CN106591902A - Continuous partial gold, tin and nickel plating control system of thin material - Google Patents
Continuous partial gold, tin and nickel plating control system of thin material Download PDFInfo
- Publication number
- CN106591902A CN106591902A CN201611091176.8A CN201611091176A CN106591902A CN 106591902 A CN106591902 A CN 106591902A CN 201611091176 A CN201611091176 A CN 201611091176A CN 106591902 A CN106591902 A CN 106591902A
- Authority
- CN
- China
- Prior art keywords
- gold
- plating
- plated
- face
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a continuous partial gold, tin and nickel plating control system of a thin material, and relates to the technical field of surface treatment hardware electroplating. The system comprises the following process steps that (1) according to a single-face gold plating mold special for gold plating design, a wheel plating technical mold is manufactured, plating gold is produced through the single-face masking technique, a non-gold-plating face is masked by a silica gel band through the self tension of an electroplating machine table, a power line cannot reach the surface of the masking face, meanwhile, a masking wheel must be synchronous with a gold plating material band, and a center ceramic bearing is utilized in the masking wheel; and (2) a single-face tin plating jig is manufactured, a device capable of achieving single-face tin plating can be manufactured through the surface tension of liquid, due to the fact that the material is thin, the jig is designed to be of a U-shaped structure, an anode is placed in the middle, a solution is supplied from a female groove through a water pump, holes are punched in the two sides of the jig, and bubbles are removed. The continuous partial gold, tin and nickel plating control system has the beneficial effects that the system is used for selective electroplating of the thin material, single-face tin plating and single-face gold plating of the thin material can be achieved, cost can be reduced, and production efficiency can be improved.
Description
Technical field
The present invention relates to be surface-treated five metals electroplating technology field, and in particular to thin material continuous and local is gold-plated, the control of stannum, nickel
System.
Background technology
With product more and more thinners such as high-endization of 3C Product, mobile phones, function becomes more powerful, to zero inside mobile phone
Part requirement is also higher, it is desirable to thinner, product material more and more thinner.Existing Fructus Mali pumilae portioned product require to be welded on FPC
One piece of little gold plating film, material only has 0.05mm, the rustless steel thin material of 0.05mm, it is desirable to which plating is that the gold-plated one side of one side is tin plating,
Beat hardness from the gold-plated conductive resistance and contact position to change surface of one side, simultaneously it is tin plating come scolding tin ensure and FPC connection,
There can not be phenomenon of solder rising while scolding tin, be again selective electroplating, from electroplating industry because material is thin for this project
For, this is a difficult point, is also the technical problem for needing to break through after a 3C Product upgrading.
The gold-plated tin plating control system of continuous and local there are various ways in continuous electroplating field, has after local brush plating gold and selects
Tin plating technique is selected in tin plating technique, somewhat gold-plated rubberizing local, but the tin plating one side craft of gilding of thin material one side is still in industry
Blank out, this purpose new meaning shows the thin only 0.05mm of product material, needs the gold-plated one side plating of one side after full nickel plating
Stannum, traditional handicraft is cannot to complete the surface treatment processing of this product, and the electrically conducting manner of thin material is developed, and this technique can
It is no before one side is gold-plated to utilize, gold is not interfered with behind stripping Jinsui River according to the characteristic and layer gold of golden liquid medicine
Outward appearance and function, need to develop a wheel plating smelting tool, and one side is leaned against in masking tape, and in addition one side is contacted with liquid medicine, and energization can
With plated with gold, reverse side has golden spilling, and after one side stripping gold, then one side is tin plating, removes because stannum can not take off, and gold is again outer
Sight face, the stannum so stannum face absolutely not can overflow.
The content of the invention
Present invention aims to the defect and deficiency of prior art, there is provided a kind of continuous office of thin material reasonable in design
Portion is gold-plated, stannum, nickel control system, and it is used for the selective electroplating of thin material, the tin plating one side of thin material one side can be made gold-plated, while also making
Golden cost savings 40%, the unrest for reducing gold is given up, and saves pad pasting twice, and cost reduces by 10%, glued membrane is saved, and reduces glued membrane disorderly useless
With environmental pollution, improve production efficiency, the yield with FPC welding plates is improved.
In order to solve the problems of background technology, the technical solution used in the present invention is：Its processing step is as follows：
(1) the gold-plated mould of special one side is designed and developed for gold-plated, it is contemplated that thin material there can not be nickel side, it is impossible to enough using common line
Plating mould, makes a wheel coating technology mould, and the production of one side masking technique is gold-plated, using the own tension silica gel of electroplating machine
The non-gilding of band masking, makes electric lines of force to reach the surface in masking face, while cover wheel must be synchronous with gold-plated material strip, keep away
Exempt from material strip to rub with masking wheel, cause silica gel to gall and material strip mill flower, masking wheel uses center ceramic bearing so as to can
Flexibly operating；(2) the tin plating smelting tool of one side is designed and is made, is removed because stannum can not take off on finished product, so gilding is exhausted
To coming in contact with stannum, if gold touches gold after stannum liquid medicine and can turn white rubescent, product function and outward appearance are had a strong impact on,
Using the surface tension of liquid, make one can the tin plating device of one side, due to material it is thin, it is impossible to enough simple copys are gold-plated
The principle of mould, needs to design a smelting tool that can be accurately controlled liquid level and liquid medicine stability, if liquid level is unstable, medicine
Water can overflow to the surface of gold, cause golden bad order, therefore the tin plating smelting tool current stabilization of one side is extremely important, and smelting tool is designed to one
Anode is placed in " recessed " word structure, centre, by pump handle liquid medicine from female groove for coming up, it is ensured that liquid stream is stablized, in smelting tool
Both sides are punched, and removal of bubbles, so can ensure that product surface does not have the alveolate fluctuation for rupturing and causing liquid medicine.
The present invention has the beneficial effect that：It is used for the selective electroplating of thin material, and the tin plating one side of thin material one side can be made gold-plated, while
Also golden cost savings 40% are made, the unrest for reducing gold is given up, saves pad pasting twice, cost reduces by 10%, glued membrane is saved, and reduces glued membrane
Disorderly useless and environmental pollution, improve production efficiency improves the yield with FPC welding plates.
Specific embodiment
With reference to specific embodiment, the present invention is further illustrated.
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is right below in conjunction with specific embodiment
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, and
It is not used in the restriction present invention.
This specific embodiment is adopted the following technical scheme that：Its processing step is as follows：(1) design and develop specially for gold-plated
With the gold-plated mould of one side, it is contemplated that thin material there can not be nickel side, it is impossible to enough using common line plating mould, a wheel plating skill is made
Art mould, one side masking technique production is gold-plated, and non-gilding is covered with silicone band using the own tension of electroplating machine, makes electric power
Line can not reach the surface in masking face, while cover wheel must be synchronous with gold-plated material strip, it is to avoid material strip rubs with masking wheel
Wipe, cause silica gel to gall and material strip mill flower, masking wheel uses center ceramic bearing so as to can flexibly operate；(2) design and make
Make the tin plating smelting tool of one side, remove because stannum can not take off on finished product, so gilding absolutely not can come in contact with stannum,
If gold touches gold after stannum liquid medicine can turn white rubescent, product function and outward appearance are had a strong impact on, using the surface tension of liquid,
Make one can the tin plating device of one side, due to material it is thin, it is impossible to the principle of enough gold-plated moulds of simple copy, need design one
The individual liquid level that can be accurately controlled has with the smelting of liquid medicine stability, if liquid level is unstable, liquid medicine can overflow to the surface of gold, lead
Golden bad order is caused, therefore the tin plating smelting tool current stabilization of one side is extremely important, smelting tool is designed to " recessed " word structure, and sun is placed in centre
Pole, by pump handle liquid medicine from female groove for coming up, it is ensured that liquid stream is stablized, in the both sides punching of smelting tool, removal of bubbles, this
Sample can ensure that product surface does not have the alveolate fluctuation for rupturing and causing liquid medicine.
It is before to adopt first Entire nickel coating, one side is gold-plated after single topping film, tear glued membrane, gilding rubberizing film, one side are plated
Golden dyestripping again, whole product completes electroplating process needs 3 procedures just can complete, therefore technological change is designed, and designs gold-plated
Mould and the tin plating smelting tool of one side, it is directly tin plating using one side after mould partially plating gold after nickel plating, three techniques are closed to once
Complete, rubberizing changed to using the gold-plated smelting of mould and has tin plating, golden cost savings 40%, the unrest for reducing gold is given up, and saves pad pasting twice,
Cost reduces by 10%, and glued membrane is saved, and reduces glued membrane disorderly useless and environmental pollution, the product with stable quality of the technology production, production
Yield is up to 99.5%, and production efficiency is high, greatly promotes production capacity, solves production capacity bottleneck, improves the yield with FPC welding plates.
This specific embodiment is used for the selective electroplating of thin material, the tin plating one side of thin material one side can be made gold-plated, while also dropping
Low cost, reduces glued membrane disorderly useless and environmental pollution, improve production efficiency.
The above, only to illustrate technical scheme and unrestricted, those of ordinary skill in the art are to this
Other modifications or equivalent that bright technical scheme is made, without departing from the spirit and scope of technical solution of the present invention,
All should cover in the middle of scope of the presently claimed invention.
Claims (1)
1. thin material continuous and local is gold-plated, stannum, nickel control system, it is characterised in that its processing step is as follows：(1) set for gold-plated
The gold-plated mould of the special one side of meter exploitation, it is contemplated that thin material can not have nickel side, it is impossible to enough using common line plating mould, make one
Individual wheel coating technology mould, one side masking technique production is gold-plated, covers non-gold-plated with silicone band using the own tension of electroplating machine
Face, makes electric lines of force to reach the surface in masking face, while cover wheel must be synchronous with gold-plated material strip, it is to avoid material strip and masking
Wheel rubs, and masking wheel uses center ceramic bearing；(2) design and make one side tin plating smelting tool, due to stannum be can not be
Take off what is removed on finished product, so gilding absolutely not can come in contact with stannum, using the surface tension of liquid, make an energy
The tin plating device of enough one sides, due to material it is thin, it is impossible to the principle of the gold-plated mould of enough simple copys, need the design one can be accurate
Ground control liquid level has with the smelting of liquid medicine stability, and smelting tool is designed to " recessed " word structure, and anode is placed in centre, by pump handle
Liquid medicine, for coming up, punches, removal of bubbles from female groove on the both sides of smelting tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091176.8A CN106591902A (en) | 2016-12-01 | 2016-12-01 | Continuous partial gold, tin and nickel plating control system of thin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091176.8A CN106591902A (en) | 2016-12-01 | 2016-12-01 | Continuous partial gold, tin and nickel plating control system of thin material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106591902A true CN106591902A (en) | 2017-04-26 |
Family
ID=58594512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611091176.8A Pending CN106591902A (en) | 2016-12-01 | 2016-12-01 | Continuous partial gold, tin and nickel plating control system of thin material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106591902A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108330522A (en) * | 2018-01-30 | 2018-07-27 | 商丘金振源电子科技有限公司 | A kind of novel local electro-plating method and device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1179617A1 (en) * | 1999-12-24 | 2002-02-13 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| CN201193251Y (en) * | 2008-04-10 | 2009-02-11 | 富港电子（东莞）有限公司 | Electroplating apparatus for immersion plating |
| CN102330134A (en) * | 2011-07-28 | 2012-01-25 | 太仓市金鹿电镀有限公司 | Continuous plating process |
| CN204237878U (en) * | 2014-12-05 | 2015-04-01 | 温州市华夏电镀有限公司 | A kind of one-side electroplating device |
| CN204356422U (en) * | 2014-12-24 | 2015-05-27 | 苏州道蒙恩电子科技有限公司 | Loudspeaker terminal electronickelling gold tin production line in a kind of portable computer |
| CN205171002U (en) * | 2015-12-10 | 2016-04-20 | 苏州道蒙恩电子科技有限公司 | Hang electrotinplate device |
| CN105839158A (en) * | 2016-05-19 | 2016-08-10 | 苏州市美能五金镀饰有限公司 | Continuous electroplating technology |
-
2016
- 2016-12-01 CN CN201611091176.8A patent/CN106591902A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1179617A1 (en) * | 1999-12-24 | 2002-02-13 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| CN201193251Y (en) * | 2008-04-10 | 2009-02-11 | 富港电子（东莞）有限公司 | Electroplating apparatus for immersion plating |
| CN102330134A (en) * | 2011-07-28 | 2012-01-25 | 太仓市金鹿电镀有限公司 | Continuous plating process |
| CN204237878U (en) * | 2014-12-05 | 2015-04-01 | 温州市华夏电镀有限公司 | A kind of one-side electroplating device |
| CN204356422U (en) * | 2014-12-24 | 2015-05-27 | 苏州道蒙恩电子科技有限公司 | Loudspeaker terminal electronickelling gold tin production line in a kind of portable computer |
| CN205171002U (en) * | 2015-12-10 | 2016-04-20 | 苏州道蒙恩电子科技有限公司 | Hang electrotinplate device |
| CN105839158A (en) * | 2016-05-19 | 2016-08-10 | 苏州市美能五金镀饰有限公司 | Continuous electroplating technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108330522A (en) * | 2018-01-30 | 2018-07-27 | 商丘金振源电子科技有限公司 | A kind of novel local electro-plating method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204356422U (en) | Loudspeaker terminal electronickelling gold tin production line in a kind of portable computer | |
| CN106714507B (en) | Middle framework and its production method | |
| CN106914727A (en) | Realize the method and device of the double gloss of metallic substrate surface | |
| CN105983815A (en) | Machining method for metal middle frame display screen holding position | |
| TW200723536A (en) | Method for manufacturing conductive copper lines on panel for display device | |
| AU2001284059A1 (en) | Method for electroplating a strip of foam | |
| CN106591902A (en) | Continuous partial gold, tin and nickel plating control system of thin material | |
| CN104023483A (en) | Gold finger three-surface plating method | |
| CN206359652U (en) | De-plating device | |
| CN106132137B (en) | A kind of processing method, housing and the mobile terminal of the empty regions of housing | |
| CN204138799U (en) | A kind of selection type galvanic anode water pocket | |
| CN105514079A (en) | Integrated circuit package structure and manufacturing technology thereof | |
| CN104294331A (en) | Pretreatment method of gravure copper plating | |
| CN104411094A (en) | FPC manufacture method | |
| CN204455338U (en) | For the electroplating clamp of printed circuit board (PCB) | |
| CN210420212U (en) | High-grade gold coating equipment is felt to matter | |
| CN201904328U (en) | Lead frame of integrated circuit | |
| CN102387669B (en) | Three-dimensional circuit component and manufacture method thereof | |
| CN202662585U (en) | Single-side acid soaking device for back metallization pretreatment of semiconductor chip | |
| CN105870100A (en) | Ultrathin packaging component and manufacturing technique thereof | |
| CN213638413U (en) | Electroplating structure of circuit board | |
| CN102163556B (en) | Method for electric-lead-free electroplating by adopting buried circuit substrate | |
| CN104010447A (en) | Method for manufacturing conductor circuit | |
| CN207766661U (en) | A kind of novel flexible circuit board structure | |
| CN202824324U (en) | Stamping die for removing sharp burr |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |