CN106562687A - Baking pan assembly and frying and baking machine - Google Patents
Baking pan assembly and frying and baking machine Download PDFInfo
- Publication number
- CN106562687A CN106562687A CN201610982858.1A CN201610982858A CN106562687A CN 106562687 A CN106562687 A CN 106562687A CN 201610982858 A CN201610982858 A CN 201610982858A CN 106562687 A CN106562687 A CN 106562687A
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- CN
- China
- Prior art keywords
- baking tray
- heating board
- baking
- glass heating
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/06—Roasters; Grills; Sandwich grills
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J37/00—Baking; Roasting; Grilling; Frying
- A47J37/10—Frying pans, e.g. frying pans with integrated lids or basting devices
- A47J37/105—Frying pans, e.g. frying pans with integrated lids or basting devices electrically heated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/028—Heaters specially adapted for trays or plates to keep food or liquids hot
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Baking, Grill, Roasting (AREA)
- Cookers (AREA)
Abstract
The invention discloses a baking pan assembly and a frying and baking machine. The baking pan assembly comprises a bracket, a glass heating plate and a baking pan, wherein the glass heating plate is arranged on the bracket, the baking pan is a metal pan, the baking pan is arranged on the glass heating plate, the gap between the baking pan and the glass heating plate is greater than or equal to 0 and smaller than or equal to 0.2mm, and the baking pan is fixedly connected with the glass heating plate or the bracket at the edge, so that the phenomenon that the edge of the baking pan upwarps after the baking pan is heated is avoided. According to the baking pan assembly provided by the invention, the heating speed of the baking pan can be accelerated, the heating uniformity of the baking pan can be improved, and meanwhile, the overhigh temperature of a heat source and the bracket of the baking pan assembly can be avoided, so that the use reliability and safety of the baking pan assembly can be guaranteed.
Description
Technical field
The present invention relates to field of household appliances, more particularly, to a kind of baking tray component and baking machine.
Background technology
In the production of baking tray, limited by processing technique, especially in the case of batch production, metal baking tray surface adds
Work is not smooth enough, and metal baking tray cannot be accomplished to fit completely with glass plate under room temperature.And in baking tray and glass plate heating process, by
Different in thermal stress and thermal coefficient of expansion, aluminum pot can produce deformation (convex deformation under centre), cause aluminium dish zone line and glass
Plate is contacted, thermal resistance increase between other regions and glass plate.
The content of the invention
It is contemplated that technical problem present in prior art is at least solved, for this purpose, the present invention provides a kind of baking tray group
Part, the baking tray component can ensure that the gap between baking tray and glass plate is less, thermal resistance is less.
The present invention is also directed to a kind of baking machine with above-mentioned baking tray component.
Baking tray component of the invention, including:Support;Glass heating board, the glass heating board is located at the support
On;Baking tray, the baking tray is metal dish, and the baking tray is located on the glass heating board, and the baking tray generates heat with the glass
More than or equal to 0 and less than or equal to 0.2mm, the baking tray is in edge and the glass heating board or described in gap between plate
Support be fixedly connected with avoid the baking tray be heated back edge tilt.
Baking tray component of the invention, by the way that the gap between baking tray and glass heating board is limited to more than or equal to 0
And less than or equal to 0.2mm, while baking tray is fixedly connected in edge, so as to the firing rate of baking tray can be accelerated, improve
The heating uniformity of baking tray, while the thermal source and backing temp of baking tray component can be avoided too high, it is ensured that baking tray component is used
Reliability and safety.
In certain embodiments, the support is provided with the briquetting being compressed on the baking tray in edge.
In further embodiments, the baking tray is gluing is fixed on the glass heating board.
Alternatively, the baking tray is bonded on the glass heating board by high-temp glue.
In other embodiment, the baking tray is threaded on the glass heating board or the support.
In certain embodiments, the baking tray is rectangle, the baking tray at four sides or four corners with it is described
Glass heating board or the support are fixedly connected.
Specifically, the baking tray is plane just to the surface of the glass heating board.
Further, the thickness of the glass heating board is 1mm-5mm.
Preferably, the thickness of the glass heating board is 2mm-3mm.
Baking machine of the invention, including the baking tray component according to the above embodiment of the present invention.
Baking machine of the invention, due to being provided with above-mentioned baking tray component, therefore can accelerate the firing rate of baking machine,
Heating uniformity is improved, while avoiding the thermal source and external temperature of baking machine too high, it is ensured that reliability that baking machine is used and
Safety.
The additional aspect and advantage of the present invention will be set forth in part in the description, and partly will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from the description with reference to accompanying drawings below to embodiment
It is substantially and easy to understand, wherein:
Fig. 1 is the top view of baking tray component according to embodiments of the present invention;
Fig. 2 is the exploded view of baking tray component according to embodiments of the present invention;
Fig. 3 is the profile of baking tray component according to embodiments of the present invention;
Fig. 4 is the part sectioned view of the baking tray component in one embodiment of the invention;
Fig. 5 is the part sectioned view of baking tray component middle according to a further embodiment of the invention;
Fig. 6 is the temperature that thermal source, support and the shell of baking tray component according to embodiments of the present invention changes with air layer thickness
Degree change schematic diagram;
Fig. 7 be baking tray component according to embodiments of the present invention in different air layer thickness condition lower baking disk temperature with heating
The change schematic diagram of time;
It according to baking tray component in one embodiment of the invention in air layer thickness is 0 and thermal source temperature during 0.2mm that Fig. 8 is
Degree, the contrast table of skin temperature;
Fig. 9 is the deformation cloud atlas after aluminum flat heater;
Figure 10 is experimental comparison figure when baking tray is unlocked and fixed in corner.
Reference:
Baking tray component 100, baking tray 1, screwed hole 11, boss 12, glass heating board 2, support 3, shell 4, threaded connector
5th, briquetting 6, heat shield 7.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Baking tray component 100 according to embodiments of the present invention is described below with reference to Fig. 1-Figure 10.
Baking tray component 100 according to embodiments of the present invention, as shown in Figure 1-Figure 3, including:Support 3, the and of glass heating board 2
Baking tray 1, glass heating board 2 is located on support 3.Baking tray 1 is metal dish, and baking tray 1 is located on glass heating board 2.
Wherein, support 3 is the support member of glass heating board 2 and baking tray 1.In some embodiments, support 3 also can be used as roasting
The housing of disk component 100 is used, and is placed directly within housing equivalent to glass heating board 2.In further embodiments, such as Fig. 2 and
Shown in Fig. 3, the outside of support 3 is additionally provided with shell 4, and heat shield 7 is provided between support 3 and glass heating board 2, is sent out with reducing glass
Hot plate 2 externally conducts heat.
Specifically, glass heating board 2 is located between support 3 and baking tray 1, and baking plate 1 carries out adding after glass heating board 2 generates heat
Heat.In certain embodiments, glass heating board 2 is provided with thin film heater in the side away from baking tray 1, after thin film heater is powered
Simultaneously baking plate 1 is heated for heating, and glass plate is equivalent to the insulation board between thin film heater and baking tray 1.
The discovery of inventor Jing experimental analysiss, the speed of the thin and thick baking plate heating of air layer between baking tray 1 and glass heating board 2
The parameters such as degree, baking tray component external temperature affect larger.
Illustrate by taking the experiment that the baking tray component 100 of Fig. 1-embodiment illustrated in fig. 3 is carried out as an example.
Fig. 6 is illustrated in the embodiment after the experiment of baking tray component 100, and thermal source, support 3 and the shell 4 for summing up is with air
The temperature change schematic diagram of layer thickness variation, can be seen that by the figure:1st, the air between metal baking tray 1 and glass heating board 2
Impact of the thickness degree to heat source temperature and the temperature of shell 4 is larger;2nd, when the thickness of air layer is when 0 is changed to 0.5mm, thermal source temperature
Degree rises to 447 DEG C by 194 DEG C, and the temperature of shell 4 rises to 67 DEG C by 45 DEG C.
It is understood that if the heat source temperature of baking tray component 100 is too high, thermal source circuit may burn out, thermal source
Temperature determines the use reliability of baking tray component 100, and the temperature of shell 4 then determines that using for baking tray component 100 is safe
Property.So the air layer thickness that can be seen that by the analysis result of Fig. 6 between baking tray 1 and glass heating board 2 can affect baking tray group
The reliability and safety of part 100.
Fig. 7 is illustrated in the embodiment after baking tray component 100 tests, sum up in different air layer thickness conditions
Under, the temperature of baking tray 1 with heat time heating time change schematic diagram.Can be seen that by the figure:1st, metal baking tray 1 and glass heating board 2 it
Between air layer thickness affect the pre-heating temperature elevation speed of baking tray 1, air layer thickness increase, the time of cooking food can be extended;2nd, when roasting
When 20 DEG C rise to 140 DEG C, air layer thickness only needs to 105s to the temperature of disk 1 in the case of 0mm, and air layer thickness exists
212s, air layer thickness is then needed to extend in the situation of 0mm in the situation relative atmospheric thickness degree of 0.4mm in the case of 0.4mm
102% cooking time.
By the analysis of above-mentioned two variation diagram it is found that air layer is thicker between baking tray 1 and glass heating board 2, then bake
The heat time heating time that disk 1 needs is longer, while the temperature of thermal source, support 3 and shell 4 also can be higher;Conversely, baking tray 1 is sent out with glass
Air layer is thinner between hot plate 2, then the heat time heating time that baking tray 1 needs is shorter, while the temperature of thermal source, support 3 and shell 4 also can
It is lower.
This can also be construed to, when air layer thickness gets over hour between baking tray 1 and glass heating board 2, glass heating board 2 to
The thermal resistance of the heat transfer of baking tray 1 is less, and heat can quickly be transferred to baking tray 1 with more on glass heating board 2 so that baking tray 1 is heated
Time shortens, while according to the conservation principle of heat, the remaining heat of thermal source, thermal source are transferred to support 3, the heat of shell 4 and subtract
It is few, therefore the temperature of thermal source, support 3 and shell 4 also can be relatively low;Otherwise it is then anti-.
The experimental analysiss figure of comprehensive Fig. 6 and Fig. 7, still further it can be seen that, the air layer between baking tray 1 and glass heating board 2
When thickness is between 0 to 0.2mm, the air layer thickness value changes are on the temperature impact of thermal source, support 3, back cover, to heat time heating time
Impact it is most obvious, and in the thickness range, thermal source, support 3, back cover temperature it is most preferable.
Fig. 8 illustrate baking tray component 100 air layer thickness be 0 and heat source temperature during 0.2mm, the temperature of shell 4 it is right
Than table, when air layer thickness is 0, heat source temperature is 152 DEG C, and the temperature of shell 4 is 50 DEG C;When air layer thickness is 0.2mm,
Heat source temperature is 276.8 DEG C, and the temperature of shell 4 is 59.7 DEG C.As can be seen that when the air layer between baking tray 1 and glass heating board 2
Thickness is more than or equal to 0 and during less than or equal to 0.2mm, and the bottom temp of baking tray component 100 is not high, safety preferably, the temperature of thermal source
Degree is also less high, threatens little to its circuit.
Therefore, the gap between baking tray 1 and glass heating board 2 is set greater than in the embodiment of the present invention being equal to 0 and little
In 0.2mm is not more than equal to 0.2mm, i.e. air layer thickness, so, the firing rate of baking tray 1 was both can guarantee that, baking tray can have been avoided again
The bottom temp of component 100 is too high, so as to ensure that practicality, reliability and safety that baking tray component 100 is used.
Only pipe baking tray component 100 in design and production and processing, according to above-mentioned parameter by baking tray 1 and glass heating board 2
Between gap be limited within 0.2mm, but inevitably, baking tray 1 when in use can temperature distortion, air after deformation
Layer thickness variation is larger.
With specification as 260*280*2, the aluminum flat board of (i.e. thickness 2mm, wide 260mm, thick 280mm) carries out Heating Experiment to inventor,
And analyze the deformation result measured of experiment.
Fig. 9 illustrates the deformation cloud atlas after the aluminum flat heater, from fig. 9, it can be seen that aluminum flat board is little in center deformation,
Deform in edge larger.It is additionally observed that in experiment, aluminium sheet understands mid portion to lower recess after being heated, and the edge of aluminium sheet sticks up
Rise.It can therefore be concluded that go out, if the temperature distortion of metal baking tray 1, the central area of baking tray 1 can be because to lower recess and glass
Heating board 2 is contacted, and the edge of baking tray 1 is increased considerably with the distance of glass heating board 2, causes the marginal area of baking tray 1 by hot
Reduce, have a strong impact on the firing rate of baking tray 1 and the temperature homogeneity of baking tray 1.
To solve the above problems, propose baking tray 1 in the embodiment of the present invention in edge and glass heating board 2 or support
3 are fixedly connected, with avoid baking tray 1 be heated back edge tilt.
To verify the feasibility of above-mentioned method for designing, inventor has carried out baking tray and has fixed with edge edge is unlocked
Firmly test experiments of two kinds of situations.As shown in Figure 10, baking tray thickness is 2mm in experiment, two kinds of situation lower baking disks of experiment test
Initial temperature, baking tray up to heat time heating time when 140 DEG C, baking tray up to support bottom temperature when 140 DEG C.Randomly select in experiment roasting
Five location points are to test the temperature of baking tray on disk, and calculate the temperature difference and standard deviation of five location points.
Can be seen that after baking tray is fixed in edge by the Experimental comparison results of Figure 10, the heating speed of baking tray can be improved
The temperature homogeneity of degree, the bottom temp of baking tray component and baking tray.
Baking tray component 100 according to embodiments of the present invention, by the way that the gap between baking tray 1 and glass heating board 2 is limited
More than or equal to 0 and less than or equal to 0.2mm, while baking tray 1 is fixedly connected in edge with glass heating board 2 or support 3,
Air layer that can be between thinning metal baking tray 1 and glass heating board 2, reduces thermal contact resistance, so as to accelerate the heating speed of baking tray 1
Degree, improves the heating uniformity of baking tray 1, while avoiding the thermal source and external temperature of baking tray component 100 too high, it is ensured that baking tray group
The reliability and safety that part 100 is used.
In embodiments of the present invention, baking tray 1 is plane just to the surface of glass heating board 2, and metal baking tray 1 adds man-hour, pot
Bottom surface initially ensures that smooth, is so easily guaranteed that baking tray 1 can be fitted on glass heating board 2.
In embodiments of the present invention, glass heating board 2 selects microcrystal glass plate, glass heating board 2 to have enough intensity,
Pressure can be born and not damaged, the thickness of glass heating board 2 gets over Bao Yuehao, such as the thickness choosing of glass heating board 2 under the premise of here
With 1mm-5mm, preferred 2mm~3mm.
In embodiments of the present invention, when baking tray 1 is fixed, baking tray 1 can be directly fixedly connected on glass heating board 2,
Baking tray 1 can be fixedly connected on support 3, support 3 is by the way that baking tray 1 is suppressed towards glass heating board 2 so that the energy of baking tray 1
More preferably it is fitted on glass heating board 2.
When fixed, baking tray 1 can be fixed a circle along edge, it is also possible to which multiple points are chosen on the edge of baking tray 1 to be carried out admittedly
It is fixed.For example, baking tray 1 is rectangle, and the four of baking tray 1 sides can be fixedly connected with glass heating board 2 or support 3, also may be used
Four turnings of baking tray 1 are fixedly connected on glass heating board 2 or support 3.
In the example in figure 2, baking tray 1 can be pre-fixed with glass heating board 2 using corner symmetric position, also can be adopted
Fixed with glass plate with the side of baking tray bottom surface four, wherein, preferred corner symmetric position is fixed.
In embodiments of the present invention, the version that baking tray 1 is fixedly connected with support 3 or glass heating board 2 is had into many
Kind, can be fixed by the way of physics extrusion, it is also possible to by the gluing fixation of baking tray 1.
It is easy from gluing fixed form operation, and each modular construction of baking tray component 100 is with respect to existing structure change
Float little, improvement cost is low.Alternatively, baking tray 1 can be bonded on glass heating board 2 by high-temp glue, and baking tray 1 is at corner
Fixed by high-temp glue with glass heating board 2.
It is preferable from the fixed form reliability of physics extrusion, in certain embodiments, as shown in figure 4, support 3 is at edge
Place can be provided with briquetting 6, and briquetting 6 is compressed on baking tray 1, and briquetting 6 can be pressed on baking tray 1 on glass heating board 2, it is to avoid baking tray 1
Back edge of being heated sticks up.
In further embodiments, baking tray 1 can be threaded connection and be fixed on glass heating board 2 or support 3.As schemed
In 5, baking tray 1 is provided with screwed hole 11, and glass heating board 2 is threaded connection part 5 and is fixed on screw thread through after glass heating board 2
On hole 11.In addition, baking tray 1 can set boss 12 at screwed hole 11, to increase the thickness of baking tray 1, it is ensured that connection reliability.
To sum up, using physical impact or directly gluing form, baking tray 1 can be made to fit well by by baking tray 1
On glass heating board 2, the air layer between metal baking tray 1 and glass heating board 2 is eliminated, reduce thermal contact resistance.
Baking machine according to embodiments of the present invention, including the baking tray component 100 according to the above embodiment of the present invention, bakes
The structure of disk component 100 is repeated no more here.
Baking machine can have a baking tray component 100 as described in the above embodiment the present invention, it is also possible to arrange two
Baking tray component 100.In some instances, two baking tray components 100 are oppositely arranged.Due to being provided with above-mentioned baking tray component 100, because
This can accelerate the firing rate of baking machine, improve heating uniformity, while avoiding the thermal source and external temperature of baking machine too high, protect
The reliability and safety that baking machine is used is demonstrate,proved.
In describing the invention, it is to be understood that term " " center ", " thickness ", " on ", D score, " vertical ", " water
It is flat ", " top ", " bottom ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship,
Be for only for ease of description the present invention and simplify description, rather than indicate or imply indication device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of this specification, the description of reference term " embodiment ", " example " etc. mean to combine the embodiment or
Specific features, structure, material or the feature that example is described is contained at least one embodiment of the present invention or example.At this
In description, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, description it is concrete
Feature, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that:Not
These embodiments can be carried out with various changes, modification, replacement and modification in the case of the principle and objective that depart from the present invention, this
The scope of invention is limited by claim and its equivalent.
Claims (10)
1. a kind of baking tray component, it is characterised in that include:
Support;
Glass heating board, the glass heating board sets on the bracket;
Baking tray, the baking tray is metal dish, and the baking tray is located on the glass heating board, and the baking tray generates heat with the glass
More than or equal to 0 and less than or equal to 0.2mm, the baking tray is in edge and the glass heating board or described in gap between plate
Support be fixedly connected with avoid the baking tray be heated back edge tilt.
2. baking tray component according to claim 1, it is characterised in that the support edge be provided be compressed on it is described roasting
Briquetting on disk.
3. baking tray component according to claim 1, it is characterised in that the baking tray is gluing to be fixed on the glass heating
Plate.
4. baking tray component according to claim 3, it is characterised in that the baking tray is bonded in the glass by high-temp glue
On heating board.
5. baking tray component according to claim 1, it is characterised in that the baking tray is threaded in the glass heating board
Or on the support.
6. the baking tray component according to any one of claim 1-5, it is characterised in that the baking tray is rectangle, it is described roasting
Either four corners are fixedly connected disk with the glass heating board or the support at four sides.
7. the baking tray component according to any one of claim 1-5, it is characterised in that the baking tray just to the glass
The surface of heating board is plane.
8. the baking tray component according to any one of claim 1-5, it is characterised in that the thickness of the glass heating board is
1mm-5mm。
9. baking tray component according to claim 8, it is characterised in that the thickness of the glass heating board is 2mm-3mm.
10. a kind of baking machine, it is characterised in that include the baking tray component according to any one of claim 1-9.
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CN105433818A (en) * | 2014-09-30 | 2016-03-30 | 佛山市顺德区美的电热电器制造有限公司 | Baking tray assembly of frying and baking machine and frying and baking machine |
CN105559626A (en) * | 2016-03-07 | 2016-05-11 | 无锡市行远实业有限公司 | Energy-saving and environment-friendly barbecue oven |
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KR20050037266A (en) * | 2003-10-17 | 2005-04-21 | 양민용 | Heat balance apparatus of the roster |
CN202515474U (en) * | 2012-02-06 | 2012-11-07 | 美的集团有限公司 | Frying and baking machine |
CN203468382U (en) * | 2013-06-14 | 2014-03-12 | 九阳股份有限公司 | Frying and baking machine with even heating |
CN204133251U (en) * | 2014-09-30 | 2015-02-04 | 佛山市顺德区美的电热电器制造有限公司 | Glass-ceramics heating plate mounting structure and decoct roasting machine |
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CN105559626A (en) * | 2016-03-07 | 2016-05-11 | 无锡市行远实业有限公司 | Energy-saving and environment-friendly barbecue oven |
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Publication number | Publication date |
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CN106562687B (en) | 2019-11-29 |
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Effective date of registration: 20210324 Address after: 528311 4 Global Innovation Center, industrial road, Beijiao Town, Shunde District, Foshan, Guangdong, China Patentee after: GUANGDONG MEIDI WHITE HOUSEHOLD ELECTRICAL APPLIANCE TECHNOLOGY INNOVATION CENTER Co.,Ltd. Patentee after: MIDEA GROUP Co.,Ltd. Address before: 528311, 26-28, B District, Mei headquarters building, 6 Mei Road, Beijiao Town, Shunde District, Foshan, Guangdong. Patentee before: MIDEA GROUP Co.,Ltd. |