CN104794282B - A kind of electromagnetic compatibility reliability estimation method of avionic unit power module - Google Patents
A kind of electromagnetic compatibility reliability estimation method of avionic unit power module Download PDFInfo
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Abstract
A kind of electromagnetic compatibility reliability of the power module of avionic unit (Electromagnetic Reliability, EMR) appraisal procedure, this method has five big steps：Information；Simulation analysis；Hard fault EMR is assessed；Accumulative failure EMR is assessed；Comprehensive EMR is assessed.The present invention is the angle from failure mechanism, study the mechanism of action of galvanomagnetic-effect, and utilize emulation technology, with reference to the method for Stress strength interference (SSI) model and probability faulty physical (PPoF), detailed research is expanded for the related reliability of avionic unit power module electromagnetic compatibility, propose a set of based on simulation analysis, the method for assessing avionic unit electromagnetic compatibility reliability, enable a designer to the EMR levels in the design phase just to product to get information about, so as to provide reference frame for the design improvement of product.
Description
Technical field
The present invention provides a set of based on emulation, assesses the power module electromagnetic compatibility reliability of avionic unit
The method of (Electromagnetic Reliability, EMR), belongs to product reliability field.
Background technology
Electrified to be improved constantly with automatization level with the arrival of information age, electronic product is to miniaturization, integrated
Change, high-power, high frequency, high speed, highly sensitive direction are developed, and the electromagnetic environment around us becomes increasingly complex.These electronics
Equipment is all outwardly launching various useful or useless electromagnetic wave, and the normal work to other electronic equipments produces interference.
As current main, most flexible electronic countermeasure platform, the type and quantity of avionic unit are growing day by day, the electricity of occupancy
Magnetic frequency spectrum is more and more wider, and transmission power is also increasing, sensitivity requirement more and more higher, and airborne platform space is limited in addition, shape
Into complicated and severe external electromagnetic environment；On the other hand, the function of avionic unit is enriched increasingly, internal microelectronics member
Device and circuit increase, and trace width is more and more narrow, and along with signal frequency is uprushed, edge is also more and more precipitous, just constitute again
Severe inside electromagnetic environment.The electromagnetic environment disturbed outside this domestic trouble makes the electromagnetic compatibility problem of avionic unit increasingly
It is prominent.
At present, electromagnetic compatibility problem receives the attention of world community, and the U.S., Germany, Japan and other countries are in electromagnetic compatibility
Research and application field have reached higher level.In theory, various accurate and approximation algorithms are proposed, and are embedded into business
In industry software part, supercomputing emulation is carried out using computer；In engineering, not only from circuit, structure, technique and installation etc. each
Angle proposes elimination and weakens the measure of electromagnetic interference, has also formulated Specification.
But traditional product design is in accordance with the rich experiences of engineer, and function is carried out using instruments such as oscillographs
Checking, is then only sent to professional electromagnetic compatibility test mechanism for EMC test, spends cost high, the R＆D cycle
It is long, and it is not suitable for the research and development of new product.As a rule, whether emc testing report can only provide product by test
Conclusion, it is impossible to see clearly problem producing cause, can only by technical staff experience come solve occur electromagnetic compatibility problem, tool
There is certain blindness, it is higher to personnel's technical requirements, and waste time and energy.Therefore, product design personnel begin to focus on modeling and imitated
Very, potential electromagnetic compatibility mal function, time update product design can be just predicted in the design phase.
Generally speaking, though the Electro Magnetic Compatibility of avionic unit is progressively taken seriously, electromagnetic compatibility common at present
Property assess, often by emulation or test etc. method find failure occur position, it is impossible to clearly provide reliability index value.
The content of the invention
The electromagnetic Compatibility Design and optimization important references as electronic installation can not be clearly provided for prior art
The shortcoming of EMR desired values, it is an object of the invention to provide the electromagnetic compatibility of the power module of a set of assessment avionic unit
The method of reliability, specifically, based on Emulation of EMC technology, and by SSI (Stress Strength Interference
Stress-strength interference) involvement of theoretical and PPoF (Probability Physics of Failure probability faulty physical) method
To galvanomagnetic-effect analysis in, and then obtain avionic unit electromagnetism accumulated damage EMR indexs, establish electromagnetic stress with can
By the quantitative relationship between property index, the EMR levels directly perceived for holding product, electromagnetic Compatibility Design and optimization for product provide ginseng
Examine foundation.
The appraisal procedure of the electromagnetic compatibility reliability of the avionic unit power module of the present invention, it is characterised in that including
Following steps：
Step one：Information, including：
A. power module hardware and operating condition information are collected；
B. set up the power module fault message matrix related to electromagnetic compatibility, fault message matrix include failure mechanism and
Corresponding physics model of failure；
C. select time before failure most short failure mechanism as main failure mechanism from fault message matrix, obtain its right
The master answered
Physics model of failure；
D. the determination characteristic parameter related to electric field radiation and main failure mechanism and distribution；
Step 2：The simulation analysis of power module electromagnetic compatibility, including following sub-step：
A. the hardware and operating condition information collected according to step one, set up the simulation model of power module；
B. the target cabling to be analyzed in the simulation model is selected, analysis setting is carried out to it；
C. the emulation that signal integrity, Power Integrity, magnetic distribution and far-field radiation are carried out to power module is solved；
Step 3：Hard fault electromagnetic compatibility reliability assessment, including following sub-step：
A. the characteristic parameter determined in step one is distributed according to it and carries out Monte Carlo sampling；
B. the simulation model that will be set up in the characteristic parameter data from the sample survey input step two of acquisition, is obtained through repeatedly calculating
Multiple maximum field intensity levels on multiple frequencies, and fit its distribution；
C. using the maximum field intensity distribution on multiple frequencies as the stress distribution in SSI models, by national regulations
Limit of electric field strength carries out Reliability Solution, and draw out frequency-reliability curves figure as the intensity of SSI models；
D. it is reliable according to the hard fault electromagnetic compatibility under the conditions of frequency-reliability curves figure acquisition power module working frequency
Angle value；
Step 4：Accumulated damage electromagnetic compatibility reliability assessment, including following sub-step：
A. selection and identical characteristic parameter sample in hard fault electromagnetic compatibility reliability assessment, distinguish on multiple frequencies
It is modeled emulation and solves the electromagnetism physical parameter obtained on target cabling；
B. obtained multiple electromagnetism physical parameters are substituted into foregoing major error physical model, obtains power module in the electricity
Stress
Under the conditions of multiple out-of-service times, carry out fitting of distribution to it, obtain Reliability Function；
Step 5：Comprehensive electromagnetic compatibility reliability assessment, with the hard fault electromagnetism under the conditions of the power module working frequency
Compatible reliability value and the product of accumulated damage type electromagnetic compatibility Reliability Function are compatible as the comprehensive electromagnetic of the power module
Reliability.
Preferably, hardware and operating condition information collected wherein in step one include the work(of power module circuitry plate
Can, working stress condition, the composition component inventory on circuit board, the structure of circuit board and component, material, technological parameter,
Pinout information, solder joint and via information.
Preferably, the failure mechanism wherein in step one includes electromigration, second breakdown, hot carrier's effect, grid
Oxide layer breakdown and overheat are burnt.
Preferably, the main failure mechanism wherein described in step one is electromigration.
Preferably, the characteristic parameter wherein determined in step one is normal for the relative dielectric of power module circuitry plate and component
Number, its Normal Distribution.
Preferably, the analysis wherein in step 2 sets and included：To selected cabling addition excitation source port, set imitative
The background material and boundary condition of true mode, set mesh parameter, solve the frequency sweep response of target, working frequency and model, if
Put monitor.
Preferably, solution is emulated wherein described in step 2 includes：
1) signal integrity is emulated, analyzes the signal cross-talk caused by high-frequency circuit electromagnetic stress, interference problem
The influence produced to circuit board signal integrality, obtains signal eye diagram；
2) Power Integrity is emulated, analysis obtains source impedance and supply voltage drop；
3) electromagnetic field that analysis trace signal is produced, the field radiation of artificial circuit plate, obtains Electric Field Distribution, the magnetic of circuit board
Field distribution, surface current and far-field radiation.
Preferably, the electromagnetism physical parameter wherein described in step 4 is the surface current on target cabling.
In summary, technical thought of the invention is：First from the angle of faulty physical, the effect of galvanomagnetic-effect is studied
Mechanism, it is established that power module failure information matrix under an electromagnetic environment, then gives Emulation of EMC specific works,
Including the content such as modeling, condition setting, solution and post processing, design optimization, it is reliable that its simulation result will be used for electromagnetic compatibility
Property assess.Then in conjunction with fault message matrix, simulation result and the Monte Carlo sampling obtained before, two kinds of assessment EMR are proposed
Method.One kind, which is directed to, has probabilistic hard fault, theoretical using SSI, obtains the RELIABILITY INDEX of product；Another method
The damage fault with degenerative is then directed to, using PPoF methods, probability physics model of failure is set up, to obtain the reliable of product
Property index.Finally, comprehensive two kinds of reliability indexs propose comprehensive EMR evaluation indexes.
The present invention has advantages below：
1. the present invention goes to grind by the way that faulty physical is combined with electromagnetic compatibility problem from microcosmic points such as physics, chemistry
Study carefully the basic reason of electromagnetic compatibility mal function generation and the effect of electromagnetic stress, contribute to the deep effect machine for understanding electromagnetic stress
System.Furthermore, it is understood that in addition to having qualitative assurance to electromagnetism failure, the faulty physical of description Related Mechanism is given herein
Model, and mining model includes the meaning and dispersiveness of each electromagnetism physical parameter including electromagnetic stress, take into full account structure,
The uncertain influence that the characteristic parameters such as material, technique are caused on failure, this gives the quantitative description of electromagnetism failure,
Finally set up the related fault message matrix of complete electromagnetism.
2. there is shown herein the related simulating analysis of the galvanomagnetic-effect of complete set, from modeling setting to boundary condition
Put, then to the definition and algorithms selection for solving domain, finally emulate the overall process of solution, obtain various Electro Magnetic Compatibility information,
So that it is guaranteed that simulation result is true and reliable.
3. Electro Magnetic Compatibility common at present is assessed, finding failure often by the method such as emulation or test occurs position
Put, it is impossible to clearly provide reliability index value, and can be the electromagnetic Compatibility Design of product and optimization provide extremely the index
Important reference.Therefore, this paper presents the method for a set of calculating electromagnetic compatibility reliability index, this method combines electromagnetic compatibility
Emulation technology, and SSI theories and PPoF methods are dissolved into galvanomagnetic-effect analysis, establish electromagnetic stress and reliability index
Between direct relation, provides method for the directly perceived EMR levels for holding product, reference frame is provided for the design improvement of product.
Brief description of the drawings
The application includes the following drawings, wherein：
Fig. 1 is power module operation principle schematic diagram of the embodiment of the present invention.
Fig. 2 is the inventive method FB(flow block).
Fig. 3 is power module Emulation of EMC flow chart of the embodiment of the present invention.
Fig. 4 is power module plate figure of the embodiment of the present invention.
Fig. 5 is power module simulation model figure of the embodiment of the present invention.
Fig. 6 is power module signal eye diagram of the embodiment of the present invention.
Fig. 7 is power module impedance plot of the embodiment of the present invention.
Fig. 8 is the pressure drop figure of power module cabling of the embodiment of the present invention.
Fig. 9 is the distribution map of the electric field of power module circuitry plate of the embodiment of the present invention.
Figure 10 is the Surface current distribution figure of power module circuitry plate of the embodiment of the present invention.
Figure 11 is power module far-field radiation pattern of the embodiment of the present invention.
Figure 12 is the distribution map of the electric field of power module of the embodiment of the present invention.
Figure 13 is the Electric Field Distribution SSI illustratons of model that the emulation of power module of the embodiment of the present invention is obtained.
Figure 14 is the curve of frequency-reliability of power module of embodiment of the present invention fitting.
Figure 15 is power module of embodiment of the present invention electric current-relative dielectric constant curve.
Figure 16 is that power module of the embodiment of the present invention carries out the Weibull probability that Weibull distribution inspection is obtained with Matlab
Figure.
Embodiment
Below in conjunction with drawings and examples, the present invention is described in further detail.
Selection DC-isolation formula switch power module of the embodiment of the present invention is used as electromagnetic compatibility reliability assessment object, the electricity
Source module mainly includes high-efficiency separated Switching Power Supply integrated circuit, three end adjustable shunt reference sources, single-phase rectification bridge and line
Property photoelectrical coupler.Fig. 1 shows the operation principle schematic diagram of DC-isolation formula Switching Power Supply, the mistake that its main circuit function is realized
Substantially, high pressure industrial-frequency alternating current becomes high voltage direct current to journey after rectifying and wave-filtering, then is changed into high voltagehigh frequency through signal modulation
Alternating current, then becomes low-voltage high-frequency alternating current through isolated transformer, and last rectifying and wave-filtering, output has high stability Gao Pin
The low-voltage DC of matter.
Carry out, mainly include according to flow as shown in Figure 2 for the electromagnetic compatibility reliability estimation method of power module
Determine the main failure mechanism and its corresponding physics model of failure of power module, Emulation of EMC, hard fault EMR assess, it is tired
Damage fault EMR is counted to assess and comprehensive EMR assessments.Below in conjunction with electricity of the DC-isolation formula switch power module to the present invention
Magnetic compatibility reliability estimation method is described in detail.
Step 1: information
Information is the first step of this method, and the information being collected into is the basis of subsequent simulation work and evaluation work,
Its integrality and accuracy directly determine the accuracy of last emulation and assessment result, therefore very crucial.
The information of collection mainly includes three parts：Collect the hardware and operating condition information of power module, set up failure letter
Breath matrix determines major error information and determines characteristic parameter and distribution.
First, the hardware and operating condition information of power module are collected, the approach of collection mainly has access reference books, reality
Thing is tested and three kinds of virtual emulation.The content collected is needed mainly to include the function of circuit board, working stress condition, the first device of composition
Structure, material, technological parameter, pinout information and the solder joint of part inventory, plate and component, via information etc..The present embodiment
Circuit board in power module is about 152mm, wide 102mm, and thickness of slab is 18.2mil, and one layer of dielectric layer of two metal layers is added outside
Lower two layers of solder mask.The function of several Important Components is as follows on plate：
TNY223, high-efficiency separated Switching Power Supply integrated circuit is the serial IC products of TinySwitch-III,
A high-voltage power switch mosfet and a power-supply controller of electric are integrated with thereon.The controller includes oscillator, a voltage stabilizing
Device, enable circuit, overtemperature protection, current limitation selection circuit, current limit circuit, limited current state machine, lead-edge-blanking circuit and
One 700V power MOSFET tube.Different from PDM keyer, it is exported steady using simple switch control mode
Determine voltage.
TL431, three end adjustable shunt reference sources, its output voltage can be set by adjusting resistance ratio, can be stablized
Arbitrary value in the range of reference voltage terminal to 36V.
2kbp10m, single-phase rectification bridge, effect is rectification, and alternating current is changed into direct current, and feature is to facilitate compact.In fact
Matter is exactly that four silicon diodes are connected into bridge rectifier, is then encapsulated in together, and is got up with plastics package, draws four
Pin, two of which pin connects AC power, is represented with~~symbol, and two other pin is then direct current output, is represented with+-.
Pc817, precision photoelectric coupler usually makees coupled apparatus in the accurate functional circuit of comparison is required, with every
From the effect of the superior and the subordinate's circuit, make front end completely isolated with loading, increase line security, reduce circuit interference.Common light
Electric coupler can only transmit data signal, and precision photoelectric coupler can then transmit the analog voltage or electric current letter of consecutive variations
Number, corresponding optical signal can be produced with the strong and weak change of input signal, so that the conducting degree of photistor is also different,
The voltage or electric current of output are also different therewith.
Secondly, faulty physical analysis, including the failure mechanism and its corresponding physics model of failure of power module are determined, build
Vertical fault message matrix, determines main failure mechanism and corresponding major error physical model.
Physics model of failure is to be directed to failure mechanism, in the base of basic physics, chemistry, electrical equation or empirical regression formula
On plinth, it is established that the mathematical function model of the relation such as quantitatively reaction failure time of origin and material, structure, stress for coming.This
Method first has to investigate the failure mechanism related to electromagnetic compatibility, in microcosmic points such as physics, chemistry to electromagnetic compatibility mal function
The basic reason of generation and the effect of electromagnetic stress are studied, and determine that power module failure mechanism includes following five kinds：
1) electromigration
After device develops to sub-micron, deep-submicron, the width of metallization constantly reduces, and strong-electromagnetic field is coupled to circuit
In, big current density is produced, the forceful electric power potential difference that high current is caused can produce very big mechanical stress ladder on metal interconnecting wires
Degree, causes metal ion to move, and hole or crackle are formed in cabling, ultimately causes metallization lines open circuit or short circuit, makes device
The leakage current increase of part, it is seen then that electromigration caused by electromagnetic field can influence the reliability of circuit.
2) second breakdown
Second breakdown is the most common ESD of microwave semiconductor device (Electro-Static discharge static discharge)
Damage phenomenon.Similarly, strong-electromagnetic field is coupled in circuit, is produced big current density, is caused local temperature to raise, this enters again
One step causes current density to increase, and temperature rise continues to improve.When the local temperature of device exceedes the melting temperature of semi-conducting material,
PN junction can be caused to fail.If temperature is sufficiently high when can melt the metal of neighbouring contact hole, molten metal will be in electric field
In the presence of between knot migrate, cause knot between resistive short.
3) hot carrier's effect
Extraneous strong-electromagnetic field is coupled in circuit, high current is formed, when power device channel laterally electric field or vicinity
When electric field is very strong, the electronics produced by source electrode becomes thermoelectron (i.e. hot carrier), causes and touch after by strong electric field region
Ionization is hit, greater number of electron hole pair is produced, the hot carrier so produced is drain avalanche hot carrier.Part drains
Avalanche hot carriers can overcome silicon-silicon dioxide interface potential barrier, and injector grid silicon dioxide film, it is produced trap and boundary
Face energy level, and threshold voltage is changed.This effect can be such that Oxide trapped charge increases or fluctuation shakiness, so as to cause device
Electrical parameter performance degradation, device is decayed.The hole produced simultaneously with drain avalanche hot carrier, enters under strong grid field action
Enter substrate, form substrate current, trigger latch-up.And in maximum, the performance of device is caused by drain avalanche hot carrier
Degenerate the most notable.
4) gate oxide breakdown
When voltage has exceeded the breakdown voltage of gate oxide, ESD can cause the rupture of MOS device gate oxide (to bipolar
Type device, punctures and occurs mainly in device body).High current causes local heating, and usually rupture position in grid by breakdown point
Generation metal silicon alloy is put, the short-circuit resistance through grid is formed.Short circuit can make grid to drain short circuit, can also make grid
To source short or grid to substrate short circuit, this depends on oxidation Rotating fields and defect.In flawless oxide layer, ESD is damaged
Wound is most likely to happen in source electrode or drain electrode, and this depends on the bias of transient state polarity and device.The ESD damage of PN junction generally occurs
Under the conditions of reverse-biased, the performance degradation of PN junction is shown as.
5) overheat is burnt
Many bonding jumper structures are usually contained in modern microwave semiconductor devices, the connection or device for device inside with
The connection of pin.The electric current and energy produced during electromagnetic pulse, can promote the temperature of microwave semiconductor device rapid
Rise, when temperature reaches it is sufficiently high when, metallic film and bonding wire scorification can be made or even vaporized, so as to cause open circuit.And by
In the limitation of real technological level, uniform metal layer is difficult to realize, therefore is easy to cause local current to be assembled and local
Overheat.
By consulting handbook literature, the power module failure mechanism related to electromagnetic compatibility and corresponding faulty physical are determined
Model, is collected integration by information such as failure mechanism, physics model of failure, it is established that electromagnetic compatibility dependent failure information square
Battle array, as shown in table 1.
(researched and developed in the method using Cacle PWA softwares by the CALCE centers of Univ Maryland-Coll Park USA, main research
Electronic component faulty physical) to calculate failure mechanism respectively be that electromigration, second breakdown, hot carrier's effect, gate oxide are hit
Wear, overheat the time before the power module failure burnt.By contrast, time before failure is most under electromigration failures mechanism
It is short, illustrate that the influence that electromigration is broken down to power module is maximum, thereby determine that the major error that electromigration is this power module
Mechanism.
The physics model of failure table of table 1
There is the parameters such as many physical dimensions, material properties and electric stress in physics model of failure, by crudy, work
The influence of the factor such as skill control and environmental stress, these parameters have certain randomness, and obey certain distribution, such as table 2
It is shown.Characteristic parameter dispersiveness causes uncertain influence on failure, so considering that these are special in this appraisal procedure
The influence of parameter is levied, the parameter distribution of each characteristic parameter is provided.Electric field radiation is related to the relative dielectric constant of material, Er Qieben
The main failure mechanism determined in the foregoing step of method is electromigration, the generation of electromigration and the dielectric properties phase of circuit board material
Close, it is thus determined that the characteristic parameter paid close attention in subsequent simulation analysis is the relative dielectric constant of this power module circuitry plate,
Its Normal Distribution.
The unknown distribution of model parameters table of table 2
Step 2: simulation analysis
The stream of electromagnetic compatibility Reliability Simulation Analysis is carried out for avionic unit DC-isolation formula switch power module
Journey is as shown in Figure 3.
According to the information of collection, the simulation model of circuit board is set up, to signal integrity, Power Integrity, circuit board
Electric Field Distribution, Distribution of Magnetic Field, surface current and far-field radiation carry out simulation analysis.These aspects are selected to carry out simulation analysis
Reason has at 3 points：
1) essence of design circuit is that certain specific function, signal matter are realized by the circuit signal flowed in cabling
Amount is the matter of utmost importance that we are concerned about.Therefore, signal integrity (SI) is emulated, analyzed by high-frequency circuit electromagnetic stress
The influence that the problems such as signal cross-talk that causes, interference produces to circuit board SI, finally gives the results such as signal eye diagram.
2) stable supply voltage is the primary condition of circuit board normal work, and the fluctuation of power supply can give whole circuit board band
Carry out fatal influence.Power Integrity can directly affect signal integrity and electromagnetic interference and radiation, in many cases, cause letter
Number produce distortion main cause both be from power-supply system.Therefore, Power Integrity (PI) is emulated, analyzes power supply
Impedance and supply voltage drop (IR-drop).
3) electromagnetic interference of circuit board and radiation are this paper focus of attention, therefore, to analyze the electricity of trace signal generation
Magnetic field, the field radiation of artificial circuit plate, finally gives Electric Field Distribution, Distribution of Magnetic Field, surface current and the far field spoke of circuit board
The result such as penetrate.
When the power module in for the present embodiment implements this method, (come from Altium Designer softwares
Altium companies) in create a new projects, the circuit diagram according to product completes the drafting of its schematic diagram, adds to each element
Dress is sealed up, then preserves and generates net list；Using the net list of generation, the component of each composition is placed, is connected up and layer
Set, complete circuit board figure.The Switching Power Supply mould plate figure set up for power module in the present embodiment is as shown in Figure 4.In Fig. 4
C1, T2 constitute electromagnetic interface filter, D1 and C5, C6 carry out rectifying and wave-filtering to input ac voltage, and DV1 and D2 are used to eliminate because becoming
Peak voltage caused by depressor leakage inductance, IC1 is built-in MOSFET switch controller chip, and model is TNY223, it
Receive the work that output is fed back and controls whole circuit, be the core devices of the switching power circuit.D4, C9, C10 and D5,
C12, C13 are secondary commutation filter circuits, and L1, C11, C15 and L2, C14, C16 separately constitute low pass filter to reduce output
Ripple voltage.R7 and R9, R10 are output sample resistances, TL431 REF terminal voltages are determined by both partial pressures, so as to control
Shuntings of the TL431 processed from negative electrode to anode, and this electric current direct drive linear optical coupling Pc817 luminous component.Therefore, when
When output voltage has change trend, REF terminal voltages increase therewith, cause the electric current increase for flowing through TL431, and then optocoupler is luminous adds
By force, the feedback voltage that photosensitive end is obtained also just corresponding increase.TNY223 is being received after this becomes big feedback voltage and will changed
MOSFET switch time so that output voltage falls after rise.
The plate figure is imported into CST simulation softwares (coming from CST joint-stock companies of Germany), Emulation of EMC model such as figure is set up
Shown in 5.The target cabling to be analyzed is selected, excitation source port is added in selection to it；Background material and the side of simulation model are set
Boundary's condition；Mesh parameter is set, the frequency sweep response of target, working frequency and model is solved；Needed for that can be shown in post processing
The result wanted, in addition it is also necessary to which corresponding monitor is set.For power module in the present embodiment, background material is set to normal,
Boundary condition is open (add space), and it is 0~4GHz to solve frequency range, is set according to this area power module correlation is consulted
Handbook is counted, selects most sensitive on electromagnetic radiation or maximum cabling is influenceed on electromagnetic radiation from environment as analysis cabling, to this
For the DC-isolation formula switch power module of embodiment, it is determined that analysis cabling is NETC5_1 and NETC3_2, in every cabling
Two ends set 2 excitation ports respectively：Port1, port2 and port3, port4.Hereafter analysis is carried out only for NETC5_1 to comment
Estimate., it is necessary to analysis and evaluation be carried out respectively to this two cablings, due to the two method phase for the total evaluation of the power module
Together, therefore the analysis and evaluation process no longer to NETC3_2 is described in detail herein.
Complete after analysis sets, start to carry out power module signal integrity, Power Integrity, magnetic distribution and remote
The emulation such as field radiation are solved, and post-process the scattering parameter for obtaining power module, signal eye diagram, Electric Field Distribution, Distribution of Magnetic Field, surface
The relevant informations such as electric current, far-field radiation situation.By taking the cabling NETC5_1 of power module circuitry plate in the present embodiment as an example, pass through
Emulation can obtain following information after solving：
1) as shown in fig. 6, eye pattern " eyes " opens larger, stitching is more clear, because the size opened reflects intersymbol
Crosstalk and the power of interference noise, therefore the crosstalk that is subject to of the visible cabling and disturb smaller.
2) in power distribution system (PDN), source impedance is reduced usually through decoupling capacitor in parallel so that noise or letter
Number can find Low ESR return flow path, it is to avoid because impedance loop is too high and caused by radiation-emitting.By can Fig. 7 know, in 0~2GHz
Frequency band, impedance value is integrally relatively low, and 7 Ω are much smaller than substantially, and the impedance only at 0.67GHz is slightly higher, about 6.2 Ω.
3) as can be seen from Figure 8, the loss very little of the internal resistance of source, can ignore, and the pressure drop of cabling can also be ignored not
Meter.
4), can be with as shown in figs. 9-10, by the distribution map of the electric field of circuit board, Distribution of Magnetic Field figure and Surface current distribution figure
Obtain the maximum field value 78.49V/m (Fig. 9 a) of the circuit board under 2GHz frequencies), maximum surface current value 2.3A (Figure 10 a)),
The maximum field value 33.99V/m (Fig. 9 b) of circuit board under 4GHz frequencies), maximum surface current value 3.6A (Figure 10 b)), after being
The EMR in face, which is assessed, provides input.Influence of the cabling of addition pumping signal to other trace signals can also be observed, electricity is instructed
The layout designs of road plate.Arrow in figure is excitation port, and blueness is the component on circuit, and remaining is fragmentarily
Electric field, magnetic field or surface current field distribution situation.It can be seen that, the cabling around excitation cabling is easily affected, but is not
Clearly.
7) radiation event of the signal lead to surrounding space as shown in figure 11, can be analyzed, judges to produce radiation most
Big direction and gain amplitude, gain amplitude are bigger, represent that the directionality of aerial radiation is stronger, radiation propagation is more remote.From 11a)
It is known that antenna gains of the cabling NETC5_1 under 2GHz frequencies is 4.474dBi in figure.From 11b) it can obtain in block diagram
Cabling NETC5_1 is known under 2GHz frequencies, the Electric Field Distribution situation at circuit board central axis 0.5m.
Step 3: hard fault Reliability assessment
Based on the simulation analysis result to power module, hard fault EMR assessments are carried out to the power module, to obtain power supply
The hard fault reliability of module.Specifically, obtained characteristic parameter and distribution are studied according to step one faulty physical, to feature
Parameter carries out Monte Carlo sampling, i.e., the relative dielectric constant of circuit board material is taken out according to normal distribution progress Monte Carlo
Sample.The simulation model that will be set up in the characteristic parameter data from the sample survey input step two of acquisition, is obtained in each frequency through repeatedly calculating
N maximum field intensity values on point, and its distribution is fitted, as the stress distribution in SSI models, by specified in GJB151A
Electric-field intensity limit value as SSI models intensity, you can according to SSI theory carry out Reliability Solution, several conventional distributions can
It is as shown in table 3 below by degree calculation formula.And then obtain the reliability R on each frequencyh, and draw out frequency-reliability curves
Figure.
The formula of reliability of table 3
The material of circuit board medium is FR4 grades of flame resistant materials, is to add filler and glass fibre institute with epoxy resin
The composite made, its relative dielectric constant is 4.3.From table 1, material parameter Normal Distribution, the phase of the material
To dielectric constant Normal Distribution N (4.3,0.5).Pass through the normrnd functions in Matlab, one group of obedience normal state point of generation
Cloth N (4.3,0.5) random data, i.e., 4.1611,4.5258,4.3017,4.3620,4.2661,4.4410,4.6301,
4.2891st, 4.4077,4.3302, retained 2 significant digits decimal as emulation input value, and from small to large ord
Arrangement, is followed successively by 4.16,4.27,4.29,4.30,4.33,4.36,4.41,4.44,4.53,4.63.
According to step 2, using this 10 FR4 relative dielectric constants as input value, electromagnetic compatibility is carried out to circuit board and imitated
Very, it is respectively 64.28,62.87,60.95,58.18,55.81,52.36,50.90 to obtain the maximum field value under 2GHz,
49.83,47.57,44.91dB μ V/m.Fitting of distribution and normality are carried out to above-mentioned 10 maximum field values using SPSS softwares
Examine, as a result as shown in table 4.
The test of normality of table 4
Wherein in terms of Kolmogorov-Smirnova methods Sig.=0.2 ＞ 0.05, in terms of Shapiro-Wilk methods
Sig.=0.714 ＞ 0.05, therefore, electric field value Normal Distribution, i.e. N (54.76,6.682), its distribution map such as Figure 12 institutes
Show.According to the regulation of RE102 in GJB151A, the electric-field intensity limit value at 2GHz is 60dB μ V/m, regard the limit value as SSI
Intensity distribution in model, the Electric Field Distribution that emulation is obtained is used as the stress distribution in SSI models, i.e. electric-field intensity limit value S
=60, s~N (54.76,6.682), as shown in figure 13.
SSI solves the reliability at each frequency
Look into standardized normal distribution table, it is known that, reliability of the circuit board under 2GHz is：
Rh=0.7823
It is 0.5GHz, 1GHz, 1.5GHz, 2.5GHz, 3GHz, 3.5GHz to obtain frequency with identical method, during 4GHz, electricity
The reliability of road plate is respectively 0.8115,0.8012,0.7936,0.7764,0.7717,0.7682,0.7629, is finally fitted
To frequency-reliability curves, as shown in figure 14.According to the working frequency of power module, the hard fault of power module can be obtained
Damage Reliability assessment value.
Step 4: progressive damage Reliability assessment
Based on the simulation analysis result to power module, accumulated damage EMR appraisal procedures are carried out to the power module, to obtain
Obtain the progressive damage reliability of power module.Choose identical characteristic parameter random value in being assessed with hard fault EMR, i.e., it is relative to be situated between
Electric constant random value, carries out Multi simulation running model solution, obtains corresponding multiple electromagnetism physics ginsengs under certain frequency on target cabling
Numerical value.The electromagnetism physical parameter can be surface current, it is contemplated that the ghost effect of circuit board, be excitation electric stress and cabling string
The coefficient result such as disturbing, (research has shown that, it is considered to which the crosstalk of actual cabling is compared with pure circuit theory diagrams are emulated, its noise electricity
It is flat to be higher by 20dB, that is, an order of magnitude).Then obtained multiple electromagnetism physical parameter values are substituted into fault message square
In battle array in corresponding physical model, multiple out-of-service times of the circuit board under the conditions of the electric stress are obtained, distribution plan is carried out to it
Close, you can obtain failure distribution function and Reliability Function Rd。
For the power module of the embodiment of the present invention, when assessing, still choose and phase in hard fault lesion assessment step
With 10 FR4 relative dielectric constant random values, i.e., 4.16,4.27,4.29,4.30,4.33,4.36,4.41,4.44,4.53,
4.63, Emulation of EMC analysis is carried out to circuit board, the accumulated damage failure EMR combined with PPoF methods is assessed.Root
According to step 2, this 10 FR4 relative dielectric constants are emulated as input value, cabling NETC5_1 are obtained in 2GHz frequencies
On electric current for 3.73,3.69,3.63,3.60,3.56,3.52,3.50,3.48,3.46,3.44A.
SPSS softwares carry out curve fitting to electric current and its corresponding FR4 relative dielectric constants, as a result as shown in figure 15.
The electric current obtained according to above-mentioned emulation, then add known cross-sectional area S to be 0.6mm2, can be in the hope of current density j, electricity
Current density accelerated factor n takes 2, Diffusion Activation Energy Ea to take absolute temperature T under 0.58eV, condition of work to take 300K；Consult material hand
Volume, Boltzmann constant k is 8.62 × 10-5eJ/K, adds the obtained electric current for stating emulation, and these parameters are inputted into Cacle
PWA, according to following electromigration failures physical model expression formula
Calculating obtain out-of-service time tf be respectively 14222,14548,15033,15284,15647,15969,16189,
16357th, 16527,16759 hours.
Life-span fitting of distribution carries out Weibull distribution inspection, such as Figure 16 using Matlab softwares to above-mentioned 10 out-of-service times
It is shown, approximately in straight line, it is known that, the Weibull Distributed Units.Further solve, obtain the shape of the Weibull distribution
Parameter is 0.01, and dimensional parameters are 22.1267, i.e. W (0.01,22), and its distribution function is
Reliability Function is：
Step 5: comprehensive electromagnetic compatibility Reliability assessment
Carry out DC-isolation formula switch power module and integrate EMR assessments.Hard fault generating process and accumulated damage occurred
Journey is separate, and the compatible reliability of comprehensive electromagnetic of system can be expressed as hard fault electromagnetic compatibility reliability and accumulated damage electromagnetism
The product of compatible reliability.The hard fault reliability and progressive damage reliability obtained according to abovementioned steps, works frequently in 2GHz
Under the conditions of rate, the comprehensive reliability of circuit board trace NETC5_1 electromagnetic compatibilities is represented by：
When its index of aging is 15 years, it is assumed that daily work 8 hours, work in 1 year 200 days, i.e. t0=24000h, then：
Rs=0.74
So far, electromagnetic compatibility reliability assessment of the invention has been completed.
Above-mentioned comprehensive electromagnetic compatible reliability result can be by the qualified amount of reliability in the quantized result and engineering when applying
Change index to compare, for example, aviation electricity can be determined according to the experience in engineering on avionic unit EMC Design
Sub-device EMC Design reliability qualified index under the conditions of its working frequency is 0.9.So cabling NETC5_1 is in its work
The comprehensive reliability of electromagnetic compatibility shows that the power module design is unqualified, it is necessary to product for 0.74 under the conditions of working frequency 2GHz
Design is improved.By the horizontal stroke of the material, PCB layouts, conductive material density, resistivity and the cabling that improve pcb board medium
Sectional area, can improve the reliability of the electromagnetic compatibility of power module.
The present invention studies the mechanism of action of galvanomagnetic-effect from the angle of faulty physical, and utilizes emulation technology, with reference to should
The method of power-strength Interference (SSI) model and probability faulty physical (PPoF), is established between electromagnetic stress and reliability index
Direct relation, it is proposed that the method for assessing avionic unit electromagnetic compatibility reliability, reference is provided for the design improvement of product
Foundation.
Claims (8)
1. a kind of appraisal procedure of the electromagnetic compatibility reliability of avionic unit power module, it is characterised in that including following step
Suddenly：
Step one：Information, including：
A. power module hardware and operating condition information are collected；
B. the power module fault message matrix related to electromagnetic compatibility is set up, fault message matrix is including failure mechanism and correspondingly
Physics model of failure；
C. select time before failure most short failure mechanism as main failure mechanism from fault message matrix, obtain its corresponding
Major error physical model；
D. the determination characteristic parameter related to electric field radiation and main failure mechanism and distribution；
Step 2：The simulation analysis of power module electromagnetic compatibility, including following sub-step：
A. the hardware and operating condition information collected according to step one, set up the simulation model of power module；
B. the target cabling to be analyzed in the simulation model is selected, analysis setting is carried out to it；
C. the emulation that signal integrity, Power Integrity, magnetic distribution and far-field radiation are carried out to power module is solved；
Step 3：Hard fault electromagnetic compatibility reliability assessment, including following sub-step：
A. the characteristic parameter determined in step one is distributed according to it and carries out Monte Carlo sampling；
B. the simulation model that will be set up in the characteristic parameter data from the sample survey input step two of acquisition, is obtained multiple through repeatedly calculating
Multiple maximum field intensity levels on frequency, and fit its distribution；
C. using the maximum field intensity distribution on multiple frequencies as the stress distribution in SSI models, by the field strength of national regulations
Limit value carries out Reliability Solution, and draw out frequency-reliability curves figure as the intensity of SSI models；
D. the hard fault electromagnetic compatibility reliability under the conditions of power module working frequency is obtained according to frequency-reliability curves figure
Value；
Step 4：Accumulated damage electromagnetic compatibility reliability assessment, including following sub-step：
A. selection and identical characteristic parameter sample in hard fault electromagnetic compatibility reliability assessment, are carried out respectively on multiple frequencies
Modeling and simulating solves the electromagnetism physical parameter obtained on target cabling；
B. obtained multiple electromagnetism physical parameters are substituted into foregoing major error physical model, obtains power module in electric stress bar
Multiple out-of-service times under part, fitting of distribution is carried out to it, obtain Reliability Function；
Step 5：Comprehensive electromagnetic compatibility reliability assessment, with the hard fault electromagnetic compatibility under the conditions of the power module working frequency
Reliability value and the product of accumulated damage type electromagnetic compatibility Reliability Function are compatible reliable as the comprehensive electromagnetic of the power module
Degree.
2. collected hardware and operating condition information include in appraisal procedure according to claim 1, wherein step one
The knot of composition component inventory on function, the working stress condition of power module circuitry plate, circuit board, circuit board and component
Structure, material, technological parameter, pinout information, solder joint and via information.
3. the failure mechanism in appraisal procedure according to claim 1, wherein step one includes electromigration, secondary hit
Wear, hot carrier's effect, gate oxide breakdown and overheat burn.
4. appraisal procedure according to claim 1, the main failure mechanism wherein described in step one is electromigration.
5. the characteristic parameter determined in appraisal procedure according to claim 1, wherein step one is power module circuitry plate
And the relative dielectric constant of component, its Normal Distribution.
6. the analysis in appraisal procedure according to claim 1, wherein step 2, which is set, to be included：Selected cabling is added
Plus excitation source port, the background material and boundary condition of simulation model are set, mesh parameter is set, target, working frequency is solved
And the frequency sweep response of model, monitor is set.
7. appraisal procedure according to claim 1, solution is emulated wherein described in step 2 to be included：
1) signal integrity is emulated, analyzes the signal cross-talk caused by high-frequency circuit electromagnetic stress, interference problem to electricity
The influence that road partitioned signal integrality is produced, analysis obtains signal eye diagram；
2) Power Integrity is emulated, analysis obtains source impedance and supply voltage drop；
3) electromagnetic field that analysis trace signal is produced, the field radiation of artificial circuit plate obtains Electric Field Distribution, the magnetic field point of circuit board
Cloth, surface current and far-field radiation.
8. appraisal procedure according to claim 1, the electromagnetism physical parameter wherein described in step 4 is on target cabling
Surface current.
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| CN112560368B (en) * | 2020-12-29 | 2023-07-21 | 海光信息技术股份有限公司 | Circuit simulation method, circuit simulation device, electronic equipment and computer readable storage medium |
| CN112834843B (en) * | 2020-12-31 | 2023-12-19 | 江苏南高智能装备创新中心有限公司 | Near-field electromagnetic compatibility test management method and system for radio frequency integrated circuit |
| CN113092917B (en) * | 2021-04-12 | 2021-09-21 | 北京航空航天大学 | Method for rapidly realizing boundary test of electromagnetic environment adaptability of electronic equipment |
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