CN106626477A - Hot-pressing curing device for preparing RFID tags - Google Patents
Hot-pressing curing device for preparing RFID tags Download PDFInfo
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- CN106626477A CN106626477A CN201710063577.0A CN201710063577A CN106626477A CN 106626477 A CN106626477 A CN 106626477A CN 201710063577 A CN201710063577 A CN 201710063577A CN 106626477 A CN106626477 A CN 106626477A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
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- Mechanical Engineering (AREA)
- Labeling Devices (AREA)
- Press Drives And Press Lines (AREA)
Abstract
The invention provides an up-down dual-drive hot-pressing curing device suitable for preparing RFID tags. The hot-pressing curing device comprises a hot-pressing mechanism assembly, a lower driving assembly, an upper driving assembly, a heat insulation belt assembly and a hot-pressing head assembly. The hot-pressing mechanism assembly comprises a bottom fixed plate, a first adsorption plate, a second adsorption plate and a top fixed plate which are sequentially placed from bottom to top. Four guide pillars vertically penetrate through the four vertex angles correspondingly. Hot-pressing head positioning plates are arranged on the surfaces of the adsorption plates. The lower driving assembly penetrates through the bottom fixed plate to abut against the first adsorption plate and to be fixedly connected with the first adsorption plate. The upper driving assembly penetrates through the top fixed plate to abut against the second adsorption plate and to be fixedly connected with the second adsorption plate. The hot-pressing head assembly is located between the first adsorption plate and the second adsorption plate. The heat insulation belt assembly comprises heat insulation belts located between upper hot-pressing heads and lower hot-pressing heads of the hot-pressing head assembly. By the adoption of the hot-pressing curing device, multiple pairs of hot-pressing heads can be accurately positioned, and the problem of poor pressure and temperature consistency due to multiple hot-pressing heads of a hot-pressing mechanism in existing RFID tag production equipment is solved.
Description
Technical field
The invention belongs to RFID tag preparing technical field, and in particular to a kind of hot-press solidifying dress for preparing RFID tag
Put.
Background technology
(RFID, English is RF identification：Radio Frequency Identification) it is a kind of logical using radio frequency
The technology of reliable existing contactless automatic identification, has large-scale application prospect, quilt in fields such as logistics, manufacture, traffic, military affairs
It is considered one of 21 century most rising information technology.
RFID tag batch production is generally using based on anisotropic conducting resinl (anisotropic
Conductiveadhesive, abbreviation ACA) solidification flip chip bonding process, to realize the interconnection of chip and flexible base board.Using
The RFID tag sealed in unit of ACA techniques generally includes substrate conveying, detection, dispensing, five technical modules of attachment and hot pressing.Heat
Die block, to the chip for having aligned and the heating and pressurization of antenna, makes ACA solidifications between chip and antenna by thermal head, complete
Into chip and the electrical interconnection of antenna.ACA is mainly made up of matrix and conductive particle, in its solidification process, the temperature of solidification, pressure
Power and time all have a major impact to chip and the mechanical performance and electric property of antenna interconnection, directly affect the property of RFID tag
Energy and quality.
It is general on equipment to cover thermal heads simultaneously to the core of multiple arrays arrangement using in order to improve label production efficiency more
Piece carries out hot pressing, i.e., apply pressure to multiple rows of chip and antenna simultaneously and promote the solidification of conducting resinl Multipoint synchronous.According to actual condition
Demand, hardening time of anisotropy conductiving glue (ACA) is 8-12s, for improve production efficiency in actual production, is often adopted
With the substrate mode of movement of reel-to-reel (R2R), i.e., simultaneously hot pressing is carried out to the arrangement of multiple chip array formulas using many set thermal heads,
Apply pressure to multiple rows of chip-antenna simultaneously and promote the solidification of conducting resinl Multipoint synchronous.So it is accomplished by being set in the range of certain station
The position put more thermal heads and can flexibly control thermal head can free adjusting position within the scope of station to ensure thermal head
To adapt to the diversity of antenna distance on substrate, at the same also need to control the temperature of multipair thermal head, pressure uniformity with it is consistent
Property, to realize the high efficiency, rate of good quality rate and the economy that produce.
And, relative to low frequency, ultra high frequency IC tag, ultrahigh frequency electronic tag difficulty of processing is compared more greatly, to hot pressing pressure
The technological parameters such as power, temperature, time, environment require higher.In traditional hot-press arrangement design, general temperature, Stress control essence
Degree is inadequate, and thermal head temperature can not realize individually control, be only capable of meeting the processing of common low frequency, high-frequency label, and can not expire
The processing of sufficient ultrahigh frequency electronic tag.Conventional RFID tag encapsulation hot-press arrangement, by up or down thermal head body with send out
The constant pressure cylinder for moving electro-heat equipment is provided between thermal, upper and lower thermal head coordinates chip and antenna solidification, realizes
High-volume automated production.
But on market generally there is segmental defect in existing scheme：
The depth of parallelism of the upper and lower heating platen by the levelling gear adjustment in drive mechanism therebetween, adjusts when the firstth, assembling
Flattening mechanism complex structure, manufacturing expense are high, adjustment technology has high demands, and the heating platen depth of parallelism after adjusting is easily varied, reliable
Property is poor；
Secondth, the one the second heating platen folding strokes are too little, and observation, assembly and disassembly thermal head time space are little, very inconvenient, and heat
Pressure head positioning regulating mechanism is loaded down with trivial details, and practical operation is difficult.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of prepare the upper and lower double of RFID tag
Hot-press solidifying device is driven, it can be accurately positioned to multipair thermal head, solve hot pressing in existing RFID tag producing equipment
The poor problem of many thermal head pressure and temperature uniformity of mechanism.
For achieving the above object, the invention provides a kind of hot-press solidifying of Dual Drive up and down dress for being suitable to RFID tag preparation
Put, including hot pressing mechanism component, lower drive component, upper drive component, heat insulating belt component and hot pressing head assembly；
Hot pressing mechanism component includes that bottom fixed plate, the first adsorption plate, the second adsorption plate, the first thermal head location-plate, top are solid
Fixed board, the second thermal head location-plate, eight linear bearings and four guide pillars；Bottom fixed plate, the first adsorption plate, the second adsorption plate
Sequentially put from the bottom up with top fixed plate and four drift angles are respectively perpendicular through four guide pillars；Bottom fixed plate and top fixed plate point
It is not fixedly connected with the end of guide pillar, the first adsorption plate and the second adsorption plate are flexibly connected with guide pillar by linear bearing；First
Thermal head location-plate is located at the first adsorption plate upper surface, and the second thermal head location-plate is located at the second adsorption plate lower surface, for matching somebody with somebody
Conjunction completes the location and installation of hot pressing head assembly；
Lower drive component abuts the first adsorption plate and mutually fixes with the first adsorption plate through bottom fixed plate, for driving first
Adsorption plate is moved along guide pillar Z-direction；
Upper drive component abuts the second adsorption plate and mutually fixes with the second adsorption plate through top fixed plate, for driving second
Adsorption plate is moved along guide pillar Z-direction；
Hot pressing head assembly is located between the first adsorption plate, the second adsorption plate；
Heat insulating belt component includes the heat insulating belt being located between the upper and lower thermal head of hot pressing head assembly so that upper and lower thermal head
It is not directly contacted with substrate.
Further, the first thermal head location-plate is located at the first adsorption plate upper surface by two semi arches thereon
Face positions and fixes respectively with the cylindrical cooperation of linear bearing on two guide pillars, and the second thermal head location-plate is located at the second adsorption plate
Lower surface and positioned and fixed with the cylindrical cooperation of linear bearing on two guide pillars respectively by two semicircle cambered surfaces thereon；The
The locating notch that the edge of one thermal head location-plate and the second thermal head location-plate is also provided with several to be installed for thermal head.
Further, the upper drive component is identical with lower drive component structure, and the lower drive component includes mounting seat
And the first motor, the first leading screw and the drive connection plate being mounted thereon, it is electric with first that first leading screw one end passes through shaft coupling
The motor shaft of machine is connected, middle to connect drive connection plate by feed screw nut, and other end cantilever is not fixed.
Further, free arm structure is formed after the first drive connection plate is connected with the first leading screw, with first
Energy free centering position when adsorption plate is assembled, then be connected with the first adsorption plate.
Further, also including substrate adsorption support component, the guide pillar outside being installed between two adsorption plates, for steady
Support is positioned over the substrate between the upper and lower thermal head of hot pressing head assembly.
Further, the substrate adsorption support component includes two U-shaped gripper shoes, four locating rings and steel wire rope machines
Structure, the two ends of each U-shaped gripper shoe are installed on guide pillar by a locating ring, and between two U-shaped gripper shoes steel wire rope is provided with
Mechanism.
Further, the steel wire rope mechanism includes steel wire rope, the first pad, the second pad, fix bar, knob and hand
Handle；Steel wire rope one ends wound is fixed, and the other end is first wrapped in fix bar, by the slight pre-pressing of knob, is rotated further by handle, is allowed
Steel wire rope is set up and suitably tighten after tension force, continues locking knob, steel wire rope is clamped by two pads, so as to play attaching
The effect of substrate.
Further, the heat insulating belt component also includes the blowing component installed near heat insulating belt, rewinding component and gives up
Material guide groove mechanism.
In general, the relative existing apparatus of the technology of the present invention design have following Advantageous Effects：
The the one the second heating platens and top bottom fixed plate pass through Precision Machining in the present invention, it is ensured that the flatness of part itself
Precision；By Combined machining, it is ensured that the perpendicularity and axiality of four groups of guide pillar pilot holes, so ensure that the first heating platen,
Parallelism precision after the assembling of second heating platen, eliminates original loaded down with trivial details and insecure heating platen parallelism adjusting mechanism, letter
Change mechanism structure, greatly reduce assembling and the workload for adjusting；The present invention is using location and installation in the first and second hot pressing
Thermal head locating template on plate, quickly accurately can position to thermal head, when substantially reducing thermal head mounting and adjusting
Between, improve production efficiency.
Further, the present invention is accurately positioned by the way that linear bearing is cylindrical, then after the four of corner handle lockings, it is many
Group locating notch of the thermal head by location-plate, can realize that thermal head is accurately positioned and Fast Installation；In practical application, only need to strive
Corresponding locating template is made to several conventional RFID tags, and the replacing of template is also very simple and convenient.
Further, screw structure one end positioning of the upper and lower drive component of the present invention is fixed, and the other end floats, and floats during assembling
Moved end is connected after free centering with heating platen, it is to avoid the risk that leading screw is easily damaged by radially bending power；
Further, the present invention utilizes the support component with substrate adsorption function, and between two support components
The steel wire rope mechanism contour with adsorption plate adsorption plane, can guarantee that substrate grazing in hot pressing, stability, will not tremble
It is dynamic, so as to lay the first stone for the hot pressing quality for ensureing substrate.
Further, heat insulating belt component of the present invention can realize Fast Installation by the locating surface on the second heating platen, reduce
Equipment adjustment workload；Heat insulating belt assembly layout mode be heat insulating belt motion direction it is consistent with substrate motion direction, the two movement
It is in opposite direction；Heat insulating belt waste material is not coiled, but is expelled directly out outside equipment by waste material deflector chute；This several processing mode
Production efficiency can be greatly improved.
Description of the drawings
Fig. 1 is the three-dimensional overall of the hot-press solidifying device of Dual Drive up and down prepared by RFID tag in present pre-ferred embodiments
Figure；
Fig. 2 is the assembly relation of the hot-press solidifying device of Dual Drive up and down prepared by RFID tag in present pre-ferred embodiments
Three-dimensional explosive view；
Fig. 3 is hot pressing mechanism component three dimensional structure diagram in present pre-ferred embodiments；
Fig. 4 is three coaxial plate Combined machining three dimensional structure diagrams of face parallel hole in present pre-ferred embodiments；
Fig. 5 be in present pre-ferred embodiments thermal head location-plate in hot pressing mechanism schematic view of the mounting position；
Fig. 6 be in present pre-ferred embodiments thermal head location-plate in hot pressing mechanism installation site floor map；
Fig. 7 (a) is the first thermal head location-plate three dimensional structure diagram in present pre-ferred embodiments；
Fig. 7 (b) is the second thermal head location-plate three dimensional structure diagram in present pre-ferred embodiments；
Fig. 8 (a) is the three dimensional structure diagram of lower drive component in the embodiment of the present invention；
Fig. 8 (b) is the partial structural diagram of lower drive component in the embodiment of the present invention；
Fig. 9 is the three dimensional structure diagram of upper drive component in present pre-ferred embodiments；
Figure 10 (a) is adsorbent support component three dimensional structure diagram in present pre-ferred embodiments；
Figure 10 (b) is the steel wire rope component three dimensional structure diagram of heat insulating belt in present pre-ferred embodiments；
Figure 11 is the heat insulating belt component three dimensional structure diagram in present pre-ferred embodiments.
In all of the figs, identical reference be used for represent identical element or structure, wherein：
10- support components, 20- hot pressing mechanism components, drive component under 30-, the upper drive components of 40-, 50- substrate adsorptions
Support component, 60- heat insulating belt components, 70- hot pressing head assemblies；
201- bottoms fixed plate, the adsorption plates of 202- first, the adsorption plates of 203- second, 204- tops fixed plate, 205- guide pillars, 206-
Linear bearing, 207- the first thermal head location-plates, 208- the second thermal head location-plates；
2061- clutch shaft bearings, 2062- second bearings, 2063- 3rd bearings, 2064- fourth bearings, the axles of 2065- the 5th
Hold, 2066- 6th bearings, 2067- 7th bearings, 2068- 8th bearings；
First semicircle cambered surface of the first thermal heads of 207A- location-plate 207, the second of the first thermal heads of 207B- location-plate 207
Semicircle cambered surface, the first semicircle cambered surface of the second thermal heads of 208A- location-plate 208, the of the second thermal heads of 208B- location-plate 208
Two semicircle cambered surfaces；
The motors of 301- first, the leading screws of 302- first, 303- the first drive connection plates, 304- driving seats, 305- shaft couplings,
306- first bearing seats, the motor cabinets of 307- first, 3021- the first leading screw bodies, 3022- nuts；The motor cabinets of 304A- first are installed
Groove, 304B- first bearing seat mounting grooves；
The motors of 401- second, the leading screws of 402- second, 403- the second drive connection plates, 404- second drives seat, 405- second
Shaft coupling, 406- second bearing seats, the motor cabinets of 407- second；
501- U-shaped adsorbent support plate, 502- locating rings, 503- steel wire ropes mechanism；
The locating rings of 5021- first, the locating rings of 5022- second, the locating rings of 5023- the 3rd, the locating rings of 5024- the 4th；
5031- steel wire ropes, the pads of 5032- first, the pads of 5033- second, 5034- fix bars, 5035- knobs, 5036- hands
Handle.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing, the present invention is entered
Row is further described.If described herein as limit the present invention when being related to instantiation only to explain the present invention,.
In the present invention, X represents respectively horizontal direction and horizontal direction in the same plane and mutually to, Y-direction and Z-direction
Vertical vertical direction and while with horizontally and vertically vertical direction.
Fig. 1 and 2 is referred to, better embodiment of the present invention includes support component 10, hot pressing mechanism component 20, lower driving group
Part 30, upper drive component 40, substrate adsorption support component 50, heat insulating belt component 60 and hot pressing head assembly 70.
Fig. 1 and 2 is referred to, support component 10 is located at the bottom, for supporting whole device.
Refer to Fig. 3, hot pressing mechanism component 20 include bottom fixed plate 201, the first adsorption plate 202, the second adsorption plate 203,
First thermal head location-plate 207, top fixed plate 204, the second thermal head location-plate 208, linear bearing 206 and four guide pillars
205.Bottom fixed plate 201 is installed in support component, from bottom fixed plate 201 by the bilinear guideway in support component 10
The first heating platen 202, the second heating platen 203, the top fixed plate 204 being parallel to each other is followed successively by upwards；Bottom fixed plate 201, first
Adsorption plate 202, the second adsorption plate 203 and top fixed plate 204 are sequentially put from the bottom up and four drift angles are respectively perpendicular through four
Individual guide pillar 205.Bottom fixed plate 201 and top fixed plate 203 are fixedly connected respectively with the end of guide pillar, the first adsorption plate 202 and the
Two adsorption plates 203 are flexibly connected with guide pillar by linear bearing 206；First thermal head location-plate 207 is located at the first adsorption plate 202
Upper surface, the second thermal head location-plate 208 is located at the lower surface of the second adsorption plate 203, and for coordinating determining for hot pressing head assembly is completed
Install position.Top fixed plate 204, the first adsorption plate 202, the three of the second adsorption plate 203 are first each machined to the flatness essence of itself
Degree, then by Combined machining (referring to Fig. 4), can simultaneously ensure axiality, perpendicularity and the position of four linear bearing installing holes
Degree of putting precision, then assemble, it is easy to ensure that mechanism has the harmonious depth of parallelism, eliminate conventional device it is loaded down with trivial details the one the
The adjustment mechanism of the two heating platen depth of parallelisms, it is easier to which the work of the thermal head group on the one the second adsorption plates is adsorbed respectively in guarantee
Make the consistent of the end depth of parallelism.
Fig. 1 and Fig. 2 is referred to, lower drive component 30 abuts the first adsorption plate 202 and inhales with first through bottom fixed plate 201
Attached plate 202 is mutually fixed, for driving the first adsorption plate 202 to move along guide pillar Z-direction.
Fig. 1 and Fig. 2 is referred to, upper drive component 40 abuts the second adsorption plate 203 and inhales with second through top fixed plate 204
Attached plate 203 is mutually fixed, for driving the second adsorption plate 203 to move along guide pillar Z-direction.
Fig. 1 and Fig. 2 is referred to, hot pressing head assembly 70 is located between the first adsorption plate 202, the second adsorption plate 203；
Refer to Fig. 1 and Fig. 2, heat insulating belt component 60 include being located between the upper and lower thermal head of hot pressing head assembly 70 every
The torrid zone so that upper and lower thermal head is not directly contacted with substrate.
Fig. 1 and Fig. 2 is referred to, according to a kind of better embodiment, substrate adsorption support component 50 is also additionally arranged, substrate is inhaled
Attached support component 50 be installed between two adsorption plates guide pillar outside, for gentle support be positioned over hot pressing head assembly 70,
Substrate between lower thermal head.
Refer to Fig. 5,6,7 (a), 7 (b), according to the present invention a kind of better embodiment, installed in the first adsorption plate
The first thermal head location-plate 207 on 202 by two semicircle cambered surfaces 207A, 207B thereon respectively with two linear bearings
2061st, after 2062 cylindrical cooperation positioning, then fastened by the four of corner set lever screws；On the second adsorption plate
The second thermal head location-plate 208 by two semicircle cambered surfaces 208A, 208B thereon respectively with two linear bearings 2065,
After 2066 cylindrical cooperation positioning, then fastened by the four of corner set lever screws.First thermal head location-plate 207 and
The locating notch that the edge of two thermal head location-plates 208 is also provided with several to be installed for thermal head.Described thermal head positioning
Plate 207,208 own structural characteristics are that have two groups of semi arch locating surfaces to be used for the locating surface that hot pressing head assembly is installed with several,
And the overwhelming majority is distributed in the thermal head locating notch at edge and runs through with sideline, can easily assemble and disassemble hot pressing head assembly, realizes
The quick of hot pressing head assembly, precise positioning are installed.
Fig. 8 (a) and 8 (b) are referred to, according to a kind of better embodiment of the present invention, the lower drive component 30 includes
Mounting seat 304 and the first motor 301 being mounted thereon, the first leading screw 302 and the first drive connection plate 303, the first leading screw
302 one end are connected by shaft coupling 305 with the motor shaft of the first motor 301, and the other end is driven by feed screw nut connection first
Connecting plate 303, the first drive connection plate 303 is connected again with the first adsorption plate 202.It is electric promising first to be designed on driving seat 304
The first motor cabinet mounting groove 304A and first bearing seat mounting groove 304B that support 307 and first bearing seat 306 are installed, to ensure
Motor shaft is coaxial with screw axis.Drive connection plate 303 forms free arm configuration, with the first adsorption plate behind free centering position
202 contact and are attached thereto, it is to avoid because excessively positioning the screw mandrel radial force for causing bending, eliminate loaded down with trivial details in existing structure
Heating platen parallelism adjusting mechanism, mechanism structure is simplified.
Refer to Fig. 9, the mounting seat 404 that upper drive component 40 includes is fixed in the fixed plate of bottom, provide external force drive the
Two motors 401, the second leading screw 402, described one end of second leading screw 402 is connected by shaft coupling with the motor shaft of the second motor 401
With can concomitant rotation, the other end contact with the second adsorption plate 203 by drive connection plate 403, behind free centering position and with
Connection, it is to avoid because excessively positioning the screw mandrel radial force for causing bending, eliminate heating platen loaded down with trivial details in existing structure parallel
Degree adjustment mechanism, mechanism structure is simplified.
Figure 10 (a) is referred to, according to a kind of better embodiment of the present invention, the substrate adsorption support component 50 includes
Two U-shaped gripper shoes, 501, four locating rings 502 and steel wire rope mechanism 503, the two ends of each U-shaped gripper shoe 501 pass through one
Locating ring 502 is installed on guide pillar 205, and between two U-shaped gripper shoes 501 steel wire rope mechanism 503 is provided with.Steel wire rope component 503
Governor motion steel wire rope can be allowed to tighten, and the collective effect of adsorbent support plate 501, to playing absorption positioning in substrate hot pressing
And supporting role.
Refer to a kind of better embodiments of the Figure 10 (b) according to the present invention, the steel wire rope mechanism 503) including steel wire
The 5031, first pad 5032 of rope, the second pad 5033, fix bar 5034, knob 5035 and handle 5036；The one end of steel wire rope 5031
It is fastened, the other end is first wrapped in fix bar 5034, by the slight pre-pressing of knob 5035, is rotated further by handle 5036, allows
Steel wire rope 5031 is set up and suitably tighten after tension force, continues locking knob 5035, and by two pads 5032,5033 steel is clamped
Cord, so as to play a part of attaching substrate.
Figure 11 is referred to, according to a kind of better embodiment of the present invention, heat insulating belt component 60 is installed on the second adsorption plate
The 203 relative both sides positioned at substrate moving direction, including heat insulating belt blowing component 61, heat insulating belt rewinding component 62, heat insulating belt
And waste material guide bowl assembly (63), heat insulating belt unreeled to heat insulating belt rewinding component side from heat insulating belt blowing component side, by
Substrate adsorption support component 50 is supported and through in upper and lower thermal head, is thermally shielded for heat pressing process；After hot pressing
Heat insulating belt heat insulating belt waste material guide bowl assembly is flowed under the traction of heat insulating belt rewinding component 62, without the need for rewinding rolling, directly
Outside device for transferring.
As it will be easily appreciated by one skilled in the art that the foregoing is only presently preferred embodiments of the present invention, not to
The present invention, all any modification, equivalent and improvement made within the spirit and principles in the present invention etc. are limited, all should be included
Within protection scope of the present invention.
Claims (8)
1. it is a kind of to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that including hot pressing mechanism group
Part (20), lower drive component (30), upper drive component (40), heat insulating belt component (60) and hot pressing head assembly (70)；Hot pressing mechanism
Component (20) includes bottom fixed plate (201), the first adsorption plate (202), the second adsorption plate (203), the first thermal head location-plate
(207), fixed plate (204), the second thermal head location-plate (208), eight linear bearings (206) and four guide pillars (205) are pushed up；
Bottom fixed plate (201), the first adsorption plate (202), the second adsorption plate (203) and top fixed plate (204) are sequentially put from the bottom up
And four drift angles are respectively perpendicular through four guide pillars (205)；Bottom fixed plate (201) and top fixed plate (203) respectively with guide pillar
End is fixedly connected, and four drift angles and the guide pillar of the first adsorption plate (202) and the second adsorption plate (203) pass through linear bearing (206)
It is flexibly connected；First thermal head location-plate (207) is positioned at the first adsorption plate (202) upper surface, the second thermal head location-plate (208)
Positioned at the second adsorption plate (203) lower surface, for coordinating the location and installation for completing hot pressing head assembly；Lower drive component (30) passes through
Bottom fixed plate (201) abuts the first adsorption plate (202) and mutually fixes with the first adsorption plate (202), for driving the first adsorption plate
(202) move along guide pillar Z-direction；Upper drive component (40) abuts the second adsorption plate (203) and with second through top fixed plate (204)
Adsorption plate (203) is mutually fixed, for driving the second adsorption plate (203) to move along guide pillar Z-direction；Hot pressing head assembly (70) is positioned at first
Between adsorption plate (202), the second adsorption plate (203)；Heat insulating belt component (60) includes being located at the upper and lower heat of hot pressing head assembly (70)
Heat insulating belt between pressure head so that upper and lower thermal head is not directly contacted with substrate.
It is 2. according to claim 1 to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that
The first thermal head location-plate (207) is positioned at the first adsorption plate (202) upper surface by two semicircle cambered surfaces difference thereon
Position and fix with the cylindrical cooperation of the linear bearing (206) on two guide pillars, the second thermal head location-plate (208) is inhaled positioned at second
Attached plate (203) lower surface and by two semicircle cambered surfaces thereon respectively with two guide pillars on linear bearing (206) cylindrical matching somebody with somebody
Conjunction is positioned and fixed；The edge of the first thermal head location-plate (207) and the second thermal head location-plate (208) is also provided with several use
In the locating notch that thermal head is installed.
It is 3. according to claim 1 to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that
The upper drive component (40) is identical with lower drive component (30) structure, and the lower drive component (30) includes driving seat (304)
And the first motor (301), the first leading screw (302) and the first drive connection plate (303) being mounted thereon, the first leading screw
(302) one end is connected by shaft coupling with the motor shaft of the first motor (301), middle to connect drive connection plate by feed screw nut
(303), other end cantilever is not fixed.
It is 4. according to claim 3 to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that
The first drive connection plate (303) be connected with the first leading screw (302) after formed free arm structure, with the first adsorption plate
(202) it is connected with the first adsorption plate (202) again behind centering position when assembling.
It is 5. according to claim 1 to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that
Also include substrate adsorption support component (50), the guide pillar outside being installed between two adsorption plates is positioned over heat for gentle support
Substrate between the upper and lower thermal head of pressure head component (70).
It is 6. according to claim 5 to be suitable to the hot-press solidifying device of Dual Drive up and down prepared by RFID tag, it is characterised in that
The substrate adsorption support component (50) includes two U-shaped gripper shoes (501), four locating rings (502) and steel wire rope mechanism
(503), the two ends of each U-shaped gripper shoe (501) are installed on guide pillar (205) by a locating ring (502), two U-shaped supports
Steel wire rope mechanism (503) is installed between plate (501).
7. the hot-press solidifying device of Dual Drive up and down of RFID tag preparation is suitable to as claimed in claim 6, it is characterised in that institute
State steel wire rope mechanism (503) including steel wire rope (5031), the first pad (5032), the second pad (5033), fix bar (5034),
Knob (5035) and handle (5036)；Steel wire rope (5031) one ends wound is fixed, and the other end is first wrapped in fix bar (5034),
By the slight pre-pressing of knob (5035), handle (5036) is rotated further by, allows steel wire rope (5031) to set up and suitably tighten tension force
Afterwards, locking knob (5035) is continued, by two pads (5032), (5033) clamping steel wire rope, so as to play attaching substrate
Effect.
8. the hot-press solidifying device of Dual Drive up and down of RFID tag preparation is suitable to as claimed in claim 1, it is characterised in that institute
State blowing component (61), rewinding component (62) and waste material deflector chute that heat insulating belt component (60) also includes being installed near heat insulating belt
Mechanism (63).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610665548.7A CN106273617A (en) | 2016-08-15 | 2016-08-15 | A kind of hot-press solidifying device preparing RFID label tag |
| CN2016106655487 | 2016-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106626477A true CN106626477A (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610665548.7A Withdrawn CN106273617A (en) | 2016-08-15 | 2016-08-15 | A kind of hot-press solidifying device preparing RFID label tag |
| CN201710063577.0A Pending CN106626477A (en) | 2016-08-15 | 2017-02-03 | Hot-pressing curing device for preparing RFID tags |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610665548.7A Withdrawn CN106273617A (en) | 2016-08-15 | 2016-08-15 | A kind of hot-press solidifying device preparing RFID label tag |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109534048A (en) * | 2018-11-16 | 2019-03-29 | 湖北华威科智能股份有限公司 | A kind of multiple tracks heat insulating belt simultaneous feeding device for inlay hot-pressing system |
| CN110150098A (en) * | 2018-02-27 | 2019-08-23 | 滁州昭阳电信通讯设备科技有限公司 | A kind of letterwood plate pre-press equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107499884A (en) * | 2017-08-24 | 2017-12-22 | 深圳市策维科技有限公司 | Vacuum heating system and method |
| CN113145417B (en) * | 2021-04-02 | 2022-09-27 | 广东兴发铝业有限公司 | Electrostatic spraying process of aluminum alloy section |
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| DE2354281A1 (en) * | 1972-11-09 | 1974-05-22 | Joint Francais | THERMAL INSULATING AND NON-DEFORMABLE STRUCTURE FOR A PRESS HEATING PLATE |
| US4518337A (en) * | 1983-08-31 | 1985-05-21 | The French Oil Mill Machinery Co. | Hydraulic press |
| CN104369408A (en) * | 2014-10-13 | 2015-02-25 | 华中科技大学 | Hot-pressing curing device for manufacturing ultrahigh-frequency RFID label |
| CN204187509U (en) * | 2014-11-22 | 2015-03-04 | 江苏博亚照明电器有限公司 | A kind of solar street light photovoltaic module stringer |
| CN206528110U (en) * | 2016-08-15 | 2017-09-29 | 湖北华威科智能股份有限公司 | A kind of hot-press solidifying device for preparing RFID tag |
-
2016
- 2016-08-15 CN CN201610665548.7A patent/CN106273617A/en not_active Withdrawn
-
2017
- 2017-02-03 CN CN201710063577.0A patent/CN106626477A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2354281A1 (en) * | 1972-11-09 | 1974-05-22 | Joint Francais | THERMAL INSULATING AND NON-DEFORMABLE STRUCTURE FOR A PRESS HEATING PLATE |
| US4518337A (en) * | 1983-08-31 | 1985-05-21 | The French Oil Mill Machinery Co. | Hydraulic press |
| CN104369408A (en) * | 2014-10-13 | 2015-02-25 | 华中科技大学 | Hot-pressing curing device for manufacturing ultrahigh-frequency RFID label |
| CN204187509U (en) * | 2014-11-22 | 2015-03-04 | 江苏博亚照明电器有限公司 | A kind of solar street light photovoltaic module stringer |
| CN206528110U (en) * | 2016-08-15 | 2017-09-29 | 湖北华威科智能股份有限公司 | A kind of hot-press solidifying device for preparing RFID tag |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110150098A (en) * | 2018-02-27 | 2019-08-23 | 滁州昭阳电信通讯设备科技有限公司 | A kind of letterwood plate pre-press equipment |
| CN109534048A (en) * | 2018-11-16 | 2019-03-29 | 湖北华威科智能股份有限公司 | A kind of multiple tracks heat insulating belt simultaneous feeding device for inlay hot-pressing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106273617A (en) | 2017-01-04 |
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Application publication date: 20170510 |