CN106504647B - A kind of OLED mould group - Google Patents
A kind of OLED mould group Download PDFInfo
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- CN106504647B CN106504647B CN201610930862.3A CN201610930862A CN106504647B CN 106504647 B CN106504647 B CN 106504647B CN 201610930862 A CN201610930862 A CN 201610930862A CN 106504647 B CN106504647 B CN 106504647B
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- touch
- circuit board
- flexible circuit
- cof
- control
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
This application discloses a kind of OLED mould groups, to solve existing OLED mould group since the flexible circuit board beyond glass step needs to bend, and cause the unmatched problem of package dimension.It include: touch-control flexible circuit board, flip chip COF, packaged glass plate and glass step；Wherein: the upper surface COF is provided with driving flexible circuit board；The touch-control flexible circuit board is arranged in glass step upper surface, and the touch-control flexible circuit board is located in region composed by the packaged glass plate and glass step；One end of the touch-control flexible circuit board is electrically connected by the COF and the driving flexible circuit board, and the other end bonding of the touch-control flexible circuit board is on the packaged glass plate.
Description
Technical field
This application involves field of display technology more particularly to a kind of Organic Light Emitting Diode OLED mould groups.
Background technique
Using organic light-emitting diode display (Organic Light-Emitting Display, OLED) technology, preparation
OLED display panel be increasingly becoming since it has many advantages, such as that small in size, structure is simple, brightness is high, image quality is good and power saving
The mainstream development direction of field of display technology.
In the prior art, the OLED mould group in OLED display panel generallys use mode as shown in Figure 1 and assembles, Fig. 1
In 10 be touch-control flexible circuit board (Touch Panel Flexible Printed Circuit board, TP FPC), 20 are
It drives flexible circuit board (Driver FPC), 30 be flip chip (Chip On Film, COF), and 31 be drive integrated circult
(integrated circuit, IC), 32 be golden finger 40 in flip chip 30 be polaroid (Polarizer, POL), 50
For packaged glass plate, 61 be glass step, wherein the touch-control flexible circuit board 10 by the driving flexible circuit board 20 and
The flip chip 30 connect, and then reach the mesh that the touch-control flexible circuit board 10 is connect with the drive integrated circult 31
's.
Below by taking Fig. 2 as an example, show in OLED mould group in detail, between polaroid, packaged glass plate and glass step
Positional relationship, 60 be glass substrate in Fig. 2, and 50 be packaged glass plate, and 40 be polaroid, and the enclosed region 61 of dotted line bracket is glass
Glass step.
In Fig. 1, flip chip 30, driving flexible circuit board 20 and touch-control flexible circuit board 10 are independent from each other flexibility
Circuit board, this three when packaged, is required to be folded into the other side of glass step 61 beyond the part outside glass step 61, curved
It will cause the unmatched problem of package dimension after folding.
Summary of the invention
The embodiment of the present application provides a kind of Organic Light Emitting Diode OLED mould group, to solve existing OLED mould group due to
Flexible circuit board beyond glass step needs to bend, and causes the unmatched problem of package dimension.
The embodiment of the present application adopts the following technical solutions:
A kind of Organic Light Emitting Diode OLED mould group, comprising: touch-control flexible circuit board, flip chip COF, packaged glass plate
And glass step；Wherein:
The upper surface COF is provided with driving flexible circuit board；
In glass step upper surface, the touch-control flexible circuit board is located at described for the touch-control flexible circuit board setting
In region composed by packaged glass plate and glass step；
Touch-control flexible circuit board one end is electrically connected by the COF and the driving flexible circuit board；
The touch-control flexible circuit board other end bonding is on the packaged glass plate.
Preferably, golden finger is provided on the COF；Golden finger and setting on the COF is on the glass step
The first interface on surface is electrically connected, the golden hand when golden finger on the COF is connect with the first interface, on the COF
Refer to and is located in glass step boundary；Golden finger is provided on the touch-control flexible circuit board；The touch-control flexible circuit board
On golden finger be electrically connected with the second interface that glass step upper surface is arranged in, on the touch-control flexible circuit board
When golden finger is connect with the second interface, the golden finger position on the touch-control flexible circuit board is in glass step boundary
It is interior.
Preferably, the golden finger on the driving flexible circuit board and the COF is electrically connected；The first interface and institute
State second interface electric connection.
Preferably, via hole of the driving flexible circuit board by being located at the upper surface COF and the golden hand on the COF
Refer to and is electrically connected.
Preferably, the touch-control flexible circuit board is soft by the electric connection device being arranged on the COF and the driving
Property circuit board be electrically connected.
Preferably, on the packaged glass plate at the bonding of touch-control flexible circuit board described in bonding to the touch-control flexible electrical
Road plate direction extends.
Preferably, the touch-control flexible circuit board includes the first touch-control circuit plate and the second touch-control circuit plate；Described first
Touch-control circuit plate and the second touch-control circuit plate are located at the two sides COF.
Preferably, the first touch-control circuit plate and the second touch-control circuit plate are electrically connected.
The embodiment of the present application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
Since driving flexible circuit board is arranged in the upper surface COF, one end of the touch-control flexible circuit board can pass through institute
It states COF and the driving flexible circuit board is electrically connected, and table is arranged on the glass step in the touch-control flexible circuit board
Face, the touch-control flexible circuit board is located in region composed by the packaged glass plate and glass step, thus the application
In the OLED mould group of offer, only COF may exceed the glass step, then only need to exceed COF the part of glass step
It is folded into the other side of glass step, without bending driving flexible circuit board and touch-control flexible circuit board, so as to
Reduce the influence after bending to package dimension.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram for OLED mould group that the prior art provides；
Fig. 2 is the location diagram in OLED mould group between polaroid, packaged glass plate and glass step；
Fig. 3 is a kind of structural schematic diagram of OLED mould group provided by the embodiments of the present application；
Fig. 4 is the structural schematic diagram of another kind OLED mould group provided by the embodiments of the present application；
Fig. 5 is the structural schematic diagram of the third OLED mould group provided by the embodiments of the present application；
Fig. 6 is the concrete structure schematic diagram of packaged glass plate in a kind of OLED mould group provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram of the 4th kind of OLED mould group provided by the embodiments of the present application.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
The embodiment of the present application provides a kind of OLED mould group, to solve existing OLED mould group due to exceeding glass step
Flexible circuit board needs to bend, and causes the unmatched problem of package dimension.A kind of OLED mould group provided by the embodiments of the present application
Concrete structure schematic diagram it is as shown in Figure 3, wherein 310 be touch-control flexible circuit board, and 320 be COF, and 321 be driving flexible circuit
Plate, 330 be glass step, and 340 be packaged glass plate, and 350 be the first interface being arranged on glass step, with described the in figure
The part of one interface 350 pressing is the golden finger on the COF 320, and 360 be the second interface being arranged on glass step, figure
In with the second interface 360 pressing part be the touch-control flexible circuit board 310 on golden finger.
The upper surface of the COF 320 is provided with driving flexible circuit board 321, so that COF 320 and driving flexible electrical
Road plate 321 becomes an entirety, since the driving flexible circuit board 321 setting is on the COF 320, thus only needs pair
The COF 320 is bent beyond the part of the glass step 330, without carrying out to driving flexible circuit board 321
Bending；
The touch-control flexible circuit board 310 is arranged in 330 upper surface of glass step, the touch-control flexible circuit board
310 are located in region composed by the packaged glass plate 340 and glass step 330, in this way, it is ensured that institute
Touch-control flexible circuit board 310 is stated without departing from the glass step 330, it is curved without being carried out to touch-control flexible circuit board 310
Folding；
One end of the touch-control flexible circuit board 310 is electrical by the COF 320 and the driving flexible circuit board 321
Connection, the other end bonding of the touch-control flexible circuit board 310 on the packaged glass plate 340, due to the COF 320 with
The driving flexible circuit board 321 forms a whole, thus the touch-control flexible circuit board 310 can pass through the COF320
It is electrically connected with the driving flexible circuit board 321, in the prior art without picture, by extending touch-control flexible circuit board
Glass step out, so that touch-control flexible circuit board is directly electrically connected with driving flexible circuit board.
Golden finger is provided on the COF 320, the golden finger on the COF 320 and setting are in the glass step
The first interface 350 of 330 upper surfaces is electrically connected.
Conventionally, as the golden finger on COF is just at glass step when COF and glass step bonding
Edge, in this case, when bending to COF, the edge of glass step may hurt the golden finger on COF.
When in order to avoid bending COF, glass step edge hurts the golden finger on COF, provided by the embodiments of the present application
Golden finger in OLED mould group, when the golden finger on the COF 320 is connect with the first interface 350, on the COF 320
In glass step boundary, then at this time when bending to COF 320, the golden finger on the COF 320 is not
The problem of being in bending region, thus the golden finger on COF 320 hurt there is no glass step edge.
Golden finger is provided on the touch-control flexible circuit board 310, the golden finger on the touch-control flexible circuit board 310 with
The second interface 360 that 330 upper surface of glass step is arranged in is electrically connected, meanwhile, on the touch-control flexible circuit board 310
Golden finger when being connect with the second interface 360, the golden finger position on the touch-control flexible circuit board 310 is in the glass platform
In 330 boundary of rank.
It is connect for connecting the first interface 350 with described second as shown in figure 3, being provided on the glass step 330
The connection line of mouth 360, thus the first interface 350 and the second interface 360 are electrically connected, and since the touch-control is soft
Property circuit board 310 on golden finger and the second interface 360 be electrically connected, and the golden finger on the COF 320 with it is described
First interface 350 is electrically connected, therefore in this case, passes through the interface being arranged on the glass step 330 and company
The electric connection of the touch-control flexible circuit board 310 and COF 320 may be implemented in link.
Golden finger on the driving flexible circuit board 321 and the COF320 is electrically connected, and then may be implemented described
The electric connection of touch-control flexible circuit board 320 and the driving flexible circuit board 321.
Since the golden finger on the COF 320 needs and is arranged in the first interface of 330 upper surface of glass step
350 are electrically connected, thus the golden finger on the COF 320 is generally located on the lower surface of COF 320, and the driving is flexible
The upper surface of the COF 320 is arranged in circuit board 321, in order to can achieve the driving flexible circuit board 321 and COF
The purpose that golden finger on 320 is electrically connected, in OLED mould group provided by the embodiments of the present application, the upper surface COF320 is equipped with via hole
(non-schema) described driving flexible circuit board 321 is by being located on the via hole and the COF 320 of the upper surface COF320
Golden finger is electrically connected.
Referring to Fig. 4, being the concrete structure schematic diagram of another kind OLED mould group provided by the embodiments of the present application, wherein 410
It is the golden finger on the touch-control flexible circuit board 410 for the touch-control flexible circuit board in OLED mould group, 411,420 be OLED mould
COF in group, 421 be the driving flexible circuit board being arranged on the COF, and 422 be the golden finger on the COF, and 423 be institute
The electric connection device on COF is stated, 430 be glass step, and 440 be packaged glass plate.
In Fig. 4, it is provided on the COF and is electrically connected device 423, thus, the touch-control flexible circuit board 411 can be straight
It connected the electric connection device 423 being arranged on the COF and the COF is electrically connected, and then reach flexible with the driving
The purpose that circuit board 421 is electrically connected.
It should be noted that the touch-control flexible circuit board 411 can use following sides with the electric connection device 423
Formula connection, includes but are not limited to:
Mode 1: membrane structure connects (Film to Film, FOF)；
Mode 2: welding；
Mode 3: connector connection.
This OLED mould group shown in Fig. 4, due to being provided with interface unit, thus the one of touch-control flexible circuit board on COF
End can directly on the COF interface unit be electrically connected, compared to OLED mould group shown in Fig. 3, do not need in glass
Route for connecting COF and touch-control flexible circuit board is set on step, so that the internal components arrangement of OLED mould group is more
Rationally.
It should be noted that as shown in Figure 1, touch-control flexible circuit board 10 connects generally by hot pressing in OLED mould group
Connect (Film On Glass, FOG) technique, by thermal head by 10 bonding of touch-control flexible circuit board on packaged glass plate 50,
And it is relatively close due to 40 distance of polaroid on 10 distance packaged glass plate 50 of touch-control flexible circuit board, thus to touch-control flexibility
When circuit board 10 carries out FOG, it is easy to scald the polaroid 40, cause the damage of OLED mould group, influence the life of OLED mould group
Produce yields.
In order to avoid the above problem, the embodiment of the present application also provides a kind of OLED mould group, the specific knots of the OLED mould group
Structure schematic diagram is as shown in Figure 5, wherein 510 be the touch-control flexible circuit board in OLED mould group, and 520 be the encapsulation in OLED mould group
Glass plate, 530 be the polaroid in OLED mould group, and 540 be the COF in OLED mould group, and 541 be the drive being arranged on the COF
Dynamic flexible circuit board.
As shown in figure 5, to the touch-control at the bonding of touch-control flexible circuit board 510 described in bonding on packaged glass plate 520
510 direction of flexible circuit board extends, in OLED mould group shown in Fig. 5, the concrete shape of packaged glass plate 520 as shown in fig. 6,
At bonding of the region that dotted line frame is enclosed in Fig. 6 for touch-control flexible circuit board 510 described in bonding on packaged glass plate 520.
By the way that the shape of packaged glass plate 520 to be changed, so that touch-control flexible circuit board 510 is being bonded to encapsulation
When on glass plate 520, the polaroid 530 on the packaged glass plate 520 will be far from, so as to avoid to touch-control flexible circuit
When plate 510 carries out FOG, the polaroid 530 is scalded.
It should be noted that being arranged on glass step when the touch-control flexible circuit board in OLED mould group passes through with COF
When interface is electrically connected, such as connection type as shown in Figure 3, the connection line on glass step is required to be connected to the right at this time
In the second interface being connected with touch-control flexible circuit board, in this case, the cabling on glass step is required to connect to the right,
The trace width being likely to result on glass step increases, and then impedance is caused to increase, to influence normally making for OLED mould group
With.
In order to avoid the above problem, the embodiment of the present application also provides another OLED mould groups, in the OLED mould group, institute
State touch-control flexible circuit board include the first touch-control circuit plate and the second touch-control circuit plate, and the first touch-control circuit plate with it is described
Second touch-control circuit plate is electrically connected, so as to so that this two blocks of touch-control circuit plates can play a touch-control flexible circuit board
Effect, the concrete structure schematic diagram of the OLED mould group are as shown in Figure 7, wherein 711 be the first touch-control circuit plate, and 712 be the second touching
Circuit board is controlled, 720 be the COF of OLED mould group, and 721 be the driving flexible circuit board being arranged on the COF, and 730 be glass platform
Rank, 741 be the interface connecting with golden finger on the first touch-control circuit plate 711, and 742 are and the second touch-control circuit plate
The interface that golden finger connects on 712,751 with 752 be to connect the connection line that interface on glass step 730 is arranged in, and 760 are
Packaged glass plate.
As shown in fig. 7, the first touch-control circuit plate 711 and the second touch-control circuit plate 712 are located at the COF
720 two sides, and by the way that the first touch-control circuit plate 711 and the second touch-control circuit plate 712 to be electrically connected, so that first
Touch-control circuit plate 711 and the second touch-control circuit plate 712 can play the role of one piece of touch-control flexible circuit board, in such case
Under, when carrying out the connection of touch-control flexible circuit board and COF, the golden finger positioned at COF upper left side will be by being arranged in glass platform
Connection line on rank is electrically connected with the golden finger on the second touch-control circuit plate 712 on the left of COF, and is positioned at COF
The first touch-control circuit plate that the golden finger on upper right side will pass through the connection line being arranged on glass step be located on the right side of COF
Golden finger on 711 is electrically connected, so that the cabling on glass step is more reasonable, reduces the trace width on glass step
Increase, reduces impedance.
It should be noted that avoid when carrying out FOG to the first touch-control circuit plate 711 and the second touch-control circuit plate 712,
Scalding polaroid in one embodiment can be by 711 He of the first touch-control circuit plate described in bonding on packaged glass plate 760
Extend respectively to touch-control flexible circuit board direction at the bonding of the second touch-control circuit plate 712, so that packaged glass plate 760
Upper first touch-control circuit plate 711 and the second touch-control circuit plate 712 will be far from the polaroid on the packaged glass plate 760,
So as to avoid when carrying out FOG to touch-control flexible circuit board, polaroid is scalded.
It should also be noted that, electric connection device can also be respectively set in the two sides of the COF 720, so that institute
State the electric connection that the first touch-control circuit plate 711 and the second touch-control circuit plate 712 can directly by being arranged on the COF
Device is electrically connected with the COF 720 respectively, so reach the first touch-control circuit plate 711 and the second touch-control circuit plate 712 with
The purpose that the driving flexible circuit board 721 is electrically connected.
Since driving flexible circuit board is arranged in the upper surface COF, one end of the touch-control flexible circuit board can pass through institute
It states COF and the driving flexible circuit board is electrically connected, and table is arranged on the glass step in the touch-control flexible circuit board
Face, the touch-control flexible circuit board is located in region composed by the packaged glass plate and glass step, thus the application
In the OLED mould group of offer, only COF may exceed the glass step, then only need to exceed COF the part of glass step
It is folded into the other side of glass step, without bending driving flexible circuit board and touch-control flexible circuit board, so as to
Reduce the influence after bending to package dimension.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (6)
1. a kind of OLED mould group characterized by comprising touch-control flexible circuit board, flip chip COF, packaged glass plate and
Glass step；Wherein:
The upper surface COF is provided with driving flexible circuit board；
The touch-control flexible circuit board is arranged in glass step upper surface, and the touch-control flexible circuit board is located at the encapsulation
In region composed by glass plate and glass step；
One end of the touch-control flexible circuit board is electrically connected by the COF and the driving flexible circuit board, the touch-control
The other end bonding of flexible circuit board is on the packaged glass plate；Golden finger is provided on the COF；
Golden finger on the COF is electrically connected with the first interface that glass step upper surface is arranged in, on the COF
When golden finger is connect with the first interface, the golden finger position on the COF is in glass step boundary；
Golden finger is provided on the touch-control flexible circuit board；
Golden finger on the touch-control flexible circuit board is electrically connected with the second interface that glass step upper surface is arranged in,
Golden finger when golden finger on the touch-control flexible circuit board is connect with the second interface, on the touch-control flexible circuit board
In glass step boundary.
2. OLED mould group as described in claim 1, which is characterized in that the gold on the driving flexible circuit board and the COF
Finger is electrically connected；
The first interface and the second interface are electrically connected.
3. OLED mould group as claimed in claim 2, which is characterized in that the upper surface COF is equipped with via hole, and the driving is flexible
Circuit board is electrically connected by the golden finger being located on the via hole and the COF of the upper surface COF.
4. OLED mould group as described in claim 1, which is characterized in that touch-control flexible electrical described in bonding on the packaged glass plate
Extend at the bonding of road plate to touch-control flexible circuit board direction.
5. the OLED mould group as described in Claims 1 to 4 is any, which is characterized in that the touch-control flexible circuit board includes first
Touch-control circuit plate and the second touch-control circuit plate；
The first touch-control circuit plate and the second touch-control circuit plate are located at the two sides COF.
6. OLED mould group as claimed in claim 5, which is characterized in that the first touch-control circuit plate and second touch-control electricity
Road plate is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610930862.3A CN106504647B (en) | 2016-10-31 | 2016-10-31 | A kind of OLED mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610930862.3A CN106504647B (en) | 2016-10-31 | 2016-10-31 | A kind of OLED mould group |
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| CN106504647A CN106504647A (en) | 2017-03-15 |
| CN106504647B true CN106504647B (en) | 2019-03-19 |
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| CN201610930862.3A Active CN106504647B (en) | 2016-10-31 | 2016-10-31 | A kind of OLED mould group |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393422B (en) * | 2017-09-04 | 2019-09-27 | 武汉华星光电半导体显示技术有限公司 | Display panel and display equipment |
| CN107544185B (en) * | 2017-09-25 | 2020-08-18 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| US11039006B2 (en) | 2017-10-09 | 2021-06-15 | Huawei Technologies Co., Ltd. | Display panel module and electronic device |
| WO2020258160A1 (en) * | 2019-06-27 | 2020-12-30 | 京东方科技集团股份有限公司 | Chip-on-flex (cof), touch module and display device |
| CN110568660A (en) * | 2019-08-09 | 2019-12-13 | 惠州市华星光电技术有限公司 | Display device and method for manufacturing the same |
| CN112198981A (en) * | 2020-09-25 | 2021-01-08 | 合肥维信诺科技有限公司 | Display module, preparation method thereof and display device |
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| JP2010108501A (en) * | 2008-10-30 | 2010-05-13 | Samsung Electronics Co Ltd | Touch screen controller having increased sensing sensitivity, and display driving circuit and display device and system having the touch screen controller |
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| CN101615088A (en) * | 2008-06-23 | 2009-12-30 | 瑞鼎科技股份有限公司 | Induction installation and comprise the display system of induction installation |
| CN102597924A (en) * | 2009-10-27 | 2012-07-18 | 夏普株式会社 | Display device with attached touch panel |
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