CN106548969B - Clamping device and semiconductor processing equipment - Google Patents
Clamping device and semiconductor processing equipment Download PDFInfo
- Publication number
- CN106548969B CN106548969B CN201510606839.4A CN201510606839A CN106548969B CN 106548969 B CN106548969 B CN 106548969B CN 201510606839 A CN201510606839 A CN 201510606839A CN 106548969 B CN106548969 B CN 106548969B
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- Prior art keywords
- cover board
- clamping device
- boss
- claw
- pallet
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The present invention provides a kind of clamping device and semiconductor processing equipments, including pallet, cover board and multiple claw components, wherein, the upper surface of pallet is provided with multiple boss for bearing wafer, it is provided with multiple through-holes through its thickness on the cover board, and each through-hole is mutually nested with each boss correspondingly, and the upper surface flush with each other of the upper surface of cover board and chip on each boss；Each claw component is arranged in correspondingly at each boss, and cover board is used to each claw component being fixed on pallet；Each claw component includes the equally distributed multiple claws of circumferential direction along boss, and multiple claws push down the fringe region of each upper wafer surface.So as to improve the etch rate uniformity in piece, and then process uniformity can be improved to avoid the raw difference of the gentle miscarriage of electric field being distributed between Waffer edge and center in clamping device provided by the invention.
Description
Technical field
The invention belongs to microelectronics technologies, and in particular to the semiconductor machining of clamping device and the application clamping device
Equipment.
Background technique
With the continuous development of microelectric technique, the competition of associated production enterprise is more and more fierce, reduces cost, improves life
Producing efficiency then is the conventional means for improving enterprise competitiveness.It is produced into such as LED light source manufacturing enterprise to improve production efficiency, reducing
This, in graphical sapphire substrate (Patterned Sapphire Substrates, hereinafter referred to as PSS) etching process
In, multiple sapphire substrates are realized while carried and etching by the way of pallet carrying, are needed with coping with increasingly increased market
It asks.
Fig. 1 is the structure diagram of the existing plasma processing device for carrying out PSS etching.As shown in Figure 1, the plasma
Body process equipment include reaction chamber 1, inductance-coupled coil 4, coil adaptation 21, coil RF power supply 22, mechanical chuck 6,
Lower electrode adaptation 31, lower electrode radio-frequency power supply 32 and clamping device 5.Wherein, inductance-coupled coil 4 is set to reaction chamber
1 top, and be sequentially connected with coil adaptation 21 and coil RF power supply 22；Mechanical chuck 6 includes that lower electrode (does not show in figure
Out), the lower section inside reaction chamber 1, and lower electrode and lower electrode adaptation 31 and lower electrode radio-frequency power supply 32 are set to
It is sequentially connected；Clamping device 5 is used for while carrying and transporting multiple chips, enters reaction chamber 1 and is placed on machinery later
On chuck 6.It is well known that the structure of clamping device has a very big impact the etching effect and availability of chip.
Fig. 2A is the sectional view of common clamping device.Fig. 2 B is the top view of clamping device in Fig. 2A.Also referring to
Fig. 2A -2B, clamping device include pallet 51 and cover board 52.Wherein, pallet 51 is for carrying multiple chips 7；It is set on cover board 52
It is equipped with through-hole 57, and is provided with multiple claws 571 along its circumferentially-spaced distribution in each through-hole 57, to push down chip 7
The fringe region of upper surface；Cover board 52 is fixed together with pallet 51 using screw 53, to realize that the clamping to chip 7 is solid
It is fixed.Moreover, because the requirement of etching selection ratio, cover board 52 must be using nonmetallic materials (such as quartz) production, this is just needed
Increase the thickness of entire cover board 52, to guarantee the intensity of claw 571.
Above-mentioned clamping device is inevitably present following problems in practical applications:
Fig. 3 be technique in air-flow and electric field wafer edge distribution schematic diagram.As shown in figure 3, due to cover board 52
On through-hole 57 can chip 7 periphery formed a groove structure, when carrying out technique, electric field can be in the shadow of this groove structure
Certain deflection is generated under sound in recess edge, as shown in the arrow of the leftmost side in Fig. 3, is caused in the side perpendicular to wafer surface
Upwards, the electric field strength of wafer edge certainly will be less than the electric field strength at center wafer；Meanwhile air-flow (the gas above chip
Stream direction is as shown by the dotted line in fig. 3) flow resistance under the influence of this groove structure in Waffer edge becomes larger, lead to Waffer edge
The density of the plasma at place generates difference relative to center wafer.
From the foregoing, it will be observed that leading to the electricity being distributed between Waffer edge and center due to being influenced by above-mentioned groove structure
The raw difference of the gentle miscarriage in field, to cause the etch rate at Waffer edge and center uneven, and then the process uniformity in piece
It is deteriorated.
Summary of the invention
It is at least to solve one of above-mentioned technical problem, the present invention provides a kind of clamping device and semiconductor processing equipment,
It can be to avoid the raw difference of the gentle miscarriage of electric field being distributed between Waffer edge and center, so as to improve the speed of the etching in piece
Rate uniformity, and then process uniformity can be improved.
For this purpose, the present invention provides a kind of clamping device, including pallet and cover board, it is provided in the upper surface of the pallet
Multiple boss for bearing wafer are provided with multiple through-holes through its thickness on the cover board, and each through-hole is one by one
It is accordingly mutually nested with each boss, and the upper surface of chip is mutually put down on the upper surface of the cover board and each boss
Together；The clamping device further includes multiple claw components, and each claw component is arranged in correspondingly at each boss, described
Cover board is used to each claw component being fixed on the pallet；Each claw component includes uniformly dividing along the circumferential of the boss
Multiple claws of cloth, the multiple claw push down the fringe region of each upper wafer surface.
Preferably, each claw component further includes ring body, the ring body be nested in the through-hole and the boss it
Between, the claw is the protrusion being arranged on the internal perisporium of the ring body；Flange, institute are provided on the periphery wall of the ring body
Cover board is stated the ring body is fixed on the pallet and pushing down the flange.
Preferably, on the lower surface of the cover board, and it is located at the peripheral portion of each through-hole, or each logical
Annular groove is additionally provided on the hole wall in hole, the flange is located in the annular groove.
Preferably, each claw component further includes ring body, and the ring body is embedded in the cover board, and the ring body
Upper end and the cover board upper surface flush；One end of the claw is connect with the upper end of the ring body, the claw
The other end extends to the fringe region of the upper wafer surface.
Preferably, each claw component further includes multiple connectors, and the multiple connector is embedded in the cover board
In, and the upper surface flush of the upper end of the connector and the cover board；One end of each claw correspondingly with it is each
The upper end of connector connects, and the other end of each claw extends to the fringe region of the upper wafer surface.
Preferably, the claw is made of metal material.
Preferably, the cover board is fixed together in such a way that screw is connect with the pallet.
As another technical solution, the present invention also provides a kind of semiconductor processing equipments, including for bearing wafer
Clamping device, the clamping device use above-mentioned clamping device provided by the invention.
The invention has the following advantages:
Multiple boss for bearing wafer are arranged by the upper surface in pallet in clamping device provided by the invention,
It is provided with multiple through-holes through its thickness on the cover board, and each through-hole is mutually nested with each boss correspondingly, it can
The upper surface flush with each other of chip on upper surface and each boss to realize cover board, to can not only make the gas above chip
Stream can flow in opposed flattened plane, and flow velocity is without mutation, but also can occur to avoid electric field in wafer edge
Deflection, and then can be to avoid the raw difference of the gentle miscarriage of electric field being distributed between Waffer edge and center, so as to improve piece
Interior etch rate uniformity improves process uniformity.In addition, above-mentioned clamping device is fixed brilliant using independent claw component
Piece, this can not only be realized on the basis of the upper surface flush with each other of chip on the upper surface of above-mentioned cover board and each boss
Fixation to chip, and since the structure of independent claw component is simple, difficulty of processing is small, this compared with prior art, can
To increase the flexibility of structure and installation.
Semiconductor processing equipment provided by the invention can be kept away by using above-mentioned clamping device provided by the invention
Exempt to be distributed in the raw difference of the gentle miscarriage of electric field between Waffer edge and center, it is uniform so as to improve the etch rate in piece
Property, and then process uniformity can be improved.
Detailed description of the invention
Fig. 1 is the structure diagram of the existing plasma processing device for carrying out PSS etching；
Fig. 2A is the sectional view of common clamping device；
Fig. 2 B is the top view of clamping device in Fig. 2A；
Fig. 3 be technique in air-flow and electric field wafer edge distribution schematic diagram；
Fig. 4 is the partial sectional view for the clamping device that first embodiment of the invention provides；
Fig. 5 is the top view for the clamping device that first embodiment of the invention provides；And
Fig. 6 is the partial sectional view for the clamping device that second embodiment of the invention provides.
Specific embodiment
To make those skilled in the art more fully understand technical solution of the present invention, come with reference to the accompanying drawing to the present invention
The clamping device and semiconductor processing equipment of offer are elaborated.
For ease of description, following embodiment places clamping device in the horizontal plane, and the upper surface of pallet refers to pallet
Towards upper surface, the upper surface of chip refer to chip towards upper surface.
Fig. 4 is the partial sectional view for the clamping device that first embodiment of the invention provides.Fig. 5 is first embodiment of the invention
The top view of the clamping device of offer.Referring to Figure 4 together and Fig. 5, clamping device include pallet 61, cover board 62 and multiple claws
Component 65.Wherein, the upper surface of pallet 61 is provided with multiple boss 611 for bearing wafer 63, is arranged on cover board 62
There are multiple through-holes through its thickness, and each through-hole is mutually nested with each boss correspondingly, and cover board 62 is upper
The upper surface flush with each other of chip 63 on surface and each boss 611.That is, cover board 62 is stacked in the upper surface of pallet 61
On, and each boss 611 correspondingly be located at each through-hole in, so as to realize cover board 62 upper surface and each boss
The upper surface flush with each other of chip 63 on 611.It is readily appreciated that, the difference in height between 61 upper surface of 611 upper surface of boss and pallet
The difference of the thickness of cover board 62 and the thickness of chip 63 should be substantially equal to.
Due to the upper surface flush with each other of chip 63 on the upper surface of cover board 62 and each boss 611, this can not only make
The air-flow of the top of chip 63 can flow in opposed flattened plane, and flow velocity is without mutation, but also can exist to avoid electric field
63 edge of chip deflects, and then can be poor to avoid the gentle miscarriage life of electric field being distributed between Waffer edge and center
It is different, so as to improve the etch rate uniformity in piece, improve process uniformity.
Each claw component 65 is arranged in correspondingly at each boss 611, and cover board 62 is used for each claw component
62 are fixed on pallet 61.In the present embodiment, each claw component 65 include ring body 651, ring body 651 be nested in through-hole with
Between boss 611, furtherly, there is annular gap between the hole wall of through-hole and the periphery wall of boss 611, ring body 651 is set
It sets in the annular gap.Moreover, multiple protrusions 652 are provided on the internal perisporium of each ring body 651, multiple 652 edges of protrusion
The circumferential direction of boss 611 is uniformly distributed, and is used as the fringe region that claw pushes down each 63 upper surface of chip, to realize to chip
63 fixation.
In addition, being provided with flange 653 on the periphery wall of ring body 651, cover board 62 is and pushing down flange 653 by ring body
651 are fixed on pallet 61.Preferably, on the lower surface of cover board 62, and the peripheral portion for being located at each through-hole is provided with ring
Connected in star, flange 653 are located in the annular groove, in this way can be brilliant on the upper surface and each boss 611 for realizing cover board 62
On the basis of the upper surface flush with each other of piece 63, guarantee that the integral thickness of cover board 62 is basically unchanged.Certainly, in practical applications,
Above-mentioned annular groove also can be set on the hole wall of each through-hole, and make position of the flange 653 on the periphery wall of ring body 651
Make the adjustment of adaptability.
When installing claw component 65, each ring body 651 is mounted on correspondingly at each boss 611 first, this
When each protrusion 652 push down the fringe region of each 63 upper surface of chip；Then, cover board 62 is stacked in the upper surface of pallet 61
On, flange 653 is located in the annular groove of cover board 62 at this time, and is pushed down by the bottom surface of the annular groove；Finally, cover board 62 and support
Disk 61 is fixed together using multiple screws 64, to realize the fixation to chip 63.
From the foregoing, it will be observed that above-mentioned clamping device is using independent claw component fixed wafer, this not only can be in above-mentioned lid
On the upper surface of plate and each boss on the basis of the upper surface flush with each other of chip, fixation of the realization to chip, and due to
The structure of independent claw component is simple, difficulty of processing is small, this can increase the flexible of structure and installation compared with prior art
Property.
Fig. 6 is the partial sectional view for the clamping device that second embodiment of the invention provides.Referring to Fig. 6, the present embodiment mentions
Compared with above-mentioned first embodiment, difference is only that the clamping device of confession: the structure of claw component is different, and adaptively adjusts
The structure of cover board.
Specifically, clamping device includes pallet 61, cover board 81 and multiple claw components 82.Wherein, each claw component packet
Include ring body 822, and the equally distributed multiple claws 821 of circumferential direction along boss 611.Wherein, ring body 822 is embedded in cover board 81
In, and the upper surface flush of the upper end of the ring body 822 and cover board 81；One end of each claw 821 and the upper end of ring body 822 connect
It connects, the other end of the claw 821 extends to the fringe region of 63 upper surface of chip, to realize the fixation of chip 63.
When installing claw component 82, cover board 62 need to be only stacked on the upper surface of pallet 61, claw 821 can be pushed down
The fringe region of 63 upper surface of chip；Then, cover board 62 is fixed together with pallet 81 using multiple screws 64, thus realization pair
The fixation of chip 63.
Preferably, in above-mentioned first, second embodiment, above-mentioned claw is made of metal material.Due to each claw
Exterior surface area it is smaller, thus even if it is exposed in plasma environment, etching selection ratio will not be impacted, therefore
It can be made of metal material.In addition, the intensity due to metal material is preferable, thus it can permit and reduce to the thickness of claw
Very thin, the upper surface of chip is flush with each other on the most of region and each boss so as to realize cover board upper surface.
Certainly, in practical applications, above-mentioned claw can also be using the preferable insulating materials production of intensity.
As a variant embodiment of above-mentioned second embodiment, above-mentioned ring body 822 can be replaced using multiple connectors,
That is, each claw is fixedly connected by each connector with cover board correspondingly, due to being in discrete topology between each connector,
It is smaller that it is exposed to the surface area in plasma environment, so as to be further ensured that etching selection ratio not will receive shadow
It rings.
Specifically, each claw component includes along the equally distributed multiple claws of circumferential direction of boss and multiple connections
Part.Wherein, similar with the ring body in above-mentioned second embodiment, multiple connectors are embedded in cover board, and each connector
Upper end and cover board upper surface flush；One end of each claw is connect with the upper end of each connector correspondingly, respectively
The other end of a claw extends to the fringe region of upper wafer surface, to realize the fixation of chip.
In conclusion the clamping device that the above-mentioned each embodiment of the present invention provides, by making the upper surface of cover board and every
The upper surface flush with each other of chip on a boss, can not only enable the air-flow above chip flow in opposed flattened plane
It is dynamic, and flow velocity is without mutation, but also can deflect to avoid electric field in wafer edge, so as to avoid being distributed in chip
The raw difference of the gentle miscarriage of electric field between edge and center, and then the etch rate uniformity in piece can be improved, improve technique
Uniformity.In addition, above-mentioned clamping device is using independent claw component fixed wafer, the structure of the claw component is simple, adds
Work difficulty is small, this can increase the flexibility of structure and installation compared with prior art.
As another technical solution, the embodiment of the present invention also provides a kind of semiconductor processing equipment, including for carrying
The clamping device of chip, the clamping device use the clamping device that the above-mentioned each embodiment of the present invention provides.
Semiconductor processing equipment provided in an embodiment of the present invention is provided by using the above-mentioned each embodiment of the present invention
Above-mentioned clamping device, can be to avoid the raw difference of the gentle miscarriage of electric field being distributed between Waffer edge and center, so as to mention
Etch rate uniformity in high piece, and then process uniformity can be improved.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (5)
1. a kind of clamping device, including pallet and cover board, which is characterized in that the upper surface of the pallet is provided with multiple be used for
The boss of bearing wafer, is provided with multiple through-holes through its thickness on the cover board, and each through-hole correspondingly with
Each boss is mutually nested, and the upper surface flush with each other of the upper surface of the cover board and chip on each boss；
The clamping device further includes multiple claw components, and each claw component is arranged in correspondingly at each boss, institute
Cover board is stated for each claw component to be fixed on the pallet；
Each claw component includes the equally distributed multiple claws of circumferential direction along the boss, and the multiple claw pushes down each crystalline substance
The fringe region of piece upper surface；
Each claw component further includes ring body, and the ring body is nested between the through-hole and the boss, the claw
The protrusion on internal perisporium for the ring body is arranged in, is provided with flange on the periphery wall of the ring body, and the cover board passes through
It pushes down the flange and the ring body is fixed on the pallet.
2. clamping device according to claim 1, which is characterized in that on the lower surface of the cover board, and be located at each
The peripheral portion of the through-hole, or annular groove is additionally provided on the hole wall of each through-hole, the flange is located at the ring
In connected in star.
3. clamping device according to claim 1, which is characterized in that the claw is made of metal material.
4. clamping device according to claim 1, which is characterized in that the cover board is connect with the pallet using screw
Mode is fixed together.
5. a kind of semiconductor processing equipment, including the clamping device for bearing wafer, which is characterized in that the clamping device is adopted
The clamping device described in any one of claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606839.4A CN106548969B (en) | 2015-09-22 | 2015-09-22 | Clamping device and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606839.4A CN106548969B (en) | 2015-09-22 | 2015-09-22 | Clamping device and semiconductor processing equipment |
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| Publication Number | Publication Date |
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| CN106548969A CN106548969A (en) | 2017-03-29 |
| CN106548969B true CN106548969B (en) | 2019-08-23 |
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| CN201510606839.4A Active CN106548969B (en) | 2015-09-22 | 2015-09-22 | Clamping device and semiconductor processing equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10522381B2 (en) * | 2017-04-07 | 2019-12-31 | Applied Materials, Inc. | Aligner apparatus and methods |
| JP6839314B2 (en) * | 2019-03-19 | 2021-03-03 | 日本碍子株式会社 | Wafer mounting device and its manufacturing method |
| CN112670143B (en) * | 2020-12-23 | 2024-04-12 | 北京北方华创微电子装备有限公司 | Semiconductor device and tray cover plate assembly thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202275812U (en) * | 2011-07-13 | 2012-06-13 | 昆山中辰矽晶有限公司 | Wafer bearing combination |
| CN203631509U (en) * | 2013-12-23 | 2014-06-04 | 徐州同鑫光电科技有限公司 | Substrate tray with different cooling temperatures at different areas |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400235A (en) * | 1982-03-25 | 1983-08-23 | Bell Telephone Laboratories, Incorporated | Etching apparatus and method |
| CN101621022A (en) * | 2008-07-04 | 2010-01-06 | 广镓光电股份有限公司 | Combined type chip carrying disk and epitaxy machine platform thereof |
| KR101124167B1 (en) * | 2010-06-01 | 2012-03-06 | 주식회사 소로나 | a holder of substrate for plasma treatment and plasma apparatus adopting the same |
| CN103594315B (en) * | 2012-08-14 | 2016-04-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of plasma processing device |
| CN204651300U (en) * | 2015-05-21 | 2015-09-16 | 安徽三安光电有限公司 | A kind of carrier and etching apparatus |
-
2015
- 2015-09-22 CN CN201510606839.4A patent/CN106548969B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202275812U (en) * | 2011-07-13 | 2012-06-13 | 昆山中辰矽晶有限公司 | Wafer bearing combination |
| CN203631509U (en) * | 2013-12-23 | 2014-06-04 | 徐州同鑫光电科技有限公司 | Substrate tray with different cooling temperatures at different areas |
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| CN106548969A (en) | 2017-03-29 |
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Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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