CN206472020U - Current transformation module - Google Patents
Current transformation module Download PDFInfo
- Publication number
- CN206472020U CN206472020U CN201621482433.6U CN201621482433U CN206472020U CN 206472020 U CN206472020 U CN 206472020U CN 201621482433 U CN201621482433 U CN 201621482433U CN 206472020 U CN206472020 U CN 206472020U
- Authority
- CN
- China
- Prior art keywords
- cooling
- cooling structure
- power semiconductor
- flow channel
- semiconductor modular
- Prior art date
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- Expired - Fee Related
Links
- 230000009466 transformation Effects 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 85
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000002826 coolant Substances 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model devises a kind of new current transformation module, and the structure includes electric capacity, IGBT, in addition to cooling structure；Described cooling structure is provided with and outside cooling system carries out the interface of heat exchange, and the one side of cooling structure is cooling surface, and the radiating surface of cooling surface and power semiconductor modular is engaged, and power semiconductor modular is radiated by cooling structure；The electric capacity is fixed on the one side of cooling structure dorsad cooling surface, is electrically connected between electric capacity and power semiconductor modular.Modularized design is realized by cooling structure, total is compact, assembling is simple, maintenance for the control device later stage, research and analyse and all have very great help.
Description
Technical field
The utility model is related to the technical field of motor control, specifically, is that a kind of interior electric current of motor that is used for is changed
Control, particularly the current transformation module of motor control assembly.
Background technology
Motor control is one of core technology of electric automobile, structural design scheme of the producer for motor control assembly
Typically there is following expectation：
1st, on the premise of function, cooling requirements is met, volume is as small as possible；Corresponding, power density is motor control
One important indicator of device, the motor control assembly of relatively high power density has the stronger market competitiveness.
2nd, assembly technology is simple, and simple assembly technology means less assembly work amount and relatively low assembling error
Rate, can bring higher production efficiency and lower production cost.
We are studied prior art, and typical prior art is in the following example：
Chinese patent, a kind of electric machine controller, publication number：The U of CN 203596780, disclose technical scheme：Controller bag
Include shell and loaded on the shielding iron plate in shell, IGBT drive modules and driver circuit plate, control circuit board, thin-film capacitor, electricity
Flow sensor and noninductive Absorption Capacitance, busbar support and busbar；Case body by described busbar support is provided with
With the groove of noninductive Absorption Capacitance form fit, noninductive Absorption Capacitance is located in the groove, and busbar support is provided with covering
The baffle plate of noninductive Absorption Capacitance.This technical scheme illustrates power semiconductor modular too far due to coolant flow channel, big for IGBT
The not enough situation of radiating easily occurs under conditions of power work, meanwhile, thin-film capacitor and IGBT are arranged side by side, hence it is evident that increase
Area in the horizontal direction, it will the placement of the in-car other parts of influence.
Chinese patent, a kind of electric machine controller, publication number：CN205212748U, discloses that the utility model discloses one
Kind of electric machine controller, including controller box, the DC modules of DC mono-, capacitance module, driver circuit plate, control circuit board and at least
2 independent power models, are provided with radiating wall, radiating wall is the cavity in the middle of controller box point in the middle of controller box
Superposed upper plenum and the lower cavity positioned at bottom are segmented into, projection is provided with inside upper plenum, on the top surface of radiating wall,
Capacitance module is on raised side, the top surface for radiating wall, and multiple power models are abreast arranged on raised opposite side, radiated
On the top surface of wall, driver circuit plate and control circuit board are installed in inside upper plenum, control circuit board control driver circuit plate
Driving power module operation work, the DC modules of DC mono- are opened up inside lower cavity, on the bottom surface for the wall that radiates on radiating wall
There is cooling water channel and be provided with the water inlet and delivery port connected with cooling water channel, by cooling water channel to the DC modules of DC mono-, electricity
Molar block and power model spout, and row is unified to radiate.Although this technical scheme solves the heat dissipation problem of power model, but together
There is the problem of horizontal direction area is big in sample, influence the placement of in-car other parts.
Chinese patent, a kind of IGBT power models, publication number：The U of CN 203368303, disclose a kind of IGBT power mould
Copper bar, positive and negative compound mother are drawn in block, including power semiconductor modular, IGBT radiators, DC filtering thin-film capacitor, IGBT exchange
Row, module underframe and electric capacity supporting plate;IGBT radiators are packed on the module underframe, and power semiconductor modular is arranged on described
On the medial surface of work GBT radiators;Positive and negative composite bus bar is fixedly installed on module underframe;Electric capacity supporting plate is packed in module underframe
On;One end of DC filtering thin-film capacitor is connected with electric capacity supporting plate, and the other end is connected with positive and negative composite bus bar;IGBT exchanges are drawn
Copper bar is packed on the medial surface of IGBT radiators, and copper bar and power semiconductor modular ac output end are drawn in IGBT exchanges
It is connected.The problem of this technical scheme solves compact conformation to a certain extent, but still suffer from terms of radiating deficiency.
In summary, prior art common problem have it is following some：
1st, spatial design is bad, and structural compactness is not enough；
2nd, the arrangement of current transformation module depends on controller housing, and the degree of modularity is low, and assembly technology is complicated；Some into
Pattern block is also that the device for needing similar shell or support is coordinated, its modularization existing defects in structure；
3rd, heat radiation structure design is unreasonable.
Utility model content
The utility model is to be directed to deficiency of the prior art, designs the modular current transformation mould of a automotive grade
Block, solution structural compactness is not enough, the degree of modularity is low, the irrational problem of radiator structure.
The utility model employs following technical scheme：
A kind of current transformation module, including driving plate, power semiconductor modular, cooling structure and electric capacity.
The one side of described power semiconductor modular be provided with radiating surface, power semiconductor modular according to driving plate order pair
Electric current enters line translation.
Driving plate is fixed on power semiconductor modular and signal is connected between power semiconductor modular, driving plate control
Power semiconductor modular is operated.
Described cooling structure is provided with the interface that heat exchange is carried out with outside cooling system, and the one side of cooling structure is cold
But the radiating surface of face, cooling surface and power semiconductor modular is engaged, and power semiconductor modular is radiated by cooling structure；
The electric capacity is fixed on the one side of cooling structure dorsad cooling surface, is electrically connected between electric capacity and power semiconductor modular
Connect.
It is preferred that, following scheme can be used：
Power semiconductor modular is IGBT module or MOSFET modules.
Power semiconductor modular is provided with three-phase alternating current copper bar or positive and negative direct current copper bar, and electric capacity is provided with positive and negative direct current copper
Row；When the three-phase alternating current copper bar or positive and negative direct current copper bar on power semiconductor modular are that electric current inputs copper bar, on electric capacity just
Negative direct current copper bar then exports copper bar for electric current；When the three-phase alternating current copper bar or positive and negative direct current copper bar on power semiconductor modular are electricity
During stream output copper bar, the positive and negative direct current copper bar on electric capacity then inputs copper bar for electric current.
Described cooling structure is that coolant flow channel is provided with inside liquid cooling structure, cooling structure, and coolant flow channel is arranged on cooling
The inner side in face.
Described cooling structure interior laminate layer is provided with coolant flow channel and liquor charging runner, and described coolant flow channel is arranged on cooling
Face side, liquor charging runner is arranged on the side of dorsad cooling surface, serial communication between liquor charging runner and coolant flow channel.
Described cooling structure is provided with inlet and liquid outlet, is used to exchange coolant between outside cooling system,
Described inlet and liquid outlet is arranged at the one side of cooling structure dorsad cooling surface, and coolant flow channel is connected with liquid outlet,
Liquor charging runner is connected with inlet.
Connected between described coolant flow channel and liquid outlet by drainage channel, drainage channel passes through liquor charging runner.
Connected entrance between coolant flow channel and drainage channel is arranged on one end of coolant flow channel, coolant flow channel and liquor charging runner
Between connected entrance be arranged on cooling coolant flow channel the other end.
The radiating surface of described power semiconductor modular is provided with radiation tooth, and the cooling surface of cooling structure is provided with cooling bath
Mouthful, radiation tooth enters coolant flow channel through cooling notch, and the edge and radiating surface sealing for cooling down notch coordinate.
It is connected on electric capacity between power semiconductor modular by connecting copper bar, the cross section of connecting copper bar is L-shaped.
It is integrally formed between described electric capacity and connecting copper bar.
Described cooling structure also includes technique post, and technique post is arranged on cooling structure towards the one of power semiconductor modular
Face.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the utility model current transformation module.
Fig. 2 is the schematic top plan view provided with three-phase connecting copper bar one side of the utility model current transformation module.
Fig. 3 is the schematic perspective view of the electric capacity of the utility model current transformation module.
Fig. 4 is the schematic perspective view of the cooling structure of the utility model electric capacity transformational structure.
Fig. 5 is the tangent plane schematic diagram of the cooling structure of the utility model electric capacity transformational structure.
Drawing reference numeral：
1st, driving plate；2nd, power semiconductor modular；3rd, cooling structure；4th, electric capacity；5th, external signaling module；6th, cooling bath
Mouthful；7th, first flow；8th, second flow channel；9th, drainage channel；10th, the first liquid in-out mouthful；11st, the second liquid in-out mouthful；12nd, " L " type
Connecting copper bar；13rd, fixed column；14th, three-phase connecting copper bar；15th, positive and negative connecting copper bar；16th, technique post.
Embodiment
For the ease of description, the direction of cooling structure 3 towards power semiconductor modular 2 is set to by we, by power half
Before one side of the conductor module 2 provided with three-phase connecting copper bar 14 is set to direction, and correspondence sets other directions.
In order to which technical solutions of the utility model are better described, we are described by specific examples below.
Current transformation module, from top to bottom, sets gradually driving plate 1, power semiconductor modular 2, cooling structure 3 and electric capacity
4。
Described driving plate 1 is fixed on the one side of the dorsad cooling structure 3 of power semiconductor modular 2, and and power semiconductor
The signal of module 2 is connected, and external signaling module 5 is additionally provided with driving plate 1, for being connected with external control system.
Described power semiconductor modular 2 uses IGBT module, and power semiconductor modular is provided with radiation tooth and is fixed on
The top of cooling structure 3.
The upper surface of described cooling structure 3 is cooling surface, and cooling surface cools down the edge of notch provided with cooling notch 6
Seal and coordinate with the lower surface of power semiconductor modular, sealed mode can use sealing ring.
The described inside of cooling structure 3 is provided with two layers of runner up and down, and upper strata is named as first flow 7 by us, by lower floor
Second flow channel 8 is named as, in the present embodiment, first flow 7 is equivalent to the coolant flow channel in utility model content, second flow channel
8 equivalent to the liquor charging runner in utility model content.
The right-hand member of the lower surface of described cooling structure 3 is provided with the liquid in-out mouthful 11 of the first liquid in-out mouthful 10 and second side by side,
In the present embodiment, the first liquid in-out mouthful 10 corresponds to the coolant outside connection equivalent to the liquid outlet in utility model content
Retracting device, the second liquid in-out mouthful 11 corresponds to the coolant liquor charging outside connection equivalent to the inlet in utility model content
Device.
Radiation tooth is probeed into first flow 7 by cooling bath 6, and second flow channel 8 is connected with first flow 7 in both sides' left end
Logical, first flow 7 is connected by drainage channel 9 with the first liquid in-out mouthful 10, and drainage channel 9 passes through second flow channel 8, second
Road 8 is connected with the second liquid in-out mouthful 11.
So, after coolant enters 3 inside of cooling structure, second flow channel 8 is first passed around, and it is right in second flow channel 8
High temperature coolant in first flow 7 carries out auxiliary temperature-reducing, reaches first flow 7 by the connected entrance of left end afterwards, and the
Radiation tooth is cooled down in one runner 7, afterwards into drainage channel 9, liquid outlet is eventually arrived at, and by coolant recovery structure
Reclaim.Described drainage channel 9 is straight tube and discord second flow channel 8 is connected, and therefore, we are by drainage channel 9 and first flow 7
Connected entrance be located on the axis of first flow 7, corresponding first liquid in-out mouthful 10 is located on the axis of second flow channel 8.
Electric capacity 4 is provided with " L " type connecting copper bar 12, and the cross section of " L " type connecting copper bar 12 is " L " type, has two rows, often
Row three, totally six, its one end and electric capacity 4 are integrally formed connection, and its other end is connected with power semiconductor modular 2, electric current
Can pass through " L " types connecting copper bar 12 transmitted.
In view of the specific power semiconductor module 2 of driving plate 1 in embodiment is slightly longer, in order to prevent driving plate 1 from shaking, in cooling
Structure 3 is provided with fixed column 13 in the one side towards power semiconductor modular 2, and fixed column 13 fixes driving plate 1.
Power semiconductor modular 2 is provided with three-phase connecting copper bar 14 in front, and outside three-phase out splice going splice, electricity are corresponded to respectively
Hold 4 and be provided with positive and negative connecting copper bar 15, outside two-phase input adapter is corresponded to respectively.
For the ease of installing, the upper surface of described cooling structure 3 is also detachably provided with technique post 16, technique post 16
Provided with assembling screw, be used for being fixedly connected between assembly tooling, be easy to each part of current transformation module and and it is outside its
Assembling installation operation between its part.
During real work, start the liquid feeding device and retracting device of outside coolant, cooling structure 3 is possessed beginning work
Make, afterwards, start outside two-phase power supply（Such as on-vehicle battery group）It is powered, electric current reaches power semiconductor mould through electric capacity 4
Block 2, driving plate 1 is controlled according to external control signal to power semiconductor modular 2 and by the work shape of current transformation module
The feedback of the information such as state are to external control system, electricity of the power semiconductor modular 2 according to needed for being exported the control signal of driving plate 1
Stream, and to the equipment of outside need current control（Such as motor）It is controlled.
Set it should be noted that although design original intention of the present utility model is the demand for surrounding automotive grade motor control
Meter, but the scheme that design is completed is not only applicable to automotive grade motor, is fitted for other similar systems, equipment or part
With.
Technical scheme provided by the utility model is described in detail above, for the general technology people of this area
Member, according to the thought of the present embodiment, will change in specific embodiments and applications, in summary, this theory
Bright book content should not be construed as to limitation of the present utility model, all any changes made according to the utility model Creative Design thought
All within protection domain of the present utility model.
Claims (10)
1. a kind of current transformation module, including driving plate, power semiconductor modular and electric capacity, described driving plate and power are partly led
Module signal connects and controls power semiconductor modular to be operated, described power semiconductor modular according to driving plate life
Line translation is entered in order to electric current, and the one side of power semiconductor modular is provided with radiating surface, it is characterised in that：
Also include cooling structure；
Described cooling structure is provided with the interface that heat exchange is carried out with outside cooling system, and the one side of cooling structure is cooling
The radiating surface of face, cooling surface and power semiconductor modular is engaged, and power semiconductor modular is radiated by cooling structure；
The electric capacity is fixed on the one side of cooling structure dorsad cooling surface, is electrically connected between electric capacity and power semiconductor modular.
2. current transformation module according to claim 1, it is characterised in that：Described power semiconductor modular is IGBT moulds
Block or MOSFET modules.
3. current transformation module according to claim 1 or 2, it is characterised in that：Described cooling structure is liquid cooling structure,
Coolant flow channel is provided with inside cooling structure, coolant flow channel is arranged on the inner side of cooling surface.
4. current transformation module according to claim 3, it is characterised in that：Described cooling structure interior laminate layer is provided with cold
But runner and liquor charging runner, described coolant flow channel are arranged on cooling surface side, and liquor charging runner is arranged on the one of dorsad cooling surface
Side, serial communication between liquor charging runner and coolant flow channel.
5. current transformation module according to claim 4, it is characterised in that：Described cooling structure provided with inlet and
Liquid outlet, is used to exchange coolant between outside cooling system, described inlet and liquid outlet is arranged at cooling structure
The dorsad one side of cooling surface, coolant flow channel is connected with liquid outlet, and liquor charging runner is connected with inlet.
6. current transformation module according to claim 5, it is characterised in that：Lead between described coolant flow channel and liquid outlet
Drainage channel connection is crossed, drainage channel passes through liquor charging runner.
7. current transformation module according to claim 6, it is characterised in that：Connection between coolant flow channel and drainage channel
Mouth is arranged on one end of coolant flow channel, and the connected entrance between coolant flow channel and liquor charging runner is arranged on the another of cooling coolant flow channel
End.
8. the current transformation module according to any one in claim 4 to 7, it is characterised in that：Described power is partly led
The radiating surface of module is provided with radiation tooth, and the cooling surface of cooling structure is provided with cooling notch, and radiation tooth passes through cooling notch
Into coolant flow channel, the edge and radiating surface sealing for cooling down notch coordinate.
9. the current transformation module according to any one in claim 1 to 2 or 4 to 7, it is characterised in that：One on electric capacity
Connecting copper bar is provided with body formedly, one end of connecting copper bar is connected with electric capacity, the other end and power of connecting copper bar are partly led
Module is connected, and the cross section of connecting copper bar is L-shaped.
10. current transformation module according to claim 9, it is characterised in that：Described cooling structure also includes technique post,
Technique post is arranged on cooling structure towards the one side of power semiconductor modular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621482433.6U CN206472020U (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621482433.6U CN206472020U (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206472020U true CN206472020U (en) | 2017-09-05 |
Family
ID=59712690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621482433.6U Expired - Fee Related CN206472020U (en) | 2016-12-30 | 2016-12-30 | Current transformation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206472020U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289169A (en) * | 2019-08-02 | 2019-09-27 | 北斗航天汽车（北京）有限公司 | Modular water-cooled film capacitor and motor controller |
| CN110323058A (en) * | 2019-08-02 | 2019-10-11 | 北斗航天汽车（北京）有限公司 | A kind of novel modularized electric machine controller |
| CN114286580A (en) * | 2020-09-27 | 2022-04-05 | 上海汽车电驱动有限公司 | Dual-drive system power device |
-
2016
- 2016-12-30 CN CN201621482433.6U patent/CN206472020U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289169A (en) * | 2019-08-02 | 2019-09-27 | 北斗航天汽车（北京）有限公司 | Modular water-cooled film capacitor and motor controller |
| CN110323058A (en) * | 2019-08-02 | 2019-10-11 | 北斗航天汽车（北京）有限公司 | A kind of novel modularized electric machine controller |
| CN114286580A (en) * | 2020-09-27 | 2022-04-05 | 上海汽车电驱动有限公司 | Dual-drive system power device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 211806 Jiangsu province Nanjing city Pukou District Qiaolin Street 29 step road 12 -156 Patentee after: Nanjing Electronic Technology Co. Ltd. Ansett Lai Address before: 300304 Tianjin District of Dongli City Huaming Road No. 22 building 9-2 Patentee before: Tianjin Anjie Li electronic technology limited liability company |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170905 Termination date: 20181230 |