter 2 or the gas side in downstream, hot junction
Upstream or the gas side in downstream.Specifically, can arrange in the cold end of semiconductor refrigerating element 4
First heat pipe 53, hot junction arranges the second heat pipe 54, then that cold is defeated via the first heat pipe 53
The gas side of evaporimeter 2 is delivered to, heat is delivered to into the gas side of condenser 3 via the second heat pipe 54.
When cold is delivered to the gas side of the upstream of evaporimeter 2, pre-dehumidified can be carried out to gas；When cold
When amount is delivered to the gas side in the downstream of evaporimeter 2, the gas Jing after the process of evaporimeter 2 can be entered
Row further dehumidifying；Regardless of processing mode, in the certain feelings of the moisture removal of evaporimeter 2
Under condition, the gas aridity for subsequently flowing through condenser 3 can be improved, improve effect on moisture extraction.
When heat is delivered to the gas side of the upstream of condenser 3, can be to preheating into gas；When
When heat is delivered to the gas side in the downstream of condenser 3, can be to the gas after being processed by condenser 3
Further heated up；In the case where the increasing extent of temperature of condenser 3 is certain, no matter using what
Planting processing mode can lift the temperature of the gas for eventually entering into cylinder, to shorten drying time.
As in Figure 3-5, cold can be equably delivered to the first heat pipe 53 evaporimeter 2
Gas side, specifically can extend to the other end by the horizontal one end of evaporimeter 2, or by evaporimeter
2 vertical one end extends to the other end, can be with by the diagonally opposed by one end of evaporimeter 2
The other end is extended to, so that cold to be more uniformly transferred to the gas side of whole evaporimeter 2.
In the same manner, even heat can be delivered to the second heat pipe 54 the gas side of condenser 3,
Specifically the other end can be extended to by the horizontal one end of condenser 3, or vertical one end extends
To the other end, or the other end is extended to by diagonally opposed one end of condenser 3, so as to incite somebody to action
Heat is more uniformly transferred to whole condenser 3.
In other words, it is the distributing homogeneity of realizing cold in evaporimeter 2, can be to the first heat pipe
53 bearing of trend is configured, specifically can be corresponding according to the matching of the structure shape of evaporimeter 2,
It is not limited to above-mentioned set-up mode；In the same manner, the bearing of trend of the second heat pipe 54 can be configured,
To improve distributing homogeneity of the heat in condenser 3.
Wherein, the first heat pipe 53 and the second heat pipe 54 can be arranged in parallel, it is also possible to which inclination sets
Put.In the embodiment shown in Fig. 3-5, evaporimeter 2 and condenser 3 can be parallel to each other,
And can upwardly extend, now, the first heat pipe 53 and the second heat pipe in the side perpendicular to wind direction
54 can extend in the face of wind direction, and the first heat pipe 53 is in the upper of the second heat pipe 54
Trip.Those skilled in the art can also as needed adjust the concrete of evaporimeter 2 and condenser 3
Position, and the position to the first heat pipe 53 and the second heat pipe 54 carries out accommodation.
Can be being set with some fins 6, each fin on the first heat pipe 53 and the second heat pipe 54
6 are spaced apart on the first heat pipe 53 and the second heat pipe 54, each fin surface approximately along
Wind direction extension, as in Figure 3-5.With the bottom surface institute direction of evaporimeter 2 and condenser 3
, used as the bottom surface in air channel 1, now, fin 6 can be with perpendicular to the bottom surface in air channel 1 for end face.
Fin 6 can be in the first heat pipe 53 and the second heat pipe 54 is first-class is intervally arranged, it is also possible to according to
The rule of heat transfer arranges the spacing of fin 6 and arrangement rule；Can also only in the first heat pipe
53 and second heat pipe 54 away from one end of semiconductor refrigerating element 4, the fin 6 is set, to increase
Big heat exchange area, improves heat exchange efficiency.That is, the quantity and version of fin 6
, as long as can play a part of to improve heat exchange efficiency, heat can be taken into account with unrestricted
The uniformity of conduction.
On the basis of the above, heat pump of the invention can also include keeper 7, keeper
7 can be made using Heat Conduction Material, be specifically as follows metal material, such as ingot.Now,
Semiconductor refrigerating element 4 can be arranged on keeper 7, then will partly be led by keeper 7
Body cooling module 4 is fixed on the outside of air channel 1.The space in the outside of air channel 1 may be incorporated for installing
Semiconductor refrigerating element 4, in the embodiment shown in Fig. 3-5, can be by semiconductor refrigerating
Element 4 is fixedly mounted on the lateral wall in air channel 1, now, without the need for for semiconductor refrigerating element 4
Installation be separately provided mounting seat, it can also be ensured that the reliability of connection, at the same be easy to heat pipe or
Heat sink mounting arrangements.
As shown in Figure 5 b, heat pump of the invention can specifically include some semiconductor refrigeratings
Element 4, keeper 7 can be provided with some grooves, each semiconductor refrigerating element 4 can with it is each
Matching grooves, and then each semiconductor refrigerating element 4 is arranged in each groove of keeper 7,
Form a semiconductor refrigerating plate.Wherein, two opposing end surfaces of semiconductor refrigerating element 4 point
Not as the cold end and the hot junction, one end of the first heat pipe 53 is connected with the cold end, separately
One end bends towards air channel 1, and stretches in air channel 1, extends in the side of evaporimeter 2, tool
Body may be at the upstream gas side of evaporimeter 2 or lower faint breath side；Second heat pipe 54 and the heat
End connection, the other end bends towards air channel 1, and stretches in air channel 1, the one of condenser 3
Side extends, and specifically may be at the upstream gas side or lower faint breath side of condenser 3.Now,
One heat pipe 53 and the second heat pipe 54 can substantially rectangular bending tube arrange, and with the short of right angle
While the both sides of semiconductor refrigerating element 4 are connected to, with the long side at right angle respectively in evaporimeter
2 and the side of condenser 3 extend, the first heat pipe 53, semiconductor refrigerating element 4 is installed
The heat pipe 54 of keeper 7 and second can connect to form generally U-shaped overall structure, such as
Shown in Fig. 5 a.
Those skilled in the art can be arranged as required to the number of semiconductor refrigerating element 4, such as
Shown in Fig. 5 b, four semiconductor refrigerating elements 4 can be set, then arranged on keeper 7
Four corresponding grooves, and each groove can be in 2 × 2 arranged in matrix.Each semiconductor refrigerating unit
Part 4 can be with respective cold end towards air channel 1, it is also possible to respective hot junction towards air channel 1,
Only illustrated towards as a example by air channel 1 by cold end in Fig. 3-5b, do not indicated that to cold end and hot junction
The restriction of direction.It is, of course, also possible to adjust the end face of semiconductor refrigerating element 4 as needed
Direction, is not limited to unify direction；Those skilled in the art can also be arranged as required to semiconductor
The number and arrangement mode of cooling module 4, the structure being not limited to shown in Fig. 5 a and Fig. 5 b.
The lateral wall in the air channel 1 refers to the wall in the outside of air channel 1, preferably can be except
The outside wall surface corresponding to the other parts of bottom surface for installing evaporimeter 2 and condenser 3 is gone,
For example, the top surface relative with the bottom surface in air channel 1, and the bottom surface in air channel 1 and top surface it
Between two sides.
Embodiment 2
Fig. 6-10 are refer to, in second specific embodiment, the heat pump of the present invention can
To be connected with evaporimeter 2 by the first heat pipe 53, connect with condenser 3 by second heat sink 52
Connect.Now, the first heat pipe 53 is referred to embodiment 1 and is configured, and no longer describes in detail herein.
In the present embodiment, second heat sink 52 may be mounted at the heat of semiconductor refrigerating element 4
End, it is concrete on the end face in hot junction；Second heat sink 52 can include some fin, each to dissipate
Backing can be arranged in strip, can be being uniformly distributed on the end face in hot junction, it is also possible to
According to the exterior contour of certain rule arrangement form rule.In the embodiment shown in Fig. 6-10
In, second heat sink 52 each fin can be intervally arranged with a matrix type, form exterior contour
For the structure of rectangular column；The bearing of trend of each fin can be parallel to condensation on second heat sink 52
The heat exchanger tube of device 3, or perpendicular to the heat exchanger tube of condenser 3, to increase heat exchange area.But
To be limited by heat sink structure, heat sink limited length, often can not possibly as heat pipe by
One end of condenser 3 extends to the other end.Now, although second heat sink 52 limited length,
But the multiple fin on second heat sink 52 arrange to be formed exterior contour be rectangular column solid change
Heat structure, can effectively realize heat exchange, and the gas of the upstream and downstream of condenser 3 is fully heated.
Those skilled in the art can be arranged as required to the number of fin on second heat sink 52,
Density and arrangement mode etc., to form the structure matched with condenser 3, preferably to condensation
The gas of the upstream and downstream of device 3 is heated, and is not limited to above-mentioned specific mode.
For example, the multiple fin on second heat sink 52 can be spaced to form exterior contour
For the structure of triangular prism, and it is arranged as required to the corresponding relation of each seamed edge and condenser 3.Also
The multiple fin on second heat sink 52 can be caused to be intervally arranged to form exterior contour for halfpace
The structure of shape.Spacing between adjacent fin can be with equal, it is also possible to, specifically may be used
With the spacing for as needed some fin on second heat sink 52 being adjusted according to certain rule.
The present embodiment can also arrange the structures such as keeper 7 with reference to embodiment 1, it may also be said to,
The present embodiment can be only that to substituted for second using second heat sink 52 hot with the difference of embodiment 1
Pipe 54, other parts are referred to embodiment 1 and arrange.
As seen in figs. 8-10, the hot junction of semiconductor refrigerating element 4 is whole equivalent to a mounting surface
Individual semiconductor refrigerating element 4 in other words bearing semiconductor cooling module 4 keeper 7 equivalent to
Second heat sink 52 mounting seat, second heat sink 52 can be fixed on semiconductor refrigerating element with one end
4 hot junction, the other end arranges fin, and causes fin perpendicular to semiconductor refrigerating element 4
Extend.Specifically can be as shown in Figure 10, second heat sink 52 is fixed on corresponding semiconductor refrigerating
The hot junction of element 4, each semiconductor refrigerating element 4 is carried by keeper 7, is formed and is had the
Two heat sink 52 location-plate.
On the basis of shown in Figure 10, semiconductor refrigerating element 4 can connect the first heat pipe 53,
First heat pipe 53 can be the pipe of rectangular bending, with one end of the minor face of right-angle side and semiconductor
The cold end connection of cooling module 4, another right-angle side is approximately perpendicular to semiconductor refrigerating element 4
Extend, as shown in Figure 8 and Figure 9, realize semiconductor refrigerating element 4, the first heat pipe 53 and
Second heat sink 52 connection.
Embodiment 3
As is illustrated by figs. 11 and 12, in the third specific embodiment, semiconductor refrigerating unit
The cold end of part 4 can be by the first heat sink 51 gas side that cold is delivered to evaporimeter 2, hot junction
The gas side of condenser 3 is delivered heat to by the second heat pipe 54.
In detail, the cold end of semiconductor refrigerating element 4 conveys cold by first heat sink 51
To the upstream of evaporimeter 2 or the gas side in downstream, hot junction is delivered heat to by the second heat pipe 54
The upstream of condenser 3 or the gas side in downstream.
Wherein, first heat sink 51 be referred in embodiment 2 second heat sink 52 be configured,
These settings include first heat sink 51 structure, install the number and fin of fin thereon
Arrangement form on the end face of cold end place.Specifically, semiconductor refrigerating unit in the present embodiment
Part 4 can with its cold end towards air channel 1 inner side, first heat sink 51 may be mounted at the end of cold end
On face, the fin on first heat sink 51 can be intervally arranged on the end face of cold end, form outer
Contouring is the three-dimensional heat exchange structure of rectangular column as shown in Figure 11-Figure 12.
Density and arrangement form of fin that can also be on heat sink to first 51 etc. change
Enter, be not limited to above-mentioned rectangular cylindrical structures, second be specifically referred in embodiment 2 is hot
Heavy 52, here is omitted.
The second heat pipe 54 in the present embodiment is referred to the second heat pipe 54 in embodiment 1
Structure is configured, and also repeats no more herein.
Understand with reference to above-described embodiment, preferred mode is the cold and hot junction that cold end is produced
In the heat of generation, at least one is conveyed by heat pipe.As described in above-mentioned embodiment 1-3
Specific embodiment.Heat pipe can be arranged according to the version of evaporimeter 2 or condenser 3
Bearing of trend and development length, then can be set with fin 6 on heat pipe to increase heat exchange
Area, that is to say, that whole evaporation can be preferably covered when carrying out energy transmission using heat pipe
Device 2 or condenser 3, improve the uniformity of heat exchange efficiency and heat exchange.
In embodiment 1-3, the first heat pipe 53 can be extended in the same direction with the heat exchanger tube of evaporimeter 2,
Effect on moisture extraction is cooperateed with improve cold and evaporimeter 2 produced by semiconductor refrigerating element 4,
Play preferably auxiliary exsiccation；Second heat pipe 54 can be in the same direction with the heat exchanger tube of condenser 3
Extend, with improve the heat produced by semiconductor refrigerating element 4 and condenser 3 heating is cooperateed with
Effect, plays and preferably aid in heat effect.
Can also there is embodiment 4 in the present invention, i.e. the cold of cold end generation passes through first heat sink 51
Conveying, the heat that hot junction produces is by the second heat sink 52 conveying, and first heat sink 51 and second is hot
Heavy 52 are referred to embodiment 2 and embodiment 3 is configured.Using first heat sink 51 and
Two heat sink 52 when carrying out energy transmission, it is possible to reduce the loss in transmittance process, improves energy profit
With rate.
In the present invention, embodiment 2 can be implemented with embodiment 3, embodiment 4 using similar
The structure of example 1, for example, can arrange the keeper 7 described in embodiment 1, to realize half
The installation of conductor cooling module 4, in other words, the difference of embodiment 1-4 can be only that transmission
The part that cold and heat are adopted (heat pipe is heat sink).
On the basis of the above, in heat pump of the invention, can be in cold end and the first heat pipe 53
Or coated with thermally conductive silicone grease in the gap between first heat sink 51；Can also be in hot junction and the second heat pipe
Coated with thermally conductive silicone grease in gap between 54 or second heat sink 52.Specifically, in embodiment 1
In, in the joint gap of cold end and the first heat pipe 53, between the connection of hot junction and the second heat pipe 54
Can be with coated with thermally conductive silicone grease in gap；In example 2, the connection of cold end and the first heat pipe 53
In gap, hot junction with second heat sink 52 joint gap in can be with coated with thermally conductive silicone grease；In reality
In applying example 3, in cold end and first heat sink 51 joint gap, hot junction and the second heat pipe 54
Can be with coated with thermally conductive silicone grease in joint gap；In example 4, cold end and first heat sink 51
Joint gap in, hot junction with second heat sink 52 joint gap in can be with coated with thermally conductive silicon
Fat.
Present invention also offers a kind of heat pump clothes dryer, including above-mentioned heat pump.In detail,
As shown in Fig. 3-12, the heat pump clothes dryer of the present invention can also include compressor 8 and motor 9,
Wherein, compressor 8 is connected with evaporimeter 2 and condenser 3, for evaporating shape to evaporimeter 2
Into gaseous refrigerant be compressed, form high temperature and high pressure gas, and be transferred to condenser 3；
Motor 9 is used to drive the cylinder of heat pump clothes dryer to rotate, while heat pump clothes dryer can also be driven
Circulating fan rotate, the circulation wind field needed for form drying.
In view of the part that heat pump clothes dryer includes is more, the structure of each part is also complex, this
Text is only illustrated to its heat pump and its associated components, and to the greatest extent part not refer to now for other
There is technology, here is omitted.
Heat pump clothes dryer provided by the present invention and its heat pump are described in detail above.
Specific case used herein is set forth to the principle and embodiment of the present invention, the above
The explanation of embodiment is only intended to the core concept for helping understand the present invention.It should be pointed out that for
For those skilled in the art, under the premise without departing from the principles of the invention, also
Some improvement and modification can be carried out to the present invention, these are improved and modification also falls into power of the present invention
In the protection domain that profit is required.
Claims (10)
1. a kind of heat pump, including the evaporation being arranged in the air channel of heat pump clothes dryer (1)
Device (2) and condenser (3), it is characterised in that the heat pump also include with cold end and
The semiconductor refrigerating element (4) in hot junction, the semiconductor refrigerating element (4) is fixedly mounted on institute
The outside of air channel (1) is stated, the cold that the cold end is produced passes through the first heat pipe (53) or first
Heat sink (51) are delivered to the gas side of the evaporimeter (2), and the heat that the hot junction produces passes through
Second heat pipe (54) or second heat sink (52) are delivered to the gas side of the condenser (3).
2. heat pump as claimed in claim 1, it is characterised in that first heat pipe
(53) cold can be equably delivered to the gas side of the evaporimeter (2)；And/or it is described
Even heat can be delivered to second heat pipe (54) the gas side of the condenser (3).
3. heat pump as claimed in claim 2, it is characterised in that first heat pipe
(53) some fins (6), each fin and/or on second heat pipe (54) are set with
(6) extend along wind direction.
4. heat pump as claimed in claim 2, it is characterised in that first heat pipe
(53) extend in the same direction with the heat exchanger tube of the evaporimeter (2)；And/or second heat pipe (54)
Extend in the same direction with the heat exchanger tube of the condenser (3).
5. heat pump as claimed in claim 1, it is characterised in that the cold end direction
The inner side of the air channel (1), first heat sink (51) on the end face of the cold end,
And first heat sink (51) are with some fin, each fin in the matrix form between
Every arrangement.
6. heat pump as claimed in claim 1, it is characterised in that the hot junction direction
The inner side of the air channel (1), second heat sink (52) on the end face in the hot junction,
And second heat sink (52) are with some fin, each fin in the matrix form between
Every arrangement.
7. heat pump as claimed in claim 1, it is characterised in that the cold end is produced
Cold by first heat pipe (53) conveyed and/or the hot junction produce heat institute
State the second heat pipe (54) to be conveyed.
8. the heat pump as described in any one of claim 1-7, it is characterised in that also include
Using keeper made by Heat Conduction Material (7), the semiconductor refrigerating element (4) is installed in institute
State on keeper (7), and the air channel (1) is fixedly mounted on by the keeper (7)
Lateral wall.
9. heat pump as claimed in claim 8, it is characterised in that the cold end and institute
State between the first heat pipe (53) or the cold end (51) heat sink with described first between apply
It is covered with heat-conducting silicone grease；And/or, it is between the hot junction and second heat pipe (54) or described
Hot junction is heat sink with described second to be coated with heat-conducting silicone grease between (52).
10. a kind of heat pump clothes dryer, it is characterised in that arbitrary including the claims 1-9
Heat pump described in.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015107312117 | 2015-10-30 | ||
| CN201510731211 | 2015-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106637871A true CN106637871A (en) | 2017-05-10 |
| CN106637871B CN106637871B (en) | 2020-01-10 |
Family
ID=58850734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510744653.5A Active CN106637871B (en) | 2015-10-30 | 2015-11-05 | Heat pump clothes dryer and heat pump system thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106637871B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109237837A (en) * | 2018-07-24 | 2019-01-18 | 同济大学 | Thermoelectric cooler and thermoelectric (al) type tumble drier |
| CN114318803A (en) * | 2020-09-30 | 2022-04-12 | 青岛海尔洗衣机有限公司 | Clothes dryer |
| WO2024109450A1 (en) * | 2022-11-23 | 2024-05-30 | 无锡小天鹅电器有限公司 | Clothes treatment device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU1836753C (en) * | 1991-06-28 | 1993-08-23 | Санкт-Петербургский технологический институт холодильной промышленности | Semiconductor unit |
| CN2607549Y (en) * | 2003-03-13 | 2004-03-24 | 陕西科技大学 | Refrigerator with electronic auxiliary condenser |
| US20070163274A1 (en) * | 2004-03-26 | 2007-07-19 | Angels Walter G | Method & arrangement for cooling a substrate, particularly a semiconductor |
| JP2010266132A (en) * | 2009-05-15 | 2010-11-25 | Mitsubishi Heavy Ind Ltd | Inverter cooling device, inverter cooling method, and refrigerating machine |
| CN102560992A (en) * | 2012-01-12 | 2012-07-11 | 无锡小天鹅股份有限公司 | Novel clothes dryer |
| CN202430535U (en) * | 2011-12-28 | 2012-09-12 | 无锡小天鹅股份有限公司 | Heat pump system provided with auxiliary thermal source |
| CN102899874A (en) * | 2012-10-12 | 2013-01-30 | 海尔集团公司 | Condensing unit and clothes dryer with condensing unit |
| CN104005213A (en) * | 2014-05-26 | 2014-08-27 | 合肥荣事达三洋电器股份有限公司 | Washing and drying integrated machine |
| CN204373264U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN104818600A (en) * | 2015-05-19 | 2015-08-05 | 合肥工业大学 | Drying system and control method thereof applied to roller washing machine |
-
2015
- 2015-11-05 CN CN201510744653.5A patent/CN106637871B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU1836753C (en) * | 1991-06-28 | 1993-08-23 | Санкт-Петербургский технологический институт холодильной промышленности | Semiconductor unit |
| CN2607549Y (en) * | 2003-03-13 | 2004-03-24 | 陕西科技大学 | Refrigerator with electronic auxiliary condenser |
| US20070163274A1 (en) * | 2004-03-26 | 2007-07-19 | Angels Walter G | Method & arrangement for cooling a substrate, particularly a semiconductor |
| JP2010266132A (en) * | 2009-05-15 | 2010-11-25 | Mitsubishi Heavy Ind Ltd | Inverter cooling device, inverter cooling method, and refrigerating machine |
| CN202430535U (en) * | 2011-12-28 | 2012-09-12 | 无锡小天鹅股份有限公司 | Heat pump system provided with auxiliary thermal source |
| CN102560992A (en) * | 2012-01-12 | 2012-07-11 | 无锡小天鹅股份有限公司 | Novel clothes dryer |
| CN102899874A (en) * | 2012-10-12 | 2013-01-30 | 海尔集团公司 | Condensing unit and clothes dryer with condensing unit |
| CN104005213A (en) * | 2014-05-26 | 2014-08-27 | 合肥荣事达三洋电器股份有限公司 | Washing and drying integrated machine |
| CN204373264U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN104818600A (en) * | 2015-05-19 | 2015-08-05 | 合肥工业大学 | Drying system and control method thereof applied to roller washing machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109237837A (en) * | 2018-07-24 | 2019-01-18 | 同济大学 | Thermoelectric cooler and thermoelectric (al) type tumble drier |
| CN114318803A (en) * | 2020-09-30 | 2022-04-12 | 青岛海尔洗衣机有限公司 | Clothes dryer |
| CN114318803B (en) * | 2020-09-30 | 2023-07-28 | 青岛海尔洗衣机有限公司 | Clothes dryer |
| WO2024109450A1 (en) * | 2022-11-23 | 2024-05-30 | 无锡小天鹅电器有限公司 | Clothes treatment device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106637871B (en) | 2020-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9207015B2 (en) | Dryer having evaporator equipped with second condenser | |
| FI58686B (en) | FOERFARANDE FOER VAERMEOEVERFOERING MELLAN FRAONLUFT OCH TILLUFT I EN VENTILATIONSANLAEGGNING | |
| CN103774402A (en) | Laundry machine | |
| WO2010140334A1 (en) | Drying device | |
| CN101802291B (en) | Clothes drying device, and heat pump unit | |
| CN102573414A (en) | Electronic apparatus rack and data center | |
| US20180371682A1 (en) | Clothes drying device and method for drying clothes | |
| CN107027278A (en) | Air conditioner and controller heat dissipation assembly thereof | |
| CN104776739A (en) | Heat pipe heat exchanger, evaporator component and heat pump clothes dryer | |
| EP3483515B1 (en) | Dehumidifier system | |
| CN102471987A (en) | A laundry dryer the drying effectiveness of which is increased by using different heat sources | |
| CN106637871A (en) | Heat pump clothes dryer and heat pump system thereof | |
| CN108758882A (en) | A kind of semiconductor refrigerating dehumidizer and its dehumanization method | |
| JP2011106723A (en) | Drying device | |
| EP2452009B1 (en) | Clothes drying apparatus | |
| CN106012457B (en) | Device for processing washings | |
| KR101313591B1 (en) | Drying device | |
| CN205537254U (en) | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator | |
| CN208566926U (en) | A kind of semiconductor refrigerating dehumidizer | |
| CN211112813U (en) | Heat pump clothes dryer | |
| CN210215942U (en) | Integral heat exchanger for washing machine with clothes drying function | |
| CN113141753A (en) | Data center cooling using heat pipes | |
| CN106702696A (en) | Clothes- drying device and clothes-drying method thereof | |
| CN220468447U (en) | Embedded clothes care machine | |
| CN104894801A (en) | Laundry treatment apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190820 Address after: 312500 Xinchang, Zhejiang Qixing street under the Liquan Applicant after: Zhejiang three flower intelligent control Limited by Share Ltd Address before: 310018 No. 289-3, 12 Baiyang Street, Hangzhou Economic and Technological Development Zone, Hangzhou, Zhejiang Province Applicant before: HANGZHOU SANHUAJIA ELECTROTHERMAL MANAGEMENT SYSTEM CO., LTD. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |