CN117304741B - Solder resist ink for packaging substrate and preparation method thereof - Google Patents
Solder resist ink for packaging substrate and preparation method thereof Download PDFInfo
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- CN117304741B CN117304741B CN202311248432.XA CN202311248432A CN117304741B CN 117304741 B CN117304741 B CN 117304741B CN 202311248432 A CN202311248432 A CN 202311248432A CN 117304741 B CN117304741 B CN 117304741B
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- epoxy resin
- component
- solder resist
- resist ink
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 68
- 238000006243 chemical reaction Methods 0.000 claims abstract description 61
- -1 modified acrylic ester Chemical class 0.000 claims abstract description 60
- 239000003822 epoxy resin Substances 0.000 claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000002904 solvent Substances 0.000 claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000012745 toughening agent Substances 0.000 claims abstract description 31
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 30
- 239000000178 monomer Substances 0.000 claims abstract description 28
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims abstract description 24
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims abstract description 24
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 21
- 239000002253 acid Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 50
- 238000002156 mixing Methods 0.000 claims description 40
- 238000003756 stirring Methods 0.000 claims description 39
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 34
- 239000013067 intermediate product Substances 0.000 claims description 26
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 26
- 239000004843 novolac epoxy resin Substances 0.000 claims description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 16
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 16
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 14
- 239000000047 product Substances 0.000 claims description 14
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 13
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000004103 aminoalkyl group Chemical group 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000003995 emulsifying agent Substances 0.000 claims description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 3
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 claims description 2
- KIKYOFDZBWIHTF-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-3-ene-1,2-dicarboxylate Chemical compound C1CC=CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KIKYOFDZBWIHTF-UHFFFAOYSA-N 0.000 claims description 2
- 239000002736 nonionic surfactant Substances 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 4
- 239000000976 ink Substances 0.000 description 48
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 40
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 30
- 239000011790 ferrous sulphate Substances 0.000 description 22
- 235000003891 ferrous sulphate Nutrition 0.000 description 22
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 22
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 22
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 22
- 239000008367 deionised water Substances 0.000 description 20
- 229910021641 deionized water Inorganic materials 0.000 description 20
- 238000001035 drying Methods 0.000 description 20
- 239000012299 nitrogen atmosphere Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 13
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 12
- 235000019441 ethanol Nutrition 0.000 description 12
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 239000000839 emulsion Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 10
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 10
- 239000012295 chemical reaction liquid Substances 0.000 description 10
- 239000012043 crude product Substances 0.000 description 10
- 238000004108 freeze drying Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000007873 sieving Methods 0.000 description 10
- 238000005119 centrifugation Methods 0.000 description 8
- YYKBWYBUCFHYPR-UHFFFAOYSA-N 12-bromododecanoic acid Chemical compound OC(=O)CCCCCCCCCCCBr YYKBWYBUCFHYPR-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 125000005250 alkyl acrylate group Chemical group 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 125000004185 ester group Chemical group 0.000 description 4
- 238000009863 impact test Methods 0.000 description 4
- PFNCOYVEMJYEED-UHFFFAOYSA-N 16-bromohexadecanoic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCBr PFNCOYVEMJYEED-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical group C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 2
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 2
- 229940043264 dodecyl sulfate Drugs 0.000 description 2
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229940065472 octyl acrylate Drugs 0.000 description 2
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical group [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- GAWAYYRQGQZKCR-REOHCLBHSA-N (S)-2-chloropropanoic acid Chemical compound C[C@H](Cl)C(O)=O GAWAYYRQGQZKCR-REOHCLBHSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- YAQLSKVCTLCIIE-UHFFFAOYSA-N 2-bromobutyric acid Chemical compound CCC(Br)C(O)=O YAQLSKVCTLCIIE-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- RVBUZBPJAGZHSQ-UHFFFAOYSA-N 2-chlorobutanoic acid Chemical compound CCC(Cl)C(O)=O RVBUZBPJAGZHSQ-UHFFFAOYSA-N 0.000 description 1
- XFRBTQMRZOIMKM-UHFFFAOYSA-N 20-bromoicosanoic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCBr XFRBTQMRZOIMKM-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
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- 229920000298 Cellophane Polymers 0.000 description 1
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- RZLXRFDFCORTQM-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O RZLXRFDFCORTQM-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229910021549 Vanadium(II) chloride Inorganic materials 0.000 description 1
- 229910021551 Vanadium(III) chloride Inorganic materials 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
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- 238000005054 agglomeration Methods 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- HIVLDXAAFGCOFU-UHFFFAOYSA-N ammonium hydrosulfide Chemical compound [NH4+].[SH-] HIVLDXAAFGCOFU-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- GUPWNYUKYICHQX-UHFFFAOYSA-N carbonobromidic acid Chemical compound OC(Br)=O GUPWNYUKYICHQX-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229920006235 chlorinated polyethylene elastomer Polymers 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- AOGYCOYQMAVAFD-UHFFFAOYSA-N chlorocarbonic acid Chemical compound OC(Cl)=O AOGYCOYQMAVAFD-UHFFFAOYSA-N 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- IMBKASBLAKCLEM-UHFFFAOYSA-L ferrous ammonium sulfate (anhydrous) Chemical compound [NH4+].[NH4+].[Fe+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O IMBKASBLAKCLEM-UHFFFAOYSA-L 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PZDUWXKXFAIFOR-UHFFFAOYSA-N hexadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C=C PZDUWXKXFAIFOR-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- OGUCKKLSDGRKSH-UHFFFAOYSA-N oxalic acid oxovanadium Chemical compound [V].[O].C(C(=O)O)(=O)O OGUCKKLSDGRKSH-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- ITAKKORXEUJTBC-UHFFFAOYSA-L vanadium(ii) chloride Chemical compound Cl[V]Cl ITAKKORXEUJTBC-UHFFFAOYSA-L 0.000 description 1
- HQYCOEXWFMFWLR-UHFFFAOYSA-K vanadium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[V+3] HQYCOEXWFMFWLR-UHFFFAOYSA-K 0.000 description 1
- UUUGYDOQQLOJQA-UHFFFAOYSA-L vanadyl sulfate Chemical compound [V+2]=O.[O-]S([O-])(=O)=O UUUGYDOQQLOJQA-UHFFFAOYSA-L 0.000 description 1
- 229940041260 vanadyl sulfate Drugs 0.000 description 1
- 229910000352 vanadyl sulfate Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/108—Hydrocarbon resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The invention relates to a packaging substrate solder resist ink and a preparation method thereof, wherein the solder resist ink comprises a component A and a component B, and the component A comprises the following components in parts by weight: 10-50 parts of alkali-soluble o-cresol formaldehyde epoxy resin, 1-10 parts of active monomer, 1-5 parts of modified MBS resin, 1-10 parts of photoinitiator, 1-10 parts of auxiliary agent and 10-30 parts of solvent; the component B comprises the following components in parts by weight: 1-10 parts of epoxy resin, 1-10 parts of solvent and 1-10 parts of toughening agent; wherein the modified MBS resin is obtained by the reaction of butadiene, styrene, modified acrylic ester, acrylic ester and pentaerythritol tetraacrylate; the modified acrylic ester is obtained by reacting acrylic amino alkyl ester with halogenated alkyl acid. The invention can obviously improve mechanical properties such as toughness and the like of the ink, simultaneously maintain stronger stability and higher glass transition temperature, and overcome the defects in the prior art.
Description
Technical Field
The invention relates to the technical field of solder resist ink, in particular to solder resist ink for a packaging substrate and a preparation method thereof.
Background
The packaging substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaging product, improvement of electric performance and heat dissipation, and ultrahigh density or multi-chip modularization.
The photo-curing solder resist ink is one of key materials of the packaging substrate, and is a protective coating covered on a printed circuit copper wire, so that the circuit is prevented from being corroded to break, the short circuit between wires is prevented from being caused by a plurality of welding points, the attachment amount of soldering tin can be regulated, the dissolved pollution of copper in the welding lines is reduced, the soldering tin is saved, the weight of an instrument is reduced, the high density of wiring is increased, the cold joint is avoided, the inspection speed is improved, and the requirements of the packaging substrate such as high definition, dense holes, high resolution and the like can be met.
The traditional solder resist ink for the packaging substrate is generally composed of components such as a polymerization monomer, a photoinitiator, a polymerization inhibitor and the like. Currently, a large number of photo-curable solder resist inks are used in solder resist films, which generally include a photopolymerization initiator and a photo-curable and thermosetting resin composition containing carboxyl groups. The photo-curable and thermosetting resin is generally epoxy acrylic resin, and has the advantages of good photo-curability, good developing property and the like, but the toughness and impact resistance of the cured film after curing are not high, cracks are easily generated on the surface of the solder resist cured film during a high-low temperature cold-hot cycle impact test, further, the solder is easy to foam or drop oil, and the requirements cannot be met during high-requirement BGA application.
In order to solve the above problems, the solder resist ink is toughened by adding flexible epoxy resin and the like, but the glass transition temperature (Tg) of the solder resist ink is reduced due to the addition of the flexible epoxy resin, which is unfavorable for the high temperature performance of the solder resist ink. Therefore, how to provide a solder resist ink with high mechanical property, high stability and other performances is a problem to be solved in the field.
In view of the foregoing, it is necessary to develop a new technical solution to solve the drawbacks of the prior art.
Disclosure of Invention
Based on the above, the invention provides a solder resist ink for a package substrate and a preparation method thereof. The modified MBS resin is adopted as a component, and the components are butadiene, styrene, modified acrylic ester, acrylic ester and pentaerythritol tetraacrylate which are obtained by reaction, so that the modified MBS resin has good dispersibility and compatibility, and after being compounded with the components such as epoxy resin, active monomer, auxiliary agent and the like, the modified MBS resin can remarkably improve the mechanical properties such as toughness and the like of the ink, simultaneously maintain stronger stability and higher glass transition temperature, and overcome the defects in the prior art.
The invention aims at providing a package substrate solder resist ink, which comprises an A component and a B component, wherein the A component comprises the following components in parts by weight:
The component B comprises the following components in parts by weight:
1-10 parts of epoxy resin
1-10 parts of solvent
1-10 parts of a toughening agent;
wherein,
the active monomer is a monomer with a mono-functional or multi-functional acrylate unit;
the modified MBS resin is obtained by the reaction of butadiene, styrene, modified acrylic ester, acrylic ester and pentaerythritol tetraacrylate;
the modified acrylic ester is obtained by reacting acrylic amino alkyl ester with halogenated alkyl acid.
Further, the acrylic acid ester is selected from alkyl acrylate, alkyl acrylate derivative, alkyl methacrylate or alkyl methacrylate derivative, and the alkyl in the alkyl acrylate, alkyl acrylate derivative, alkyl methacrylate or alkyl methacrylate derivative is selected from C4-C20 alkyl;
in the alkyl acrylate derivative or the alkyl methacrylate derivative,
one or more carbon atoms on the alkyl group are substituted with one or more of a hydrogen atom, an oxygen atom, an alkenyl group, an alkynyl group, an aryl group, a hydroxyl group, an amino group, a carbonyl group, a carboxyl group, an ester group, a cyano group, a nitro group;
And/or the number of the groups of groups,
one or more hydrogen atoms on the alkyl group are substituted with one or more of fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.
Specifically, the reactive monomers, including but not limited to, are: monomers containing an acrylate unit such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, octyl acrylate, dodecyl acrylate, cetyl acrylate, stearyl acrylate, etc., or methyl methacrylate, ethyl methacrylate, propyl ethacrylate, butyl acrylate, octyl acrylate, dodecyl propyl acrylate, stearyl butyl acrylate, etc., in short, the ester group may be linked to a C1-C22 alkyl chain structure, and the alkyl chain moiety linked to acrylic acid may be a C1-C22 alkyl chain structure;
monomers containing two acrylate units, such as diethylene glycol diacrylate, dipropylene glycol diacrylate, 1, 6-hexanediol diacrylate, tetraethylene glycol diacrylate, and the like; the ester group of the acrylic ester can be independently connected with an alkyl chain structure of C1-C22;
monomers containing three acrylate units, such as trimethylolpropane triacrylate, 1,2, 3-propane triacrylate, tri (2-hydroxyethyl) isocyanuric acid triacrylate, etc., wherein the acrylate groups may independently be linked to a C1-C22 alkyl chain structure;
Monomers containing 4 to 6 acrylate units, such as polydipentaerythritol hexaacrylate, the ester groups of the acrylate may be independently linked to a C1-C22 alkyl chain structure;
the halogenated alkyl acid can be fluorinated alkyl acid, chlorinated alkyl acid, brominated alkyl acid or iodinated alkyl acid. The alkyl acid may be selected from the group consisting of C1-C22 alkyl acids including, but not limited to: bromoformic acid, chloroformic acid, bromoacetic acid, chloroacetic acid, bromopropionic acid, chloropropionic acid, bromobutyric acid, chlorobutyric acid, and the like;
and a mixture of any two or more of the above monomers having a monofunctional or polyfunctional acrylate unit blended at any mass ratio. The blending may be binary blending, ternary blending, quaternary blending or more.
Further, in the halogenated alkyl acid, the number of carbon atoms of the alkyl group is selected from 10 to 20.
Further, the auxiliary agent is selected from one or more of filler, toner, leveling agent, defoamer, ultraviolet absorber, dispersant and antioxidant.
Specifically, the filler may be, but is not limited to: calcium carbonate, talc, mica powder, silica micropowder, barium sulfate, kaolin, wollastonite, and the like, and mixtures of any of the foregoing optional objects blended in any mass ratio.
The toner may be, but is not limited to: phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, carbon black, naphthalene black, and the like.
Leveling agents may be, but are not limited to: silicone, polyurethane, alcohol, polyalcohol, acrylic, inorganic, etc., such as isopropyl alcohol, polysiloxane, dimethicone, glycerin, polyether, alumina, calcium oxide, etc., and mixtures of any of the above alternatives blended in any mass ratio.
The dispersant may be, but is not limited to: a series of anionic surfactants such as AES, AOS, LAS, MES and the like; a non-ionic surfactant series, such as the AEO series, the span series, the tween series, etc., and mixtures of any of the above alternatives blended in any mass ratio.
Defoamers may be, but are not limited to: mineral oil, polydimethyl silicone oil, tributyl phosphate, silicone resin, and the like, and mixtures of any of the above alternatives, blended in any mass ratio.
The ultraviolet absorber may be, but is not limited to: benzophenone, benzotriazole, acrylonitrile, triazine, and the like, and mixtures of any of the foregoing alternatives, blended in any mass ratio.
Antioxidants may be, but are not limited to: phenols, thiols, etc., and mixtures of any of the above alternatives, blended in any mass ratio.
Further, the dispersant is selected from anionic surfactants, preferably one or more of dodecylbenzene sulfonate, dodecylsulfate, lunar silicate, stearate.
Further, the epoxy resin is selected from one or more of bisphenol A epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, p-tert-butylphenol novolac epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, diglycidyl phthalate, diglycidyl tetrahydrophthalate, triglycidyl isocyanurate and bicyclo-diene epoxide.
Further, the toughening agent may be, but is not limited to,: rubber-based toughening agents, resin-based toughening agents, and the like, such as ethylene propylene rubber, polybutadiene rubber, butyl rubber, nitrile rubber, styrene-butadiene rubber, SBS, ABS, MBS, CPE, DOP, DBP, TCP, TPP, and the like, and mixtures of any of the above alternatives blended in any mass ratio.
Further, the solvent is selected from organic solvents such as methanol, ethanol, propanol, butanol, chlorobenzene, toluene, tetrahydrofuran, dichloromethane, chloroform, petroleum ether, benzene, DMF, DMSO, DBE, or derivatives of the above alternatives, and mixtures of any of the above alternatives blended in any mass ratio.
Another object of the present invention is to provide a method for preparing the solder resist ink for a package substrate, which includes the following steps:
s1, adding amino alkyl acrylate, halogenated alkyl acid and a catalyst into a solvent, stirring and reacting in an inert atmosphere, and purifying to obtain modified acrylic ester;
s2, adding butadiene, styrene, an emulsifying agent, an initiator and a reducing agent into a solvent, and heating and reacting in an inert atmosphere to obtain an intermediate product; then adding the modified acrylic ester, pentaerythritol tetraacrylate, an initiator and a reducing agent into the intermediate product, heating for reaction, adding styrene, and continuously reacting to obtain modified MBS resin;
s3, adding o-cresol novolac epoxy resin and acrylic acid into diethylene glycol monoethyl ether acetate, heating and stirring, then adding triphenylphosphine, heating and reacting, adding dibasic ester and tetrahydrophthalic anhydride, and reacting at a constant temperature to obtain alkali-soluble o-cresol novolac epoxy resin;
s4, blending the modified MBS resin, alkali-soluble o-cresol formaldehyde epoxy resin, an active monomer, a photoinitiator, an auxiliary agent and a solvent to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, and grinding and filtering to obtain a product.
Further, in the step S2, the temperature of the heating reaction under the inert atmosphere is 60-80 ℃; the temperature of the heating reaction is 70-80 ℃.
In step S2, the mass ratio of butadiene to styrene to modified acrylic ester to pentaerythritol tetraacrylate is (100-200) (50-150) (5-20) (20-50) (5-20).
Further, in the step S3, the temperature of heating and stirring is 80-100 ℃; the temperature of the heating reaction is 100-140 ℃; the temperature of the heat preservation reaction is 100-110 ℃.
Further, the initiator is selected from one or more of potassium persulfate, ammonium persulfate, sodium persulfate, azobisisobutyrimidine hydrochloride and azobisiso Ding hydrochloride.
Further, the reducing agent is selected from sodium sulfite, ammonium sulfite, sodium sulfide, sodium hydrosulfide, ammonium sulfide, ammonium hydrosulfide, sodium thiosulfate, ammonium thiosulfate, sulfur dioxide, ferrous sulfate, ferrous ammonium sulfate, ferrous chloride, VC, citric acid, tartaric acid, vanadyl sulfate, V 2 (SO 4 ) 3 、VSO 4 One or more of vanadyl oxalate, vanadium trichloride and vanadium dichloride.
Further, the initiator is potassium persulfate; the reducing agent is ferrous sulfate.
Further, step S3 includes the steps of:
adding o-cresol novolac epoxy resin and acrylic acid into diethylene glycol monoethyl ether acetate, stirring at 80-100 ℃, adding triphenylphosphine, heating to 100-110 ℃ for reaction for 1-2h, heating to 120-140 ℃ for reaction for 10-12h, adding dibasic ester and tetrahydrophthalic anhydride, reacting for 2-4h at 100-110 ℃, and cooling to obtain the alkali-soluble epoxy acrylic resin.
Another object of the present invention is to provide an application of the solder resist ink for package substrate in package substrate.
The invention has the following beneficial effects:
the package substrate solder resist ink provided by the invention adopts modified MBS resin as a component, the component firstly reacts with butadiene and styrene to form a core structure, then modified acrylic ester, acrylic ester and pentaerythritol tetraacrylate are added to react on the surface of the core structure to obtain a shell structure, wherein the modified acrylic ester is obtained by reacting amino alkyl acrylate with long-chain halogenated alkyl acid, and has a betaine structure, so that the package substrate solder resist ink has good interfacial activity, can better play an emulsifying role in the reaction, promotes the wrapping and forming of a shell layer, and improves the emulsion stability and the reaction efficiency; meanwhile, the modified acrylic ester can also participate in polymerization reaction due to the acrylic acid group, so that a betaine structure is introduced to the particle surface, the dispersibility of the modified MBS resin is enhanced, and the conditions of agglomeration and uneven dispersion are avoided; in addition, pentaerythritol tetraacrylate is introduced into the monomer, so that the modified MBS resin can be crosslinked to form a more three-dimensional branched network structure, can bear larger external force action, and further improves the performances of toughness, stability and the like of the solder resist ink. In addition, the long-chain betaine structure in the modified MBS resin can generate a synergistic effect with specific anionic dispersants such as dodecyl benzene sulfonate, dodecyl sulfate and the like, so that the effects of reducing the surface tension and enhancing the stability are more effectively exerted, and the ink product can be stored and used for a long time under various conditions.
Drawings
Figure 1 shows the appearance of example 2 and comparative example 1 after the cold and hot cycle impact test,
wherein,
fig. 1 (1) is an external view of example 2, and fig. 1 (2) is an external view of comparative example 1.
Detailed Description
In order to more clearly illustrate the technical solution of the present invention, the following examples are set forth. The starting materials, reactions and workup procedures used in the examples are those commonly practiced in the market and known to those skilled in the art unless otherwise indicated.
The words "preferred," "more preferred," and the like in the present disclosure refer to embodiments of the present disclosure that may provide certain benefits in some instances. However, other embodiments may be preferred under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
It should be understood that, except in any operating examples, or where otherwise indicated, quantities or all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending upon the desired properties to be obtained by the present invention.
The epoxy resin in the embodiment of the invention is bisphenol A epoxy resin E-12.
The active monomers in the embodiment of the invention are trimethylolpropane triacrylate (TMPTA) and polydipentaerythritol hexaacrylate (DPHA) with the mass ratio of 1:1.
The photoinitiator in the embodiment of the invention is ITX and 819.
The auxiliary agent in the embodiment of the invention comprises a filler, a toner, a leveling agent and a dispersing agent in a mass ratio of 3:1:1:1, wherein the filler comprises talcum powder and barium sulfate in a mass ratio of 1:1, the toner is phthalocyanine green, the leveling agent is isopropanol, and the dispersing agent is sodium dodecyl sulfate.
The solvent in the examples of the present invention is dibasic ester (DBE).
The toughening agent in the embodiment of the invention is Brillouin MZ-120.
In the embodiment of the invention, "parts" refer to parts by weight.
Example 1
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
epoxy resin 5 parts
Solvent 5 parts
1 part of toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
S1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
s3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
S4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 2
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
10 parts of epoxy resin
Solvent 10 parts
2 parts of a toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 20-bromoeicosanoic acid in a molar ratio of 1:1.1, then adding potassium iodide with the weight percent of 3% of the reaction system as a catalyst, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
S2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
s3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 3
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
8 parts of epoxy resin
Solvent 8 parts
1.5 parts of toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 16-bromohexadecanoic acid in a molar ratio of 1:1.1, then adding 3wt% potassium iodide of a reaction system as a catalyst, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 4
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
4 parts of epoxy resin
Solvent 4 parts
1 part of toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 180 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then adding 12 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water into the intermediate product, reacting for 1h at 70 ℃, adding 30 parts of styrene, continuing to react for 1h to obtain modified MBS resin emulsion, centrifuging and drying to obtain modified MBS resin;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 5
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
6 parts of epoxy resin
Solvent 5 parts
2 parts of a toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 180 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 6
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
10 parts of epoxy resin
Solvent 10 parts
2 parts of a toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 200 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 15 parts of modified acrylic ester, 15 parts of methyl methacrylate, 25 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, so as to obtain modified MBS resin emulsion, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 7
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
10 parts of epoxy resin
Solvent 10 parts
2 parts of a toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 8
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
7 parts of epoxy resin
Solvent 7 parts
1 part of toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 12-bromododecanoic acid in a molar ratio of 1:1.1, then adding 3wt% of potassium iodide serving as a catalyst into a reaction system, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 9
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
10 parts of epoxy resin
Solvent 10 parts
2 parts of a toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 16-bromohexadecanoic acid in a molar ratio of 1:1.1, then adding 3wt% potassium iodide of a reaction system as a catalyst, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 150 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then 10 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water are added into the intermediate product to react for 1h at 70 ℃, 30 parts of styrene is added to react for 1h continuously, modified MBS resin emulsion is obtained, and the modified MBS resin is obtained through centrifugation and drying;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Example 10
A solder resist ink for packaging substrate comprises component A and component B,
the component A comprises the following components in parts by weight:
the component B comprises the following components in parts by weight:
4 parts of epoxy resin
Solvent 4 parts
1 part of toughening agent;
the preparation method of the solder resist ink for the packaging substrate comprises the following steps:
s1, taking absolute ethyl alcohol as a solvent, adding dimethylaminoethyl methacrylate and 16-bromohexadecanoic acid in a molar ratio of 1:1.1, then adding 3wt% potassium iodide of a reaction system as a catalyst, stirring and reacting for 72 hours at 35 ℃ under a nitrogen atmosphere, filtering, removing the ethanol under reduced pressure, drying a crude product at 35 ℃ for 24 hours, adding water for dissolving, extracting for 3 times, and freeze-drying a water phase to obtain white powder, namely modified acrylic ester;
s2, adding 180 parts of butadiene, 100 parts of styrene, 5 parts of sodium dodecyl sulfate, 3 parts of potassium persulfate and 1.5 parts of ferrous sulfate into 800 parts of deionized water, and reacting for 10 hours at 70 ℃ in a nitrogen atmosphere to obtain an intermediate product;
then adding 12 parts of modified acrylic ester, 15 parts of methyl methacrylate, 20 parts of butyl acrylate, 10 parts of pentaerythritol tetraacrylate, 8 parts of potassium persulfate, 4 parts of ferrous sulfate and 500 parts of deionized water into the intermediate product, reacting for 1h at 70 ℃, adding 30 parts of styrene, continuing to react for 1h to obtain modified MBS resin emulsion, centrifuging and drying to obtain modified MBS resin;
S3, adding 535 parts of o-cresol novolac epoxy resin (EPICLON N-695 of DIC Co., ltd.) and 180 parts of acrylic acid into 300 parts of diethylene glycol monoethyl ether acetate, heating to 100 ℃, stirring, and dissolving until uniform; then adding 2 parts of triphenylphosphine, heating to 110 ℃ for reaction for 2 hours, heating to 120 ℃ and then carrying out reaction for 12 hours; 415 parts of dibasic ester and 250 parts of tetrahydrophthalic anhydride are added into the obtained reaction liquid, the reaction is carried out for 4 hours at 110 ℃, and after cooling, the alkali-soluble o-cresol formaldehyde epoxy resin is obtained;
s4, blending the modified MBS resin, the alkali-soluble o-cresol formaldehyde epoxy resin, the active monomer, the photoinitiator, the auxiliary agent and the solvent according to the parts by weight to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, grinding until the fineness is less than or equal to 20 mu m, and sieving with a 120-mesh sieve to obtain the product.
Comparative example 1
The comparative example differs from example 1 in that: in step S4, the modified MBS resin is replaced by the Brillouin MZ-120 toughening agent in equal mass, and other components and preparation methods are the same as in example 1.
Comparative example 2
The comparative example differs from example 1 in that: in step S2, the modified acrylic ester was replaced with methyl methacrylate in equal mass, and the other components and the production method were the same as in example 1.
Comparative example 3
The comparative example differs from example 1 in that: in step S2, pentaerythritol tetraacrylate was replaced with methyl methacrylate in equal mass, and the other components and the preparation method were the same as in example 1.
Test case
The solder resist inks prepared in examples 1 to 3 and comparative examples 1 to 3 were subjected to performance test.
The test method is as follows:
stability test: the solder resist inks prepared in examples and comparative examples were each sampled at 200mL, filled in a transparent container and sealed, left at 25 ℃ for 30 days, and then observed for appearance, and evaluated on the following basis:
excellent: no sediment exists;
common: a small amount of precipitation;
poor: a large amount of precipitate.
Adhesion test: the solder resist inks prepared in examples and comparative examples were applied to a PCB, respectively, and then photo-cured for 1h (wavelength 395nm, intensity 25.0mW/cm 2 Is cured for 1 hour at 150 ℃ to form a film with a thickness of 0.5 mm. The films were each scored x-shaped with a needle tip, then attached to the score with cellophane adhesive tape and pulled, as assessed according to the following criteria:
excellent: not torn off;
common: tearing off a small amount;
poor: a large amount of the paper is torn off.
Bending resistance: 180 ° bending was performed with the solder resist ink film as the outer side, and evaluation was performed with the following criteria:
Excellent: the film has no cracks;
poor: the film had cracks.
Acid/alkali resistance: at 20 ℃, the PCB circuit board coated with the solder resist ink is immersed in 10% sulfuric acid solution or 10% sodium hydroxide solution, taken out after 30min, and the state and the adhesiveness of the coating film are evaluated, and the judgment standard is as follows:
excellent: no or slight changes were found;
poor: the coating film is swelled or swelled and falls off.
Pencil hardness: measured based on JIS K5400.
Elongation rate: the elongation (elongation at break) of the film was measured by a tensile-compression tester (manufactured by Shimadzu corporation).
Glass transition temperature: the glass transition temperature was determined by the DMA method.
Cold and hot cycle impact:
firstly, pretreatment is carried out: after 24 hours at 125 ℃, the mixture was left at 60 ℃ and 60% RH for 52 hours; then, cold and hot condition circulation is carried out: after 15min at-65 ℃, 15min at 150 ℃ again, the cycle is performed, the conversion time is less than 10s, and the cycle times are 1000 times. The decision criteria are as follows:
qualified: the cracking, falling and other conditions are avoided;
disqualification: cracking and falling off occur.
The test results are shown in Table 1.
TABLE 1 Performance test results
Figure 1 shows the appearance of example 2 and comparative example 1 after the cold and hot cycle impact test,
Wherein,
fig. 1 (1) is an external view of example 2, and fig. 1 (2) is an external view of comparative example 1.
As can be seen from FIG. 1, the comparative example and the example show a large difference after the cold and hot cycle impact test, the example 2 has no defects such as cracks, and the comparative example 1 has obvious cracks.
As can be seen from table 1, the solder resist ink for package substrate prepared in the embodiment of the invention has various performances obviously superior to those of comparative examples 1-3, and the comparative example 1 replaces the modified MBS resin with the common toughening agent, so that the stability of the ink is reduced, and the glass transition temperature is lower; and the modified acrylic ester is replaced by the modified acrylic ester in the comparative example 2, the pentaerythritol tetraacrylate is replaced by the modified acrylic ester in the comparative example 3, the performance of the modified MBS resin is reduced, and meanwhile, the synergistic effect among the components is weakened, so that the stability and the mechanical property of the ink are reduced to different degrees, and the ideal performance improvement cannot be realized. The solder resist ink for the packaging substrate has good stability and mechanical property, has higher glass transition temperature, solves the defects existing in the prior art, and has good application prospect.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. The packaging substrate solder resist ink is characterized by comprising an A component and a B component, wherein the A component comprises the following components in parts by weight:
10-50 parts of alkali-soluble o-cresol formaldehyde epoxy resin
1-10 parts of active monomer
1-5 parts of modified MBS resin
1-10 parts of photoinitiator
1-10 parts of auxiliary agent
10-30 parts of a solvent;
the component B comprises the following components in parts by weight:
1-10 parts of epoxy resin
1-10 parts of solvent
1-10 parts of a toughening agent;
wherein,
the active monomer is a monomer with a mono-functional or multi-functional acrylate unit;
The modified MBS resin is obtained by the reaction of butadiene, styrene, modified acrylic ester, acrylic ester and pentaerythritol tetraacrylate;
the modified acrylic ester is obtained by reacting acrylic amino alkyl ester with halogenated alkyl acid;
the preparation method of the modified MBS resin comprises the following steps:
adding butadiene, styrene, an emulsifying agent, an initiator and a reducing agent into a solvent, and heating and reacting in an inert atmosphere to obtain an intermediate product; then adding the modified acrylic ester, pentaerythritol tetraacrylate, an initiator and a reducing agent into the intermediate product, heating for reaction, adding styrene, and continuously reacting to obtain modified MBS resin;
the mass ratio of butadiene to styrene to modified acrylic ester to pentaerythritol tetraacrylate is (100-200)/(50-150)/(5-20)/(20-50)/(5-20).
2. The package substrate solder resist ink of claim 1, wherein the number of carbon atoms of the alkyl group in said halogenated alkyl acid is selected from 10 to 20.
3. The package substrate solder resist ink of claim 1, wherein said auxiliary agent is selected from one or more of a filler, a toner, a leveling agent, an antifoaming agent, an ultraviolet absorber, a dispersant, and an antioxidant.
4. The package substrate solder resist ink of claim 3, wherein said dispersant is selected from one or more of anionic surfactant, nonionic surfactant.
5. The package substrate solder resist ink of claim 1, wherein said epoxy resin is selected from one or more of bisphenol a type epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, p-t-butylphenol novolac epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, diglycidyl phthalate, diglycidyl tetrahydrophthalate, triglycidyl isocyanurate, and bicyclo-diene epoxide.
6. The method for preparing the solder resist ink for the package substrate according to any one of claims 1 to 5, wherein the method for preparing the solder resist ink for the package substrate comprises the following steps:
s1, adding amino alkyl acrylate, halogenated alkyl acid and a catalyst into a solvent, stirring and reacting in an inert atmosphere, and purifying to obtain modified acrylic ester;
s2, adding butadiene, styrene, an emulsifying agent, an initiator and a reducing agent into a solvent, and heating and reacting in an inert atmosphere to obtain an intermediate product; then adding the modified acrylic ester, pentaerythritol tetraacrylate, an initiator and a reducing agent into the intermediate product, heating for reaction, adding styrene, and continuously reacting to obtain modified MBS resin;
S3, adding o-cresol novolac epoxy resin and acrylic acid into diethylene glycol monoethyl ether acetate, heating and stirring, then adding triphenylphosphine, heating and reacting, adding dibasic ester and tetrahydrophthalic anhydride, and reacting at a constant temperature to obtain alkali-soluble o-cresol novolac epoxy resin;
s4, blending the modified MBS resin, alkali-soluble o-cresol formaldehyde epoxy resin, an active monomer, a photoinitiator, an auxiliary agent and a solvent to obtain a component A; and (3) blending epoxy resin, an auxiliary agent, a solvent and a toughening agent to obtain a component B, blending the component A and the component B, uniformly stirring and dispersing, and grinding and filtering to obtain a product.
7. The method for preparing solder resist ink for package substrate according to claim 6, wherein in step S2, the temperature of the heating reaction under the inert atmosphere is 60-80 ℃; the temperature of the heating reaction is 70-80 ℃.
8. The method for preparing the solder resist ink for the packaging substrate according to claim 6, wherein in the step S2, the mass ratio of butadiene to styrene to modified acrylic ester to pentaerythritol tetraacrylate is (100-200): (50-150): (5-20): (20-50): (5-20).
9. The method for preparing solder resist ink for package substrate according to claim 6, wherein in step S3, the temperature of the heating and stirring is 80-100 ℃; the temperature of the heating reaction is 100-140 ℃; the temperature of the heat preservation reaction is 100-110 ℃.
10. Use of the solder resist ink of any of claims 1-5 for packaging substrates.
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