CN201582648U - Backlight module and display device using same - Google Patents
Backlight module and display device using same Download PDFInfo
- Publication number
- CN201582648U CN201582648U CN2009201312749U CN200920131274U CN201582648U CN 201582648 U CN201582648 U CN 201582648U CN 2009201312749 U CN2009201312749 U CN 2009201312749U CN 200920131274 U CN200920131274 U CN 200920131274U CN 201582648 U CN201582648 U CN 201582648U
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- module backlight
- light
- lgp
- circuit board
- drive integrated
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Abstract
The utility model relates to a backlight module and a display device using same. The backlight module comprises a frame, a power supply/signal circuit board and a driving integrated circuit chip, wherein the driving integrated circuit chip is arranged on the surface of the power supply/signal circuit board; at least one side wall of the frame is provided with a clamping groove; and accordingly, the driving integrated circuit chip is fixedly contained in the clamping groove. In the backlight module and the display device, the side wall of the frame is provided with the clamping groove used for containing the driving integrated circuit chip, thus effectively fixing the driving integrated circuit chip onto the backlight module, leading the structure of the backlight module and the display device using same to be more compact, lighter and thinner, and improving the installation reliability.
Description
Technical field
The utility model is about a kind of module backlight, refers to the module backlight of a kind of effectively fixed drive IC wafer and light source especially and uses the display unit of this module backlight.
Background technology
In response to the compact requirement of hand-held electronic product at present, the light source on its display unit, for example (Light Emitting Diode LED) or other spot lights, is accepted by as thin as a wafer a power supply/signal circuit board light emitting diode.
The perspective exploded view of display unit that a kind of prior art discloses as shown in Figure 1, this display unit 1 comprises a module 100 backlight, a liquid crystal panel 160 and a flexible printed wiring board (Flexible Printed Circuit Board) 170.This module 100 backlight comprises a framework 110, a LGP 120, a diffusion sheet 130, one first prismatic lens 140, one second prismatic lens 150, three light emitting diodes 180 and reflector plates 190.
This framework 110 has an accommodation section 111 and a slotted eye 112.This LGP 120 is contained in this accommodation section 111, and this diffusion sheet 130, this first prismatic lens 140, this second prismatic lens 150 are cascading between this LGP 120 and this liquid crystal panel 160.This reflector plate 190 is arranged at this framework 110 bottoms, and these LGP 120 bottom surfaces are provided with relatively.This flexible printed wiring board 170 is that (Flexible Printed CircuitBoard, FPC), the one end is electrically connected at this liquid crystal panel 160 to flexible circuit board.These three light emitting diodes 180 are arranged at this flexible printed wiring board 170 surfaces.
During this display unit 1 assembling, this flexible printed wiring board 170 bends and extends to from the upper surface of framework 110 lower surface of this framework 110 downwards, coat the slotted eye 112 of framework 110, and utilize the sticking works usefulness of two-sided tape, this flexible printed wiring board 170 is fixed on this framework 110.After assembling is finished, be arranged at three light emitting diodes 180 on this flexible printed wiring board 170 and be arranged in the slotted eye 112 of this framework 110, and these three light-emitting components 180 electrically connect with this flexible printed wiring board 170, and this light-emitting component 180 adopts the lateral emitting mode light to be imported the incidence surface (not indicating) of LGP 120.
This kind design is because this flexible printed wiring board 170 needs reflexed, and these three light emitting diodes 180 only are arranged in the slotted eye 112 of this framework 110, and it relies on the support of this flexible printed wiring board 170 and is fixed in desired location.
But in view of the very property of this flexible printed wiring board 170 is lower, very the lower flexible printed wiring board 170 of property certainly will cause difficulty to effective location of this light emitting diode 180.This flexible printed wiring board 170 easily causes that because of shaking or clashing into this light emitting diode 180 misplaces.Because the light that this light emitting diode 180 penetrates is from the appropriate location incident of these LGP 120 incidence surfaces, can effectively this light be imported this LGP 120 and be transferred to this liquid crystal panel 160, so when these light emitting diode 180 dislocation, can cause the incident ray loss, influence the picture display quality of this liquid crystal panel 160.
Simultaneously, because this flexible printed wiring board 170 utilizes the gummed mode that circuit board is combined with this framework 110, therefore, sticker must enough glue to prevent this flexible printed wiring board 170 resiliences protuberance.When if this flexible printed wiring board 170 has the component of higher density because of circuit design, also the welding layout work to this light emitting diode 180 causes difficulty, makes complicated integral structure, is unfavorable for the densification development trend of product, reduce packaging efficiency, and influence the product yield.
In addition, in the driving process of this module 100 backlight, also need additionally to be provided with the drive integrated circult wafer to drive this light emitting diode 180 work, electronic components such as this drive integrated circult wafer, this light-emittingdiode 180 are the independent individuals that are separated from each other with this module 100 backlight, make that so this display unit 1 integral body is frivolous inadequately.
The utility model content
For the module backlight that overcomes prior art causes that because of shaking or clashing into electronic component dislocation and power supply/signal circuit board surface electronic component structure design complexity easily, the problem frivolous inadequately, that assembling is inconvenient is necessary to provide a kind of effective positioning electronic components, compact conformation, whole module backlight frivolous and easy to assembly.
For the display unit that overcomes prior art causes electronic component dislocation and the frivolous inadequately problem of overall structure because of shaking or clashing into easily, be necessary to provide a kind of effective positioning electronic components and frivolous display unit simple in structure.
A kind of module backlight, it comprises a framework, one power supply/signal circuit board and a drive integrated circult wafer, this drive integrated circult wafer is arranged on this power supply/signal circuit board surface, at least one sidewall of this framework is provided with a draw-in groove, and this drive integrated circult wafer is corresponding fixedly to be contained in this draw-in groove.
A kind of display unit, it comprises a display floater and a module backlight, this display floater and the superimposed setting of this module backlight, this module backlight comprises a framework, one power supply/signal circuit board and a drive integrated circult wafer, this drive integrated circult wafer is arranged on this power supply/signal circuit board surface, at least one sidewall of this framework is provided with a draw-in groove, and this drive integrated circult wafer is corresponding fixedly to be contained in this draw-in groove.
Compared to prior art, in above-mentioned module backlight, electronic component drive integrated circult wafer is arranged on power supply/signal circuit board surface, and be contained in the module backlight, and with this framework by draw-in groove accommodate cooperate fixing, should cooperate in aggregates with this drive integrated circult wafer by module backlight, effective fixedly associated electronic components, simplify package assembly, in the time of ease of assembly, make the entire aphototropism mould structure compact more, integral body is more frivolous, guarantees to be arranged on the reliability of power supply/signal circuit board surface electronic element.
Compared to prior art, in above-mentioned display unit, electronic component drive integrated circult wafer is arranged on power supply/signal circuit board surface, and is contained in the module backlight, and with this framework by draw-in groove accommodate cooperate fixing, effectively this electronic component drive integrated circult of location is in this module backlight, and cooperate with this module backlight in aggregates, effectively fixing associated electronic components, simplify package assembly, in the time of ease of assembly, make whole display device structure compact more, integral body is more frivolous.
Description of drawings
Fig. 1 is a kind of perspective exploded view of prior art display unit.
Fig. 2 is the perspective exploded view of display unit that first embodiment of the invention discloses.
Fig. 3, Fig. 4 are the Assembly Action schematic diagrames of display unit shown in Figure 2.
Fig. 5 is the broken section enlarged diagram of display unit shown in Figure 2 along the V-V line.
Fig. 6 is the part section enlarged diagram of display unit shown in Figure 2 along the V-V line.
The specific embodiment
Please refer to Fig. 2, is the perspective exploded view of display unit that first embodiment of the invention discloses.This display unit 2 comprises a module 200 backlight, first power supply/signal circuit board 300 and a display floater 400.The setting that is superimposed with each other of this module backlight 200 and this display floater 400.This first power supply/signal circuit board 300 1 ends are electrically connected with this display floater 400, this first power supply/signal circuit board 300 other ends receive the extraneous signal of telecommunication and transfer to this display unit 2, and it is provided with power interface (figure does not show), ground connection mouth (figure does not show) and a plurality of control interface (figure does not show).
This module 200 backlight comprises a framework 210, a LGP 220, a diffusion sheet 230, one first prismatic lens 240, one second prismatic lens 250, a shading rubber belt 260, one second source/signal circuit board 270, a drive integrated circult wafer (Integrate Circuit Chip, IC) 271, three light-emitting components 280 and a reflector plate 290.
This framework 210 is rectangular hollow frameworks, and it comprises two pairs of the first side walls that are arranged in parallel 211, second sidewall 212, the 3rd sidewall 213 and the 4th sidewall 214.This first side wall 211 is parallel to each other with this second sidewall 212 and is provided with at interval, the 3rd sidewall 213 is parallel to each other equally with the 4th sidewall 214 and is provided with at interval, this first, second sidewall 211,212 is perpendicular to the 3rd, the 4th sidewall 213,214, this four sidewall 211,212,213,214 is end to end successively, and surrounds a sealing receiving space 215.A wall extension 216 is extended in these framework 210 inboards, and it is divided into two parts up and down with this receiving space 215.This first side wall 211 is provided with a draw-in groove 2111 and three light source slots 2112 near these receiving space 215 side surfaces.
This LGP 220 is whole rectangular acrylic plates, in order to the guiding light beam.Side at this LGP 220 is provided with plurality of bump (not indicating), and this LGP 220 is fixed in the receiving space 215 of this framework 210 in the tenon mode of closing.This LGP 220 comprises an incidence surface 221, an exiting surface 222 and a bottom surface 223.This incidence surface 221 is wherein sides of this LGP 220, and wherein the incidence surface 221 of this LGP 220 is provided with near the first side wall 211 of framework 210.This exiting surface 222 is oppositely arranged with this bottom surface 223, and this incidence surface 221 is provided with this exiting surface 222 and this bottom surface 223 adjacency.
This reflector plate 290 is blooming pieces of a tool high reflectance, and this reflector plate 290 is arranged at this framework 210 bottoms, and the bottom surface 223 of this this LGP 220 is provided with relatively.
This diffusion sheet 230, first prismatic lens 240, second prismatic lens 250 all are transmissive optical diaphragms.This diffusion sheet 230 changes the beam Propagation direction of passing it, improves the optics uniformity.This first prismatic lens 240, second prismatic lens 250 change the light beam convergence angle respectively from different directions, improve the beam intensity of passing it.Side at this blooming piece 230,240,250 is provided with plurality of bump (not indicating), and this projection is corresponding with the projection of LGP 220, this diffusion sheet 230, this first prismatic lens 240 and this second prismatic lens 250 are cascading in exiting surface 222 sides of this LGP 220, and are successively from bottom to top: this diffusion sheet 230, this first prismatic lens 240, this second prismatic lens 250.
This shading rubber belt 260 is located between this liquid crystal panel 400 and this second prismatic lens 250, and this shading rubber belt 260 is hollow square frames, and hollow region is with transmitted light.
This display floater 400 is contained in this this framework 210, and these wall extension 216 upper surfaces of an end surfaces butt, and correspondence is contained in the first half of these framework 210 receiving spaces 215.
This second source/signal circuit board 270 is flexible printed wiring boards, this flexible printed wiring board is a kind of flexible circuit board that can transmit power supply signal and data-signal, and the corresponding electric connections such as power interface, ground connection mouth and a plurality of control interfaces of this second source/signal circuit board 270 and this first power supply/signal circuit board 300.
This drive integrated circult wafer 271 is drive integrated circults, and it is in order to drive this module 200 work backlight, and it is arranged on this second source/signal circuit board 270 surfaces.This light-emitting component 280 is arranged at this second source/signal circuit board 270 surfaces equally, and wherein this light-emitting component 280 is spot lights, as: light-emittingdiode etc.This drive integrated circult wafer 271 and this light-emitting component 280 can be by band automated bonding packaged type (TapeAutomatic Bonding, TAB) (Chip on film, COF) mode realizes being electrically connected with this second source/signal circuit board 270 wafer package or on the film.
This second source/signal circuit board 270 comprise one in order to main circuit district 273 and that drive integrated circult wafer 271 is set in order to the light source setting area 274 of light-emitting component 280 to be set.This light source setting area 274 is provided with these 273 spaces, main circuit district.Each light source setting area 274 is provided with a light-emitting component 280.
Please refer to Fig. 3, Fig. 4, be this display unit 2 Assembly Action schematic diagrames.This second source/signal circuit board 270 is state before the bending in Fig. 3, this second source/signal circuit board 270 is bending back state in Fig. 4.
In assembling process, these second source/signal circuit board 270 1 ends are electrically connected at this first power supply/signal circuit board 300, and upwards bending of the lower surface of this framework 210 certainly, coat the first side wall 211 parts of this framework 210, adopt the adhesive tape bonding mode that this second source/signal circuit board 270 is sticked on this framework 210 simultaneously.After assembling was finished, the second source/signal circuit board 270 after the bending cooperated the draw-in groove 2111 of this first side wall 211 and the light source slot 2112 of this first side wall 211 to surround a plurality of semiclosed accommodation spaces respectively to accommodate this drive integrated circult wafer 271 and this light-emitting component 280.
Please be the section enlarged diagram of three-dimensional assembling schematic diagram shown in Figure 4 simultaneously with reference to Fig. 5.Adhesive effect by adhesive tape, make the light source setting area 274 of this second source/signal circuit board 270 be parallel to the upper and lower surface of framework 210, and, guarantee that this light-emitting component 280 and this drive integrated circult wafer 271 close on incidence surface 221 settings of this LGP 220 perpendicular to the incidence surface 221 of this LGP 220.
Equally, the appearance profile of this light-emitting component 280 is consistent with the inner surface profile of this light source slot 2112, and the light-emitting component 280 that is arranged at this light source setting area 274 is nested in the light source slot 2112 of framework 210, the external form profile phase of the shape of this light source slot 2112 and this light-emitting component 280 coincide, the light-emitting area 281 of this light-emitting component 280 is near the incidence surface 221 of LGP 220, and the light-emitting area of this light-emitting component 280 is relative with the incidence surface 221 of this LGP 220.The inner surface profile of the outline of this drive integrated circult wafer 271 and this draw-in groove 2111 matches, make this drive integrated circult wafer 271 be fixed on this framework 210, this drive integrated circult wafer 271, this light-emitting component 280 and this frame set are combined into an integral body, effectively fix this electronic component drive integrated circult wafer 271, this light-emitting component 280, avoid it because of vibrations or the dislocation displacement that causes of bump etc., simplify entire aphototropism mould 200, make overall structure compact more, ease of assembly.
Simultaneously, the degree of depth of the height of this drive integrated circult wafer 271 less than this draw-in groove 2111 is set, then when this drive integrated circult wafer 271 is contained in this draw-in groove 2111, this drive integrated circult wafer 271 is contained in this draw-in groove 2111 fully, can not increase the integral thickness of module 200 backlight because of this drive integrated circult wafer 271 is set.The height of this light-emitting component 280 is also less than the degree of depth of this light source slot 2112, then when this light-emitting component 280 is contained in this light source slot 2112, this light-emitting component 280 is contained in this light source slot 2112 fully, can not increase the integral thickness of module 200 backlight because of this light-emitting component 280 is set equally.So, make entire aphototropism mould 200 and use display unit 2 integral body of this module 200 backlight more frivolous.
When these display unit 2 work, the demonstration signal that these second source/signal circuit board 270 outputs produce from this display floater 400, and the light signal of these light-emitting component 280 generations, the light of these light-emitting component 280 luminous generations, part imports from this incidence surface 221 of LGP 220, part light is reflected into this LGP 220 via this reflector plate 290, and then injects this display floater 400 via the exiting surface 222 of this LGP 220.
In above-mentioned display unit 2, this second source/signal circuit board 270 also can be a soft or hard convolution circuit board, position in this light source setting area 274 and this main circuit district 273 is provided with one deck supporting material, improves the very property in this light source setting area 274 and this main circuit district 273.
In above-mentioned display unit 2,273 surfaces, main circuit district of this second source/signal circuit board 270 can apply one deck reflective material, improve the light utilization of light-emitting component 280.273 surfaces, main circuit district of this second source/signal circuit board 270 can apply one deck and inhale the optical activity material, avoid light to form the bright line defective in incidence surface 221 sides of this LGP 220.
According to the above, the light-emitting component 280 of being located at this light source setting area 274 is between this display floater 400 and this framework 210, be embedded in simultaneously in the draw-in groove 2111 of this framework 210, therefore, this light-emitting component 280 is combined with these LGP 220 edges, this light-emitting component 280 utilizes this display floater 400 and 210 original spaces of this framework simultaneously, and is embedded in the structure in this framework 210, does not influence the thickness of display unit 2.
Seeing also Fig. 6 again, is the perspective exploded view of the display unit of second embodiment of the invention.This display unit 5 is with the difference of a last embodiment: the draw-in groove 5211 that is used to accommodate this drive integrated circult wafer 571 is arranged on this LGP 520 and closes on this incidence surface 521 ends, engage mutually by draw-in groove by between this drive integrated circult wafer 571 and this LGP 520, make that these module 500 integral body backlight are integrated, effectively fix this electronic component drive integrated circult wafer 571.Equally, this light source slot 5211 is arranged on this LGP 520 equally and closes on the first side wall 511 sides, these light-emitting component 580 same nested being arranged in this LGP 520, fix the relative position relation of itself and peripheral element by the light source slot 5212 of this LGP 520, avoid it because of vibrations or the dislocation displacement that causes of bump etc., simplify sidewall 511 structures of this framework 510, and then simplify the structure of entire aphototropism mould 500, make overall structure compact more, ease of assembly.
Simultaneously, because this electronic component: drive integrated circult wafer 571 and this light-emitting component 580 are effectively fixing, avoid it to move relative to this LGP 520, reduce fiber-loss, improve the display quality of the display unit 5 of using this module 500 backlight.
Claims (10)
1. module backlight, it comprises a framework, one power supply/signal circuit board and a drive integrated circult, this drive integrated circult is arranged on this power supply/signal circuit board surface, this drive integrated circult comprises the drive integrated circult wafer, it is characterized in that: at least one sidewall of this framework is provided with a draw-in groove, and this drive integrated circult wafer is corresponding fixedly to be contained in this draw-in groove.
2. module backlight as claimed in claim 1 is characterized in that: the height of this drive integrated circult wafer is less than the degree of depth of this draw-in groove.
3. module backlight as claimed in claim 1, it is characterized in that: this module backlight also comprises a plurality of spot lights that are arranged at this power supply/signal circuit board surface, this sidewall also comprises a plurality of light source slots, these a plurality of spot light correspondences are contained in these a plurality of light source slots, and the height of this spot light is less than the degree of depth of this light source slot.
4. module backlight as claimed in claim 3 is characterized in that: this module backlight also comprises a LGP, and a plurality of sidewalls of this framework surround a receiving space, and this LGP is contained in this receiving space.
5. module backlight as claimed in claim 4 is characterized in that: this LGP comprises an incidence surface and a bottom surface, and this incidence surface closes on this bottom surface and is provided with, and this light source is a light emitting diode, and the light-emitting area of this light emitting diode is corresponding to the incidence surface of this LGP.
6. module backlight as claimed in claim 4 is characterized in that: this LGP closes on the incidence surface end and is provided with a plurality of light source slots, and these a plurality of spot light correspondences are accommodated respectively and are fixed in this light source slot.
7. display unit as claimed in claim 1, it is characterized in that: this power supply/signal circuit board is a flexible circuit board, this drive integrated circult is electrically connected with this flexible circuit board by wafer package mode on band automated bonding packaged type or the film, is bonded in the framework surface by adhesive tape simultaneously.
8. display unit, it comprises a display floater and a module backlight, this display floater and the superimposed setting of this module backlight, it is characterized in that: this module backlight is as the described module backlight of claim 1-7.
9. display unit as claimed in claim 8 is characterized in that: this module backlight also comprises a plurality of blooming pieces, and these a plurality of blooming pieces are folded between this LGP and this display floater.
10. display unit as claimed in claim 8 is characterized in that: this display unit more comprises a reflector plate, and this reflector plate bottom surface of this LGP relatively is provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201312749U CN201582648U (en) | 2009-04-30 | 2009-04-30 | Backlight module and display device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201312749U CN201582648U (en) | 2009-04-30 | 2009-04-30 | Backlight module and display device using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201582648U true CN201582648U (en) | 2010-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201312749U Expired - Lifetime CN201582648U (en) | 2009-04-30 | 2009-04-30 | Backlight module and display device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201582648U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102102834A (en) * | 2010-12-31 | 2011-06-22 | 友达光电股份有限公司 | Backlight module |
| CN103912824A (en) * | 2013-11-15 | 2014-07-09 | 厦门天马微电子有限公司 | Backlight source and display device |
| CN107110441A (en) * | 2014-12-26 | 2017-08-29 | 夏普株式会社 | Lighting device and display device |
| CN107111048A (en) * | 2014-12-26 | 2017-08-29 | 夏普株式会社 | Lighting device and display device |
| CN112859399A (en) * | 2021-02-02 | 2021-05-28 | 河源思比电子有限公司 | Manufacturing method and device of TFT (thin film transistor) liquid crystal display module and storage medium |
-
2009
- 2009-04-30 CN CN2009201312749U patent/CN201582648U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102102834A (en) * | 2010-12-31 | 2011-06-22 | 友达光电股份有限公司 | Backlight module |
| CN102102834B (en) * | 2010-12-31 | 2012-12-12 | 友达光电股份有限公司 | Backlight module |
| CN103912824A (en) * | 2013-11-15 | 2014-07-09 | 厦门天马微电子有限公司 | Backlight source and display device |
| CN107110441A (en) * | 2014-12-26 | 2017-08-29 | 夏普株式会社 | Lighting device and display device |
| CN107111048A (en) * | 2014-12-26 | 2017-08-29 | 夏普株式会社 | Lighting device and display device |
| US10018868B2 (en) | 2014-12-26 | 2018-07-10 | Sharp Kabushiki Kaisha | Optical and positioning structures, illumination device, and display device having the same |
| CN107111048B (en) * | 2014-12-26 | 2020-03-27 | 夏普株式会社 | Illumination device and display device |
| CN112859399A (en) * | 2021-02-02 | 2021-05-28 | 河源思比电子有限公司 | Manufacturing method and device of TFT (thin film transistor) liquid crystal display module and storage medium |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100915 |
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| CX01 | Expiry of patent term |