CN106531905A - Laser packaging device and method of organic electroluminescence device - Google Patents
Laser packaging device and method of organic electroluminescence device Download PDFInfo
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- CN106531905A CN106531905A CN201610999749.0A CN201610999749A CN106531905A CN 106531905 A CN106531905 A CN 106531905A CN 201610999749 A CN201610999749 A CN 201610999749A CN 106531905 A CN106531905 A CN 106531905A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention discloses a laser packaging device and method of an organic electroluminescence device. The laser packaging device and the laser packaging method belong to the organic electroluminescent device technology field, and solve the problem in the prior art that when an OLED device is sealed in an indium sealing manner, and the heating temperature at a sealing frame reaches or exceeds a melting temperature of a melting alloy, the heat is conducted to an organic light-emitting material in the middle area of the OLED device, so that the organic light-emitting material bears a higher temperature to be damaged or destroyed. The laser packaging device of the present invention comprises a vacuum chamber, a three dimensional numerical control mobile platform pedestal and a three dimensional numerical control mobile platform which are arranged inside the vacuum chamber, a pedestal arranged on the three dimensional numerical control mobile platform pedestal and used for placing the OLED device, an optical fiber output end cap arranged on the three dimensional numerical control mobile platform, a laser and a computer which are arranged outside the vacuum chamber and an optical fiber arranged on the laser. The optical fiber penetrates the wall of the vacuum chamber to be connected with the optical fiber output end cap, and the computer controls the three dimensional numerical control mobile platform to drive the optical fiber output end cap to move in the XY two-dimensional directions and control the pedestal to move in a Z one-dimensional direction and controls the operation of the laser. The laser packaging device and the laser packaging method of the present invention are used for the packaging of the organic electroluminescent device.
Description
Technical field
A kind of laser package device of organic electroluminescence device and method, for the envelope of organic electroluminescence device
Dress, belongs to organic electroluminescence device technical field.
Background technology
Organic electroluminescence device (OLED) is with active is luminous, brightness height, full-color EL display, driving voltage are low, device
Thickness of thin, achievable Flexible Displays, and preparation technology is relative to liquid crystal display device (LCD) and plasma display device
(PDP) simple the features such as, have a good application prospect in terms of large screen flat plate display and flexible display.
Luminous organic material in OLED is very sensitive to vapor and oxygen, and minimal amount of vapor and oxygen are with regard to energy loss
Evil luminous organic material, deteriorates the luminescent properties of device.Therefore, vapor and oxygen how to be reduced to device encapsulating material
Infiltration, the vapor and oxygen inside abatement device is organic electroluminescence device encapsulation technology major issue to be solved.Will
Ensure that device has the service life that disclosure satisfy that business application, the infiltration of vapor and oxygen to device encapsulation structure and material
Rate should be less than 10-6g/m2The level of/day.
Traditional rigid OLED method for packing, be with ultraviolet cured epoxy (also referred to as UV glue) do glass substrate and
Seal, sealing materials between cover plate, which has the disadvantage：Epoxy resin is poor to the barrier property of water and oxygen, and for example water to thickness is
The permeability of 1 millimeter of ultraviolet cured epoxy is 10 ° -10-1g/m2/ day magnitudes, far above OLED encapsulating material
Water penetration rate should be less than 10-6g/m2The requirement of/day magnitudes.Secondly, epoxy resin contains substantial amounts of water, and these water can be in device
The course of work in enter device inside because device heating is discharged.
Additionally, the protective gas of device inside contains a certain amount of vapor and oxygen, epoxy resin encapsulating material in addition
The continuous water of release, device inside material constantly desorption and the water for discharging and oxygen so that the content of device inside water and oxygen with
Device storage and the prolongation of working time and be continuously increased.These vapor and oxygen will be organic in constantly attack device
Luminescent material so as to which luminescent properties are constantly deteriorated, the life-span of device are greatly shortened.
Existing patent (Patent No. 200910167662.7,201210435587.X) is proposed, with indium method for sealing pair
The method that the substrate and cover plate of OLED carries out sealing-in.Vapor and oxygen are less than 10 to the permeability of indium and indium alloy-6g/m2/
Day magnitudes；Vitrification point of the melting temperature of indium and indium alloy less than electroluminescent organic material, the temperature of indium process for sealing
Infringement will not be produced to luminous organic material.These features of indium sealing-in become more satisfactory organic electroluminescence device
Method for sealing.
In these patents, indium envelope process is to adopt integrally to heat device, or is arranged in the film layer of sealing-in frame
Electrical heating resistive layer, the method for making which generate heat to the film layer impressed current are realized the heating to indium sealing layer, make substrate and lid
Seal after the indium sealing layer fusing of plate., during sealing-in, in making device, OLED is organic for overall heating sealing-in method
Luminescent material is also heated to more than indium alloy melting temperature, make heat labile OLED luminous organic materials bear higher temperature and
It is damaged or destroys, causes device luminescent properties to decline and even fail.Electric heating heating sealing-in method sealing-in side only to OLED
Frame region is heated, and the organic luminous layer temperature rise in the middle part of device is not high, effectively avoids organic luminous layer and is heated damage, but seals
Sealing-in at edge fit frame is complicated with film structure, and preparation cost is high, and is difficult to the multiple OLED lists on a substrate
Unit carries out heating sealing-in, is unfavorable for the industrialization of OLED.
The content of the invention
The present invention provides a kind of laser package device and the side of organic electroluminescence device for above-mentioned weak point
Method, in solution prior art during indium sealing-in OLED, the heating-up temperature at (1) frame reaches plugs with molten metal more than alloy melting point temperature,
OLED luminous organic materials bear higher temperature and are damaged or destroy；(2) sealing-in frame film structure complexity, preparation cost
It is high；(3) sealing-in speed is slow, sealing-in is unreliable；(4) asking for sealing-in can not be carried out to the multiple OLED units on a substrate
Topic.
To achieve these goals, the technical solution used in the present invention is：
A kind of laser package device of organic electroluminescence device, it is characterised in that：Including vacuum chamber, it is arranged on vacuum
The three-dimension numerical controlled mobile platform pedestal of within the chamber and three-dimension numerical controlled mobile platform, it is arranged on three-dimension numerical controlled mobile platform pedestal
For the base for placing OLED, the fiber-optic output cap being arranged on three-dimension numerical controlled mobile platform, it is arranged on vacuum chamber
Outer laser instrument and computer, the optical fiber being arranged on laser instrument, optical fiber are connected through vacuum chamber wall with fiber-optic output cap
Connect, the three-dimension numerical controlled mobile platform of computer controls drives fiber-optic output cap to make the motion on XY two-dimensional directionals, control base to make Z
Motion in one-dimensional square.
Further, end caps pedestal is provided with the three-dimension numerical controlled mobile platform, fiber-optic output cap is arranged on light
On fine end cap base seat, optical fiber air-tight interfaces in the vacuum chamber wall, are provided with, optical fiber is defeated with optical fiber through optical fiber air-tight interfaces
Go out and hold cap to be connected.
Further, the laser instrument is semiconductor diode continuous-wave laser, and wavelength is 790-1064nm, maximum output
Laser power is 10-20W, power adjustable.
Further, the OLED includes glass substrate and glass cover-plate, setting ITO electrode on the glass substrate
Layer, the insulating barrier being arranged in ITO electrode layer and light emitting functional layer, are arranged on insulating barrier, glass substrate and glass cover-plate
Sealing-in frame, light emitting functional layer are arranged in sealing-in frame, and sealing-in frame includes being successively set on insulating barrier and glass from top to bottom
Substrate adhesion layer, substrate transition zone, substrate indium alloy sealing layer on glass substrate, is successively set on glass cover-plate from top to bottom
Cover plate adhesion layer, cover plate transition zone and cover plate indium alloy sealing layer, cover plate indium alloy sealing layer is arranged on substrate indium alloy envelope
Connect on layer, and the sealing-in that is fused constitutes indium alloy sealing layer.
Further, the material of the insulating barrier is SiO2Or Al2O3, thickness is 300nm-500nm, and width is 2nm-
3mm；The material of the substrate adhesion layer and cover plate adhesion layer is Cr, and width is 1mm-2mm, and thickness is 200nm-500nm；It is described
The material of substrate transition zone and cover plate transition zone is Cu-Ag alloys, and the part by weight of Cu is 95%-97%, the part by weight of Ag
For 5%-3%.Thickness is 200nm-500nm, and width is 1mm 2mm；
The thickness of the indium alloy sealing layer is 50 μm -200 μm, and width is 1mm 2mm；Indium alloy sealing layer is closed for indium tin
Gold, indium alloy or indium bismuth alloy, wherein, indium, the weight ratio of tin are that indium is 50.9%, and tin is 49.1%, and fusing point is 116 DEG C；Indium
The part by weight of bismuth alloy is indium 66%, and bismuth 34%, fusing point are 72 DEG C.
A kind of laser package method of organic electroluminescence device, it is characterised in that following steps：
(1) OLED is placed on the base in the vacuum chamber of laser package device；
(2) by the three-dimension numerical controlled mobile platform band fiber-optic output cap movement of computer controls, adjust fiber-optic output cap
The spacing and glass cover-plate of OLED between, makes the laser beam that fiber-optic output cap (7) is exported on glass cover-plate (14)
The spot diameter of formation is equal or slightly larger than the width of sealing-in frame；
(3) along sealing-in frame path direction, fiber-optic output cap is driven by the three-dimension numerical controlled mobile platform of computer controls
It is mobile, fiber-optic output cap is adjusted, the center line of the sealing-in frame of the laser beam alignment OLED of fiber-optic output cap output is made
Position；
(4) driving power supply of laser instrument is opened, fiber-optic output is driven by the three-dimension numerical controlled mobile platform of computer controls
Cap and base, make the laser beam of fiber-optic output cap output move one week along the sealing-in frame closed loop of OLED, and sealing-in indium is closed
Golden sealing layer；
(5) will take out from vacuum chamber after the OLED cooling of encapsulation, that is, complete sealing-in process.
Further, in the step (1) and step (5), OLED is sent in vacuum chamber by manipulator and
Take out vacuum chamber.
Further, in the step (1), the gas pressure intensity in vacuum chamber is less than 2 × 10-4Pa, or it is filled with an air
The high-purity Ar protective gas of pressure.
Further, the OLED includes glass substrate and glass cover-plate, setting ITO electrode on the glass substrate
Layer, the insulating barrier being arranged in ITO electrode layer and light emitting functional layer, are arranged on insulating barrier, glass substrate and glass cover-plate
Sealing-in frame, light emitting functional layer are arranged in sealing-in frame, and sealing-in frame includes being successively set on insulating barrier and glass from top to bottom
Substrate adhesion layer, substrate transition zone, substrate indium alloy sealing layer on glass substrate, is successively set on glass cover-plate from top to bottom
Cover plate adhesion layer, cover plate transition zone and cover plate indium alloy sealing layer, cover plate indium alloy sealing layer is arranged on substrate indium alloy envelope
Connect on layer, and the sealing-in that is fused constitutes indium alloy sealing layer.
Further, the material of the insulating barrier is SiO2Or Al2O3, thickness is 300nm-500nm, and width is 2nm-
3mm；The material of the substrate adhesion layer and cover plate adhesion layer is Cr, and width is 1mm-2mm, and thickness is 200nm-500nm；It is described
The material of substrate transition zone and cover plate transition zone is Cu-Ag alloys, and the part by weight of Cu is 95%-97%, the part by weight of Ag
For 5%-3%.Thickness is 200nm-500nm, and width is 1mm 2mm；
The thickness of the indium alloy sealing layer is 50 μm -200 μm, and width is 1mm 2mm；Indium alloy sealing layer is closed for indium tin
Gold, indium alloy or indium bismuth alloy, wherein, indium, the weight ratio of tin are that indium is 50.9%, and tin is 49.1%, and fusing point is 116 DEG C；Indium
The part by weight of bismuth alloy is indium 66%, and bismuth 34%, fusing point are 72 DEG C.
Compared with prior art, it is an advantage of the current invention that:
First, indium alloy sealing layer is heated using laser beam, sealing-in OLED, the sealing-in at a heater element edge
Frame region, it is to avoid the OLED luminescent material temperature rises of device central region are too high and performance degradation and damage, it is ensured that sealing-in
The security of process；
2nd, there is laser beam heats sealing region noncontact heating, heating power can accelerate greatly to heat sealing-in process, heating
The advantage of region very little, homogeneous heating, is conducive to improving the speed and sealing-in quality of sealing-in；
3rd, moved by the three-dimension numerical controlled mobile platform of computer controls and base, the efficiency and reliability of sealing-in can be improved,
And sealing-in can be carried out to the indium sealing-in frame of arbitrary graphic；
4th, the present invention can carry out sealing-in to the OLED unit multiple to be cut on Large substrates, be adapted to
In industrialization production；
5th, sealing-in process of the invention can be 10 in pressure-4-10-6Complete in the high vacuum environment of Pa, sealing-in is complete
Cheng Hou, the partial pressure of vapor and oxygen inside OLED are less than 10-4-10-6Pa, is sealed under high pure protective gas environment
The one thousandth of vapor and oxygen content in OLED is connect to ten a ten thousandths, be conducive to improving the performance of OLED and
Life-span.
Description of the drawings
Fig. 1 is the schematic diagram of laser sealing-in device encapsulation OLED in the present invention；
Fig. 2 is the structural representation of OLED in the present invention；
Fig. 3 is the top view of sealing-in OLED in the present invention.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.
A kind of laser package device of organic electroluminescence device, including vacuum chamber 3, be arranged in vacuum chamber 3
Three-dimension numerical controlled mobile platform pedestal 8 and three-dimension numerical controlled mobile platform 5, it is arranged on being used on three-dimension numerical controlled mobile platform pedestal 8
Place the base 9 of OLED 10, the fiber-optic output cap 7 being arranged on three-dimension numerical controlled mobile platform 5, be arranged on vacuum chamber
Laser instrument 1 and computer, the optical fiber 2 being arranged on laser instrument 1 outside 3, optical fiber 2 pass through 3 wall of vacuum chamber and fiber-optic output
Cap 7 is connected, and the three-dimension numerical controlled mobile platform 5 of computer controls drives fiber-optic output cap 7 to make the motion on XY two-dimensional directionals, control
Base processed 9 is made the motion in Z one-dimensional squares and controls laser instrument 1 to run.Light is provided with the three-dimension numerical controlled mobile platform 5
Fine end cap base seat 6, fiber-optic output cap 7 are arranged on end caps pedestal 6, are provided with optical fiber gas on 3 wall of the vacuum chamber
Contiguity mouth 4, optical fiber are connected through optical fiber air-tight interfaces 4 with fiber-optic output cap 7.The laser instrument 1 is semiconductor diode
Continuous-wave laser, wavelength is 790-1064nm, and maximum output laser power is 10-20W, power adjustable.The OLED
10 include glass substrate 13 and glass cover-plate 14, the ITO electrode layer 15 being arranged on glass substrate 13, are arranged on ITO electrode layer
Insulating barrier 16 and light emitting functional layer 22 on 15, the sealing-in side being arranged on insulating barrier 16, glass substrate 13 and glass cover-plate 14
Frame 23, light emitting functional layer 22 are arranged in sealing-in frame 23, and sealing-in frame 23 includes being successively set on insulating barrier 16 from top to bottom
With the substrate adhesion layer 17 on glass substrate 13, substrate transition zone 18, substrate indium alloy sealing layer, it is successively set on from top to bottom
Cover plate adhesion layer 21, cover plate transition zone 20 and cover plate indium alloy sealing layer on glass cover-plate 14, cover plate indium alloy sealing layer set
Put on substrate indium alloy sealing layer, during sealing-in, cover plate indium alloy sealing layer and substrate indium alloy sealing layer melt and mutually melt
Close, after cooling, constitute the indium alloy sealing layer 19 of OLED.The material of the insulating barrier 16 is SiO2Or Al2O3, thickness is
300nm-500nm, width are 2nm-3mm；The material of the substrate adhesion layer 17 and cover plate adhesion layer 21 is Cr, and width is 1mm-
2mm, thickness are 200nm-500nm；The material of the substrate transition zone 18 and cover plate transition zone 20 be Cu-Ag alloys, the weight of Cu
Amount ratio is 95%-97%, and the part by weight of Ag is 5%-3%.Thickness is 200nm-500nm, and width is 1mm 2mm；It is described
The thickness of indium alloy sealing layer 19 is 50 μm -200 μm, and width is 1mm 2mm；Indium alloy sealing layer 19 is indium stannum alloy, indium conjunction
Gold or indium bismuth alloy, wherein, indium, the weight ratio of tin are that indium is 50.9%, and tin is 49.1%, and fusing point is 116 DEG C；Indium bismuth alloy
Part by weight is indium 66%, and bismuth 34%, fusing point are 72 DEG C.Ensure that OLED 10 is completely in high vacuum in preparation process
Or in high-purity protective gas.Ensure that OLED 10 is completely in high vacuum or high-purity protective gas in preparation process
In.
Concrete sealing-in flow process is as follows：
A kind of laser package method of organic electroluminescence device, is 40 centimetres of 30 cm x from sealing-in frame size
Organic electroluminescence device, sealing-in are comprised the following steps that：
(1) on the base 9 OLED 10 being placed in the vacuum chamber 3 of laser package device, wherein vacuum chamber 3
Interior gas pressure intensity is less than 2 × 10-4Pa；
(2) moved with fiber-optic output cap 7 by the three-dimension numerical controlled mobile platform of computer controls 5, adjust fiber-optic output
Spacing between the glass cover-plate 14 of cap 7 and OLED 10, makes the laser beam of the output of fiber-optic output cap 7 in glass cover-plate
(14) spot diameter formed on is 2 millimeters；
(3) along 23 path direction of sealing-in frame, fiber-optic output is driven by the three-dimension numerical controlled mobile platform 5 of computer controls
Cap 7 is moved, adjustment fiber-optic output cap 7, makes the laser beam of fiber-optic output cap output be directed at the sealing-in frame of OLED 10
23 midline position；
(4) driving power supply of laser instrument 1 is opened by computer, and adjusts laser output power and reach 5 watts, by calculating
Machine controls three-dimension numerical controlled mobile platform 5 and drives fiber-optic output cap and base 9, the laser beam edge for exporting fiber-optic output cap 7
23 closed loop of sealing-in frame of OLED is moved one week, indium alloy sealing layer 19 is heated, and reaches indium alloy
More than melting temperature, you can sealing-in indium alloy sealing layer 19；
Etc. (5) after the indium alloy sealing layer 19 of OLED 10 to be packaged is cooled to less than 50 degrees Celsius, from by machine
OLED 10 is taken out from vacuum chamber 3 by tool hand, that is, complete sealing-in process.
Claims (10)
1. the laser package device of a kind of organic electroluminescence device, it is characterised in that：Including vacuum chamber (3), it is arranged on very
Three-dimension numerical controlled mobile platform pedestal (8) and three-dimension numerical controlled mobile platform (5) in plenum chamber (3), it is arranged on three-dimension numerical controlled movement
The base (9) for placing OLED (10) on platform base (8), the light being arranged on three-dimension numerical controlled mobile platform (5)
Fine output end cap (7), it is arranged on the outer laser instrument (1) of vacuum chamber (3) and computer, the optical fiber being arranged on laser instrument (1)
(2), optical fiber (2) is connected through vacuum chamber (3) wall with fiber-optic output cap (7), and the three-dimension numerical controlled movement of computer controls is put down
Platform (5) drives fiber-optic output cap (7) to make motion on XY two-dimensional directionals, control base (9) to make the motion in Z one-dimensional squares.
2. the laser package device of a kind of organic electroluminescence device according to claim 1, it is characterised in that：Described three
End caps pedestal (6) is provided with dimension numerical control mobile platform (5), fiber-optic output cap (7) is arranged on end caps pedestal (6)
On, optical fiber air-tight interfaces (4) are provided with vacuum chamber (3) wall, optical fiber passes through optical fiber air-tight interfaces (4) and optical fiber output
End cap (7) is connected.
3. the laser package device of a kind of organic electroluminescence device according to claim 1, it is characterised in that：It is described to swash
Light device (1) is semiconductor diode continuous-wave laser, and wavelength is 790-1064nm, and maximum output laser power is 10-20W,
Power adjustable.
4. the laser package device of a kind of organic electroluminescence device according to claim 1, it is characterised in that：It is described
OLED (10) includes glass substrate (13) and glass cover-plate (14), the ITO electrode layer being arranged on glass substrate (13)
(15) insulating barrier (16), being arranged in ITO electrode layer (15) and light emitting functional layer (22), are arranged on insulating barrier (16), glass
Sealing-in frame (23) on substrate (13) and glass cover-plate (14), light emitting functional layer (22) are arranged in sealing-in frame (23), envelope
Edge fit frame (23) includes the substrate adhesion layer (17), base being successively set on insulating barrier (16) and glass substrate (13) from top to bottom
Plate transition zone (18), substrate indium alloy sealing layer, the cover plate adhesion layer being successively set on glass cover-plate (14) from top to bottom
(21), cover plate transition zone (20) and cover plate indium alloy sealing layer, cover plate indium alloy sealing layer are arranged on substrate indium alloy sealing layer
On, and the sealing-in that is fused constitutes indium alloy sealing layer (19).
5. the laser package device of a kind of organic electroluminescence device according to claim 4, it is characterised in that：It is described exhausted
The material of edge layer (16) is SiO2Or Al2O3, thickness is 300nm-500nm, and width is 2nm-3mm；The substrate adhesion layer
(17) and cover plate adhesion layer (21) material be Cr, width is 1mm-2mm, and thickness is 200nm-500nm；The substrate transition zone
(18) and the material of cover plate transition zone (20) is Cu-Ag alloys, the part by weight of Cu is 95%-97%, and the part by weight of Ag is
5%-3%.Thickness is 200nm-500nm, and width is 1mm 2mm；
The thickness of the indium alloy sealing layer (19) is 50 μm -200 μm, and width is 1mm 2mm；Indium alloy sealing layer (19) is indium
Tin alloy, indium alloy or indium bismuth alloy, wherein, indium, the weight ratio of tin are that indium is 50.9%, and tin is 49.1%, and fusing point is 116
℃；The part by weight of indium bismuth alloy is indium 66%, and bismuth 34%, fusing point are 72 DEG C.
6. a kind of laser package method of organic electroluminescence device, it is characterised in that following steps：
(1) on the base (9) OLED (10) being placed in the vacuum chamber (3) of laser package device；
(2) it is mobile by the three-dimension numerical controlled mobile platform of computer controls (5) band fiber-optic output cap (7), adjust fiber-optic output
Spacing between the glass cover-plate (14) of cap (7) and OLED (10), makes the laser beam that fiber-optic output cap (7) is exported in glass
The spot diameter formed on glass cover plate (14) is equal or slightly larger than the width of sealing-in frame；
(3) along sealing-in frame (23) path direction, fiber-optic output is driven by the three-dimension numerical controlled mobile platform of computer controls (5)
Cap (7) is mobile, adjustment fiber-optic output cap (7), makes the envelope of laser beam alignment OLED (10) of fiber-optic output cap output
The midline position of edge fit frame (23)；
(4) driving power supply of laser instrument (1) is opened, and optical fiber output is driven by the three-dimension numerical controlled mobile platform of computer controls (5)
End cap and base (9), make the laser beam that fiber-optic output cap (7) is exported along sealing-in frame (23) the closed loop movement one of OLED
Week, sealing-in indium alloy sealing layer (19)；
(5) will take out from vacuum chamber after OLED (10) cooling of encapsulation, that is, complete sealing-in process.
7. the laser package method of a kind of organic electroluminescence device according to claim 6, it is characterised in that：The step
Suddenly, in (1) and step (5), OLED (10) is sent in vacuum chamber by manipulator and takes out vacuum chamber.
8. a kind of laser package method of organic electroluminescence device according to claim 6, it is characterised in that the step
Suddenly, in (1), the gas pressure intensity in vacuum chamber (3) is less than 2 × 10-4Pa, or it is filled with the high-purity Ar protective gas of an atmospheric pressure.
9. the laser package method of a kind of organic electroluminescence device according to claim 6, it is characterised in that：It is described
OLED (10) includes glass substrate (13) and glass cover-plate (14), the ITO electrode layer being arranged on glass substrate (13)
(15) insulating barrier (16), being arranged in ITO electrode layer (15) and light emitting functional layer (22), are arranged on insulating barrier (16), glass
Sealing-in frame (23) on substrate (13) and glass cover-plate (14), light emitting functional layer (22) are arranged in sealing-in frame (23), envelope
Edge fit frame (23) includes the substrate adhesion layer (17), base being successively set on insulating barrier (16) and glass substrate (13) from top to bottom
Plate transition zone (18), substrate indium alloy sealing layer, the cover plate adhesion layer being successively set on glass cover-plate (14) from top to bottom
(21), cover plate transition zone (20) and cover plate indium alloy sealing layer, cover plate indium alloy sealing layer are arranged on substrate indium alloy sealing layer
On, and the sealing-in that is fused constitutes indium alloy sealing layer (19).
10. the laser package method of a kind of organic electroluminescence device according to claim 6, it is characterised in that：It is described
The material of insulating barrier (16) is SiO2Or Al2O3, thickness is 300nm-500nm, and width is 2nm-3mm；The substrate adhesion layer
(17) and cover plate adhesion layer (21) material be Cr, width is 1mm-2mm, and thickness is 200nm-500nm；The substrate transition zone
(18) and the material of cover plate transition zone (20) is Cu-Ag alloys, the part by weight of Cu is 95%-97%, and the part by weight of Ag is
5%-3%.Thickness is 200nm-500nm, and width is 1mm 2mm；
The thickness of the indium alloy sealing layer (19) is 50 μm -200 μm, and width is 1mm 2mm；Indium alloy sealing layer (19) is indium
Tin alloy, indium alloy or indium bismuth alloy, wherein, indium, the weight ratio of tin are that indium is 50.9%, and tin is 49.1%, and fusing point is 116
℃；The part by weight of indium bismuth alloy is indium 66%, and bismuth 34%, fusing point are 72 DEG C.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112171056A (en) * | 2020-08-14 | 2021-01-05 | 大族激光科技产业集团股份有限公司 | OLED laser packaging device |
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| CN105336876A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | Packaging system and packing method for sealed glass packaging body through laser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112171056A (en) * | 2020-08-14 | 2021-01-05 | 大族激光科技产业集团股份有限公司 | OLED laser packaging device |
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