CN107544185B - Array substrate, display panel and display device - Google Patents
Array substrate, display panel and display device Download PDFInfo
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- CN107544185B CN107544185B CN201710879907.3A CN201710879907A CN107544185B CN 107544185 B CN107544185 B CN 107544185B CN 201710879907 A CN201710879907 A CN 201710879907A CN 107544185 B CN107544185 B CN 107544185B
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Abstract
The patent refers to the field of 'semiconductor devices and electric solid state devices'. The frame area is provided with two first binding areas for connecting the first specification of the chip on film and two second binding areas for connecting the second specification of the chip on film; the second binding region is provided with a connecting electrode for connecting the first binding region; the display panel comprises the array substrate; the display device comprises the display panel. The application can be applied to the technical field of display.
Description
Technical Field
The application relates to the technical field of display, in particular to an array substrate, a display panel and a display device.
Background
The design of an Integrated Circuit (IC) of an embedded Touch screen (incoll Touch panel) is different from that of a common Liquid Crystal Display (LCD), and pins of the embedded Touch screen need to be designed with pins of a Touch (Touch) signal transmission Line in addition to pins of a display signal transmission Line (Data Line); at present, the integrated circuit design of Chip On Flex (COF) of the in-cell touch product is not compatible with the common liquid crystal display.
For example, for 14.0 Full High Definition (FHD) High aperture ratio Advanced Super Dimensional field Switching (HADS) Dual Gate (Dual Gate) products, 2880 connection lines (channels) are required for Normal Bonding Pad. Each 48mm sized COF is provided with 960 connecting wires, and 3 48mm sized COFs are required to meet the design requirements of the product.
However, in the 14.0FHD HADS dual-gate in-cell touch product, a plurality of connecting wires for transmitting touch signals are required; if the chip on film with the specification of 48mm is still adopted, the Pitch (Pitch) of the binding area of each chip on film reaches about 20um, which exceeds the process limit of product manufacturing; therefore, the 70mm specification of the chip on film is required to be used to replace the 48mm specification of the chip on film, so as to meet the design requirements of the product.
In addition, in the production process of the array substrate, if the array substrate for the common liquid crystal product is changed into the array substrate for the embedded touch product, the Mask (Mask) design and the pad design, including at least 3 Mask plates including a Gate (Gate) layer, a protective layer (PVX) and an Indium Tin Oxide (ITO) layer, need to be changed; this alteration process will also result in an increase in manufacturing costs.
Disclosure of Invention
The technical problem solved by the application is to provide an array substrate, a display panel and a display device, which can effectively overcome the problem that the array substrate of the existing common liquid crystal product and the array substrate of the embedded touch product cannot be compatible.
In order to solve the technical problem, the application provides an array substrate, which comprises a display area and a frame area located at the periphery of the display area;
the frame area is provided with two first binding areas for connecting the first specification of the chip on film and two second binding areas for connecting the second specification of the chip on film;
the second binding region is provided with a connecting electrode for connecting the first binding region.
The array substrate can also have the following characteristics,
the two first binding regions are located in a region between the two second binding regions.
The array substrate can also have the following characteristics,
the two second binding regions are located in a region between the two first binding regions.
The array substrate can also have the following characteristics,
the first binding region and the second binding region are arranged at intervals.
The array substrate can also have the following characteristics,
one end of the connecting electrode is connected with part of the connecting lines of the first binding region, and the other end of the connecting electrode is connected with each connecting line of the second binding region.
The array substrate can also have the following characteristics,
one end of the connecting electrode is connected with 2-3 connecting wires of the first binding region.
The array substrate can also have the following characteristics,
the first binding area is provided with 960 connecting lines for binding a 48mm chip on film.
The array substrate can also have the following characteristics,
the second binding area is provided with 1920 connecting lines for binding the chip on film with the specification of 70 mm.
In order to solve the above technical problem, the present application further provides a display panel including the array substrate.
In order to solve the above technical problem, the present application further provides a display device including the foregoing display panel.
The above technical scheme of this application has following beneficial effect:
compared with the prior art, the array substrate of the common liquid crystal product and the array substrate of the embedded touch product can be effectively solved by the arrangement of the first binding area, the second binding area and the connecting electrodes, the problem that the array substrate of the common liquid crystal product and the array substrate of the embedded touch product cannot be compatible can be effectively solved, and the mask plate can be effectively prevented from being changed so as to realize that the touch function and the non-touch function of the flip chip film share the same array substrate.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the invention. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.
Fig. 1 is a schematic structural diagram of an array substrate according to a first embodiment of the invention;
FIG. 2 is a diagram illustrating a binding region according to a first embodiment of the present invention;
illustration of the drawings:
1-display area, 2-frame area, 21-first binding area, 22-second binding area, 23-connection electrode, 24-binding mark.
Detailed Description
Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
At present, a common liquid crystal product generally has 3 groups of binding regions for binding a flip chip film, and taking an FHD Dual Gate product as an example, each group of binding regions needs 960 connecting lines to realize normal transmission of display signals and common voltage signals.
In the prior art, the design of an embedded touch product is different from that of a common liquid crystal product. Taking Chip On Glass (COG) products fixed On a Glass substrate as an example, connecting lines for display signals are generally arranged in the middle area, and connecting lines for touch signals are arranged in the two side areas; the connecting line of the common voltage signal needs to be connected with the binding region of the touch signal through the binding region of the display signal, and then input into the substrate to perform corresponding routing. When the array substrate of the embedded touch product uses a touch function or does not use the touch function, the design and routing of a binding area are different, the design of a mask plate and the design of a bonding pad need to be changed, and at least 3 mask plates including a grid layer, a protective layer and an indium tin oxide layer need to be changed.
In order to effectively solve the problem that an array substrate of an existing common liquid crystal product is incompatible with an array substrate of an embedded touch product, the embodiment of the invention provides an array substrate and a display panel.
The technical solution of the embodiment of the present invention is further described below by the structural arrangement of the array substrate.
The first embodiment is as follows:
referring to fig. 1 and 2, a first embodiment of the present invention provides an array substrate, including a display area 1 and a frame area 2 located at a periphery of the display area 1; the frame area 2 is provided with two first binding areas 21 for connecting the first specification flip chip film and two second binding areas 22 for connecting the second specification flip chip film, and the second binding areas 22 are provided with connecting electrodes 23 for connecting the first binding areas 21.
In the specific operation, the input of the display signal required by the work of the common liquid crystal product can be realized through the setting of the first binding region 21; the input of the touch signal of the embedded touch product and the input of the common voltage signal of the common liquid crystal product can be realized through the setting of the second binding region 22; when the product needs a touch function, the first binding area 21 binds the first specification flip chip film to transmit a display signal, and the second binding area 22 binds the second specification flip chip film to transmit a touch signal and a common voltage signal; when the product does not need a touch function, the first binding area 21 can be bound with the chip on film with the corresponding specification, the connecting line of the first binding area 21 transmits a display signal, and the connecting line of the second binding area 22 receives a common voltage signal through the connecting electrode 23 and inputs the common voltage signal into the substrate; the optimal arrangement can effectively overcome the problem that the array substrate of a common liquid crystal product is incompatible with the array substrate of an embedded touch product, and can also effectively avoid changing a mask plate so as to realize that the flip chip thin films with touch control function and non-touch control function share the same array substrate.
In the present embodiment, two first bonded regions 21 are located in a region between two second bonded regions 22; namely, the binding region for binding the first specification flip chip film is positioned at the inner side, and the binding region for binding the second specification flip chip film is positioned at the outer side, so that the convenient and fast connection line arrangement is realized.
It should be noted that the two second binding regions 22 may also be located in the region between the two first binding regions 21; alternatively, the first binding region 21 and the second binding region 22 may be provided at an interval.
In a specific operation, whether the connecting electrode 23 is trimmed or not can be selected through laser so as to realize switching between a connection state and a disconnection state of the connecting electrode 23; when the connection electrode 23 is in a connection state, the first binding region 21 binds a chip on film corresponding to a common liquid crystal product, and a common voltage signal required by the common liquid crystal product can be transmitted to the inside of the array substrate through the connection electrode 23 via the second binding region 22; when the connection electrode 23 is in the off state, the first bonding region 21 transmits the display signal, and the second bonding region 22 can be used for bonding the second specification flip chip film to transmit the corresponding touch signal and the common voltage signal.
In this embodiment, 960 connection lines are disposed in the first bonding area 21, and the first bonding area can be used for bonding a 48mm sized chip on film; correspondingly, the second bonding area 22 is provided with 1920 connecting lines, which can be used for bonding 70mm sized flip chip.
In the specific operation, the first binding area 21 binds the chip on film with the specification of 48mm, so that the transmission operation of the display signal can be realized; when the touch function is not involved, the connection electrode 23 is in a connection state, and a common voltage signal input by a 48mm specification flip-chip film can be input into the array substrate through the second binding region 22 via the connection electrode 23. When the touch function is involved, the connection electrode 23 is in a disconnected state, the first bonding region 21 bonds the 48mm sized flip chip film to meet the transmission requirement of the display signal, and the second bonding region 22 bonds the 70mm sized flip chip film to meet the transmission requirement of the touch signal and the common voltage signal.
In this embodiment, one end of the connection electrode 23 is connected to a portion of the connection lines of the first bonding region 21, and the other end is connected to each of the connection lines of the second bonding region 22. In a specific operation, one end of the connection electrode 23 may be connected to 2 to 3 connection lines of the first bonding region 21, so as to implement an input operation of a common voltage signal required for a general liquid crystal display.
In this embodiment, the touch control adopts a time-sharing driving mode, and the driving signals of the display time period and the touch control time period are processed separately. In the display time interval, the data lines are supplied with display signals by the data driving circuit, the touch control electrodes are multiplexed as common electrodes, the touch control signal lines are multiplexed as common electrode lines, the touch control signal lines provide common voltage for the touch control electrodes, and the touch control signal scanning is not performed, so that normal display is ensured. In the touch control time interval, the touch control driving circuit scans the touch control signal through the touch control signal line, at the moment, one frame of display is finished, the display state is basically not influenced by the touch control signal, and the touch control driving circuit and the touch control signal line work independently in a time-sharing mode.
In this embodiment, the frame area is provided with 4 binding marks 24, and the 4 binding marks 24 include 2 binding marks located in the middle and at the bonding specification of 48mm of the flip chip, and 2 binding marks located at the two ends and used for binding the flip chip with the specification of 70 mm; by setting the binding mark 24, the precise binding operation of the chip on film can be realized.
Example two:
the second embodiment of the invention provides a display panel, which comprises the array substrate described in the first embodiment.
Example three:
the second embodiment of the invention provides a display device, which comprises the display panel described in the second embodiment.
In the description of the present application, the terms "disposed," "connected," "fixed," and the like are used in a broad sense, for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood by those skilled in the art that the embodiments of the present invention are described above, but the descriptions are only for the purpose of facilitating understanding of the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the embodiments of the invention as defined by the appended claims.
Claims (6)
1. An array substrate comprises a display area and a frame area positioned at the periphery of the display area; it is characterized in that the preparation method is characterized in that,
the frame area is provided with two first binding areas for connecting the first specification of the chip on film and two second binding areas for connecting the second specification of the chip on film; the first binding region and the second binding region are arranged at intervals; the first binding area is provided with 960 connecting lines for binding a chip on film with the specification of 48mm, and the second binding area is provided with 1920 connecting lines for binding a chip on film with the specification of 70 mm;
the second binding region is provided with a connecting electrode used for being connected with the first binding region, one end of the connecting electrode is connected with part of connecting lines of the first binding region, and the other end of the connecting electrode is connected with each connecting line of the second binding region.
2. The array substrate of claim 1,
the two first binding regions are located in a region between the two second binding regions.
3. The array substrate of claim 1,
the two second binding regions are located in a region between the two first binding regions.
4. The array substrate of claim 1,
one end of the connecting electrode is connected with 2-3 connecting wires of the first binding region.
5. A display panel comprising the array substrate according to any one of claims 1 to 4.
6. A display device characterized by comprising the display panel according to claim 5.
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| CN201710879907.3A CN107544185B (en) | 2017-09-25 | 2017-09-25 | Array substrate, display panel and display device |
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| CN201710879907.3A CN107544185B (en) | 2017-09-25 | 2017-09-25 | Array substrate, display panel and display device |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110596970B (en) * | 2019-08-27 | 2020-12-04 | 深圳市华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN115145065A (en) * | 2021-03-31 | 2022-10-04 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof, display device and splicing display device |
| CN113759620B (en) * | 2021-08-19 | 2023-09-29 | 北海惠科光电技术有限公司 | Display panel and display device |
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