CN106583188A - Method for protecting welding spots - Google Patents
Method for protecting welding spots Download PDFInfo
- Publication number
- CN106583188A CN106583188A CN201710010465.9A CN201710010465A CN106583188A CN 106583188 A CN106583188 A CN 106583188A CN 201710010465 A CN201710010465 A CN 201710010465A CN 106583188 A CN106583188 A CN 106583188A
- Authority
- CN
- China
- Prior art keywords
- solder joint
- glue
- minutes
- welding spots
- uviol lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
Abstract
The invention provides a method for protecting welding spots. The method comprises the following steps: a plasma gun is used for cleaning the welding spots; a high-pressure pump sprays UV liquid glue onto the welding spots to isolate the welding spots from air; after gluing, an UV lamp is used for curing the liquid glue; finally, the ultraviolet lamp is used for detecting if the glue wraps the welding spots or not; and the glue can be uniformly distributed on the welding points to prevent the welding spots from being corroded.
Description
Technical field
The invention belongs to wire harness welding field, more particularly to a kind of method for protecting solder joint.
Background technology
Qualified solder joint is referred to：1) solder joint has enough mechanical strengths：Typically can be using by the lead end of weldering components and parts
The method that son is welded after bending again；2) weld reliable, it is ensured that electric conductivity；3) pad surface is neat, attractive in appearance：The outward appearance of solder joint should
It is smooth, cleaning, it is uniform, symmetrical, neat, attractive in appearance, full of whole pad and suitable with pad size.Meet above three bar
The solder joint of part, just solder joint qualified at last.During preventing solder joint use afterwards, by oxide etch, so that
Solder joint comes off, common practice be using heat-shrink tube protecting solder joint from oxide etch, but the heatproof degree of heat-shrink tube
Limited, the protection of meeting butt welding point is impacted, the serious security performance for affecting equipment.
The content of the invention
In view of this, in order to overcome the deficiencies in the prior art, the present invention to provide a kind of coating technique, fastness is strong, and
Can be uniformly distributed on solder joint, so as to protect solder joint from corrosion, improve the security performance of equipment.
In order to realize above-mentioned technical purpose, technical scheme is as follows：
A kind of method for protecting solder joint, comprises the following steps：
1) solder joint is cleaned with plasma gun；
2) UV liquid glues are ejected on solder joint with high-pressure pump, make solder joint and air insulated；
3), after gluing, liquid glue is solidified with UV lamp；
4) finally whether solder joint is wrapped with uviol lamp detection glue.
Further, implementing the step 1) before, the rust on solder joint is removed with hair-dryer.
Further, the step 1) in, the time of plasma gun cleaning solder joint is 30 minutes～60 minutes.
Further, the step 2) in, high-pressure pump is ejected into UV liquid glues on solder joint in three times, per 30 points of minor tick
Clock～60 minute.
Further, the step 3) in, it is 2 hours with the time that liquid glue is solidified by UV lamp.
Further, the step 4) in, when all purples of the color of uviol lamp detection solder joint, solder joint is wrapped.
Further, the step 4) in, when uviol lamp is purple with detecting the color interval of solder joint, it is repeated in step
2), step 3) and step 4).
Beneficial effects of the present invention are：Can be uniformly distributed on solder joint, so as to protect solder joint from corrosion.
1) rust on solder joint being removed with hair-dryer, can effectively removing the impurity on pad surface, butt welding point surface is entered
Row pretreatment, it is simple to operate, practical.
2) solder joint is cleaned with plasma gun, pad surface can be cleaned again, be conducive to UV liquid to be uniformly distributed；
3) finally solder joint whether is wrapped with uviol lamp detection glue, introducing uviol lamp detection being capable of effective butt welding point table
The cladding degree in face is detected, and the method for uviol lamp detection is easily operated.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, with reference to embodiment, to the present invention
It is further elaborated.It should be appreciated that specific embodiment described herein is not used to limit only to explain the present invention
The fixed present invention.
Embodiment 1
A kind of method for protecting solder joint, comprises the following steps：
1) rust on solder joint is removed with hair-dryer, then solder joint is cleaned with plasma gun 30 minutes；
2) in three times UV liquid glues are ejected on solder joint with high-pressure pump, every minor tick 30 minutes makes solder joint and air
Isolation；
3) after gluing, liquid glue is solidified with UV lamp, wherein hardening time is 2 hours；
4) finally whether solder joint is wrapped with uviol lamp detection glue.
When all purples of the color of uviol lamp detection solder joint, solder joint is wrapped.
When uviol lamp detect solder joint color interval for purple when, be repeated in step 2), step 3) and step 4).
Embodiment 2
A kind of method for protecting solder joint, comprises the following steps：
1) rust on solder joint is removed with hair-dryer, then solder joint is cleaned with plasma gun 45 minutes；
2) in three times UV liquid glues are ejected on solder joint with high-pressure pump, every minor tick 45 minutes makes solder joint and air
Isolation；
3) after gluing, liquid glue is solidified with UV lamp, wherein hardening time is 2 hours；
4) finally whether solder joint is wrapped with uviol lamp detection glue.
When all purples of the color of uviol lamp detection solder joint, solder joint is wrapped.
When uviol lamp detect solder joint color interval for purple when, be repeated in step 2), step 3) and step 4).
Embodiment 3
A kind of method for protecting solder joint, comprises the following steps：
1) rust on solder joint is removed with hair-dryer, then solder joint is cleaned with plasma gun 60 minutes；
2) in three times UV liquid glues are ejected on solder joint with high-pressure pump, every minor tick 60 minutes makes solder joint and air
Isolation；
3) after gluing, liquid glue is solidified with UV lamp, wherein hardening time is 2 hours；
4) finally whether solder joint is wrapped with uviol lamp detection glue.
When all purples of the color of uviol lamp detection solder joint, solder joint is wrapped.
When uviol lamp detect solder joint color interval for purple when, be repeated in step 2), step 3) and step 4).
Embodiment described above only expresses embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore it is interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection model of the present invention
Enclose.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (7)
1. a kind of method for protecting solder joint, it is characterised in that comprise the following steps：
1) solder joint is cleaned with plasma gun；
2) UV liquid glues are ejected on solder joint with high-pressure pump, make solder joint and air insulated；
3), after gluing, liquid glue is solidified with UV lamp；
4) finally whether solder joint is wrapped with uviol lamp detection glue.
2. method according to claim 1, it is characterised in that：Implementing the step 1) before, removed with hair-dryer and welded
Rust on point.
3. method according to claim 1, it is characterised in that：The step 1) in, plasma gun cleans the time of solder joint
For 30 minutes～60 minutes.
4. method according to claim 1, it is characterised in that：The step 2) in, high-pressure pump is in three times UV liquid glues
Water is ejected on solder joint, every minor tick 30 minutes～60 minutes.
5. method according to claim 1, it is characterised in that：The step 3) in, with UV lamp liquid glue solidified
Time is 2 hours.
6. method according to claim 1, it is characterised in that：The step 4) in, when uviol lamp detects the color of solder joint
During all purples, solder joint is wrapped.
7. method according to claim 1, it is characterised in that：The step 4) in, when uviol lamp detects the color of solder joint
Compartment of terrain be purple when, be repeated in step 2), step 3) and step 4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710010465.9A CN106583188A (en) | 2017-01-06 | 2017-01-06 | Method for protecting welding spots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710010465.9A CN106583188A (en) | 2017-01-06 | 2017-01-06 | Method for protecting welding spots |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106583188A true CN106583188A (en) | 2017-04-26 |
Family
ID=58582532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710010465.9A Pending CN106583188A (en) | 2017-01-06 | 2017-01-06 | Method for protecting welding spots |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106583188A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407428A (en) * | 2018-12-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Display device |
| CN115502597A (en) * | 2022-09-14 | 2022-12-23 | 郑永柱 | Laser tin ball welding method for FPCB (flexible printed circuit board), PCB (printed circuit board) and semiconductor product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201906667U (en) * | 2010-12-28 | 2011-07-27 | 上海稳健医疗器械有限公司 | Static glue spraying device for self-adhesive bandages |
| CN203814059U (en) * | 2014-03-05 | 2014-09-03 | 惠州市和宏电线电缆有限公司 | Drying device |
| CN105478415A (en) * | 2015-12-30 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Full-automatic surface treatment machine |
-
2017
- 2017-01-06 CN CN201710010465.9A patent/CN106583188A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201906667U (en) * | 2010-12-28 | 2011-07-27 | 上海稳健医疗器械有限公司 | Static glue spraying device for self-adhesive bandages |
| CN203814059U (en) * | 2014-03-05 | 2014-09-03 | 惠州市和宏电线电缆有限公司 | Drying device |
| CN105478415A (en) * | 2015-12-30 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Full-automatic surface treatment machine |
Non-Patent Citations (1)
| Title |
|---|
| 潘桂忠: "《MOS集成电路工艺与制造技术》", 30 June 2012, 上海科学技术出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407428A (en) * | 2018-12-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Display device |
| WO2020133812A1 (en) * | 2018-12-29 | 2020-07-02 | 武汉华星光电技术有限公司 | Display device |
| CN115502597A (en) * | 2022-09-14 | 2022-12-23 | 郑永柱 | Laser tin ball welding method for FPCB (flexible printed circuit board), PCB (printed circuit board) and semiconductor product |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |