CN106566453A - 一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 - Google Patents
一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 Download PDFInfo
- Publication number
- CN106566453A CN106566453A CN201610913780.8A CN201610913780A CN106566453A CN 106566453 A CN106566453 A CN 106566453A CN 201610913780 A CN201610913780 A CN 201610913780A CN 106566453 A CN106566453 A CN 106566453A
- Authority
- CN
- China
- Prior art keywords
- parts
- end capped
- sealant
- preparation
- silane end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
本发明公开了一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,由以下重量份的原料制成:玻化微珠2‑3,碳纤维2‑4,二氧化硅1‑2,二甲基甲酰胺5‑10,异佛尔酮二异氰酸酯10‑15,氯仿适量,膨润土1‑2,聚硅氮烷10‑15,乙醇15‑20,纳米碳酸钙3‑5,氮气适量,邻苯二甲酸酯4‑8,硅烷封端聚氨酯预聚体25‑30,有机锡0.2‑0.3,月桂胺0.04‑0.06;本发明用异佛尔酮二异氰酸酯改性碳纤维,添加到密封胶中,赋予密封胶可以导电的性能,并且密封性良好,广泛应用于水利工程的各个方面;通过玻化微珠等的加入,使得该密封胶具有更宽的温度适用范围。
Description
技术领域
本发明涉及高分子复合材料领域,具体涉及一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法。
背景技术
硅烷改性聚氨醋密封胶又称SPU密封胶。SPU密封胶的基础聚合物是端硅烷的聚氨酷(又称SPU预聚体)。它是通过含胺基的的硅烷和端NCO基团的聚氨酷预聚体进行加成得到的,用有机硅改性聚氨醋可以综合二者的优异性能,弥补聚氨酷耐水解性、耐温性差的缺陷,使改性聚氨酷表现出良好的憎水性,表面富集性,低温柔顺性和优良的生物相容性等。现今,水底船舶、海上平台、水利工程、隧道大大发展,所以对具有阻水性能的海底电缆、超高压电缆和通信电缆等都有大量需要。而要实现阻水功能,电缆的密封胶是必不可少的。目前已有的轴向阻水电缆密封胶都是不导电的,不能在隔绝水分的同时又起到均匀电场的作用,而这一点在中高压海底电缆中是尤其重要的。
李吉明在《单组分湿固化硅烷封端聚氨酯密封胶的制备及性能研究》文章中,以硅烷封端聚氨酯预聚物为基础聚合物,制备了单组分湿固化硅烷封端聚氨酯密封胶,但是应用于海底电缆、通信电缆时,还存在着导电性缺失、防水性不佳等缺点。
发明内容
基于以上的思考,本发明旨在提供一种具有导电性、防水性良好的硅烷封端聚氨酯密封胶及其制备方法。
本发明所要解决的技术问题采用以下的技术方案来实现 :
一种温度适用范围宽的导电硅烷封端聚氨酯密封胶,其特征在于,是由以下重量份的原料制成:
玻化微珠2-3,碳纤维2-4,二氧化硅1-2,二甲基甲酰胺5-10,异佛尔酮二异氰酸酯10-15,氯仿适量,膨润土1-2,聚硅氮烷10-15,乙醇15-20,纳米碳酸钙3-5,氮气适量,邻苯二甲酸酯4-8,硅烷封端聚氨酯预聚体25-30,有机锡0.2-0.3,月桂胺0.04-0.06;
所述的有机锡为二月桂酸二丁基锡。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,是由以下步骤制成:
a. 将碳纤维、二氧化硅、硅藻土加入到二甲基甲酰胺中, 磁力搅拌均匀后加入异佛尔酮二异氰酸酯,室温密闭反应20-25h后抽滤,用氯仿洗涤多余的异佛尔酮二异氰酸酯2-4次,自然干燥后研磨,得到异氰酸酯改性碳纤维、二氧化硅、硅藻土混合物;
b. 将聚硅氮烷溶于乙醇中,向其中加入纳米碳酸钙,超声分散均匀后,通入湿润氮气,使聚硅氮烷在纳米碳酸钙表面原位反应生成表面带有活性氨基修饰的二氧化硅纳米颗粒,过滤并烘干,得到表面包覆二氧化硅纳米颗粒,并且二氧化硅表面带有活性氨基修饰的纳米碳酸钙混合物;
c. 将步骤a所得混合物、步骤b所得混合物在150-180℃条件下真空脱水3-6h,将邻苯二甲酸酯在100-130℃条件下真空脱水2-4h后,加入到硅烷封端聚氨酯预聚体中,再加入有机锡和月桂胺、玻化微珠,混合均匀后在三辊研磨机上混合3遍,罐装储存即可。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,湿润氮气的含水汽量为0.5-2.5。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,步骤a所得改性碳纤维、步骤b所得混合物真空脱水至使用卡尔费休水分测定仪测水分含量在500ppm以下,邻苯二甲酸酯真空脱水至水分含量在400ppm以下。
本发明的有益效果是:本发明用异佛尔酮二异氰酸酯改性碳纤维,添加到密封胶中,赋予密封胶可以导电的性能,并且密封性良好,经该导电密封胶密封的电缆料能广泛应用于水利工程的各个方面,尤其适用于海底电缆;利用聚硅氮烷在纳米碳酸钙表面原位生成活性氨基修饰的纳米二氧化硅,不仅可以达到增强、增韧密封胶的效果,同时二氧化硅表面修饰的活性氨基能和硅烷封端聚氨酯预聚体反应,形成强相互作用,阻碍原位生成的纳米粒子发生团聚,有效提高包裹纳米碳酸钙的二氧化硅纳米粒子在密封胶中的分散性,从而进一步增强、增韧密封胶;通过玻化微珠等的加入,使得该密封胶具有更宽的温度适用范围。
具体实施方式
下面结合实施例, 对本发明的具体实施方式作进一步描述。
实施例
一种温度适用范围宽的导电硅烷封端聚氨酯密封胶,其特征在于,是由以下重量份的原料制成:
玻化微珠3,碳纤维4,二氧化硅2,二甲基甲酰胺10,异佛尔酮二异氰酸酯15,氯仿适量,膨润土2,聚硅氮烷15,乙醇20,纳米碳酸钙5,氮气适量,邻苯二甲酸酯8,硅烷封端聚氨酯预聚体30,有机锡0.3,月桂胺0.06;
所述的有机锡为二月桂酸二丁基锡。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,是由以下步骤制成:
a. 将碳纤维、二氧化硅、硅藻土加入到二甲基甲酰胺中, 磁力搅拌均匀后加入异佛尔酮二异氰酸酯,室温密闭反应20-25h后抽滤,用氯仿洗涤多余的异佛尔酮二异氰酸酯2-4次,自然干燥后研磨,得到异氰酸酯改性碳纤维、二氧化硅、硅藻土混合物;
b. 将聚硅氮烷溶于乙醇中,向其中加入纳米碳酸钙,超声分散均匀后,通入湿润氮气,使聚硅氮烷在纳米碳酸钙表面原位反应生成表面带有活性氨基修饰的二氧化硅纳米颗粒,过滤并烘干,得到表面包覆二氧化硅纳米颗粒,并且二氧化硅表面带有活性氨基修饰的纳米碳酸钙混合物;
c. 将步骤a所得混合物、步骤b所得混合物在150-180℃条件下真空脱水3-6h,将邻苯二甲酸酯在100-130℃条件下真空脱水2-4h后,加入到硅烷封端聚氨酯预聚体中,再加入有机锡和月桂胺、玻化微珠,混合均匀后在三辊研磨机上混合3遍,罐装储存即可。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,湿润氮气的含水汽量为0.5-2.5。
所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,步骤a所得改性碳纤维、步骤b所得混合物真空脱水至使用卡尔费休水分测定仪测水分含量在500ppm以下,邻苯二甲酸酯真空脱水至水分含量在400ppm以下。
本发明技术参数为:体积电阻率≤ 1Ω·m;密封胶室温、湿气条件表干时间≤15min;拉伸强度≥6.0MPa。
Claims (4)
1.一种温度适用范围宽的导电硅烷封端聚氨酯密封胶,其特征在于,是由以下重量份的原料制成:
玻化微珠2-3,碳纤维2-4,二氧化硅1-2,二甲基甲酰胺5-10,异佛尔酮二异氰酸酯10-15,氯仿适量,膨润土1-2,聚硅氮烷10-15,乙醇15-20,纳米碳酸钙3-5,氮气适量,邻苯二甲酸酯4-8,硅烷封端聚氨酯预聚体25-30,有机锡0.2-0.3,月桂胺0.04-0.06;
所述的有机锡为二月桂酸二丁基锡。
2.根据权利要求1所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,是由以下步骤制成:
a. 将碳纤维、二氧化硅、硅藻土加入到二甲基甲酰胺中, 磁力搅拌均匀后加入异佛尔酮二异氰酸酯,室温密闭反应20-25h后抽滤,用氯仿洗涤多余的异佛尔酮二异氰酸酯2-4次,自然干燥后研磨,得到异氰酸酯改性碳纤维、二氧化硅、硅藻土混合物;
b. 将聚硅氮烷溶于乙醇中,向其中加入纳米碳酸钙,超声分散均匀后,通入湿润氮气,使聚硅氮烷在纳米碳酸钙表面原位反应生成表面带有活性氨基修饰的二氧化硅纳米颗粒,过滤并烘干,得到表面包覆二氧化硅纳米颗粒,并且二氧化硅表面带有活性氨基修饰的纳米碳酸钙混合物;
c. 将步骤a所得混合物、步骤b所得混合物在150-180℃条件下真空脱水3-6h,将邻苯二甲酸酯在100-130℃条件下真空脱水2-4h后,加入到硅烷封端聚氨酯预聚体中,再加入有机锡和月桂胺、玻化微珠,混合均匀后在三辊研磨机上混合3遍,罐装储存即可。
3.根据权利要求2所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,湿润氮气的含水汽量为0.5-2.5。
4.根据权利要求2所述的一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法,其特征在于,步骤a所得改性碳纤维、步骤b所得混合物真空脱水至使用卡尔费休水分测定仪测水分含量在500ppm以下,邻苯二甲酸酯真空脱水至水分含量在400ppm以下。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610913780.8A CN106566453A (zh) | 2016-10-20 | 2016-10-20 | 一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610913780.8A CN106566453A (zh) | 2016-10-20 | 2016-10-20 | 一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106566453A true CN106566453A (zh) | 2017-04-19 |
Family
ID=58533208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610913780.8A Pending CN106566453A (zh) | 2016-10-20 | 2016-10-20 | 一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106566453A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107022183A (zh) * | 2017-05-18 | 2017-08-08 | 成都新柯力化工科技有限公司 | 一种汽车工程塑料专用石墨烯母料的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102408866A (zh) * | 2011-10-31 | 2012-04-11 | 东莞市普赛达密封粘胶有限公司 | 一种遇水膨胀单组份聚氨酯密封胶的制备方法 |
CN104558644A (zh) * | 2014-12-01 | 2015-04-29 | 沈阳航空航天大学 | 一种连续纤维增强混杂多尺度复合材料的制备方法 |
CN104592734A (zh) * | 2013-10-30 | 2015-05-06 | 信越化学工业株式会社 | 光半导体密封用固化性组合物及使用其的光半导体装置 |
CN105038681A (zh) * | 2015-08-28 | 2015-11-11 | 上海蒂姆新材料科技有限公司 | 一种硅烷改性树脂密封胶及其制备方法 |
-
2016
- 2016-10-20 CN CN201610913780.8A patent/CN106566453A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102408866A (zh) * | 2011-10-31 | 2012-04-11 | 东莞市普赛达密封粘胶有限公司 | 一种遇水膨胀单组份聚氨酯密封胶的制备方法 |
CN104592734A (zh) * | 2013-10-30 | 2015-05-06 | 信越化学工业株式会社 | 光半导体密封用固化性组合物及使用其的光半导体装置 |
CN104558644A (zh) * | 2014-12-01 | 2015-04-29 | 沈阳航空航天大学 | 一种连续纤维增强混杂多尺度复合材料的制备方法 |
CN105038681A (zh) * | 2015-08-28 | 2015-11-11 | 上海蒂姆新材料科技有限公司 | 一种硅烷改性树脂密封胶及其制备方法 |
Non-Patent Citations (1)
Title |
---|
夏磊 等: "硅改性密封剂的进展", 《广州化学》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107022183A (zh) * | 2017-05-18 | 2017-08-08 | 成都新柯力化工科技有限公司 | 一种汽车工程塑料专用石墨烯母料的制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110951435B (zh) | 一种高强度等比例硅烷改性聚醚密封胶及其制备方法 | |
CN102702688B (zh) | 一种双酚a型环氧树脂/凹凸棒土纳米复合材料的制备方法 | |
CN108165208B (zh) | 一种胶黏剂 | |
CN104388095B (zh) | 双组份纳米高分子固沙材料及其固沙方法 | |
CN106243971A (zh) | 新型复合高铁防水材料及其制备方法 | |
WO2008143643A3 (en) | Intercalation agent free compositions useful to make nanocomposite polymers | |
CN104910850A (zh) | 一种高强耐水防霉玻璃胶 | |
CN116640457B (zh) | 一种用于防水卷材的改性沥青及其制备方法 | |
CN106566453A (zh) | 一种温度适用范围宽的导电硅烷封端聚氨酯密封胶及其制备方法 | |
KR20060065629A (ko) | 소수성 복합체 및 미립자 및 이들의 용도 | |
CN106380117A (zh) | 一种耐磨性能好的自清洁透水砖及其制备方法 | |
CN110421921B (zh) | 一种抗渗膨润土防水毯及其加工工艺 | |
CN109866490B (zh) | 一种用于土壤修复的多层复合土工膜及其制备方法 | |
CN106479423A (zh) | 一种耐老化、导电的单组分湿固化聚氨酯密封胶及其制备方法 | |
CN108863280B (zh) | 一种泥岩注浆材料 | |
CN113563640A (zh) | 一种生物质人造草坪弹性填充颗粒 | |
CN106566455A (zh) | 一种高剥离强度的导电聚氨酯密封胶及其制备方法 | |
CN106566454A (zh) | 一种抗菌、导电的硅烷封端聚氨酯密封胶及其制备方法 | |
CN109680496B (zh) | 芳纶表面改性方法及表面改性芳纶 | |
CN109777281A (zh) | 一种石材防护剂及其制备方法 | |
CN106566452A (zh) | 一种导电的单组分湿固化硅烷封端聚氨酯密封胶及其制备方法 | |
CN106497488A (zh) | 一种防冻的、导电硅烷封端聚氨酯密封胶及其制备方法 | |
CN106566396A (zh) | 一种含沸石的导电单组分湿固化硅烷封端聚氨酯密封胶及其制备方法 | |
CN110041889B (zh) | 环保结壳型抑尘剂及其制备方法和使用方法 | |
CN108178571A (zh) | 一种高强度路面材料及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170419 |