CN106610709A - Novel heat dissipation device for computer - Google Patents

Novel heat dissipation device for computer Download PDF

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Publication number
CN106610709A
CN106610709A CN201510683569.7A CN201510683569A CN106610709A CN 106610709 A CN106610709 A CN 106610709A CN 201510683569 A CN201510683569 A CN 201510683569A CN 106610709 A CN106610709 A CN 106610709A
Authority
CN
China
Prior art keywords
constant
computer
heat conduction
constant temperature
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510683569.7A
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Chinese (zh)
Inventor
崔同科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central South University of Forestry and Technology
Original Assignee
Central South University of Forestry and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central South University of Forestry and Technology filed Critical Central South University of Forestry and Technology
Priority to CN201510683569.7A priority Critical patent/CN106610709A/en
Publication of CN106610709A publication Critical patent/CN106610709A/en
Pending legal-status Critical Current

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Abstract

The present invention relates to a novel heat dissipation device for a computer, installed at a position above the interior of a computer chassis. The novel heat dissipation device comprises a constant temperature material fixture and a silver heat conduction temperature drop tube. The constant temperature material fixture and the silver heat conduction temperature drop tube are connected to a constant temperature material device end to end in a Chinese character Tian shape. The constant temperature material device is provided with a material replacement device opening and a filling/recycling key. The device needs to be installed at a position above the interior of the computer chassis in parallel. The silver heat conduction temperature drop tube is elliptic, the diameter of the wider part being 3mm, and the diameter of the higher part being 1.5mm. The heat dissipation device for a computer, provided in the present invention, has the advantages that: the constant temperature material fixture and the silver heat conduction temperature drop tube are installed, so the temperature of a position covered by the silver heat conduction temperature drop tube is controlled within a constant temperature material range; and moreover, the constant temperature material device is provided with the replacement device opening and the filling/recycling key, so a constant temperature material can be conveniently replaced and maintained.

Description

A kind of computer novel radiating device
Technical field
Patent of the present invention is related to computer realm, more particularly to server, the work station of network computer.
Background technology
Computer is commonly called as computer, is that one kind can be run according to program, automatic, high speed processing magnanimity number According to modernization intelligent electronic device.It is made up of hardware system and software system, is fitted without any The computer of software is referred to as bare machine.Supercomputer, industrial control computer, network calculations can be divided into Machine (containing server, work station), personal computer (desktop computer), five class of embedded computer, compared with Advanced computer has biocomputer, photonic computer, quantum computer etc..
Server, work station in network computer, can all have extension in the desktop computer of personal computer Plug-in card is used for the plug-in card (such as RAID card, sonet card, network interface card etc.) for installing different demands type, intensive Expansion card and intensive chip layout using the radiating of expansion card into problem, bad meeting of radiating Expansion card is caused the phenomenons such as overheating fault and reduced lifetime occur.
Patent of invention content
In view of this, it is necessary to which a kind of heat conduction drop for solving expansion card heat dissipation problem in computer is provided Warm device.
Patent of the present invention is related to a kind of computer novel radiating device, is installed on inside computer cabinet Top position, the novel radiating device include constant-temp material fixture and silver heat conduction cooling pipe, permanent Adiabator fixture is end to end to constant-temp material device using " field " type with silver heat conduction cooling pipe, Constant-temp material device is provided with material more changing device mouth and button is reclaimed in filling, and described device needs parallel installation Top position inside computer cabinet, the silver heat conduction cooling are managed as ellipse, wide diameter For the computer heat conduction heat sink advantage that 3mm, high a diameter of 1.5mm, patent of the present invention are provided It is:By installing constant-temp material fixture and silver heat conduction cooling pipe, silver heat conduction cooling pipe institute is made The position temperature control of covering is in the range of constant-temp material, while constant-temp material fixture is provided with and more changes the outfit Put mouth and filling & reclaims button, constant-temp material can be facilitated to change and safeguard.
Description of the drawings
Fig. 1 is a kind of computer novel radiating device structural representation of patent of the present invention.
Specific embodiment
In order that the purpose of patent of the present invention, technical scheme and advantage become more apparent, below in conjunction with Drawings and Examples, are further elaborated to patent of the present invention.It should be appreciated that this place is retouched The specific embodiment stated only to explain patent of the present invention, is not intended to limit the present invention patent.
Fig. 1 is referred to, Fig. 1 is a kind of computer heat-radiating dustproof device structural representation of patent of the present invention.
A kind of computer novel radiating device, it is characterised in that described device includes constant-temp material Fixture (10) and silver heat conduction cooling pipe (14), the body need to be arranged on computer cabinet (20) The internal parallel installation in top position, constant-temp material fixture (10) comprising constant-temp material device area (13), Device portal (11), filling & reclaim button (12).
Described computer heat conduction heat sink, its hardware characteristics are that described device need to be less than calculating The specification of machine cabinet (20), and the silver heat conduction cooling pipe is ellipse, wide is a diameter of 3mm, high a diameter of 1.5mm.
Described computer heat conduction heat sink, it is that described device is 2 years which installs & maintenance features / time replacing constant-temp material, constant-temp material is circulated into device area (13) by device portal (11), then presses The embedded key of filling & recovery button (12) completes constant-temp material and is filled into silver heat conduction cooling pipe (14), Such as need to change constant-temp material, need to first press the recovery key that filling & reclaims button (12), after having reclaimed again The constant-temp material for being empty device area (13) reinstalls new constant-temp material again.
The preferred embodiment of patent of the present invention is the foregoing is only, it is of the invention not special to limit Profit, all any modification, equivalent and improvement made within the spirit and principle of patent of the present invention Deng should be included within the protection domain of patent of the present invention.

Claims (3)

1. a kind of computer novel radiating device described in, it is characterised in that described device includes constant temperature material Material fixture (10) and silver heat conduction cooling pipe (14), the body need to be arranged on computer cabinet (20) The internal parallel installation in top position, constant-temp material fixture (10) comprising constant-temp material device area (13), Device portal (11), filling & reclaim button (12).
2. computer heat conduction heat sink according to claim 1, its hardware characteristics is, institute The specification that device need to be less than computer cabinet (20) is stated, and the silver heat conduction cooling pipe is ellipse Round, wide a diameter of 3mm, high a diameter of 1.5mm.
3. computer heat conduction heat sink according to claim 1, which is installed & maintenance features and exists In described device is that constant-temp material is changed in 2 years/time, and constant-temp material is circulated into by device portal (11) Device area (13), then press filling & and reclaim the embedded key of button (12) and complete constant-temp material and be filled into Silver heat conduction cooling pipe (14), need to such as change constant-temp material, need to first press filling & and reclaim button (12) Recovery key, the constant-temp material for being empty device area (13) after having reclaimed again reinstalls new constant temperature again Material.
CN201510683569.7A 2015-10-22 2015-10-22 Novel heat dissipation device for computer Pending CN106610709A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510683569.7A CN106610709A (en) 2015-10-22 2015-10-22 Novel heat dissipation device for computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510683569.7A CN106610709A (en) 2015-10-22 2015-10-22 Novel heat dissipation device for computer

Publications (1)

Publication Number Publication Date
CN106610709A true CN106610709A (en) 2017-05-03

Family

ID=58610703

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510683569.7A Pending CN106610709A (en) 2015-10-22 2015-10-22 Novel heat dissipation device for computer

Country Status (1)

Country Link
CN (1) CN106610709A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1567132A (en) * 2003-06-16 2005-01-19 微星科技股份有限公司 Computer system with heat radiation modules for mounting multiple pumps
CN201000598Y (en) * 2006-12-15 2008-01-02 乔宏伟 Computer cabinet with water cooling radiator
CN201107718Y (en) * 2007-12-05 2008-08-27 仲红军 Computer noiseless electromagnetical fluid water-cooling heat sinking system
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
CN101859738A (en) * 2009-04-07 2010-10-13 康舒科技股份有限公司 Large-area liquid-cooled heat dissipation device
CN103179837A (en) * 2011-12-20 2013-06-26 研能科技股份有限公司 Cooling system applied to portable electronic device
CN104850200A (en) * 2015-05-29 2015-08-19 黑龙江大学 Water-cooled computer and application method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1567132A (en) * 2003-06-16 2005-01-19 微星科技股份有限公司 Computer system with heat radiation modules for mounting multiple pumps
CN201000598Y (en) * 2006-12-15 2008-01-02 乔宏伟 Computer cabinet with water cooling radiator
CN201107718Y (en) * 2007-12-05 2008-08-27 仲红军 Computer noiseless electromagnetical fluid water-cooling heat sinking system
CN101325863A (en) * 2008-08-06 2008-12-17 王志勇 Radiator for cooling automatic cycle liquid
CN101859738A (en) * 2009-04-07 2010-10-13 康舒科技股份有限公司 Large-area liquid-cooled heat dissipation device
CN103179837A (en) * 2011-12-20 2013-06-26 研能科技股份有限公司 Cooling system applied to portable electronic device
CN104850200A (en) * 2015-05-29 2015-08-19 黑龙江大学 Water-cooled computer and application method thereof

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Application publication date: 20170503