CN106624391B

CN106624391B - A kind of multilayer material layered milling system of processing and method based on Spatial Coupling laser spot

Info

Publication number: CN106624391B
Application number: CN201610877008.5A
Authority: CN
Inventors: 张立国
Original assignee: Individual
Current assignee: Individual
Priority date: 2016-09-23
Filing date: 2016-10-08
Publication date: 2018-02-16
Anticipated expiration: 2036-10-08
Also published as: CN206230160U; CN106624391A

Abstract

The invention discloses a kind of multilayer material layered milling hole-drilling system and boring method based on Spatial Coupling laser spot,Milling hole-drilling system includes windowing milling laser,Select milling laser,Laser bundling device and Laser Focusing and focus handover module,Realize under same drilling optical focusing system,That is Laser Focusing and focus handover module,There is provided Spatial Coupling laser spot,When processing the slicer board of multiple layers of different materials,The laser spot of different qualities,It can be used for processing different layer materials,Laser Processing efficiency and Laser Processing quality can so be increased substantially,Particularly when processing the blind hole drilling of the slicer board of multiple layers of different materials superposition,In the milling of the low material of last layer of laser-damaged threshold value of blind hole,The material is removed using selection milling laser spot,Without worrying to damage the next layer of high material of laser-damaged threshold value,Bring good process stabilizing section,Saving process time improves processing efficiency,Obtain good processing effect.

Description

A kind of multilayer material layered milling system of processing based on Spatial Coupling laser spot and Method

Technical field

The present invention relates to technical field of laser processing, and in particular to a kind of multilayer material based on Spatial Coupling laser spot Layered milling system of processing and method.

Background technology

Current Ultra-Violet Laser blind holes of circuit board drilling, belongs to the highly difficult field of field of laser processing, general pcb board is special It is flexible PCB, is that multilayer material is formed by stacking, laser needs the dimension (being usually within 10 millimeters) in very little to be gone Except the insulating barrier below copper sheet, copper sheet, and do not hinder next layer of bottom copper, and require that hole wall is smooth, surface copper sheet does not tilt, and will Seek high-speed drilling.At present it is reported that all Ultra-Violet Laser PCB blind holes drill, when the insulating barrier between removing copper sheet, The materials such as polyimides are mainly removed, are all the ways using laser spot defocus, be i.e. laser first focuses on copper sheet surface, gone After falling copper sheet, laser spot leaves copper sheet, and the insulating layer material below copper sheet is purged using defocus large spot, due to from Burnt hot spot peak power is low, therefore the defocused spot only removes insulating barrier, does not remove layers of copper, therefore can obtain satisfied blind Hole.But because laser defocus run duration is considerably beyond the laser drill time, therefore, laser spot defocus removes circuit board Insulation material layer is a very poorly efficient but helpless method.

The content of the invention

The invention provides a kind of multilayer material layered milling system of processing and method based on Spatial Coupling laser spot, The defects of can solve the problem that prior art and deficiency.

The technical scheme that the present invention solves above-mentioned technical problem is as follows：

On the one hand, drilled the invention provides a kind of multilayer material layered milling based on Spatial Coupling laser spot and be System, including windowing milling laser, selection milling laser, laser bundling device and Laser Focusing and focus handover module；

The windowing milling laser, for producing the first windowing milling laser beam, and incident laser bundling device；

The selection milling laser, for producing first choice milling laser beam, and incident laser bundling device；

The laser bundling device, for the first windowing milling laser beam and first choice milling laser beam to incidence Conjunction beam, the second windowing milling laser beam of output equidirectional parallel transmission and the second selection milling laser beam are carried out, and respectively The incident Laser Focusing and focus handover module；

The Laser Focusing and focus handover module, swash for the second windowing milling to the equidirectional parallel transmission Light beam and the second selection milling laser beam are focused, and obtain Spatial Coupling Laser Focusing focus, and control the Spatial Coupling Laser Focusing focus switches between the different hole positions of workpiece to be processed, or, control the Spatial Coupling Laser Focusing Focus carries out milling campaign at a hole position of workpiece to be processed；Wherein, the Spatial Coupling Laser Focusing focus includes opening Window milling Laser Focusing focus and selection milling Laser Focusing focus, when the Spatial Coupling Laser Focusing focus is in static state When, the dispersion at the center of the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus is less than 10 millimeters；

The workpiece to be processed is the slicer board that multilayer material is formed by stacking, wherein, multilayer material is divided into laser damage threshold It is worth the low material of high material and laser-damaged threshold value；It is blind when workpiece to be processed described in the Spatial Coupling Laser Focusing focus milling Kong Shi, the workpiece to be processed include at least three layers, the layer of material and the bottom hole material of the blind hole that laser transmission runs at first Expect for the high material of laser-damaged threshold value, the layer of material being finally milled during processing blind hole is the low material of laser-damaged threshold value；

In blind hole process, the windowing milling laser light extraction, by the windowing milling Laser Focusing focus formed, By controlling comprising the process conditions including windowing milling laser device laser light extraction time, windowing milling laser spot movement velocity Laser milling depth is controlled, to the other materials in addition to the layer of material being finally milled during processing blind hole of workpiece to be processed Layer completes Milling Process；Then the selection milling laser light extraction, by the selection milling Laser Focusing focus that is formed to be added The layer of material being finally milled during the processing blind hole of work workpiece completes Milling Process；

The laser peak power density of the windowing milling Laser Focusing focus is burnt higher than the selection milling Laser Focusing The laser peak power density of point, and it is enough the high material of laser-damaged threshold value described in milling, the selection milling Laser Focusing is burnt Dot laser peak power density is enough the low material of laser-damaged threshold value described in milling, but is not enough to laser-damaged threshold value described in milling High material.

It should be noted that the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus Center dispersion be less than 10 millimeters, refer to it is described windowing milling Laser Focusing focus center and it is described selection milling swash The space ultimate range at the center of light focused spot is less than 10 millimeters, and the milling Laser Focusing focus that only opens a window and selection milling swash Light focused spot ability Special composition combination laser focused spot.Only sufficiently closed between laser spot, can be blind in processing Maximum processing efficiency is played when hole.

It should be noted that the high material of laser-damaged threshold value, illustrates the focusing laser pulses for needing peak power density It is processed；The low material of laser-damaged threshold value, illustrate only to need the focusing laser pulses hot spot for meeting laser damage material threshold It is processed, i.e. low peak power laser；

Beneficial effects of the present invention are：Multiple laser is focused on by same laser focusing system, i.e., multiple laser passes through Laser Focusing is focused with focus handover module, and it is fine that the milling laser beam that opened a window wherein in multiple laser carries out high-speed, high precision Hot spot focuses on drilling, and Milling Process is carried out to the high material of laser-damaged threshold value in workpiece to be processed, milling is selected in multiple laser Laser beam carries out Milling Process to the low material of laser-damaged threshold value in workpiece to be processed.The present invention is gathered using the laser of different qualities Focus carries out Milling Process to the machined layer of the different kinds material of workpiece to be processed, with reference to vibration mirror scanning carry out Kong Yukong it Between processing switching etc. technology, realize high-efficiency high-accuracy high quality laser drill, be very suitable for treating to what is be made up of multilayer material The Milling Process of workpieces processing.

Particularly in the blind hole application for the multi-layer thin sheet being made up of a variety of different laser-damaged threshold value materials, using not With the laser spot of peak power density, the windowing milling laser spot of peak power density carries out window milling drastically Processing is cut, is stopped in the low material of the laser-damaged threshold value that is worked into last layer of hole bottom, otherwise peak power density The windowing milling laser spot low material of laser-damaged threshold value that is easy to punch bottom hole or do not punch bottom hole but bottom hole do not have Clean out, directly affect the plating copper process of filling a vacancy of later process., now need not be again using biography using application technical scheme The method of system, that is, windowing milling laser spot defocus is allowed to carry out last layer of processing blind hole bottom hole laser-damaged threshold value to be processed low Material, but easily this layer material of selective milling is carried out by selection milling laser spot, it is not concerned about that bottom hole can be injured, because The peak power of selection milling laser spot is not enough to break the high material of that layer of hole bottom laser-damaged threshold value, and selects milling The light extraction delay time of laser beam is about less than 1 microsecond, if using laser spot defocus mode, generally requires 300 milliseconds of The Milling Process of this layer of material can be carried out, therefore, this scheme of the application saves the substantial amounts of Laser Processing time, now It is not concerned about injuring hole bottom material, process for stabilizing parameter section is widened significantly.

On the basis of above-mentioned technical proposal, the present invention can also improve as follows.

Further, the windowing milling laser is short laser pulse laser, and the selection milling laser is length Laser pulse laser, wherein, length is comparatively the windowing milling laser selects milling laser with described.

The reason for so selecting is that the high material of laser-damaged threshold value needs to process using high-peak power laser, therefore The windowing milling laser selection narrow spaces laser, and if the low material of laser-damaged threshold value is also swashed using high-peak power Light device is processed, and is very easy to produce a large amount of plasmas, and not only influence post laser pulse is further coupled to material surface, And a large amount of heat affected areas (plasma heating causes machining area to overheat) are brought, influence very much Laser Processing efficiency and effect Fruit, therefore the selection milling laser selects long pulsewidth laser, can with the extraordinary a large amount of generations for avoiding plasma, It is very beneficial for the Laser Processing efficiency and effect ensured.Here it is the processing for multilayer material, swashed using Spatial Coupling The benefit that light focused spot is brought, the species of material to be processed can be directed to, is combined from different LASER Light Sources.

Further, the dispersion is less than 100 microns, reduces the windowing milling Laser Focusing focus and selection milling as far as possible The space length between Laser Focusing focus is cut, for the windowing milling Laser Focusing focus and selection milling Laser Focusing focus Same hole position is processed and saves space traveling time, and then saves process time.

Further, in addition to beam shaping, the beam shaping positioned at the selection milling laser with it is described Between laser bundling device, for carrying out beam shaping to first choice milling laser beam so that by the Laser Focusing and Jiao Selection milling Laser Focusing focus after point handover module focuses on is flat-top hot spot or quasi- flat-top hot spot；Or the light beam is whole Shape device is between the windowing milling laser and the laser bundling device, for carrying out light to the first windowing milling laser beam Beam shaping so that the windowing milling Laser Focusing focus after the Laser Focusing and focus handover module focus on is flat-top light Spot or quasi- flat-top hot spot.

The beam shaping can be microlens array, drum type lens array, high transmittance diffusion sheet, square/eight side Shape optical fiber uniformly, the combination of beam shaping lens, diffraction optical element (binary optical device) or these forms so that it is described Windowing milling laser beam and/or the selection milling laser beam obtain horizontal through the Laser Focusing and the focusing of focus handover module Field strength distribution is the windowing milling Laser Focusing hot spot and/or selection milling Laser Focusing hot spot of flat-top or quasi- flat-top.Windowing Milling Laser Focusing hot spot, the windowing milling effect that can have been obtained, reduce milling taper；Milling laser spot is selected from flat Top distribution laser facula, can obtain preferable laser milling effect.

Further, on workpiece to be processed surface, the spot diameter of the selection milling Laser Focusing focus is more than described The spot diameter for the milling Laser Focusing focus that opens a window.

It is described further to have the beneficial effect that：, can be with for the high material of laser-damaged threshold value in view of dissimilar material properties Using short pulse duration LASER Light Source, for the high material of laser-damaged threshold value, long pulsewidth LASER Light Source, long pulsewidth laser light can be used Source is relative not allow to be also easy to produce laser plasma in the low material of processing laser-damaged threshold value, is advantageous to improving laser processing Efficiency and quality, and the blind hole of Spatial Coupling Laser Focusing focus processing multilayer material superposition is used, it is very suitable for using not Light-resource fousing with characteristic forms Spatial Coupling Laser Focusing focus, and it is just burnt using the laser of different qualities to process different materials Point is processed, wherein, the laser spot of different qualities refers to the spot size of laser spot, light spot laser Energy distribution, light The differences such as what light spot laser pulse width of spot laser peak power density, light spot laser pulse energy.Wherein, Laser Focusing focus Different qualities, be is determined by the configuration of light path outside corresponding LASER Light Source output characteristics, beam Propagation, can be answered according to specific With needing to carry out specific design, the outer light path of described beam Propagation includes but is not limited to laser beam expanding, laser beam shaping, laser Focusing system etc..

Further, in addition to the fine modulation movement module of laser, the fine modulation movement module of laser are located at described Open a window between milling laser and the laser bundling device, for carrying out motion modulation to the described first windowing milling laser beam, And then windowing milling Laser Focusing focus carries out milling campaign corresponding to driving；Or

The fine modulation movement module of laser is used between the selection milling laser and the laser bundling device In carrying out motion modulation to the first choice milling laser beam, and then selection milling Laser Focusing focus corresponding to driving is carried out Milling campaign；Or

The fine modulation movement module of laser is located at the laser bundling device and the Laser Focusing and focus switching mould Between block, motion modulation is carried out for the second windowing milling laser beam after pairing beam and the second selection milling laser beam, and then Selection milling Laser Focusing focus and selection milling Laser Focusing focus is driven to carry out milling campaign.

Further, when the fine modulation movement module of the laser is closed positioned at the windowing milling laser and the laser When between beam device, or, when the fine modulation movement module of the laser is closed positioned at the selection milling laser and the laser When between beam device, the fine modulation movement module of laser, it is additionally operable to modulate the first windowing milling laser beam or modulation The first choice milling laser beam so that the center of the windowing milling Laser Focusing focus and the selection milling laser gather The center of focus is drawn close to hole position center to be processed, so as to adjust the windowing center of milling Laser Focusing focus and described Select the dispersion at the center of milling Laser Focusing focus；

Switch when the fine modulation movement module of the laser is located at the laser bundling device and the Laser Focusing with focus When between module, the fine modulation movement module of laser, it is additionally operable to modulate the second windowing milling laser beam or second Select milling laser beam so that the windowing milling Laser Focusing focus or the selection milling Laser Focusing focus are to be processed Hole position center is drawn close, so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus Center dispersion.

It is described further to have the beneficial effect that：The benefit of this design is, after system long-time use, due to board The reason such as mechanical stress deformation when causing that each focus space position changes in Spatial Coupling Laser Focusing focus, it is described to swash The fine modulation movement module of light can compensate these slight changes, it is ensured that system uses steadily in the long term, it is ensured that Spatial Coupling swashs The dispersion of light focused spot within the specific limits, so that it is guaranteed that Spatial Coupling laser spot same hole position is processed it is efficient fast It is prompt.

Further, the fine modulation movement module of the laser is that acousto-optic deflection device or electro-optic deflector or piezoelectric ceramics drive Dynamic speculum or galvanometer driving speculum or refracting prisms or electric spindle motor driving rotation refracting prisms or wherein any two Person or the combination of more persons；

When the fine modulation movement module of the laser is acousto-optic deflection device, acousto-optic deflection device is by changing acousto-optic deflection device The carrier frequency of driving source adjust the Bragg grating reflection angle of the incident laser, change incident laser transmission direction；

When the fine modulation movement module of the laser is electro-optic deflector, by the driving source for changing electro-optic deflector Incident laser transmission direction described in voltage-regulation；

Piezoelectric Ceramic speculum or galvanometer driving speculum, refer to that speculum by driving beat, incides reflection The laser beam deflection angle of mirror changes；Or, galvanometer driving refracting prisms, refer to that refracting telescope by driving beat, incides folding The laser beam of the prism refraction angle after refraction is penetrated to change；

Electric spindle motor driving rotation refracting prisms, when referring to refracting prisms rotation, incide the laser beam of refracting prisms Deflecting light beams rotate after refraction.

Further, the laser bundling device is polarization coupling element or is the combination of at least two speculums.

Further, the Laser Focusing is that vibration mirror scanning focusing unit or platform movement are static poly- with focus handover module Burnt unit；

The vibration mirror scanning focusing unit includes scanning f-theta mirror and scanning galvanometer；The scanning f-theta mirror is used It is focused, obtains in the second windowing milling laser beam to being exported from the laser bundling device and the second selection milling laser beam Spatial Coupling Laser Focusing focus；The scanning galvanometer is used to control the Spatial Coupling Laser Focusing focus in workpiece to be processed Different processing hole positions between high speeds switching, or motion modulation is carried out to laser spot motion in a hole position；

Or the vibration mirror scanning focusing unit includes scanning f-theta mirror, scanning galvanometer and two-dimension moving platform；Institute State scanning f-theta mirror and milling laser is selected to the second windowing milling laser beam exported from the laser bundling device and second Beam is focused, and obtains Spatial Coupling Laser Focusing focus；The scanning galvanometer is used to control the Spatial Coupling Laser Focusing High speed switching of the focus between the different processing hole positions of workpiece to be processed, or laser spot is moved in a hole position and carried out Motion modulation；The two-dimension moving platform is used to carry the switching of workpiece to be processed and machining area or entered with vibration mirror scanning Row composition linkage；

The platform movement static focus unit includes static focus mirror and linear moving table, and the static focus mirror is used It is focused, obtains in the second windowing milling laser beam to being exported from the laser bundling device and the second selection milling laser beam Spatial Coupling Laser Focusing focus；The linear moving table is used to control the Spatial Coupling Laser Focusing focus to be processed Switching between the different processing hole positions of workpiece.

Further, when Spatial Coupling laser spot is processed to same hole position, if the windowing milling swashs Light focused spot and/or selection milling Laser Focusing focus do not enter into hole position Working position, then need the Laser Focusing with Focus handover module or the fine modulation movement module of the laser laser spot corresponding to are switched to corresponding hole position and added Work.

Best situation is, without the Laser Focusing and focus handover module or the fine modulation movement of the laser Module adjusts, and the window milling Laser Focusing focus and/or selection milling Laser Focusing focus are in hole position position to be processed simultaneously Put, so most save drilling time.

Further, the workpiece to be processed is multilayer circuit board base material, the high material of laser-damaged threshold value be copper or Person's gold either silver or other conductive materials, the low material of the laser-damaged threshold value is polyimides, polyester, acrylic acid bonding Layer or modified form epoxy resin.

Further, the windowing milling laser and the selection milling laser can be same laser, should Laser sends laser and carries out light path switching by light path switching photoswitch, produces the first windowing milling laser beam and first respectively Select milling laser beam.

On the other hand, the invention provides a kind of multilayer material layered milling processing side based on Spatial Coupling laser spot Method, including：

S1, the first windowing milling laser beam and as caused by selection milling laser as caused by windowing milling laser First choice milling laser beam distinguishes incident laser bundling device；

S2, laser bundling device carries out conjunction beam to the described first windowing milling laser beam and first choice milling laser beam, defeated Go out the second windowing milling laser beam and the second selection milling laser beam of equidirectional parallel transmission, and incident Laser Focusing and Jiao Point handover module；

S3, Laser Focusing and focus handover module opened a window to the second of the equidirectional parallel transmission milling laser beam and Second selection milling laser beam is focused, and obtains Spatial Coupling Laser Focusing focus, and control the Spatial Coupling laser to gather Focus switches between the different hole positions of workpiece to be processed, or, control the Spatial Coupling Laser Focusing focus to exist Milling campaign is carried out at one hole position of workpiece to be processed；Wherein, the Spatial Coupling Laser Focusing focus includes windowing milling Laser Focusing focus and selection milling Laser Focusing focus, when the Spatial Coupling Laser Focusing focus be in it is static when, it is described The dispersion at the center for the milling Laser Focusing focus that opens a window and the center of the selection milling Laser Focusing focus is less than 10 millimeters；

Further, in addition to：

Beam shaping is set between the selection milling laser and the laser bundling device, to first choice milling Laser beam carries out beam shaping so that the selection milling Laser Focusing after the Laser Focusing and focus handover module focus on Focus is flat-top hot spot or quasi- flat-top hot spot.

Further, the dispersion is less than 100 microns, reduces the windowing milling Laser Focusing focus and selection as far as possible Space length between milling Laser Focusing focus, it is burnt for the windowing milling Laser Focusing focus and selection milling Laser Focusing Point is processed to same hole position saves space traveling time, and then saves process time.

Further, in addition to：

The fine modulation movement module of laser is set between the windowing milling laser and the laser bundling device, to institute State the first windowing milling laser beam and carry out motion modulation, and then drive corresponding windowing milling Laser Focusing focus to carry out milling fortune It is dynamic；Or

The fine modulation movement module of laser is set between the selection milling laser and the laser bundling device, to institute State first choice milling laser beam and carry out motion modulation, and then drive corresponding selection milling Laser Focusing focus to carry out milling fortune It is dynamic；Or

The fine modulation movement of laser is set between the laser bundling device and the Laser Focusing and focus handover module Module, the second windowing milling laser beam and the second selection milling laser beam after pairing beam carry out motion modulation, and then drive choosing Select milling Laser Focusing focus and selection milling Laser Focusing focus carries out milling campaign.

The beneficial effects of the invention are as follows：When processing the slicer board of multiple layers of different materials, the laser spot of different qualities can For processing different layer materials, can so increase substantially Laser Processing efficiency and Laser Processing quality, particularly adding During the blind hole drilling for the slicer board that work is superimposed by multiple layers of different materials, in the milling of the low material of last layer of laser-damaged threshold value of blind hole When cutting, the material is removed using selection milling laser spot, without worrying to damage the next layer of high material of laser-damaged threshold value, brought Good process stabilizing section, compared with traditional laser spot defocus takes processing mode, process time is saved due to choosing It is big to select the hot spot of milling laser spot, improves processing efficiency.

Further, when the fine modulation movement module of the laser is closed positioned at the windowing milling laser and the laser When between beam device, or, when the fine modulation movement module of the laser is closed positioned at the selection milling laser and the laser When between beam device, the fine modulation movement module of laser is also to the described first windowing milling laser beam or modulation described first Selection milling laser beam is modulated so that the center of the windowing milling Laser Focusing focus and the selection milling laser gather The center of focus is drawn close to hole position center to be processed, so as to adjust the windowing center of milling Laser Focusing focus and described Select the dispersion at the center of milling Laser Focusing focus；

Switch when the fine modulation movement module of the laser is located at the laser bundling device and the Laser Focusing with focus When between module, the fine modulation movement module of laser is also to the described second windowing milling laser beam or the second selection milling Laser beam is modulated so that the windowing milling Laser Focusing focus or the selection milling Laser Focusing focus are to be processed Hole position center is drawn close, so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus Center dispersion.

In the application when Spatial Coupling laser spot is processed to same hole position, if the windowing milling swashs Light focused spot and/or selection milling Laser Focusing focus do not enter into hole position Working position, then need the Laser Focusing with Focus handover module or the fine modulation movement module of the laser laser spot corresponding to are switched to corresponding hole position and added Work.Best situation is, without the Laser Focusing and focus handover module or the fine modulation movement module of the laser Adjustment, the windowing milling Laser Focusing focus and/or selection milling Laser Focusing focus are in hole position position to be processed simultaneously, So most save drilling time.

A kind of multilayer material layered milling system of processing and method based on Spatial Coupling laser spot disclosed in the present application, Open a window milling laser and the selection milling laser can be two lasers, or same laser, when opening Window milling laser and selection milling laser for same laser when, the laser that the laser is sent can be cut by light path Change photoswitch and carry out light path switching, produce the first windowing milling laser beam and first choice milling laser beam respectively；Preferably, should Laser possesses pulse energy and pulse recurrence frequency dynamic control function；The light path switching photoswitch switches comprising light path Electrooptical switching either light path switching acoustooptic switch or high-speed vibrating mirror light path switching switch, or the combination of these devices.

In blind hole process, when needing the windowing milling Laser Focusing focus processing, light path switching photoswitch The laser beam deviation windowing milling laser beam light path of milling laser output, the first windowing milling laser beam is formed, now institute Milling laser is stated equivalent to windowing milling laser noted earlier；Processed when needing the selection milling Laser Focusing focus When, light path switches the laser beam deviation selection milling laser beam optical path that photoswitch exports milling laser, forms first choice Milling laser beam, now the milling laser is equivalent to selection milling laser noted earlier.The milling laser it is defeated Go out light beam when being switched to any light path, milling laser switchs processing request of the photocontrol according to Spatial Coupling laser spot Carry out, or, require to carry out according to the corresponding windowing milling laser and selection milling laser control.

Wherein, light path switching electrooptical switching, using the electrooptic effect of crystal, changes the polarization state of transmission laser, and combine The switch that polarization beam splitting optical element is formed.The electrooptic effect, refer to some isotropic transparency materials in electric field action Under show the phenomenon of optically anisotropic effect, i.e. what the refractive index of transparency material changed by extra electric field shows As.When the direction of an electric field being added on crystal is parallel with optical direction, referred to as longitudinal electro-optic modulator；When optical direction and applied field Direction is perpendicular, referred to as horizontal Electro-optical Modulation.Modulation and Amplitude Modulation (the intensity modulated modulation to light wave can be realized using electrooptic effect Device) and Spatial transmission (electro-optic phase modulator).When being not added with voltage on electro-optic crystal, laser beam passes through polarization beam splitting optical element Or reflected by polarization beam splitting element according to certain angle；Corresponding, when adding certain voltage on electro-optic crystal, laser beam is polarized Beam splitting element reflects according to certain angle or by polarization beam splitting optical element, has been achieved in that the switch switching of light beam.

Light path switching acoustooptic switch refers to utilize acousto-optic modulation technology or audio-optical deflection technology, to laser beam progress light beam The photoswitch of beat switching.Acoustooptic switch is made up of acousto-optic medium and PZT (piezoelectric transducer).When certain specific carriers frequency of driving source When rate drives transducer, transducer is the ultrasonic wave for producing same frequency and incoming acousto-optic medium, is formed periodically in medium Variations in refractive index and turn into phase type diffraction grating, changed the direction of propagation of light when light beam passes through medium by optical grating diffraction, spread out The intensity and direction for penetrating light change with the intensity of ultrasonic wave and the state of frequency.Here it is the interaction of ultrasonic wave and light, That is acoustooptical effect, the effect are exactly the operation principle of acoustooptic switch and acousto-optic deflection device.

High-speed vibrating mirror light path switching switch is a kind of excellent vector scan device, and general principle is switched on coil in magnetic field Middle generation torque, balance position is deviateed with rotor added with reseting torque, size by the method for mechanical knob spring or electronics on its rotor The angle put is directly proportional, and when coil passes to certain electric current and rotor deflects to certain angle, electromagnetic torque is with returning Multiple torque is equal in magnitude, therefore, it can only deflect, deflection angle is directly proportional to electric current, the mentality of designing of high-speed vibrating mirror light path switching switch Follow the design method of ammeter completely, eyeglass instead of indicator, and -5V -5V that the signal popped one's head in is controlled by computer or - 10V-+10V direct current signal substitution, to complete predetermined action.The light path switching of the present invention can also have high-speed vibrating mirror complete Into using the reflecting optics of high-speed vibrating mirror the light beam progress space switching incided on galvanometer eyeglass, so as to realize light beam Switch and switching.

Brief description of the drawings

Fig. 1 is a kind of multilayer material layered milling drilling system based on Spatial Coupling laser spot of the embodiment of the present invention 1 System structural representation；

Fig. 2-1 is multilayer material drilling section front view；

Fig. 2-2 is multilayer material windowing milling sectional view；

Fig. 2-3 is blind hole sectional view；

Fig. 3 is the concrete structure schematic diagram of laser bundling device in the embodiment of the present invention 1；

Fig. 4 is a kind of multilayer material layered milling processing system based on Spatial Coupling laser spot of the embodiment of the present invention 2 System structural representation；

Fig. 5 is a kind of multilayer material layered milling processing side based on Spatial Coupling laser spot of the embodiment of the present invention 3 Method flow chart.

In accompanying drawing, the list of parts representated by each label is as follows：

1st, open a window milling laser, the 11, first windowing milling laser beam, and 2, selection milling laser, 21, first choice milling Cut laser beam, 3, beam shaping, 4, the fine modulation movement module of laser, 5, laser bundling device, 501, polarization coupling element, 502nd, the speculum of laser bundling device first, the 503, the speculum of laser bundling device second, 6, second windowing milling laser beam, 7, second Milling laser beam is selected, 8, Laser Focusing and focus switch, the electric machine main shaft of the 801, second motor, 802 second reflecting optics, 803rd, the second reflection of parallel beam, the 804, first reflection of parallel beam, the 805, first reflecting optics, the 806, first motor 807 Electric machine main shaft, the 807, first motor, 808, telecentric scanning f-theta mirror, 9, focus on light beam, 10, workpiece to be processed, 1001, One layers of copper, 1002, polyimide layer, the 1003, second layers of copper, 1004, remove the blind hole of copper sheet, 1005, blind hole.

Embodiment

The principle and feature of the present invention are described below in conjunction with accompanying drawing, the given examples are served only to explain the present invention, and It is non-to be used to limit the scope of the present invention.

Embodiment 1, a kind of multilayer material layered milling hole-drilling system based on Spatial Coupling laser spot.With reference to figure The system that 1- Fig. 3 is provided the present embodiment is described in detail.

The multilayer material layered milling hole-drilling system based on Spatial Coupling laser spot provided referring to Fig. 1, the present embodiment Including windowing milling laser 1, selection milling laser 2, laser bundling device 5 and Laser Focusing and focus handover module 8；

The windowing milling laser 1, for producing the first windowing milling laser beam 11, and incident laser bundling device 5；

The selection milling laser 2, for producing first choice milling laser beam 21, and incident laser bundling device 5；

The laser bundling device 5, for swashing to the first windowing milling laser beam 11 of incidence and first choice milling Light beam 21 carries out conjunction beam, the second windowing milling laser beam 6 and the second selection milling laser beam of output equidirectional parallel transmission 7, and the incident Laser Focusing and focus handover module 8 respectively；

The Laser Focusing and focus handover module 8, for the milling that opened a window to the second of the equidirectional parallel transmission Laser beam 6 and second selects milling laser beam 7 to be focused, and obtains Spatial Coupling Laser Focusing focus, and control the space Combination laser focused spot switches between the different hole positions of workpiece to be processed 10, or, control the Spatial Coupling to swash Light focused spot carries out milling campaign at a hole position of workpiece to be processed 10；Wherein, the Spatial Coupling Laser Focusing is burnt Point includes opening a window milling Laser Focusing focus and selects milling Laser Focusing focus, when the Spatial Coupling Laser Focusing focal point When static state, it is described windowing milling Laser Focusing focus center and it is described selection milling Laser Focusing focus center it is discrete Degree is less than 10 millimeters；Preferably, the dispersion be less than 100 microns, reduce as far as possible it is described windowing milling Laser Focusing focus and The space length between milling Laser Focusing focus is selected, is gathered for the windowing milling Laser Focusing focus and selection milling laser Focus is processed to same hole position saves space traveling time, and then saves process time.

The workpiece to be processed 10 is the slicer board that multilayer material is formed by stacking, wherein, multilayer material is divided into laser damage The high material of threshold value and the low material of laser-damaged threshold value；When workpiece to be processed 10 described in the Spatial Coupling Laser Focusing focus milling Blind hole when, the workpiece to be processed 10 includes at least three layers, the laser layer of material that runs at first of transmission and the blind hole Bottom hole material is the high material of laser-damaged threshold value, and the layer of material being finally milled during processing blind hole is the low material of laser-damaged threshold value Material；

In blind hole process, the light extraction of windowing milling laser 1 is burnt by the windowing milling Laser Focusing formed Point, by controlling comprising the technique including the Laser output time of windowing milling laser 1, windowing milling laser spot movement velocity Condition controls laser milling depth, to its in addition to the layer of material being finally milled during processing blind hole of workpiece to be processed 10 He completes Milling Process at material layer；Then the light extraction of selection milling laser 2, by the selection milling Laser Focusing focus formed Milling Process is completed to the layer of material being finally milled during the processing blind hole of workpiece to be processed 10；

Illustrated below exemplified by carrying out layered milling drilling to the blind hole of printed circuit board (PCB).

The milling laser 1 that opens a window produces the first windowing milling laser beam 11 and incident laser bundling device 5, selects milling laser Device 2 produces first choice milling laser beam 21, and incident laser bundling device 5.Wherein, the first windowing milling laser beam 11 and first Select the optical maser wavelength of milling laser beam 21 can be with identical, can also be different, the first windowing milling laser beam 11 is pulse laser Beam, first choice milling laser beam 21 can be continuous laser beam, or pulse laser beam.For example, the first windowing milling Laser beam 11 and the wavelength of first choice milling laser beam 21 are the Ultra-Violet Laser either green laser or red of 355 nano wave lengths Outer laser, or the first windowing milling laser beam 11 are picosecond laser, and first choice milling laser beam 21 is long pulse width laser etc. Deng.

The laser bundling device 5 carries out the first windowing milling laser beam 11 and first choice milling laser beam 21 of incidence Beam, the second windowing milling laser beam 6 and the second selection milling laser beam 7 of output equidirectional parallel transmission are closed, and incidence swashs Light focuses on and focus handover module 8.

Laser bundling device 5 in the present embodiment is polarization coupling element 501, in fact, polarization coupling element 501 at least may be used To use following four technical scheme, the first technical scheme is polarization beam apparatus (PBS=polarizing beam Splitter) use in turn, the polarization beam apparatus enables to a polarization state light to reflect, and another polarizing beam is saturating Penetrate, when carrying out two kinds of polarizing beams and closing beam, a kind of polarizing beam P polarization light and with another polarizing beam S-polarization Light corresponds to output end input from polarization beam apparatus respectively, then polarization beam apparatus input can export P polarization light and S-polarization light Close the laser beam of beam；Second of technical scheme is to use film polarizer (Thin Film Polarizer), it is also possible that One polarization state light reflection, the transmission of another polarizing beam, when carrying out two kinds of polarizing beams conjunction beams, a kind of polarization state light Beam transmits, such as P polarization light passes through film polarizer, another polarizing beam, such as S-polarization light and exported from film polarizer The position input of P polarization light beam, then film polarizer can be to the S-polarization light total reflection, and such film polarizer output end can To export the laser beam of P polarization light and S-polarization combiner, the advantage of this scheme is that laser beam closes beam efficiency high, volume It is small；The third technical scheme is a kind of special circumstances, and conjunction beam is carried out using Brewster piece, is closed carrying out two kinds of polarizing beams Shu Shi, a kind of polarizing beam transmission, such as P polarization light pass through Brewster piece, another polarizing beam, such as S-polarization Position input of the light from Brewster piece output P polarization light beam, then film polarizer can be reflected the S-polarization light part, this Sample film polarizer output end can export the laser beam of P polarization light and S-polarization combiner, and the advantage of this scheme is can be with The laser beam for completing phase co-wavelength or different wave length carries out conjunction beam.Also a kind of scheme, it is to use speculum Spatial Coupling, So that final the reflected beams are equidirectional parallel transmissions, as long as the laser beam of these equidirectional parallel transmissions can Enough enter vibration mirror scanning f-theta system (Laser Focusing and focus handover module) can, parallel two incident beams are parallel Light beam focuses on same point after the focusing of f-theta mirror.For this situation see Fig. 3, this is that laser bundling device has speculum empty Between combine a kind of situation of composition.The laser bundling device 5 is made up of two panels speculum, the first windowing milling laser beam 11 The second windowing milling laser beam 6 is obtained through the reflection of the first speculum of laser bundling device 502；The first choice milling laser beam 21 The second selection milling laser beam 7 is obtained through the reflection of the second speculum of laser bundling device 503；The second windowing milling laser beam 6 Transmit, focused on through Laser Focusing and focus handover module 8, in material to be processed with the cocurrent and parallel of the second selection milling laser beam 7 Corresponding laser spot center maximum on 10 is smaller than 10 millimeters.It should be noted that two laser spots are in theory Overlap, it is all here to provide error range, error is had when being because of practical application adjustment, and this error does not influence The combination application of Spatial Coupling Laser Focusing focus.

The the second windowing milling laser beam 6 and the second selection milling laser beam 7 exported from laser bundling device 5 gathers by laser Jiao is focused with focus handover module 8, obtains Spatial Coupling Laser Focusing focus, and controls the Spatial Coupling Laser Focusing burnt Point switches between the different hole positions of workpiece to be processed 10, or carries out motion tune to laser spot motion in a hole position System.

In the present embodiment, Laser Focusing includes vibration mirror scanning focusing unit with focus handover module 10, and vibration mirror scanning gathers Burnt unit includes scanning galvanometer and scanning f-theta mirror, and scanning f-theta mirror has the scanning focused mirror of common flat field and telecentricity to sweep Retouch the types such as focus lamp.In the present embodiment, scanning f-theta mirror uses telecentric scanning focus lamp 808, telecentric scanning focus lamp 808 focal length is 100 millimeters, 50 millimeters × 50 millimeters of f-theta scope, 355 nanometers of eyeglass anti-reflection film wavelength.Scanning galvanometer Including the first reflecting optics 805 and the second reflecting optics 802.First reflecting optics 805 of the scanning galvanometer are arranged on scanning On the electric machine main shaft 806 of first motor 807 of galvanometer.Second reflecting optics 802 of the scanning galvanometer are arranged on scanning galvanometer The second motor electric machine main shaft 801 on.

The workpiece to be processed 10 is 60 micron thickness double-side flexible printed circuit boards, wherein two layers of layers of copper is 15 up and down Micron thickness copper, centre are the polyimides of 25 micron thickness, respectively there is 2 micron thickness between polyimide layer and upper and lower layers of copper Dry glue.

The light path flow of the present embodiment is as follows：First windowing milling laser beam 11 of the transmitting of windowing milling laser 1, With the incident laser bundling device 5 of the first choice milling laser beam 21 of the transmitting of selection milling laser 2, output The the second windowing milling laser beam 6 and the second selection milling laser light beams 7 of equidirectional parallel transmission, scanned galvanometer first Reflecting optics 805 obtain the first reflection of parallel beam 804, and the second of the 804 scanned galvanometer of the first reflection of parallel beam is anti- Penetrate eyeglass 802 and obtain the second reflection of parallel beam 803, second reflection of parallel beam 803 is through the scanning focused mirror of telecentricity flat field 808 are focused, and obtain focus on light beam 9, and the focus on light beam 9 directly acts on workpiece to be processed 10.It should be noted that institute State the second reflection of parallel beam 803 to be focused through the scanning focused mirror 808 of telecentricity flat field, it can be understood as a big beam diameter Light beam focused on by telecentricity flat field scanning mirror, therefore be only referred to " obtain focus on light beam 9 " here.

It should be noted that printed circuit board (PCB) includes at least three layers, the laser layer of material that runs at first of transmission and described The bottom hole material of blind hole is the high material of laser-damaged threshold value, and the layer of material being finally milled during processing blind hole is laser damage threshold It is worth low material；

In blind hole process, the windowing milling laser light extraction, by the windowing milling Laser Focusing focus formed, By controlling comprising the process conditions including windowing milling laser device laser light extraction time, windowing milling laser spot movement velocity Laser milling depth is controlled, to the other materials in addition to the layer of material being finally milled during processing blind hole of workpiece to be processed Layer completes Milling Process；Then the selection milling laser beam light extraction, by the selection milling Laser Focusing focus that is formed to be added The layer of material being finally milled during the processing blind hole of work workpiece completes Milling Process；

The first windowing milling laser beam 11 is the beam-expanding collimation light beam that diameter is 6.5 millimeters, and its relevant parameter is as follows： 355 nanometers of optical maser wavelength, beam quality factor are less than 1.1, and hot spot circularity is more than 90 percent, 8 watts of mean power, 50 kilo hertzs of@ Hereby, the nanosecond of laser pulse width 20, single mode gauss laser (horizontal field strength is Gaussian Profile), range of pulse repetition frequency 30 arrives 200 KHzs.Spot diameter with the corresponding windowing milling laser spot of the second windowing milling laser beam 6 is 10 microns, burnt It is deep 10 millimeters.

The first choice milling laser beam 21 is the laser beam that diameter is 2 millimeters, and its relevant parameter is as follows：Laser wave Long 355 nanometers, beam quality factor is less than 1.1, and hot spot circularity is more than 90 percent, 3 watts of KHzs of@30 of mean power, swashs The nanosecond of light impulse length 50, single mode gauss laser (horizontal field strength is Gaussian Profile), 20 to 100 kilo hertzs of range of pulse repetition frequency Hereby.Spot diameter with 7 corresponding selection milling laser spot hot spot of the described second selection milling laser beam is 45 microns, depth of focus 800 microns.From above-mentioned data, the spot diameter of the selection milling Laser Focusing focus is more than the windowing milling laser The spot diameter of focused spot, and the former laser peak power density is much smaller than the latter.

Embodiment 2,

From above-described embodiment 1, windowing milling Laser Focusing focus and selection milling Laser Focusing focus Special composition Combination laser focused spot (does not indicate) in figure, and the present embodiment selects milling Laser Focusing on the basis of above-described embodiment 1 Focus can be further designed to flat-top distribution laser spot.See Fig. 4, selection milling laser 2 and laser bundling device 5 it Between set beam shaping 3 so that it is corresponding selection milling Laser Focusing focus transverse direction field strength be distributed as flat-top hot spot distribution, this Kind design is advantageous in that flat-top laser is very beneficial for the Milling Process of high-effect high-quality so that hole bottom is clean, removes and adds Work ultrahigh in efficiency.

In addition, in the present embodiment, it can also set and swash between windowing milling laser 1 and the laser bundling device 5 The fine modulation movement module 2 of light, motion modulation is carried out to the first windowing milling laser beam 11, and then drive corresponding windowing milling Laser Focusing focus carries out milling campaign；Or set laser fine between selection milling laser 2 and laser bundling device 5 Modulation movement module 2, motion modulation is carried out to first choice milling laser beam 21, and then drive corresponding selection milling laser to gather Focus carries out milling campaign；Or laser essence is set between laser bundling device 5 and Laser Focusing and focus handover module 8 Fine modulated motion module 2, the second windowing milling laser beam 6 and the second selection milling laser beam 7 after pairing beam carry out motion tune System, and then drive selection milling Laser Focusing focus and selection milling Laser Focusing focus to carry out milling campaign.

Wherein, the fine modulation movement module 2 of laser can be acousto-optic deflection device, or electro-optic deflector, can also Speculum or refracting prisms are driven for Piezoelectric Ceramic speculum or galvanometer, can also be electric spindle motor driving rotation Refracting prisms, or for it is foregoing this it is several in two or more any Spatial Coupling.

For example when the fine modulation movement module 2 of laser is acousto-optic deflection device, acousto-optic deflection device is by changing audio-optical deflection The Bragg grating reflection angle of the carrier frequency regulation incident laser of the driving source of device, changes incident laser transmission direction；When sharp When the fine modulation movement module 2 of light is electro-optic deflector, electro-optic deflector is changed using electro-optic crystal refractive index with voltage Characteristic, apply applied voltage along perpendicular to electro-optical deflection crystal growth direction, electro-optical deflection crystal is formed gradually along the direction of growth Variable refractivity gradient is distributed, and then electro-optical deflection crystals light wave equiphase surface is deflected, and is realized in its output end The deflection of beam direction, then the deflection angle of light beam will continuously be changed by continuously changing applied voltage.

When the fine modulation movement module 4 of the laser positioned at the windowing milling laser 1 and the laser bundling device 5 it Between when, or, when the fine modulation movement module 4 of the laser is positioned at the selection milling laser 2 and the laser bundling device 5 Between when, the fine modulation movement module 4 of laser, be additionally operable to modulate the first windowing milling laser beam 11 or modulation institute State first choice milling laser beam 21 so that the center of the windowing milling Laser Focusing focus and the selection milling laser gather The center of focus is drawn close to hole position center to be processed, so as to adjust the windowing center of milling Laser Focusing focus and described Select the dispersion at the center of milling Laser Focusing focus；

When the fine modulation movement module 4 of the laser is located at the laser bundling device 5 and the Laser Focusing is cut with focus When changing the mold between block 8, the fine modulation movement module 4 of laser, be additionally operable to modulate the second windowing milling laser beam 6 or Second selection milling laser beam 7 so that the windowing milling Laser Focusing focus or the selection milling Laser Focusing focus to Hole position center to be processed is drawn close, and is gathered so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling laser The dispersion at the center of focus.

The benefit of this design is, after system long-time use, because the reasons such as the mechanical stress deformation of board are made When each focus space position changes in into Spatial Coupling laser spot, the fine modulation movement module of laser can compensate These slight changes, it is ensured that system uses steadily in the long term.Ensure the dispersion of Spatial Coupling Laser Focusing focus in certain model In enclosing, so that it is guaranteed that the efficient quick that Spatial Coupling laser spot is processed to same hole position.

When Spatial Coupling laser spot is processed to same hole position, if the windowing milling Laser Focusing is burnt Point and/or selection milling Laser Focusing focus do not enter into hole position Working position, then need the Laser Focusing to switch with focus Module or the fine modulation movement module of the laser laser spot corresponding to are switched to corresponding hole position and are processed.Best Situation is adjusted without the Laser Focusing and the fine modulation movement module of focus handover module or the laser, described Window milling Laser Focusing focus and/or selection milling Laser Focusing focus are in hole position position to be processed simultaneously, so most save and bore The hole time.

The present embodiment workflow is as follows：Laser Focusing causes workpiece to be processed 10 with the galvanometer in focus handover module 8 In correct locus, the light extraction of windowing milling laser 1 (now selects the not light extraction of milling laser 2), and vibration mirror scanning drives The milling laser spot that opens a window removes layers of copper 1001 on the surface of material 10 to be processed, and formation is removed copper sheet blind hole 1004, may refer to Fig. 2-1 and Fig. 2-2, Fig. 2-1 are multilayer material drilling section front view, and Fig. 2-2 is multilayer material windowing milling surface chart.Then select The light extraction of milling laser 2 (now open a window the not light extraction of milling laser 1) is selected, vibration mirror scanning drives selection milling laser spot treating Milling campaign drilling is carried out on the primer 1002 for removing the bottom hole of copper sheet blind hole 1004 of workpieces processing 10, forms blind hole 1005, and do not hinder the layers of copper 1003 of bottom, see Fig. 2-3, Fig. 2-3 is blind hole sectional view.After completing the drilling of blind hole 1005, laser Focus on and Spatial Coupling Laser Focusing focus is switched to next drilling hole position with focus handover module 8.

For the present embodiment, the first windowing milling laser beam 11 can be infrared picosecond laser, described first Selection milling laser beam 21 can be pulse green laser, and vibration mirror reflected eyeglass plates dual wavelength reflectance coating, and focusing system also uses Dual wavelength focuses on design.

The core concept of above-described embodiment 1 and embodiment 2 be exactly for multiple material superposition slicer board processing, it is necessary to With the laser spot Spatial Coupling of corresponding different qualities, realize below same drilling optical focusing system, be provided with Spatial Coupling laser spot, different material layers can be processed using different laser spots, and particularly this superposition is empty Between combined material blind hole drilling, requiring the flat no residue of blind via bottom, hole wall is smooth, eat dishes without rice or wine impulse- free robustness and too many hot shadow Area is rung, and requires drilling efficiency height, then using Spatial Coupling Laser Focusing focus by extraordinary this problem of solution, and Different material processing, can select suitable LASER Light Source, suitable light path design, accomplish the laser of every kind of material as far as possible Processing optimizes；The fine laser drill field of slicer board of most multiple layers of different materials superpositions is can apply to, is laser The another quantum jump of drilling FIELD OF THE INVENTIONThe.

Embodiment 3, a kind of multilayer material layered milling processing method based on Spatial Coupling laser spot.

Referring to Fig. 5, the method that the present embodiment provides specifically includes：

The laser peak power density of the windowing milling Laser Focusing focus is burnt higher than the selection milling Laser Focusing The laser peak power density of point, and it is enough the high material of laser-damaged threshold value described in milling, the selection milling Laser Focusing is burnt Dot laser peak power density is enough the low material of laser-damaged threshold value described in milling, but laser-damaged threshold value described in insufficient milling is high Material.

Wherein, the present embodiment also includes：Light beam is set between the selection milling laser and the laser bundling device Reshaper, beam shaping is carried out to first choice milling laser beam so that gather with focus handover module by the Laser Focusing Defocused selection milling Laser Focusing focus is flat-top hot spot or quasi- flat-top hot spot.

And also include：Laser is set finely to modulate fortune between the windowing milling laser and the laser bundling device Dynamic model block, motion modulation is carried out to the described first windowing milling laser beam, and then drive corresponding windowing milling Laser Focusing burnt Point carries out milling campaign；Or

When the fine modulation movement module of the laser is between the windowing milling laser and the laser bundling device When, or, when the fine modulation movement module of the laser is between the selection milling laser and the laser bundling device When, the fine modulation movement module of laser is also to the described first windowing milling laser beam or the modulation first choice milling Laser beam is modulated so that the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus Center is drawn close to hole position center to be processed, so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling The dispersion at the center of Laser Focusing focus；

The tool of the multilayer material layered milling processing method based on Spatial Coupling laser spot provided using the present embodiment Body running principle refers to the correlation technique feature of above-described embodiment 1 and embodiment 2, is not repeated.

A kind of multilayer material layered milling system of processing and method based on Spatial Coupling laser spot proposed by the present invention, Its main inventive point is：Below same drilling optical focusing system, there is provided Spatial Coupling Laser Focusing focus；No In Laser Processing with the multi-layer thin sheet of type materials superposition, a kind of laser of proper characteristics can be used per layer of material Focused spot is processed, wherein, proper characteristics refer to focussed laser spot size, optical maser wavelength, pulse energy, laser pulse width Degree, laser peak power density, laser facula field strength distribution (flat-top or Gauss) etc., or even also include deliberately doing laser in advance The processing of focus defocus.In blind hole drilling processing particularly to this complex superposition slicer board, the windowing of peak power density Milling laser spot carries out windowing Milling Process drastically, is stopped when being worked into last layer of hole bottom, by selecting Select milling laser spot and carry out easily this layer material of selective milling, bottom hole can be hindered by being not concerned about it, because selection milling laser The peak power of focus is not enough to break the blind hole completion high material of metapore that layer of bottom laser-damaged threshold value, saves substantial amounts of laser Process time, the stabilized lasers bore process section of raising, improve laser blind hole drilling quality；The present invention cleverly solves very much The intensive blind hole drilling quality of circuit board and efficiency of multilayer material of having determined superposition.

The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.

Claims

1. a kind of multilayer material layered milling system of processing based on Spatial Coupling laser spot, it is characterised in that including windowing Milling laser, selection milling laser, laser bundling device and Laser Focusing and focus handover module；

The laser bundling device, for being carried out to the first windowing milling laser beam and first choice milling laser beam of incidence Beam, the second windowing milling laser beam of output equidirectional parallel transmission and the second selection milling laser beam are closed, and it is incident respectively The Laser Focusing and focus handover module；

The Laser Focusing and focus handover module, for the milling laser beam that opened a window to the second of the equidirectional parallel transmission It is focused with the second selection milling laser beam, obtains Spatial Coupling Laser Focusing focus, and control the Spatial Coupling laser Focused spot switches between the different hole positions of workpiece to be processed, or, control the Spatial Coupling Laser Focusing focus Milling campaign is carried out at a hole position of workpiece to be processed；Wherein, the Spatial Coupling Laser Focusing focus includes window milling Cut Laser Focusing focus and selection milling Laser Focusing focus, when the Spatial Coupling Laser Focusing focus be in it is static when, institute The dispersion for stating the center of windowing milling Laser Focusing focus and the center of the selection milling Laser Focusing focus is less than 10 millis Rice；

The workpiece to be processed is the slicer board that multilayer material is formed by stacking, wherein, multilayer material is divided into laser-damaged threshold value height Material and the low material of laser-damaged threshold value；When the blind hole of workpiece to be processed described in the Spatial Coupling Laser Focusing focus milling When, the workpiece to be processed includes at least three layers, the layer of material and the bottom hole material of the blind hole that laser transmission runs at first The layer of material being finally milled for the high material of laser-damaged threshold value, during processing blind hole is the low material of laser-damaged threshold value；

In blind hole process, the windowing milling laser light extraction, by the windowing milling Laser Focusing focus formed, pass through Control includes the process regulation including windowing milling laser device laser light extraction time, windowing milling laser spot movement velocity Laser milling depth, it is complete to the other materials layer in addition to the layer of material being finally milled during processing blind hole of workpiece to be processed Into Milling Process；Then the selection milling laser light extraction, by the selection milling Laser Focusing focus that is formed to work to be processed The layer of material being finally milled during the processing blind hole of part completes Milling Process；

The laser peak power density of the windowing milling Laser Focusing focus is higher than the selection milling Laser Focusing focus Laser peak power density, and it is enough the high material of laser-damaged threshold value described in milling, the selection milling Laser Focusing focus swashs Light peak power density is enough the low material of laser-damaged threshold value described in milling, but is not enough to the high material of laser-damaged threshold value described in milling Material.

2. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 1, its feature It is, the windowing milling laser is short laser pulse laser, and the selection milling laser is long laser pulse laser Device.

3. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 1, its feature It is, in addition to beam shaping；The beam shaping positioned at selection milling laser and the laser bundling device it Between, for carrying out beam shaping to first choice milling laser beam so that gather by the Laser Focusing with focus handover module Defocused selection milling Laser Focusing focus transverse direction field strength is distributed as flat-top hot spot or quasi- flat-top hot spot；Or the light beam is whole Shape device is between the windowing milling laser and the laser bundling device, for carrying out light to the first windowing milling laser beam Beam shaping so that the windowing milling Laser Focusing focus after the Laser Focusing and focus handover module focus on is flat-top light Spot or quasi- flat-top hot spot.

4. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 3, its feature It is, on the workpiece to be processed surface, the spot diameter of the selection milling Laser Focusing focus is more than the windowing milling The spot diameter of Laser Focusing focus.

5. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 4, its feature It is, in addition to the fine modulation movement module of laser, the fine modulation movement module of laser is positioned at the windowing milling laser Between device and the laser bundling device, for carrying out motion modulation to the described first windowing milling laser beam, and then drive corresponding Windowing milling Laser Focusing focus carry out milling campaign；Or

The fine modulation movement module of laser positioned at it is described selection milling laser and the laser bundling device between, for pair The first choice milling laser beam carries out motion modulation, and then drives corresponding selection milling Laser Focusing focus to carry out milling Motion；Or

The fine modulation movement module of laser be located at the laser bundling device and the Laser Focusing and focus handover module it Between, motion modulation is carried out for the second windowing milling laser beam after pairing beam and the second selection milling laser beam, and then drive Milling Laser Focusing focus and selection milling Laser Focusing focus is selected to carry out milling campaign.

6. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 5, its feature It is, when the fine modulation movement module of the laser is between the windowing milling laser and the laser bundling device, Or when the fine modulation movement module of the laser is between the selection milling laser and the laser bundling device, The fine modulation movement module of laser, it is additionally operable to modulate the first windowing milling laser beam or the modulation first choice Milling laser beam so that the center of the windowing milling Laser Focusing focus and the center of the selection milling Laser Focusing focus Drawn close to hole position center to be processed, so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling laser The dispersion at the center of focused spot；

When the fine modulation movement module of the laser is located at the laser bundling device and the Laser Focusing and focus handover module Between when, the fine modulation movement module of laser, be additionally operable to modulate the second windowing milling laser beam or the second selection Milling laser beam so that the windowing milling Laser Focusing focus or the selection milling Laser Focusing focus are to hole position to be processed Center is drawn close, so as to adjust in the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus The dispersion of the heart.

7. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as described in claim 5 or 6, it is special Sign is, the fine modulation movement module of laser be acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic speculum or Galvanometer drives speculum or refracting prisms or electric spindle motor driving rotation refracting prisms or wherein both any or more persons Combination；

When the fine modulation movement module of the laser is acousto-optic deflection device, acousto-optic deflection device is by changing the drive of acousto-optic deflection device The carrier frequency in dynamic source adjusts the Bragg grating reflection angle of the incident laser, changes incident laser transmission direction；

When the fine modulation movement module of the laser is electro-optic deflector, the voltage of the driving source by changing electro-optic deflector Adjust the incident laser transmission direction.

8. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 7, its feature It is, the laser bundling device is polarization coupling element or is the combination of at least two speculums.

9. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 8, its feature It is, the Laser Focusing is that vibration mirror scanning focusing unit or platform move static focus unit with focus handover module；

The vibration mirror scanning focusing unit includes scanning f-theta mirror and scanning galvanometer；The scanning f-theta mirror is used for pair It is focused from the second windowing milling laser beam of laser bundling device output and the second selection milling laser beam, obtains space Combination laser focused spot；The scanning galvanometer be used for control the Spatial Coupling Laser Focusing focus in workpiece to be processed not Motion modulation is carried out to laser spot motion with the high speed switching between processing hole position, or in a hole position；

Or the vibration mirror scanning focusing unit includes scanning f-theta mirror, scanning galvanometer and two-dimension moving platform；It is described to sweep F-theta mirror is retouched to enter the second windowing milling laser beam exported from the laser bundling device and the second selection milling laser beam Line focusing, obtain Spatial Coupling Laser Focusing focus；The scanning galvanometer is used to control the Spatial Coupling Laser Focusing focus High speed switching between the different processing hole positions of workpiece to be processed, or laser spot is moved in a hole position Modulation；The two-dimension moving platform is used to carry the switching of workpiece to be processed and machining area or answered with vibration mirror scanning Close linkage；

Platform movement static focus unit includes static focus mirror and linear moving table, the static focus mirror for pair It is focused from the second windowing milling laser beam of laser bundling device output and the second selection milling laser beam, obtains space Combination laser focused spot；The linear moving table is used to control the Spatial Coupling Laser Focusing focus in workpiece to be processed Different processing hole positions between switchings.

10. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 9, its feature Be, when Spatial Coupling laser spot is processed to same hole position, if it is described windowing milling Laser Focusing focus and/ Or selection milling Laser Focusing focus does not enter into hole position Working position, then need the Laser Focusing and focus handover module or The fine modulation movement module of laser described in person laser spot corresponding to is switched to corresponding hole position and is processed.

11. the multilayer material layered milling system of processing based on Spatial Coupling laser spot as claimed in claim 10, it is special Sign is that the workpiece to be processed is multilayer circuit board base material, and the high material of laser-damaged threshold value is copper either gold or silver, The low material of the laser-damaged threshold value is polyimides, polyester, acrylic acid adhesive linkage or modified form epoxy resin.

12. the multilayer material layered milling based on Spatial Coupling laser spot as described in claim 1 or 3 or 4 or 5 or 6 adds Work system, the windowing milling laser and the selection milling laser can send for same laser, the laser Laser carries out light path switching by light path switching photoswitch, produces the first windowing milling laser beam respectively and first choice milling swashs Light beam.

A kind of 13. multilayer material layered milling boring method based on Spatial Coupling laser spot, it is characterised in that including：

S1, the first windowing milling laser beam and first as caused by selection milling laser as caused by windowing milling laser Select milling laser beam difference incident laser bundling device；

S2, laser bundling device carry out conjunction beam to the described first windowing milling laser beam and first choice milling laser beam, export phase Second windowing milling laser beam of equidirectional parallel transmission and the second selection milling laser beam, and incident Laser Focusing is cut with focus Change the mold block；

S3, second windowing milling laser beam and second of the Laser Focusing with focus handover module to the equidirectional parallel transmission Selection milling laser beam is focused, and obtains Spatial Coupling Laser Focusing focus, and controls the Spatial Coupling Laser Focusing burnt Point switches between the different hole positions of workpiece to be processed, or, the Spatial Coupling Laser Focusing focus is controlled to be added Milling campaign is carried out at one hole position of work workpiece；Wherein, the Spatial Coupling Laser Focusing focus includes windowing milling laser Focused spot and selection milling Laser Focusing focus, when the Spatial Coupling Laser Focusing focus be in it is static when, the windowing The dispersion at the center of milling Laser Focusing focus and the center of the selection milling Laser Focusing focus is less than 10 millimeters；

The laser peak power density of the windowing milling Laser Focusing focus is higher than the selection milling Laser Focusing focus Laser peak power density, and it is enough the high material of laser-damaged threshold value described in milling, the selection milling Laser Focusing focus swashs Light peak power density is enough the low material of laser-damaged threshold value described in milling, but the high material of laser-damaged threshold value described in insufficient milling Material.

14. the multilayer material layered milling boring method based on Spatial Coupling laser spot as claimed in claim 13, it is special Sign is, in addition to：

Beam shaping is set between the selection milling laser and the laser bundling device, to first choice milling laser Shu Jinhang beam shapings so that the selection milling Laser Focusing focus after the Laser Focusing and focus handover module focus on For flat-top hot spot or quasi- flat-top hot spot.

15. the multilayer material layered milling boring method based on Spatial Coupling laser spot as claimed in claim 14, it is special Sign is, in addition to：

The fine modulation movement module of laser is set between the windowing milling laser and the laser bundling device, to described the One windowing milling laser beam carries out motion modulation, and then drives corresponding windowing milling Laser Focusing focus to carry out milling campaign； Or

The fine modulation movement module of laser is set between the selection milling laser and the laser bundling device, to described the One selection milling laser beam carries out motion modulation, and then drives corresponding selection milling Laser Focusing focus to carry out milling campaign； Or

The fine modulation movement module of laser is set between the laser bundling device and the Laser Focusing and focus handover module, The second windowing milling laser beam and the second selection milling laser beam after pairing beam carry out motion modulation, and then drive selection milling Laser Focusing focus and selection milling Laser Focusing focus carry out milling campaign.

16. the multilayer material layered milling boring method based on Spatial Coupling laser spot as claimed in claim 15, it is special Sign is, when the fine modulation movement module of the laser is between the windowing milling laser and the laser bundling device When, or, when the fine modulation movement module of the laser is between the selection milling laser and the laser bundling device When, the fine modulation movement module of laser is also to the described first windowing milling laser beam or the modulation first choice milling Laser beam is modulated so that the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus Center is drawn close to hole position center to be processed, so as to adjust the center of the windowing milling Laser Focusing focus and the selection milling The dispersion at the center of Laser Focusing focus；

When the fine modulation movement module of the laser is located at the laser bundling device and the Laser Focusing and focus handover module Between when, the fine modulation movement module of laser also to described second windowing milling laser beam or second selection milling laser Beam is modulated so that the windowing milling Laser Focusing focus or the selection milling Laser Focusing focus are to hole position to be processed Center is drawn close, so as to adjust in the center of the windowing milling Laser Focusing focus and the selection milling Laser Focusing focus The dispersion of the heart.