CN112541321A - Aerospace seal integrated circuit early screening and risk prediction method and device - Google Patents
Aerospace seal integrated circuit early screening and risk prediction method and device Download PDFInfo
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Abstract
The embodiment of the invention discloses an aerospace seal integrated circuit early screening and risk prediction method and device. The method comprises the following steps: determining background information of the aerospace seal integrated circuit, and physically dissecting the aerospace seal integrated circuit into a plurality of units according to the background information; performing performance analysis on the plurality of units after dissection; determining the minimum independent element of the aerospace sealed integrated circuit; analyzing each minimum independent factor and determining a first analysis result; combining at least two minimum independent elements and analyzing to determine a second analysis result; and determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit. The method can effectively avoid the problem of early design, improves the device on the structural reliability gene level, can indicate the problem that the existing test method cannot be exposed in the early stage, and improves the inherent reliability of the device.
Description
Technical Field
The invention relates to the technical field of aerospace, in particular to a method and a device for early screening and risk prediction of an aerospace seal integrated circuit.
Background
Along with the miniaturization, complication, diversified constantly development of electronic components, the chip integrated level is high, and the encapsulation is complicated various, brings huge challenge to its design, optimization, in case the positioning analysis that appears inefficacy is very difficult, needs to spend a large amount of manpower, material resources, and some super large-scale components and parts inner structure have the defect, and current detection technology is difficult to discern, can't adapt to the development demand that current design tends to the miniaturization. Aerospace seal integrated circuits are often used in special space environments, have new requirements on the structure and the function of the aerospace seal integrated circuits, and can find problems as early as possible and improve the problems in time if early screening of structural reliability genes is carried out in advance.
The aerospace seal integrated circuit can be designed and manufactured with high quality, the structure of the device contains a lot of important reliability information, and if the structure and the function are not designed reasonably, the inherent reliability of the device is not high; the problems that arise from this can affect the model task if it occurs during the device use phase, and in severe cases can even cause significant economic or schedule losses.
Historically, aerospace models at home and abroad are subject to failure caused by unreasonable design, structure or process of components, particularly aerospace seal integrated circuits, in the research and in-orbit flight processes, and some of the aerospace models have great influence on the models.
Most of the current component inspection standards are inspection properties, belong to post inspection and are conformance inspection, once problems occur, the process of the whole project is often influenced, and a large amount of economic cost is wasted for finished products.
The aerospace seal integrated circuit has complex and various structures, and due to the particularity of the space environment, the design of the conventional ground is not available in the aerospace application field, and the inherent defects in the aspects of various structures, materials, processes and the like exist possibly, so that in order to solve the defects, the research on the reliability development of an early screening and risk prediction method of the aerospace seal integrated circuit is necessary.
At present, an aerospace seal integrated circuit reliability early screening and risk prediction method is urgently needed, problems can be found in advance in the early stage of product design, a device production unit is guided to improve efficiently, the quality of products is continuously optimized at the minimum cost, component development and production tasks are completed efficiently, and the full success of model scientific research tasks is powerfully guaranteed.
Disclosure of Invention
The technical problem solved by the invention is as follows: the method and the device for early screening and risk prediction of the aerospace seal integrated circuit are provided.
In order to solve the technical problem, the invention provides an aerospace seal integrated circuit early screening and risk prediction method, which comprises the following steps:
determining background information of the aerospace seal integrated circuit;
according to the background information, the space navigation sealing integrated circuit is physically dissected into a plurality of units;
performing a performance analysis on a plurality of the units after dissection;
determining a minimum independent element of the aerospace sealed integrated circuit;
analyzing each minimum independent factor and determining a first analysis result;
combining at least two minimum independent elements and analyzing to determine a second analysis result;
and determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit.
Optionally, the step of determining the smallest independent element of the aerospace sealed integrated circuit comprises:
inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching;
outputting a first matching result by the aerospace component structure information database;
and determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
Optionally, the step of analyzing each of the smallest independent elements and determining a first analysis result includes:
inputting the minimum independent elements into a failure analysis database and a structural analysis database;
the failure analysis database outputs a second matching result;
the structural analysis database outputs a third matching result;
and analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
Optionally, the step of analyzing at least two of the minimum independent elements after combination to determine a second analysis result includes:
combining at least two minimum independent elements, and inputting the combined elements into a failure analysis database and a structural analysis database;
the failure analysis database outputs a fourth matching result;
the structural analysis database outputs a fifth matching result;
determining a second analysis result based on the fourth matching result and the fifth matching result.
Optionally, the step of determining a risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit includes:
determining the application environment of the aerospace sealed integrated circuit;
and determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
Optionally, the step of physically dissecting the aerospace seal integrated circuit into a plurality of units according to the background information includes:
according to the background information, the aerospace seal integrated circuit is physically dissected into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
In order to solve the technical problem, the invention also provides an aerospace seal integrated circuit early screening and risk prediction device, which comprises:
the first determining module is used for determining background information of the aerospace seal integrated circuit;
the dissection module is used for physically dissecting the aerospace seal integrated circuit into a plurality of units according to the background information;
an analysis module for performing a performance analysis on the plurality of the cells after dissection;
a second determination module for determining a minimum independent element of the aerospace sealed integrated circuit;
the third determining module is used for analyzing each minimum independent element and determining a first analysis result;
the fourth determining module is used for analyzing at least two minimum independent elements after the minimum independent elements are combined to determine a second analysis result;
and the fifth determining module is used for determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit.
Optionally, the second determining module includes:
the first matching submodule is used for inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching;
the first output submodule is used for outputting a first matching result by the aerospace component structure information database;
and the first determining submodule is used for determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
Optionally, the second analysis module comprises:
a first input submodule for inputting the minimum independent elements into a failure analysis database and a structural analysis database;
the second output submodule is used for outputting a second matching result by the failure analysis database;
the third output submodule is used for outputting a third matching result by the structural analysis database;
and the second determining submodule is used for analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
Optionally, the fourth determining module includes:
the second input submodule is used for inputting the combined at least two minimum independent elements into the failure analysis database and the structural analysis database;
the fourth output submodule is used for outputting a fourth matching result by the failure analysis database;
the fifth output submodule is used for outputting a fifth matching result by the structural analysis database;
a third determining submodule, configured to determine a second analysis result based on the fourth matching result and the fifth matching result.
Optionally, the fifth determining module includes:
the fourth determination submodule is used for determining the application environment of the aerospace sealed integrated circuit;
and the fifth determining submodule is used for determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
Optionally, the first determining module is specifically configured to:
according to the background information, an aerospace seal integrated circuit is subject to understanding and planning into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
Compared with the prior art, the invention has the advantages that:
(1) the invention mainly aims at an aerospace sealed integrated circuit which is not formally put into application, fully identifies and reasonably divides each component element of a device, forms a structural reliability gene database with a front surface and a back surface based on years of engineering experience accumulation and fault case extraction, combines the relation of the device in the aspect of aerospace application reliability, can judge the rationality of the device structure, materials, process and the like in the design stage, determines the unreasonable structure of the device, and provides suggestions for subsequent improvement. The invention can realize the reliability screening and risk prediction of the sealed integrated circuit in the aerospace application field as early as possible, reveals the defects of the device in the aerospace application environment in the design stage, effectively avoids the reliability problem that the existing test can not be exposed in time, and effectively reduces the subsequent economic and periodic losses. The method intervenes in the early stage of aerospace seal integrated circuit design, intervention time is short, and after problems are found, production units are helped to improve the quality level of devices in time, so that compared with the defect elimination in the traditional inspection test, a large amount of manpower, material resources and financial resources are saved, and the development efficiency and level of domestic devices are improved.
(2) The invention is the early screening of the structural reliability gene level, and the existing inspection test method aims at the integral performance of the device, so that the invention can effectively avoid the problem of early design, improves the device quality at the structural reliability gene level, can indicate the problem that the existing test method can not be exposed at the early stage, and improves the inherent reliability of the device.
(3) The weak point analysis result for the aerospace seal integrated circuit provided by the invention not only stays at the qualitative analysis level, but also gives a part of definite quantitative criteria, and the given forbidden, limited and improved suggestions are strong in pertinence and applicability and more comprehensive and accurate.
(4) Based on years of engineering experience accumulation and failure case analysis, the method can divide single elements more accurately by combining special space navigation application environment consideration; on the basis of considering the analysis of the single elements, the combination element coherence analysis is innovatively provided, the combination analysis is carried out on the elements which reach the standard in reliability of the single elements but interfere with each other after combination, the reliability influence on the performance and the structure of the device after combination is given, the rationality in the space navigation application environment is also given, and the result is more comprehensive and has guiding significance.
Drawings
FIG. 1 is a flowchart illustrating steps of a method for early screening and risk prediction of an aerospace sealed integrated circuit according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an aerospace sealed integrated circuit early screening and risk prediction method according to an embodiment of the present invention.
Detailed Description
Example one
Referring to fig. 1, a flowchart illustrating steps of an aerospace seal integrated circuit early screening and risk prediction method according to an embodiment of the present invention is shown, and as shown in fig. 1, the aerospace seal integrated circuit early screening and risk prediction method may specifically include the following steps:
step 101: background information for an aerospace sealed integrated circuit is determined.
Step 102: and according to the background information, the space navigation sealing integrated circuit is physically dissected into a plurality of units.
According to the background information, the aerospace seal integrated circuit is physically dissected into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
The functions of all the components are known through the performance characteristics of the aerospace seal integrated circuit, and the target aerospace seal integrated circuit is subjected to comprehensive physical anatomy in the directions of device functionality, reliability, environmental adaptability, safety, assembly adaptability, design manufacturability and the like.
The aerospace component structure information database is a root directory, the aerospace component structure information database is divided into 13 branches, wherein 1 branch is a common structure and a process branch, and structures and processes needing attention of all types of components are combed to form a list description; the rest 12 components are 12 general aerospace component branches, each general component branch is subdivided into subclasses according to aerospace application frequency, each subclass is provided with plates such as basic information, a typical structure, a failure mode, a failure mechanism and application notice items according to the condition, and a database is regularly maintained to record the related information of the novel device according to the plate classification, so that subsequent inquiry and accumulation are facilitated.
Step 103: performing a performance analysis on a plurality of the units after dissection.
Step 104: determining a minimum independent element of the aerospace sealed integrated circuit.
In a specific implementation manner of the embodiment of the present invention, step 104 may specifically include:
substep A1: and inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching.
Substep A2: and the aerospace component structure information database outputs a first matching result.
The structural analysis database accumulates component structural analysis cases which occur over the years, the module type of the input information comprises analysis conclusion and general conclusion information besides information such as basic model specification, model batch, production unit and the like of the components, wherein the general conclusion determines whether the components can be subsequently applied to space navigation, and the analysis conclusion comprises detailed information such as component structures, processes, materials and the like, so that ideas and experiences are provided for the structural analysis of the subsequent similar components.
The structure analysis database matches the parameter information of the aerospace seal integrated circuit with each data in the structure analysis database in sequence, and after the matching is successful, the structure score database outputs a first matching result.
Substep A3: and determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
And performing performance analysis on the dissected units, identifying key units related to the overall performance of the aerospace seal integrated circuit, looking up a structure analysis database and the like, determining the production and design conditions of similar devices, and comprehensively finishing to form minimum structure and function elements with independent functions.
Step 105: and analyzing each minimum independent element and determining a first analysis result.
In a specific implementation manner of the embodiment of the present invention, step 105 may specifically include:
substep B1: inputting the minimum independent elements into a failure analysis database and a structural analysis database.
And the failure analysis database receives each minimum independent element input by a user, and matches each minimum independent element with each data in the failure analysis database.
The structure analysis database receives each minimum independent element input by a user, and matches each minimum independent element with each data in the structure analysis database
Substep B2: and outputting a second matching result by the failure analysis database.
And outputting the data similar to or identical to the minimum independent elements by the failure analysis database for the user to refer to.
Substep B3: and the structural analysis database outputs a third matching result.
And the structural analysis database outputs and displays data similar to or identical to the minimum independent element for the user to use as reference.
Substep B4: and analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
The failure analysis database accumulates component failure analysis cases which occur over the years, the module type of the input information mainly comprises information such as failure modes, failure properties, failure reasons, failure time, failure reasons, analysis conclusions and whether batch problems exist besides information such as component basic model specifications, model batches, production units and the like, subsequent classification query is facilitated, information such as similar defects and the like can be screened more quickly, especially inherent quality defects of certain types of components are researched, and a defect inspection method and improvement measures are researched to provide help for subsequent quality improvement of the components.
For example: the aerospace seal integrated circuit is mainly divided into three parts, namely a package, an interconnection and a chip. Each part is divided into a plurality of units, the package comprises a mark, a tube shell, an external lead and the like, the interconnection comprises chip bonding, lead bonding and the like, and the chip comprises top layer passivation, metallization, interlayer dielectric, diffusion and the like.
The method has the advantages that the structural and functional characteristics of each element are fully known, the element is analyzed by taking the minimum element as a unit, the quality problems of multiple elements are determined by relying on a failure analysis database and a structural analysis database, the mature advanced device elements of the same type are compared, comprehensive defect screening is carried out, the criteria of the quality of each element of the aerospace seal integrated circuit are formed after summarizing and refining, the key elements need to be focused on, and comprehensive quality problem improvement and promotion suggestions are listed.
The analysis for the above minimum independent elements may specifically be: the mark part needs to pay attention to the checking of mark integrity, firmness and the like, is convenient to use and observe, and aims at the laser marking device, so that the marking depth cannot be excessive, thereby exposing the bottom layer metal, and the risk of corrosion exists in the subsequent environment such as humidity.
The tube shell part is required to pay attention to the special air tightness inspection, the internal water vapor content inspection and the like of the sealed device, pure tin is forbidden to be used inside and outside the aerospace sealed integrated circuit tube shell, the phenomenon that tin whiskers grow in the subsequent space environment and the electrical performance of the device is damaged is avoided, and a welding flux with the lead content of more than 3% is recommended to be used.
The outer lead portion prohibits the use of a pure tin plating layer, the outer plating layer is a pure gold underlayer which must have a barrier layer, the material compatibility of the lead and the case, and the like.
The chip bonding part forbids the use of pure glass powder for chip bonding, and the conductive adhesive is used for bonding the chip, so that the bonding height can not reach the surface metalized area of the chip, and the like.
The lead bonding part requires reasonable selection of bonding process, consistent radian of a bonding wire arch wire, consistent destructive bonding tension data, no allowance of key release and the like.
The passivation part of the top layer is required to be uniform and complete and should cover all chip surface areas except the bonding area and the test point.
The metallized part requires that the patterns of each metal layer should be complete and should not have the defects of lap joint, scratch, cavity, groove and the like.
The interlayer dielectric part requires that the interlayer dielectric material and the structure are reasonable, the forming process and the quality are good, and the dielectric constant and the thickness of the interlayer dielectric part can meet the requirements of insulation and ESD resistance of a chip and the like.
The diffusion part requires that the edge of a diffusion area is regular and clear, no protrusion or depression exists, no interference fringes and other defects appear in an oxidation layer of the diffusion area, and the chip has corresponding anti-radiation reinforcement design, redundancy design and the like.
Step 106: and combining at least two minimum independent elements and analyzing to determine a second analysis result.
In a specific implementation manner of the embodiment of the present invention, step 106 may specifically include:
substep C1: and combining at least two minimum independent elements, and inputting the combined minimum independent elements into a failure analysis database and a structural analysis database.
And aiming at the combined elements after the minimum independent elements of two or more combinations, inputting the combined elements into a failure analysis database and a structure analysis database for data matching.
When the smallest independent elements are combined, two smallest independent elements may be combined into one combined element, or three smallest independent elements may be combined into one combined element. The embodiment of the present invention is not particularly limited thereto.
Substep C2: and outputting a fourth matching result by the failure analysis database.
And matching the two minimum independent elements with the data in the failure analysis database according to the received combination of the two minimum independent elements by the failure analysis database, and outputting a fourth matching result.
Substep C3: and outputting a fifth matching result by the structural analysis database.
And matching the combination of the two minimum independent elements with the data in the structural analysis database according to the received combination of the two minimum independent elements by the structural analysis database, and outputting a fifth matching result.
And the fourth matching result and the fifth matching result are both used for reference by the user.
Substep C4: determining a second analysis result based on the fourth matching result and the fifth matching result.
Aiming at two or more combined elements, the coherence analysis of the combined elements is carried out, the advanced experience of the same type which is mature and applied is compared by relying on a failure analysis database and a structural analysis database, the problem of functional interference existing after the elements are combined is determined, and the criterion for judging the quality of the combined elements is formed.
The specific analysis process is as follows:
the low-temperature solder is adopted in a certain device, the melting temperature of the solder does not meet the final mounting and using conditions, and the mounting temperature can possibly cause the melting of the internal solder, so that the chip falls off; when multiple solders are used in the device, attention needs to be paid to reasonably setting the melting temperature gradient of the solders, and the principle of firstly increasing and then decreasing is followed.
Aiming at the part of the external lead of the device, which is not led out horizontally, a stress release structure is lacked between a welding spot and a tube shell after the device is installed, so that stress release can not be carried out, the risk of cracking of the welding spot, the tube shell and other parts exists under the action of thermal stress or mechanical stress, and the problem of related assembly matching property needs to be paid attention to subsequently.
The large-size LCCC device package and the FR4 printed board have the problem of thermal mismatch, the direct welding on the FR4 printed board is easy to generate welding point fatigue cracking failure, and the heat matching problem between the device tube shell and the printed board material needs attention.
The materials of the inner lead and the bonding area are recommended to be the same, the reliability of homogeneous bonding is high, heterogeneous bonding, particularly gold-aluminum bonding, has the risk of generating a Kerkinjel cavity under a certain condition, so that the bonding strength is reduced, even the bonding is removed, the electrical performance of a device is influenced, important attention needs to be paid to the combination condition of various heterogeneous bonding, and a targeted examination test is made if necessary to verify the reliability.
Step 107: and determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit.
In a specific implementation manner of the embodiment of the present invention, step 106 may specifically include:
substep D1: determining the application environment of the aerospace sealed integrated circuit.
Substep D2: and determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
The aerospace seal integrated circuit is relatively special in application environment, has special requirements on structure, materials, process and the like, and finally needs to be screened for defects in the aspect of the special requirements of the aerospace application environment to form the integral quality judgment of components.
A certain aerospace seal integrated circuit adopts split type heat sinks, the screening result is an unreasonable structure, because heat generated by devices in a space vacuum environment cannot be diffused into air, a main heat dissipation mode is heat conduction, the reliability of the split type heat sinks is reduced, and the heat dissipation effect can be greatly reduced, so that the split type heat sinks are suggested to be changed into integrated heat sinks.
The reliability of the aerospace components is screened in an early stage through the steps of various element identification and division, element quality criterion method determination, aerospace environment adaptability and the like.
And (4) carrying out weight sequencing on each judgment result formed by early screening according to the risk level, the influence level and the like, and definitely indicating the reliability risk of the aerospace seal integrated circuit.
The method intervenes in the early stage of aerospace seal integrated circuit design, intervention time is short, and after problems are found, production units are helped to improve the quality level of devices in time, so that compared with the defect elimination in the traditional inspection test, a large amount of manpower, material resources and financial resources are saved, and the development efficiency and level of domestic devices are improved.
Example two
Referring to fig. 2, a schematic structural diagram of an aerospace seal integrated circuit early screening and risk predicting device provided by an embodiment of the invention is shown. Specifically, the apparatus comprises:
a first determining module 201, configured to determine context information of an aerospace sealed integrated circuit;
the dissection module 202 is used for physically dissecting the aerospace seal integrated circuit into a plurality of units according to the background information;
an analysis module 203 for performing a performance analysis on the plurality of the cells after dissection;
a second determining module 204 for determining a smallest independent element of the aerospace sealed integrated circuit;
a third determining module 205, configured to analyze each of the smallest independent elements, and determine a first analysis result;
a fourth determining module 206, configured to combine and analyze at least two of the minimum independent elements, and determine a second analysis result;
a fifth determining module 207, configured to determine a risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on an application environment of the aerospace sealed integrated circuit.
Optionally, the second determining module includes:
the first matching submodule is used for inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching;
the first output submodule is used for outputting a first matching result by the aerospace component structure information database;
and the first determining submodule is used for determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
Optionally, the second analysis module comprises:
a first input submodule for inputting the minimum independent elements into a failure analysis database and a structural analysis database;
the second output submodule is used for outputting a second matching result by the failure analysis database;
the third output submodule is used for outputting a third matching result by the structural analysis database;
and the second determining submodule is used for analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
Optionally, the fourth determining module includes:
the second input submodule is used for inputting the combined at least two minimum independent elements into the failure analysis database and the structural analysis database;
the fourth output submodule is used for outputting a fourth matching result by the failure analysis database;
the fifth output submodule is used for outputting a fifth matching result by the structural analysis database;
a third determining submodule, configured to determine a second analysis result based on the fourth matching result and the fifth matching result.
Optionally, the fifth determining module includes:
the fourth determination submodule is used for determining the application environment of the aerospace sealed integrated circuit;
and the fifth determining submodule is used for determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
Optionally, the first determining module is specifically configured to:
according to the background information, an aerospace seal integrated circuit is subject to understanding and planning into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
Those skilled in the art will appreciate that those matters not described in detail in the present specification are well known in the art.
Claims (12)
1. An aerospace seal integrated circuit early screening and risk prediction method, the method comprising:
determining background information of the aerospace seal integrated circuit;
according to the background information, the space navigation sealing integrated circuit is physically dissected into a plurality of units;
performing a performance analysis on a plurality of the units after dissection;
determining a minimum independent element of the aerospace sealed integrated circuit;
analyzing each minimum independent factor and determining a first analysis result;
combining at least two minimum independent elements and analyzing to determine a second analysis result;
and determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit.
2. The method of claim 1, wherein the step of determining the smallest independent element of the aerospace sealed integrated circuit comprises:
inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching;
outputting a first matching result by the aerospace component structure information database;
and determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
3. The method of claim 1, wherein said step of analyzing each of said smallest individual elements and determining a first analysis result comprises:
inputting the minimum independent elements into a failure analysis database and a structural analysis database;
the failure analysis database outputs a second matching result;
the structural analysis database outputs a third matching result;
and analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
4. The method of claim 1, wherein the step of combining at least two of the smallest independent components for analysis to determine a second analysis result comprises:
combining at least two minimum independent elements, and inputting the combined elements into a failure analysis database and a structural analysis database;
the failure analysis database outputs a fourth matching result;
the structural analysis database outputs a fifth matching result;
determining a second analysis result based on the fourth matching result and the fifth matching result.
5. The method of claim 1, wherein the step of determining a risk level of the aerospace sealed integrated circuit based on the application environment of the aerospace sealed integrated circuit from the first analysis result and the second analysis result comprises:
determining the application environment of the aerospace sealed integrated circuit;
and determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
6. The method of claim 1, wherein the step of physically dissecting the aerospace seal integrated circuit into a plurality of units based on the context information comprises:
according to the background information, the aerospace seal integrated circuit is physically dissected into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
7. An aerospace seal integrated circuit early screening and risk prediction device, the device comprising:
the first determining module is used for determining background information of the aerospace seal integrated circuit;
the dissection module is used for physically dissecting the aerospace seal integrated circuit into a plurality of units according to the background information;
an analysis module for performing a performance analysis on the plurality of the cells after dissection;
a second determination module for determining a minimum independent element of the aerospace sealed integrated circuit;
the third determining module is used for analyzing each minimum independent element and determining a first analysis result;
the fourth determining module is used for analyzing at least two minimum independent elements after the minimum independent elements are combined to determine a second analysis result;
and the fifth determining module is used for determining the risk level of the aerospace sealed integrated circuit according to the first analysis result and the second analysis result based on the application environment of the aerospace sealed integrated circuit.
8. The apparatus of claim 7, wherein the second determining module comprises:
the first matching submodule is used for inputting the parameters of the aerospace seal integrated circuit into an aerospace component structure information database for matching;
the first output submodule is used for outputting a first matching result by the aerospace component structure information database;
and the first determining submodule is used for determining the minimum independent element of the aerospace sealed integrated circuit based on the first matching result.
9. The apparatus of claim 7, wherein the second analysis module comprises:
a first input submodule for inputting the minimum independent elements into a failure analysis database and a structural analysis database;
the second output submodule is used for outputting a second matching result by the failure analysis database;
the third output submodule is used for outputting a third matching result by the structural analysis database;
and the second determining submodule is used for analyzing each minimum independent element based on the second matching result and the third matching result to determine a first analysis result.
10. The apparatus of claim 7, wherein the fourth determining module comprises:
the second input submodule is used for inputting the combined at least two minimum independent elements into the failure analysis database and the structural analysis database;
the fourth output submodule is used for outputting a fourth matching result by the failure analysis database;
the fifth output submodule is used for outputting a fifth matching result by the structural analysis database;
a third determining submodule, configured to determine a second analysis result based on the fourth matching result and the fifth matching result.
11. The apparatus of claim 7, wherein the fifth determining module comprises:
the fourth determination submodule is used for determining the application environment of the aerospace sealed integrated circuit;
and the fifth determining submodule is used for determining the risk level of the aerospace seal integrated circuit according to the application environment, the first analysis result and the second analysis result.
12. The apparatus of claim 7, wherein the first determining module is specifically configured to:
according to the background information, the aerospace seal integrated circuit is physically dissected into a plurality of units through an aerospace component structure information database, wherein the background information comprises at least one of the following: derating requirements, heat dissipation requirements, installation requirements, resistance to mechanical strength requirements, environmental temperature requirements, vacuum environment requirements, and radiation resistance requirements.
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| CN202011507458.8A CN112541321B (en) | 2020-12-18 | Method and device for early screening and risk prediction of aerospace seal integrated circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011507458.8A CN112541321B (en) | 2020-12-18 | Method and device for early screening and risk prediction of aerospace seal integrated circuit |
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