CN106505007B - A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching - Google Patents
A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching Download PDFInfo
- Publication number
- CN106505007B CN106505007B CN201611219617.8A CN201611219617A CN106505007B CN 106505007 B CN106505007 B CN 106505007B CN 201611219617 A CN201611219617 A CN 201611219617A CN 106505007 B CN106505007 B CN 106505007B
- Authority
- CN
- China
- Prior art keywords
- dorsal pore
- electron mobility
- metal layer
- high electron
- mobility transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Abstract
The present invention provides a kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching, and in device front, two kinds of metals of the wiring layer alternating growth of technique form periodical metal layer, and periodical metal layer is located above the position of backside through vias to be etched;The endpoint monitoring suitable is the following steps are included: S1, the real-time etch spectra signal of acquisition;S2, judge whether periodical spectral signal occur;S3, it is etched if so, crossing stopping after quarter 30s;S4, if not, repeating step S2.The present invention improves the identification and sensitivity of endpoint detection system endpoint signal by the periodic stack design of front wiring periodicity metal layer, improve the accuracy and validity of terminal decision, silicon carbide-based GaN high electron mobility transistor dorsal pore particularly suitable for exposed area ratio not high (< 2%) etches, it can obviously improve process degree when dorsal pore etching, have higher practical value.
Description
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of terminal of high electron mobility transistor dorsal pore etching
Monitoring method.
Background technique
GaN base high electron mobility transistor (HEMT) is close with its distinctive high electron mobility, high two-dimensional electron gas face
Degree, high breakdown electric field become the one preferred technique of next-generation RF/Microwave power amplifier.
GaN HMET technique is divided into positive technique and back process, wherein back process mainly complete wafer be thinned and back
The work of hole interconnection.Wherein, dorsal pore technique is particularly important, is the interconnection approach of front device Yu back metal ground plane, dorsal pore
The quality of technique directly decides the height of product quality.
At present GaN HEMT dorsal pore processing technology mainly by SiC etching, GaN/AlGaN etching and etc. constituted, core
Difficult point is the control and the selection of etching technics terminal of the pattern of etched hole.For the selection of etching technics terminal, commonly
Method includes endpoint detection system and process time control.Wherein, process time control requires stability pole between process batch
Height will be unable to make reply in time once there is the variation of technological parameter, therefore there is more obvious drawback;And terminal is supervised
Examining system then can real-time monitoring technical process, once etching reach home can be reflected on monitor signals in real time, facilitate
The control of technical process.
Endpoint detection system mainly has following two classification: laser interferance method and characteristic spectrum analytic approach.Laser interferance method
Detection precisely, is not influenced by minimum exposure area in hot spot, and hot spot must be in detected region laser-irradiated domain temperature
It can increase quickly, cause the variation of etch rate, if being etched rough surface injustice, can also make to detect signal weaker and precision
It is lower.Characteristic spectrum analytic approach is passive detection type detection device, does not influence etching process, can detect slight change, can
To carry out very sensitive detection, but precision is influenced by minimum exposure area, and the signal of endpoint detection system can change,
The intensity for detecting light wave is directly proportional to etch rate, when etch rate is slow, detection difficult.Since dorsal pore diameter is only dozens of
Micron, and general laser spot diameter is all larger than 100 microns, so GaN HEMT dorsal pore etching technics, selects characteristic light spectrometry
It is more feasible.However to have the disadvantage in that dorsal pore exposed area accounts for smaller for characteristic light spectrometry, causes endpoint detection system signal
It is weaker, it is difficult to screen.
Summary of the invention
The purpose of the present invention is to provide a kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching, the party
Method can well solve problem above.
To reach above-mentioned requirements, the technical solution adopted by the present invention is that: a kind of high electron mobility transistor dorsal pore is provided
The endpoint monitoring suitable of etching, in device front, two kinds of metals of the wiring layer alternating growth of technique form periodical metal layer, week
Phase property metal layer is located above the position of backside through vias to be etched;The endpoint monitoring suitable the following steps are included:
S1, real-time etch spectra signal is obtained, and spectral signal is analyzed;
S2, judge whether periodical spectral signal occur;
S3, it is etched if so, crossing stopping after quarter 30s;
S4, if not, repeating step S1.
Compared with prior art, present invention has the advantage that
(1) it is improved by the periodic stack design of front wiring periodicity metal layer (being also dorsal pore etching barrier layer)
The identification and sensitivity of endpoint detection system endpoint signal improve the accuracy and validity of terminal decision, are particularly suitable for using
In the not high silicon carbide-based GaN high electron mobility transistor dorsal pore etching of exposed area ratio, back can obviously improve
Process degree when hole etches, has higher practical value;
(2) this method only adjusts wiring metal structure, have it is good implantable, without increasing additional technique step
Suddenly.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, at this
The same or similar part, the illustrative embodiments and their description of the application are indicated using identical reference label in a little attached drawings
For explaining the application, do not constitute an undue limitation on the present application.In the accompanying drawings:
Fig. 1 is flow diagram of the invention.
Fig. 2-Fig. 8 is the flow diagram of dorsal pore of the present invention etching.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with drawings and the specific embodiments, to this
Application is described in further detail.For the sake of simplicity, it is omitted that well known to a person skilled in the art certain skills in being described below
Art feature.
The present embodiment is by taking a kind of silicon carbide-based GaN high electron mobility transistor as an example, dorsal pore etching and terminal prison
The entire flow of control is as follows:
A, periodical metal layer 3, periodical metal are formed in two kinds of metals of wiring layer alternating growth of device front technique
Layer 3 is located above the position of backside through vias to be etched, as shown in Figure 2;The metal of alternating growth is platinum and gold, or for nickel and
Gold constitutes the periodic structure of Pt/Au/Pt/Au/Pt/Au or Ni/Au/Ni/Au/Ni/Au, typical thickness 500/2000/
500/2000/500/4500, overall thickness is about 1 μm.The intensity that signal is grabbed according to endpoint monitoring system, can be to periodicity
The periodicity of metal layer 3 is adjusted, but at least has 2 periods;For SiC base GaN HEMT, usually can all there is one
Walk special technique for complete device metal line, interconnection, while this layer of metal be also in back process dorsal pore etch
Barrier layer should stop when dorsal pore is etched to the layer i.e.;
B, the transistor left-hand thread is bonded to sapphire by bonding material to carry in support, front description is protected at this time, such as
Shown in Fig. 3;
C, 1 back side of SiC layer is thinned, is thinned to 70 ~ 120 μm;1 back spatter furling plating of SiC layer, material are Ti and Au,
Middle Ti with a thickness of 200 ~ 500, Au with a thickness of 1000 ~ 2000;Ni is then made by way of plating, with a thickness of
5 ~ 10 μm, as shown in Figure 4;
D, the photoetching of dorsal pore figure, development, as shown in Figure 5;
E, W metal, 0.5 ~ 1 μm/min of corrosion rate are corroded using the concentrated sulfuric acid, hydrogen peroxide mixed solution;It is dedicated using Au
Corrode corrosion Au;Using 10% HF solution corrosion Ti, as shown in Figure 6;
F, photoresist is removed, with Ni for hard exposure mask, using ICP-RIE equipment etching SiC layer 1, etching gas is F base gas
Body, exemplary options SF6+O2, 0.5 ~ 1.0 μm/min of rate, as shown in Figure 7;
G, use the concentrated sulfuric acid, hydrogen peroxide mixed solution corrosion W metal to completely remove W metal, 0.5 ~ 1 μ of corrosion rate
m/min;Use the dedicated corrosion corrosion Au of Au to completely remove metal Au;Use 1% ~ 10% HF solution corrosion Ti to go completely
Except metal Ti;
H, using SiC as exposure mask, using ICP-RIE equipment, using Cl2And BCl3Etch GaN/AlGaN layer 2, etch rate
0.1~0.2μm/min.After complete etching layer thoroughly, gas can start etching cycle metal layer 3;Once being etched to periodicity
Metal layer 3 is acquired and is analyzed by the spectrum to special metal element in periodical metal layer 3, and spectral signal can be in
Reveal the alternating variation for gradually increasing and weakening, shows apparent periodicity;Determine whether to reach the specific step of etching terminal
It is rapid as follows:
Endpoint detection system acquires real-time etch spectra signal, and analyzes collected spectral signal;
When there is periodical spectral signal, illustrate to reach etching terminal, stops etching after crossing quarter 30s;
When there is not periodical spectral signal, endpoint detection system continues to acquire real-time etch spectra signal and divide
Analysis.
Eventually form device architecture as shown in Figure 8.
Above-mentioned ICP-RIE equipment should be equipped with the endpoint detection system using characteristic spectrum analytic approach, detectable exposed area
Than < 5%, and should have broad spectral analysis ability, the elements such as Ni, Pt, Au can be parsed.
Embodiment described above only indicates several embodiments of the invention, and the description thereof is more specific and detailed, but not
It can be interpreted as limitation of the scope of the invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these belong to the scope of the present invention.Therefore this hair
Bright protection scope should be subject to the claim.
Claims (3)
1. a kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching, which is characterized in that in device front technique
Two kinds of metals of wiring layer alternating growth form periodical metal layer, the periodicity metal layer is located at backside through vias to be etched
Above position;The endpoint monitoring suitable the following steps are included:
S1, real-time etch spectra signal is obtained, and spectral signal is analyzed;
S2, judge whether periodical spectral signal occur;
S3, it is etched if so, crossing stopping after quarter 30s;
S4, if not, repeating step S1;
The metal of the alternating growth is platinum and gold, or is nickel and gold.
2. the endpoint monitoring suitable of high electron mobility transistor dorsal pore etching according to claim 1, which is characterized in that
The periodicity metal layer at least has 2 periods.
3. the endpoint monitoring suitable of high electron mobility transistor dorsal pore etching according to claim 1, which is characterized in that
It is described periodicity metal layer with a thickness of 0.8 μm -1.2 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611219617.8A CN106505007B (en) | 2016-12-26 | 2016-12-26 | A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611219617.8A CN106505007B (en) | 2016-12-26 | 2016-12-26 | A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106505007A CN106505007A (en) | 2017-03-15 |
CN106505007B true CN106505007B (en) | 2019-03-26 |
Family
ID=58334018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611219617.8A Active CN106505007B (en) | 2016-12-26 | 2016-12-26 | A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106505007B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101771032A (en) * | 2008-12-31 | 2010-07-07 | 中芯国际集成电路制造(上海)有限公司 | Method for forming through hole structure, semiconductor device, metal interconnection structure and mask plate |
CN105470131A (en) * | 2015-12-30 | 2016-04-06 | 东莞市青麦田数码科技有限公司 | Method for fabricating back hole of gallium arsenide-based HEMT device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444576B1 (en) * | 2000-06-16 | 2002-09-03 | Chartered Semiconductor Manufacturing, Ltd. | Three dimensional IC package module |
US20160204340A1 (en) * | 2015-01-08 | 2016-07-14 | Yoshinori Kumura | Magnetic memory device and method of manufacturing the same |
-
2016
- 2016-12-26 CN CN201611219617.8A patent/CN106505007B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101771032A (en) * | 2008-12-31 | 2010-07-07 | 中芯国际集成电路制造(上海)有限公司 | Method for forming through hole structure, semiconductor device, metal interconnection structure and mask plate |
CN105470131A (en) * | 2015-12-30 | 2016-04-06 | 东莞市青麦田数码科技有限公司 | Method for fabricating back hole of gallium arsenide-based HEMT device |
Also Published As
Publication number | Publication date |
---|---|
CN106505007A (en) | 2017-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10823766B2 (en) | Detector and a voltage converter | |
WO2017088560A1 (en) | Sensor, preparation method and multi-sensor system | |
US20170084505A1 (en) | Method for removing material from a substrate using in-situ thickness measurement | |
CN109314148A (en) | Gallium nitride Schottky diode on high pressure transverse direction silicon | |
TW200809958A (en) | Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement | |
US9454684B2 (en) | Edge crack detection system | |
CN106505007B (en) | A kind of endpoint monitoring suitable of high electron mobility transistor dorsal pore etching | |
EP2344418A1 (en) | A nanogap device for field enhancement and a system for nanoparticle detection using the same | |
US9863999B2 (en) | Circuit and method for inspecting semiconductor device | |
JP2006024774A (en) | Troubleshooting method and equipment for semiconductor device | |
CN110050187B (en) | Device for measuring a small potential of a sample, method for producing said device and use thereof | |
US8847335B2 (en) | Membrane structure for electrochemical sensor | |
Koehler et al. | High voltage GaN lateral photoconductive semiconductor switches | |
CN106449773B (en) | GaN-based Schottky diode structure and manufacturing method thereof | |
CN104037107B (en) | The failure analysis method of via chain structure | |
US20100117098A1 (en) | Schottky electrode for diamond semiconductor device and manufacturing method thereof | |
Huygens et al. | Photoelectrochemical reactions at the n-GaN electrode in 1 MH 2 SO 4 and in acidic solutions containing Cl− ions | |
Yamada et al. | Depth profiling of surface damage in n-type GaN induced by inductively coupled plasma reactive ion etching using photo-electrochemical techniques | |
US11823978B2 (en) | Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structure | |
CN103762264A (en) | GaN-based UV detecting sensor | |
US6528335B2 (en) | Electrical method for assessing yield-limiting asperities in silicon-on-insulator wafers | |
JP2015226018A (en) | Individualization method of electronic device | |
CN112038418A (en) | High-wavelength-selectivity ultraviolet detector and manufacturing method thereof | |
US11137310B2 (en) | Micro-hall effect devices for simultaneous current and temperature measurements for both high and low temperature environments | |
KR20160098241A (en) | Forming a metal contact 0n a surface of a semiconductor, and device with a metal contact |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |