CN106540762A - 一种常温下聚苯乙烯微流控芯片的制备方法 - Google Patents
一种常温下聚苯乙烯微流控芯片的制备方法 Download PDFInfo
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Abstract
本发明涉及微流控芯片的制备方法,具体是一种常温下聚苯乙烯微流控芯片的制备方法。本发明解决了现有微流控芯片的制备方法不适于批量化制备、制备时间长、应用受限、容易变形的问题。一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:步骤S1:将第一聚苯乙烯片放入丙酮中浸泡;步骤S2:在高硬度模具的上表面滴加丙酮;步骤S3:将第一聚苯乙烯片放在高硬度模具的上表面;步骤S4:将聚二甲基硅氧烷片放在第一聚苯乙烯片的上表面;步骤S5:将重物放在聚二甲基硅氧烷片的上表面;步骤S6:依次将重物、聚二甲基硅氧烷片、第一聚苯乙烯片剥离;步骤S7:将第二聚苯乙烯片放入丙酮中浸泡,再将其键合。本发明适用于微流控芯片的制备。
Description
技术领域
本发明涉及微流控芯片的制备方法,具体是一种常温下聚苯乙烯微流控芯片的制备方法。
背景技术
微流控芯片是把生物和化学等领域中涉及到的样品制备、分离、混合、反应及检测等基本操作单元集成或基本集成到一块几平方厘米(甚至更小)的芯片上,依靠芯片上微管道、微阀、储液器、微电极、微检测元件和连接器等功能器件控制流体贯穿整个系统,用以取代常规生物或化学实验室各种功能的一种技术平台,因此又被称为片上实验室(lab-on-a-chip)。微流控芯片能够把常规实验的采样、稀释、浓缩、混合、分离、反应和检测等进行功能一体化、微型化、快速化和便携化等。
在微流控芯片的设计、制备和应用中,首先要考虑的是芯片材料的选取。其选取原则通常有以下几点:(1)芯片材料要有良好的光学性能,便于后续芯片的检测;(2)芯片材料要有稳定的化学性质,不易与样品和试剂发生化学反应,在生物领域的应用中还要考虑生物相容性;(3)材料成本低廉,且芯片的制备工艺简单。随着微流控芯片和微加工技术的发展,制备微流控芯片的材料也日趋成熟和多样化,常用的制备材料有硅、玻璃和聚合物材料等,而聚苯乙烯(Polystyrene,PS)是制备微流控芯片常用的聚合物材料之一。
通过对现有技术的检索发现,Li Huawei等在Microsystem technologies 2012,18 (3), 373-379中利用CO2激光器制备了聚苯乙烯微流控芯片,但利用激光器制备微流控芯片不太适合于批量化制备。Wang Yuli等在Lab on a Chip 2011, 11 (18), 3089-3097中利用gamma-butyrolactone和delta-valerolactone溶解聚二甲基硅氧烷(Polydimethylsiloxane, PDMS),但其聚苯乙烯溶液的形成需要将聚苯乙烯固体放入装有有机溶剂中的离心管中,并在离心机上离心处理7天。Nargang, T. M.等在Lab on a chip2014, 14 (15), 2698-2708中将聚苯乙烯溶解到甲苯等有机溶剂中形成聚苯乙烯溶液,缩短了聚苯乙烯溶液的制备时间,但甲苯可以迅速膨胀PDMS并导致其扭曲变形,从而限制了其应用。Vasdekis, A. E.等在Lab on a Chip 2014, 14 (12), 2072-2080中利用溶剂浸压印光刻技术成功制备了聚苯乙烯微流控芯片,其基本方法是将在丙酮浸泡软化后的聚苯乙烯片放在具有微结构上的聚二甲基硅氧烷模具上进行压印,最后键合形成聚苯乙烯微流控芯片,但是聚二甲基硅氧烷较软,微结构在压印过程中很容易变形,从而导致图形转移的失真。
基于此,有必要发明一种全新的微流控芯片的制备方法,以解决现有微流控芯片的制备方法不适于批量化制备、制备时间长、应用受限、容易变形的问题。
发明内容
本发明为了解决现有微流控芯片的制备方法不适于批量化制备、制备时间长、应用受限、容易变形的问题,提供了一种常温下聚苯乙烯微流控芯片的制备方法。
本发明是采用如下技术方案实现的:
一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片和第二聚苯乙烯片,然后将第一聚苯乙烯片放入丙酮中浸泡,丙酮进入第一聚苯乙烯片的表面形成聚苯乙烯片软化层(如图1所示);
步骤S2:选取上表面制备有微结构的高硬度模具,然后在高硬度模具的上表面滴加丙酮,直至丙酮在高硬度模具的上表面铺展形成将其全面覆盖的丙酮层(如图2所示);
步骤S3:将第一聚苯乙烯片放在高硬度模具的上表面(如图3所示);
步骤S4:选取聚二甲基硅氧烷片,然后将聚二甲基硅氧烷片放在第一聚苯乙烯片的上表面(如图4所示);
步骤S5:选取重物,然后将重物放在聚二甲基硅氧烷片的上表面(如图5所示);
步骤S6:依次将重物、聚二甲基硅氧烷片、第一聚苯乙烯片从高硬度模具上剥离,由此得到下表面具有微结构的第一聚苯乙烯片(如图6所示);
步骤S7:在第二聚苯乙烯片的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片放入丙酮中浸泡,再将第二聚苯乙烯片键合在第一聚苯乙烯片的下表面,由此得到聚苯乙烯微流控芯片(如图7a所示);
或者在第一聚苯乙烯片的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片放入丙酮中浸泡,再将第二聚苯乙烯片键合在第一聚苯乙烯片的下表面,由此得到聚苯乙烯微流控芯片(如图7b所示)。
与现有微流控芯片的制备方法相比,本发明所述的一种常温下聚苯乙烯微流控芯片的制备方法基于全新的原理,实现了制备具有高深宽比微结构的微流控芯片,因此其具备了如下优点:一、与Li Huawei等的方法相比,本发明无需利用激光器即可制备出微流控芯片,因此其更适合于批量化制备。二、与Wang Yuli等的方法相比,本发明无需形成聚苯乙烯溶液即可制备出微流控芯片,因此其制备时间更短。三、与Nargang, T. M.等的方法相比,本发明无需采用甲苯即可制备出微流控芯片,因此其有效避免了甲苯导致PDMS扭曲变形的问题,从而使其应用不再受限。四、与Vasdekis, A. E.等的方法相比,本发明采用高硬度模具替代了聚二甲基硅氧烷模具,因此其有效避免了微结构在压印过程中容易变形的问题。
本发明有效解决了现有微流控芯片的制备方法不适于批量化制备、制备时间长、应用受限、容易变形的问题,适用于微流控芯片的制备。
附图说明
图1是本发明中步骤S1的原理示意图。
图2是本发明中步骤S2的原理示意图。
图3是本发明中步骤S3的原理示意图。
图4是本发明中步骤S4的原理示意图。
图5是本发明中步骤S5的原理示意图。
图6是本发明中步骤S6的原理示意图。
图7a是本发明中步骤S7的第一种原理示意图。
图7b是本发明中步骤S7的第二种原理示意图。
图中:1-第一聚苯乙烯片,2-聚苯乙烯片软化层,3-高硬度模具,4-丙酮层,5-聚二甲基硅氧烷片,6-重物,7-第二聚苯乙烯片。
具体实施方式
实施例一
一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片1和第二聚苯乙烯片7,然后将第一聚苯乙烯片1放入丙酮中浸泡,丙酮进入第一聚苯乙烯片1的表面形成聚苯乙烯片软化层2;
步骤S2:选取上表面制备有微结构的高硬度模具3,然后在高硬度模具3的上表面滴加丙酮,直至丙酮在高硬度模具3的上表面铺展形成将其全面覆盖的丙酮层4;
步骤S3:将第一聚苯乙烯片1放在高硬度模具3的上表面;
步骤S4:选取聚二甲基硅氧烷片5,然后将聚二甲基硅氧烷片5放在第一聚苯乙烯片1的上表面;
步骤S5:选取重物6,然后将重物6放在聚二甲基硅氧烷片5的上表面;
步骤S6:依次将重物6、聚二甲基硅氧烷片5、第一聚苯乙烯片1从高硬度模具3上剥离,由此得到下表面具有微结构的第一聚苯乙烯片1;
步骤S7:在第二聚苯乙烯片7的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片7放入丙酮中浸泡,再将第二聚苯乙烯片7键合在第一聚苯乙烯片1的下表面,由此得到聚苯乙烯微流控芯片。
所述第一聚苯乙烯片1放入丙酮中浸泡5s。
所述高硬度模具3的材料为硅。
所述重物6放在聚二甲基硅氧烷片5的上表面保持10min。
所述第二聚苯乙烯片7放入丙酮中浸泡2s。
所述第一聚苯乙烯片1的尺寸为26mm×16mm×1.5mm;所述第二聚苯乙烯片2的尺寸为26mm×16mm×1.5mm;所述高硬度模具3的尺寸为30mm×20mm×0.5mm;所述聚二甲基硅氧烷片5的尺寸为30mm×20mm×2 mm;所述重物6的质量为0.5kg;所述微结构的高度为10μm;所述通孔的直径为2mm。
实施例二
一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片1和第二聚苯乙烯片7,然后将第一聚苯乙烯片1放入丙酮中浸泡,丙酮进入第一聚苯乙烯片1的表面形成聚苯乙烯片软化层2;
步骤S2:选取上表面制备有微结构的高硬度模具3,然后在高硬度模具3的上表面滴加丙酮,直至丙酮在高硬度模具3的上表面铺展形成将其全面覆盖的丙酮层4;
步骤S3:将第一聚苯乙烯片1放在高硬度模具3的上表面;
步骤S4:选取聚二甲基硅氧烷片5,然后将聚二甲基硅氧烷片5放在第一聚苯乙烯片1的上表面;
步骤S5:选取重物6,然后将重物6放在聚二甲基硅氧烷片5的上表面;
步骤S6:依次将重物6、聚二甲基硅氧烷片5、第一聚苯乙烯片1从高硬度模具3上剥离,由此得到下表面具有微结构的第一聚苯乙烯片1;
步骤S7:在第二聚苯乙烯片7的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片7放入丙酮中浸泡,再将第二聚苯乙烯片7键合在第一聚苯乙烯片1的下表面,由此得到聚苯乙烯微流控芯片。
所述第一聚苯乙烯片1放入丙酮中浸泡120s。
所述高硬度模具3的材料为玻璃。
所述重物6放在聚二甲基硅氧烷片5的上表面保持60min。
所述第二聚苯乙烯片7放入丙酮中浸泡5s。
所述第一聚苯乙烯片1的尺寸为36mm×26mm×1.5mm;所述第二聚苯乙烯片2的尺寸为36mm×26mm×1.5mm;所述高硬度模具3的尺寸为40mm×30mm×0.5mm;所述聚二甲基硅氧烷片5的尺寸为40mm×30mm×2 mm;所述重物6的质量为1kg;所述微结构的高度为200μm;所述通孔的直径为2mm。
实施例三
一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片1和第二聚苯乙烯片7,然后将第一聚苯乙烯片1放入丙酮中浸泡,丙酮进入第一聚苯乙烯片1的表面形成聚苯乙烯片软化层2;
步骤S2:选取上表面制备有微结构的高硬度模具3,然后在高硬度模具3的上表面滴加丙酮,直至丙酮在高硬度模具3的上表面铺展形成将其全面覆盖的丙酮层4;
步骤S3:将第一聚苯乙烯片1放在高硬度模具3的上表面;
步骤S4:选取聚二甲基硅氧烷片5,然后将聚二甲基硅氧烷片5放在第一聚苯乙烯片1的上表面;
步骤S5:选取重物6,然后将重物6放在聚二甲基硅氧烷片5的上表面;
步骤S6:依次将重物6、聚二甲基硅氧烷片5、第一聚苯乙烯片1从高硬度模具3上剥离,由此得到下表面具有微结构的第一聚苯乙烯片1;
步骤S7:在第一聚苯乙烯片1的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片7放入丙酮中浸泡,再将第二聚苯乙烯片7键合在第一聚苯乙烯片1的下表面,由此得到聚苯乙烯微流控芯片。
所述第一聚苯乙烯片1放入丙酮中浸泡5s。
所述高硬度模具3的材料为金属。
所述重物6放在聚二甲基硅氧烷片5的上表面保持10min。
所述第二聚苯乙烯片7放入丙酮中浸泡2s。
所述第一聚苯乙烯片1的尺寸为26mm×16mm×1.5mm;所述第二聚苯乙烯片2的尺寸为26mm×16mm×1.5mm;所述高硬度模具3的尺寸为30mm×20mm×0.5mm;所述聚二甲基硅氧烷片5的尺寸为30mm×20mm×2 mm;所述重物6的质量为0.5kg;所述微结构的高度为10μm;所述通孔的直径为2mm。
实施例四
一种常温下聚苯乙烯微流控芯片的制备方法,该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片1和第二聚苯乙烯片7,然后将第一聚苯乙烯片1放入丙酮中浸泡,丙酮进入第一聚苯乙烯片1的表面形成聚苯乙烯片软化层2;
步骤S2:选取上表面制备有微结构的高硬度模具3,然后在高硬度模具3的上表面滴加丙酮,直至丙酮在高硬度模具3的上表面铺展形成将其全面覆盖的丙酮层4;
步骤S3:将第一聚苯乙烯片1放在高硬度模具3的上表面;
步骤S4:选取聚二甲基硅氧烷片5,然后将聚二甲基硅氧烷片5放在第一聚苯乙烯片1的上表面;
步骤S5:选取重物6,然后将重物6放在聚二甲基硅氧烷片5的上表面;
步骤S6:依次将重物6、聚二甲基硅氧烷片5、第一聚苯乙烯片1从高硬度模具3上剥离,由此得到下表面具有微结构的第一聚苯乙烯片1;
步骤S7:在第一聚苯乙烯片1的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片7放入丙酮中浸泡,再将第二聚苯乙烯片7键合在第一聚苯乙烯片1的下表面,由此得到聚苯乙烯微流控芯片。
所述第一聚苯乙烯片1放入丙酮中浸泡120s。
所述高硬度模具3的材料为硅。
所述重物6放在聚二甲基硅氧烷片5的上表面保持60min。
所述第二聚苯乙烯片7放入丙酮中浸泡5s。
所述第一聚苯乙烯片1的尺寸为36mm×26mm×1.5mm;所述第二聚苯乙烯片2的尺寸为36mm×26mm×1.5mm;所述高硬度模具3的尺寸为40mm×30mm×0.5mm;所述聚二甲基硅氧烷片5的尺寸为40mm×30mm×2 mm;所述重物6的质量为1kg;所述微结构的高度为200μm;所述通孔的直径为2mm。
以上公开仅为本发明的具体实施例,并不构成对本发明保护范围的限制,对于本发明所属技术领域的普通技术人员来说,在不脱离本发明的整体构思前提下,依据本发明技术方案所作的无需经过创造性劳动的变化和替换,都应落在本发明的保护范围之内。
Claims (7)
1.一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:该方法包括如下步骤:
步骤S1:分别选取第一聚苯乙烯片(1)和第二聚苯乙烯片(7),然后将第一聚苯乙烯片(1)放入丙酮中浸泡,丙酮进入第一聚苯乙烯片(1)的表面形成聚苯乙烯片软化层(2);
步骤S2:选取上表面制备有微结构的高硬度模具(3),然后在高硬度模具(3)的上表面滴加丙酮,直至丙酮在高硬度模具(3)的上表面铺展形成将其全面覆盖的丙酮层(4);
步骤S3:将第一聚苯乙烯片(1)放在高硬度模具(3)的上表面;
步骤S4:选取聚二甲基硅氧烷片(5),然后将聚二甲基硅氧烷片(5)放在第一聚苯乙烯片(1)的上表面;
步骤S5:选取重物(6),然后将重物(6)放在聚二甲基硅氧烷片(5)的上表面;
步骤S6:依次将重物(6)、聚二甲基硅氧烷片(5)、第一聚苯乙烯片(1)从高硬度模具(3)上剥离,由此得到下表面具有微结构的第一聚苯乙烯片(1);
步骤S7:在第二聚苯乙烯片(7)的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片(7)放入丙酮中浸泡,再将第二聚苯乙烯片(7)键合在第一聚苯乙烯片(1)的下表面,由此得到聚苯乙烯微流控芯片;
或者在第一聚苯乙烯片(1)的表面打一对通孔分别作为进口和出口,然后将第二聚苯乙烯片(7)放入丙酮中浸泡,再将第二聚苯乙烯片(7)键合在第一聚苯乙烯片(1)的下表面,由此得到聚苯乙烯微流控芯片。
2.根据权利要求1所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述第一聚苯乙烯片(1)放入丙酮中浸泡5~120s。
3.根据权利要求1所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述高硬度模具(3)的材料为硅或者玻璃或者金属。
4.根据权利要求1所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述重物(6)放在聚二甲基硅氧烷片(5)的上表面保持10~60min。
5.根据权利要求1所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述第二聚苯乙烯片(7)放入丙酮中浸泡2~5s。
6.根据权利要求1或2或3或4或5所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述第一聚苯乙烯片(1)的尺寸为26mm×16mm×1.5mm;所述第二聚苯乙烯片(2)的尺寸为26mm×16mm×1.5mm;所述高硬度模具(3)的尺寸为30mm×20mm×0.5mm;所述聚二甲基硅氧烷片(5)的尺寸为30mm×20mm×2 mm;所述重物(6)的质量为0.5kg;所述微结构的高度为10μm;所述通孔的直径为2mm。
7.根据权利要求1或2或3或4或5所述的一种常温下聚苯乙烯微流控芯片的制备方法,其特征在于:所述第一聚苯乙烯片(1)的尺寸为36mm×26mm×1.5mm;所述第二聚苯乙烯片(2)的尺寸为36mm×26mm×1.5mm;所述高硬度模具(3)的尺寸为40mm×30mm×0.5mm;所述聚二甲基硅氧烷片(5)的尺寸为40mm×30mm×2 mm;所述重物(6)的质量为1kg;所述微结构的高度为200μm;所述通孔的直径为2mm。
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