CN106505837A - Current transformation module - Google Patents
Current transformation module Download PDFInfo
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- CN106505837A CN106505837A CN201611263327.3A CN201611263327A CN106505837A CN 106505837 A CN106505837 A CN 106505837A CN 201611263327 A CN201611263327 A CN 201611263327A CN 106505837 A CN106505837 A CN 106505837A
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- CN
- China
- Prior art keywords
- cooling
- cooling structure
- flow channel
- power semiconductor
- coolant flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention devises a kind of new current transformation module, and the structure includes electric capacity, IGBT, and achieves modularized design by cooling structure, and total is compact, and assembling is simple, maintenance for the control device later stage, researchs and analyses and all has very great help.
Description
Technical field
The present invention relates to the technical field of motor control, specifically, is that one kind is used for the interior electric current conversion and control of motor,
The current transformation module of particularly motor control assembly.
Background technology
Motor control is one of core technology of electric automobile, and the producer is for the structural design scheme of motor control assembly
Typically there is following expectation：
1st, on the premise of function, cooling requirements are met, volume is as little as possible；Corresponding, power density is motor control assembly
An important indicator, the motor control assembly of relatively high power density has the higher market competitiveness.
2nd, assembly technology is simple, and simple assembly technology means less assembly work amount and relatively low assembling error
Rate, can bring higher production efficiency and lower production cost.
We are studied to prior art, and typical prior art is in the following example：
Chinese patent, a kind of electric machine controller, publication number：203596780 U of CN, disclose technical scheme：Controller includes outer
Shell and the shielding iron plate loaded on inside the shell, IGBT drive modules and driver circuit plate, control circuit board, thin-film capacitor, electric current are passed
Sensor and noninductive Absorption Capacitance, busbar support and busbar；Being and not being is set on case body by described busbar support
Sense Absorption Capacitance form fit groove, noninductive Absorption Capacitance be located at the groove in, and busbar support be provided with covering noninductive
The baffle plate of Absorption Capacitance.This technical scheme due to coolant flow channel citing power semiconductor modular too far, for IGBT high-power
The not enough situation that radiates is susceptible under conditions of work, meanwhile, thin-film capacitor and IGBT are arranged side by side, hence it is evident that increased
The area of horizontal direction, it will affect the placement of other parts in-car.
Chinese patent, a kind of electric machine controller, publication number：CN205212748U, discloses the utility model discloses one
Kind of electric machine controller, including controller box, mono- DC modules of DC, capacitance module, driver circuit plate, control circuit board and at least
2 independent power models, have radiating wall in controller box middle setting, and radiating wall is the cavity in the middle of controller box point
Superposed upper plenum and the lower cavity positioned at bottom is segmented into, inside upper plenum, on the top surface of radiating wall, is provided with projection,
, on raised side, the top surface of radiating wall, multiple power models are abreast installed in raised opposite side, radiating for capacitance module
On the top surface of wall, driver circuit plate and control circuit board are installed in inside upper plenum, and control circuit board controls driver circuit plate
Driving power module operation work, mono- DC modules of DC are opened up inside lower cavity, on the bottom surface of the wall that radiates on radiating wall
There is cooling water channel and be provided with the water inlet and delivery port connected with cooling water channel, by cooling water channel to mono- DC modules of DC, electricity
Molar block and power model spout, and row is unified to radiate.Although this technical scheme solves the heat dissipation problem of power model, but same
Sample has that horizontal direction area is big, affects the placement of other parts in-car.
Chinese patent, a kind of IGBT power models, publication number：203368303 U of CN, disclose a kind of IGBT power mould
Block, draws copper bar, positive and negative compound mother including power semiconductor modular, IGBT radiators, DC filtering thin-film capacitor, IGBT exchanges
Row, module underframe and electric capacity supporting plate;IGBT radiators are packed on the module underframe, and power semiconductor modular is arranged on described
On the medial surface of work GBT radiator;Positive and negative composite bus bar is fixedly installed on module underframe;Electric capacity supporting plate is packed in module underframe
On;One end of DC filtering thin-film capacitor is connected with electric capacity supporting plate, and the other end is connected with positive and negative composite bus bar;IGBT exchanges are drawn
Copper bar is packed on the medial surface of IGBT radiators, and copper bar and power semiconductor modular ac output end are drawn in the IGBT exchanges
It is connected.This technical scheme solves the problems, such as compact conformation to a certain extent, but still suffers from deficiency in terms of radiating.
In sum, prior art common problem have following some：
1st, spatial design is bad, and structural compactness is not enough；
2nd, the arrangement of current transformation module depends on controller housing, and the degree of modularity is low, and assembly technology is complicated；Some shaping moulds
Block is also to need similar shell or the device of support to be coordinated, its modularization existing defects in structure；
3rd, heat radiation structure design is unreasonable.
Content of the invention
The present invention be directed to deficiency of the prior art, designs the modular current transformation module of a automotive grade, solution
Certainly structural compactness is not enough, the degree of modularity is low, the irrational problem of radiator structure.
Present invention employs following technical scheme：
A kind of current transformation module, including driving plate, power semiconductor modular, cooling structure and electric capacity.
The one side of described power semiconductor modular is provided with radiating surface, and power semiconductor modular is right according to the order of driving plate
Electric current enters line translation.
Driving plate is fixed on power semiconductor modular and signal connection and power semiconductor modular between, and driving plate is controlled
Power semiconductor modular is operated.
Described cooling structure is provided with the interface for carrying out heat exchange with outside cooling system, and the one side of cooling structure is cold
But the radiating surface of face, cooling surface and power semiconductor modular is engaged, and power semiconductor modular is radiated by cooling structure；
The electric capacity is fixed on the one side of cooling structure dorsad cooling surface, electrically connects between electric capacity and power semiconductor modular.
Preferably, following scheme can be adopted：
Power semiconductor modular is IGBT module or MOSFET modules.
Power semiconductor modular is provided with three-phase alternating current copper bar or positive and negative direct current copper bar, and electric capacity is provided with positive and negative direct current copper
Row；When the three-phase alternating current copper bar or positive and negative direct current copper bar on power semiconductor modular is that electric current is input into copper bar, on electric capacity just
Negative direct current copper bar then exports copper bar for electric current；When the three-phase alternating current copper bar or positive and negative direct current copper bar on power semiconductor modular is electricity
During stream output copper bar, the positive and negative direct current copper bar on electric capacity is then input into copper bar for electric current.
Described cooling structure is liquid cooling structure, is provided with coolant flow channel inside cooling structure, and coolant flow channel is arranged on cooling
The inner side in face.
Described cooling structure interior laminate layer is provided with coolant flow channel and liquor charging runner, and described coolant flow channel is arranged on cooling
Face side, liquor charging runner are arranged on the side of dorsad cooling surface, serial communication between liquor charging runner and coolant flow channel.
Described cooling structure is provided with inlet and liquid outlet, for exchanging coolant and outside cooling system between,
Described inlet and liquid outlet are arranged at the one side of cooling structure dorsad cooling surface, and coolant flow channel is connected with liquid outlet,
Liquor charging runner is connected with inlet.
Connected by drainage channel between described coolant flow channel and liquid outlet, drainage channel passes through liquor charging runner.
Connected entrance between coolant flow channel and drainage channel is arranged on one end of coolant flow channel, coolant flow channel and liquor charging runner
Between connected entrance be arranged on cooling coolant flow channel the other end.
The radiating surface of described power semiconductor modular is provided with radiation tooth, and the cooling surface of cooling structure is provided with cooling bath
Mouthful, radiation tooth enters coolant flow channel through cooling notch, and the edge and radiating surface sealing for cooling down notch coordinates.
It is connected by connecting copper bar and power semiconductor modular between on electric capacity, the cross section of connecting copper bar is L-shaped.
It is integrally formed between described electric capacity and connecting copper bar.
Described cooling structure also includes that technique post, technique post are arranged on cooling structure towards the one of power semiconductor modular
Face.
Description of the drawings
Fig. 1 is the schematic perspective view of current transformation module of the present invention.
Fig. 2 is the schematic top plan view for being provided with three-phase connecting copper bar one side of current transformation module of the present invention.
Fig. 3 is the schematic perspective view of the electric capacity of current transformation module of the present invention.
Fig. 4 is the schematic perspective view of the cooling structure of electric capacity transformational structure of the present invention.
Fig. 5 is the tangent plane schematic diagram of the cooling structure of electric capacity transformational structure of the present invention.
Drawing reference numeral：
1st, driving plate；2nd, power semiconductor modular；3rd, cooling structure；4th, electric capacity；5th, external signaling module；6th, notch is cooled down；7、
First flow；8th, second flow channel；9th, drainage channel；10th, the first liquid in-out mouth；11st, the second liquid in-out mouth；12nd, " L " type connection copper
Row；13rd, fixed column；14th, three-phase connecting copper bar；15th, positive and negative connecting copper bar；16th, technique post.
Specific embodiment
For the ease of description, cooling structure 3 is set to by we towards the direction of power semiconductor modular 2, by power half
Conductor module 2 is provided with before the one side of three-phase connecting copper bar 14 is set to direction, and correspondingly sets other directions.
In order to technical solution of the present invention is better described, we are described by specific examples below.
Current transformation module, from top to bottom, sets gradually driving plate 1, power semiconductor modular 2, cooling structure 3 and electric capacity
4.
Described driving plate 1 is fixed on the one side of the dorsad cooling structure 3 of power semiconductor modular 2, and and power semiconductor
2 signal of module connects, and is additionally provided with external signaling module 5, for being connected with external control system in driving plate 1.
Described power semiconductor modular 2 adopts IGBT module, power semiconductor modular to be provided with radiation tooth and be fixed on
3 top of cooling structure.
The upper surface of described cooling structure 3 be cooling surface, cooling surface be provided with cooling notch 6, cool down notch edge
Lower surface sealing with power semiconductor modular coordinates, and the mode of sealing can adopt sealing ring.
Upper and lower two-layer runner is provided with inside described cooling structure 3, and upper strata is named as first flow 7 by us, by lower floor
Be named as second flow channel 8, in the present embodiment, first flow 7 equivalent to content of the invention in coolant flow channel, 8 phase of second flow channel
When the liquor charging runner in content of the invention.
The right-hand member of the lower surface of described cooling structure 3 is provided with the first liquid in-out mouth 10 and the second liquid in-out mouth 11 side by side,
In the present embodiment, the liquid outlet during the first liquid in-out mouth 10 is equivalent to content of the invention, the outside coolant recovery of corresponding connection
Device, the second liquid in-out mouth 11 equivalent to content of the invention in inlet, the coolant liquid feeding device outside corresponding connection.
Radiation tooth is probeed in first flow 7 by cooling bath 6, and second flow channel 8 is connected in both sides' left end with first flow 7
Logical, first flow 7 is connected with the first liquid in-out mouth 10 by drainage channel 9, and drainage channel 9 passes through second flow channel 8, second
Road 8 is connected with the second liquid in-out mouth 11.
So, after coolant enters 3 inside of cooling structure, second flow channel 8 is first passed around, and right in second flow channel 8
High temperature coolant in first flow 7 carries out auxiliary temperature-reducing, reaches first flow 7 by the connected entrance of left end afterwards, and the
Radiation tooth is cooled down in one runner 7, enter drainage channel 9 afterwards, eventually arrive at liquid outlet, and by coolant recovery structure
Reclaim.Described drainage channel 9 is that straight tube and second flow channel 8 of getting along well are connected, and therefore, we are by drainage channel 9 and first flow 7
Connected entrance be located on the axis of first flow 7, corresponding first liquid in-out mouth 10 is located on the axis of second flow channel 8.
Electric capacity 4 is provided with " L " type connecting copper bar 12, and the cross section of " L " type connecting copper bar 12 is " L " type, has two rows, per
Row three, totally six, its one end and electric capacity 4 are integrally formed connection, and its other end is connected with power semiconductor modular 2, electric current
Can pass through " L " type connecting copper bar 12 transmitted.
In view of the 1 specific power semiconductor module 2 of driving plate in embodiment is slightly longer, in order to prevent driving plate 1 from shaking, in cooling
Structure 3 is provided with fixed column 13 in the one side towards power semiconductor modular 2, and driving plate 1 is fixed by fixed column 13.
Power semiconductor modular 2 is provided with three-phase connecting copper bar 14 in front, respectively corresponding outside three-phase out splice going splice, electricity
Hold 4 and be provided with positive and negative connecting copper bar 15, respectively corresponding outside two-phase input adapter.
For the ease of installing, the upper surface of described cooling structure 3 is also detachably provided with technique post 16, technique post 16
Be provided with assembling screw, for being fixedly connected and assembly tooling between, be easy to each part of current transformation module and and outside its
Assembling installation operation between its part.
During real work, start the liquid feeding device and retracting device of outside coolant, make cooling structure 3 possess beginning work
Make, afterwards, start outside two-phase power supply（Such as on-vehicle battery group）It is powered, electric current reaches power semiconductor mould through electric capacity 4
Block 2, driving plate 1 are controlled to power semiconductor modular 2 according to external control signal and the work shape by current transformation module
The feedback of the information such as state are to external control system, electricity of the power semiconductor modular 2 according to needed for the output of the control signal of driving plate 1
Stream, and the equipment to outside need current control（Such as motor）It is controlled.
It should be noted that although the design original intention of the present invention is designed around the demand of automotive grade motor control,
But design the scheme for completing and be not only applicable to automotive grade motor, for other similar system, equipment or parts are suitable for.
Above technical scheme provided by the present invention is described in detail, for one of ordinary skill in the art,
According to the thought of the present embodiment, will change in specific embodiments and applications, in sum, this specification
Content should not be construed as limiting the invention, and all any changes that is made according to the invention design philosophy are all the present invention's
Within protection domain.
Claims (10)
1. a kind of current transformation module, partly leads including driving plate, power semiconductor modular and electric capacity, described driving plate and power
Module signal connects and controls power semiconductor modular and is operated, the life of described power semiconductor modular according to driving plate
Line translation is entered in order to electric current, and the one side of power semiconductor modular is provided with radiating surface, it is characterised in that：
Also include cooling structure；
Described cooling structure is provided with the interface for carrying out heat exchange with outside cooling system, and the one side of cooling structure is cooling
The radiating surface of face, cooling surface and power semiconductor modular is engaged, and power semiconductor modular is radiated by cooling structure；
The electric capacity is fixed on the one side of cooling structure dorsad cooling surface, electrically connects between electric capacity and power semiconductor modular.
2. current transformation module according to claim 1, it is characterised in that：Described power semiconductor modular is IGBT moulds
Block or MOSFET modules.
3. current transformation module according to claim 1 and 2, it is characterised in that：Described cooling structure is liquid cooling structure,
Coolant flow channel is provided with inside cooling structure, and coolant flow channel is arranged on the inner side of cooling surface.
4. current transformation module according to claim 3, it is characterised in that：Described cooling structure interior laminate layer is provided with cold
But runner and liquor charging runner, described coolant flow channel are arranged on cooling surface side, and liquor charging runner is arranged on the one of dorsad cooling surface
Side, serial communication between liquor charging runner and coolant flow channel.
5. current transformation module according to claim 4, it is characterised in that：Described cooling structure be provided with inlet and
Liquid outlet, for exchanging coolant and outside cooling system between, described inlet and liquid outlet are arranged at cooling structure
The dorsad one side of cooling surface, coolant flow channel are connected with liquid outlet, and liquor charging runner is connected with inlet.
6. current transformation module according to claim 5, it is characterised in that：Lead between described coolant flow channel and liquid outlet
Drainage channel connection is crossed, drainage channel passes through liquor charging runner.
7. current transformation module according to claim 6, it is characterised in that：Connection between coolant flow channel and drainage channel
Mouth is arranged on one end of coolant flow channel, and the connected entrance between coolant flow channel and liquor charging runner is arranged on the another of cooling coolant flow channel
End.
8. the current transformation module according to any one in claim 4 to 7, it is characterised in that：Described power is partly led
The radiating surface of module is provided with radiation tooth, and the cooling surface of cooling structure is provided with cooling notch, and radiation tooth is through cooling notch
Coolant flow channel is entered, the edge and radiating surface sealing for cooling down notch coordinates.
9. the current transformation module according to any one in claim 1 to 2 or 4 to 7, it is characterised in that：One on electric capacity
Connecting copper bar is provided with body formedly, one end of connecting copper bar is connected with electric capacity, the other end and power of connecting copper bar are partly led
Module is connected, and the cross section of connecting copper bar is L-shaped.
10. current transformation module according to claim 9, it is characterised in that：Described cooling structure also includes technique post,
Technique post is arranged on cooling structure towards the one side of power semiconductor modular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611263327.3A CN106505837A (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611263327.3A CN106505837A (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106505837A true CN106505837A (en) | 2017-03-15 |
Family
ID=58334912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611263327.3A Pending CN106505837A (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106505837A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110506385A (en) * | 2017-04-20 | 2019-11-26 | 三菱电机株式会社 | Power conversion device |
-
2016
- 2016-12-30 CN CN201611263327.3A patent/CN106505837A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110506385A (en) * | 2017-04-20 | 2019-11-26 | 三菱电机株式会社 | Power conversion device |
| EP3614550A4 (en) * | 2017-04-20 | 2020-04-29 | Mitsubishi Electric Corporation | Power conversion device |
| CN110506385B (en) * | 2017-04-20 | 2021-03-12 | 三菱电机株式会社 | Power conversion device |
| US11019756B2 (en) | 2017-04-20 | 2021-05-25 | Mitsubishi Electric Corporation | Power conversion device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170315 |