CN106513899B - Clamp and method when the miniature soldered fitting of sandwich style and its preparation - Google Patents
Clamp and method when the miniature soldered fitting of sandwich style and its preparation Download PDFInfo
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- CN106513899B CN106513899B CN201610989688.XA CN201610989688A CN106513899B CN 106513899 B CN106513899 B CN 106513899B CN 201610989688 A CN201610989688 A CN 201610989688A CN 106513899 B CN106513899 B CN 106513899B
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- metal substrate
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- welded
- solder layer
- soldered fitting
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 211
- 239000002184 metal Substances 0.000 claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 claims abstract description 146
- 229910000679 solder Inorganic materials 0.000 claims abstract description 142
- 238000005476 soldering Methods 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 24
- 238000005219 brazing Methods 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
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- 229910052802 copper Inorganic materials 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 7
- 239000000956 alloy Substances 0.000 claims 7
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
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- 238000007740 vapor deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 6
- 239000006071 cream Substances 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides clamp when the miniature soldered fitting of sandwich style and its preparation and methods.Utilize shape, the consistent metal substrate of size is as soldering base material, and a surface of substrate is chosen as surface to be welded, upper, size and the consistent solder layer of surface to be welded are placed between lower two metal substrate surfaces to be welded, form metal substrate/solder layer/metal substrate structure, the structure is sequentially placed among special fixture, fixture includes metab, gasket, three parts of weight block, then fixture is placed in heating furnace and is brazed, postwelding can be obtained, lower metal substrate is aligned in center and surface to be welded realizes the miniature soldered fitting of the sandwich style being fully connected.The application of this soldered fitting can effectively solve the problems, such as that soldered fitting structure used present in Current electronic manufacture solder joint research differs larger with practical solder joint, it, which prepares clamp, can guarantee that upper and lower metal substrate is aligned in center, and it can realize the accuracy controlling of pressure, cost is relatively low for preparation method, can effectively improve joint quality and Efficiency.
Description
Technical field
The invention belongs to material welding and connection areas, develop the miniature soldered fitting of sandwich style, are suitable for electronics and produce
The correlative study of solder joint inside product, and it is related to preparing fixture and method used when such connector.
Background technique
In recent years, as the use of electronic product and people's lives contact more and more closely, electronics manufacturing is had become
The key areas that countries in the world are first developed.Therefore, as the important component of electronic manufacturing technology, Electronic Encapsulating Technology is obtained
More and more concerns are arrived.In the encapsulation at different levels inside electronic product, need to realize each component using interconnection technique
Connection.Soldering becomes at different levels because having many advantages, such as that stronger Stress match ability, significant economy and technique are relatively easy
The prefered method of interconnection technique in encapsulation.Particularly, the interconnection of each component can only be complete by soldering connection in many cases,
At.Soldering in Electronic Packaging specifically refers to the metal using fusing point lower than metal substrate fusing point to be welded on component as pricker
Material, be higher than brazing filler metal fusing point and lower than metal substrate fusing point at a temperature of, brazing filler metal melts simultaneously soak substrate, filling gap, simultaneously
Counterdiffusion occurs with substrate and forms intermetallic compound, to realize the connection of each component.After the completion of soldering, the solder joint of formation
It can not only realize the mechanical connection of each component, moreover it is possible to realize the electrical connection of different components.Obviously, solder joint is to influence electronics to produce
An important factor for moral character energy.
In order to ensure the second best in quality solder joint can be formed after soldering, and then the performance of electronic product is made to reach expected, for
Solder joint in electronic product, researcher have carried out extensive research.Currently, correlative study is concentrated mainly on two aspects, respectively
It is studied for solder joint forming process median surface phase increment study and welding spot reliability.With the continuous micromation of electronic product,
The size of internal solder joint has been decreased to a micron order of magnitude, in order to study conveniently, needs butt welding spot size to carry out appropriateness in research
Amplification, that is, select miniature soldered fitting as research object.As one of the critical issue that butt welding point conducts a research, the pricker of selection
Plumb joint should be able to reflect industrial actual conditions, and only in this way, obtained result of study could have actual production
There is directive significance.However, it is directed to the selection of soldered fitting, and at present there is no corresponding professional standard, pricker used in existing research
Plumb joint is designed according to researcher's self-demand, and form is broadly divided into two classes, respectively simple lap joint form,
As shown in Figure 1, and diffusion couple form, as shown in Figure 2.
For simple lap joint form, refers to and first choose two metal substrates consistent in shape and size as base material, respectively
Using the end of two metallic substrate surfaces as welding ends, two welding ends are made to link together by soldering, and then form this
Kind lap joint form.Such form soldered fitting is for carrying out welding spot reliability aspect research, and the center of two metal substrates is not
There is alignment, and only some forms connection to two substrate surfaces to be welded.However, inside the electronic product in solder joint, two
Metal substrate is usually in center alignment, while at least one metal substrate surface to be welded can fully achieve connection after brazing.Obviously,
This form soldered fitting and practical welding spot structure have bigger difference.For diffusion couple form, refer to first in metal substrate table
Solder is placed in face, and solder is connected together with substrate by intermetallic compounds layer after the completion of soldering, and then is formed to be similar to and be expanded
Idol form is dissipated, is mutually grown for some researcher's butt welding point forming process median surfaces used when conducting a research.On stricti jurise, this is simultaneously
Not counting a kind of joint form, because it does not realize the connection between base material, and practical solder joint can make two in electronic product
Metal substrate forms connection.It follows that diffusion couple form soldered fitting is differed with the solder joint in actual production in configuration aspects
It is bigger.Therefore, when conducting a research to solder joint in electronic product, using the soldered fittings of both forms, there is structures and reality
Border solder joint differs larger problem, and gained result of study does not have enough convincingnesses.
To solve the above problems, when solder joint is studied in electronic product, need to develop a kind of the miniature of new model
Soldered fitting, this connector should not only meet the practical structures of solder joint inside electronic product, should also carry out solder joint and be formed
The long research of process median surface interpromoting relation in five elements and welding spot reliability research.For this purpose, the invention proposes the miniature soldered fitting of sandwich style,
And it is related to special fixture and method used in its preparation process.
Summary of the invention
The purpose of the present invention is to provide fixture and sides used in the miniature soldered fitting of sandwich style and its preparation process
Method.Using metal substrate consistent in shape and size as soldering base material, select one surface of metal substrate as surface to be welded, it will
Solder layer identical with surface to be welded size is placed between upper and lower two metal substrate surfaces to be welded, solder layer and upper and lower surface to be welded
It contacting with each other with maximum area, forms metal substrate/solder layer/metal substrate structure, two metal substrates are aligned in center at this time,
In order to make two metal substrates keep center alignment, and apply to metal substrate/solder layer/metal substrate structure with can be convenient
The structure is sequentially placed into special fixture, then fixture is put into heating furnace and is brazed by pressure vertically downward, fixture
It keeps horizontal in furnace, after the completion of soldering, the miniature soldered fitting of sandwich style can be obtained, structure meets inside electronic product
Welding spot structure can be used for solder joint forming process median surface phase increment study, welding spot reliability research.
The miniature soldered fitting of sandwich style provided by the invention, as shown in figure 3, being consistent by upper and lower two sizes, shapes
Metal substrate by soldering connection together, upper and lower two metal substrates are in center alignment, sandwich articulamentum, and two
A metal substrate surface to be welded, which realizes, to be fully connected；
Preferably, the metal substrate material is one of Cu, Ag, Au, Co, Ni；
The shape of the metal substrate is cuboid, it is preferable that length is 1mm~3mm, and width is 1mm~3mm, thickness
For 0.5mm~1.5mm；
The metal substrate surface to be welded is the maximum surface of metal substrate area；
Fixture provided by the present invention for preparing the miniature soldered fitting of sandwich style includes three parts, and first part is
Metab, metab upper surface are provided with groove, and second part is gasket, and Part III is weight block；Second part and
Three parts can alternatively be used；
Preferably, metab material be aluminium alloy, shape be cuboid, length be respectively 100mm, 100mm,
5mm, metab upper surface are that an area is the surface 100mm × 100mm, and groove is located at upper surface center；
For the recessing of base upper surface institute, shape is cuboid, and effect is the movement of restriction pad piece, for convenience
The placement and taking-up of gasket, four vertex of groove distinguish open gap, and notch depth is consistent with depth of groove, it is preferable that groove
Length is 90mm, width 90mm, depth 1.6mm, and notch is arc, radius of curvature 3mm；
On the circumference using recessing bottom centre, institute as the center of circle, then several little grooves are provided with, its role is to guarantee
Upper and lower two metal substrate keeps center alignment in the miniature soldered fitting preparation process of sandwich style, these little grooves are rectangular
Body, size is consistent, and length, width and metal substrate length used, equivalent width, metal substrate/solder layer/Metal Substrate are hardened
Upper and lower two metal substrates are entirely confined in little groove after structure is put into little groove, while upper metal substrate a part energy
Expose little groove, exposing with a thickness of 0.1mm~1mm, it is small for convenience of metal substrate/solder layer/metal substrate structure placement
Four vertex of groove distinguish open gap, and notch depth is consistent with little groove depth, it is preferable that radius of a circle 25mm, thereon
4,6 or 8 grooves are provided with, little groove length is 1mm~3mm, and width is 1mm~3mm, and depth is 0.8~2.5mm, is lacked
Mouth is arc notch, and radius of curvature is equal, is 0.3mm~0.8mm；
For the weight block, it acts as in the preparation process of the miniature soldered fitting of sandwich style to metal substrate/
Solder layer/metal substrate structure provides pressure vertically downward, is placed in the centre of gasket surface, it is preferable that weight block is in
Cylindric, used aloned, material is stainless steel, specification be respectively 100g, 200g, 300g, 400g, 500g, 600g, 700g,
800g,900g,1000g；
It for the gasket, is matched with pedestal, it acts as the weight block gravity being placed on thereon to be converted into face power
It is applied to metal substrate/solder layer/metal substrate structure, gasket shape is cuboid, gasket length, width and base upper surface
Institute's recessing length, equivalent width, are placed in base upper surface groove, and hardened with each metal substrate/solder layer/Metal Substrate
Structure exposes the metallic substrate surfaces contact except little groove, it is preferable that gasket material is quartz glass, and gasket length is
90mm, width 90mm, with a thickness of 1.5mm；
The present invention also provides the preparation methods of the miniature soldered fitting of sandwich style, specifically includes the following steps:
Step 1: a kind of metal conduct soldering base material is provided, metal substrate consistent in shape and size is cut into；
Step 2: a surface of metal substrate is chosen as surface to be welded, which is successively ground, polishing treatment；
Step 3: solder is placed between upper and lower two metal substrates surface to be welded, and solder layer and upper and lower surface to be welded are with most
Large area contacts with each other, and forms metal substrate/solder layer/metal substrate structure；For the solder layer, length, width with
Metal substrate surface to be welded length, equivalent width, type be preferably pure Sn, pure In, SnAgCu series, SnBi series in one
Kind, thickness is preferably 1~200 μm, and laying method is preferably in surface to be welded electroplating solder, sputtering solder, coating soldering paste, puts
Set one of solder piece；
Step 4: metal substrate/solder layer/metal substrate structure that step 3 is formed is sequentially placed in the small of fixture
In groove；
Step 5: apply pressure for each metal substrate/solder layer being placed in little groove/metal substrate structure；It is described
Apply pressure, method is that gasket is placed in base upper surface groove, and hardened with each metal substrate/solder layer/Metal Substrate
Structure exposes the metallic substrate surfaces contact except little groove, then weight block is placed in the centre of gasket surface；For
Metal substrate/solder layer/metal substrate structure in each little groove, solder layer thickness must be identical, to guarantee each metal
The thickness that substrate/solder layer/metal substrate structure middle and upper part metal substrate exposes the outer portion of little groove is identical；Each Metal Substrate
Plate/solder layer/metal substrate structure pressure direction be vertically downward, size be weight block gravity divided by metal substrate/
Solder layer/metal substrate structure number；
Step 6: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keeps horizontal in furnace, after the completion of soldering, obtains sandwich style and is brazed miniature soldered fitting；Preferably, the heating
Furnace is connected with argon gas as protective gas, and brazing temperature is 200 DEG C~300 DEG C, and the holding time is 1min~30min；
If the solder joint studied is not necessarily to the application of pressure in actual fabrication process, directly walked after the completion of step 4
Rapid six；
The invention has the benefit that it is prepared for the miniature soldered fitting of sandwich style, such form soldered fitting constructor
Close solder joint practical structures inside electronic product, can effectively solve currently be directed to electronic product inside solder joint study present in due to
Soldered fitting structure used and the larger caused result of study of practical welding spot structure deviation do not have the problem of enough convincingnesses；
Meanwhile it can be to carry out solder joint forming process median surface phase increment study, weldering more conveniently using such form soldered fitting
Point reliability research；For the preparation of the miniature soldered fitting of sandwich style, the present invention develops special fixture, benefit in brazing process
With the fixture, upper and lower two metal substrates in metal substrate/solder layer/metal substrate structure can on the one hand protected always
Center alignment is held, on the other hand chooses whether to apply pressure to the structure in combination with actual conditions, if desired applies pressure, pass through
This purpose can be conveniently realized by placing weight block, and changing weight block weight can make the pressure applied by accurately
Regulation has good economy；In addition, the present invention also provides the method for preparing the miniature soldered fitting of sandwich style, the party
The step of method is used cooperatively without brazing flux, can not only save cleaning remnants brazing flux, can also reduce the content of impurity inside connector,
Effectively improve joint quality；This method need to be only brazed in heating furnace, and cost is relatively low, and can accurately control soldering temperature
Degree, time；The batch production of the miniature soldered fitting of sandwich style can also be realized using this method, and can disposably be prepared
Different types of connector, significantly improves Efficiency；
Detailed description of the invention
Fig. 1: simple lap joint form soldered fitting schematic diagram；
Fig. 2: diffusion couple form soldered fitting schematic diagram；
Fig. 3: the miniature soldered fitting schematic diagram of sandwich style provided by the invention；
Fig. 4: aluminum alloy base schematic top plan view in embodiment 1；
Fig. 5: each metal substrate/solder layer/metal substrate structure is put into the section after fixture in the embodiment of the present invention 1,2
Schematic diagram；
Fig. 6: aluminum alloy base schematic top plan view in embodiment 2；
Fig. 7: aluminum alloy base schematic top plan view in embodiment 3；
Fig. 8: each metal substrate/solder layer/metal substrate structure is put into disconnected after fixture in the embodiment of the present invention 3,4,5
Face schematic diagram；
Fig. 9: the simple bridging type soldering of gained under sandwich style soldered fitting obtained by embodiment 3 and identical preparation parameter
Connector, practical solder joint shear strength comparison diagram；
Figure 10: aluminum alloy base schematic top plan view in embodiment 4；
Figure 11: the simple bridging type pricker of gained under sandwich style soldered fitting obtained by embodiment 4 and identical preparation parameter
Plumb joint, practical solder joint shear strength comparison diagram；
Figure 12: aluminum alloy base schematic top plan view in embodiment 5；
Figure 13: the simple bridging type pricker of gained under sandwich style soldered fitting obtained by embodiment 5 and identical preparation parameter
Plumb joint, practical solder joint shear strength comparison diagram；
Description of symbols:
1-metal substrate；2-articulamentums；3-intermetallic compounds layers；4-solder layers；
5-aluminum alloy bases；6-base upper surface grooves；
7-base upper surface groove vertex arc notch；
The recessing of 8-base upper surface bottom portion of groove institutes；9-bottom groove vertex arc notch；
10-metal substrates/solder layer/metal substrate structure；
11-quartz glass gaskets；12-weight blocks；
Specific embodiment
Below with reference to specific drawings and examples, the invention will be further described.
Embodiment 1:
The miniature soldered fitting of sandwich style provided by the invention is led to by upper and lower two sizes, the consistent Cu substrate of shape
Cross soldering connection together, the shape of Cu substrate is cuboid, length and width, thick respectively 1mm, 1mm, 0.5mm, surface to be welded
The surface for being 1mm × 1mm for an area, upper and lower two Cu substrates are aligned in center, sandwich articulamentum, and two Cu
Substrate surface to be welded, which realizes, to be fully connected；
Provided by the present invention for preparing the fixture of the miniature soldered fitting of sandwich style, including aluminum alloy base 5, quartzy glass
Three glass gasket, weight block parts, wherein quartz glass gasket, weight block do not use in the present embodiment；
Aluminum alloy base is cuboid, and length is respectively 100mm, 100mm, 5mm, and upper surface is an area
It is the surface of 100mm × 100mm；
It is provided with the groove 6 that a shape is cuboid in base upper surface centre, groove length and width is respectively deeply
90mm, 90mm, 1.6mm, four vertex of groove have an arc notch 7, and circular arc curvature radius is 3mm, notch depth with
Depth of groove is consistent；
It is being the center of circle, radius on the circumference of 25mm, to successively open 4 little grooves 8 using bottom portion of groove central point, this 4
Groove is cuboid, and size is consistent, length and width, deep respectively 1mm, 1mm, 0.8mm, and vertex has arc and lacks
Mouth 9, radius of curvature 0.3mm, notch depth is consistent with depth of groove, and the line in each groove center and the center of circle can be by this circle 4 etc.
Point；
The schematic top plan view of Al-alloy metal pedestal, as shown in Figure 4；
Method provided by the present invention for preparing the miniature soldered fitting of sandwich style, is realized by following steps:
Step 1: providing Ni metal as soldering base material, and being cut out forming shape using the method for wire cutting is cuboid,
Length is respectively the Cu substrate of 1mm, 1mm, 0.5mm；
Step 2: choose one area of Cu substrate be 1mm × 1mm surface as surface to be welded, successively utilize No. 2000,
No. 3000 sand paper and partial size be 0.5 μm of diamond polishing cream the face is ground, polishing treatment；
Step 3: being divided into 4 groups for Cu substrate, and number is #1~#4, and every group 2；It is to be welded in a Cu substrate for a group #1
The Sn-3.0Ag-0.5Cu solder piece of 100 μ m-thicks is placed on face, solder leaf length, width are respectively 1mm, 1mm, by another Cu base
Plate surface to be welded is placed on the solder on piece, and solder piece is contacted with each other with upper and lower surface to be welded with maximum area, forms substrate/100 Cu
μ m-thick Sn-3.0Ag-0.5Cu solder piece/Cu board structure；For a group #2,100 μ m-thicks are applied on a Cu substrate surface to be welded
Sn58Bi42 soldering paste, another Cu substrate surface to be welded is placed on the soldering paste of coating, the soldering paste of coating and upper and lower surface to be welded with
Maximum area contacts with each other, and forms Cu substrate/100 μ m-thick Sn58Bi42 soldering paste/Cu board structure；For a group #3, in a Cu
Another Cu substrate surface to be welded is placed on the weldering of coating by the Sn-3.0Ag-0.5Cu soldering paste that 150 μ m-thicks are applied on substrate surface to be welded
On cream, the soldering paste of coating is contacted with each other with upper and lower surface to be welded with maximum area, forms Cu substrate/150 μ m-thick Sn-3.0Ag-
0.5Cu soldering paste/Cu board structure；For a group #4, the Sn58Bi42 solder of 150 μ m-thicks is placed on a Cu substrate surface to be welded
Piece, solder leaf length, width are respectively 1mm, 1mm, and another Cu substrate surface to be welded is placed on the solder on piece, solder piece with
Upper and lower surface to be welded is contacted with each other with maximum area, forms Cu substrate/150 μ m-thick Sn58Bi42 solder pieces/Cu board structure；
Step 4: 4 metal substrate/solder layer/metal substrate structures that step 3 is formed are sequentially placed in fixture
In little groove, each metal substrate/solder layer/metal substrate structure is put into the sectional schematic diagram after fixture, sees Fig. 5；
Step 5: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keep horizontal in furnace, and argon gas is connected in furnace and is protected, 300 DEG C of brazing temperature, the holding time be respectively 15min,
After the completion of soldering, it is miniature to obtain 4 variety classes sandwich styles under each holding time by 20min, 25min, 30min
It is brazed soldered fitting；
It can accurately reflect reality for verifying sandwich style miniature soldered fitting forming process median surface phase growth course
Solder joint forming process median surface phase growth course identifies joint interface intermetallic compound obtained by the present embodiment, measures
Intermetallic compound thickness, and compared with diffusion couple formula soldered fitting, the practical solder joint obtained under identical preparation parameter, it ties
Fruit is respectively as described in table 1, table 2, table 3, table 4；As seen from table, the interface phase growth course of sandwich style soldered fitting and practical weldering
Point interface phase growth course meets well, and diffusion couple formula soldered fitting interface phase growth course is mutually grown with practical welding point interface
Process variations are larger；
Difference joint form interface phase growing state when 1 solder layer of table is 100 μ m-thick Sn-3.0Ag-0.5Cu solder piece
Difference joint form interface phase growing state when 2 solder layer of table is 100 μ m-thick Sn58Bi42 soldering paste
Difference joint form interface phase growing state when 3 solder layer of table is 150 μ m-thick Sn58Bi42 solder piece
Difference joint form interface phase growing state when 4 solder layer of table is 150 μ m-thick Sn-3.0Ag-0.5Cu soldering paste
Embodiment 2:
The miniature soldered fitting of sandwich style provided by the invention is led to by upper and lower two sizes, the consistent Ag substrate of shape
Cross soldering connection together, the shape of Ag substrate is cuboid, length and width, thick respectively 1mm, 1mm, 0.5mm, surface to be welded
The surface for being 1mm × 1mm for an area, upper and lower two Ag substrates are aligned in center, sandwich articulamentum, and two Ag
Substrate surface to be welded, which realizes, to be fully connected；
Provided by the present invention for preparing the fixture of the miniature soldered fitting of sandwich style, including aluminum alloy base 5, quartzy glass
Three glass gasket, weight block parts, wherein quartz glass gasket, weight block do not use in the present embodiment；
Aluminum alloy base is cuboid, and length is respectively 100mm, 100mm, 5mm, and upper surface is an area
It is the surface of 100mm × 100mm；
Be provided with the groove 6 that a shape is cuboid in upper surface centre, groove length and width, it is deep be respectively 90mm,
90mm, 1.6mm, four vertex of groove have arc notch 7, and circular arc curvature radius is 3mm, and notch depth and groove are deep
Degree is consistent；
It is being the center of circle, radius on the circumference of 25mm, to successively open 4 little grooves 8 using bottom portion of groove central point, this 4
Groove is cuboid, and size is consistent, length and width, deep respectively 1mm, 1mm, 0.8mm, and vertex has arc and lacks
Mouth 9, radius of curvature 0.3mm, notch depth is consistent with little groove depth, and the line in each little groove center and the center of circle can justify this
4 equal parts；
The schematic top plan view of Al-alloy metal pedestal, as shown in Figure 6；
Method provided by the present invention for preparing the miniature soldered fitting of sandwich style, is realized by following steps:
Step 1: providing metal Ag as soldering base material, and being cut out forming shape using the method for wire cutting is cuboid,
Length is respectively the Ag substrate of 1mm, 1mm, 0.5mm；
Step 2: choose Ag substrate an area be 1mm × 1mm surface as surface to be welded, successively utilize No. 2000,
No. 3000 sand paper and partial size be 0.5 μm of diamond polishing cream the face is ground, polishing treatment；
Step 3: being divided into 4 groups for Ag substrate, and number is #1~#4, and every group 2；It is to be welded in an Ag substrate for a group #1
Place the Sn58Bi42 solder piece of 200 μ m-thicks on face, solder leaf length, width are respectively 1mm, 1mm, and another Ag substrate is to be welded
Face is placed on the solder on piece, and solder piece is contacted with each other with upper and lower surface to be welded with maximum area, forms Ag substrate/200 μ m-thicks
Sn58Bi42 solder piece/Ag board structure；For a group #2, the Sn-3.0Ag- of 200 μ m-thicks is applied on an Ag substrate surface to be welded
Another Ag substrate surface to be welded is placed on the soldering paste of coating by 0.5Cu soldering paste, and the soldering paste of coating and upper and lower surface to be welded are with maximum
Area contacts with each other, and forms Ag substrate/200 μ m-thick Sn-3.0Ag-0.5Cu soldering paste/Ag board structure；For a group #3, at one
Another Ag substrate surface to be welded is placed on the soldering paste of coating by the Sn58Bi42 soldering paste that 150 μ m-thicks are applied on Ag substrate surface to be welded,
The soldering paste of coating is contacted with each other with upper and lower surface to be welded with maximum area, forms Ag substrate/150 μ m-thick Sn58Bi42 soldering paste/Ag base
Hardened structure；For a group #4, the Sn-3.0Ag-0.5Cu solder piece of 160 μ m-thicks, solder piece are placed on an Ag substrate surface to be welded
Length, width are respectively 1mm, 1mm, and another Ag substrate surface to be welded is placed on the solder on piece, solder piece and upper and lower surface to be welded
It is contacted with each other with maximum area, forms Ag substrate/160 μ m-thick Sn-3.0Ag-0.5Cu solder pieces/Ag board structure；
Step 4: 4 metal substrate/solder layer/metal substrate structures that step 3 is formed are sequentially placed in fixture
In little groove, each metal substrate/solder layer/metal substrate structure is put into the sectional schematic diagram after fixture, sees Fig. 5；
Step 5: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keep horizontal in furnace, and argon gas is connected in furnace and is protected, 280 DEG C of brazing temperature, the holding time be respectively 15min,
After the completion of soldering, it is miniature to obtain 4 variety classes sandwich styles under each holding time by 20min, 25min, 30min
It is brazed soldered fitting；
It can accurately reflect reality for verifying sandwich style miniature soldered fitting forming process median surface phase growth course
Solder joint forming process median surface phase growth course identifies joint interface intermetallic compound obtained by the present embodiment, measures
Intermetallic compound thickness, and compared with diffusion couple formula soldered fitting, the practical solder joint obtained under identical preparation parameter, it ties
Fruit is respectively as described in table 5, table 6, table 7, table 8；As seen from table, the interface phase growth course of sandwich style soldered fitting and practical weldering
Point interface phase growth course meets well, and diffusion couple formula soldered fitting interface phase growth course is mutually grown with practical welding point interface
Process variations are larger；
Difference joint form interface phase growing state when 5 solder layer of table is 200 μ m-thick Sn58Bi42 solder piece
Difference joint form interface phase growing state when 6 solder layer of table is 200 μ m-thick Sn-3.0Ag-0.5Cu soldering paste
Difference joint form interface phase growing state when 7 solder layer of table is 150 μ m-thick Sn58Bi42 soldering paste
Difference joint form interface phase growing state when 8 solder layer of table is 160 μ m-thick Sn-3.0Ag-0.5Cu solder piece
Embodiment 3:
The miniature soldered fitting of sandwich style provided by the invention is led to by upper and lower two sizes, the consistent Au substrate of shape
Cross soldering connection together, the shape of Au substrate is cuboid, and length and width, thick respectively 2mm, 2mm, 1mm, surface to be welded are
The surface that one area is 2mm × 2mm, upper and lower two Au substrates are aligned in center, sandwich articulamentum, and two Au bases
Plate surface to be welded, which realizes, to be fully connected；
Provided by the present invention for preparing the fixture of the miniature soldered fitting of sandwich style, including aluminum alloy base 5, quartzy glass
12 3 glass gasket 11, weight block parts；
Aluminum alloy base is cuboid, and length is respectively 100mm, 100mm, 5mm, and upper surface is an area
It is the surface of 100mm × 100mm；
It is provided with the groove 6 that a shape is cuboid in base upper surface centre, groove length and width is respectively deeply
90mm, 90mm, 1.6mm, four vertex of groove have an arc notch 7, and circular arc curvature radius is 3mm, notch depth with
Depth of groove is consistent；
It is the center of circle, radius on the circumference of 25mm, to successively open 6 little grooves 8 being located at using groove floor central point, this
6 grooves are cuboid, and size is consistent, and length and width, deep respectively 2mm, 2mm, 1.5mm, four vertex of little groove are opened respectively
There is arc notch 9, radius of curvature 0.5mm, notch depth is consistent with little groove depth, the line at each little groove center and the center of circle
This can be justified 6 equal parts；
The schematic top plan view of Al-alloy metal pedestal, as shown in Figure 7；
Quartz glass gasket shape is cuboid, length and width, thick respectively 90mm, 90mm, 1.5mm；
Weight block is the cylindric stainless steel of 400g；
Method provided by the present invention for preparing the miniature soldered fitting of sandwich style, is realized by following steps:
Step 1: providing metal Au as soldering base material, and being cut out forming shape using the method for wire cutting is cuboid,
Length is respectively the Au substrate of 2mm, 2mm, 1mm；
Step 2: choose Au substrate an area be 2mm × 2mm surface as surface to be welded, successively utilize No. 2000,
No. 3000 sand paper and partial size be 0.5 μm of diamond polishing cream the face is ground, polishing treatment；
Step 3: the pure In film of 50 μ m-thicks is deposited as solder using the method for sputtering on an Au substrate surface to be welded
Layer, another Au substrate surface to be welded is placed on deposited In film, pure In film and upper and lower surface to be welded are mutual with maximum area
Contact forms the pure In film/Au board structure of Au substrate/50 μ m-thicks；
Step 4: the pure In film/Au board structure of Au substrate/50 μ m-thicks that step 3 is formed is sequentially placed in fixture
In each little groove；
Step 5: it in order to apply pressure vertically downward to the pure In film of each Au substrate/50 μ m-thicks/Au board structure, will pad
Piece is placed in base upper surface groove, and is exposed the Au substrate surface outside little groove with each structure and contacted with each other, then by weight
Block is placed in gasket surface center, and the pure In film/Au board structure of each Au substrate/50 μ m-thicks is put into the section signal after fixture
Figure, as shown in Figure 8；
Step 6: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keep horizontal in furnace, argon gas protection are connected in furnace, 200 DEG C of brazing temperature, holding time 5min, soldering is completed
Afterwards, the miniature soldering soldered fitting of 6 identical type sandwich styles is disposably obtained；
It can accurately reflect the practical solder joint to be studied to verify the reliability of the miniature soldered fitting of sandwich style
Reliability, first sandwich style soldered fitting shear strength obtained by the present embodiment is tested, then respectively to identical preparation
The shear strength of the simple bridging type soldered fitting, practical solder joint that obtain under parameter is tested, as a result as shown in Figure 9；Wherein,
The shear strength of sandwich style soldered fitting is 45.9MPa, and the shear strength of simple bridging type soldered fitting is 29.8MPa, real
The shear strength of border solder joint is 46.0MPa；Obviously, the shear strength of the miniature soldered fitting of sandwich style and practical solder joint basic one
It causes, and the shear strength of simple bridging type soldered fitting differs larger with practical solder joint；
Embodiment 4:
The miniature soldered fitting of sandwich style provided by the invention is led to by upper and lower two sizes, the consistent Co substrate of shape
Cross soldering connection together, the shape of Co substrate is cuboid, and length and width, thick respectively 2mm, 2mm, 1mm, surface to be welded are
The surface that one area is 2mm × 2mm, upper and lower two Co substrates are aligned in center, sandwich articulamentum, and two Co bases
Plate surface to be welded, which realizes, to be fully connected；
Provided by the present invention for preparing the fixture of the miniature soldered fitting of sandwich style, including aluminum alloy base 5, quartzy glass
12 3 glass gasket 11, weight block parts；
Aluminum alloy base is cuboid, and length is respectively 100mm, 100mm, 5mm, and upper surface is an area
It is the surface of 100mm × 100mm；
It is provided with the groove 6 that a shape is cuboid in base upper surface centre, groove length and width is respectively deeply
90mm, 90mm, 1.6mm, four vertex of groove have an arc notch 7, and circular arc curvature radius is 3mm, notch depth with
Depth of groove is consistent；
It is the center of circle, radius on the circumference of 25mm, to successively open 6 little grooves 8 being located at using groove floor central point, this
6 grooves are cuboid, and size is consistent, and length and width, deep respectively 2mm, 2mm, 1.5mm, four vertex of little groove are opened respectively
There is arc notch 9, radius of curvature 0.5mm, notch depth is consistent with little groove depth, the line at each little groove center and the center of circle
This can be justified 6 equal parts；
The schematic top plan view of Al-alloy metal pedestal, as shown in Figure 10；
Quartz glass gasket shape is cuboid, length and width, thick respectively 90mm, 90mm, 1.5mm；
Weight block is the cylindric stainless steel of 700g；
Method provided by the present invention for preparing the miniature soldered fitting of sandwich style, is realized by following steps:
Step 1: providing metal Co as soldering base material, and being cut out forming shape using the method for wire cutting is cuboid,
Length is respectively the Co substrate of 2mm, 2mm, 1mm；
Step 2: choose Co substrate an area be 2mm × 2mm surface as surface to be welded, successively utilize No. 2000,
No. 3000 sand paper and partial size be 0.5 μm of diamond polishing cream the face is ground, polishing treatment；
Step 3: the pure Sn film of 20 μ m-thicks is deposited as solder using electric plating method on a Co substrate surface to be welded
Layer, another Co substrate surface to be welded is placed on deposited Sn film, pure Sn film and upper and lower surface to be welded are mutual with maximum area
Contact forms the pure Sn film/Co board structure of Co substrate/20 μ m-thicks；
Step 4: the pure Sn film/Co board structure of Co substrate/20 μ m-thicks that step 3 is formed is sequentially placed in special folder
In each little groove of tool；
Step 5: it in order to apply pressure vertically downward to the pure Sn film of each Co substrate/20 μ m-thicks/Co board structure, will pad
Piece is placed in base upper surface groove, and is exposed the Co substrate surface outside little groove with each structure and contacted with each other, then by weight
Block is placed in gasket surface center, and the pure Sn film/Co board structure of each Co substrate/20 μ m-thicks is put into the section signal after fixture
Figure, as shown in Figure 8；
Step 6: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keep horizontal in furnace, argon gas protection are connected in furnace, 240 DEG C of brazing temperature, holding time 10min, soldering is completed
Afterwards, the miniature soldering soldered fitting of 6 identical type sandwich styles is disposably obtained；
It can accurately reflect the practical solder joint to be studied to verify the reliability of the miniature soldered fitting of sandwich style
Reliability, first sandwich style soldered fitting shear strength obtained by the present embodiment is tested, then respectively to identical preparation
The shear strength of the simple bridging type soldered fitting, practical solder joint that obtain under parameter is tested, as a result as shown in figure 11；Its
In, the shear strength of sandwich style soldered fitting is 29.8MPa, and the shear strength of simple bridging type soldered fitting is 19.9MPa,
The shear strength of practical solder joint is 29.6MPa；Obviously, the shear strength of the miniature soldered fitting of sandwich style and practical solder joint are basic
Unanimously, the shear strength of simple bridging type soldered fitting differs larger with practical solder joint；
Embodiment 5:
The miniature soldered fitting of sandwich style provided by the invention is led to by upper and lower two sizes, the consistent Ni substrate of shape
Cross soldering connection together, the shape of Ni substrate is cuboid, and length and width, thickness are respectively 3mm, 3mm, 1.5mm, to be welded
Face is the surface that an area is 3mm × 3mm, and upper and lower two Ni substrates are aligned in center, sandwich articulamentum, and two
Ni substrate surface to be welded, which realizes, to be fully connected；
Provided by the present invention for preparing the fixture of the miniature soldered fitting of sandwich style, including aluminum alloy base 5, quartzy glass
12 3 glass gasket 11, weight block parts；
Aluminum alloy base is cuboid, and length is respectively 100mm, 100mm, 5mm, and upper surface is an area
It is the surface of 100mm × 100mm；
Be provided with the groove 6 that a shape is cuboid in upper surface centre, groove length and width, it is deep be respectively 90mm,
90mm, 1.6mm, four vertex of groove have arc notch 7, and circular arc curvature radius is 3mm, and notch depth and groove are deep
Degree is consistent；
It is the center of circle, radius on the circumference of 25mm, to successively open 8 little grooves 8 being located at using groove floor central point, this
8 grooves are cuboid, and size is consistent, and length and width, deep respectively 3mm, 3mm, 2.5mm, four vertex of little groove are opened respectively
There is arc notch 9, radius of curvature 0.8mm, notch depth is consistent with little groove depth, the line at each little groove center and the center of circle
This can be justified 8 equal parts；
The schematic top plan view of Al-alloy metal pedestal, as shown in figure 12；
Quartz glass gasket shape is cuboid, length and width, thick respectively 90mm, 90mm, 1.5mm；
Weight block is the cylindric stainless steel of 1000g；
Method provided by the present invention for preparing the miniature soldered fitting of sandwich style, is realized by following steps:
Step 1: providing W metal as soldering base material, and being cut out forming shape using the method for wire cutting is cuboid,
Length is respectively the Ni substrate of 3mm, 3mm, 1.5mm；
Step 2: choose Ni substrate an area be 3mm × 3mm surface as surface to be welded, successively utilize No. 2000,
No. 3000 sand paper and partial size be 0.5 μm of diamond polishing cream the face is ground, polishing treatment；
Step 3: the pure Sn film of 10 μ m-thicks is deposited as solder using electric plating method on a Ni substrate surface to be welded
Layer, another Ni substrate surface to be welded is placed on deposited Sn film, pure Sn film and upper and lower surface to be welded are mutual with maximum area
Contact forms the pure Sn film/Ni board structure of Ni substrate/10 μ m-thicks；
Step 4: the pure Sn film/Ni board structure of Ni substrate/10 μ m-thicks that step 3 is formed is sequentially placed in fixture
In each little groove；
Step 5: it in order to apply pressure vertically downward to the pure Sn film of each Ni substrate/10 μ m-thicks/Ni board structure, will pad
Piece is placed in base upper surface groove, and is exposed the Ni substrate surface outside little groove with each structure and contacted with each other, then by weight
Block is placed in gasket surface center, and the pure Sn film/Ni board structure of each Ni substrate/10 μ m-thicks is put into the section signal after fixture
Figure, as shown in Figure 8；
Step 6: fixture is put into heating furnace to carry out pricker to internal metal substrate/solder layer/metal substrate structure
Weldering, fixture keep horizontal in furnace, argon gas protection are connected in furnace, 250 DEG C of brazing temperature, holding time 1min, soldering is completed
Afterwards, the miniature soldering soldered fitting of 8 identical type sandwich styles is disposably obtained；
It can accurately reflect the practical solder joint to be studied to verify the reliability of the miniature soldered fitting of sandwich style
Reliability, first sandwich style soldered fitting shear strength obtained by the present embodiment is tested, then respectively to identical preparation
The shear strength of the simple bridging type soldered fitting, practical solder joint that obtain under parameter is tested, as a result as shown in figure 13；Its
In, the shear strength of sandwich style soldered fitting is 25.8MPa, and the shear strength of simple bridging type soldered fitting is 11.5MPa,
The shear strength of practical solder joint is 26.0MPa；Obviously, the shear strength of the miniature soldered fitting of sandwich style and practical solder joint are basic
Unanimously, the shear strength of simple bridging type soldered fitting differs larger with practical solder joint；
Embodiments above is that further detailed description of the invention, and it cannot be said that specific implementation of the invention
It is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, present inventive concept is not being departed from
Under the premise of principle, several deduction or replace can also be made, all shall be regarded as belonging to protection scope of the present invention.
Claims (1)
1. the preparation method of the miniature soldered fitting of sandwich style, which is characterized in that the miniature soldered fitting of sandwich style is by Metal Substrate
Plate/solder layer/metal substrate structure is formed by soldering connection, before soldering, solder layer with a thickness of 1 μm~500 μm, it is upper,
Shape, the size of lower two metal substrates are consistent, and alignment, after soldering, upper and lower two metal substrates still keep being aligned, intermediate
Solder layer is accompanied, that is, there are metal/intermetallic compound/solder/intermetallic compound/metal interface structure, and two metals
Substrate surface to be welded, which realizes, to be fully connected；Metal substrate is one of Cu, Ag, Au, Co, Ni, Al, Mo, Pt, Pd, shape
Shape is cuboid, and length is 1mm~5mm, and width is 1mm~5mm, and with a thickness of 0.5mm~2mm, surface to be welded is Metal Substrate plate face
The maximum surface of product；
It is used to prepare the fixture of the miniature soldered fitting of sandwich style, including metab, weight block and gasket, the metal bottom
Seat, material are one of aluminium alloy, ferrous alloy, nickel-base alloy, cobalt-base alloys, and upper and lower surfaces are two mutually flat
Capable plane, upper surface regional area are provided with groove, and groove shapes are cuboid, and length is 80mm~100mm, width 80mm
~100mm, depth are 1mm~3mm, distinguish open gap in four vertex of groove, notch depth is consistent with depth of groove；With
Bottom portion of groove center is the center of circle, and radius is that the little groove that 3~9 shapes are cuboid is provided on the circumference of 20mm~30mm, is used
In placing metal substrate/solder layer/metal substrate structure, these little groove centers can be by circumference equal dividing, and size is consistent, and length is
1mm~5mm, width are 1mm~5mm, and depth is 0.8mm~3.5mm, and length, width and metal substrate length used, width
Unanimously, four vertex distinguish open gap, and notch depth is consistent with little groove depth, and metal substrate/pricker is put into inside little groove
Upper and lower two metal substrates are entirely confined in little groove after the bed of material/metal substrate structure, while upper metal substrate one
Point can expose little groove, exposing with a thickness of 0.1mm~1mm；For the weight block, material is ferrous alloy, Ni-based conjunction
Any one in gold, cobalt-base alloys, weight are 100g~1000g, are used singly or in combination thereof, are placed in gasket surface
Center portion position；For the gasket, material is quartz glass or aluminium alloy, and shape is cuboid, length be 80mm~
100mm, width are 80mm~100mm, and respectively with base upper surface institute recessing length, equivalent width, with a thickness of 1mm~
3mm is placed in the recessing of base upper surface institute, and with each metal substrate/solder layer/metal substrate structure upper metal substrate
Surface contact；
Preparation method includes the following steps:
Step 1: a kind of metal conduct soldering base material is provided, metal substrate consistent in shape and size is cut into；
Step 2: a surface of metal substrate is chosen as surface to be welded, which is successively ground, polishing treatment；
Step 3: solder is placed between upper and lower two metal substrates surface to be welded, and solder layer and upper and lower two surface to be welded are with maximum
Area contacts with each other, and forms metal substrate/solder layer/metal substrate structure；Solder layer length, width are waited for metal substrate respectively
It is face of weld length, of same size, it is one of pure Sn, pure In, Sn based alloy, In based alloy, laying method is in surface to be welded
Upper electroplating solder, vapor deposition solder, coating soldering paste, places one or more in solder piece at chemical plating solder；
Step 4: by step 3 formed metal substrate/solder layer/metal substrate structure, be placed in fixture each little groove it
In；
Step 5: apply pressure for each metal substrate/solder layer being placed in little groove/metal substrate structure or do not apply
Pressure；If applying pressure, applying pressure method is the centre that weight block is placed in gasket surface, and gasket is placed in fixture bottom
Within the recessing of seat upper surface institute, and contacted with each metal substrate/solder layer/metal substrate structure upper metal substrate surface,
At this time in each structure solder layer thickness answer it is identical, each structure pressure direction be vertically downward, size be weight block gravity
Divided by metal substrate/solder layer/metal substrate structure number；
Step 6: fixture is put into heating furnace to be brazed to internal metal substrate/solder layer/metal substrate structure, folder
Tool keeps horizontal in furnace, after the completion of soldering, obtains the miniature soldered fitting of sandwich style；Heating furnace should be vacuum or be connected with protection
Gas, brazing temperature is 200 DEG C~350 DEG C, the time is 1min~60min.
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| CN110394522B (en) * | 2019-08-12 | 2021-02-26 | 河北工业大学 | Deformed nickel-based alloy and cast Ni3Brazing process of Al-based alloy |
| CN113579403A (en) * | 2021-08-02 | 2021-11-02 | 南京工业大学 | Multi-lap-plate movable positioning brazing clamp |
| CN113681107B (en) * | 2021-09-10 | 2023-07-04 | 上海无线电设备研究所 | Microstrip board and substrate welding device and use method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6467680B1 (en) * | 2000-10-10 | 2002-10-22 | Axsun Technologies, Inc. | Optical bench assembly solder fixture and method |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN105834541A (en) * | 2016-06-04 | 2016-08-10 | 北京工业大学 | Preparing method for low-temperature-connection and high-temperature-use Cu/Sn/Cu brazing interface and structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528194A (en) * | 2010-12-15 | 2012-07-04 | 无锡华测电子系统有限公司 | Vacuum eutectic welding method |
| CN102244022A (en) * | 2011-04-26 | 2011-11-16 | 哈尔滨工业大学 | Manufacturing method of single intermetallic compound micro-interconnecting structure of flip chip |
| CN203140919U (en) * | 2013-03-19 | 2013-08-21 | 苏州市国晶电子科技有限公司 | Jig bottom die for hot press |
| CN105436653A (en) * | 2015-12-11 | 2016-03-30 | 中国科学院电子学研究所 | Special welding fixture for cavity of electronic vacuum device |
-
2016
- 2016-11-10 CN CN201610989688.XA patent/CN106513899B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6467680B1 (en) * | 2000-10-10 | 2002-10-22 | Axsun Technologies, Inc. | Optical bench assembly solder fixture and method |
| CN105789071A (en) * | 2016-03-29 | 2016-07-20 | 中国电子科技集团公司第二十九研究所 | Device used for realizing microwave chip eutectic pressurization and pressurization method |
| CN105834541A (en) * | 2016-06-04 | 2016-08-10 | 北京工业大学 | Preparing method for low-temperature-connection and high-temperature-use Cu/Sn/Cu brazing interface and structure |
Non-Patent Citations (1)
| Title |
|---|
| 微连接Cu/SAC305/Cu界面扩散动力学与几何尺寸关联研究;罗亮亮;《中国优秀硕士学位论文全文数据库（工程科技Ⅰ辑）》;20140715;第2.2、3.2.1节 * |
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