CN106496522A - A kind of alkali solubility light-cured epoxy acrylate and preparation method and its etching resisting ink - Google Patents
A kind of alkali solubility light-cured epoxy acrylate and preparation method and its etching resisting ink Download PDFInfo
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- CN106496522A CN106496522A CN201610884210.0A CN201610884210A CN106496522A CN 106496522 A CN106496522 A CN 106496522A CN 201610884210 A CN201610884210 A CN 201610884210A CN 106496522 A CN106496522 A CN 106496522A
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- 0 CC(C=C)OCC(CCC1C(*(C)*c2cccc(*(C)Cc(cccc3)c3OCC(COC(C=C)=O)OC(CC(CC=C*)C(O)=O)=O)c2OCC(COC(C=C)=O)OC(CC(CC=C*)CO*O)=O)=CC=CC1)OC(CC(CC=C*)C(C)=O)=O Chemical compound CC(C=C)OCC(CCC1C(*(C)*c2cccc(*(C)Cc(cccc3)c3OCC(COC(C=C)=O)OC(CC(CC=C*)C(O)=O)=O)c2OCC(COC(C=C)=O)OC(CC(CC=C*)CO*O)=O)=CC=CC1)OC(CC(CC=C*)C(C)=O)=O 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention belongs to UV curable ink technical field, discloses a kind of alkali solubility light-cured epoxy acrylate and preparation method and the UV solidification etching resisting inks based on which and application.The alkali solubility light-cured epoxy acrylate of the present invention has structure shown in following formula：The alkali solubility light-cured epoxy acrylate has that esterification yield is high, photo-curing rate is fast, the degree of cross linking is high, hardness is high and the features such as alkali solubility, and which contains carboxyl, through with ammonia or organic amine in and after generation ammonium salt, water miscible UV oligomer can be obtained.The present invention also provides a kind of UV etching resisting inks based on which, based on the alkali solubility light-cured epoxy acrylate, the UV etching resisting inks of resin only need 30s i.e. curable using ultra violet lamp, have preferable chemical-resistant, hardness high, and under high alkali liquid, directly immersion can realize rapidly thoroughly disengaging, not hinder base material.The alkali solubility light-cured epoxy acrylate and its UV etching resisting inks of the present invention is can be widely used in printed wiring board technique.
Description
Technical field
The invention belongs to UV curable ink technical field, more particularly to a kind of alkali solubility light-cured epoxy acrylate
With preparation method and the UV solidification etching resisting inks based on which and application.
Background technology
Wiring board is the important component in electronic system, and it has almost been applied in all electronic products.In circuit
In the production technology of plate, chemical method for etching is typically adopted, using need before acid or alkaline etching liquid will not with etching resisting ink
The Copper Foil protection of etching is needed, after etching is completed, etching resisting ink is removed with high alkali liquid etc..Alkali-soluble ultraviolet light is typically adopted
Key component of the curing anti-etching printing ink as liquid photosensitive resist.Alkali solubility light-cured resin is that printed wiring board is successful
Key, it play of crucial importance to the manufacture crafts such as front baking, development, exposure, resist layer adhesive force, hardness, laser curing velocity
Effect.Although the needs of the anti-etching printing ink of production basic adaptation automated production in exposed and developed performance at present,
Its ink film has that softening temperature is relatively low and to the less weak point of the adhesive force of copper-clad plate, and this not only affects continuous and automatic
The efficiency of production, also declines the yields of product.
Content of the invention
In order to overcome the shortcoming of above-mentioned prior art and deficiency, the primary and foremost purpose of the present invention to be to provide a kind of alkali solubility light
Cured epoxy acrylic.Alkali solubility light-cured epoxy acrylate its matrix resin of the present invention not only has can be by ultraviolet light
The double bond of initiation, also containing substantial amounts of polar group, greatly improves the adhesive force of ink, and pre-polymerization resin is easily eluted, can answer
For the preparation of screen printing etch wiring board, production efficiency is improve.
Another object of the present invention is to provide a kind of preparation method of above-mentioned alkali solubility light-cured epoxy acrylate.
Still a further object of the present invention is that providing a kind of UV solidifications based on above-mentioned alkali solubility light-cured epoxy acrylate resists
Erosion ink.The UV solidification etching resisting inks have the characteristics such as high, the good, chemicals-resistant of adhesive force of excellent film forming, hardness, dense
Can be eluted in alkali lye.
Still a further object of the present invention is to provide above-mentioned UV solidifications application of the etching resisting ink in printed wiring board field.
The purpose of the present invention is realized by following proposal：
A kind of alkali solubility light-cured epoxy acrylate, with structure shown in following formula：
The alkali solubility light-cured epoxy acrylate of the present invention has the features such as esterification yield is high, and hardness is high, not by illumination
There is alkali solubility during crosslinking, can be eluted with weak lye.And the solidify coating formed in illumination curing has excellent chemical-resistant.
The present invention a kind of preparation method of above-mentioned alkali solubility light-cured epoxy acrylate is also provided, by epoxy resin with
Acrylic acid (AA) carries out esterification with acid anhydrides after carrying out ring-opening reaction again, obtains alkali solubility light-cured epoxy acrylate.
Further, said method is reacted with acrylic acid (AA) by epoxy resin, obtains epoxy acrylate, epoxy radicals
The hydroxyl of group's open loop gained carries out esterification with acid anhydrides, obtains the alkali solubility light-cured epoxy propylene for possessing a large amount of acidic-groups
Acid esters.
The reaction equation of above-mentioned preparation method is as follows：
Above-mentioned preparation method specifically includes following steps：
(1) epoxy resin is preheated to 70～90 DEG C, adds polymerization inhibitor, then be warming up to 80～100 DEG C, catalyst is added dropwise,
Acrylic acid is added, is reacted 3～6 hours, is obtained epoxy acrylate；
(2) step (1) reaction system is cooled to 40 DEG C, adds dissolving acid anhydrides in a solvent, react 4～6 hours, obtain
Arrive alkali solubility light-cured epoxy acrylate.
In above-mentioned preparation method, the mol ratio of epoxy resin, acrylic acid and acid anhydrides used is preferably (0.8～1.2)：1：
(0.8～1).
In above-mentioned preparation method, the mol ratio of acrylic acid used and acid anhydrides is preferably 1:1.
Acid anhydrides used is preferably dodecenylsuccinic anhydride (DDSA), nonenyl succinic acid acid anhydride, 2- octenyl succinic acid anhydrides
In at least one, more preferably dodecenylsuccinic anhydride.
Polymerization inhibitor described in step (1) is preferably hydroquinones, adjacent methyl hydroquinone, MEHQ, to benzene
At least one in quinone and 2,6- di-tert-butyl-4-methy phenol, more preferably hydroquinones.
0.5～1.0wt% of the amount of polymerization inhibitor used for content of epoxy resin in step (1).
Catalyst described in step (1) be triethylamine, triethanolamine, TBAB, tetramethyl ammonium chloride, N, N-
At least one in dimethyl benzylamine and triphenylphosphine, preferably triphenylphosphine.
In step (1), the amount of used catalyst is catalytic amount.
In step (1), epoxy resin used is preferably novolac epoxy resin.
In step (2), the solvent of dissolving acid anhydrides used is preferably acetone, dichloromethane.
Step (2) overall reaction terminate after can by add hot water stirs washing with remove unreacted acid anhydrides, polymerization inhibitor and
Catalyst；Separate again and remove a layer liquid, be put in vacuum drying oven 60 DEG C and dry 24h and obtain dry product.
Above-mentioned reaction is preferably carried out under atmosphere of inert gases.
Present invention also offers a kind of UV solidification etching resisting inks based on above-mentioned alkali solubility light-cured epoxy acrylate.Should
UV solidification etching resisting inks have noresidue, easily peelable performance, only need 30s i.e. curable using ultra violet lamp, under high alkali liquid
Directly soak, you can realize that rapidly coating thoroughly departs from, do not hinder base material.Which contains above-mentioned alkali solubility light-cured epoxy acrylic acid
Ester, with excellent film forming, in the presence of photo initiator, there is photo-crosslinking in the position of ultraviolet light, form UV
Solidify coating, gained coating chemical-resistant is strong, adhesive force is good, can be applicable in printed wiring board field.And due to the UV admittedly
Change etching resisting ink and contain above-mentioned alkali solubility light-cured epoxy acrylate, alkali solubility is not had by illumination position, weak base can be used
Liquid is eluted.And the solidify coating for being formed, the corrosion of strong acid etc. is resistant to, after the completion of etch process, can be by high alkali liquid immersion stripping
From, noresidue, application prospect is extensive.
Described in above-mentioned UV solidifications etching resisting ink, light trigger can be benzoin ethyl ether, two ketal of benzil, 2- hydroxyl -2-
Methyl isophthalic acid-phenylacetone, 1- hydroxy benzenes hexyl acetophenones, benzophenone/triethanolamine, benzophenone/acrylate reactive amine
In at least one.The consumption of the light trigger is preferably the 3～5% of alkali solubility light-cured epoxy acrylate quality.
The alkali solubility light-cured epoxy acrylate of the present invention is can be applicable in printed wiring board field.
The UV solidification etching resisting inks of the present invention are can be applicable in printed wiring board field.
The present invention introduces acrylic double bond by the carboxyl in acrylic acid and epoxy addition esterification, gives epoxy third
Olefin(e) acid ester photo-curable.By the esterification with acid anhydrides, in epoxy acrylate introduce polar group carboxyl, using its with
The effect being chemically bonded between metal base, significantly improves the adhesive force of film, while substantial amounts of carboxyl has pre-polymerization resin
There is alkali solubility.And the present invention use be long alkane chain acid anhydrides, increased the content of Long carbon chain in resin, improve coating
Toughness and wearability.With figuratum " film " mask substrate of band, selective ultraviolet light is carried out to the pre-polymerization resin for coating,
The decomposition of initiator of part is shone, and free radical is produced so as to initiated polymerization.Without ultraviolet light part, coating does not occur
Cross-linking polymerization, alkali solubility hydrophilic group are reacted with alkali lye because of (- COOH), so as to be dissolved.And the coating portion after being polymerized
Divide because molecular weight increases and forms dimensional network structure, the solubility in sig water declines, so as to make it have slightly solubility,
Could demoulding in high alkali liquid.
The present invention is had the following advantages and beneficial effect relative to prior art：
(1) alkali solubility light-cured epoxy acrylate of the invention has esterification yield high, and photo-curing rate is fast, and the degree of cross linking is high
The features such as.
(2) alkali solubility light-cured epoxy acrylate of the invention has higher hardness and alkali solubility.
(3) alkali solubility light-cured epoxy acrylate preparation method is simple of the invention, with the alkali solubility light-cured epoxy
Based on acrylate, the UV etching resisting inks of resin only need 30s i.e. curable using ultra violet lamp, can be widely used in print
In circuit board technique processed.
(4) the UV etching resisting inks of resin based on alkali solubility light-cured epoxy acrylate of the invention have preferably
Chemical-resistant, hardness are high, and under high alkali liquid, directly immersion can realize rapidly thoroughly disengaging, not hinder base material.
(5) present invention synthesis alkali solubility light-cured epoxy acrylate contain carboxyl, through with ammonia or organic amine in and after
Ammonium salt is generated, water miscible UV oligomer can be obtained.
Description of the drawings
Fig. 1 is the applicating flow chart that UV of the present invention solidifies etching resisting ink.
Fig. 2 is the infrared spectrogram of the alkali solubility light-cured epoxy acrylate that embodiment 1 is prepared.
Specific embodiment
With reference to embodiment, the present invention is described in further detail, but embodiments of the present invention not limited to this.
Reagent used in the following example can be obtained from commercial channel.
Embodiment 1：A kind of preparation of alkali solubility light-cured epoxy acrylate
Under nitrogen protection, 50g epoxy resin is added in the 250mL there-necked flasks equipped with dropping funel and agitator
NPPN-638, is warming up to 80 DEG C, adds hydroquinone of polymerization retarder 0.20g, is warming up to 90 DEG C, catalyst is added dropwise after stirring 15min
(epoxy radicals is 1 with acrylic acid mol ratio for triphenylphosphine 0.5g and acrylic acid 19.82g:1), react 5.5 hours.Then will be anti-
Answer system to be cooled to 40 DEG C, add the dodecenylsuccinic anhydride being dissolved in 20mL dichloromethane with acrylic acid equivalent
26.97g, reacts 5 hours.Reaction adds hot water stirs to wash three times to remove unreacted acid anhydrides, polymerization inhibitor and urge after terminating
Agent.A layer liquid is removed in separation, is put in vacuum drying oven 60 DEG C and is dried 24h, obtains alkali solubility light-cured epoxy acrylate.Right
Which carries out infrared spectrum analysis, as a result sees Fig. 2.
Embodiment 2：A kind of preparation of alkali solubility light-cured epoxy acrylate
Under nitrogen protection, 50g epoxy resin is added in the 250mL there-necked flasks equipped with dropping funel and agitator
NPPN-638, adds hydroquinone of polymerization retarder 0.25g, is warming up to 95 DEG C, catalyst triphenylphosphine 0.5g is added dropwise after stirring 15min
(epoxy radicals is 1 with acrylic acid mol ratio with acrylic acid 17.83g:0.9), react 4 hours.Then reaction system is cooled to
50 DEG C, the dodecenylsuccinic anhydride 24.52g being dissolved in 20mL acetone with acrylic acid equivalent is added, reacted 4 hours.Instead
Hot water stirs should be added after terminating to wash three times to remove unreacted acid anhydrides, polymerization inhibitor and catalyst.A layer liquid is removed in separation,
It is put in vacuum drying oven 60 DEG C and dries 24h, obtains alkali solubility light-cured epoxy acrylate.
Embodiment 3：A kind of preparation of alkali solubility light-cured epoxy acrylate
Under nitrogen protection, 50g epoxy resin is added in the 250mL there-necked flasks equipped with dropping funel and agitator
NPPN-638, is warming up to 90 DEG C, adds hydroquinone of polymerization retarder 0.33g, is warming up to 100 DEG C, catalyst is added dropwise after stirring 15min
(epoxy radicals is 1 with acrylic acid mol ratio for triphenylphosphine 0.5g and acrylic acid 21.80g:1.1), react 3 hours.Then will be anti-
Answer system to be cooled to 60 DEG C, add the dodecenylsuccinic anhydride 29.67g being dissolved in 20mL acetone with acrylic acid equivalent,
Reaction 3 hours.Reaction adds hot water stirs to wash three times to remove unreacted acid anhydrides, polymerization inhibitor and catalyst after terminating.Point
From supernatant liquid is taken, it is put in vacuum drying oven 60 DEG C and dries 24h, obtain alkali solubility light-cured epoxy acrylate.
Embodiment 4：Comparative example 1
Under nitrogen protection, 50g epoxy resin is added in the 250mL there-necked flasks equipped with dropping funel and agitator
NPPN-638, is warming up to 85 DEG C, adds hydroquinone of polymerization retarder 0.25g, is warming up to 95 DEG C, catalyst is added dropwise after stirring 15min
(epoxy radicals is 1 with acrylic acid mol ratio for triphenylphosphine 0.5g and acrylic acid 18.81g:0.9).Reaction 4 hours, steams through decompression
Solvent is removed in distillation, and modified epoxy acrylate is obtained.
Properties of product are tested：
3wt% light triggers are added toward above-described embodiment 1～4 in the epoxy acrylate for preparing respectively
Irgacure1173, fully dissolves the mode after stirring through glass bar roller coating and is coated on copper sheet surface, shape with a small amount of solvent
Into the uniform coating that thickness is 35～70 μm, place a period of time solvent is volatilized naturally pre-polymerization coating, using high-pressure sodium lamp
Or Halogen lamp LED (mJ/cm2) irradiation coating 1min or so, obtain solidify coating.
Respectively the performance of above-mentioned pre-polymerization coating and the coating after ultra-violet curing is tested, method of testing is as follows：Attachment
Force test method：GB/T9286-1998
Hardness measuring method：GB/T6739-1996
Water resistance testing method：GB/T1733-1993
Resistance to acids and bases method of testing：It is separately immersed in the Na of 10wt%2CO3In sig water, NaOH high alkali liquids and HCl solution,
The state of film on observation copper sheet.Test result is as shown in table 1.The applicating flow chart of UV solidification etching resisting inks is shown in Fig. 1.
Test result shows that the pre-polymerization coating of the non-illumination curing of the present invention possesses preferable alkali solubility, 1～3 institute of embodiment
Obtained coating has excellent adhesive force, hardness, resistance to acids and bases, and the ink coating after being fully cured is formed on the surface to copper
Plate has the protective coating of excellent adhesive attraction, can be in the corrosion of opposing weak lye in a period of time, easy demoulding under aqueous alkali.
The UV etching resisting ink coating test results of 1 epoxy acrylate of table
| Test event | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 |
| Consume during sig water wash-out pre-polymerization coating | <3min | <3min | <3min | >12h |
| Adhesive force | 3B | 3B | 3B | 0B |
| Hardness | 5H | 4H | 4H | 5H |
| Acid resistance (h) | >12 | >12 | >12 | >12 |
| The 10wt%Na of resistance to sig water2CO3(h) | >2 | >2 | >2 | >12 |
| The 10wt%NaOH of resistance to high alkali liquid | <10min | <10min | <10min | >12h |
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not by above-described embodiment
Limit, other any Spirit Essences without departing from the present invention and the change, modification, replacement that is made under principle, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (10)
1. a kind of alkali solubility light-cured epoxy acrylate, it is characterised in that with structure shown in following formula：
2. the preparation method of the alkali solubility light-cured epoxy acrylate described in a kind of claim 1, it is characterised in that by ring
Oxygen tree fat carries out esterification with acid anhydrides after carrying out ring-opening reaction with acrylic acid again, obtains alkali solubility light-cured epoxy acrylic acid
Ester.
3. the preparation method of alkali solubility light-cured epoxy acrylate according to claim 2, it is characterised in that by ring
Oxygen tree fat and propylene acid reaction, obtain epoxy acrylate, and the hydroxyl of epoxide group open loop gained carries out esterification with acid anhydrides,
Obtain alkali solubility light-cured epoxy acrylate.
4. the preparation method of alkali solubility light-cured epoxy acrylate according to claim 2, it is characterised in that concrete wrap
Include following steps：
(1) epoxy resin is preheated to 70～90 DEG C, adds polymerization inhibitor, then be warming up to 80～100 DEG C, catalyst is added dropwise, added
Acrylic acid, reacts 3～6 hours, obtains epoxy acrylate；
(2) step (1) reaction system is cooled to 40 DEG C, adds dissolving acid anhydrides in a solvent, react 4～6 hours, obtain alkali
Dissolubility light-cured epoxy acrylate.
5. the preparation method of alkali solubility light-cured epoxy acrylate according to claim 4, it is characterised in that：Ring used
The mol ratio of oxygen tree fat, acrylic acid and acid anhydrides is (0.8～1.2)：1：(0.8～1).
6. the preparation method of alkali solubility light-cured epoxy acrylate according to claim 4, it is characterised in that：Acid used
Acid anhydride is dodecenylsuccinic anhydride, nonenyl succinic acid acid anhydride, at least one in 2- octenyl succinic acid anhydrides.
7. the preparation method of alkali solubility light-cured epoxy acrylate according to claim 4, it is characterised in that：Described
Polymerization inhibitor is hydroquinones, adjacent methyl hydroquinone, MEHQ, 1,4-benzoquinone and 2,6 di tert butyl 4 methyl phenol
In at least one；0.5～1.0wt% of the amount of polymerization inhibitor used for content of epoxy resin；Described catalyst be triethylamine,
Triethanolamine, TBAB, tetramethyl ammonium chloride, N, at least one in N- dimethyl benzylamines and triphenylphosphine；Used
The solvent of dissolving acid anhydrides is acetone or dichloromethane.
8. a kind of UV solidifies etching resisting ink, it is characterised in that containing the alkali solubility light-cured epoxy acrylic acid described in claim 1
Ester.
9. application of the alkali solubility light-cured epoxy acrylate described in claim 1 in printed wiring board field.
10. UV solidification applications of the etching resisting ink in printed wiring board field described in claim 8.
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| CN108034041A (en) * | 2017-12-25 | 2018-05-15 | 广东炎墨科技有限公司 | Alkali solubility photo-curing epoxy resin containing cinnamic acid or coumarin group and preparation method thereof and the solder resist using its preparation |
| CN108410255A (en) * | 2018-05-31 | 2018-08-17 | 丰顺县三和电子材料有限公司 | Low energy UV photocuring circuit inks and preparation method thereof |
| CN108976899A (en) * | 2018-05-31 | 2018-12-11 | 丰顺县三和电子材料有限公司 | Low energy UV photocuring solder mask and preparation method thereof |
| CN109401426A (en) * | 2018-12-07 | 2019-03-01 | 鹤山市炎墨科技有限公司 | High-flexibility photocureable coating and preparation method thereof |
| CN112011031A (en) * | 2020-08-12 | 2020-12-01 | 湖南松井新材料股份有限公司 | Negative photoresist resin, preparation method thereof and negative photoresist |
| CN112063226A (en) * | 2020-10-23 | 2020-12-11 | 无锡博加电子新材料有限公司 | Photocuring PCB circuit board protective ink |
| CN112266708A (en) * | 2020-10-27 | 2021-01-26 | 中科院广州化学有限公司 | Developable anti-sand-blasting multifunctional protective material and preparation method and application thereof |
| CN112812274A (en) * | 2020-12-30 | 2021-05-18 | 鹤山市炎墨科技有限公司 | Epoxy resin with anti-silver-streak property for photocuring solder resist coating and preparation method thereof |
| CN113307946A (en) * | 2021-06-03 | 2021-08-27 | 广州亦盛环保科技有限公司 | Silane-modified alkali-soluble flexible epoxy acrylic resin, preparation method and photocuring glass protection ink containing same |
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