CN106497511A - A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature - Google Patents
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature Download PDFInfo
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- CN106497511A CN106497511A CN201610976640.5A CN201610976640A CN106497511A CN 106497511 A CN106497511 A CN 106497511A CN 201610976640 A CN201610976640 A CN 201610976640A CN 106497511 A CN106497511 A CN 106497511A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, is made up of the raw material of following weight portion：Vinyl-terminated silicone fluid 1 40 50, vinyl-terminated silicone fluid 2 50 60,12% platinum catalyst 0.38 0.5, ethynylcyclohexanol 0.02 0.04, vinyl polysiloxane 25 30,1 allyloxy 2,3 expoxy propane 14.8 16.8,1,3,5,7 tetramethyl-ring tetrasiloxanes 23 25, silane coupling A 1712.7 3.6, appropriate containing hydrogen silicone oil, nanometer zinc ferrite 2.4 3, polyacrylic acid 1 1.4, animal glue 0.8 1.2, stibium oxide 1.8 2.5, dehydrated alcohol 28 35, palladium dydroxide 0.2 0.3, appropriate deionized water；Casting glue good flowing properties prepared by the present invention, easy to use, with excellent flame retardant and heat conductivility, it is worthy to be popularized.
Description
Technical field
The present invention relates to printed-circuit board encapsulating glue technical field, more particularly to a kind of continuously can use at high temperature
PCB organic silicon electronic potting adhesive.
Background technology
With the fast development of electronic science and technology, electronic component, device, instrument and instrument are obtained in the electronics industry
It is widely applied.As the working environment of many electronic equipments is complicated and changeable, exceedingly odious natural bar can be run into even sometimes
Part, is to protect electronic component and integrated circuit not to be affected by working environment, improves the electric property and stability of electronic device, tastes
Tasting needs to carry out embedding protection to electronic equipment.Embedding is one of important procedure of electronic components, and it is by Embedding Material
It is filled in the space of electronic device with the method such as mechanical or manual, machine-shaping under certain condition makes device inside
The operating procedure that electronic component and circuit are environmentally isolated with.At present, electronic component and integrated circuit forward direction high-performance, densification,
High accuracy and powerful direction are fast-developing, and this necessarily causes the caloric value of electronic device to greatly improve.Meanwhile, electronics device
The miniaturization of part strongly reduces its heat-dissipating space again, and heat dissipation channel is more crowded, causes heat to gather in a large number, if heat is not
Timely and effectively can conduct, it will the operating temperature of circuit is increased rapidly, cause electronic device failure probability into
Increase again, have a strong impact on the stability and reliability of electronic device, or even the service life that electronic equipment can be shortened.Therefore, use
To not only there is good electrical insulation capability should also have the higher capacity of heat transmission in the Embedding Material of electronic device, in order to avoid height
Cause Embedding Material to catch fire under the working condition such as voltage and electric discharge, also require that Embedding Material has good fire resistance, additionally,
In order to prevent moisture and harmful gass from causing the pollution and corrosion of circuit board, Embedding Material sea by the gap between electronic device
English has good adhesive property.Organosilicon material has excellent electrical insulation capability, especially additional organosilicon casting glue
During solidification, the consumption of catalyst is less, and no coupling product is produced, and the dimensional stability of solidfied material is high, and linear shrinkage is low, and chemistry is steady
Qualitative good, thus development prospect is extensively, but to there is low thermal conductivity, anti-flammability and adhesive property poor for common organic silicon potting adhesive
The shortcomings of, have a strong impact on range of application, although embedding can be improved by a large amount of heat filling, fire retardant and bonding agents of adding
The performance of glue, but the mechanical property of casting glue, processing characteristics can be had adverse effect on, so the Halogen resistance of research autohension
Combustion heat conduction additional organosilicon casting glue has important theory significance and application prospect.
Huang Zhibin exists《The preparation and performance study of heat conductive transparent organic silicon potting adhesive》In one text, by vinyl silicone oil
Studied with the architectural characteristic and reinforced filling Miscibility, the species of viscosifier of containing hydrogen silicone oil etc., be prepared for possessing good
The organic silicon potting adhesive of good mechanical property, optical property and adhesive property, have studied VMQ silicones, nano silicon, thickening
The impact to casting glue performance such as agent, on this basis, adds heat filling nano aluminium oxide and nano zine oxide, is prepared for having
The organic silicon potting adhesive of standby high intensity, high heat conductance and high transmission rate, and have studied nanoparticle, coupling agent modified etc. to filling
The impact of sealing performance.As a result show the vinyl-terminated silicone fluid of viscosity 19mPa S and 3000mPa S with mass ratio 8:100 compoundings
Based on polymer, add reactive hydrogen mass fraction be 0.8% containing hydrogen silicone oil, make mol ratio n（Si-H）：n（Si-Vi）For
The consumption of 1.2, VMQ silicones prepares the LED casting glues of optimal synthesis performance when being 30phr, synthesized not using additive reaction
Congener viscosifier DA, DAVE and DAVM, the wherein casting glue of DAVM possess optimal adhesive property and optical property, to leading
Hot filler carries out surface silanization process, and the thermal conductivity and refractive index of casting glue are gradually increasing, light transmittance, thermal coefficient of expansion and body
Product resistivity is gradually lowered, and thermostability is significantly improved.But the casting glue synthesized in article is not met by PCB circuits on market
Use requirement of the plate to casting glue, and various aspects of performance is not high, it is necessary to further improve and could expand use range.
Content of the invention
The object of the invention is exactly the defect in order to make up prior art, there is provided a kind of PCB that continuously can be used at high temperature
Circuit board organic silicon electronic potting adhesive.
The present invention is achieved by the following technical solutions：
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, by the raw material system of following weight portion
Prepare into：- 1 40-50 of vinyl-terminated silicone fluid, -2 50-60 of vinyl-terminated silicone fluid, 12% platinum catalyst 0.38-0.5, acetylene basic ring
Hexanol 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,7- tetramethyls
Basic ring tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, nanometer zinc ferrite 2.4-3, polyacrylic acid
1-1.4, animal glue 0.8-1.2, stibium oxide 1.8-2.5, dehydrated alcohol 28-35, palladium dydroxide 0.2-0.3, appropriate deionized water.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, by following concrete step
Suddenly make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature under agitation
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanometer zinc ferrite and polyacrylic acid are added in the 7-9 times of deionized water that measures, high-temperature are risen and is heated at 60-80 DEG C
Stirring 3-4h, obtains nanometer zinc ferrite dispersion liquid, and it is that 7-9 is standby to adjust pH value, and animal glue, stibium oxide and dehydrated alcohol are added to
In deionized water, 60-70 DEG C is heated to, adds above-mentioned nanometer zinc ferrite dispersion liquid and palladium dydroxide stirring reaction 1-2h, instead
1-2h should be dried at being placed in after terminating 130-150 DEG C in microwave dryer, be crushed after cooling standby；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, pours in mould
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, the end-vinyl
The viscosity of silicone oil -1 is 300mPa s, and contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s,
Contents of ethylene is 0.8mol%.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, described Silicon Containing Hydrogen
In oil, active hydrogen content is 0.50Wt%, and the addition of containing hydrogen silicone oil is n (Si-H)：n（Si-Vi）For 1.2-1.4.
It is an advantage of the invention that：Vinyl silicone oil is one of most basic composition of additional organosilicon casting glue, the present invention
Tensile strength and hardness, elongation at break are obtained by the vinyl silicone oil compounding for selecting different viscosities coefficient and contents of ethylene
With all higher organic silicon potting adhesive of elasticity, containing hydrogen silicone oil as cross-linking agent, when its active hydrogen content is higher, with organosilicon embedding
The crosslink density of glue will be larger, and stress can be made to be dispersed on more strands, higher tensile strength, hardness is shown
And elongation at break, but when active hydrogen content is too high, crosslinking rate is too fast, and strand has little time to form perfect cross-linked network
Network, and side reaction is also susceptible under the catalyst of Karst, make in organic silicon potting adhesive, to form more bubble, cause to lack
Fall into, so it is that 0.5Wt% is more suitable that the present invention selects active hydrogen content, the present invention selects vinyl polysiloxane to fill out as reinforcement
Material, be because with contents of ethylene is more, outer layer by organic team knowledge, molecular weight is little the characteristics of, and and organic silicon potting adhesive
There is good dispersion and the compatibility, preferable mobility and the transparency can be kept, and also can be occurred with containing hydrogen silicone oil
Hydrosilylation, it is possible to increase the mechanical property of casting glue, because the universal non-binding of organosilicon material, with base after solidification
There are space, the infiltration of long-time steam to cause fault occur between material, the present invention utilizes chemical reactive synthesis viscosifier, energy
The enough caking property for effectively improving organic silicon potting adhesive, tensile shear strength, do not affect viscosity and mobility, the present invention also to utilize
Filler improves the heat conductivity and anti-flammability of casting glue, but filler has pole with matrix in terms of molecular structure and physical property
Big difference, and the dispersibility of system is poorer, and the thermal conductivity of casting glue is lifted and is more difficult to, and the surface modification of filler can promote filler
Dispersion in the base, reduces the interface resistance on direction of heat flow, so as to can effectively lift the performances such as the thermal conductivity of system, profit
The stable dispersion liquid rich in surfactant is made with nanometer zinc ferrite, can form good dividing in water or solvent
Dissipate, fire-retardant glue made by recycling stibium oxide and nanometer zinc ferrite dispersion liquid mechanical mixture prepares compounded mix, improves filling
The heat conduction of sealing, insulation, the performance such as fire-retardant, casting glue good flowing properties prepared by the present invention, easy to use, solidfied material has excellent
Good fire-retardant and heat conductivility, can be widely applied to the fields such as electronic apparatus, chip package, LED encapsulation, and use range is wide, is worth
Promote.
Specific embodiment
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, by following weight portion（Public
Jin）Raw material make：Vinyl-terminated silicone fluid -1, vinyl-terminated silicone fluid -2,12% platinum catalyst 0.38, ethynylcyclohexanol
0.02nd, vinyl polysiloxane 25,1- allyloxy -2,14.8,1,3,5,7- tetramethyl-ring tetrasiloxane 23, silicon of 3- expoxy propane
Alkane coupling agent A171 2.7, appropriate containing hydrogen silicone oil, nanometer zinc ferrite 2.4, polyacrylic acid 1, animal glue 0.8, stibium oxide 1.8, nothing
Water-ethanol 28, palladium dydroxide 0.2, appropriate deionized water.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, by following concrete step
Suddenly make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2h at 40 DEG C, then rises high-temperature to 68 under agitation
DEG C reaction 2h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanometer zinc ferrite and polyacrylic acid are added in the deionized water of 7 times of amounts, high-temperature are risen to heated and stirred at 60 DEG C
3h, obtains nanometer zinc ferrite dispersion liquid, and regulation pH value is standby for 7, and animal glue, stibium oxide and dehydrated alcohol are added to deionized water
In, 60 DEG C are heated to, above-mentioned nanometer zinc ferrite dispersion liquid and palladium dydroxide stirring reaction 1h is added, reaction is placed in micro- after terminating
1h is dried at 130 DEG C in ripple drying machine, is crushed standby after cooling；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35min and obtains B component, by component A and B component according to mass ratio 1；1 in high speed shear
Mixed in the presence of dispersion, be placed in vacuum drying oven（Vacuum is MPa）Deaeration 10min, pour in mould 110 DEG C solid
Change 2h and obtain organic silicon potting adhesive.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, the end-vinyl
The viscosity of silicone oil -1 is 300mPa s, and contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s,
Contents of ethylene is 0.8mol%.
A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, described Silicon Containing Hydrogen
In oil, active hydrogen content is 0.50Wt%, and the addition of containing hydrogen silicone oil is n (SiH)：n（SiVi）For 1.2.
According to casting glue prepared by embodiment, performance test is carried out to which, as a result as follows：
Thermal conductivity（W/m•K）：0.66；Tensile strength（MPa）：3.4；Shear strength（MPa）：1.7；Specific insulation（Ω•cm）：
2.6×1015；Anti-flammability (UL94；V 0)：Pass through；Dielectric constant（50HZ）：3.4；Percentage elongation（%）：260.
Claims (4)
1. a kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature, it is characterised in that by following heavy
The raw material of amount part is made：- 1 40-50 of vinyl-terminated silicone fluid, -2 50-60 of vinyl-terminated silicone fluid, 12% platinum catalyst 0.38-
0.5th, ethynylcyclohexanol 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,
1,3,5,7- tetramethyl-ring tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, nanometer zinc ferrite
2.4-3, polyacrylic acid 1-1.4, animal glue 0.8-1.2, stibium oxide 1.8-2.5, dehydrated alcohol 28-35, palladium dydroxide 0.2-
0.3rd, appropriate deionized water.
2. a kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature according to claim 1, its
It is characterised by, is made up of following concrete steps：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature under agitation
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanometer zinc ferrite and polyacrylic acid are added in the 7-9 times of deionized water that measures, high-temperature are risen and is heated at 60-80 DEG C
Stirring 3-4h, obtains nanometer zinc ferrite dispersion liquid, and it is that 7-9 is standby to adjust pH value, and animal glue, stibium oxide and dehydrated alcohol are added to
In deionized water, 60-70 DEG C is heated to, adds above-mentioned nanometer zinc ferrite dispersion liquid and palladium dydroxide stirring reaction 1-2h, instead
1-2h should be dried at being placed in after terminating 130-150 DEG C in microwave dryer, be crushed after cooling standby；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, pours in mould
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
3. a kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature according to claim 1-2,
Characterized in that, the viscosity of the vinyl-terminated silicone fluid -1 is 300mPa s, contents of ethylene is 1.92mol%, end-vinyl silicon
The viscosity of oil -2 is 1000mPa s, and contents of ethylene is 0.8mol%.
4. a kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature according to claim 1-2,
Characterized in that, active hydrogen content is 0.50Wt% in described containing hydrogen silicone oil, and the addition of containing hydrogen silicone oil is n (Si-H)：
n（Si-Vi）For 1.2-1.4.
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| CN201610976640.5A CN106497511A (en) | 2016-11-08 | 2016-11-08 | A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature |
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| CN201610976640.5A CN106497511A (en) | 2016-11-08 | 2016-11-08 | A kind of PCB organic silicon electronic potting adhesive that continuously can be used at high temperature |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534276A (en) * | 2020-05-26 | 2020-08-14 | 唐山三友硅业有限责任公司 | Low-density adhesive type flame-retardant silicone rubber and preparation method thereof |
-
2016
- 2016-11-08 CN CN201610976640.5A patent/CN106497511A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534276A (en) * | 2020-05-26 | 2020-08-14 | 唐山三友硅业有限责任公司 | Low-density adhesive type flame-retardant silicone rubber and preparation method thereof |
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