CN106570290A - Hierarchical structure construction method for hybrid integrated circuit reliability index evaluation - Google Patents
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Abstract
A hierarchical structure construction method for hybrid integrated circuit reliability index evaluation is as follows: first, determining a target layer of a hybrid integrated circuit reliability evaluation hierarchy, second, determining a criterion layer of the hybrid integrated circuit reliability evaluation hierarchy, and third, determining a key element layer of the hybrid integrated circuit reliability evaluation hierarchical structure. Through the above steps, making evaluation to a specific type of hybrid integrated circuit is no longer unable to start or judgment to the evaluation on the whole can prevented; specific evaluation can be made from multiple angles, at multi-level and from multi-detail aspects; more complete and reasonable grasp of the evaluation can be realized; and a problem of hybrid integrated circuit reliability index evaluation can be solved. The structural modeling thought and element classification thought of the work breakdown structure of the hierarchical structure construction method for hybrid integrated circuit can conduct hierarchical construction to a certain type of DC/DC power supply module.
Description
First, technical field：
The present invention provides a kind of hierarchical structure construction method evaluated for hydrid integrated circuit reliability index, and it is one
The method that hydrid integrated circuit multiple information is extracted and hierarchical structure builds is planted, it is related to a kind of layer of DC-DC power module
Secondary structure construction method.It combines the structural model thought in analytic hierarchy process (AHP) (i.e. AHP) and work breakdown structure (WBS) (i.e. WBS)
Element category thought, DC-DC power module reliability evaluation work in, each key element to affecting the index carries out layer
Secondary decomposition and classification, to follow-up quantum chemical method process reference role is played, and belongs to the reliability evaluation field of electronic devices and components.
2nd, background technology：
In recent years, with the military science and technology in various countries and the fast development of weaponry etc., not only to the demand of electronic devices and components
It is increasing, to its reliability requirement also more and more higher.Hydrid integrated circuit with its electronic devices and components parameter area width, precision and
Stability is high, circuit design flexibility is big, development and production cycle is short the features such as be widely used in electronic equipment.For electronics unit device
Whether part is available and reliable, often makes a concrete analysis of in light of the circumstances：Such as airborne circumstance, trip temperature is entered to components and parts
The proving tests such as shock and vibration, temperature cycles.But there are the electronic devices and components of various functions on hydrid integrated circuit simultaneously
There are different electrical interconnections, the components and parts not very clear understanding of the impact to whole system should without excessive reality
With experience, just for application conditions and environment it cannot be guaranteed that components and parts are available and reliable.If to whole hydrid integrated circuit
Reliability do not know about, once going wrong, the loss for causing can not be estimated, thus study hydrid integrated circuit reliability
Evaluation is necessary and necessary.
DC-DC power module is a kind of to be widely used in opening for the military field such as Aeronautics and Astronautics and carrier-borne weaponry
Powered-down source circuit, belongs to one kind of hydrid integrated circuit, excellent with small volume, light weight, power density height, conversion efficiency height etc.
Point.The module is actually also the Complex Electronic Systems Based of a high integration, inside comprising integrated circuit, resistance, electric capacity, partly lead
A large amount of electronic devices and components such as body discrete device, transformator, inducer, its process for making is also extremely complex.Its development and production
How is the technology essential factor Maturity such as designing technique, packaging technology, material, the components and parts that process is adopted, and will directly affect it in force
Application in device equipment.
For the reliability index evaluation of hydrid integrated circuit, it is most basic be also a most important step be to set up suitable clear
Hierarchical structure, and the accurate foundation of hierarchical structure, effective decomposition depending on each influent factor for treating evaluation objective and
Sort out, rationally comprehensively treat evaluation objective hierarchically carries out analytic induction with key element.
Therefore, the present invention launches research for the DC-DC power module of a certain style number, and binding hierarchy analytic process is (i.e.
The element category thought of structural model thought and work breakdown structure (WBS) (i.e. WBS) in AHP), to affecting its reliability index
Each key element carries out hierachical decomposition and classification, ultimately forms a set of hierarchical structure construction method suitable for hydrid integrated circuit,
Reliable foundation is provided for quantitative analysis of Reliability.
3rd, the content of the invention：
1st, purpose：It is an object of the invention to provide providing a kind of level evaluated for hydrid integrated circuit reliability index
The method that structure construction method, i.e. hydrid integrated circuit multiple information are extracted and hierarchical structure builds, it is combined with level
The element category thought of structural model thought and work breakdown structure (WBS) (i.e. WBS) in analytic process (i.e. AHP), forms a set of being directed to
The hierarchical structure construction method that hydrid integrated circuit reliability index is evaluated, and the layer using the method to DC-DC power module
Secondary structure is accurately set up.
2nd, technical scheme：
The present invention is achieved by the following technical solutions：
Whole hierarchical structure is divided into destination layer, rule layer and pass by the method based on the basic structure of analytic hierarchy process (AHP)
Key key element layer.Three levels are in pyramid structure, and destination layer occupy top, and the target of decision-making is finally treated in representative；Rule layer
It is then the multiple standards or factor for affecting target, generally there are several；Orlop is then to the further concrete thin of each criterion
It is divided into key element.Belong to total score relation between destination layer, rule layer and key element layer.
A kind of hierarchical structure construction method evaluated for hydrid integrated circuit reliability index of the present invention, its step is such as
Under：
Step one：Determine the destination layer of hydrid integrated circuit reliability evaluation hierarchical structure；Here, destination layer is exactly to treat
Evaluate the reliability index of hydrid integrated circuit；
Step 2：Determine the rule layer of hydrid integrated circuit reliability evaluation hierarchical structure；Rule layer mainly affects mesh
The factor of the various aspects of mark layer, including function, design, manufacturing process, material, environment, encapsulation and logistics, such as scheme
Shown in 1；These aspects cover the hydrid integrated circuit Life cycle for using from design production to manufacture and afterwards, base
Originally each aspect can be comprehensively related to；
Step 3：Determine the key element layer of hydrid integrated circuit reliability evaluation hierarchical structure；The group of key element layer
Into, each criterion of then layer is in alignment with, further subdivision, obtains the concrete alternative of the criterion；If some key elements
Also need to further clearly divide, then new one layer can be properly joined into；
Functions are broadly divided into three key elements, are respectively electrical characteristic, frequency characteristic and temperature characterisitic, such as Fig. 2
It is shown.
The representative element of electrical characteristic can be divided into digital signal, analogue signal, voltage and power consumption again；
For the voltage key element in electrical characteristic, voltage range and voltage stability can be further subdivided into again；
The representative element of frequency characteristic can be divided into noise, time parameter, bandwidth and ripple again；
Design criteria is broadly divided into two key elements, is respectively that the selection of built-in components and parts and global reliability are designed,
As shown in Figure 3.
The selection of built-in components and parts again can be according to from type, requirement on electric performance, Technological adaptability, selection standard and matter
Four aspects of amount are further segmented.
Can be divided into active device, passive device and monolithic integrated optical circuit from type；
Can the main requirement on electric performance of requirement on electric performance pays close attention to components and parts unit for electrical property parameters rated value meet the HIC limit
Design and the requirement of design of Reducing Rating.
Technological adaptability mainly considers from two dimensions of component structure form and components and parts volume；
Selection standard is broadly divided into QRL and QPL；
The judgement of component quality then from whether by stable state experiment of high-temperature load, whether by seasoned screening test, be
It is no by Destructive Physical Analysis test, whether have risk out of stock etc. several from the aspect of.
Global reliability design mainly carries out reducing complexity and power consumption from function aspects, implements layout size, function
The reliability design of the aspect such as tolerance and nargin, heat distribution and radiating, wiring and necessary protection, can to eliminate and control it
The temporal pattern that can occur, makes product function obtain relatively stable result with the stipulated time under prescribed conditions.Therefore from
The angle sorting of function, can by global reliability design be divided into simplify design, Redundancy Design, low power dissipation design, design of Reducing Rating,
Thermal design and margin design.Reliability design in terms of environmental suitability is broadly divided into resistance to Environment Design, electromagnetic compatibility and sets
Meter, antinoise design, radioprotective design, antistatic design and the design of anti-transient state.
Especially, for design of Reducing Rating, I, II, III level drop volume can be divided into according to derating level again；
Thermal design can according to manufacture and design link and using link continue segment；
According to link is manufactured and designed, it is divided into thermally matched design and reduces the aspect of thermal resistance two；
According to process is used, then installation and the layout scenarios of which kind of radiating mode and whole circuit can be considered as.
Resistance to Environment Design can be divided into three portions according to resistance to mechanics Environment Design, high temperature resistant Environment Design and " three prevent " design
Point.
Resistance to mechanics Environment Design can be divided into disappear source design and Aseismic Design again.
" three prevent " design is then divided into moisture proof, Defend salt fog, mould proof three aspects.
EMC Design is from from the aspect of shielding design, filter design and grounding design three.
Radioprotective design can be subdivided into radioprotective situation in anti-tatal ionizing dose effects, anti-single particle effect and application.
Anti- tatal ionizing dose effects can be according to whether being designed reinforcing, whether carry out technique reinforcing and whether carry out material
Expect reinforcing to judge.
Anti-single particle effect can judge according to whether feedback circuit and SOI technology reinforcing is increased.
Whether radioprotective situation can be divided into using in carries out shielding Design of Reinforcement, whether carries out redundancy Design of Reinforcement, whether
Carry out anti-single particle locking design and whether there are four aspects such as watchdog circuit design.
Antistatic design generally from production design link and using link two in terms of analyzing.
Whether the antistatic design of production design link is largely divided into network protection, device protection and has antistatic packaging to hold
Device.
Then mainly consider antistatic equipment and facility using the antistatic design of link.
Anti- transient state design considers in terms of six, is respectively overvoltage crowbar, current foldback circuit, short-circuit protection electricity
Road, overheating protection circuit, under-voltage protecting circuit and protective circuit of voltage regulation.
Process criteria is broadly divided into five passes such as packaging technology, technique for sticking, bonding technology, welding procedure and packaging technology
Key key element, as shown in Figure 4.
The packaging technology of hydrid integrated circuit is broadly divided into HIC package techniques, MCM package techniques, SOC package techniques, SOP
Package technique and SiP package techniques.
Wherein HIC package techniques can be taken into account according to thick film, thin film and thick film and be divided into thick film HIC, thin film HIC, thickness again
Thin film HIC.Thick film HIC makes conductor, resistance using thick-film techniques such as silk screen printing, sintering, on ceramic substrate, and same
Substrate over-assemble discrete device chip or monolithic integrated circuit chip or other microchips, are then packaged to form mixing collection
Into circuit.Thin-film technique is then that conductor, electricity are made on silicon chip, glass or ceramic substrate using vacuum evaporation or sputtering technology
Resistance, and discrete device chip or monolithic integrated circuit chip or other microchips are assembled on the same substrate, then sealed
Dress forms hydrid integrated circuit.
MCM package techniques are called multi-chip module package technique.It uses high-density multi-layered interconnection substrate, and interlayer is by through hole
It is connected, the multiple IC bare chips of pole plate over-assemble, through being encapsulated into a high density, multi-functional electronic building brick.According to its base
The manufacturing technology of plate, can be divided into the class of MCM-L, MCM-C, MCM-D, MCM-C/D, MCM-L/D etc. five.
The technique for sticking of hydrid integrated circuit can be divided into insulating cement bonding, conductive adhesive according to the difference of adhesivess
With solder bonding.
The bonding technology of hydrid integrated circuit can be from technology mode, the three angle classification of speciation and bonding time.
Technology mode can be divided into thermocompression bonding, ultrasonic bond, thermoacoustic weldering, ultrasonic-thermocompression welding and flip-chip welding.
Speciation is broadly divided into two kinds：Spherical weldering and wedge shape weldering.
Bonding parameter aspect is divided into lead radian, bond strength and bonding time.
The welding procedure of hydrid integrated circuit can be divided into manual welding technology and automatic welding technique.
Manual welding technology can be subdivided into Reflow Soldering, gas phase weldering, wave-soldering, immersed solder, remelting weldering again.
The packaging technology of hydrid integrated circuit can be divided into cartridge-type encapsulation and surface installing type encapsulation.
Material criterion is mainly classified in terms of encapsulating material, baseplate material, lead material three, as shown in Figure 5.
Encapsulating material can be divided into glass-encapsulated, Metal Packaging, ceramic package, Plastic Package, perfusion encapsulation.
Baseplate material can be divided into ceramic substrate, crystallite glass substrate, silicon substrate and printed circuit board (PCB).
Lead material can further be segmented according to outer lead, lead and lead frame.
Outer lead material is divided into golden film and aluminium film.
Lead material is divided into gold thread, aluminum steel and copper cash.
Blaster fuse frame material is divided into copper, kovar alloy, aluminum.
Environmental suitability criterion mainly considers storage environment and the adaptability under use environment, as shown in Figure 6.
Adaptability under storage environment is broadly divided into protection against the tide, anti-corrosion, antirust, anti-aging, antistatic.
Adaptability under use environment be broadly divided into temperature shock, temperature cycles, random vibration, mechanical vibration, low pressure,
Space radiation etc..
Components and parts Denso criterion can be from from the aspect of Denso characteristic and Denso technology two, as shown in Figure 7.
Denso characteristic is divided into lead quality of coating, mark, size, volume, weight.
Denso technology is divided into surface mounting technique and through hole mount technology.
Long-term reliability ensures that the key element under criterion can be divided into one between life-span, Development Schedule, system compatibility, batch
Cause property, key parameter concordance, the production quality certification, components and parts handbook, components and parts technical specification, such as components and parts technical data, Fig. 8
It is shown.
The production quality certification again can be from components and parts classification, title, model specification, quantity, production unit, date of manufacture, matter
The aspect subdivisions such as amount grade, batch, screening requirement.
Components and parts handbook can be applied, note thing from regulation parameter, regulation performance, regulation environment, stipulated time, typical case
The aspects such as item, safeguard procedures are segmented.
Components and parts technical data can from technical specification, Specifeca tion speeification, quality assurance grade, operating temperature range,
The aspect subdivision such as generic specification and execution standard, failure and analysis information.
Wherein, " determining the destination layer of hydrid integrated circuit reliability evaluation hierarchical structure " described in step one, its
The concrete practice is as follows：The hydrid integrated circuit function type and concrete model of setting needs assessment, and set needs assessment can
By property index, such as technology maturity, availability, protection etc., as the concrete meaning of destination layer；
Wherein, " determining the rule layer of hydrid integrated circuit reliability evaluation hierarchical structure " described in step 2, its
The concrete practice is as follows：From the design production link of the target up to working service link, each side factor to affecting destination layer
Comprehensive analysis, screening are carried out, influence factor is divided into into some big class, as the concrete meaning of rule layer；
Wherein, " key element of hydrid integrated circuit reliability evaluation hierarchical structure is determined described in step 3
Layer ", its concrete practice is as follows：Each criterion to rule layer, from more specific technical approach method, index parameter, spy
Property etc. aspect subdivision, as affect each criterion key element；
By above step so that for the evaluation of the concrete hydrid integrated circuit of a certain class is no longer to have no way of doing it or only
It is to make a decision to overall, but can be from multi-angle, at many levels, many details aspects make respectively concrete evaluation, more completely simultaneously
Evaluation procedure is reasonably held, the reliability index evaluation problem of mixing complicated circuit is solved.
3rd, advantage and effect
The present invention provides a kind of hierarchical structure construction method of DC-DC power module, in binding hierarchy analytic process (i.e. AHP)
Structural model thought and work breakdown structure (WBS) (i.e. WBS) element category thought, to affect its reliability index each will
Element carries out hierachical decomposition and classification, can help to set up suitable clearly hierarchical structure, and the accurate foundation of hierarchical structure, after being
The continuous development basis that accurately and effectively analysis of Reliability is calculated, is indispensable in whole reliability index evaluation procedure
Important step.
In the hierarchical structure of ongoing certain type DC-DC power module builds, according to hydrid integrated circuit hierarchical structure,
Specificity factor analysis is carried out to the type DC-DC power module and is considered, criterion and key element are selectively accepted or rejected, be allowed to
Meet actual manufacture and the service condition of the type DC-DC power module.Level builds result and shows, based on hydrid integrated circuit
Hierarchical structure and key element are decomposed can preferably be applied to the type DC-DC power module.Therefore, the present invention provide based on level
The hybrid integrated electricity of the element category thought of structural model thought and work breakdown structure (WBS) (i.e. WBS) in analytic process (i.e. AHP)
Road level construction method can carry out level structure to certain type DC-DC power module.
4th, illustrate
(1) Fig. 1 is destination layer and rule layer structured flowchart.
(2) Fig. 2 is the minor structure block diagram under functions.
(3) Fig. 3 is the minor structure block diagram under design criteria, due to structure of block diagram complexity, therefore is divided into A, tri- parts of B, C.A
Part is design criteria and its key element structure chart, and B, C portion are respectively the subdivision minor structure block diagram under key element.
(4) Fig. 4 is the minor structure block diagram under process criteria.
(5) Fig. 5 is the minor structure block diagram under material criterion.
(6) Fig. 6 is the minor structure block diagram under environmental suitability criterion.
(7) Fig. 7 is the minor structure block diagram under Denso criterion.
(8) Fig. 8 is the minor structure block diagram under long-term reliability criterion.
(9) Fig. 9 is the method for the invention flow chart.
Specific embodiment
The DC-DC power module that the present invention is selected is a highly reliable HVSA28S5 type DC-DC converters, adopts and recommends
Formula structure, can work under 28V input voltages, and peak power is 45W, and the circuit case is metal all-sealed structure, without
Fixing end, using single layer thick film substrate, is not used chip package technique and multilayer wiring technique, due to insufficient space, the circuit
Employ element stitch welding technique, the circuit passes through the technique that aluminium flake is welded on substrate, it is to avoid in wire bonding on aluminum steel
Gold-aluminium bonding point, with reference to specific real case, comments one kind of the present invention for hydrid integrated circuit reliability index
The hierarchical structure construction method of valency, i.e., a kind of multiple information suitable for hydrid integrated circuit is extracted and hierarchical structure builds
Method, as shown in Figure 9, its specific implementation step is as follows：
Step one：The type DC-DC power module function type and concrete model are set, and sets the reliability of needs assessment
Index, such as technology maturity, availability, protection etc., as the concrete meaning of destination layer, determine the type DC-DC power source mould
The destination layer of the reliability evaluation hierarchical structure of block.Here, destination layer is exactly the reliability of the type DC-DC power module to be evaluated
Property index；
Step 2：From the design production link of the target up to working service link, to affect each side of destination layer because
Element carries out comprehensive analysis, screening, and influence factor is divided into into some big class, as the concrete meaning of rule layer, determines type DC-DC
The rule layer of the reliability evaluation hierarchical structure of power module.DC-DC power module belongs to typical hybrid integrated circuit classification, mixes
Close each rule layer in integrated circuit layer time structure and be still applied to the type DC-DC power module.Therefore, by type DC-DC
It is accurate that the rule layer of power module is divided into functions, design criteria, process criteria, material criterion, environmental suitability criterion, Denso
Then and seven criterions such as long-term reliability criterion, as shown in Figure 1；
Step 3：Each criterion to rule layer, from more specific technical approach method, index parameter, characteristic etc.
Aspect subdivision, as the key element for affecting each criterion, determines the type DC-DC power module reliability evaluation hierarchical structure
Key element layer.
The type DC-DC power module belongs to typical hybrid integrated circuit, therefore does not exist under functions and it is critical to
The disappearance of element, can be divided into electrical characteristic, three key elements of frequency characteristic and temperature characterisitic, as shown in Figure 2.
The representative element of electrical characteristic can be divided into digital signal, analogue signal, voltage and power consumption again；
For the voltage key element in electrical characteristic, voltage range and voltage stability can be further subdivided into again.
The representative element of frequency characteristic can be divided into noise, time parameter, bandwidth and ripple again.
Design criteria is broadly divided into two key elements, is respectively that the selection of built-in components and parts and global reliability are designed,
As shown in Figure 3.
The selection of built-in components and parts again can be according to from type, Technological adaptability, four aspects of selection standard and quality
Further subdivision.
Can be divided into active device, passive device and monolithic integrated optical circuit from type；
Technological adaptability mainly considers from two dimensions of component structure form and components and parts volume；
Selection standard is broadly divided into QRL and QPL；
The judgement of component quality then from whether by stable state experiment of high-temperature load, whether by seasoned screening test, be
It is no to test, whether have from the aspect of risk out of stock etc. by Destructive Physical Analysis.
DC-DC power module reliability design is divided into and simplifies design, Redundancy Design, low power dissipation design, design of Reducing Rating, heat and set
Meter and margin design.Reliability design in terms of environmental suitability is broadly divided into resistance to Environment Design, EMC Design, prevents
Noise Design, antistatic design and the design of anti-transient state.Because the use environment of DC-DC power module is mostly the common ring in ground
Border, therefore radioprotective design can be deleted from design considerations.The subdivision considerations of every kind of design subordinate all collect with mixing
Considerations into circuit keep identical.
Process criteria is broadly divided into five passes such as packaging technology, technique for sticking, bonding technology, welding procedure and packaging technology
Key key element, as shown in Figure 4.
According to the detail specification of HVSA28S5 type DC-DC power modules, the type DC-DC power module uses thick film and mixes
Close integrated technique and MCM package techniques.Therefore HIC techniques and MCM package techniques are retained under packaging technology key element.
The technique for sticking that the type DC-DC power module is adopted is onductive adhesive technology.
The lead key closing process that the type DC-DC power module is adopted includes thermocompression bonding and ultrasonic bond, and speciation includes ball
Shape is welded and wedge type weldering, and bonding parameter aspect is divided into lead radian, bond strength and bonding time.
The welding procedure that the type DC-DC power module is adopted is automatic welding technique.
Material criterion is mainly classified in terms of encapsulating material, baseplate material, lead material three, as shown in Figure 5.
The encapsulating material of the type DC-DC power module is metal.
The baseplate material of the type DC-DC power module is printed circuit board (PCB).
The lead material of the type DC-DC power module can further be segmented according to outer lead, lead and lead frame.
Outer lead material is mainly golden film and aluminium film.
Lead material is mainly gold thread, aluminum steel.
Blaster fuse frame material is mainly copper.
Environmental suitability criterion mainly considers storage environment and the adaptability under use environment, as shown in Figure 6.
Adaptability under storage environment is broadly divided into protection against the tide, anti-corrosion, antirust, anti-aging, antistatic.
Adaptability under use environment is broadly divided into temperature shock, temperature cycles, random vibration, mechanical vibration.Low pressure
Both use environments can have selection to delete with space radiation.
Denso criterion mainly considers Denso characteristic and Denso technology, as shown in Figure 7.
The type DC-DC power module Denso characteristic is divided into lead quality of coating, mark, size, volume, weight.
The Denso technology of the type DC-DC power module is through hole mount technology.
Long-term reliability ensures that the key element under criterion can be divided into one between life-span, Development Schedule, system compatibility, batch
Cause property, key parameter concordance, the production quality certification, components and parts handbook, components and parts technical specification, components and parts technical data.Its tool
Body subdivision key element is identical with hydrid integrated circuit dividing mode, as shown in Figure 8.
Claims (4)
1. it is a kind of for hydrid integrated circuit reliability index evaluate hierarchical structure construction method, it is characterised in that：Its step
It is as follows：
Step one：Determine the destination layer of hydrid integrated circuit reliability evaluation hierarchical structure；Here, destination layer is exactly to be evaluated
The reliability index of hydrid integrated circuit；
Step 2：Determine the rule layer of hydrid integrated circuit reliability evaluation hierarchical structure；Rule layer is each of impact destination layer
The factor of individual aspect, including function, design, manufacturing process, material, environment, encapsulation and logistics；These aspects are covered
The Life cycle that use of the hydrid integrated circuit from design production to manufacture and afterwards, can comprehensively be related to each side
Face；
Step 3：Determine the key element layer of hydrid integrated circuit reliability evaluation hierarchical structure；The composition of key element layer, be
Each criterion to rule layer, further subdivision, obtains the concrete alternative of the criterion；If some key elements are also needed to
Further clearly divide, then add new one layer；
By above step so that for the evaluation of the concrete hydrid integrated circuit of a certain class is had no way of doing it and simply to whole
Body makes a decision, but can be from multi-angle, at many levels, and many details aspects make respectively concrete evaluation, more complete and reasonably
Evaluation procedure is held, the reliability index evaluation problem of mixing complicated circuit is solved.
2. it is according to claim 1 it is a kind of for hydrid integrated circuit reliability index evaluate hierarchical structure structure side
Method, it is characterised in that：" determining the destination layer of hydrid integrated circuit reliability evaluation hierarchical structure " described in step one, its
The concrete practice is as follows：The hydrid integrated circuit function type and concrete model of setting needs assessment, and set needs assessment can
By property index, as the concrete meaning of destination layer.
3. it is according to claim 1 it is a kind of for hydrid integrated circuit reliability index evaluate hierarchical structure structure side
Method, it is characterised in that：" determining the rule layer of hydrid integrated circuit reliability evaluation hierarchical structure " described in step 2, its
The concrete practice is as follows：From the design production link of the target up to working service link, each side factor to affecting destination layer
Comprehensive analysis, screening are carried out, influence factor is divided into into each big class, as the concrete meaning of rule layer.
4. it is according to claim 1 it is a kind of for hydrid integrated circuit reliability index evaluate hierarchical structure structure side
Method, it is characterised in that：" determine the key element of hydrid integrated circuit reliability evaluation hierarchical structure described in step 3
Layer ", its concrete practice is as follows：Each criterion to rule layer, from more specific technical approach method, index parameter, spy
Property each side subdivision, as affect each criterion key element.
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| CN107861001A (en) * | 2017-11-02 | 2018-03-30 | 国网重庆市电力公司电力科学研究院 | Intelligent substation closes the capacitor method for evaluating reliability of intelligence integrated device, system |
| CN109117535A (en) * | 2018-07-31 | 2019-01-01 | 北京航空航天大学 | A kind of estimated modification method of the IC reliability based on process factor |
| CN109255148A (en) * | 2018-07-27 | 2019-01-22 | 石家庄创天电子科技有限公司 | Mechanics product design method and its system |
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| US20020049571A1 (en) * | 2000-05-25 | 2002-04-25 | Dinesh Verma | Supportability evaluation of system architectures |
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| CN106022616A (en) * | 2016-05-23 | 2016-10-12 | 北京航空航天大学 | Evaluation method for technical maturity of DC-DC power supply module |
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