CN106531905B - A kind of the laser package device and method of organic electroluminescence device - Google Patents
A kind of the laser package device and method of organic electroluminescence device Download PDFInfo
- Publication number
- CN106531905B CN106531905B CN201610999749.0A CN201610999749A CN106531905B CN 106531905 B CN106531905 B CN 106531905B CN 201610999749 A CN201610999749 A CN 201610999749A CN 106531905 B CN106531905 B CN 106531905B
- Authority
- CN
- China
- Prior art keywords
- indium
- sealing
- optical fiber
- layer
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses the laser package devices and method of a kind of organic electroluminescence device, belong to organic electroluminescence device technical field, when solving indium sealing-in OLED device in the prior art, heating temperature at sealing-in frame reaches when pluging with molten metal alloy melting point temperature or more, heat is transmitted to the luminous organic material of OLED device central region, the problem of so that it is born higher temperature and be damaged or destroy.The present invention includes vacuum chamber, it is arranged in the indoor three-dimension numerical controlled mobile platform pedestal of vacuum chamber and three-dimension numerical controlled mobile platform, the pedestal for placing OLED device being arranged on three-dimension numerical controlled mobile platform pedestal, the optical fiber output end cap being arranged on three-dimension numerical controlled mobile platform, the laser and computer being arranged outside vacuum chamber, the optical fiber being arranged on laser, optical fiber is connected across vacuum chamber wall with optical fiber output end cap, computer controls three-dimension numerical controlled mobile platform and optical fiber output end cap is driven to make the movement on XY two-dimensional directionals, control pedestal makees the movement in Z one-dimensional squares, and control laser operation.The present invention is used for the encapsulation of organic electroluminescence device.
Description
Technical field
A kind of the laser package device and method of organic electroluminescence device are used for the envelope of organic electroluminescence device
Dress, belongs to organic electroluminescence device technical field.
Background technology
Organic electroluminescence device (OLED) have actively shine, brightness height, full-color EL display, driving voltage are low, device
Thickness is thin, Flexible Displays and preparation process can be achieved relative to liquid crystal display device (LCD) and plasma display device
(PDP) the features such as simple, has a good application prospect in terms of large screen flat plate display and flexible display.
Luminous organic material in OLED is very sensitive to vapor and oxygen, and minimal amount of vapor and oxygen are with regard to energy loss
Evil luminous organic material, makes the luminescent properties of device deteriorate.Therefore, vapor and oxygen how to be reduced to device encapsulating material
It permeates, vapor and oxygen inside abatement device, are the organic electroluminescence device encapsulation technology major issues to be solved.It wants
Ensure that device has the service life that disclosure satisfy that business application, the infiltration of vapor and oxygen to device encapsulation structure and material
Rate should be less than 10-6g/m2The level of/day.
Traditional rigid OLED device packaging method, be with ultraviolet cured epoxy (also referred to as UV glue) do glass substrate and
Seal, sealing materials between cover board, the disadvantage is that：Epoxy resin is poor to the barrier property of water and oxygen, such as water is to thickness
The permeability of 1 millimeter of ultraviolet cured epoxy is 10 ° -10-1g/m2/ day magnitudes, far above OLED device encapsulating material
Water penetration rate should be less than 10-6g/m2The requirement of/day magnitudes.Secondly, epoxy resin contains a large amount of water, these water can be in device
The course of work in released due to device heating and enter device inside.
In addition, the protective gas of device inside contains a certain amount of vapor and oxygen, epoxy resin encapsulating material in addition
The water constantly discharged, device inside material constantly be desorbed and release water and oxygen so that the content of device inside water and oxygen with
It device storage and the extension of working time and is continuously increased.These vapor and oxygen will be organic in constantly attack device
Luminescent material makes its luminescent properties constantly deteriorate, and the service life of device greatly shortens.
Have patent (Patent No. 200910167662.7,201210435587.X) to propose, with indium method for sealing pair
The method that the substrate and cover board of OLED carries out sealing-in.Vapor and oxygen are less than 10 to the permeability of indium and indium alloy-6g/m2/
Day magnitudes；The melting temperature of indium and indium alloy is less than the glass transition temperature of electroluminescent organic material, the temperature of indium process for sealing
Damage will not be generated to luminous organic material.These features of indium sealing-in become more satisfactory organic electroluminescence device
Method for sealing.
In these patents, indium envelope process is to use integrally to heat device, or in the film layer of sealing-in frame be arranged
Electrical heating resistive layer makes the film layer impressed current method of its fever, realizes the heating to indium sealing layer, makes substrate and lid
It is sealed after the indium sealing layer fusing of plate.Whole heating sealing-in method can make OLED in device organic during sealing-in
Luminescent material is also heated to indium alloy melting temperature or more, make heat labile OLED luminous organic materials bear higher temperature and
It is damaged or destroys, cause device luminescent properties to decline and even fail.Electric heating heats sealing-in method only to the sealing-in side of OLED device
Frame region heats, and the organic luminous layer Wen Sheng in the middle part of device is not high, effectively avoids organic luminous layer and is damaged by heating, but seals
Sealing-in film structure complexity at edge fit frame, manufacturing cost is high, and is difficult to multiple OLED device lists on a substrate
Member carries out heating sealing-in, is unfavorable for the industrialization of OLED.
Invention content
Place provides laser package device and the side of a kind of organic electroluminescence device to the present invention against the above deficiency
Method, when solving indium sealing-in OLED device in the prior art, the heating temperature at (1) frame, which reaches, plugs with molten metal alloy melting point temperature or more,
OLED luminous organic materials bear higher temperature and are damaged or destroy；(2) sealing-in frame film structure complexity, manufacturing cost
It is high；(3) sealing-in speed is slow, sealing-in is unreliable；(4) asking for sealing-in cannot be carried out to multiple OLED device units on a substrate
Topic.
To achieve the goals above, the technical solution adopted by the present invention is：
A kind of laser package device of organic electroluminescence device, it is characterised in that：Including vacuum chamber, it is arranged in vacuum
The indoor three-dimension numerical controlled mobile platform pedestal of chamber and three-dimension numerical controlled mobile platform are arranged on three-dimension numerical controlled mobile platform pedestal
Optical fiber output end cap, setting for placing the pedestal of OLED device, being arranged on three-dimension numerical controlled mobile platform is in vacuum chamber
Outer laser and computer, the optical fiber being arranged on laser, optical fiber are connected across vacuum chamber wall with optical fiber output end cap
It connects, computer controls three-dimension numerical controlled mobile platform and drives that optical fiber output end cap makees the movement on XY two-dimensional directionals, control pedestal makees Z
Movement in one-dimensional square.
Further, end caps pedestal is provided on the three-dimension numerical controlled mobile platform, optical fiber output end cap is arranged in light
On fine end cap pedestal, optical fiber air-tight interfaces are provided in the vacuum chamber wall, optical fiber passes through optical fiber air-tight interfaces and optical fiber defeated
Go out end cap to be connected.
Further, the laser is semiconductor diode continuous-wave laser, wavelength 790-1064nm, maximum output
Laser power is 10-20W, power adjustable.
Further, the OLED device includes glass substrate and glass cover-plate, the ITO electrode of setting on the glass substrate
Layer, the insulating layer being arranged in ITO electrode layer and light emitting functional layer, are arranged on insulating layer, glass substrate and glass cover-plate
Sealing-in frame, light emitting functional layer are arranged in sealing-in frame, and sealing-in frame includes being successively set on insulating layer and glass from top to bottom
Substrate adhesive layer, substrate transition zone, substrate indium alloy sealing layer on glass substrate, are successively set on glass cover-plate from top to bottom
Cover board adhesive layer, cover board transition zone and cover board indium alloy sealing layer, cover board indium alloy sealing layer setting substrate indium alloy seal
It connects on layer, and the sealing-in that is fused constitutes indium alloy sealing layer.
Further, the material of the insulating layer is SiO2Or Al2O3, thickness 300nm-500nm, width 2nm-
3mm；The material of the substrate adhesive layer and cover board adhesive layer is Cr, width 1mm-2mm, thickness 200nm-500nm；It is described
The material of substrate transition zone and cover board transition zone is Cu-Ag alloys, and the weight ratio of Cu is 95%-97%, the weight ratio of Ag
For 5%-3%.Thickness is 200nm-500nm, and width is 1mm -2mm；
The thickness of the indium alloy sealing layer is 50 μm -200 μm, and width is 1mm -2mm；Indium alloy sealing layer closes for indium tin
Gold, indium alloy or indium bismuth alloy, wherein indium, tin weight ratio be indium be 50.9%, tin 49.1%, fusing point is 116 DEG C；Indium
The weight ratio of bismuth alloy is indium 66%, and bismuth 34%, fusing point is 72 DEG C.
A kind of laser package method of organic electroluminescence device, which is characterized in that following steps：
(1) OLED device is placed on the indoor pedestal of vacuum chamber of laser package device；
(2) it controls three-dimension numerical controlled mobile platform band optical fiber output end cap by computer to move, adjusts optical fiber output end cap
Spacing between the glass cover-plate of OLED device makes the laser beam that optical fiber output end cap (7) exports on glass cover-plate (14)
The spot diameter of formation is equal or slightly larger than the width of sealing-in frame；
(3) along sealing-in frame path direction, three-dimension numerical controlled mobile platform is controlled by computer and drives optical fiber output end cap
It is mobile, optical fiber output end cap is adjusted, the laser beam that optical fiber output end cap exports is made to be directed at the center line of the sealing-in frame of OLED device
Position；
(4) driving power for opening laser controls three-dimension numerical controlled mobile platform by computer and drives fiber-optic output
Cap and pedestal make the laser beam that optical fiber output end cap exports be moved one week along the sealing-in frame closed loop of OLED device, and sealing-in indium closes
Golden sealing layer；
(5) it is taken out out of vacuum chamber after cooling down the OLED device of encapsulation, that is, completes sealing-in process.
Further, in the step (1) and step (5), OLED device is transmitted in vacuum chamber by manipulator and
Take out vacuum chamber.
Further, in the step (1), the gas pressure intensity in vacuum chamber is less than 2 × 10-4Pa, or it is filled with an air
The high-purity Ar protective gas of pressure.
Further, the OLED device includes glass substrate and glass cover-plate, the ITO electrode of setting on the glass substrate
Layer, the insulating layer being arranged in ITO electrode layer and light emitting functional layer, are arranged on insulating layer, glass substrate and glass cover-plate
Sealing-in frame, light emitting functional layer are arranged in sealing-in frame, and sealing-in frame includes being successively set on insulating layer and glass from top to bottom
Substrate adhesive layer, substrate transition zone, substrate indium alloy sealing layer on glass substrate, are successively set on glass cover-plate from top to bottom
Cover board adhesive layer, cover board transition zone and cover board indium alloy sealing layer, cover board indium alloy sealing layer setting substrate indium alloy seal
It connects on layer, and the sealing-in that is fused constitutes indium alloy sealing layer.
Further, the material of the insulating layer is SiO2Or Al2O3, thickness 300nm-500nm, width 2nm-
3mm；The material of the substrate adhesive layer and cover board adhesive layer is Cr, width 1mm-2mm, thickness 200nm-500nm；It is described
The material of substrate transition zone and cover board transition zone is Cu-Ag alloys, and the weight ratio of Cu is 95%-97%, the weight ratio of Ag
For 5%-3%.Thickness is 200nm-500nm, and width is 1mm -2mm；
The thickness of the indium alloy sealing layer is 50 μm -200 μm, and width is 1mm -2mm；Indium alloy sealing layer closes for indium tin
Gold, indium alloy or indium bismuth alloy, wherein indium, tin weight ratio be indium be 50.9%, tin 49.1%, fusing point is 116 DEG C；Indium
The weight ratio of bismuth alloy is indium 66%, and bismuth 34%, fusing point is 72 DEG C.
Compared with the prior art, the advantages of the present invention are as follows:
One, indium alloy sealing layer is heated using laser beam, sealing-in OLED device, the sealing-in at heater element edge
Frame region, the OLED luminescent material temperature for avoiding device central region rises excessively high and performance deteriorates and damage, ensure that sealing-in
The safety of process；
Two, there is laser beam heats sealing region non-contact heating, heating power can accelerate to heat sealing-in process, heating greatly
The advantages of region very little, homogeneous heating, is conducive to the speed and sealing-in quality that improve sealing-in；
Three, three-dimension numerical controlled mobile platform is controlled by computer and pedestal moves, the efficiency and reliability of sealing-in can be improved,
And sealing-in can be carried out to the indium sealing-in frame of arbitrary graphic；
Four, the present invention can carry out sealing-in to multiple OLED device units to be cut on a Large substrates, be suitble to
In industrialization production；
Five, sealing-in process of the invention can be 10 in pressure-4-10-6It is completed in the high vacuum environment of Pa, sealing-in is complete
The partial pressure of Cheng Hou, vapor and oxygen inside OLED device are less than 10-4-10-6Pa is sealed under high pure protective gas environment
The one thousandth of vapor and oxygen content is connect in OLED device to ten a ten thousandths, be conducive to the performance for improving OLED device and
Service life.
Description of the drawings
Fig. 1 is the schematic diagram of laser sealing-in device encapsulation OLED device in the present invention；
Fig. 2 is the structural schematic diagram of OLED device in the present invention；
Fig. 3 is the vertical view of sealing-in OLED device in the present invention.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and examples.
A kind of laser package device of organic electroluminescence device, including vacuum chamber 3, be arranged in vacuum chamber 3
Three-dimension numerical controlled mobile platform pedestal 8 and three-dimension numerical controlled mobile platform 5 are arranged and are used on three-dimension numerical controlled mobile platform pedestal 8
The pedestal 9 for placing OLED device 10, is arranged in vacuum chamber the optical fiber output end cap 7 being arranged on three-dimension numerical controlled mobile platform 5
Laser 1 and computer outside 3, the optical fiber 2 being arranged on laser 1, optical fiber 2 pass through 3 wall of vacuum chamber and fiber-optic output
Cap 7 is connected, and computer controls three-dimension numerical controlled mobile platform 5 and optical fiber output end cap 7 is driven to make the movement on XY two-dimensional directionals, control
Pedestal 9 processed makees the movement in Z one-dimensional squares and controls the operation of laser 1.It is provided with light on the three-dimension numerical controlled mobile platform 5
Fine end cap pedestal 6, optical fiber output end cap 7 are arranged on end caps pedestal 6, and optical fiber gas is provided on 3 wall of the vacuum chamber
Touch mouth 4, optical fiber is connected across optical fiber air-tight interfaces 4 with optical fiber output end cap 7.The laser 1 is semiconductor diode
Continuous-wave laser, wavelength 790-1064nm, maximum output laser power are 10-20W, power adjustable.The OLED device
10 include glass substrate 13 and glass cover-plate 14, the ITO electrode layer 15 being arranged on glass substrate 13, be arranged in ITO electrode layer
The sealing-in side on insulating layer 16, glass substrate 13 and glass cover-plate 14 is arranged in insulating layer 16 on 15 and light emitting functional layer 22
Frame 23, light emitting functional layer 22 are arranged in sealing-in frame 23, and sealing-in frame 23 includes being successively set on insulating layer 16 from top to bottom
Substrate adhesive layer 17, substrate transition zone 18, substrate indium alloy sealing layer on glass substrate 13, are successively set on from top to bottom
Cover board adhesive layer 21, cover board transition zone 20 on glass cover-plate 14 and cover board indium alloy sealing layer, cover board indium alloy sealing layer are set
It sets on substrate indium alloy sealing layer, when sealing-in, cover board indium alloy sealing layer and the fusing of substrate indium alloy sealing layer are simultaneously mutually melted
It closes, the indium alloy sealing layer 19 of OLED device is constituted after cooling.The material of the insulating layer 16 is SiO2Or Al2O3, thickness is
300nm-500nm, width 2nm-3mm；The material of the substrate adhesive layer 17 and cover board adhesive layer 21 is Cr, width 1mm-
2mm, thickness 200nm-500nm；The material of the substrate transition zone 18 and cover board transition zone 20 is Cu-Ag alloys, the weight of Cu
Amount ratio is 95%-97%, and the weight ratio of Ag is 5%-3%.Thickness is 200nm-500nm, and width is 1mm -2mm；It is described
The thickness of indium alloy sealing layer 19 is 50 μm -200 μm, and width is 1mm -2mm；Indium alloy sealing layer 19 is indium stannum alloy, indium conjunction
Gold or indium bismuth alloy, wherein indium, tin weight ratio be indium be 50.9%, tin 49.1%, fusing point be 116 DEG C；Indium bismuth alloy
Weight ratio is indium 66%, and bismuth 34%, fusing point is 72 DEG C.It ensure that OLED device 10 is completely in high vacuum in preparation process
Or in high-purity protective gas.It ensure that OLED device 10 is completely in high vacuum or high-purity protective gas in preparation process
In.
Specific sealing-in flow is as follows：
A kind of laser package method of organic electroluminescence device, it is 40 centimetres of 30 cm x to select sealing-in frame size
Organic electroluminescence device, sealing-in are as follows：
(1) OLED device 10 is placed on the pedestal 9 in the vacuum chamber 3 of laser package device, wherein vacuum chamber 3
Interior gas pressure intensity is less than 2 × 10-4Pa；
(2) it controls three-dimension numerical controlled mobile platform 5 by computer to move with optical fiber output end cap 7, adjusts fiber-optic output
Spacing between cap 7 and the glass cover-plate of OLED device 10 14 makes the laser beam that optical fiber output end cap 7 exports in glass cover-plate
(14) spot diameter formed on is 2 millimeters；
(3) along 23 path direction of sealing-in frame, three-dimension numerical controlled mobile platform 5 is controlled by computer and drives fiber-optic output
Cap 7 moves, and adjustment optical fiber output end cap 7 makes the laser beam that optical fiber output end cap exports be directed at the sealing-in frame of OLED device 10
23 midline position；
(4) driving power of laser 1 is opened by computer, and adjusts laser output power and reaches 5 watts, passes through calculating
Machine controls three-dimension numerical controlled mobile platform 5 and drives optical fiber output end cap and pedestal 9, the laser beam edge for making optical fiber output end cap 7 export
23 closed loop of sealing-in frame of OLED device moves one week, is heated to indium alloy sealing layer 19, and reach indium alloy
More than melting temperature, you can sealing-in indium alloy sealing layer 19；
(5) etc. after the indium alloy sealing layer 19 of OLED device 10 to be packaged is cooled to 50 degrees Celsius or less, from passing through machine
Tool hand takes out OLED device 10 out of vacuum chamber 3, that is, completes sealing-in process.
Claims (8)
1. a kind of laser package device of organic electroluminescence device, it is characterised in that：Including vacuum chamber（3）, be arranged true
Plenum chamber（3）Interior three-dimension numerical controlled mobile platform pedestal（8）With three-dimension numerical controlled mobile platform（5）, be arranged in three-dimension numerical controlled movement
Platform base（8）On for placing OLED device（10）Pedestal（9）, be arranged in three-dimension numerical controlled mobile platform（5）On light
Fibre output end cap（7）, be arranged in vacuum chamber（3）Outer laser（1）With computer, setting in laser（1）On optical fiber
（2）, optical fiber（2）Across vacuum chamber（3）Wall and optical fiber output end cap（7）It is connected, it is flat that computer controls three-dimension numerical controlled movement
Platform（5）Drive optical fiber output end cap（7）Make the movement on XY two-dimensional directionals, control pedestal（9）Make the movement in Z one-dimensional squares；
The three-dimension numerical controlled mobile platform（5）On be provided with end caps pedestal（6）, optical fiber output end cap（7）It is arranged in end caps
Pedestal（6）On, the vacuum chamber（3）Optical fiber air-tight interfaces are provided on wall（4）, optical fiber is across optical fiber air-tight interfaces（4）With
Optical fiber output end cap（7）It is connected.
2. a kind of laser package device of organic electroluminescence device according to claim 1, it is characterised in that：It is described to swash
Light device（1）For semiconductor diode continuous-wave laser, wavelength 790-1064nm, maximum output laser power is 10-20W,
Power adjustable.
3. a kind of laser package device of organic electroluminescence device according to claim 1, it is characterised in that：It is described
OLED device（10）Including glass substrate（13）And glass cover-plate（14）, be arranged in glass substrate（13）On ITO electrode layer
（15）, be arranged in ITO electrode layer（15）On insulating layer（16）And light emitting functional layer（22）, it is arranged in insulating layer（16）, glass
Substrate（13）And glass cover-plate（14）On sealing-in frame（23）, light emitting functional layer（22）It is arranged in sealing-in frame（23）It is interior, envelope
Edge fit frame（23）Including being successively set on insulating layer from top to bottom（16）And glass substrate（13）On substrate adhesive layer（17）, base
Plate transition zone（18）, substrate indium alloy sealing layer, be successively set on glass cover-plate from top to bottom（14）On cover board adhesive layer
（21）, cover board transition zone（20）With cover board indium alloy sealing layer, cover board indium alloy sealing layer is arranged in substrate indium alloy sealing layer
On, and the sealing-in that is fused constitutes indium alloy sealing layer（19）.
4. a kind of laser package device of organic electroluminescence device according to claim 3, it is characterised in that：It is described
Insulating layer（16）Material be SiO2Or Al2O3, thickness 300nm-500nm, width 2nm-3mm；The substrate adhesive layer
（17）With cover board adhesive layer（21）Material be Cr, width 1mm-2mm, thickness 200nm-500nm；The substrate transition zone
（18）With cover board transition zone（20）Material be Cu-Ag alloys, the weight ratio that the weight ratio of Cu is 95% -97%, Ag is 5%
- 3%, thickness 200nm-500nm, width are 1mm -2mm；
The indium alloy sealing layer（19）Thickness be 50 μm -200 μm, width be 1mm -2mm；Indium alloy sealing layer（19）For indium
One kind in tin alloy, indium alloy or indium bismuth alloy, wherein indium, tin weight ratio be indium be 50.9%, tin 49.1%, fusing point
It is 116 DEG C；The weight ratio of indium bismuth alloy is indium 66%, and bismuth 34%, fusing point is 72 DEG C.
5. a kind of laser package method of organic electroluminescence device, which is characterized in that following steps：
（1）By OLED device（10）It is placed on the vacuum chamber of laser package device（3）Interior pedestal（9）On；
（2）Three-dimension numerical controlled mobile platform is controlled by computer（5）Band optical fiber output end cap（7）It is mobile, adjust fiber-optic output
Cap（7）With OLED device（10）Glass cover-plate（14）Between spacing, make optical fiber output end cap（7）The laser beam of output is in glass
Glass cover board（14）The spot diameter of upper formation is equal or slightly larger than the width of sealing-in frame；
（3）Along sealing-in frame（23）Path direction controls three-dimension numerical controlled mobile platform by computer（5）Drive fiber-optic output
Cap（7）It is mobile, adjust optical fiber output end cap（7）, the laser beam that optical fiber output end cap exports is made to be directed at OLED device（10）Envelope
Edge fit frame（23）Midline position；
（4）Open laser（1）Driving power, three-dimension numerical controlled mobile platform is controlled by computer（5）Drive optical fiber output
End cap and pedestal（9）, make optical fiber output end cap（7）Sealing-in frame of the laser beam of output along OLED device（23）Closed loop movement one
Week, sealing-in indium alloy sealing layer（19）；
（5）By the OLED device of encapsulation（10）It is taken out out of vacuum chamber after cooling, that is, completes sealing-in process；
The step（1）And step（5）In, by manipulator by OLED device（10）It is transmitted in vacuum chamber and takes out vacuum
Chamber.
6. a kind of laser package method of organic electroluminescence device according to claim 5, which is characterized in that the step
Suddenly（1）In, vacuum chamber（3）In gas pressure intensity be less than 2 × 10-4Pa, or it is filled with the high-purity Ar protective gas of an atmospheric pressure.
7. a kind of laser package method of organic electroluminescence device according to claim 5, it is characterised in that：It is described
OLED device（10）Including glass substrate（13）And glass cover-plate（14）, be arranged in glass substrate（13）On ITO electrode layer
（15）, be arranged in ITO electrode layer（15）On insulating layer（16）And light emitting functional layer（22）, it is arranged in insulating layer（16）, glass
Substrate（13）And glass cover-plate（14）On sealing-in frame（23）, light emitting functional layer（22）It is arranged in sealing-in frame（23）It is interior, envelope
Edge fit frame（23）Including being successively set on insulating layer from top to bottom（16）And glass substrate（13）On substrate adhesive layer（17）, base
Plate transition zone（18）, substrate indium alloy sealing layer, be successively set on glass cover-plate from top to bottom（14）On cover board adhesive layer
（21）, cover board transition zone（20）With cover board indium alloy sealing layer, cover board indium alloy sealing layer is arranged in substrate indium alloy sealing layer
On, and the sealing-in that is fused constitutes indium alloy sealing layer（19）.
8. a kind of laser package method of organic electroluminescence device according to claim 7, it is characterised in that：It is described exhausted
Edge layer（16）Material be SiO2Or Al2O3, thickness 300nm-500nm, width 2nm-3mm；The substrate adhesive layer
（17）With cover board adhesive layer（21）Material be Cr, width 1mm-2mm, thickness 200nm-500nm；The substrate transition zone
（18）With cover board transition zone（20）Material be Cu-Ag alloys, the weight ratio that the weight ratio of Cu is 95% -97%, Ag is 5%
- 3%, thickness 200nm-500nm, width are 1mm -2mm；
The indium alloy sealing layer（19）Thickness be 50 μm -200 μm, width be 1mm -2mm；Indium alloy sealing layer（19）For indium
One kind in tin alloy, indium alloy or indium bismuth alloy, wherein indium, tin weight ratio be indium be 50.9%, tin 49.1%, fusing point
It is 116 DEG C；The weight ratio of indium bismuth alloy is indium 66%, and bismuth 34%, fusing point is 72 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610999749.0A CN106531905B (en) | 2016-11-14 | 2016-11-14 | A kind of the laser package device and method of organic electroluminescence device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610999749.0A CN106531905B (en) | 2016-11-14 | 2016-11-14 | A kind of the laser package device and method of organic electroluminescence device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106531905A CN106531905A (en) | 2017-03-22 |
| CN106531905B true CN106531905B (en) | 2018-07-31 |
Family
ID=58351562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610999749.0A Expired - Fee Related CN106531905B (en) | 2016-11-14 | 2016-11-14 | A kind of the laser package device and method of organic electroluminescence device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531905B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112171056B (en) * | 2020-08-14 | 2023-04-07 | 大族激光科技产业集团股份有限公司 | OLED laser packaging device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656303A (en) * | 2009-09-17 | 2010-02-24 | 电子科技大学 | Structure and method for packaging organic electroluminescence component |
| CN102034682A (en) * | 2009-10-05 | 2011-04-27 | 三星移动显示器株式会社 | Laser irradiation system and laser irradiation method |
| CN105336876A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | Packaging system and packing method for sealed glass packaging body through laser |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101117732B1 (en) * | 2010-01-19 | 2012-02-24 | 삼성모바일디스플레이주식회사 | Laser beam irradiation apparatus for substrate sealing and manufacturing method of organic light emitting display device using the same |
-
2016
- 2016-11-14 CN CN201610999749.0A patent/CN106531905B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656303A (en) * | 2009-09-17 | 2010-02-24 | 电子科技大学 | Structure and method for packaging organic electroluminescence component |
| CN102034682A (en) * | 2009-10-05 | 2011-04-27 | 三星移动显示器株式会社 | Laser irradiation system and laser irradiation method |
| CN105336876A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | Packaging system and packing method for sealed glass packaging body through laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106531905A (en) | 2017-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101728489B (en) | Organic light emitting diode display device and method of fabricating same | |
| CN103383992B (en) | The method for packing of OLED and the OLED with the method encapsulation | |
| JP5127465B2 (en) | Sealed glass package and manufacturing method thereof | |
| US9941487B2 (en) | Glass item, glass item having luminescent-substance particles, device for producing a glass item, method for producing a glass item, and method for producing a glass item having luminescent-substance particles | |
| CN104505465A (en) | OLED packaging structure and packaging method thereof | |
| JP3903204B2 (en) | Manufacturing method of display device | |
| CN104505466B (en) | OLED encapsulating structure and method for packing thereof | |
| US9472777B2 (en) | Packaging method and display device | |
| JP2016521675A (en) | Laminate sealing sheet | |
| JP2003123966A (en) | Sealing and forming method of display element | |
| TW201615409A (en) | Sealed device and methods for making the same | |
| CN102690045A (en) | Packaging device and packaging method | |
| JPH11185956A (en) | Manufacture of organic el element and organic el element | |
| CN103730598A (en) | Organic light-emitting device and preparation method thereof | |
| CN103681771A (en) | Display device and encapsulating method thereof | |
| CN106531905B (en) | A kind of the laser package device and method of organic electroluminescence device | |
| US9825247B2 (en) | Optoelectronic component, method for operating an optoelectronic component, and method for producing an optoelectronic component | |
| TWI528610B (en) | Oled package heating device and process | |
| CN102332536A (en) | Packaging structure and packaging method for organic electroluminescent device | |
| CN108511620B (en) | Laser packaging OLED lighting panel and packaging method | |
| WO2015027534A1 (en) | Method for packaging glass substrates | |
| CN102916137B (en) | A kind of encapsulating structure of organic electroluminescence device and method for packing | |
| CN108565351B (en) | OLED display device and manufacturing method thereof | |
| WO2020199268A1 (en) | Oled packaging structure and oled packaging method | |
| CN102694132B (en) | A kind of packaging system and method for packing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180731 Termination date: 20191114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |