CN106550535A - It is provided with the multi-layer ceramics printed circuit board and its manufacture method of heat sink substrate - Google Patents

It is provided with the multi-layer ceramics printed circuit board and its manufacture method of heat sink substrate Download PDF

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Publication number
CN106550535A
CN106550535A CN201610526785.5A CN201610526785A CN106550535A CN 106550535 A CN106550535 A CN 106550535A CN 201610526785 A CN201610526785 A CN 201610526785A CN 106550535 A CN106550535 A CN 106550535A
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China
Prior art keywords
layer
laminating
heat sink
ceramics
substrate
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CN201610526785.5A
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Chinese (zh)
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CN106550535B (en
Inventor
王锐勋
王玉河
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Zhongshan Basic Technology Co., Ltd
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Shenzhen Nano Science And Technology Co Ltd
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Priority to CN201610526785.5A priority Critical patent/CN106550535B/en
Publication of CN106550535A publication Critical patent/CN106550535A/en
Priority to PCT/CN2017/091855 priority patent/WO2018006831A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB

Abstract

The multi-layer ceramics printed circuit board for being provided with heat sink substrate includes at least one piece ceramics base PCB plate and at least one piece heat sink substrate；Ceramics base PCB plate includes ceramic base bottom and the laminating layer of ceramic substrate；Heat sink substrate includes heat sink base layer and the laminating layer of heat sink substrate；The laminating layer of ceramic substrate and the laminating layer of heat sink substrate are the eutectic material layer with eutectic melting characteristic, and the two-layer laminating heating eutectic fusion weld realizes that eutectic is laminating becomes multi-layer ceramics printed circuit board.The mechanical attachment of interlayer is not only realized compared to the laminating layer in the lying copper region and lying copper region of known structure and technique, the laminating layer of heat sink substrate, heat sink substrate and intermediate layer and is electrically connected, also substantially increase the heat conductivility of multi-layer ceramics printed circuit board；Ceramic bases and heat sink substrate all have good heat conductivility and dielectric strength so that there is the multi-layer ceramics printed circuit board of the present invention good heat conductivility to be adapted to the application scenario of high power and high heat flux.

Description

It is provided with the multi-layer ceramics printed circuit board and its manufacture method of heat sink substrate
Technical field
The present invention relates to semiconductor packages and application, more particularly to high current, high voltage, powerful high power density Multi-layer ceramics printed circuit board and its manufacture method that semiconductor device is used, specifically relate to a kind of high temperature resistant, lead suitable for height The ceramic circuit-board and its manufacture method of heat, high voltage and high power density application.
Background technology
The printed circuit support plate of resin material, such as FR-4 epoxy glass fabrics lamination are most commonly that in of the prior art Plate, wherein FR-4 are a kind of code names of flame resistant material grade, representative to mean that resin material is must be able to through fired state A kind of material specification of enough self-extinguish, it is not a kind of title material, but a kind of material rate, therefore general circuit at present FR-4 grade materials used by plate just have very many species, but majority is all plus filler and glass with epoxy resin The laminating material made by fiber.High mechanical strength under epoxy glass cloth laminated board high temperature, under high humidity, electric property stability is good, But in some high currents, high voltage, the application of large-power semiconductor device, its stability, dielectric strength, thermal expansion system Number and heat dissipation characteristics are still defeated by ceramic base line carrier plate.Especially in present quasiconductor application, due to carrying for integrated level Height, brings the demand of high power density, high heat flux, for common base plate for packaging and application substrate, bears high power Density, high heat flux are greatly challenges, it is difficult to competent.And the thermal expansion difference of carrier plate material and silicon is difficult to arrange in pairs or groups.
Ceramic circuit-board of the prior art using ceramic carrier, the physical and chemical stability of its base ceramic material have High-fire resistance, high insulation resistance and low thermal coefficient of expansion, especially alumina ceramic-base line carrier plate are employed in insulated part The aluminium oxide ceramics fairly close with silicon thermal expansion so that when through hole is carried out, it is possible to achieve the target of higher Distribution density, because The appearance of this ceramic substrate overcomes the shortcoming that resin printing substrate is difficult to overcome.
In prior art, the manufacture method of multi-layer ceramics printed circuit board generally adopts ceramic batch firing process, first by original The ceramics of material, organic resin, solvent etc., using spherical destructor hybrid modulation, until mixing liquid forms milk shape Ceramic material；Shape followed by thin slice, allow ceramic forming material to be greenbelt, wire is then using tungsten powder and organic carrier The slurry agent of mixing is printed on greenbelt, makes distribution；The workability of ceramic green sheet is make use of, can be in any position in greenbelt Perforation is put, and through conductor being imbedded inside hole, realizes multiple-plate interlayer conduction；Be then passed through common burning, nickel plating, the hard solder of pin, The a series of step such as gold-plated is completed；The last action that again conductor in lamination and ceramics are synchronously sintered, and complete pottery The Making programme of porcelain base electronic circuit board.In whole processing procedure, most important step is the molding in greenbelt, and synchronous sintering Technology；Refractory metal such as molybdenum Mu and tungsten W are set on multi-disc ceramic batch and in through hole used as conductor metal figure, are led with height Electric metal copper Cu is sintered together and becomes multi-layer ceramics wiring board.The sintering process of multi-layer ceramics wiring board is complicated, it is difficult to big Mass production applications, craft precision difference cannot do fine circuitry；Refractory metal has reliability hidden danger with the adhesion difference of copper, and Heat conductivity is low.
Explanation of nouns：
It is heat sink：It is referred to as Heat sink or Heatsink in english literature, also referred to as heat extractor or again radiator or hot natural pond are referred to Not with its heat energy size variation is delivered to, it can be the objects such as air, the earth to its temperature, finger liquid nitrogen in aerospace engineering Wallboard inner surface japanning industrially refers to miniature fin, for cooling down electronics core simulating the device of the cold darkness environment in universe The device of piece.In the present invention, it is heat sink to refer in LED chip and its application, for the heat dispersion substrate of packaging LED chips, make Obtain LED chip to be arranged on heat sink to help LED chip to radiate so as to stabilized operating temperature.
It is heat sink that " passivity heat dissipation element " is classified as in the field of electronic engineering, so that heat conductivity is good, light weight, easy processing Metal or nonmetallic or composite（Mostly aluminum or copper, carborundum, carbonization sial etc.）Heating surface is attached at, with what is be combined Heat exchange pattern is to transfer heat to fluid media (medium) such as air, in liquid coolant or additional radiator.It is heat sink to be mainly used in High power semiconductor device, such as Mosfet/IGBT/LED.
Eutectic：Eutectic refers to that eutectic solder at relatively low temperature occurs the phenomenon of eutectic thing fusion, eutectic be Less than the fusion of all the components at a temperature of any one constituent melting point metal.Eutectic alloy directly changes to liquid from solid-state, and Without the plastic stage, it is a liquid while generating the balancing response of two solid-states.Its fusion temperature claims eutectic temperature.Eutectic There is alloy the fundamental characteristics of specific freezing point, eutectic alloy to be：Two kinds of different metals can be far below respective fusing point At a temperature of in constant weight ratio formed alloy；This is eutectic alloy and other non-co- peritectic alloy most marked differences.
Eutectic is welded：Eutectic welding is welded also known as low-melting alloy, is, using eutectic principle, to make two kinds of different metals exist Far below co-melting crystal is cooled into after eutectic Fusion Strain being formed in constant weight ratio under respective melting temperature realize two Eutectic bond between individual solder side.
For example：The most frequently used eutectic weldering in microelectronic component is that silicon is soldered on gold-plated base or lead frame Go, i.e. " gold-silicon eutectic weldering ".It is well known that 1063 DEG C of the fusing point of gold, and the fusing point of silicon is higher, is 1414 DEG C.But if press According to the silicon that weight ratio is 2.85% and 97.15% gold combination, the eutectic alloy body that fusing point is 363 DEG C can be just formed.Here it is The theoretical basiss of gold silicon eutectic weldering.The welding process of gold-silicon eutectic weldering is referred in-fixed temperature (higher than 363 DEG C) and necessarily Pressure under, silicon is gently rubbed into friction on gold-plated base, the oxide layer of interfacial instability is wiped, is made contact surface Between melt, form-individual liquid phase by two solid phases.After cooling, when temperature is less than gold-silicon eutectic point (363 DEG C), by liquid phase shape Into granular form be combined with each other into mechanical impurity gold-co-melting crystal of silicon so that silicon is welded on base securely, And form good low-resistance Ohm contact.
Silicon nitride：Its English is Silicon nitride；Si3N4 ceramics are a kind of covalent key compounds, basic structure Unit is [SiN4] tetrahedron, and silicon atom is located at tetrahedral center, has four nitrogen-atoms around which, respectively positioned at four sides Four summits of body, then in the form of sharing an atom per three tetrahedrons, form continuous and firm in three dimensions Network structure.Many performances of silicon nitride are all attributed to this structure.Si3N4 thermal coefficient of expansions are low, thermal conductivity is high, therefore which is resistance to Thermal impact is splendid.
Aluminium nitride：Its English is Aluminum nitride；Covalently key compound, belongs to hexagonal crystal system, Pb-Zn deposits type Crystal structure, white or canescence.Aluminium nitride is atomic crystal, belongs to diamond like carbon nitride, and highest can be stabilized to 2200 DEG C. Room temperature strength is high, and intensity is good compared with slow, heat conductivity with the rising decline of temperature, and thermal coefficient of expansion is little, is good heat shock resistance Material.The ability of resist melt metal attack is strong, aluminium nitride or electrical insulator, and dielectric properties are good, are ceramic circuit-board support plates One of preferred material.
Aluminium sesquioxide：Namely aluminium oxide, chemical symbol：, pure aluminium oxide is white amorphous powder, custom Claim Alumina, density 3.9-4.0g/cm3,2050 DEG C of fusing point, 2980 DEG C of boiling point are water insoluble, are amphoteric oxide, can be dissolved in nothing In machine acid and alkaline solution, mainly there are two kinds of variants of α types and γ types, industrially can extract from bauxite.In alpha-type aluminum oxide Lattice in, oxonium ion is that six sides are tightly packed, and aluminium ion is symmetrically dispersed in the octahedral coordination center that oxonium ion is surrounded, brilliant Lattice can be very big, therefore fusing point, boiling point are very high.Alpha-type aluminum oxide is water insoluble and sour, industrially also referred to as alumina, is the base of metallic aluminium processed This raw material；It is also used for making various refractory brick, fire-clay crucible, refractory tube, high temperature resistant experimental apparatus；Can also make grinding agent, fire retardant, Inserts etc.；High-purity alpha-type aluminum oxide still produces Alundum, synthetic ruby and sapphire raw material；It is additionally operable to production The plate base of modern large scale integrated circuit.
Heat conductivity：The physical quantity of material conducts heat capacity of water is characterized, unit is W/（m·K）, it is every that Chinese reads per meter of work watt Open.When its numerical value is both sides 1 Kelvin of temperature difference of unit temperature drop degree, i.e. 1 meter of thick material in object, the unit interval The interior heat conducted by unit area.
In present specification, indication possesses high thermal conductivity coefficient, refers to that heat conductivity is more than or equal to 2W/（m·K）.
MOS is the abbreviation of English Complementary Metal-Oxide Semiconductor, and Chinese implication is complementary Type matal-oxide semiconductor.
MOSFET is the contracting of English Metallic Oxide Semiconductor Field Effect Transistor Write, Chinese implication is mos field effect transistor.
IGBT is the abbreviation of English Insulated Gate Bipolar Translator, and Chinese implication is insulation fence gate Gated transistors.
CPU is the abbreviation of English Central Processing Unit, and Chinese implication is central processing unit.
GPU is the abbreviation of English Graphic Processing Unit, and Chinese implication is graphic process unit.
MPU is the abbreviation of English Micro Processor Unit, and Chinese implication is microprocessor.
IPM is the abbreviation of English Integrated Power Module, and Chinese implication is integrated power module.
PCB is the abbreviation of English Printed Circuit Board, and Chinese implication is printed circuit board.
LED is the abbreviation of English Light Emitting Diode, and Chinese implication is light emitting diode.
COB is the abbreviation of English Chip On Board, and Chinese implication is chip on board；Chip on board encapsulation is bare chip One of mounting technology, semiconductor chip handing-over are mounted on printed wiring board, chip and substrate it is electric couple sutured with lead Method is realized, and is covered to guarantee reliability with resin.
COB light source：LED plane light source or integrated optical source are encapsulated also known as COB light source by COB；COB light source is mainly transported at present In indoor and outdoor lamp lighting, the shot-light, Down lamp, Ceiling light, lamp affixed to the ceiling, daylight lamp and light bar such as interior, the street lamp of outdoor, Bulkhead lamp, the wall lamp of flood light and current urban landscape, luminescent characters etc..
The content of the invention
The technical problem to be solved in the present invention is to avoid prior art multilayer ceramic circuit-board complex manufacturing technology precision The poor, weak point that laminating heat conductivity is low and propose a kind of multi-layer ceramics wiring board with high thermal conductivity.
The present invention is a kind of multi-layer ceramics for being provided with heat sink substrate to solve the technical scheme that the technical problem is adopted Printed circuit board, including：At least one piece ceramics base PCB plate and at least one piece heat sink substrate；The ceramics base PCB plate include for The ceramic base bottom of insulation and heat conduction and heat radiation and couple and realize the laminating layer of ceramic substrate of heat conduction for eutectic fusion weld；By institute State two mutually parallel on the whole surfaces of ceramic base bottom and be referred to as substrate A face and substrate B face, the ceramic substrate is laminating Layer is arranged on the substrate A face, or the laminating layer of the ceramic substrate is arranged on the substrate B face；The heat sink substrate bag Include for the heat sink base layer of heat conduction and heat radiation and couple for eutectic fusion weld and realize the laminating layer of heat sink substrate of heat conduction；It is described The laminating layer of heat sink substrate is overlayed on the heat sink base layer；The laminating layer of ceramic substrate and the laminating layer of the heat sink substrate are Eutectic material layer with eutectic melting characteristic；The laminating layer of ceramic substrate and the laminating layer laminating heating of the heat sink substrate are altogether Brilliant fusion weld realizes that eutectic is laminating；So as to the respectively ceramics base PCB plate and the laminating connection of heat sink substrate melting are become the number of plies extremely It is the multi-layer ceramics printed circuit board of two-layer less.
The laminating laminating layer of the ceramic substrate for coupling is melted directly or by mistake with the laminating layer eutectic of the heat sink substrate Cross metal level to overlay on the ceramic base bottom, i.e., directly join between the laminating layer of ceramic substrate and the ceramic base bottom Connect or coupled by transition metal layer；On the ceramics base PCB plate, the laminating layer eutectic of the heat sink substrate of getting along well melts laminating company Intermediate layer is provided between the laminating layer of the ceramic substrate for connecing and the ceramic base bottom；The intermediate layer is arranged on the base On the A faces of bottom, or the intermediate layer is arranged on the substrate B face；The intermediate layer is used for printed electronics circuit and/or laying is led Thermometal face；The intermediate layer includes that the electronic circuit for printed electronics circuit prints area and/or for laying heat-conducting metal The lying copper region in face, the lying copper region are covered, realize heat conduction and radiating in intermediate layer large area；The laminating layer of the ceramic substrate includes Electronic circuit prints the laminating floor in area and/or the laminating floor of lying copper region；The electronic circuit print the uniform cloth of the laminating floor in area be overlying on it is described Electronic circuit is printed on each lines of printed electronics circuit and each node in area；The uniform cloth of the laminating layer of the lying copper region is overlying on described covering On the heat-conducting metal face in copper area.
The multi-layer ceramics printed circuit board includes the multi-layer ceramics printed circuit board that the number of plies is more than three layers；This is described more The ceramic printed circuit board of layer includes one piece of heat sink substrate and at least two pieces ceramics base PCB plates；The multi-layer ceramics printed circuit board The number of plies be the heat sink substrate quantity and ceramics base PCB plate quantity summation；The heat sink substrate is by the heat sink substrate Laminating layer layer laminating with the ceramic substrate of one piece of ceramics base PCB plate is realized that eutectic melting is laminating and is coupled；While block ceramic base PCB Cover by the laminating layer of the respective ceramic substrate and with its opposite described ceramic substrate between plate and other ceramics base PCB plates The eutectic melting closed between layer is laminating, so as to shape all-in-one-piece multi-layer ceramics printed circuit board.
Described respectively ceramics base PCB plate needs the printed electronics circuit and/or heat conduction gold in two laminating opposite intermediate layers The figure in category face is mutually in specular, or the figure at least most of printed electronics circuit and/or heat-conducting metal face is in mirror As symmetrical；Described respectively ceramics base PCB plate needs the printed electronics circuit and/or heat-conducting metal in two laminating opposite intermediate layers When the figure in face is asymmetric, that face opposite with asymmetric part printed electronics circuit and/or the heat-conducting metal face should be blank Ceramic plane.
Participate in being all provided with the substrate A face and substrate B face of the ceramic base bottom of the ceramics base PCB plate of eutectic fusion weld When being equipped with the intermediate layer, printed electronics circuit and/or heat-conducting metal face respectively on the intermediate layer pass through the ceramic base Grommet on bottom is electrically connected；The grommet includes solid metal hole and/or the hole wall filled by the insertion of columnar metal thing It has been plated the plated-through hole of metal.
Described multi-layer ceramics printed circuit board includes two pieces of heat sink substrates；Two pieces of heat sink substrates are separately positioned on institute State on the bottom surface and top surface of multi-layer ceramics printed circuit board；Two pieces of heat sink substrates are corresponding with the respectively heat sink substrate respectively Ceramics base PCB plate eutectic melts laminating connection；By respective between each ceramics base PCB plate between two pieces of heat sink substrates The laminating layer of the ceramic substrate and laminating with the eutectic melting between its opposite laminating layer of the ceramic substrate, so as to form bottom Portion and top are both provided with the multi-layer ceramics printed circuit board of heat sink substrate.
The local function net of printed electronics circuit in area is printed with the electronic circuit in the heat-conducting metal face of the lying copper region Network is electrically connected, or the heat-conducting metal face of the lying copper region is printed the printed electronics circuit in area with the electronic circuit and integrally had Electrically connect.
The electronic circuit prints the isolation area being additionally provided between area and the lying copper region for electric insulation, the isolation The laminating floor of the ceramic substrate is not provided with area.
The electronic circuit prints area to be included for arranging the high power density part fixed area of high power density part, using In the control circuit area and the power electronic circuits area for Bu Let power electronic circuits that arrange control circuit.
The eutectic material that cloth covers on the laminating layer of ceramic substrate and the laminating layer of the heat sink substrate is included for Au-Sn gold stannum Alloy, Au-Si gold silicon eutectic materials, Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In stannum indium are closed Any one of gold or Sn-Pb leypewters.
The eutectic material that the laminating layer cloth of the ceramic substrate covers is Au-Sn gold-tin alloys, Au-Si gold silicon eutectic materials, Au- It is any one in Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In tin-indium alloys or Sn-Pb leypewters Kind；The laminating layer of the heat sink substrate is the golden Au of monolayer, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, Pd Palladium or aluminum Al；Or the laminating layer of the heat sink substrate is to be golden Au, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Appoint in Li, Pd palladium or all materials of aluminum Al and select the multiple structure that two or more alternating cloth covers.
The laminating layer of the ceramic substrate being oppositely arranged and the laminating layer of the heat sink substrate of eutectic welding are participated in, is had mutually Not, respectively uniform cloth be covered with monolayer or alternately cloth cover the golden Au of multilamellar, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In or One of lead Pb set of data cellulosic material is planted；Participate in the laminating layer of the ceramic substrate being oppositely arranged and the heat sink substrate of eutectic welding Laminating layer, which is two kinds of mutually different materials respectively for laminating top layer eutectic material is melted；The described bi-material exists When eutectic is welded, laminating formation Au-Sn gold-tin alloys, Au-Si gold silicon eutectic layers, Au-Ge gold-germanium alloys, Ag-Sn silver stannum are melted Alloy, Sn-Bi sn-bi alloy, any one in Sn-In tin-indium alloys, and Sn-Pb leypewters.
The thickness of the laminating layer of ceramic substrate and the laminating layer of the heat sink substrate is respectively 2 microns to 100 microns.
The thickness of the laminating layer of ceramic substrate and the laminating layer of the heat sink substrate is respectively 3 microns to 20 microns.
The material of the ceramic base bottom, is more than or equal to the high-heat-conductivity ceramic material of 2 W/mK using heat conductivity；System The ceramic material for making the ceramic base bottom includes aluminium sesquioxide, aluminium nitride, silicon nitride and beryllium oxide, the ceramic base bottom Choose any one kind of them for above-mentioned three kinds of materials or two kinds and two or more combinations.
Described in the mutually laminating polylith, the material of the ceramic base bottom of ceramics base PCB plate can be with identical；Or the phase Mutually the material of the ceramic base bottom of laminating polylith ceramics base PCB plate is different；Material used by variant ceramic base bottom Heat conduction and insulation requirements selection collocation of the material according to different layers.
The material of the heat sink substrate includes metal, carborundum or carbonization sial.
The Au-Sn gold-tin alloys, by mass percentage, wherein containing golden Au80.0% ± 2.0%, remaining is stannum Sn.
The Ag-Sn silver-tin alloys, by mass percentage, wherein stanniferous Sn96.5% ± 2.0%3.5%, remaining is silver Ag 。
The Au-Ge gold-germanium alloys, by mass percentage, wherein containing golden Au 88.0% ± 2.0%, remaining is germanium Ge.
The Au-Si gold silicon eutectics material, by mass percentage, wherein containing golden Au 97.0% ± 2.0%, remaining is silicon Si。
The present invention can also be a kind of for manufacturing aforenoted multi-layer pottery to solve the technical scheme that the technical problem is adopted The manufacture method of porcelain printed circuit board is comprised the following steps, C1：On the ceramic base bottom of the ceramics base PCB plate, cloth covers Eutectic material forms the laminating layer of the ceramic substrate；Eutectic material is covered in the heat sink base layer cloth of the heat sink substrate form described The laminating layer of heat sink substrate；C2：Heat sink substrate of the ceramic substrate of the ceramics base PCB plate laminating layer with the heat sink substrate is covered Close layer to press in opposite directions, be heated to jointly the eutectic temperature of eutectic material used, carry out eutectic melting it is laminating and by ceramics base PCB plate It is laminating with heat sink substrate melting to be connected into integrated multi-layer ceramics printed circuit board；When the quantity of the ceramics base PCB plate For it is a plurality of when, respectively realize that eutectic melting is laminating by the laminating layer of the respective ceramic substrate between the ceramics base PCB plate.
The present invention can also be a kind of for manufacturing aforenoted multi-layer pottery to solve the technical scheme that the technical problem is adopted The manufacture method of porcelain printed circuit board is comprised the following steps, D1：Eutectic material is covered in the heat sink base layer cloth of the heat sink substrate Form the laminating layer of the heat sink substrate；In the ceramic base bottom of the ceramics base PCB plate, needs are covered with the heat sink substrate Close in the side that layer is combined in opposite directions, cloth covers eutectic material and forms the laminating layer of the ceramic substrate, even if the ceramic substrate Directly couple between laminating layer and the ceramic base bottom；Getting along well, the laminating layer eutectic of the heat sink substrate melts laminating connection The ceramic base bottom side, is provided with intermediate layer between the laminating layer of ceramic substrate and the ceramic base bottom；At this The electronic circuit in intermediate layer is printed uniform cloth on each lines of printed electronics circuit and each node in area and covers eutectic material, and/or should Intermediate layer lying copper region heat-conducting metal face on uniform cloth cover eutectic material, in each line of printed electronics circuit in the intermediate layer The laminating layer of ceramic substrate is formed on bar and each node and/or on heat-conducting metal face；Before cloth covers the laminating layer of the ceramic substrate, The electronic circuit for having been provided with being printed with the intermediate layer of the ceramics base PCB plate printed electronics circuit prints area and for centre Layer large area covers the heat-conducting metal face i.e. lying copper region for carrying out heat conduction and radiating；D2：By the ceramic substrate of the ceramics base PCB plate Laminating layer is pressed laminating layer in opposite directions with the heat sink substrate of the heat sink substrate, is heated to jointly the eutectic temperature of eutectic material used Degree, carries out eutectic and melts laminating and be connected into integrated multi-layer ceramics by ceramics base PCB plate laminating with heat sink substrate melting Printed circuit board；When the quantity of the ceramics base PCB plate is a plurality of, respectively by respective institute between the ceramics base PCB plate State the laminating layer of ceramic substrate and realize that eutectic melting is laminating.
The solution have the advantages that：1. between the laminating layer of ceramic substrate and the laminating layer of heat sink substrate not only conveniently by Eutectic welding is realized the mechanical attachment of the interlayer of multi-layer ceramics printed circuit board and is electrically connected, and substantially increases multi-layer ceramics print The heat conductivility of circuit board processed；2. the laminating layer in the lying copper region and lying copper region in the laminating layer of heat sink substrate and intermediate layer enters The heat conductivility of multi-layer ceramics printed circuit board is improve one step；3. the pottery used by the ceramic base bottom of ceramics base PCB plate Porcelain material is the ceramic material of high heat conduction, with good heat conductivility and dielectric strength；Multi-layer ceramics according to the present invention Printed circuit board has superior heat conductivility, is particularly suitable for the application scenario of high power and high heat flux.
Description of the drawings
Fig. 1 is the preferred embodiment of the present invention I i.e. axonometric projection schematic diagram of single channel COB-LED light source applications substrate；
Fig. 2 is the schematic top plan view of heat sink substrate 900 in Fig. 1, and the laminating layer of heat sink substrate is provided with the embodiment in figure 930；
Fig. 3 is the schematic top plan view in the 100 substrate A face 112 of ceramics base PCB plate in preferred embodiment of the present invention I；Show in figure Ceramic base bottom 110 and laminating layer 130；
Fig. 4 is the schematic top plan view in the substrate B face 114 of ceramics base PCB plate 100 in Fig. 1；
Fig. 5 is the schematic side view of ceramics base PCB plate 100 in Fig. 4；
Fig. 6 is that the multi-layer ceramics of heat sink substrate 900 and the 100 laminating formation of ceramics base PCB plate shown in Fig. 3 and Fig. 4 in Fig. 1 is printed The schematic top plan view of circuit board；
Fig. 7 is the schematic side view of Fig. 6；
Fig. 8 is the enlarged diagram of the G parts in Fig. 7；
During Fig. 9 is preferred embodiment of the present invention II, the wherein one side of the ceramic base bottom 110 of one piece of ceramics base PCB plate 100 is bowed Depending on schematic diagram；The one side of the ceramic base bottom 110 of one piece of ceramics base PCB plate 100 is illustrate only in figure, this can be simultaneously substrate A faces 112 can also be substrate B face 114；The electronic circuit is printed the laminating floor 138 in area and is shown with electronic circuit printing area 128 It is shown as the same area；The laminating layer 135 of the lying copper region is shown as the same area with the lying copper region 125；
Figure 10 is the subregion schematic top plan view that the electronic circuit of preferred embodiment of the present invention II prints area 128, be illustrate only in figure The wherein one side of the ceramic base bottom 110 of one piece of ceramics base PCB plate 100, it can also be base that this can be simultaneously substrate A face 112 Bottom B faces 114.
Specific embodiment
The reality of one single channel COB-LED light source applications substrate of the multi-layer ceramics printed circuit board 10 as shown in Fig. 1 to 8 Apply in example, a kind of multi-layer ceramics printed circuit board 10 for being provided with heat sink substrate include one piece of ceramics base PCB plate 100 and one piece it is hot Heavy substrate 900；The ceramics base PCB plate 100 include for insulation and heat conduction and heat radiation ceramic base bottom 110 and for eutectic melt Melt the laminating layer of ceramic substrate 130 that weldering couples and realizes heat conduction；By the ceramic base bottom 110 mutually on the whole parallel two Surface is referred to as substrate A face 112 and substrate B face 114, and the laminating layer of the ceramic substrate 130 is arranged on the substrate A face 112 On, or the laminating layer of the ceramic substrate 130 is arranged on the substrate B face 114；The heat sink substrate 900 is included for heat conduction The heat sink base layer 910 of radiating and couple and realize the laminating layer of heat sink substrate 930 of heat conduction for eutectic fusion weld；It is described heat sink The laminating layer of substrate 930 is overlayed on the heat sink base layer 910；The laminating layer 130 of ceramic substrate and the heat sink substrate are laminating Layer 930 is the eutectic material layer with eutectic melting characteristic；The laminating layer 130 of ceramic substrate and the laminating layer of the heat sink substrate 930 laminating heating eutectic fusion welds realize that eutectic is laminating；So as to respectively the ceramics base PCB plate 100 and heat sink substrate 900 melt Laminating connection becomes the multi-layer ceramics printed circuit board 10 that the number of plies is at least two-layer.
It is in multi-layer ceramics printed circuit board 10 as shown in Figure 2, laminating with laminating 930 eutectic of the layer melting of the heat sink substrate The laminating layer of the ceramic substrate 130 of connection is overlayed on the ceramic base bottom 110 directly or by transition metal layer, i.e., should Directly couple or coupled by transition metal layer between the laminating layer 130 of the ceramic substrate and the ceramic base bottom 110.It is described On ceramics base PCB plate 100, the ceramic substrate that laminating 930 eutectic of layer of the heat sink substrate of getting along well melts laminating connection is laminating Intermediate layer 120 is provided between layer 130 and the ceramic base bottom 110.The material of the transition metal layer can be titanium Ti or copper The combination of Cu or various metals.
In embodiment as shown in Fig. 2 to 10, the intermediate layer 120 is arranged on the substrate A face 112, or it is described in Interbed 120 is arranged on the substrate B face 114；The intermediate layer 120 is used for printed electronics circuit and/or lays heat-conducting metal Face；The intermediate layer 120 includes that the electronic circuit for printed electronics circuit prints area 128 and/or for laying heat-conducting metal The lying copper region 125 in face, the lying copper region 125 are covered, realize heat conduction and radiating in intermediate layer large area；The ceramic substrate is laminating Floor 130 includes that electronic circuit prints the laminating floor 138 in area and/or the laminating floor of lying copper region 135；The electronic circuit prints the laminating floor in area 138 uniform cloth are overlying on the electronic circuit and print on each lines of printed electronics circuit and each node in area 128；The lying copper region is covered Close 135 uniform cloth of layer to be overlying on the heat-conducting metal face of the lying copper region 125.
Certainly in certain embodiments, the laminating connection of eutectic need not be carried out on the intermediate layer 120 of ceramics base PCB plate 100 When, the laminating layer 130 of the ceramic substrate, the i.e. electronic circuit for printed electronics circuit can be not provided with and print area 128 On be not provided with electronic circuit and print the laminating floor 138 in area, be also not provided with described cover in the lying copper region 125 in heat-conducting metal face for laying The laminating floor in copper area 135.Simply just the laminating layer of ceramic substrate is covered with where corresponding when needing to carry out eutectic melting 130, to save technique and material cost.
In embodiment as shown in Fig. 2 to 9, heat-conducting metal face and the electronic circuit of the lying copper region 125 print area In 128, the local function network of printed electronics circuit is electrically connected, or the heat-conducting metal face of the lying copper region 125 and the electric wire Printed electronics circuit in road printing area 128 is integrally electrically connected.The electronic circuit prints area 128 and the lying copper region The isolation area 127 for electric insulation is additionally provided between 125, the laminating layer of the ceramic substrate on the isolation area 127, is not provided with 130。
In embodiment as shown in Figure 10, the electronic circuit prints area 128 to be included for arranging high power density part High power density part fixed area 1283, the control circuit area 1285 for arranging control circuit and be used for Bu Let power electronics The power electronic circuits area 1287 of circuit.
In some of the figures in unshowned embodiment, the multi-layer ceramics printed circuit board 10 includes that the number of plies is more than three layers Multi-layer ceramics printed circuit board 10；The multi-layer ceramics printed circuit board 10 includes one piece of heat sink substrate 900 and at least two Block ceramics base PCB plate 100；The number of plies of the multi-layer ceramics printed circuit board 10 is 900 quantity of the heat sink substrate and ceramic base The summation of 100 quantity of pcb board；The heat sink substrate 900 is by the laminating layer 930 of the heat sink substrate and one piece of ceramics base PCB plate The laminating layer of 100 ceramic substrate 130 realizes that eutectic melts laminating connection；While the block ceramics base PCB plate 100 and other ceramic bases By the laminating layer 130 of the respective ceramic substrate and with the laminating layer of its opposite described ceramic substrate 130 between pcb board 100 Between eutectic melting it is laminating, so as to shape all-in-one-piece multi-layer ceramics printed circuit board 10.
It is in some of the figures in unshowned embodiment, described during respectively the ceramics base PCB plate 100 needs laminating two opposite The printed electronics circuit of interbed and/or the figure in heat-conducting metal face are mutually in specular, or at least most of printed electronics The figure in circuit and/or heat-conducting metal face is in specular；Described respectively ceramics base PCB plate 100 needs laminating two opposite When the printed electronics circuit in intermediate layer and/or the asymmetric figure in heat-conducting metal face, with the asymmetric part printed electronics circuit And/or opposite that face in heat-conducting metal face should be blank ceramic plane.
In fig .9 in shown embodiment, the ceramic bases of the ceramics base PCB plate 100 of eutectic fusion weld are participated in When being provided with the intermediate layer 120 on the substrate A face 112 and substrate B face 114 of layer 110, respectively on the intermediate layer 120 Printed electronics circuit and/or heat-conducting metal face are electrically connected by the grommet 118 on the ceramic base bottom 110；The metal Hole 118 includes that the solid metal hole filled by the insertion of columnar metal thing and/or hole wall have been plated the plated-through hole of metal.
In some of the figures in unshowned embodiment, including two pieces of heat sink substrates 900；900 points of two pieces of heat sink substrates It is not arranged on the bottom surface and top surface of the multi-layer ceramics printed circuit board 10；Two pieces of heat sink substrates 900 are each with same respectively 900 corresponding ceramics base PCB plate of heat sink substrate, 100 eutectic melts laminating connection；It is each between two pieces of heat sink substrates 900 By the laminating layer 130 of the respective ceramic substrate and laminating with its opposite described ceramic substrate between ceramics base PCB plate 100 Eutectic melting between layer 130 is laminating, is both provided with the multi-layer ceramics printing electricity of heat sink substrate 900 so as to form bottom and top Road plate 10.
In certain embodiments, being total to of covering of cloth on the laminating layer 130 of the ceramic substrate and the laminating layer 930 of the heat sink substrate Brilliant material is included for Au-Sn gold-tin alloys, Au-Si gold silicon eutectic materials, Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi Any one of sn-bi alloy, Sn-In tin-indium alloys or Sn-Pb leypewters.
In certain embodiments, the eutectic material that laminating 130 cloth of layer of the ceramic substrate covers is Au-Sn gold-tin alloys, Au- Si gold silicon eutectic materials, Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In tin-indium alloys or Sn-Pb Any one in leypewter；The laminating layer 930 of the heat sink substrate is the golden Au of monolayer, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, Pd palladium or aluminum Al；Or the laminating layer 930 of the heat sink substrate is to be golden Au, stannum Sn, silicon Si, silver Appoint in Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, Pd palladium or all materials of aluminum Al and select two or more alternating cloth and cover Multiple structure.
In certain embodiments, the laminating layer 130 of the ceramic substrate being oppositely arranged and the heat of eutectic welding are participated in The laminating layer 930 of heavy substrate, mutually differently, respectively uniform cloth be covered with monolayer or alternately cloth covers the golden Au of multilamellar, stannum Sn, silicon One of Si, silver Ag, germanium Ge, bismuth Bi, indium In or lead Pb set of data cellulosic material are planted；Participate in the ceramics being oppositely arranged of eutectic welding The laminating layer 130 of substrate and the laminating layer 930 of the heat sink substrate, which is two kinds mutual respectively for laminating top layer eutectic material is melted The material for differing；The described bi-material melts laminating formation Au-Sn gold-tin alloys, Au-Si gold silicons altogether when eutectic is welded Crystal layer, Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In tin-indium alloys, and the conjunction of Sn-Pb tin-leads Any one in gold.
In certain embodiments, the thickness difference of the laminating layer 130 of the ceramic substrate and the laminating layer of the heat sink substrate 930 For 2 microns to 100 microns.It is micro- that the thickness of the laminating layer 130 of ceramic substrate and the laminating layer of the heat sink substrate 930 is respectively 3 Rice is to 20 microns.
The laminating 130 preferred thickness of layer of the ceramic substrate can also be 6 microns, 8 microns, 10 microns, 20 microns, it is 50 micro- Rice and 80 microns.The laminating 930 preferred thickness of layer of the heat sink substrate can also be 6 microns, 8 microns, 10 microns, 20 microns, 50 microns and 80 microns.Certainly the laminating layer 130 of ceramic substrate and laminating 930 its thickness of layer of heat sink substrate can be that other are suitable Size.
In certain embodiments, the material of the heat sink substrate 900 includes metal, carborundum or carbonization sial.
In some embodiments, in the Au-Sn gold-tin alloys, the mass percent of golden Au is 80.0%, the quality of stannum Sn Percentage ratio is 20.0%.Its eutectic temperature is 280 DEG C, i.e. the fusing point of eutectic welding is 280 DEG C.
In some embodiments, in the Ag-Sn silver-tin alloys, the mass percent of silver-colored Ag is 3.5%, the quality of stannum Sn Percentage ratio is 96.5%.
In some embodiments, in the Au-Ge gold-germanium alloys, the mass percent of golden Au is 88.0%, the quality of germanium Ge Percentage ratio is 12.0%.Its eutectic temperature is 356 DEG C, i.e. the fusing point of eutectic welding is 356 DEG C.
In some embodiments, in the Au-Si gold silicon eutectics material, the mass percent of golden Au is 97.0%, silicon Si's Mass percent is 3.0%.Its eutectic temperature is 370 DEG C, i.e. the fusing point of eutectic welding is 370 DEG C.
The eutectic material except be previously mentioned Au-Sn gold-tin alloys, Au-Si gold silicon eutectic materials, Au-Ge gold germaniums close Outside gold, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy and Sn-In tin-indium alloys, can also be other, any to possess eutectic special The laminating material of eutectic of property.Suitable eutectic material can be selected according to the application scenario of different ceramics pcb boards and technological design demand Material.For example in the application of different temperatures demand, the eutectic material of different eutectic temperatures can be selected.
For example preferred Au-Sn gold-tin alloys Au80Sn20 and, Au-Si gold silicon eutectic materials As u97Si3 apply when, Using the multi-layer ceramics pcb board of two kinds of eutectic materials, higher temperature can be tolerated so that the range of application of stack of ceramic plates Further expand, the substrate after such as Au-Si gold silicon eutectics material eutectic can tolerate up to 280 degree of reflow soldering process.
Need and unlike material face carry out secondary welding or it is laminating when, can select to meet material with secondary welding Co-melting performance more preferably eutectic meets material；The solder Sn-Ag of such as argentiferous, it is easy to the end joined with coating argentiferous；Containing gold, Solder containing indium is easy to and end joined of the coating containing gold.
The laminating single material of above-mentioned participation eutectic may alternatively be any one conventional metal material or semi-conducting material.
In certain embodiments, the material of the ceramic base bottom 110, using heat conductivity more than or equal to 2 W/mK's High-heat-conductivity ceramic material；Make the ceramic base bottom 110 ceramic material include aluminium sesquioxide, aluminium nitride, silicon nitride and Beryllium oxide, the ceramic base bottom 110 are chosen any one kind of them or two kinds and two or more combinations for above-mentioned three kinds of materials.Three oxidations two The heat conductivity of the substrate of aluminum or nitridation aluminium material is far above common FR4 epoxy glass cloth laminated boards and existing other ceramic materials The heat conductivity of ceramic laminate；The substrate dielectric strength of aluminium sesquioxide or nitridation aluminium material is also far above aluminium base laminate Dielectric strength.
In certain embodiments, the ceramic base bottom 110 of ceramics base PCB plate 100 described in the mutually laminating polylith Material can be with identical；Or the material of the ceramic base bottom 110 of the mutually laminating polylith ceramics base PCB plate 100 is different； Heat conduction and insulation requirements selection collocation of the material used by variant ceramic base bottom 110 according to different layers.
In certain embodiments, the ceramic base bottom 110 of ceramics base PCB plate 100 described in the mutually laminating polylith Material can be with identical；Or the material of the ceramic base bottom 110 of the mutually laminating polylith ceramics base PCB plate 100 is different； Heat conduction and insulation requirements selection collocation of the material used by variant ceramic base bottom 110 according to different layers.
As shown in Fig. 1,2 and 6, the heat sink substrate 900 is circle, and the ceramics base PCB plate 100 is square.In reality Using in, the shape of the heat sink substrate 900 and the ceramics base PCB plate 100 can be made different according to the demand of application The shape that shape is for example square, circular or other are special-shaped.The thickness of the heat sink substrate 900 and the ceramics base PCB plate 100 also may be used Rationally to arrange its thickness according to the demand of actual radiating and heat conduction.
As shown in figure 9, in some embodiments, on the substrate A face 112 and substrate B face 114 of the ceramic base bottom 110 When being provided with the intermediate layer 120, printed electronics circuit and/or heat-conducting metal face respectively on the intermediate layer 120 pass through Grommet 118 on the ceramic base bottom 110 is electrically connected；The grommet 118 include by metal needle insertion fill it is solid Grommet and hole wall have been plated the plated-through hole of metal.
In certain embodiments, the grommet 118 is used to manufacture multi-layer ceramics printing in the ceramics base PCB plate 100 It is metallized before circuit board 10, synthetic multi-layer ceramic printed circuit board 10 is covered two-by-two in each ceramics base PCB plate 100 Afterwards, as eutectic welding is with good mobility, therefore the surface of the via that metallizes also assists in eutectic bond and is formed and is beneficial to lead The Eutectic Layer of heat.The grommet 118 includes solid metal hole and hollow plated-through hole.Certain solid metal hole Heat conductivility is better than hollow plated-through hole.Where the very high thermal conductivity demand of part, grommet can be designed to reality Heart plated through-hole.In addition can also arrange on each ceramics base PCB plate 100 and be provided with for installing the location hole for positioning.
In certain embodiments, the heat-conducting metal face of the lying copper region 125 is printed in area 128 with the electronic circuit and is printed The local function network of electronic circuit is electrically connected, or area is printed with the electronic circuit in the heat-conducting metal face of the lying copper region 125 Printed electronics circuit in 128 is integrally electrically connected.
In certain embodiments, mutual electric insulation between the ceramic base bottom 110 and the intermediate layer 120.It is described Between the heat-conducting metal face of the lying copper region 125 in intermediate layer 120 and the laminating layer 130 of the ceramic substrate, existing electrically connecting also has Mechanical attachment.The electronic circuit in the same intermediate layer 120 print on each lines of printed electronics circuit and each node in area 128 When laminating layer 130 of the laminating ceramic substrate, each lines of printed electronics circuit and each node are laminating with the ceramic substrate Between layer 130, existing electrically connecting also have mechanical attachment.I.e. described electronic circuit is printed the laminating 138 uniform cloth of floor in area and overlays on printing electricity On each lines in sub-line road and each node, the electronic circuit prints the laminating floor 138 in area and each lines of printed electronics circuit and Ge Jie Melt laminating rear realization to electrically connect and mechanical attachment on point；The laminating 135 uniform cloth of layer of the lying copper region overlays on the lying copper region 125 Heat-conducting metal face on, realize electrically connecting and mechanical attachment after the laminating layer 135 of the lying copper region is laminating with the melting of heat-conducting metal face.
As shown in figure 9, the electronic circuit in above-mentioned multiple embodiments prints the printed electronics line material bag in area 128 Include copper Cu.The grommet 118 the ceramics base PCB plate 100 be used for manufacture multi-layer ceramics printed circuit board 10 before Metallization, after each ceramics base PCB plate 100 covers synthetic multi-layer ceramic printed circuit board 10 two-by-two, as eutectic welding has There is good mobility, therefore the surface of the via that metallizes also assists in eutectic bond and forms the Eutectic Layer beneficial to heat conduction.The gold Category hole 118 includes solid metal hole and hollow plated-through hole.Certainly the heat conductivility in solid metal hole is better than hollow Plated-through hole.Where the very high thermal conductivity demand of part, grommet can be designed to solid metal hole.
As shown in Figure 10, in some embodiments, the electronic circuit is printed area 128 and is included for arranging high power density The high power density part fixed area 1283 of part, the control circuit area 1285 for arranging control circuit and for arranging electric power The power circuit area 1287 of electronic circuit.It should be noted that in Fig. 10, simply to illustrate that the subregion for conveniently carrying out is said It is bright, the region division thousand in actual high power density part fixed area 1283, control circuit area 1285 and power circuit area 1287 Differ from ten thousand not, need to be laid out according to actual device feature.
The laminating layer of the laminating layer 130 of ceramic substrate and heat sink substrate in above-mentioned multiple embodiments 930 not only can be very square The interlayer connection that multi-layer ceramics printed circuit board 10 is realized in eutectic welding is will pass through, and improves electronic circuit and print area 128 Heat conductivility.
Laminating layer 130 in the lying copper region 125 and lying copper region 125 in above-mentioned multiple embodiment intermediate layers 120 is further Improve the heat conductivility of multi-layer ceramics printed circuit board 10.
A kind of manufacture method for manufacturing aforenoted multi-layer ceramics printed circuit board is comprised the following steps, C1：In the pottery On the ceramic base bottom 110 of porcelain base pcb board 100, cloth covers eutectic material and forms the laminating layer of the ceramic substrate 130；Described 910 cloth of heat sink base layer of heat sink substrate 900 covers eutectic material and forms the laminating layer of the heat sink substrate 930；C2：By the ceramics The laminating 130 930 opposite pressing of laminating layer with the heat sink substrate of the heat sink substrate 900 of layer of ceramic substrate of base pcb board 100, altogether With the eutectic temperature of eutectic material used is heated to, carry out eutectic melting it is laminating and by ceramics base PCB plate 100 and heat sink substrate 900 meltings are laminating to be connected into integrated multi-layer ceramics printed circuit board 10；When the quantity of the ceramics base PCB plate 100 is When a plurality of, respectively realize that eutectic melting is covered by the laminating layer of the respective ceramic substrate 130 between the ceramics base PCB plate 100 Close.
A kind of manufacture method for manufacturing aforenoted multi-layer ceramics printed circuit board is comprised the following steps, D1：In the heat 910 cloth of heat sink base layer of heavy substrate 900 covers eutectic material and forms the laminating layer of the heat sink substrate 930；In the ceramic base PCB The ceramic base bottom 110 of plate 100, needs with the laminating 930 opposite compound side of layer of the heat sink substrate, and cloth covers altogether Brilliant material forms the laminating layer 130 of the ceramic substrate, and the laminating layer of the ceramic substrate 130 is covered directly or by transition metal layer On the ceramic base bottom 110, i.e., directly join between the laminating layer 130 of the ceramic substrate and the ceramic base bottom 110 Connect or coupled by transition metal layer；The ceramics of laminating connection are melted in laminating 930 eutectic of layer of the heat sink substrate of getting along well 110 side of basal layer, is provided with intermediate layer 120 between the laminating layer 130 of the ceramic substrate and the ceramic base bottom 110； Electronic circuit in the intermediate layer 120 is printed uniform cloth on each lines of printed electronics circuit and each node in area 128 and covers eutectic material Material, and/or uniform cloth covers eutectic material on the heat-conducting metal face of the lying copper region 125 in the intermediate layer 120 being somebody's turn to do, in the intermediate layer The laminating layer of ceramic substrate 130 is formed on the 120 each lines of printed electronics circuit and each node and/or on heat-conducting metal face；In cloth Before covering the laminating layer of the ceramic substrate 130, have been provided with being printed with printing on the intermediate layer 120 of the ceramics base PCB plate 100 The electronic circuit of electronic circuit is printed area 128 and covered for intermediate layer large area carries out heat conduction with the heat-conducting metal face radiated i.e. Lying copper region 125；D2：By the heat sink base of the ceramic substrate of the ceramics base PCB plate 100 laminating layer 130 and the heat sink substrate 900 The laminating layer of plate 930 is opposite to be pressed, and is heated to jointly the eutectic temperature of eutectic material used, carry out eutectic melting it is laminating and by ceramics Base pcb board 100 and heat sink substrate 900 are melted and laminating are connected into integrated multi-layer ceramics printed circuit board 10；When the pottery It is when the quantity of porcelain base pcb board 100 is a plurality of, respectively laminating by the respective ceramic substrate between the ceramics base PCB plate 100 Layer 130 realizes that eutectic melting is laminating.
In manufacture method for manufacturing multi-layer ceramics printed circuit board according to the present invention, laminating above-mentioned eutectic material is also There is eutectic characteristic to be applied to the other materials of eutectic welding to may alternatively be other.Various eutectic materials are according to its eutectic material The component of material is different, with different eutectic temperatures；Be related to eutectic welding temperature range can be at 100 degrees Celsius extremely Between 800 degrees Celsius, it is also possible between 200 degrees Celsius to 400 degrees Celsius；Also the eutectic temperature for having part eutectic material exists 100 degrees Celsius to 200 degrees Celsius；Also there is the eutectic temperature of part eutectic material at 400 degrees Celsius to 800 degrees Celsius.Wherein, have Between 300 to 330 degrees Celsius, specific temperature can for the eutectic temperature of part eutectic material as Au-Sn gold-tin alloys Being 310 or 320 degrees Celsius.Such temperature range is compatible with existing PCB technology, is adapted to large-scale production, it is to avoid tradition High temperature and complicated technology method in 10 manufacturing process of multi-layer ceramics printed circuit board.
In the present invention, also referred to as " it is combined " in " laminating " word other documents in the prior art；" the connection Connect " it is also sometimes used as " connection " in a word other documents in the prior art, but " connection " in present specification contains Adopted scope is referred not only to " connection ", the meaning that part occasion also " is combined ".
In the multi-layer ceramics printed circuit board of the present invention, the laminating layer of heat sink substrate is not only real conveniently by eutectic welding The interlayer connection of existing multi-layer ceramics printed circuit board, and improve the heat conductivility that electronic circuit prints area；Particularly heat sink base The laminating layer of ceramic substrate in the lying copper region and lying copper region in plate itself and ceramics base PCB plate intermediate layer 130 is further carried The high heat conductivility of multi-layer ceramics printed circuit board；The ceramic material of the ceramic base bottom of ceramics base PCB plate is three oxidations two The mixture of any one or more in aluminum, aluminium nitride, silicon nitride and beryllium oxide is strong with good heat conductivility and insulation Degree.The laminating layer of heat sink substrate and the laminating layer of ceramic substrate 130 substantially increase multi-layer ceramics print while realizing that interlayer couples The heat conductivility of circuit board processed；Ceramic base bottom has good heat conductivility and dielectric strength so that the multilamellar pottery of the present invention Porcelain printed circuit board has fine heat conductivility, is adapted to the application scenario of high power and high heat flux, is particularly suitable for The encapsulation of MOSFET, IGBT, LED constant power device, is equally suitable for the encapsulation of high power CPU/MPU/GPU integrated circuits, And the application of integrated power module IPM and photo engine power modules.
Compared to known structure and technique, the laminating layer of heat sink substrate, heat sink substrate and intermediate layer lying copper region and cover Laminating floor in copper area not only realizes the mechanical attachment of interlayer and electrically connects, and also substantially increases multi-layer ceramics printed circuit board Heat conductivility；Ceramic bases and heat sink substrate all have good heat conductivility and dielectric strength so that the multilamellar of the present invention There is ceramic printed circuit board good heat conductivility to be adapted to the application scenario of high power and high heat flux.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using invention Equivalent structure or equivalent flow conversion that description and accompanying drawing content are made, or directly or indirectly it is used in other related technologies Field, is included within the scope of the present invention.

Claims (23)

1. a kind of multi-layer ceramics printed circuit board (10) for being provided with heat sink substrate, including：At least one piece ceramics base PCB plate And at least one piece heat sink substrate (900) (100)；Characterized in that,
The ceramics base PCB plate (100) is included for insulation with the ceramic base bottom (110) of heat conduction and heat radiation and for eutectic melting Weldering couples and realizes the laminating layer of the ceramic substrate (130) of heat conduction；The ceramic base bottom (110) is mutually parallel on the whole Two surfaces are referred to as substrate A face (112) and substrate B face (114), and the laminating layer (130) of the ceramic substrate is arranged on the base On bottom A faces (112), or the laminating layer of the ceramic substrate (130) is arranged on the substrate B face (114)；
The heat sink substrate (900) includes for the heat sink base layer (910) of heat conduction and heat radiation and for eutectic fusion weld coupling simultaneously Realize the laminating layer of the heat sink substrate (930) of heat conduction；The laminating layer (930) of the heat sink substrate overlays on the heat sink base layer (910) On；
The laminating layer (130) of ceramic substrate and the laminating layer of the heat sink substrate (930) are being total to eutectic melting characteristic Brilliant material layer；The laminating layer (130) of ceramic substrate and the laminating layer of the heat sink substrate (930) laminating heating eutectic fusion weld Realize that eutectic is laminating；So as to respectively the ceramics base PCB plate (100) and the laminating connection of heat sink substrate (900) melting the number of plies will be become extremely It is the multi-layer ceramics printed circuit board (10) of two-layer less.
2. multi-layer ceramics printed circuit board according to claim 1, it is characterised in that
Melt the laminating laminating layer of the ceramic substrate (130) for coupling directly with the heat sink substrate laminating layer (930) eutectic or By transition metal layer, overlay on the ceramic base bottom (110), i.e. the laminating layer (130) of the ceramic substrate and the pottery Directly couple between porcelain basal layer (110) or coupled by transition metal layer；
On the ceramics base PCB plate (100), laminating layer (930) eutectic of the heat sink substrate of getting along well melts the described of laminating connection Intermediate layer (120) is provided between the laminating layer of ceramic substrate (130) and the ceramic base bottom (110)；
The intermediate layer (120) is arranged on the substrate A face (112), or the intermediate layer (120) are arranged on substrate B On face (114)；
The intermediate layer (120) is for printed electronics circuit and/or lays heat-conducting metal face；The intermediate layer (120) includes using Lying copper region (125) in electronic circuit printing area (128) of printed electronics circuit and/or for laying heat-conducting metal face, it is described Lying copper region (125) is covered, realizes heat conduction and radiating in intermediate layer large area；
The laminating floor (130) of the ceramic substrate prints the laminating floor (138) in area and/or the laminating floor of lying copper region including electronic circuit (135)；The electronic circuit is printed the uniform cloth of the laminating floor (138) in area and is overlying on the printing electricity that the electronic circuit prints area (128) On each lines in sub-line road and each node；The uniform cloth of the laminating layer (135) of the lying copper region is overlying on the heat conduction gold of the lying copper region (125) On category face.
3. multi-layer ceramics printed circuit board according to claim 2, it is characterised in that
The multi-layer ceramics printed circuit board (10) includes multi-layer ceramics printed circuit board (10) that the number of plies is more than three layers；This institute Multi-layer ceramics printed circuit board (10) is stated including one piece of heat sink substrate (900) and at least two pieces ceramics base PCB plates (100)；It is described The number of plies of multi-layer ceramics printed circuit board (10) is the total of the heat sink substrate (900) quantity and ceramics base PCB plate (100) quantity With；
The heat sink substrate (900) is by the laminating layer of the heat sink substrate (930) and the ceramics of one piece of ceramics base PCB plate (100) The laminating layer of substrate (130) realizes that eutectic melts laminating connection；
Simultaneously by the respective ceramic substrate between the block ceramics base PCB plate (100) and other ceramics base PCB plates (100) Laminating layer (130) and between its opposite laminating layer of described ceramic substrate (130) eutectic melting it is laminating, so as to formed one Multi-layer ceramics printed circuit board (10).
4. multi-layer ceramics printed circuit board according to claim 3, it is characterised in that
The respectively ceramics base PCB plate (100) needs the printed electronics circuit in two laminating opposite intermediate layers and/or heat conduction gold The figure in category face is mutually in specular, or the figure at least most of printed electronics circuit and/or heat-conducting metal face is in mirror As symmetrical；
The respectively ceramics base PCB plate (100) needs the printed electronics circuit in two laminating opposite intermediate layers and/or heat conduction gold When the figure in category face is asymmetric, that face opposite with asymmetric part printed electronics circuit and/or the heat-conducting metal face should be empty White ceramic plane.
5. multi-layer ceramics printed circuit board according to claim 3, it is characterised in that
Participate in substrate A face (112) and the base of the ceramic base bottom (110) of the ceramics base PCB plate (100) of eutectic fusion weld When the intermediate layer (120) are provided with bottom B faces (114), respectively the printed electronics circuit on the intermediate layer (120) and/ Or heat-conducting metal face is electrically connected by the grommet (118) on the ceramic base bottom (110)；The grommet (118) includes The solid metal hole and/or hole wall filled by the insertion of columnar metal thing have been plated the plated-through hole of metal.
6. multi-layer ceramics printed circuit board according to claim 3, it is characterised in that
Including two pieces of heat sink substrates (900)；Two pieces of heat sink substrates (900) are separately positioned on the multi-layer ceramics printed circuit On the bottom surface and top surface of plate (10)；Two pieces of heat sink substrates (900) respectively with the corresponding ceramics of each heat sink substrate (900) Base pcb board (100) eutectic melts laminating connection；Each ceramics base PCB plate (100) between two pieces of heat sink substrates (900) it Between by the laminating layer (130) of the respective ceramic substrate and between its opposite laminating layer of described ceramic substrate (130) Eutectic melting is laminating, is both provided with the multi-layer ceramics printed circuit board (10) of heat sink substrate (900) so as to form bottom and top.
7. multi-layer ceramics printed circuit board according to claim 2, it is characterised in that
The local of printed electronics circuit in area (128) is printed with the electronic circuit in the heat-conducting metal face of the lying copper region (125) Functional network is electrically connected, or the printing in area (128) is printed in the heat-conducting metal face of the lying copper region (125) with the electronic circuit Electronic circuit is integrally electrically connected.
8. multi-layer ceramics printed circuit board according to claim 2, it is characterised in that
The electronic circuit prints the isolation area being additionally provided between area (128) and the lying copper region (125) for electric insulation (127), the laminating layer of the ceramic substrate (130) is not provided with the isolation area (127).
9. multi-layer ceramics printed circuit board according to claim 2, it is characterised in that
The electronic circuit prints area (128) to be included for arranging the high power density part fixed area of high power density part (1283), for arranging the control circuit area (1285) of control circuit and the power electronic circuits for Bu Let power electronic circuits Area (1287).
10. multi-layer ceramics printed circuit board according to claim 1, it is characterised in that
The eutectic material that cloth covers on the laminating layer (130) of ceramic substrate and the laminating layer of the heat sink substrate (930) is included for Au- Sn gold-tin alloys, Au-Si gold silicon eutectic materials, Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In Any one of tin-indium alloy or Sn-Pb leypewters.
11. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
The eutectic material that laminating layer (130) cloth of the ceramic substrate covers be Au-Sn gold-tin alloys, Au-Si gold silicon eutectic materials, Appointing in Au-Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, Sn-In tin-indium alloys or Sn-Pb leypewters Meaning is a kind of；
The laminating layer (930) of the heat sink substrate is the golden Au of monolayer, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium In, nickel, lithium Li, Pd palladium or aluminum Al；Or the laminating layer (930) of the heat sink substrate is to be golden Au, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, indium Appoint in In, nickel, lithium Li, Pd palladium or all materials of aluminum Al and select the multiple structure that two or more alternating cloth covers.
12. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
The laminating layer of the ceramic substrate (130) being oppositely arranged and the laminating layer of the heat sink substrate (930) of eutectic welding are participated in, Mutually differently, respectively uniform cloth be covered with monolayer or alternately cloth cover the golden Au of multilamellar, stannum Sn, silicon Si, silver Ag, germanium Ge, bismuth Bi, One of indium In or lead Pb set of data cellulosic material are planted；
The laminating layer of the ceramic substrate (130) being oppositely arranged and the laminating layer of the heat sink substrate (930) of eutectic welding are participated in, Which is two kinds of mutually different materials respectively for laminating top layer eutectic material is melted；
The described bi-material melts laminating formation Au-Sn gold-tin alloys, Au-Si gold silicon eutectic layers, Au- when eutectic is welded Ge gold-germanium alloys, Ag-Sn silver-tin alloys, Sn-Bi sn-bi alloy, appointing in Sn-In tin-indium alloys, and Sn-Pb leypewters Meaning is a kind of.
13. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
Respectively 2 microns to 100 of the thickness of the laminating layer (130) of ceramic substrate and the laminating layer of the heat sink substrate (930) is micro- Rice.
14. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
Respectively 3 microns to 20 of the thickness of the laminating layer (130) of ceramic substrate and the laminating layer of the heat sink substrate (930) is micro- Rice.
15. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
The material of the ceramic base bottom (110), is more than or equal to the high-heat-conductivity ceramic material of 2 W/mK using heat conductivity；System The ceramic material for making the ceramic base bottom (110) includes aluminium sesquioxide, aluminium nitride, silicon nitride and beryllium oxide, the ceramics Basal layer (110) is that above-mentioned four kinds of materials are chosen any one kind of them or two kinds and two or more combinations.
16. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
Described in the mutually laminating polylith, the material of the ceramic base bottom (110) of ceramics base PCB plate (100) can be with identical；Or The material of the ceramic base bottom (110) of the mutually laminating polylith ceramics base PCB plate (100) is different；Variant pottery Heat conduction and insulation requirements selection collocation of the material used by porcelain basal layer (110) according to different layers.
17. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
The material of the heat sink substrate (900) includes metal, carborundum or carbonization sial.
18. multi-layer ceramics printed circuit boards according to claim 10, it is characterised in that
The Au-Sn gold-tin alloys, by mass percentage, wherein containing golden Au80.0% ± 2.0%, remaining is stannum Sn.
19. multi-layer ceramics printed circuit board according to claim 10, it is characterised in that
The Ag-Sn silver-tin alloys, by mass percentage, wherein stanniferous Sn 96.5% ± 2.0%, remaining is silver Ag.
20. multi-layer ceramics printed circuit boards according to claim 10, it is characterised in that
The Au-Ge gold-germanium alloys, by mass percentage, wherein containing golden Au 88.0% ± 2.0%, remaining is germanium Ge.
21. multi-layer ceramics printed circuit boards according to claim 1, it is characterised in that
The Au-Si gold silicon eutectics material, by mass percentage, wherein containing golden Au 97.0% ± 2.0%, remaining is silicon Si.
22. is a kind of for manufacturing claims 1, the manufacture method bag of multi-layer ceramics printed circuit board described in 10 to 17 any one Include following steps,
C1：On the ceramic base bottom (110) of the ceramics base PCB plate (100), cloth covers eutectic material and forms the ceramics The laminating layer of substrate (130)；Eutectic material is covered in heat sink base layer (910) cloth of the heat sink substrate (900) form described heat sink The laminating layer of substrate (930)；
C2：By the heat sink base of the laminating layer of the ceramic substrate (130) of the ceramics base PCB plate (100) and the heat sink substrate (900) The laminating layer of plate (930) is pressed in opposite directions, is heated to jointly the eutectic temperature of eutectic material used, is carried out eutectic and is melted laminating and will make pottery Porcelain base pcb board (100) is laminating with heat sink substrate (900) melting to be connected into integrated multi-layer ceramics printed circuit board (10)；
When the quantity of the ceramics base PCB plate (100) is a plurality of, respectively by respective between the ceramics base PCB plate (100) The laminating layer (130) of the ceramic substrate realizes that eutectic melting is laminating.
A kind of 23. manufacture methods for multi-layer ceramics printed circuit board described in 2 to 9 any one of manufacturing claims include with Lower step,
D1：Eutectic material is covered in heat sink base layer (910) cloth of the heat sink substrate (900) form the laminating layer of the heat sink substrate (930)；
In the ceramic base bottom (110) of the ceramics base PCB plate (100), need and the laminating layer of the heat sink substrate (930) In the opposite compound side, cloth covers eutectic material and forms the laminating layer of the ceramic substrate (130),
On the ceramic base bottom (110), i.e., the laminating layer (130) of the ceramic substrate is overlayed on directly or by transition metal layer Directly couple between the laminating layer (130) of ceramic substrate and the ceramic base bottom (110) or joined by transition metal layer Connect；
Ceramic base bottom (110) side of laminating connection is melted in laminating layer (930) eutectic of the heat sink substrate of getting along well, Intermediate layer (120) is provided between the laminating layer (130) of ceramic substrate and the ceramic base bottom (110)；In the intermediate layer (120) electronic circuit is printed uniform cloth on each lines of printed electronics circuit and each node of area (128) and covers eutectic material, and/ Or uniform cloth covers eutectic material on the heat-conducting metal face of the lying copper region (125) in the intermediate layer (120) being somebody's turn to do, in the intermediate layer (120) the laminating layer (130) of ceramic substrate is formed on each lines of printed electronics circuit and each node and/or on heat-conducting metal face；
Before cloth covers the laminating layer of the ceramic substrate (130), set on the intermediate layer (120) of the ceramics base PCB plate (100) Be equipped be printed with printed electronics circuit electronic circuit print area (128) and for intermediate layer large area cover carry out heat conduction and dissipate The heat-conducting metal face of heat is lying copper region (125)；
D2：By the heat sink base of the laminating layer of the ceramic substrate (130) of the ceramics base PCB plate (100) and the heat sink substrate (900) The laminating layer of plate (930) is pressed in opposite directions, is heated to jointly the eutectic temperature of eutectic material used, is carried out eutectic and is melted laminating and will make pottery Porcelain base pcb board (100) is laminating with heat sink substrate (900) melting to be connected into integrated multi-layer ceramics printed circuit board (10)；
When the quantity of the ceramics base PCB plate (100) is a plurality of, respectively by respective between the ceramics base PCB plate (100) The laminating layer (130) of the ceramic substrate realizes that eutectic melting is laminating.
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CN113225901A (en) * 2021-05-12 2021-08-06 四川锐宏电子科技有限公司 Multilayer thick film ceramic-based circuit board and preparation process thereof

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CN205987522U (en) * 2016-07-06 2017-02-22 深圳市微纳科学技术有限公司 Be provided with multilayer ceramic printed circuit board of heat sink base plate

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