CN106555950A - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN106555950A CN106555950A CN201610837495.2A CN201610837495A CN106555950A CN 106555950 A CN106555950 A CN 106555950A CN 201610837495 A CN201610837495 A CN 201610837495A CN 106555950 A CN106555950 A CN 106555950A
- Authority
- CN
- China
- Prior art keywords
- light
- led
- backlight module
- emitting diode
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 239000000084 colloidal system Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 239000012788 optical film Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 41
- 239000000843 powder Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000010606 normalization Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002223 garnet Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 241000219991 Lythraceae Species 0.000 description 1
- 235000014360 Punica granatum Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/002—Refractors for light sources using microoptical elements for redirecting or diffusing light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/02—Refractors for light sources of prismatic shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a backlight module, which comprises a lamp box, at least one lamp bar and at least one optical diaphragm. The lamp box is provided with a bottom and a light-emitting side relative to the bottom. The light bar is arranged at the bottom of the light box, wherein the light bar comprises a substrate, a plurality of light emitting diode packaging structures and a plurality of lenses. The light emitting diode packaging structure is arranged on the substrate. The lenses are arranged on the substrate and respectively correspond to the light emitting diode packaging structures. The optical film is arranged on the light-emitting side of the lamp box. The backlight module can reduce the use number of the LED packaging structures, reduce the cost and have better light-emitting uniformity.
Description
Technical field
The invention relates to a kind of backlight module, and in particular to a kind of back of the body using light emitting diode as light source
Optical module.
Background technology
Light emitting diode is applied in the backlight module of display at present, that is, using light emitting diode as backlight
The light source of module.However, as light emitting diode point source has very strong directivity, the light sent by light emitting diode is made
Can uniform mixed light to constitute a uniform area source, being arranged on the diffusion sheet above these light emitting diodes often needs and this
A little light emitting diodes maintain enough distances.Consequently, it is possible to will cause lamp box cannot further thinning, i.e. backlight module it is overall
Thickness cannot be reduced again, and then affect the development of display thinning.
Further, since the light beam sent by light emitting diode has between an angle of divergence, therefore adjacent two light emitting diode
Have a dark space, and these dark spaces will cause the outgoing light homogeneity of the area source provided by backlight module to decline.To understand
Certainly above-mentioned problem, industry propose the use number for increasing light emitting diode, between shortening between adjacent two light emitting diode
Away from the area of reduction dark space.Above-mentioned mode can effectively reduce the area of dark space really, but but improve backlight module
Production cost.Therefore, the light that goes out for how effectively lifting backlight module is spent and reduces production cost, it has also become current to be badly in need of
The problem of solution.
The content of the invention
The present invention provides a kind of backlight module, and which can reduce the usage quantity of package structure for LED, it is possible to decrease into
Originally and with preferably outgoing light homogeneity.
The backlight module of the present invention, which includes a lamp box, an at least lamp bar and an at least blooming piece.Lamp box has one
Bottom and one relative to bottom light emission side.Lamp bar is configured at the bottom of lamp box, and wherein lamp bar includes a substrate, multiple luminous
Diode package structure and multiple lens.Package structure for LED is configured on substrate.Lens configuration on substrate and
Respective leds encapsulating structure is arranged respectively.Blooming piece is configured at the light emission side of lamp box.
In one embodiment of this invention, above-mentioned substrate includes a circuit board or aluminium base.
In one embodiment of this invention, above-mentioned each package structure for LED includes：One bearing substrate, one
Luminous diode chip, a wavelength conversion layer, a substratum transparent and a resin colloid layer.Bearing substrate has relative to each other one
Upper surface and a lower surface, multiple the first connection pads being configured on upper surface and it is multiple be configured on lower surface second connect
Pad.Light-emitting diode chip for backlight unit flip is on bearing substrate, and is connected master with a back side, one with an active surface relative to each other
Dynamic surface and the side surface and multiple electrode pads being configured on active surface at the back side, wherein light-emitting diode chip for backlight unit pass through
Electrode pad and the first connection pad are electrically connected with.Wavelength conversion layer is configured on the back side of light-emitting diode chip for backlight unit, and along luminous
The side surface extension of diode chip for backlight unit is configured on the upper surface of bearing substrate.Substratum transparent is configured on wavelength conversion layer.Tree
Fat colloid layer is configured on bearing substrate and coats a circumferential surface of substratum transparent.
In one embodiment of this invention, the material of above-mentioned bearing substrate includes ceramics, aluminium oxide, aluminium nitride.
In one embodiment of this invention, above-mentioned wavelength conversion layer includes a yellow fluorescent powder glue-line, a red fluorescence
Arogel layer, a green emitting phosphor glue-line, a blue colour fluorescent powder glue-line or a yttrium aluminium garnet fluorescent powder glue-line.
In one embodiment of this invention, the material of above-mentioned substratum transparent includes epoxy resin, silica gel.
In one embodiment of this invention, above-mentioned resin colloid layer includes an epoxy resin layer, a silicone layer or
White adhesive layer.
In one embodiment of this invention, above-mentioned each package structure for LED includes：One light-emitting diodes tube core
Piece, a wavelength convert film and a resin colloid layer.Light-emitting diode chip for backlight unit flip is on the substrate of lamp bar, and has each other
A relative active surface is connected the side surface at active surface and the back side and multiple is configured on active surface with a back side, one
Electrode pad, wherein light-emitting diode chip for backlight unit is connected with electrical property of substrate by electrical connection pad.Wavelength convert film is configured to be sent out
On the back side of luminous diode chip, wherein wavelength convert film is extended to outside the side surface of light-emitting diode chip for backlight unit.Resin glue
Body layer coats a circumferential surface of wavelength convert film, and the side surface along light-emitting diode chip for backlight unit is arranged.
In one embodiment of this invention, above-mentioned wavelength convert film includes that a yellow fluorescent powder film, a redness are glimmering
Light arogel piece, a green emitting phosphor film, a blue colour fluorescent powder film or a yttrium aluminium garnet fluorescent powder film.
In one embodiment of this invention, above-mentioned resin colloid layer includes an epoxy resin layer, a silicone layer or
White adhesive layer.
In one embodiment of this invention, above-mentioned each lens have a lens section, and lens section has an incidence surface
And an exiting surface, and the radius of curvature of incidence surface is more than the radius of curvature of exiting surface.
In one embodiment of this invention, above-mentioned each lens also have multiple supporting parts, are configured at lens section and lamp
Between the substrate of bar.
In one embodiment of this invention, above-mentioned blooming piece is a diffusion sheet.
In one embodiment of this invention, an above-mentioned at least blooming piece is two diffusion sheets and a prismatic lenses, and rib
Eyeglass is located between diffusion sheet.
In one embodiment of this invention, an above-mentioned at least blooming piece is three diffusion sheets and a prismatic lenses, and rib
Eyeglass is located between wantonly two diffusion sheet.
In one embodiment of this invention, above-mentioned each package structure for LED is with an illumination radius R, and lamp
One upper surface of the substrate of bar has an optical distance OD, and one 1/2 dispersion angles of lens to a basal surface of blooming piece
For θ, then R/OD=tan (θ).
In one embodiment of this invention, between the intermediate point of above-mentioned adjacent two package structure for LED away from
From P, an optimal numerical constant E between 1.7 to 2.3, then R=E*P.
In one embodiment of this invention, above-mentioned package structure for LED being spaced equally.
In one embodiment of this invention, above-mentioned package structure for LED being spaced in unequal-interval.
In one embodiment of this invention, between the intermediate point of above-mentioned adjacent two package structure for LED away from
From P, then 0.9P<P<1.1P.
Based on above-mentioned, as the package structure for LED of the present invention is correspondingly arranged with lens, therefore light emitting diode
The light beam sent by encapsulating structure can be evenly dispersed, you can draw the spacing between adjacent two package structure for LED
Greatly, be effectively reduced the use number of package structure for LED whereby, thus effectively can reduce the production of backlight module into
This, and the outgoing light homogeneity for improving backlight module.
It is that the features described above and advantage of the present invention can be become apparent, special embodiment below, and it is detailed to coordinate accompanying drawing to make
Carefully it is described as follows.
Description of the drawings
Schematic diagrams of the Fig. 1 for a kind of backlight module of one embodiment of the invention；
Enlarged diagrams of the Fig. 2A for a package structure for LED in Fig. 1；
Fig. 2 B are the enlarged diagram of a package structure for LED in another embodiment；
Fig. 3 be normalization light intensity after package structure for LED one lens of correspondence in Fig. 1 are arranged with
The graph of relation of dispersion angle；
Schematic diagrams of the Fig. 4 for a kind of backlight module of another embodiment of the present invention；
Schematic diagrams of the Fig. 5 for a kind of backlight module of another embodiment of the present invention；
Schematic diagrams of the Fig. 6 for a kind of backlight module of another embodiment of the present invention；
Fig. 7 A there are different radius of curvature to be sent with package structure for LED by the incidence surface of lens from Fig. 7 B
Light beam opticpath schematic diagram.
Description of reference numerals：
100a、100b、100c、100d：Backlight module；
110：Lamp box；
112：Bottom；
114：Light emission side；
120：Lamp bar；
122：Substrate；
122a：Upper surface；
124a、124b、124c1、124c2、124c3、124c4、124c5：Package structure for LED；
124a1：Bearing substrate；
124a2、124b1：Light-emitting diode chip for backlight unit；
124a3：Wavelength conversion layer；
124a4：Substratum transparent；
124a5、124b3：Resin colloid layer；
124b2：Wavelength convert film；
125a1：Upper surface；
125a2：Lower surface；
125a3：First connection pad；
125a4：Second connection pad；
126：Lens；
126a、126a’：Lens section；
126a1：Exiting surface；
126a2、126a2’：Incidence surface；
126b：Supporting part；
127a1、125b1：Active surface；
127a2、125b2：Back surface；
127a3、125b3：Side surface；
127a4、125b4：Electrode pad；
128a：Tin cream；
128b：Encapsulation glue-line；
129a1、127b1：Circumferential surface；
129a2、127b2：Top surface；
130a：Blooming piece；
130c1、130c3、130d1、130d3、130d4：Diffusion sheet；
130c1、130d2：Prismatic lenses；
132a：Basal surface；
L1、L2：Curve；
P、P1、P2：Distance；
R：Illumination radius；
S：Space；
OD：Optical distance；
θ：1/2 dispersion angle.
Specific embodiment
Schematic diagrams of the Fig. 1 for a kind of backlight module of one embodiment of the invention.Fig. 1 is refer to, in the present embodiment, the back of the body
Optical module 100a includes a lamp box 110, an at least lamp bar 120 and an at least blooming piece 130a.Lamp box 110 has a bottom
112 and one relative to bottom 112 light emission side 114.Lamp bar 120 is configured at the bottom 112 of lamp box 110, and wherein lamp bar 120 is wrapped
Include a substrate 122, multiple package structure for LED 124a and multiple lens 126.Package structure for LED 124a
It is configured on substrate 122.Lens 126 are configured on substrate 122 and respective leds encapsulating structure 124a is arranged respectively.Light
Learn the light emission side 114 that diaphragm 130a is configured at lamp box 110.Herein, blooming piece 130a is, for example, a diffusion sheet, but not with this
It is limited.
Specifically, the substrate 122 of lamp bar 120 e.g. a circuit board or aluminium base, and package structure for LED
124a is, for example, being spaced on substrate 122 equally.As shown in Figure 2 A, each light emitting diode envelope of the present embodiment
Assembling structure 124a includes an a bearing substrate 124a1, light-emitting diode chip for backlight unit 124a2, a wavelength conversion layer 124a3, transparent
A glue-line 124a4 and resin colloid layer 124a5.Bearing substrate 124a1 have a upper surface 125a1 relative to each other with once
Surface 125a2, multiple the first connection pad 125a3 being configured on upper surface 125a1 and multiple it is configured on lower surface 125a2
Second connection pad 125a4, the first connection pad 125a3 by the conductive through hole (not shown) that is formed in bearing substrate 124a1 or along
Metal level (not shown) that bearing substrate 124a1 surfaces extend downwardly and be electrically connected with the second connection pad 125a4.Light emitting diode
Chip 124a2 flips on bearing substrate 124a1, and with an an active surface 127a1 relative to each other and back side 127a2,
The side surface 127a3 and multiple electricity being configured on active surface 127a1 of one connection active surface 127a1 and back side 127a2
The first connection pad of pole connection pad 127a4, wherein light-emitting diode chip for backlight unit 124a2 by electrode pad 127a4 and bearing substrate 124a1
125a3 is electrically connected with, and package structure for LED 124a is then electric with the substrate 122 of lamp bar 120 by the second connection pad 125a4
Property connection.Wavelength conversion layer 124a3 is configured on the back side 127a2 of light-emitting diode chip for backlight unit 124a2, and along light emitting diode
The side surface 127a3 extensions of chip 124a2 are configured on the upper surface 125a1 of bearing substrate 124a1.Substratum transparent 124a4 matches somebody with somebody
On wavelength conversion layer 124a3, and with the conformal settings of wavelength conversion layer 124a3.Resin colloid layer 124a5 is configured at bearing substrate
124a1 is upper and coats circumferential surface 129a1 of substratum transparent 124a4.
More particularly, the material of the bearing substrate 124a1 of the package structure for LED 124a of the present embodiment is for example
It is ceramics, aluminium oxide, aluminium nitride.Light-emitting diode chip for backlight unit 124a2 is in the way of chip bonding to bearing substrate 124a1.Such as
Shown in Fig. 2A, the electrode pad 127a4 of light-emitting diode chip for backlight unit 124a2 is soldered to bearing substrate 124a1 by tin cream 128a
The first connection pad 125a3 on.Wavelength conversion layer 124a3 and substratum transparent 124a4 is configured at by way of sequentially spraying
On the back side 127a2 of light-emitting diode chip for backlight unit 124a2, wherein wavelength conversion layer 124a3 be, for example, a yellow fluorescent powder glue-line, one
Red fluorescence powder glue-line, a green emitting phosphor glue-line, a blue colour fluorescent powder glue-line or a yttrium aluminium garnet fluorescent powder glue-line, and it is saturating
The material of gelatin layer 124a4 is, for example, epoxy resin, silica gel.As shown in Figure 2 A, wavelength conversion layer 124a3 is completely covered luminous two
The side surface 127a3 of pole pipe chip 124a2 and extend in the side at the edge of electrode pad 127a4 and the first connection pad 125a3
Edge, and substratum transparent 124a4 is completely covered wavelength conversion layer 124a3 and extends to the upper surface 125a1 of bearing substrate 124a1.
Resin colloid layer 124a5 is formed in circumferential surface 129a1 of substratum transparent 124a4 by mode for dispensing glue, to coat
Circumferential surface 129a1 of substratum transparent 124a4, and expose a top surface 129a2 of substratum transparent 124a4.Meanwhile, resin glue
Gap between the gap that can also fill up between the first connection pad 125a3 of body layer 124a5 and electrode pad 127a4.Herein, set
The edge of fat colloid layer 124a5 is substantially trimmed with the edge of bearing substrate 124a1, but is not limited thereto.Resin colloid layer
124a5 be, for example, an epoxy resin layer, a silicone layer or a white adhesive layer, its arrange purpose be：Block light emitting diode
The lateral light of chip 124a2, and make the light beam sent by light-emitting diode chip for backlight unit 124a2 photochromic uniform.
In another embodiment, Fig. 1 and Fig. 2 B are please also refer to, for further reduces cost, each light-emitting diodes
Pipe encapsulating structure 124b is may also be by a light-emitting diode chip for backlight unit 124b1, a wavelength convert film 124b2 and a resin colloid
Layer 124b3 is constituted.Light-emitting diode chip for backlight unit 124b1 flips on the substrate 122 of lamp bar 120, and with relative to each other one
Active surface 125b1 is connected the side surface 125b3 of active surface 125b1 and back side 125b2 and many with a back side 125b2, one
The individual electrode pad 125b4 being configured on active surface 125b1, wherein light-emitting diode chip for backlight unit 124b1 pass through electrode pad
125b4 is electrically connected with substrate 122.Wavelength convert film 124b2 is configured at the back side 125b2 of light-emitting diode chip for backlight unit 124b1
On, wherein wavelength convert film 124b2 is extended to outside the side surface 125b3 of light-emitting diode chip for backlight unit 124b1.That is, wavelength turns
Change the length of side of the length of side more than light-emitting diode chip for backlight unit 124b1 of film 124b2.Herein, wavelength convert film 124b2 is, for example, one
Yellow fluorescent powder film, a red fluorescence powder film, a green emitting phosphor film, a blue colour fluorescent powder film or a yttroalumite pomegranate
Stone fluorescent material film.Resin colloid layer 124b3 is by mode for dispensing glue coating a circumferential surface of wavelength convert film 124b2
127b1, and along the side surface 125b3 settings of light-emitting diode chip for backlight unit 124b1, and expose wavelength convert film 124b2's
One top surface 127b2.As shown in Figure 2 B, the side surface 125b3 of resin colloid layer 124b3 and light-emitting diode chip for backlight unit 124b1 it
Between have an encapsulation glue-line 128b, wherein encapsulation glue-line 128b is completely covered the side surface 125b3 of light-emitting diode chip for backlight unit 124b1,
And resin colloid layer 124b3 is extended in the circumferential surface of wavelength convert film 124b2 along encapsulation glue-line 128b
127b1.Resin colloid layer 124b3 is, for example, an epoxy resin layer, a silicone layer or a white adhesive layer.
Fig. 1 is refer again to, each lens 126 of the present embodiment have a lens section 126a, and lens section 126a has one
The curvature half of an exiting surface 126a1 and incidence surface 126a2, the wherein radius of curvature of exiting surface 126a1 less than incidence surface 126a2
Footpath, and the appearance of the core of lens 126a produces depression towards light source direction so that by lens 126a cores
The circumference of section forms two crests, and the plotted point of two crests is exactly the low spot of depression, and the low spot pair of the depression
Quasi-optical source.Additionally, also optionally there is each lens 126 multiple supporting part 126b, wherein supporting part 126b to be configured at
Between the substrate 122 of mirror portion 126a and lamp bar 120.As shown in figure 1, the package structure for LED 124a of the present embodiment is not
There are directly contact lens 126, but there is between the supporting part 126b and lens section 126a by lens 126 a space S.Especially
It is that the lens 126 and package structure for LED 124a of the present embodiment are correspondingly arranged, and its object is to：Can be by light-emitting diodes
The homogenizer dispersion sent by pipe encapsulating structure 124a.
More particularly, Fig. 3 is refer to, curve L1 is expressed as the existing light-emitting diodes for being not provided with lens in wherein Fig. 3
The relation curve of its normalization light intensity of pipe encapsulating structure and dispersion angle, and curve L2 is expressed as this example and is provided with lens
The relation curve of its normalization light intensity of 126 package structure for LED 124a and dispersion angle.It is compared to curve L1, bent
The dispersion angle of line L2 is distributed more widely, i.e., positive and negative 75 degree, and normalization light intensity be also distributed it is very average, i.e., averagely about 0.3.
Consequently, it is possible to can widen the spacing between adjacent two package structure for LED 124a, luminous two are effectively reduced whereby
The use number of pole pipe encapsulating structure 124a, thus the production cost of backlight module 100a can be effectively reduced, and backlight can be improved
The outgoing light homogeneity of module 100a.
It is preferred that refer again to Fig. 1, each package structure for LED 124a is with an illumination radius R, and lamp bar
The one basal surface 132a of the one upper surface 122a to blooming piece 130a of 120 substrate 122 has an optical distance OD, and lens
126 one 1/2 dispersion angles are θ, then R/OD=tan (θ).Herein, the centre of adjacent two package structure for LED 124a
Between point one apart from P, an optimal numerical constant E between 1.7 to 2.3, then R=E*P.That is, in optics in the same manner
Under OD, the dispersion angle of lens 126 is bigger, then bigger apart from P, and which is represented needed for package structure for LED 124a
Number is reduced, and can effectively reduce the production cost of backlight module 100a.On the other hand, under same distance P, lens 126 send out
Scattered angle is bigger, then optical distance OD is less, and the thickness which represents lamp box 110 is thinner, can effectively improve backlight module 100a's
Competitiveness.In short, user can change optical distance OD or apart from P by relational expression above, with needed for obtaining
Effect of backlight module 100a.
It is noted that above-mentioned defined optimal numerical constant E, its object is to：Adjustment makes backlight module apart from P
The area source provided by 100a seems to be more uniformly distributed.If in addition, too big apart from P, LED package knot may be faced
The brightness of the light beam sent by structure 124a is not bright enough, now can be by increasing light-emitting diode chip for backlight unit 124a2 (refer to Fig. 2A)
Power supply wattage increasing brightness, and this is also the advantage of the light-emitting diode chip for backlight unit 124a2 of crystal covering type.
Certainly, the present embodiment does not limit the arrangement mode of package structure for LED 124a.Fig. 4 is refer to, at this
In embodiment, backlight module 100b is similar to the backlight module 100a of Fig. 1, but in place of the two Main Differences is：The present embodiment
Backlight module 100b in package structure for LED 124c1,124c2,124c3,124c4,124c5 specifically between not etc.
Away from be spaced on substrate 122, wherein package structure for LED 124c1,124c2,124c3,124c4,124c5's
Structure can be identical with package structure for LED 124a or package structure for LED 124b, and here is not any limitation as.
It is preferred that 0.9P<P<1.1P.As shown in figure 4, package structure for LED 124c3 and package structure for LED 124c2
The distance between P1, or, between package structure for LED 124c3 and package structure for LED 124c4 away from
From P1, the distance between package structure for LED 124c1 and package structure for LED 124c2 P2 is greater than, or
It is the distance between package structure for LED 124c4 and package structure for LED 124c5 P2.For example, distance
P1 is, for example, 1.1P, and is, for example, 0.9P apart from P2, wherein being expressed as when package structure for LED 124a is between grade apart from P
Away from when being spaced, the distance between intermediate point of adjacent two package structure for LED 124a.
The backlight module 100b of the present embodiment, its package structure for LED 124c1,124c2,124c3,124c4,
124c5 is specifically spaced on substrate 122 in unequal-interval, therefore can be widened the brightness that 110 central authorities of lamp box overlap, with
The light intensity in 110 central authorities of lamp box is reduced, to supply the dark space at 110 edge of lamp box, and then backlight module 100b can be provided
Evenness preferably area source.Backlight module 100a, 100b described above is, for example, the lamp box of advertisement.
Additionally, the present embodiment does not limit the number and species of blooming piece 130a.Fig. 5 is refer to, in the present embodiment,
Backlight module 100c is similar to the backlight module 100a of Fig. 1, but in place of the two Main Differences is：The blooming piece of the present embodiment
Specifically there are three, which is a two diffusion sheet 130c1,130c3 and prismatic lenses 130c2 respectively, and wherein prismatic lenses 130c2 is positioned at expansion
Between discrete piece 130c1,130c3.Or, Fig. 6 is refer to, in the present embodiment, the backlight module of backlight module 100d and Fig. 1
100a is similar, but in place of the two Main Differences is：The blooming piece of the present embodiment specifically has four, and which is three diffusion sheets respectively
130d1,130d3,130d4 and a prismatic lenses 130d2, wherein prismatic lenses 130d2 are located between diffusion sheet 130d1,130d3,
But it is not limited thereto.Backlight module 100c, 100d described above is, for example, the backlight module of TV.
In addition, the present embodiment does not limit the radius of curvature of the incidence surface 126a2 of lens 126.Please also refer to Fig. 7 A with
Fig. 7 B, wherein Fig. 7 A are the package structure for LED 124a and lens section 126a in Fig. 1, and the light emitting diode in Fig. 7 B
Encapsulating structure 124a is identical with package structure for LED 124a in Fig. 7 A, and its Main Differences is：Lens section in Fig. 7 B
Radius of curvature of the radius of curvature of the incidence surface 126a2 ' of 126a ' less than the incidence surface 126a2 of the lens section 126a in Fig. 7 A.By
Can clearly be seen that in Fig. 7 A and Fig. 7 B, in Fig. 7 A, the radius of curvature of the incidence surface 126a2 of lens section 126a is larger, thus it is luminous
The light beam sent by diode package structure 124a more dissipates, and in Fig. 7 B the incidence surface 126a2 ' of lens section 126a ' song
Rate radius is less, therefore the light beam sent by package structure for LED 124a is more concentrated.In short, user can foundation
Desirable effect and voluntarily select lens section 126a, 126a ' incidence surface 126a2,126a2 ' radius of curvature, here is not in addition
Limit.
In sum, package structure for LED of the invention is correspondingly arranged with lens, therefore LED package
The light beam sent by structure can be evenly dispersed, you can widen the spacing between adjacent two package structure for LED, borrow
This is effectively reduced the use number of package structure for LED, thus can effectively reduce the production cost of backlight module, with
And improve the outgoing light homogeneity of backlight module.
Finally it should be noted that：Various embodiments above only to illustrate technical scheme, rather than a limitation；To the greatest extent
Pipe has been described in detail to the present invention with reference to foregoing embodiments, it will be understood by those within the art that：Its according to
So the technical scheme described in foregoing embodiments can be modified, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of backlight module, it is characterised in that include：
One lamp box, with a bottom and one relative to the bottom light emission side；
An at least lamp bar, is configured at the bottom of the lamp box, wherein the lamp bar includes：
One substrate；
Multiple package structure for LED, are configured on the substrate；And
Multiple lens, are configured on the substrate and correspond to respectively those package structure for LED and arrange；And
An at least blooming piece, is configured at the light emission side of the lamp box.
2. backlight module according to claim 1, it is characterised in that each package structure for LED includes：
One bearing substrate, with a upper surface relative to each other and a lower surface, it is multiple be configured on the upper surface first
Connection pad and multiple the second connection pads being configured on the lower surface；
One light-emitting diode chip for backlight unit, flip on the bearing substrate, and with an active surface relative to each other and a back side,
The one connection active surface and the side surface at the back side and multiple electrode pads being configured on the active surface, its
Described in light-emitting diode chip for backlight unit be electrically connected with those first connection pads by those electrode pads；
One wavelength conversion layer, is configured on the back side of the light-emitting diode chip for backlight unit, and along the light-emitting diodes tube core
The side surface extension of piece is configured on the upper surface of the bearing substrate；
One substratum transparent, is assigned on the wavelength conversion layer；And
One resin colloid layer, is configured on the bearing substrate and coats a circumferential surface of the substratum transparent.
3. backlight module according to claim 1, it is characterised in that each package structure for LED includes：
One light-emitting diode chip for backlight unit, flip on the substrate of the lamp bar, and with an active surface relative to each other with
One back side, the connection active surface and the side surface at the back side and multiple electrodes being configured on the active surface
Connection pad, wherein the light-emitting diode chip for backlight unit is connected with the electrical property of substrate by those electrode pads；
One wavelength convert film, is configured on the back side of the light-emitting diode chip for backlight unit, wherein the wavelength convert film
Extend to outside the side surface of the light-emitting diode chip for backlight unit；And
One resin colloid layer, coats a circumferential surface of the wavelength convert film, and along the light-emitting diode chip for backlight unit
The side surface is arranged.
4. backlight module according to claim 1, it is characterised in that each lens have a lens section, and described
Mirror portion has an incidence surface and an exiting surface, and the radius of curvature of the incidence surface more than the radius of curvature of the exiting surface.
5. backlight module according to claim 4, it is characterised in that each lens also have multiple supporting parts, configuration
Between the lens section and the substrate of the lamp bar.
6. backlight module according to claim 1, it is characterised in that an at least blooming piece be two diffusion sheets and
One prismatic lenses, and the prismatic lenses are between those diffusion sheets.
7. backlight module according to claim 1, it is characterised in that each package structure for LED is shone with
Bright radius R, and a upper surface of the substrate of the lamp bar has an optical distance to a basal surface of the blooming piece
OD, and one 1/2 dispersion angles of the lens are θ, then R/OD=tan (θ).
8. backlight module according to claim 7, it is characterised in that in adjacent two those package structure for LED
Between put between one apart from P, an optimal numerical constant E between 1.7 to 2.3, then R=E*P.
9. backlight module according to claim 1, it is characterised in that those package structure for LED are in unequal-interval
Be spaced.
10. backlight module according to claim 9, it is characterised in that adjacent two those package structure for LED
Between intermediate point one apart from P, then 0.9P<P<1.1P.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104131331 | 2015-09-22 | ||
| TW104131331A TW201712266A (en) | 2015-09-22 | 2015-09-22 | Backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106555950A true CN106555950A (en) | 2017-04-05 |
Family
ID=58418152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610837495.2A Pending CN106555950A (en) | 2015-09-22 | 2016-09-21 | Backlight module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106555950A (en) |
| TW (1) | TW201712266A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047407A (en) * | 2019-04-01 | 2019-07-23 | 方迪勇 | A kind of constructive method of assembling-type modular lamp box |
-
2015
- 2015-09-22 TW TW104131331A patent/TW201712266A/en unknown
-
2016
- 2016-09-21 CN CN201610837495.2A patent/CN106555950A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047407A (en) * | 2019-04-01 | 2019-07-23 | 方迪勇 | A kind of constructive method of assembling-type modular lamp box |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201712266A (en) | 2017-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI255566B (en) | Led | |
| CN102903833B (en) | Wide angle based indoor lighting lamp | |
| WO2011084001A2 (en) | Aspheric led lens and a light emitting device including the same | |
| TW200841089A (en) | Light source module and liquid crystal display | |
| US9039222B2 (en) | Backlight module with light-guiding portions | |
| US10529901B2 (en) | Light emitting diode package and method for fabricating the same | |
| US20140320781A1 (en) | Light source unit and display device including the same | |
| CN101981714A (en) | Light emitting device package, manufacturing method thereof, and lighting apparatus | |
| US20190139948A1 (en) | Led lighting apparatus | |
| US10141476B2 (en) | Light emitting diode chip scale packaging structure | |
| TWI496316B (en) | Light emitting diode and backlight unit thereof | |
| JP2005303211A (en) | Flat surface irradiation-type light emitting diode (led) | |
| TW201322506A (en) | LED and direct type backlight source using the same | |
| CN106555950A (en) | Backlight module | |
| US20100110686A1 (en) | Led light module | |
| KR20120017703A (en) | Lens and light-emitting device having the same | |
| CN103035816A (en) | Light emitting module and light emitting device thereof | |
| TWI688128B (en) | Light emitting diode chip scale packaging structure and direct type backlight module | |
| US11417814B2 (en) | Light-emitting diode module and a light apparatus | |
| CN102082223B (en) | Light emitting device package | |
| KR101273364B1 (en) | Substrate for fabricating led module, and led module using the same, and method for fabricating the led module | |
| TWM519254U (en) | Backlight module | |
| CN106449622A (en) | Light emitting module | |
| KR20120077252A (en) | Light-emitting package | |
| US10193035B2 (en) | Luminance pattern shaping using a back-emitting LED and a reflective substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170405 |
|
| WD01 | Invention patent application deemed withdrawn after publication |