CN106493636B - The grinding device and grinding method of positive and negative complementary angle - Google Patents
The grinding device and grinding method of positive and negative complementary angle Download PDFInfo
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- CN106493636B CN106493636B CN201610965439.7A CN201610965439A CN106493636B CN 106493636 B CN106493636 B CN 106493636B CN 201610965439 A CN201610965439 A CN 201610965439A CN 106493636 B CN106493636 B CN 106493636B
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- grinding
- waveguide
- grinding unit
- abrasive disk
- fastening screw
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention belongs to optical communication devices to manufacture and design field, be a kind of extremely strong grinding device of versatility for waveguide, chip, the end surface grinding of FA, polishing.More particularly to the grinding device and grinding method of positive and negative complementary angle, it include: new abrasive disk (5), the support tube (1) being arranged on new abrasive disk (5), the new abrasive disk (5) is equipped at least one and is used to place grinding unit (8) placing groove for grinding waveguide (7), and waveguide (7) is pressed on the inclined-plane of grinding unit (8) by inclined plate (6) by Top fastening screw (9).Loading attachment of the present invention has following advantage: 1, easy to install, flaw echo is not led；It 2, can be with the waveguide of simultaneous grinding multiple angles；3, same grinding unit can grind the waveguide of complementary angle；4, waveguide grinding, the polishing of different sizes, different type, different angle be can be applied to, versatility is very strong.
Description
Technical field
The invention belongs to optical communication devices to manufacture and design field, be one for waveguide, chip, the end surface grinding of FA, polishing
The kind extremely strong grinding device of versatility.
Background technique
Waveguide, chip, FA(be hereinafter referred to as: waveguide) it is applied to light communication system, photoelectric information transmission, Electro-optical Modulation application
Extensively, then the grinding and polishing processing of waveguide determines the degree that has excellent performance of waveguide, therefore grinding and polishing processes answering in waveguide
It is particularly important in.Grinding is a kind of processing method of precision, and grinding is using applying or be press-fitted the abrasive material on lap tool
Grain carries out finished machined to machined surface by lap tool and the relative motion of workpiece under a certain pressure.According to the machine of processing method
Reason and feature, most basic processing method can be divided into: removal is processed, in conjunction with processing and deformation processing three categories.Grinding technique
Development, attrition process not only develops to higher precision, but also processing quality is also continuously improved.Therefore, research improves grinding
Processing efficiency, machining accuracy, reduce cost and be particularly important.
Summary of the invention
The technical problems to be solved by the present invention are: the prior art, each grinding device can only grind a kind of wave of angle
It leads.And usually there are many waveguides of angle in the practical application of waveguide.Existing grinding technique, grinding angle are embodied in grinding
On disk, the grinding device of multiple angles can only be designed according to existing technology to realize.The waveguide of how many kinds of angle just needs more
The grinding device covered less.For the prior art, a kind of grinding device is invented, this grinding device can grind the wave of multiple angles
It leads.Key point is to propose grinding unit concept, the angle ground will be needed to be embodied on grinding unit, and filled to avoid grinding
It sets on body ground disk and realizes angle.Grinding device body ground disk only needs 1 set in this way, by replacing different angle (X °)
Grinding unit, so that it may realize the grinding of multiple angles waveguide.1 set of grinding device is only needed, the grinding of various angles is cooperated
Unit can solve the problems, such as a variety of grinding angles.Single abrasive disk assembles the grinding unit of different angle, Ke Yishi simultaneously
The now waveguide of single abrasive disk simultaneous grinding multiple angles.Single grinding unit can also realize the assembly grinding of complementary angle.
The input cost that grinding device can be greatly reduced greatly improves grinding assembly efficiency.
Complementary angle realizes explanation: this grinding unit can realize the complementation of angle by positive and negative assembly method.Example
Such as: grinding unit assembly inclined-plane angle with horizontal plane=X °, then after grinding unit is turned upside down, it can realize that grinding is single
Member assembly inclined-plane angle with horizontal plane=(180 °-X °), form angled complimentary.
The present invention adopts the following technical scheme:
The grinding device of positive and negative complementary angle, comprising: the support tube on new abrasive disk is arranged in new abrasive disk, described new
Abrasive disk is equipped at least one and is used to place the grinding unit placing groove for grinding waveguide, and inclined plate will by Top fastening screw
Grinding unit is pressed on abrasive disk.
In the grinding device of above-mentioned positive and negative complementary angle, grinding unit includes that a grinding ontology and setting are grinding this
The inclined-plane of body side surface；Grinding ontology both ends are set there are two symmetrical locating convex block.
In the grinding device of above-mentioned positive and negative complementary angle, described this body section of grinding is a U-shaped body, the outer wall end of U-shaped body
Face is outer wall datum level, and the inner wall end surface of U-shaped body is inclined-plane, and the seamed edge face of U-shaped body is that two symmetrical locating convex blocks are arranged in U
The both ends of body.
In the grinding device of above-mentioned positive and negative complementary angle, the placing groove includes that length and outer wall datum level length adapt to
Contact surface；Horizontal positioning plane there are two setting below placing groove, is horizontal location face and horizontal location face respectively；Placing groove both ends
If there are two arc grooves, described two horizontal location faces extend to arc groove；The end face length in horizontal location face is greater than or equal to
The length of symmetrical locating convex block side end face.
In the grinding device of above-mentioned positive and negative complementary angle, inclined plate is fixed by screws on abrasive disk, Top fastening screw spiral shell
Line screws on inclined plate, and it is upper that Top fastening screw front end, which withstands on the seamed edge face on grinding unit,.Assembly fixed relationship is formed, is held out against
The pressure that screw generates grinding unit is decomposed into downward, inward pressure, is respectively applied to symmetrical locating convex block side end face
On symmetrical locating convex block bottom face, position grinding unit tightly in the placing groove being fitted on abrasive disk.
A kind of grinding method of the grinding device using positive and negative complementary angle characterized by comprising
Step 1, by waveguide with being adhesive on the inclined-plane of corresponding grinding unit, bonding process is by auxiliary clamp reality
Existing, assembly technology is also to need auxiliary clamp come what is carried out at present, is not elaborated herein.
Step 2, the grinding unit for assembling waveguide is correspondingly placed at the positioning assembly of new abrasive disk, is rotated clockwise
Two Top fastening screws on 45 degree of inclined plates, Top fastening screw are withstood at 45 degree on the seamed edge of grinding unit；Top fastening screw applies
Power on grinding unit resolves into power downward, to grinding disk center, makes the horizontal location of grinding unit and abrasive disk respectively
Face, perpendicular positioning face paste is tight, after screwing Top fastening screw, that is, completes the assembly of grinding unit.
Step 3, by Step 1: the grinding unit of waveguide is assembled in the way of in the of two one by one, until all grindings
Unit is placed position and is installed.After the installation is completed, it ground, polished on grinder.
Step 4, after the completion of grinding, polishing, the lower wall of grinding unit is rotated on 45 degree of inclined plates counterclockwise and holds out against spiral shell
Nail, Top fastening screw can then unclamp, and grinding unit is removed i.e. completion lower wall.
Loading attachment of the present invention has following advantage: 1, easy to install, flaw echo is not led；It 2, can be a variety of with simultaneous grinding
The waveguide of angle；3, same grinding unit can grind the waveguide of complementary angle；4, different sizes, inhomogeneity be can be applied to
Waveguide grinding, the polishing of type, different angle, versatility are very strong.
Detailed description of the invention
The existing grinding device schematic diagram of Fig. 1.
The existing abrasive disk angle of assembling of Fig. 2 realizes schematic diagram.
Fig. 3 grinding device schematic diagram of the present invention.
X ° of angle of Fig. 4 a of waveguide schematic diagram.
The waveguide schematic diagram of 180 °-X ° of Fig. 4 b angle.
Fig. 5 a grinding unit and 180 °-X ° of angle of waveguide assembling schematic diagram.
Fig. 5 b grinding unit and X ° of angle of waveguide assembling schematic diagram.
Fig. 6 abrasive disk schematic diagram of the present invention.
Fig. 7 a grinding unit schematic diagram of the present invention (front)；
Fig. 7 b grinding unit schematic diagram of the present invention (after grinding unit rotates 180 °)；
Fig. 8 abrasive disk and grinding unit assembly grinding angle realize schematic diagram.
Specific embodiment
Further illustrate how the present invention realizes with reference to the accompanying drawing.
In figure, 1: support tube；2: abrasive disk 3: grinding pressing plate；4: abrasive article；5: new abrasive disk 6:45 degree inclined plate；7:
Waveguide, chip, FA(be hereinafter referred to as: waveguide)；8: grinding unit；9: Top fastening screw；As shown in Figure 1, common for current one kind
Grinding device, main member include support tube 10, and abrasive disk 2 grinds pressing plate 3, abrasive article 4；
The fixation and mode of operation of current grinding device, as shown in Fig. 2, in 2 surrounding installation site of abrasive disk, by auxiliary
Fixture is helped to assemble bonded abrasive part 4, X ° of the inclination angle of abrasive disk, as grinding angle, grinding on pressing plate 3 has Top fastening screw, leads to
It crosses Top fastening screw to be pressed on abrasive article 4, abrasive article 4 has the risk for being hurt capping by top.After holding out against abrasive article 4, single is ground
Mill part is installed into.Grinding device a set of in this way, can only grind a kind of grinding angle, and as X °, if waveguide has N kind angle,
N is so just needed to cover abrasive disk, N covers grinding device angled grinding to realize.Make grinding device many kinds of in this way, at
This is very high, can only grind a kind of angle, grinding efficiency is not high.
One, primary structure of the invention is introduced first:
Grinding device main member of the invention specifically includes that support tube 1,5,45 degree of new abrasive disk as shown in Fig. 3, Fig. 8
Inclined plate 6, waveguide 7, grinding unit 8, Top fastening screw 9.
The fixing assembling of grinding unit 8 and waveguide 7: the waveguide of positive and negative complementary angle is as shown in figure 4, grinding unit 8 and wave
7-1 is led, the assembly effect of waveguide 7-2 is as shown in figure 5, waveguide 7-1, waveguide 7-2 are the waveguide of complementary angle.Grinding unit 8 is just
To when placing, the angle that 8 inclined-plane 8e of grinding unit and horizontal plane are formed is X °, by auxiliary clamp by the face 7e of waveguide (7-1)
Tight with the 8e face paste of grinding unit 8, together with gluing knot, the face 7e and horizontal plane that waveguide 7-1 is achieved are ground at assembly
X ° of angle.Grinding unit 8 is turned upside down placement, by auxiliary clamp by the 8e face paste in the face 7e of waveguide 7-2 and grinding unit 8
Tightly, together with gluing knot, waveguide 7-2 has been achieved grinds 180 °-X ° of angle at assembly with horizontal plane.Therefore, individually
Grinding unit 8 can be realized simultaneously the waveguide assembly grinding of X °, 180 °-X ° of complementary angles.
Two, the assembly method of grinding unit Yu new abrasive disk is described below.
The assembly of new abrasive disk 5 and grinding unit 8 positions: as shown in Fig. 6,7,8, the horizontal location benchmark of new abrasive disk 5
Face 5a, 5c are bonded with horizontal location datum level 8a, 8c, 8a', 8c' of grinding unit 8, the vertical reference face 5b of new abrasive disk 5 with
The vertical reference face 8b of grinding unit 8 is bonded, and rotates clockwise the Top fastening screw 9 on 45 degree of inclined plates 6, Top fastening screw (9)
End face is withstood on seamed edge 8d, 8d' of grinding unit 8 in 45 degree.The pressure being subject on grinding unit 8, can be analyzed to: 1, vertically to
Under power；2, to the power at new 5 center of abrasive disk.Power straight down keeps datum level 8a, 8c, 8a', 8c' and datum level 5a, 5c fixed
Position is adjacent to；The face datum level 8b, 8b' and the face benchmark 5b is positioned to the power at new 5 center of abrasive disk to be adjacent to.Grinding unit 8 is i.e. tightly
Positioning be fixed on new abrasive disk 5.After surrounding all assembles grinding unit 8 on new abrasive disk 5, so that it may carry out waveguide
Grinding, polishing.The lower wall of grinding unit 8: similarly, rotating counterclockwise Top fastening screw 9, after Top fastening screw 9 is totally released,
Grinding unit 8 can be directly taken out, removes grinding unit 8 one by one, then lower wall is completed.
Three, grinding method of the invention is described below.
Step 1, by waveguide with being adhesive on the inclined-plane of corresponding grinding unit, bonding process is by auxiliary clamp reality
Existing, assembly technology is also to need auxiliary clamp come what is carried out at present, is not elaborated herein.
Step 2, the grinding unit for assembling waveguide is correspondingly placed at the positioning assembly of new abrasive disk, is rotated clockwise
Two Top fastening screws on 45 degree of inclined plates, Top fastening screw are withstood at 45 degree on the seamed edge of grinding unit；Top fastening screw applies
Power on grinding unit resolves into power downward, to grinding disk center, makes the horizontal location of grinding unit and abrasive disk respectively
Face, perpendicular positioning face paste is tight, after screwing Top fastening screw, that is, completes the assembly of grinding unit.
Step 3, by Step 1: the grinding unit of waveguide is assembled in the way of in the of two one by one, until all grindings
Unit is placed position and is installed.After the installation is completed, it ground, polished on grinder.
Step 4, after the completion of grinding, polishing, the lower wall of grinding unit is rotated on 45 degree of inclined plates counterclockwise and holds out against spiral shell
Nail, Top fastening screw can then unclamp, and grinding unit is removed i.e. completion lower wall.
The present invention proposes that grinding angle is detached from new abrasive disk 5, is embodied in grinding angle on grinding unit 8, single in this way
New abrasive disk 5, can assemble the grinding unit 8 of various angles, to realize same set of grinding device, while realize multiple angles
Grinding, polishing.
Specific embodiment described herein is only an example for the spirit of the invention.The neck of technology belonging to the present invention
The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method
In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
Claims (5)
1. the grinding device of positive and negative complementary angle, it is characterised in that: include: new abrasive disk (5), be arranged on new abrasive disk (5)
Support tube (1), the new abrasive disk (5) is equipped at least one and is used to place grinding unit (8) for grinding waveguide (7)
Grinding unit (8) is pressed on abrasive disk (5) by placing groove, inclined plate (6) by Top fastening screw (9)；Grinding unit (8) includes
One grinding ontology and the inclined-plane (8e) that this body side surface of grinding is set；Grinding ontology both ends are set there are two symmetrical convex block, are used
In the assembly positioning of grinding ontology.
2. the grinding device of positive and negative complementary angle as described in claim 1, it is characterised in that: described this body section of grinding is a U
Body, the outer wall end face of U-shaped body are outer wall datum level, and the inner wall end surface of U-shaped body is inclined-plane (8e), and the seamed edge face of U-shaped body is
(8d), two symmetrical convex block assembly are located in the both ends of U-shaped body.
3. the grinding device of positive and negative complementary angle as described in claim 1, it is characterised in that: the placing groove includes length and outer
The contact surface (5b) that wall datum level length adapts to；Horizontal positioning plane there are two setting below placing groove is positioning plane respectively
(5a) and positioning plane (5b)；Placing groove both ends are set to be used to step down there are two arc groove, and the end face length in horizontal location face is greater than
Or the length equal to symmetrical convex block side end face.
4. the grinding device of positive and negative complementary angle as described in claim 1, it is characterised in that: inclined plate (6) is fixed by screw
On abrasive disk (5), for Top fastening screw (9) threaded engagement on inclined plate (6), Top fastening screw (9) front end withstands on grinding unit (8)
On seamed edge face be (8d) on；Assembly fixed relationship is formed, the pressure that Top fastening screw (9) generates grinding unit (8) is decomposable
It at downward, inward pressure, is respectively applied on convex block side end face and convex block bottom face, grinding unit (8) is made tightly to position patch
It closes in the placing groove on abrasive disk (5).
5. a kind of grinding method using the grinding device of positive and negative complementary angle described in claim 1 characterized by comprising
Step 1, by waveguide with being adhesive on the inclined-plane of corresponding grinding unit, bonding process and assembly technology all pass through additional lock
Tool is realized；
Step 2, the grinding unit for assembling waveguide is correspondingly placed at the positioning assembly of new abrasive disk, is rotated clockwise 45
Two Top fastening screws on inclined plate are spent, Top fastening screw is withstood at 45 degree on the seamed edge of grinding unit；Top fastening screw, which is applied to, grinds
Power on mill unit resolves into power downward, to grinding disk center, makes the horizontal location face of grinding unit and abrasive disk respectively, hangs down
Straight positioning surface is adjacent to, and after screwing Top fastening screw, that is, completes the assembly of grinding unit；
Step 3, the grinding unit of waveguide is assembled one by one in the way of step 2,3, until all grinding units are put
Set installs, and after the installation is completed, is ground, is polished on grinder；
Step 4, after the completion of grinding, polishing, the lower wall of grinding unit, the Top fastening screw being rotated on 45 degree of inclined plates counterclockwise,
Top fastening screw can then unclamp, and grinding unit is removed i.e. completion lower wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610965439.7A CN106493636B (en) | 2016-10-31 | 2016-10-31 | The grinding device and grinding method of positive and negative complementary angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610965439.7A CN106493636B (en) | 2016-10-31 | 2016-10-31 | The grinding device and grinding method of positive and negative complementary angle |
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| Publication Number | Publication Date |
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| CN106493636A CN106493636A (en) | 2017-03-15 |
| CN106493636B true CN106493636B (en) | 2019-02-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4360456B2 (en) * | 2001-06-26 | 2009-11-11 | 株式会社アトライズイナケン | Grinding blade for grinding machine and method for mounting the grinding blade |
| CN201023206Y (en) * | 2007-03-29 | 2008-02-20 | 刘宇晗 | Optical fiber grinding and fixing jig |
| CN202528052U (en) * | 2012-03-21 | 2012-11-14 | 上海坤腾光电科技有限公司 | Optical fiber array grinding clamp |
| CN102794701A (en) * | 2012-08-03 | 2012-11-28 | 无锡爱沃富光电科技有限公司 | End-face grinding fixture for fiber arrays |
| CN202922387U (en) * | 2012-10-19 | 2013-05-08 | 深圳市泰科微光学有限公司 | Anti-abrasive fixture for grinding optical fiber connector blank |
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