CN106601646B - Conversion method of wafer dotting coordinate file, wafer dotting and control method - Google Patents
Conversion method of wafer dotting coordinate file, wafer dotting and control method Download PDFInfo
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- CN106601646B CN106601646B CN201611218720.0A CN201611218720A CN106601646B CN 106601646 B CN106601646 B CN 106601646B CN 201611218720 A CN201611218720 A CN 201611218720A CN 106601646 B CN106601646 B CN 106601646B
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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Abstract
The invention provides a conversion, dotting and control method of a wafer dotting coordinate file, wherein the conversion method comprises a coordinate conversion step and a header file generation step, and the coordinate conversion step comprises the following steps: acquiring coordinate information in a coordinate file, wherein the coordinate information comprises a dotting mark, a non-dotting mark, an edge mark and a blank mark; replacing the dotting marks and the edge marks with first digital marks, replacing the non-dotting marks with second digital marks, and replacing the blank marks with third digital marks; adding a separation mark between adjacent digital marks in the same row; a termination flag is added at the end of each row, and a header file is generated according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the starting position coordinates, the X traveling direction and the Y traveling direction. Through the scheme, different coordinate files can be converted into a uniform format, and header files are generated according to actual wafer conditions, so that the compatibility conversion of the coordinate files is completed, the compatibility is high, and the cost can be saved.
Description
Technical Field
The present invention relates to the field of wafers, and in particular, to a method for converting a coordinate file of a wafer dotting, a method for dotting a wafer, and a method for controlling a dotting device.
Background
In semiconductor production, as the size of wafers increases and the size of devices decreases, a wafer may be divided into thousands of identical or different chips as needed. The final wafer has normal chips and defective chips due to the process design or the nature of the material itself. Typically, a test machine and a probe card (ProbeCard) are used to test each chip on a wafer to ensure that the electrical characteristics and performance of the chip meet the design specifications. If a defective chip is found in the test process, marking is needed, and the defective chip can be particularly coated with ink by spot coating. And the position information of the defective chip can be formed into coordinate files with different forms according to different testing equipment.
The probe station for general test does not have the function of dotting, so that a wafer and corresponding coordinate files are required to be placed in a special dotting device for dotting marking, and the dotting device cannot identify due to the fact that the coordinate files with different formats are generated by different test equipment, and cannot be well compatible with various coordinate files, if a plurality of dotting devices with corresponding formats are adopted, the cost is greatly increased, and therefore cost pressure is brought to generation and production efficiency is reduced.
Disclosure of Invention
A first object of the present invention is to provide a control method of a dotting device with high compatibility and high dotting efficiency.
The second objective of the present invention is to provide a method for converting a wafer dotting coordinate file with high compatibility.
A third object of the present invention is to provide a wafer dotting method with high compatibility.
In order to achieve the first object of the present invention, the present invention provides a control method of a dotting device, the dotting device includes an X-axis movement control mechanism, a Y-axis movement control mechanism, and a table for carrying a wafer; the X-axis movement control mechanism controls the workbench to move along the X axis; the Y-axis movement control mechanism controls the workbench to move along the Y axis; the dotting device further comprises a support frame and an inking mechanism, wherein the support frame is positioned above the workbench, and a plurality of stations are arranged on the support frame; the inking mechanism comprises a fixing component and an inking component, and the inking component marks the wafer; the fixing component comprises a mounting piece, a first connecting piece, a second connecting piece, a third connecting piece, a first screw, a second screw and a third screw; the installation piece is installed on the station, a first threaded hole is formed in the upper side of the installation piece, the lower side of the first connection piece is movably matched with the upper side of the installation piece through a V-shaped groove, and a first screw is matched with the first threaded hole; a second threaded hole is formed in the upper side of the first connecting piece, the lower side of the second connecting piece is movably matched with the upper side of the first connecting piece through a V-shaped groove, and a second screw is matched with the second threaded hole; the side surface of the second connecting piece is provided with a third threaded hole, the side surface of the third connecting piece is movably matched with the side surface of the second connecting piece through a V-shaped groove, and a third screw is matched with the third threaded hole; the inking component is rotatably connected to the third connecting piece;
the control method comprises a coordinate conversion step, a header file generation step, an adjustment step and a dotting step, wherein the coordinate conversion step comprises the following steps:
acquiring coordinate information in a coordinate file, wherein the coordinate information comprises a dotting mark, a non-dotting mark, an edge mark and a blank mark;
replacing the dotting marks and the edge marks with first digital marks, replacing the non-dotting marks with second digital marks, and replacing the blank marks with third digital marks;
adding a separation mark between adjacent digital marks in the same row;
a termination flag is added at the end of each line,
the header file generating step includes:
acquiring an X step distance and a Y step distance;
obtaining the diameter of a chip of a wafer;
acquiring an initial position coordinate;
acquiring an X travelling direction and a Y travelling direction;
generating a header file according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the initial position coordinate, the X traveling direction and the Y traveling direction;
the adjusting step comprises the following steps:
adjusting the first connecting piece to move above the mounting piece, and locking the first connecting piece by using a first screw;
adjusting the second connecting piece to move above the first connecting piece, and locking the second connecting piece by using a second screw;
adjusting the third connecting piece to move on the side surface of the second connecting piece, and locking the third connecting piece by using a third screw;
the rotation angle of the inking assembly is adjusted,
the dotting step comprises the following steps:
placing a wafer on a workbench;
the workbench is controlled to move along the X axis by an X axis movement control mechanism;
the workbench is controlled to move along the Y axis by the Y axis movement control mechanism;
and according to the coordinate file and the header file after coordinate conversion, the chips corresponding to the first digital mark and the third digital mark are not dotted, and the chips corresponding to the second digital mark are dotted.
According to the technical scheme, the workbench is controlled by the X-axis movement control mechanism to drive the wafer to move along the X-axis, the Y-axis movement control mechanism is controlled by the workbench to drive the wafer to move along the Y-axis, the support frame is located above the workbench, a plurality of stations are arranged on the support frame, the mounting piece of the inking mechanism is arranged on the station, the inking component of the inking mechanism marks the wafer, meanwhile, the wafer is marked and dotted by multiple stations, so that the production efficiency is greatly improved, and the structure is simple. The lower part of the first connecting piece is movably matched with the upper part of the mounting piece through a V-shaped groove, and the first screw is matched with the first threaded hole to lock the first connecting piece; the lower part of the second connecting piece is movably matched with the upper part of the first connecting piece through a V-shaped groove, and the second screw is matched with the second threaded hole to lock the second connecting piece; the side surface of the third connecting piece is movably matched with the side surface of the second connecting piece through a V-shaped groove, and a third screw is matched with the third threaded hole to lock the third connecting piece; the inking assembly is rotatably connected to the third link. Therefore, the position of the ink dripping assembly is adjusted through the movement of the first connecting piece, the second connecting piece and the third connecting piece and the rotation of the ink dripping assembly, so that the dotting device is applicable to wafers with different specifications, and has the advantages of simple structure, high production efficiency and production cost reduction.
Meanwhile, coordinate information of coordinate files is obtained, coordinate information is identified, then different coordinate information is converted, then a separation mark is added between digital marks, and a termination mark is added at the end of a line, so that different coordinate files of different wafer test equipment can be converted into a uniform format, and a header file is generated according to X step distance, Y step distance, the diameter of a chip of a wafer, the initial position coordinate, the X traveling direction and the Y traveling direction, and finally compatibility conversion of the whole coordinate file is completed, so that the dotting device can adapt to coordinate files of various formats of various wafers, the compatibility is high, the dotting efficiency is high, and the cost can be saved.
In order to achieve the second object of the present invention, the present invention provides a method for converting a wafer dotting coordinate file, the converting method including a coordinate converting step and a header file generating step;
the coordinate conversion step includes:
acquiring coordinate information in a coordinate file, wherein the coordinate information comprises a dotting mark, a non-dotting mark, an edge mark and a blank mark;
replacing the dotting marks and the edge marks with first digital marks, replacing the non-dotting marks with second digital marks, and replacing the blank marks with third digital marks;
adding a separation mark between adjacent digital marks in the same row;
a termination flag is added at the end of each line,
the header file generating step includes:
acquiring an X step distance and a Y step distance;
obtaining the diameter of a chip of a wafer;
acquiring an initial position coordinate;
acquiring an X travelling direction and a Y travelling direction;
and generating a header file according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the initial position coordinate, the X traveling direction and the Y traveling direction.
Still further, the first digital signature is identical to the third digital signature.
Still further, the separation mark is comma.
Still further, the termination flag is ". End @".
According to the scheme, the coordinate information of the coordinate file is obtained, the coordinate information is identified, then different coordinate information is converted, then a separation mark is added between digital marks, and a termination mark is added at the tail end of a line, so that different coordinate files of different wafer test equipment can be converted into a uniform format, and a header file is generated according to the X step distance, the Y step distance, the diameter of a chip of a wafer, the initial position coordinate, the X traveling direction and the Y traveling direction, and finally the compatibility conversion of the whole coordinate file is finished.
In order to achieve the third object of the present invention, the present invention provides a wafer dotting method, the dotting method including a coordinate conversion step, a header file generation step, and a dotting step;
the coordinate conversion step includes:
acquiring coordinate information in a coordinate file, wherein the coordinate information comprises a dotting mark, a non-dotting mark, an edge mark and a blank mark;
replacing the dotting marks and the edge marks with first digital marks, replacing the non-dotting marks with second digital marks, and replacing the blank marks with third digital marks;
adding a separation mark between adjacent digital marks in the same row;
a termination flag is added at the end of each line,
the header file generating step includes:
acquiring an X step distance and a Y step distance;
obtaining the diameter of a chip of a wafer;
acquiring an initial position coordinate;
acquiring an X travelling direction and a Y travelling direction;
generating a header file according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the initial position coordinate, the X traveling direction and the Y traveling direction;
the dotting step comprises the following steps:
and dotting the chip corresponding to the first digital mark according to the coordinate file and the header file after coordinate conversion, and not dotting the chip corresponding to the second digital mark and the third digital mark.
In a further scheme, before dotting the chip, the dotting step further comprises:
judging whether the dotting area corresponding to the second digital mark is circular or not;
if the dotting area corresponding to the second digital mark is circular, the starting position of the chip of the wafer is set.
According to the scheme, coordinate information of the coordinate files is obtained, the coordinate information is identified, then different coordinate information is converted, then a separation mark is added between digital marks, and a termination mark is added at the tail end of a line, so that different coordinate files of different wafer testing equipment can be converted into a uniform format, and a header file is generated according to the X step distance, the Y step distance, the diameter of a chip of a wafer, the initial position coordinate, the X traveling direction and the Y traveling direction, compatibility conversion of the whole coordinate file is completed, then corresponding shape judgment is utilized, whether the coordinate file is successful or not is judged, dotting is carried out according to a dotting area and a dotting area if the coordinate file is successful, and the coordinate files in various formats of various wafers can be dotted.
Drawings
Fig. 1 is a block diagram of an embodiment of the dotting device of the invention.
Fig. 2 is a first view angle structural diagram of the inking mechanism of the embodiment of the dotting device of the present invention.
Fig. 3 is a second view angle structural diagram of the inking mechanism of the embodiment of the dotting device of the present invention.
Fig. 4 is a system block diagram of an embodiment of the dotting device of the invention.
Fig. 5 is a flowchart of a control method of an embodiment of the dotting device of the present invention.
Fig. 6 is a flowchart of the coordinate conversion step in the embodiment of the control method of the present invention.
Fig. 7 is a schematic diagram of a coordinate file before conversion in an embodiment of the control method of the present invention.
Fig. 8 is a schematic diagram of a coordinate file after conversion in an embodiment of the control method of the present invention.
Fig. 9 is a flowchart of a header file generation step in an embodiment of the control method of the present invention.
FIG. 10 is a flow chart of the dotting step in an embodiment of the control method of the present invention.
The invention is further described below with reference to the drawings and examples.
Detailed Description
Dotting device embodiment:
referring to fig. 1, the dotting device 1 includes an X-axis movement control mechanism 3, a Y-axis movement control mechanism 2, and a table 6, the table 6 being for carrying a wafer, the X-axis movement control mechanism 3 controlling the table 6 to move along the X-axis, the Y-axis movement control mechanism 2 controlling the table 6 to move along the Y-axis. The dotting device 1 further comprises a supporting frame 4 and an inking mechanism 5, wherein the supporting frame 4 is positioned above the workbench 6, the inking mechanism 5 marks the wafer, and can mark unqualified products of the wafer and also mark qualified products of the wafer. The support frame 4 is the ring shape setting, has arranged a plurality of stations along the ring of support frame 4, and the inking mechanism 5 is installed on this station to dotting device 1 can carry out the inking mark to a plurality of wafers simultaneously, has improved production efficiency greatly.
The dotting device 1 further comprises a fixed seat 7, and the workbench 6 is arranged on the fixed seat 7. The X-axis movement control mechanism 3 includes a first screw rod 31 and a moving seat 32, the first screw rod 31 is rotatably mounted on the moving seat 32, and the lower part of the fixed seat 7 is movably connected with the first screw rod 31. The fixed seat 7 is provided with a first slide 71 below the two sides, the movable seat 32 is provided with a first slide rail 33 above the two sides, and the first slide 71 is movably matched with the first slide rail 33. The first screw rod 31 is controlled to rotate in the forward and reverse directions, so that the fixed seat 7 is controlled to move along the X-axis direction, and meanwhile, the first sliding seat 71 moves on the first sliding rail 33 and drives the workbench 6 to move along the X-axis direction.
The Y-axis movement control mechanism 2 includes a second screw 21 and a base 22, the second screw 21 being rotatably mounted on the base 22, the lower side of the movement seat 32 being movably connected with the second screw 21. Second sliding seats 34 are arranged below two sides of the movable seat 32, second sliding rails 23 are arranged above two sides of the base 22, and the second sliding seats 34 are movably matched with the second sliding rails 23. The second screw 21 is controlled to rotate in the forward and reverse directions, so that the movable base 32 is controlled to move in the Y-axis direction, and the fixed base 7 and the table 6 are also moved in the Y-axis direction, and the second slider 34 is moved on the second slide rail 23.
Referring to fig. 2 and 3, the inking mechanism 5 includes a fixing assembly including a fourth connecting member 55, a guide base 54, a slider 531, a spring 532, a coil 533, a filament 534, an ink tank 52, and an inking needle 51, and an inking assembly mounted on the carriage 4. The fourth link 55 is rotatably connected to a side of the fixed assembly, and the guide seat 54 is movably connected with the fourth link 55. The coil 533 is located on the guide seat 54, the slider 531 is located above the coil 533, and the spring 532 is abutted between the slider 531 and the coil 533. The ink tank 52 is mounted below the guide seat 54 and communicates with the ink-dispensing needle 51, the ink-dispensing needle 51 is located at the end of the guide seat 54, the ink-dispensing needle 51 is a hollow needle tube, a filament 534 is provided through the spring 532, the coil 533 and the ink tank 52, and the filament 534 is used for connecting the slider 531 and the ink-dispensing needle 51. The distance between the ink dispensing needle 51 and the workbench 6 is adjusted by rotating the fourth connecting piece 55, electromagnetic force is generated through the coil 533 based on the current of the test data electric signal, the electromagnetic force acts on the slider 531 and the elastic force of the spring 532, the filament 534 fixed on the slider 531 moves, the filament 534 passes through the ink box 52 and drives the ink dispensing needle 51 to move, and the ink dispensing needle 51 dips ink and marks the wafer.
The fixation assembly includes a mounting member 592, a first connector 591, a second connector 58, a third connector 56, a first screw 593, a second screw 59, and a third screw 57. The mounting member 592 is mounted on a station of the support frame 4, a first threaded hole (not shown) is formed in the upper portion of the mounting member, the lower portion of the first connecting member 591 is movably matched with the upper portion of the mounting member 592 through a V-shaped groove, and the first screw 593 is matched with the first threaded hole to lock the first connecting member 591. A second threaded hole (not shown) is provided above the first connector, the lower part of the second connector 58 is movably engaged with the upper part of the first connector 591 through a V-shaped groove, and the second screw 59 is engaged with the second threaded hole to lock the second connector 58. The side of the second connector is provided with a third threaded hole (not shown), the side of the third connector 56 is movably engaged with the side of the second connector 58 by a V-groove, and a third screw 57 is engaged with the third threaded hole to lock the third connector 56. The fourth link 55 is rotatably connected to the third link 56. Through the movement of the first connecting piece 591, the second connecting piece 58, the third connecting piece 56 and the rotation of the fourth connecting piece 55, the position of the ink dot needle 51 is adjusted, so that the dot device 1 is suitable for wafers with different specifications, and has the advantages of simple structure, high production efficiency and production cost reduction.
When marking the point on the wafer, the X-axis movement control mechanism 3 controls the workbench 6 to drive the wafer to move along the X axis, and the Y-axis movement control mechanism 2 controls the workbench to drive the wafer to move along the Y axis. At the same time, the control filament 534 drives the dot ink needle 51 to move towards or back to the direction of the workbench 6, so as to mark the crystal dot ink. Before the start of the work, the dotting device 1 can move the positions of the first connecting piece 591, the second connecting piece 58 and the third connecting piece 56 and rotate the fourth connecting piece 55 according to different wafer specifications, and adjust the relative positions between the ink dotting needle 51 and the workbench 6 so as to match wafers with different specification requirements. The ring of support frame 4 is last to set up a plurality of stations, and the installed part 592 of inking mechanism 5 is installed on the station, and the inking subassembly of inking mechanism 5 marks the wafer, and the multistation marks the dotting to the wafer simultaneously, has improved production efficiency greatly, simple structure.
Referring to fig. 4, fig. 4 is a system block diagram of the dotting device, and the dotting device further includes a display control unit for processing, calculating, controlling and displaying, specifically, the dotting device includes a processing module 81, an input module 82, a display module 83, a header generation module 84 and a coordinate conversion module 85, the processing module 81 is connected with the X-axis movement control mechanism 3 and outputs an X control signal thereto, the processing module 81 is connected with the Y-axis movement control mechanism 2 and outputs a Y control signal thereto, the processing module 81 is connected with the dotting mechanism 5 and outputs a dotting control signal thereto, the input module 82 may employ a keyboard, a mouse and/or a touch display screen, the display module 83 may employ a display screen, and the display may also have an information input capability. The header file generation module 84 and the coordinate conversion module 85 are functional modules stored in a memory of the dotting device, and are respectively used for realizing a coordinate conversion function and a header file generation function, and the X-axis movement control mechanism 3 and the Y-axis movement control mechanism 2 each have a function such as a raster position detection function, so that the X-axis movement control mechanism 3 and the Y-axis movement control mechanism 2 output an X-position signal and a Y-position signal to the processing module 81, respectively. The X position signal and the Y position signal may be used for generation of the header file. The processing module 81 can control the movement control mechanism and the inking mechanism according to the coordinate file and the header file, so as to realize sequential dotting/non-dotting of each chip on the wafer.
Control method embodiment of dotting device:
referring to fig. 5, the control method of the dotting device includes a coordinate file conversion step, an adjustment step S3, and a dotting step S4, in this embodiment, the coordinate file conversion step of dotting with a wafer is the coordinate file conversion method in the claims. Specifically, the conversion step of the coordinate file includes a coordinate conversion step S1 and a header file generation step S2.
Referring to fig. 6, when the coordinate conversion step S1 is performed, step S11 is first performed, a coordinate file is input to the processing module, coordinate information in the coordinate file is obtained, the coordinate information includes a dotting flag, a non-dotting flag, an edge flag and a blank flag, referring to fig. 7, fig. 7 is a schematic diagram of a coordinate file, the dotting flag bit represents a flag that a chip test FAILs, that is, a polishing point needs to be performed, and is indicated by "2-9" and "a to F", the non-dotting flag represents a chip test passes, that is, PASS needs not to be performed, a "1" flag, the edge flag represents a chip located at an edge, that does not test needs to be dotted, an "X" flag, and a blank flag represents a blank, that is, an area other than a wafer, and a ". Flag.
Step S12 is then performed, in which the dotting mark and the edge mark are replaced with a first digital mark, the non-dotting mark is replaced with a second digital mark, and the blank mark is replaced with a third digital mark, referring to fig. 8, in this embodiment, the first digital mark is denoted by numerals 2-8, the second digital mark is denoted by numeral 1, and the third digital mark is denoted by numeral 9.
Then step S13 is performed to add a separation flag between adjacent digital flags within the same row, and to add a termination flag at the end of each row, in this embodiment the separation flag uses commas ",", and the termination flag uses ". End >".
Of course, the selection modes of the real digital mark, the separation mark and the termination mark are all the preferred modes, more variations can be realized in practical application, and if the mark to be marked is the mark to be marked, the English "Y" can be adopted, the "N" is adopted without the mark to be marked, and the separation mark can be the semicolon; "or cross bar" - ", termination mark may be". E."or"; E; "etc. Can be adjusted according to the actual memory size or other conditions.
Subsequently, the header file generating step S2 is performed, and first, step S21 is performed to obtain the pitch of each chip in the X direction and the pitch of each chip in the Y direction according to the parameters of each chip of the wafer. The X-direction and Y-direction refer to the horizontal and vertical rows of chips on a wafer. Step S22 is then performed to obtain the diameter of each chip of the wafer.
Then, step S23 is performed to obtain the initial position coordinate, where the initial position coordinate is the position of the first chip to be dotted, and is typically located in the upper left corner or the lower left corner. Of course, other locations are possible. Step S24 is then performed to obtain the X travel direction and the Y travel direction, i.e. after determining the first chip to be dotted, the next line is moved left or right, and the next line is moved up or down. Then, step S25 is performed, where the header file is generated according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the initial position coordinate, the X traveling direction, and the Y traveling direction, and in this embodiment, the header file may be formed as follows:
beginning test time, year-month-day, XX is XX;
ending the test time, and carrying out year-month-day test, wherein XX is XX;
x step distance: XXXX;
y step: XXXX;
chip diameter: XXX;
first point X coordinate: XXXX;
first point Y coordinate: XXXX;
first point X direction: -1;
first point Y direction: 1;
subsequently, an adjustment step S3 is performed, which comprises:
adjusting the first connector 591 to move over the mounting member and locking the first connector using the first screw;
adjusting the second connector 58 to move over the first connector and locking the second connector with the second screw;
adjusting the third link 56 to move on the side of the second link and locking the third link using a third screw;
the rotation angle of the ink set, i.e., the angle of the fourth link 55, is adjusted.
And finally, executing the dotting step S4, firstly, executing the step S41, judging whether the dotting area corresponding to the second digital mark is round, if the dotting area corresponding to the second digital mark is round, the setting of the representative parameter is normal, dotting can be normally performed, and meanwhile, judging whether the parameter setting is correct or not by judging whether the same line is in a mirror image relationship along the X direction. Then, step S42 is performed, in which the wafer is placed on the table, and the initial position of the chip of the wafer is set, and the ink-dispensing needle is disposed opposite to the chip. Subsequently, step S43 is executed, the table is controlled to move along the X axis by the X axis movement control mechanism, the table is controlled to move along the Y axis by the Y axis movement control mechanism, and finally step S44 is executed, the chips corresponding to the first digital mark and the third digital mark are not dotted, and the chips corresponding to the second digital mark are dotted according to the coordinate file and the header file after the coordinate conversion
When marking points on unqualified products of the wafer, the X-axis movement control mechanism 3 controls the workbench 6 to drive the wafer to move along the X axis, and the Y-axis movement control mechanism 2 controls the workbench to drive the wafer to move along the Y axis. At the same time, the control filament 534 drives the dot ink needle 51 to move towards or back to the direction of the workbench 6, so as to mark the crystal dot ink. Before the start of the work, the dotting device 1 can move the positions of the first connecting piece 591, the second connecting piece 58 and the third connecting piece 56 and rotate the fourth connecting piece 55 according to different wafer specifications, and adjust the relative positions between the ink dotting needle 51 and the workbench 6 so as to match wafers with different specification requirements. The ring of support frame 4 is last to set up a plurality of stations, and the installed part 592 of inking mechanism 5 is installed on the station, and the inking subassembly of inking mechanism 5 marks the wafer, and the multistation marks the dotting to the wafer simultaneously, has improved production efficiency greatly, simple structure.
The control method of the dotting device 1 can realize automatic marking dotting on the wafers, is suitable for marking dotting on the wafers with different specifications, has simple and reliable structure and greatly improves the production efficiency.
The coordinate information of the coordinate files is obtained, the coordinate information is identified, then different coordinate information is converted, then a separation mark is added between digital marks, and a termination mark is added at the tail end of a line, so that different coordinate files of different wafer test equipment can be converted into a uniform format, and a header file is generated according to the X step distance, the Y step distance, the diameter of a chip of a wafer, the initial position coordinate, the X traveling direction and the Y traveling direction, so that the compatibility conversion of the whole coordinate file is completed, then the corresponding shape is utilized to judge whether the success is judged, if the success is successful, the dotting is carried out according to the dotting area and the dotting area, and the coordinate files with various formats of various wafers can be dotted.
Claims (1)
1. The control method of the dotting device is characterized in that:
the dotting device comprises an X-axis movement control mechanism, a Y-axis movement control mechanism and a workbench, wherein the workbench is used for bearing a wafer;
the X-axis movement control mechanism controls the workbench to move along the X-axis;
the Y-axis movement control mechanism controls the workbench to move along the Y axis;
the dotting device further comprises a support frame and an inking mechanism, wherein the support frame is positioned above the workbench, and a plurality of stations are arranged on the support frame;
the inking mechanism comprises a fixed component and an inking component, and the inking component marks the wafer;
the fixing assembly comprises a mounting piece, a first connecting piece, a second connecting piece, a third connecting piece, a first screw, a second screw and a third screw;
the installation piece is installed on the station, a first threaded hole is formed in the upper portion of the installation piece, the lower portion of the first connection piece is movably matched with the upper portion of the installation piece through a V-shaped groove, and the first screw is matched with the first threaded hole;
a second threaded hole is formed in the upper portion of the first connecting piece, the lower portion of the second connecting piece is movably matched with the upper portion of the first connecting piece through a V-shaped groove, and the second screw is matched with the second threaded hole;
the side surface of the second connecting piece is provided with a third threaded hole, the side surface of the third connecting piece is movably matched with the side surface of the second connecting piece through a V-shaped groove, and the third screw is matched with the third threaded hole;
the inking assembly is rotatably connected to the third connector;
the control method comprises a coordinate conversion step, a header file generation step, an adjustment step and a dotting step, wherein the coordinate conversion step comprises the following steps:
acquiring coordinate information in a coordinate file, wherein the coordinate information comprises a dotting mark, a non-dotting mark, an edge mark and a blank mark;
replacing the dotting marks and the edge marks with first digital marks, replacing the non-dotting marks with second digital marks, and replacing the blank marks with third digital marks;
adding a separation mark between adjacent digital marks in the same row;
a termination flag is added at the end of each line,
the header file generating step includes:
acquiring an X step distance and a Y step distance;
obtaining the diameter of a chip of the wafer;
acquiring an initial position coordinate;
acquiring an X travelling direction and a Y travelling direction;
generating the header file according to the X step distance, the Y step distance, the diameter of the chip of the wafer, the initial position coordinate, the X traveling direction and the Y traveling direction;
the adjusting step comprises the following steps:
adjusting the first connecting piece to move above the mounting piece and locking the first connecting piece by using the first screw;
adjusting the second connecting piece to move above the first connecting piece, and locking the second connecting piece by using the second screw;
adjusting the third connecting piece to move on the side surface of the second connecting piece, and locking the third connecting piece by using the third screw;
the rotation angle of the inking assembly is adjusted,
the dotting step comprises the following steps:
placing the wafer on the workbench;
controlling the workbench to move along the X axis through the X axis movement control mechanism;
the workbench is controlled to move along the Y axis through the Y axis movement control mechanism;
and dotting the chip corresponding to the first digital mark according to the coordinate file and the header file after coordinate conversion, and not dotting the chip corresponding to the second digital mark and the third digital mark.
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| CN201611218720.0A CN106601646B (en) | 2016-12-26 | 2016-12-26 | Conversion method of wafer dotting coordinate file, wafer dotting and control method |
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| CN109065474B (en) * | 2018-07-17 | 2020-11-03 | 武汉新芯集成电路制造有限公司 | Automatic inking method for wafer defects |
| CN109277329A (en) * | 2018-09-10 | 2019-01-29 | 深圳市矽电半导体设备有限公司 | A kind of semiconductor test gets method ready |
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| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN105895545A (en) * | 2014-05-13 | 2016-08-24 | 北京同方微电子有限公司 | Method for adding ink dot identification to MAP of prober |
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| JP2004163174A (en) * | 2002-11-11 | 2004-06-10 | Nec Kyushu Ltd | Coordinate correction method and visual inspection method |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
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