CN106546781A - Probe card with lie circuit - Google Patents
Probe card with lie circuit Download PDFInfo
- Publication number
- CN106546781A CN106546781A CN201610823200.6A CN201610823200A CN106546781A CN 106546781 A CN106546781 A CN 106546781A CN 201610823200 A CN201610823200 A CN 201610823200A CN 106546781 A CN106546781 A CN 106546781A
- Authority
- CN
- China
- Prior art keywords
- signal
- hole
- conductor
- circuit
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present invention relates to a kind of probe card with lie circuit, which includes a circuit board, a signal probe and the grounded probe being arranged at below circuit board bottom surface, and one through circuit board top, the lie circuit of bottom surface, the signal through hole of contact position of the circuit board with a correspondence test machine, lie circuit includes an electric-conductor and a transmission line, electric-conductor is arranged at connection pad of the signal through hole positioned at one end of board top surface comprising one with signal through hole mutually insulated, for contacting for test machine, an earth conductor of the transmission line comprising mutually insulated and a signal conductor, earth conductor is electrically connected with earthing potential and grounded probe, signal conductor is electrically connected with signal probe and electric-conductor；Probe card provided by the present invention by it is easy, do not destroy structure and do not cause signal that lie circuit is set in the way of disturbing, can the still normal operation when the internal wiring of circuit board is problematic.
Description
Technical field
The present invention is relevant with probe card, particularly relates to a kind of probe card with lie circuit.
Background technology
Refer to Fig. 1, Fig. 1 is a kind of partial cutaway view schematic of the probe card commonly used, the probe card 10 commonly used includes
One circuit board 11, is fixed on the probe base 12 of 11 bottom surface of circuit board, and a plurality of 13 (figures of probe groups located at probe base 12
A probe groups 13 are shown in formula only, to illustrate), each probe groups 13 include a grounded probe 132 and a signal probe 134,
132 one end of grounded probe is welded in a grounding through hole 112 of circuit board 11, and 134 one end of signal probe is welded in circuit board 11
One signal through hole 114.Grounding through hole 112 is electrically connected with by the internal wiring (not shown) being laid in inside circuit board 11
Grounding through hole (not shown) to 11 outer rim of circuit board is further electrically connected to earthing potential.Signal through hole 114 is then by electricity
The internal wiring 116 of road plate 11 and be electrically connected with positioned at another signal through hole 118 of 11 outer rim of circuit board, thus, test machine
(not shown) can contact signal through hole 118 and the determinand (not shown) for touching put with signal probe 134 is transmitted mutually
Signal.
If however, internal wiring 116 problematic (such as line interruption), may make the two signal through holes 114,118 cannot be just
Often it is electrically connected with, the test result in turn resulting in determinand is incorrect or cannot be tested, if need to now verify internal wiring
Whether really there is problem, or need an electric connection framework for substituting, a lie circuit need to be set in probe card 10
To replace internal wiring 116, and make signal probe 134 still can be electrically connected with signal through hole 118 persistently to transmit electrically news
Number, avoid scrapping whole probe card with this and extend its service life cost-effective.Though made using external circuit at present
The correlation technique of the signal contact electric connection that probe contact with for test machine, such as TaiWan, China patent number I370900 with
And TaiWan, China patent publication No. 201350861 is provided, but can be applicable to circuit board internal wiring it is problematic when carry
For replacing circuit so that circuit board is not required to the correlation technique scrapped.
In details of the words, when the probe card 10 shown in Fig. 1 causes portion because the partial interior circuit 116 of circuit board 11 is problematic
When the signal through hole 114,118 for dividing normally cannot be used, to the knot provided using aforementioned TaiWan, China patent number I370900
Structure and one side road circuit (i.e. label 36,46 or 56 in the patent schema) is set so that signal probe 134 with contact for test machine
Signal through hole 118 be electrically connected with, then need to process groove in the circuit board 11, this measure is not only processed and is difficult, and is easily destroyed
The structure and circuit of circuit board 11, and, internal wiring 116 to be substituted still may be electrically connected with signal through hole 118, because
The signal that this signal through hole 118 is received can still be sent to internal wiring 116, and so signal transmission can be interfered.
On the other hand, to the structure that aforementioned TaiWan, China patent publication No. 201350861 is provided is applied to shown in Fig. 1
Probe card 10 to arrange one side road circuit (i.e. label 26 in the patent schema), internal wiring 116 to be substituted still may
It is electrically connected with signal through hole 118, therefore signal transmission can be interfered, and, in order to avoid the lie circuit and probe
Fix reservation (i.e. label 16 in the patent schema) to interfere, it may be necessary to process groove in circuit board 11, this measure is not only processed
It is difficult, and is easily destroyed the structure and circuit of circuit board 11.
The content of the invention
For the problems referred to above, present invention is primarily targeted at providing a kind of probe card with lie circuit, its lie
Circuit is by easier, easy making or processes, destroy structure and arranges in the way of not causing signal interference or misconnection, can be
The internal wiring of the circuit board of probe card is applied when problematic so that probe card can normal operation.
To reach above-mentioned purpose, a kind of probe card with lie circuit provided by the present invention, it is characterised in that include
Have：One circuit board, with a top surface, a bottom surface, and through a signal through hole of the top surface and the bottom surface, the signal
One contact position of through hole one test machine of correspondence；One probe groups, include a news of the subjacent for being arranged at the circuit board
Number probe and a grounded probe；One side road circuit, through bottom surface and the top surface of the circuit board, the lie circuit includes one
Electric-conductor and a transmission line, the electric-conductor include a connection pad, and the connection pad is arranged with the signal through hole mutually insulated
One end of the board top surface is located in the signal through hole, for contacting for the test machine, the transmission line includes
One earth conductor of mutually insulated and a signal conductor, the earth conductor are electrically connected with the earthing potential of the circuit board and institute
Grounded probe is stated, the signal conductor is electrically connected with the signal probe and the electric-conductor.
In the technical scheme of the invention described above, the signal through hole has a conductive inner wall, and the connection conduction
Inwall and the conductive junction point positioned at the board top surface, are provided with an at least insulation between the connection pad and the conductive junction point
Part.
The conductive junction point has an annular portion for being located at described conductive inner wall one end, and one is connected with the annular portion
Extension, prolong described in the shape correspondence conductive junction point entirety outer contour shape of the connection pad and the insulating part or correspondence
Extending portion shape, the part of the corresponding extension shape of the connection pad are used to contact for the test machine.
The transmission line includes one and is located at below the circuit board bottom surface and extends to the circuit from the probe groups
The hypomere of one through hole of plate, one through the through hole stage casing, and one be located above the board top surface and from described logical
Hole extends to the epimere of the electric-conductor, and the signal conductor is located at the hypomere, the stage casing and the epimere.
The through hole has a conductive inner wall, and the transmission line is located at the peripheral insulating barrier of the signal conductor with one,
So that the signal conductor is electrically insulated with the conductive inner wall.
The conductive inner wall of the through hole is electrically connected with the earthing potential of the circuit board.
The earth conductor of the transmission line is fully located at the hypomere, and the board top surface is provided with one and is located at the through hole
On fixture, for fixing the epimere of the transmission line.
The earth conductor of the transmission line is fully located at the hypomere, and the lie circuit also includes one located at the biography
The epimere periphery of defeated line and the conductive coating member with the conductive inner wall electric connection of the through hole.
The earth conductor of the transmission line is located at the hypomere, the stage casing and the epimere and connects leading for the through hole
Electric inwall.
The through hole is the signal through hole of the contact position of the correspondence test machine, the earth conductor of the transmission line
Through the signal through hole, be provided between the signal through hole and the connection pad of the electric-conductor one make the earth conductor with it is described
The insulating part of connection pad mutually insulated, the signal conductor of the transmission line connect the connection pad through the insulating part.
The signal through hole has a conductive inner wall, and one connects the conductive inner wall and is located at the board top surface
Conductive junction point, be provided with another insulating part between the insulating part and the conductive junction point, the earth conductor of the transmission line and
Signal conductor passes through another insulating part.
The electric-conductor also includes the connection connection pad and the latch through the signal through hole, and the transmission line is complete
It is located at below the circuit board bottom surface entirely, the signal conductor of the transmission line is electrically connected with the latch.
The signal through hole has a conductive inner wall, and one connects the conductive inner wall and is located at the board top surface
Conductive junction point, be provided with an outer insulator between the connection pad and the conductive junction point, the latch and the conductive inner wall it
Between be provided with an interior insulation part.
The conductive body of the encirclement latch is provided with the signal through hole, between the conductive body and the connection pad
One first insulating part is provided with, one second insulating part between the conductive body and the latch, is provided with, the conductive body is electrical
Connect the earthing potential of the circuit board.
The signal through hole is set between the conductive inner wall with a conductive inner wall, the conductive body and the signal through hole
There is one the 3rd insulating part.
The lie circuit also includes the joint of the one end that the circuit board bottom surface is located at located at the signal through hole,
The signal conductor of the transmission line and earth conductor are electrically connected with the latch and the conductive body respectively by the joint
Connect.
The lie circuit also includes another joint located at the circuit board bottom surface, the signal conductor of the transmission line
And earth conductor is electrically connected with the signal probe and the grounded probe respectively by another joint.
Also include a stiffening ring for being fixedly arranged on the board top surface, the stiffening ring with one not with the circuit board
The protuberance of contact, Yong Yu Arrived are connected to a probe card fixed seat.
Using above-mentioned technical proposal, signal probe passes through lie circuit and the mutual transmission signal of test machine, even if circuit board
Internal wiring it is problematic, still do not affect the normal effect of signal probe, therefore, the present invention probe card configuration can be in probe card
Circuit board internal wiring it is problematic when apply, that is, will originally be not belonging to the electric-conductor and transmission line installing of the circuit board
In the circuit board so that probe card can normal operation.And, connection pad and signal through hole mutually insulated (such as connection pad of electric-conductor
An insulating part is provided between signal through hole), therefore the signal transmitted between test machine and signal probe will not be sent to signal
Through hole, will not more be sent to the internal wiring of circuit board, can so avoid signal from disturbing.Additionally, the lie circuit of the present invention can
Be arranged in the existing through hole of circuit board, such as untapped any grounding through hole and signal through hole, or even can be arranged in should
The signal through hole (the signal through hole of connection pad is set) of the contact position of test machine, therefore the lie circuit set-up mode of the present invention
It is quite easy, and the structure and circuit of circuit board will not be destroyed.
Description of the drawings
Fig. 1 is the partial cutaway view schematic of the probe card commonly used；
Fig. 2 is that the partial cross of the probe card with lie circuit provided by one first preferred embodiment of the invention is illustrated
Figure；
Fig. 3 be the probe card with lie circuit provided by of the invention first preferred embodiment a signal through hole,
The perspective exploded view of a part for one grounding through hole and one side road circuit；
Fig. 4 is that the partial cross of the probe card with lie circuit provided by one second preferred embodiment of the invention is illustrated
Figure；
Fig. 5 is that the partial cross of the probe card with lie circuit provided by one the 3rd preferred embodiment of the invention is illustrated
Figure；
Fig. 6 is analogous to Fig. 5, but using different transmission lines；
Fig. 7 and Fig. 8 are the sectional exploded views of another two kinds of transmission lines；
Fig. 9 is that the partial cross of the probe card with lie circuit provided by one the 4th preferred embodiment of the invention is illustrated
Figure；
Figure 10 is that the partial cross of the probe card with lie circuit provided by one the 5th preferred embodiment of the invention shows
It is intended to；
Figure 11 is that the partial cross of the probe card with lie circuit provided by one the 6th preferred embodiment of the invention shows
It is intended to；
Figure 12 is that the partial cross of the probe card with lie circuit provided by one the 7th preferred embodiment of the invention shows
It is intended to；
Figure 13 is that the partial cross of the probe card with lie circuit provided by one the 8th preferred embodiment of the invention shows
It is intended to；
Figure 14 is that the partial cross of the probe card with lie circuit provided by one the 9th preferred embodiment of the invention shows
It is intended to；
Figure 15 is a conductive junction point of the probe card with lie circuit provided by the 9th preferred embodiment of the invention
Schematic top view；
Figure 16 is that the probe card with lie circuit provided by 1 the tenth preferred embodiment of the invention is fixed with a probe
The cross-sectional schematic of reservation.
Specific embodiment
Now lift following examples and combine accompanying drawing and the structure and effect of the present invention are described in detail.
Applicant's here explanation first, in the following embodiment that will be introduced and schema, identical reference number, table
Show same or similar element or its architectural feature.Secondly, when addressing an element and being arranged on another element, represent aforementioned unit
Part is to be set directly on another element, or aforementioned components are to be arranged on another element indirectly, i.e. two element it
Between be additionally provided with one or more other elements.And when addressing an element " direct " and being arranged on another element, represent two element
Between have no setting any other element.Additionally, the technical characteristic of this case for convenience of description, in each schema in a schematic manner
Mutual relation between display element and element, i.e. each element are not drawn according to actual size and ratio.
As shown in Figures 2 and 3, the probe card 21 with lie circuit provided by one first preferred embodiment of the invention is wrapped
The probe base 40, one that the bottom surface 31 of circuit board 30 is fixed on containing a circuit board 30, is located at circuit board located at probe base 40
Probe groups 50 below 30 bottom surface 31, and one side road circuit 60.
Probe groups 50 include a signal probe 52 and a grounded probe 54, and signal probe 52 is used for point and touches a determinand
(not shown), and it is used for the electrical connecting element of transmitting signals, such as spring needle (pogo by lie circuit 60 and a test machine
Pin) (not shown), is electrically connected with so that the test machine and the determinand can transmission signal mutually, and then reach and detect that this is treated
Survey the purpose of thing.The probe card of the present invention can actually include plurality of probes group 50, and not each probe groups 50 all connect
One side road circuit 60 is connect, some probe groups may be by the signal through hole and internal wiring of circuit board 30 (as shown in Figure 1 and first
Described in front technology) or be electrically connected with test machine by outside wire jumper.The present invention's is technically characterized in that lie line
Road 60 and circuit board original structure and the collocation design of probe groups, therefore only show the probe groups of a connection lie circuit 60
50, to illustrate.
Circuit board 30 have through its bottom surface 31 and top surface 32 a plurality of plated-through-holes (plating through hole,
PTH) as signal through hole or grounding through hole, these signal through holes are mainly used in the transmission news between test machine and signal probe
Number (as shown in Figure 1 and prior art described in), and grounding through hole is then used for connecting earthing potential.Generally, on circuit board
Ad-hoc location can arrange a large amount of plated-through-holes in case work is needed, and reserved part plated-through-hole is used as redundant, in other words, foundation
Depending on number of probes, these plated-through-holes may not be certain all to be used completely.Fig. 2 display signals through hole 33,34 is by an inner wire
Road 35 and be electrically connected with each other, and the spring needle for being connected to signal through hole 34 and test machine by signal probe contacts signal and leads to
Hole 33, constitutes a complete signal bang path.However, once the internal wiring 35 of two signal through holes 33,34 of connection occurs
Problem or open circuit, you can utilize under the original framework of whole probe card lie circuit provided by the present invention 60 being not required to significantly change
Come verify or directly as a replacement signal bang path replacing original signal bang path.Additionally, here is implemented
In example, display circuit board 30 has a plurality of grounding through hole 36,37 for running through its bottom surface 31 and top surface 32 to Fig. 2 simultaneously, and these connect
Ground through hole 36,37 is electrically connected with the earthing potential of circuit board 30.
Lie circuit 60 includes an electric-conductor 62 and a transmission line 64, and the electric-conductor 62 of the present embodiment only includes one and connects
Pad 622 (such as copper sheet or other sheet metals), connection pad 622 are arranged at signal through hole 33 positioned at one end of 30 top surface 32 of circuit board,
And an insulating part 71 (for example insulate colloid, two-sided tape etc.) between connection pad 622 and signal through hole 33, is provided with, insulating part 71 makes
Obtain connection pad 622 and 33 mutually insulated of signal through hole.In details of the words, it is coated with metal and forms out a conductive inner wall in signal through hole 33
332, and a connection conductive inner wall 332 and the conductive junction point 334 positioned at 30 top surface 32 of circuit board, as shown in Figure 3.The present embodiment
Conductive junction point 334 as positioned at the annular contact surface of 332 one end of conductive inner wall, the position of conductive junction point 334 faces survey
Test-run a machine is used for the spring needle for transmitting test signal and touches for the spring pin mark.And insulating part 71 covers conductive junction point 334 and (such as adopts
With paste or other modes fixed insulation part 71), for connection pad 622 on the insulating part 71 and with conductive junction point 334 mutually absolutely
Be arranged above signal through hole 33 edge (for example with paste or other modes fix connection pad 622).As it was previously stated, signal through hole
33 be formerly used for for the test machine spring needle contact, i.e. signal through hole 33 pairs should test machine a contact position, therefore,
Being arranged at the connection pad 622 above signal through hole 33 is available for the spring needle of the test machine to contact.Secondly, if in advance to signal through hole 33
Processing removes conductive inner wall 332 (such as with bore mode), then signal through hole 33 will become the general through hole for not having conducting function,
Aforesaid insulating part 71 now can be selectively not provided between connection pad 622 and signal through hole 33 then.
In the present embodiment, transmission line 64 is a coaxial line, includes a signal conductor at its center 642 (i.e. line
Core), one located at 642 periphery of signal conductor insulating barrier 644 (or claiming dielectric layer), and connecing located at 644 periphery of insulating barrier
Earthed conductor 646.One section of transmission line 64 is removed the earth conductor positioned at the section, and is passed through by the bottom surface 31 of circuit board 30
Grounding through hole 36 and stretched out by the top surface 32 of circuit board 30,642 2 end of signal conductor connects (such as weld) originally electrically respectively
It is connected to the signal probe 52 and connection pad 622 of signal through hole 34,646 one end of earth conductor connection (for example welding) grounded probe
54.In other words, transmission line 64 includes one and is located at below 30 bottom surface 31 of circuit board and extends to grounding through hole 36 from probe groups 50
Hypomere 647, through grounding through hole 36 stage casing 648, and one be located at 30 top surface 32 of circuit board above and from grounding through hole
36 epimeres 649 for extending to electric-conductor 62, signal conductor 642 and insulating barrier 644 are located at upper, middle and lower section 649,648,647, connect
Earthed conductor 646 is then fully located at hypomere 647.Consequently, it is possible to signal conductor 642 is electrically connected with signal probe 52 and electric-conductor 62,
So that 52 points of determinands for touching of the test machine and signal probe can mutual transmission signal；Additionally, earth conductor 646 connects
Ground probe 54, and the earthing potential of circuit board 30 is electrically connected with, such as earth conductor 646 is located at one end of hypomere 647 and passes through one
Wire 65 and be electrically connected with and the other end is then electrically connected with (such as weld) to the bottom of grounding through hole 36 with grounding through hole 37.
Thus, signal probe 52 by lie circuit 60 with the mutual transmission signal of test machine, even if circuit board 30 is interior
Portion's circuit is problematic, does not still affect the normal effect of signal probe 52.In other words, if original signal probe 52 is logical by signal
Hole 33,34 and internal wiring 35 and be electrically connected with test machine, when internal wiring 35 is problematic, then can install lie circuit
60, be changed without circuit board 30 and the contact position of the spring needle that do not change test machine in the case of, make signal probe 52
Still normally can act on.And, connection pad 622 and 33 mutually insulated of signal through hole, therefore transmit between test machine and signal probe 52
Signal will not be sent to signal through hole 33, will not more be sent to the internal wiring 35 of circuit board 30, can so avoid signal do
Disturb.Additionally, it (is such as to be arranged in grounding through hole in the present embodiment that lie circuit 60 can be arranged in 30 existing through hole of circuit board
36, but be not limited), lie circuit 60 can even be arranged in should the signal through hole 33 of contact position of test machine (will
Describe in detail in the 4th to the 6th preferred embodiment hereafter), therefore the lie circuit set-up mode of the present invention is quite easy, and not
The structure and circuit of circuit board can be destroyed.
As shown in Fig. 2 the top surface 32 of circuit board 30 can be provided with 72 (such as glue of fixture being located on grounding through hole 36
Body), for the epimere 649 of fixed transmission lines 64, with avoid epimere 649 because out of position and the spring needle of tested test-run a machine hits
Wear the insulating barrier 644 of a part.If the insulating barrier 644 positioned at epimere 649 is breakdown, signal conductor 642 may be caused because of contact
The spring needle of test machine transmission earthing potential and it is short-circuit, therefore fixture 72 is set can be prevented effectively from foregoing problems and occur.Its
It is secondary, although the end points of the signal conductor 642 during epimere 649 is shown in Fig. 2, Fig. 3 is set (such as weld) in connection pad 622 to connect
Centre position, in fact, aforementioned end points can be arranged in the edge of connection pad 622 to avoid the spring needle of test machine as far as possible.
The transmission line 64 of the present embodiment is arranged in grounding through hole 36, and grounding through hole 36 is electrically connected with circuit board 30 with one
The conductive inner wall 362 of earthing potential, therefore, insulating barrier 644 not only makes signal conductor 642 and 646 mutually insulated of earth conductor,
Make signal conductor 642 and 362 mutually insulated of conductive inner wall of grounding through hole 36 and signal conductor 642 can be avoided in transmission signal
The signal conductor 642 positioned at epimere 649 is more protected in short circuit, insulating barrier 644, it is to avoid which surprisingly contacts All other routes and short-circuit.This
Outward, the conductive inner wall 362 of earth conductor 646 and grounding through hole 36 can respectively in the hypomere 647 and 648 pairs, stage casing news of transmission line 64
Number conductor 642 produces the effect of impedance matching.
As shown in figure 4, the probe card 22 with lie circuit provided by one second preferred embodiment of the invention is analogous to
Aforesaid probe card 21, but lie circuit 60 also includes 649 periphery of epimere for being located at transmission line 64 and and grounding through hole
The conductive coating member 66 (such as metal tube or sheet metal) that 36 conductive inner wall 362 is electrically connected with.Thus, conductive coating member 66 with
The epimere 649 of transmission line 64 forms the coaxial configuration of the hypomere 647 for being analogous to transmission line 64, can produce the effect of impedance matching,
So that probe card 22 is applied to high-frequency test.The outer surface of conductive coating member 66 can make insulation processing, to avoid connecing with connection pad 622
Touch and cause short circuit.
As shown in figure 5, the probe card 23 with lie circuit provided by one the 3rd preferred embodiment of the invention is analogous to
Aforesaid probe card 21, but the earth conductor 646 of transmission line 64 is located at hypomere 647, stage casing 648 and epimere 649 and connection ground connection
The conductive inner wall 362 of through hole 36, i.e. before using transmission line 64, is not required to remove in grounding through hole 36 and circuit board 30
Earth conductor 646 above top surface 32, the upper, middle and lower section 649,648,647 for so also allowing for transmission line 64 produce impedance
The effect matched somebody with somebody so that probe card 23 is applied to high-frequency test.
It is noted that the coaxial line adopted by aforesaid transmission line 64 is suitable to transmit high-frequency signals (for example for one kind
Can be the up to signal of 6GHz) high-speed rod, be using mutually insulated and mutually adjoint signal conductor 642 and earth conductor
646 reach impedance matching effect at least part of section of transmission line 64.However, the high-speed rod adopted by transmission line 64 is not limited
For coaxial line, for example, it can also be the high-speed rod shown in Fig. 6, Fig. 7 and Fig. 8.Transmission line 64 shown in Fig. 6 includes an enamel-cover
Line and one with the enamel-covered wire wire (can be the single-core line or an enamel-covered wire of an only core), the signal of transmission line 64
Conductor 642 and insulating barrier 644 are just respectively the dielectric layer of the core and core outer cladding of the enamel-covered wire, and the ground connection of transmission line 64 is led
Body 646 is then the wire with the enamel-covered wire.Transmission line 64 shown in Fig. 7 includes a single-core line and one is sheathed on the single
Insulating sleeve outside line, and the outer surface of the insulating sleeve is coated with a metal level, the signal conductor 642 of transmission line 64 is the list
Heart yearn, the insulating barrier 644 and earth conductor 646 of transmission line 64 are then respectively the insulating sleeve and are plated on the insulating sleeve outer surface
Metal level.Transmission line 64 shown in Fig. 8 includes a single-core line, one is sheathed on the insulating sleeve outside the single-core line, Yi Jiyi
Metal wire outside the insulating sleeve, the signal conductor 642 of transmission line 64, insulating barrier 644 and earth conductor 646 are respectively
The single-core line, the insulating sleeve and the metal wire.
In the schema of fourth, fifth, six and nine following preferred embodiments (Fig. 9, Figure 10, Figure 11 and Figure 14), transmission is omitted
The insulating barrier 644 of line 64, and represent the signal conductor 642 and earth conductor of mutually insulated with the two lines being separated from each other respectively
646, for simplicity of illustration and it is easy to explanation.In fact, the transmission line 64 of following embodiment can adopt aforesaid various high-speed lines
Material.
As shown in figure 9, in the probe card 24 provided by one the 4th preferred embodiment of the invention, what transmission line 64 was passed through
Through hole is the signal through hole 33 of the contact position of correspondence test machine, and the signal conductor 642 and earth conductor 646 of transmission line 64 are worn
Cross signal through hole 33.Mutually insulated is needed between the conductive inner wall 332 of earth conductor 646 and signal through hole 33, for example can be in ground connection
Make insulation processing or be arranged insulating sleeve, make insulation processing in the conductive inner wall 332 of signal through hole 33 outside conductor 646, or
By the conductive inner wall 332 of signal through hole 33, with bore mode removal, (in this situation, signal through hole 33 cannot for general through hole
Conduction, but because the correspondence position of the spring needle of signal is transmitted positioned at test machine, can still be referred to as signal through hole) etc..Signal is led
Between body 642 and the conductive inner wall 332 of signal through hole 33 can by insulating barrier as the aforementioned 644 (not showing in fig .9) phase
Mutually insulate；Or, if the conductive inner wall 332 of signal through hole 33 is removed, signal conductor 642 is outer can be also not provided with insulating barrier 644.
Be provided with two insulating parts 73,74 between signal through hole 33 and connection pad 622, the signal conductor 642 of transmission line 64 through two insulating parts 73,
74 and connect connection pad 622, earth conductor 646 is separated and mutually insulated by insulating part 73 with connection pad 622, and earth conductor 646 can
The earthing potential of circuit board 30 is electrically connected between two insulating parts 73,74.Insulating part 74 is located at insulating part 73 and signal through hole
33 are located between the conductive junction point 334 of 30 top surface 32 of circuit board, and the earth conductor 646 of transmission line 64 passes through insulating part 74, insulation
Part 74 makes earth conductor 646 and 334 mutually insulated of conductive junction point, if the conductive inner wall 332 of signal through hole 33 is removed and does not have
There is conductive junction point 334, then can be not provided with insulating part 74.The earth conductor 646 of the transmission line 64 of the present embodiment is at 30 bottom of circuit board
Signal conductor 642 be accompanied by below face 31, in signal through hole 33 and all above 30 top surface 32 of circuit board and is produced impedance matching and is imitated
Really so that probe card 24 is applied to high-frequency test.
As shown in Figure 10, in the probe card 25 provided by one the 5th preferred embodiment of the invention, transmission line 64 is passed through
Through hole be correspondence test machine contact position signal through hole 33, transmission line 64 is fully located under the bottom surface 31 of circuit board 30
Side, electric-conductor 62 are also included one and are welded in connection pad 622 or the latch 624 that is connected and down extends is integrally formed with connection pad 622,
Latch 624 passes through signal through hole 33, the signal conductor 642 of transmission line 64 be welded in 624 lower end of latch and with latch 624 and connection pad
622 are electrically connected with.In other words, the mode of lie circuit 60 of the invention through circuit board 30, does not limit with transmission line 64 through electricity
Road plate 30, and circuit board 30 can be passed through with electric-conductor 62.Connection pad 622 is located at the conduction of 30 top surface 32 of circuit board with signal through hole 33
An outer insulator 75 is provided between contact 334, an interior insulation part 76 is provided between latch 624 and conductive inner wall 332 (in this enforcement
Example in for an insulation tube but it is also possible to be one located at 624 surface of latch insulating barrier), if the conductive inner wall 332 of signal through hole 33
It is removed, then can be not provided with outer insulator 75 and interior insulation part 76.
As shown in figure 11, the probe card 26 provided by one the 6th preferred embodiment of the invention is analogous to aforesaid probe card
25, but the periphery of latch 624 arranges a conductive body 67, and one first insulating part 77 is provided between conductive body 67 and connection pad 622,
One second insulating part 78 is provided between conductive body 67 and latch 624 (in the present embodiment for one located at table in conductive body 67
The insulating barrier in face is but it is also possible to be an insulating barrier for being located at 624 outer surface of latch), conductive body 67 is led with signal through hole 33
Be provided between electric inwall 332 one the 3rd insulating part 79 (be in the present embodiment one located at 67 outer surface of conductive body insulating barrier,
It may also be one is sheathed on the insulating sleeve outside contact tube body 67 or an insulating barrier in the conductive inner wall 332), if signal
The conductive inner wall 332 of through hole 33 is removed, then can be not provided with the 3rd insulating part 79.Conductive body 67 is electrically connected with circuit board 30
(for example earth conductor 646 is welded in conductive body 67 to earthing potential so that conductive body 67 is indirect by earth conductor 646
It is electrically connected with the earthing potential of the circuit board), so that the effect of impedance matching is produced to latch 624 so that probe card 26 is applied to
High-frequency test.
As shown in figure 12, the probe card 27 provided by one the 7th preferred embodiment of the invention is analogous to aforesaid probe card
26, but transmission line 64 is connected with latch 624 and conductive body 67 by a joint 68.In order to simplify schema, in Figure 12 and figure
In 13, the structure (identical with Figure 11) in signal through hole 33 is not with section view Shape Representation, therefore do not show by insulating barrier (i.e.
The 3rd insulating part conductive body 67 for 79) covering and the latch 624 being located therein, the structure in signal through hole 33 see figure
11；Additionally, joint 68 (and joint 69 of Figure 13) and transmission line 64 are also represented with simplified figure.Joint 68 is logical located at signal
Hole 33 is located at one end of 30 bottom surface 31 of circuit board, the signal end of joint 68 and the signal conductor 642 of transmission line 64 and electric-conductor 62
Latch 624 be electrically connected with, the earth terminal of joint 68 and the earth conductor 646 of transmission line 64, conductive body 67 and circuit board 30
Earthing potential be electrically connected with.Joint 68 can adopt the known joint with coaxial configuration, such as SMA (SubMiniature
Version A) joint, its detailed configuration and connected mode refer to the apllied TaiWan, China patent of applicant of the present invention and compile
The patent specification of number I541512.
As shown in figure 13, the probe card 28 provided by one the 8th preferred embodiment of the invention is analogous to aforesaid probe card
27, but transmission line 64 is to be connected with probe groups 50 by another joint 69, and joint 69 is located at circuit board 30 located at grounding through hole 37
One end of bottom surface 31, the signal end of joint 69 are electrically connected with the signal conductor 642 of transmission line 64 and signal probe 52, joint 69
Earth terminal and transmission line 64 earth conductor 646 and grounded probe 54 be electrically connected with and can be electrically connected with grounding through hole 37.
Joint 69 can adopt the known joint with coaxial configuration, such as sub-miniature A connector, its detailed configuration and connected mode to refer to this
The patent specification of apllied TaiWan, China patent number I541512 of bright applicant.
The probe card 29 provided by the 9th preferred embodiment of the present invention 1 as shown in Figure 14 and Figure 15, signal through hole 33
Conductive junction point 334 may also be connected with annular portion 336 with one except having an annular portion 336 for being located at 332 one end of conductive inner wall
The extension 338 for connecing, is originally intended to for the larger extension 338 of the spring needle contact area of test machine.The connection pad 622 of electric-conductor 62
And the shape of the insulating part 75 between connection pad 622 and conductive junction point 334 can 334 overall foreign steamer profile of corresponding conductive junction point
Shape (i.e. in the present embodiment in the roundlet that connects and a great circle), with completely obscured conductive junction point 334, or, connection pad 622 and
The shape of insulating part 75 can only to should extension 338 shape, as long as that is, cover extension 338 and make the spring needle of test machine
Will not directly contact extension 338 can (namely making both mutually insulateds), in other words, correspondence 338 shape of extension of connection pad 622
The part of shape is available for the spring needle of the test machine to contact.The present embodiment only with the structure of the probe card 25 being analogous to shown in Figure 10 is
Example, to illustrate preceding feature, in fact preceding feature can be applicable to the probe card of foregoing embodiments.
The tenth preferred embodiment of the present invention 1 as shown in figure 16, the probe card of the present invention can also include one and be fixedly arranged on electricity
The stiffening ring 80 of 30 top surface 32 of road plate, stiffening ring 80 have a protuberance 82 not contacted with circuit board 30, and Yong Yu Arrived are connected to one
Probe card fixed seat 90, no matter consequently, it is possible to lie circuit 60 is arranged at which position of probe card 30, all without with probe card
Fixed seat 90 is interfered, therefore is not required in order to avoid lie circuit 60 and probe card fixed seat 90 are interfered and in probe card
30 process groove.The present embodiment only by taking the structure of the probe card 21 being analogous to shown in Fig. 2 as an example, to illustrate preceding feature,
In fact preceding feature can be applicable to the probe card of foregoing embodiments.
Finally, it is necessary to illustrate again, present invention composed component disclosed in the aforementioned embodiment, by way of example only,
Not it is used for limiting the scope of patent protection of this case, the replacement of other equivalence elements or change, also should be by the patent protection of this case
Scope is covered.
Claims (18)
1. a kind of probe card with lie circuit, it is characterised in that include：
One circuit board, with a top surface, a bottom surface, and through a signal through hole of the top surface and the bottom surface, the news
One contact position of number through hole one test machine of correspondence；
One probe groups, include a signal probe and a grounded probe of the subjacent for being arranged at the circuit board；
One side road circuit, through bottom surface and the top surface of the circuit board, the lie circuit includes an electric-conductor and a transmission
Line, the electric-conductor include a connection pad, and the connection pad is arranged at the signal through hole with the signal through hole mutually insulated
Positioned at one end of the board top surface, for contacting for the test machine, the transmission line includes the one of mutually insulated and connects
Earthed conductor and a signal conductor, the earth conductor are electrically connected with the earthing potential and the grounded probe of the circuit board, institute
State signal conductor and be electrically connected with the signal probe and the electric-conductor.
2. there is the probe card of lie circuit as claimed in claim 1, it is characterised in that：The signal through hole is conductive with one
Inwall, and the connection conductive inner wall and the conductive junction point positioned at the board top surface, the connection pad and the conduction
An at least insulating part is provided between contact.
3. there is the probe card of lie circuit as claimed in claim 2, it is characterised in that：The conductive junction point is located at one
The annular portion of described conductive inner wall one end, and an extension being connected with the annular portion, the connection pad and the insulating part
Shape correspondence conductive junction point entirety outer contour shape or the correspondence extension shape, the connection pad correspondence extension
The part of portion's shape is used to contact for the test machine.
4. there is the probe card of lie circuit as claimed in claim 1, it is characterised in that：The transmission line includes one and is located at
The hypomere of a through hole of the circuit board is extended to below the circuit board bottom surface and from the probe groups, one through the through hole
Stage casing, an and epimere for being located above the board top surface and extending to from the through hole electric-conductor, the news
Number conductor is located at the hypomere, the stage casing and the epimere.
5. there is the probe card of lie circuit as claimed in claim 4, it is characterised in that：The through hole is conductive interior with one
Wall, the transmission line is with an insulating barrier for being located at signal conductor periphery, so that the signal conductor is conductive interior with described
Wall is electrically insulated.
6. there is the probe card of lie circuit as claimed in claim 5, it is characterised in that：The conductive inner wall of the through hole is electrical
Connect the earthing potential of the circuit board.
7. there is the probe card of lie circuit as claimed in claim 6, it is characterised in that：The earth conductor of the transmission line is complete
The hypomere is located at entirely, the board top surface is provided with a fixture being located on the through hole, for fixing the transmission line
Epimere.
8. there is the probe card of lie circuit as claimed in claim 6, it is characterised in that：The earth conductor of the transmission line is complete
The hypomere is located at entirely, the lie circuit is also included one located at the epimere periphery of the transmission line and led with the through hole
The conductive coating member that electric inwall is electrically connected with.
9. there is the probe card of lie circuit as claimed in claim 6, it is characterised in that：The earth conductor position of the transmission line
In the hypomere, the stage casing and the epimere and connect the conductive inner wall of the through hole.
10. there is the probe card of lie circuit as claimed in claim 4, it is characterised in that：The through hole is the correspondence survey
The signal through hole of the contact position of test-run a machine, the earth conductor of the transmission line pass through the signal through hole, the signal to lead to
An insulating part for making the earth conductor and the connection pad mutually insulated, the biography are provided between the connection pad of hole and the electric-conductor
The signal conductor of defeated line connects the connection pad through the insulating part.
11. probe cards with lie circuit as claimed in claim 10, it is characterised in that：The signal through hole is led with one
Electric inwall, and a connection conductive inner wall and the conductive junction point positioned at the board top surface, the insulating part with it is described
Another insulating part is provided between conductive junction point, the earth conductor and signal conductor of the transmission line pass through another insulating part.
12. probe cards with lie circuit as claimed in claim 1, it is characterised in that：The electric-conductor also includes one
Connect the connection pad and the latch through the signal through hole, the transmission line is fully located at below the circuit board bottom surface, institute
The signal conductor for stating transmission line is electrically connected with the latch.
13. probe cards with lie circuit as claimed in claim 12, it is characterised in that：The signal through hole is led with one
Electric inwall, and the connection conductive inner wall and the conductive junction point positioned at the board top surface, the connection pad are led with described
An outer insulator is provided between electric contact, an interior insulation part between the latch and the conductive inner wall, is provided with.
14. probe cards with lie circuit as claimed in claim 12, it is characterised in that：One is provided with the signal through hole
The conductive body of the latch is surrounded, one first insulating part, the contact tube between the conductive body and the connection pad, is provided with
One second insulating part is provided between body and the latch, the conductive body is electrically connected with the earthing potential of the circuit board.
15. probe cards with lie circuit as claimed in claim 14, it is characterised in that：The signal through hole is led with one
One the 3rd insulating part is provided between the conductive inner wall of electric inwall, the conductive body and the signal through hole.
16. probe cards with lie circuit as claimed in claim 14, it is characterised in that：The lie circuit also includes
The joint of one one end that the circuit board bottom surface is located at located at the signal through hole, the signal conductor of the transmission line and ground connection are led
Body is electrically connected with the latch and the conductive body respectively by the joint.
17. probe cards with lie circuit as claimed in claim 16, it is characterised in that：The lie circuit also includes
Located at another joint of the circuit board bottom surface, the signal conductor of the transmission line and earth conductor are by another joint point
It is not electrically connected with the signal probe and the grounded probe.
18. probe cards with lie circuit as claimed in claim 1, it is characterised in that：Also include one be fixedly arranged on it is described
The stiffening ring of board top surface, the stiffening ring have a protuberance not with the circuit board contacts, and Yong Yu Arrived are connected to a spy
Pin fixes reservation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562219143P | 2015-09-16 | 2015-09-16 | |
| US62/219143 | 2015-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106546781A true CN106546781A (en) | 2017-03-29 |
| CN106546781B CN106546781B (en) | 2019-07-02 |
Family
ID=58367867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610823200.6A Active CN106546781B (en) | 2015-09-16 | 2016-09-14 | Probe card with bypass road route |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106546781B (en) |
| TW (1) | TWI606241B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115453438A (en) * | 2021-06-09 | 2022-12-09 | 欣兴电子股份有限公司 | Probe card testing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI642941B (en) * | 2017-05-08 | 2018-12-01 | 旺矽科技股份有限公司 | Probe card |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096587A (en) * | 1993-06-07 | 1994-12-21 | 先得利科技发展有限公司 | Proving installation |
| US20120149218A1 (en) * | 2010-12-14 | 2012-06-14 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus and method for manufacturing the same |
| CN103000546A (en) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | Test probe card |
| US20150015291A1 (en) * | 2013-07-15 | 2015-01-15 | Mpi Corporation | Cantilever probe card for high-frequency signal transmission |
| CN104345186A (en) * | 2013-07-23 | 2015-02-11 | 旺矽科技股份有限公司 | High-frequency probe card for detecting photoelectric element |
-
2016
- 2016-09-08 TW TW105129167A patent/TWI606241B/en not_active IP Right Cessation
- 2016-09-14 CN CN201610823200.6A patent/CN106546781B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096587A (en) * | 1993-06-07 | 1994-12-21 | 先得利科技发展有限公司 | Proving installation |
| US20120149218A1 (en) * | 2010-12-14 | 2012-06-14 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus and method for manufacturing the same |
| CN103000546A (en) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | Test probe card |
| US20150015291A1 (en) * | 2013-07-15 | 2015-01-15 | Mpi Corporation | Cantilever probe card for high-frequency signal transmission |
| CN104345186A (en) * | 2013-07-23 | 2015-02-11 | 旺矽科技股份有限公司 | High-frequency probe card for detecting photoelectric element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115453438A (en) * | 2021-06-09 | 2022-12-09 | 欣兴电子股份有限公司 | Probe card testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106546781B (en) | 2019-07-02 |
| TWI606241B (en) | 2017-11-21 |
| TW201712347A (en) | 2017-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104345186B (en) | High-frequency probe card for detecting photoelectric element | |
| CN106199090B (en) | Probe card using coaxial needle | |
| US7252555B2 (en) | Pin connector | |
| CN1159757C (en) | Device for connection of test head and probe board in substrate-testing system | |
| US7683645B2 (en) | High-frequency probe card and transmission line for high-frequency probe card | |
| CN201522509U (en) | High-frequency short arm probe card | |
| KR950006472A (en) | Probe card, coaxial probe beam for probe card and manufacturing method thereof | |
| CN107796966A (en) | Vertical probe and method for fabricating the same, and probe head and probe card using the same | |
| JP2007527600A5 (en) | ||
| TWI564568B (en) | Use a coaxial pin with a cantilever probe card | |
| CN101221194B (en) | High-frequency probe | |
| JP5572066B2 (en) | Test board | |
| CN106546781B (en) | Probe card with bypass road route | |
| TWI700500B (en) | Test device | |
| CN106802391A (en) | Arrangement for testing integrated circuit and its electric conductor component | |
| CN104714065B (en) | Probe module | |
| JP4709707B2 (en) | High frequency probe card | |
| CN104714055B (en) | Detection jig | |
| CN101236215A (en) | High-frequency cantilevered detecting probe | |
| CN112261773A (en) | Printed circuit board and test fixture | |
| CN103592499B (en) | A kind of High-reliability multi-channel nA-level micro-current transmission design method | |
| US10320131B2 (en) | Recessed switched test connector | |
| CN110312367A (en) | Welding pad structure for radio frequency testing | |
| TWI481877B (en) | Probe card structure | |
| CN116564938A (en) | Electrical property detection carrier plate device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |